CN109906016B - Communication equipment heat dissipation control system and method - Google Patents
Communication equipment heat dissipation control system and method Download PDFInfo
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- CN109906016B CN109906016B CN201711311330.2A CN201711311330A CN109906016B CN 109906016 B CN109906016 B CN 109906016B CN 201711311330 A CN201711311330 A CN 201711311330A CN 109906016 B CN109906016 B CN 109906016B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The invention relates to a heat dissipation technology of communication equipment. The invention solves the problem that the abnormal temperature rise of the communication equipment system is not detected at present, and provides a communication equipment heat dissipation control system and a method, and the technical scheme can be summarized as follows: each business card acquires the current board card temperature and the current high-power chip temperature in real time and uploads the current board card temperature and the current high-power chip temperature to the system, and the system acquires the current environment temperature and the real-time rotating speed of the fan in real time; the system adjusts the rotating speed of the fan in real time according to the reported current board card temperature and the current high-power chip temperature of each business card; the system judges whether abnormal temperature rise occurs or not according to the current environment temperature, the real-time rotating speed of the fan, the current board card temperature of each business card and the current high-power chip temperature in combination with pre-stored information at any moment, and reports the abnormal temperature rise and the reason thereof to a management system or sends a prompt when abnormal temperature rise occurs. The invention has the beneficial effects that: the abnormal temperature rise can be found in time, and the method is suitable for communication equipment.
Description
Technical Field
The present invention relates to a technology of a communication device, and particularly to a heat dissipation technology of a communication device.
Background
In communication equipment, no matter small desktop equipment or large rack-mounted equipment, a large number of large-scale integrated circuits are used, and the rack-mounted equipment is provided with more service cards, so that the power consumption of the whole machine is large, the heat density is high, the heat dissipation of the system is more, and the quality of a heat dissipation system is closely related to the normal work of the system and the stability of the system. In general, the heat dissipation of the whole communication equipment is ensured by adding a radiator to a high-power chip for heat dissipation and exhausting air through a fan of the communication equipment.
With the progress of society, the range of communication equipment use is wider and wider, and in order to ensure that the communication equipment can normally work in a proper temperature environment, the system is ensured to have normal working environment temperature. Generally, various communication devices (network devices) are distributed in a data center of an enterprise or an industrial park, a fan for radiating heat of a system runs for a long time, dust impurities in air enter the communication devices under the action of fan air suction, and a circuit board in the communication devices is covered by thick dust after a long time; meanwhile, the dust screen of the air inlet is covered with dust under the action of air suction of the fan; and after the high-power chip runs for a long time, the heat-conducting silicone grease on the chip becomes dry and ineffective, and the heat dissipation of the chip is seriously influenced. The three phenomena can seriously affect the heat dissipation of the system, cause abnormal temperature rise of the board card (the master control card and/or the business card), accelerate the aging of the board card, affect the electrical performance and parameters of the board card, reduce the creepage distance and the safety distance of the circuit, and cause circuit faults after long-time operation.
The current common methods for solving the problems are as follows: 1. the cooling system of the common rack-mounted communication equipment controls the rotating speed of a plurality of fans by an intelligent device according to real-time temperature so as to achieve the purpose of cooling the system, but the method can only process the problem of temperature rise of the system through a speed regulation mechanism, can not find the problem of abnormal temperature rise of the system, can not locate the specific reason causing the abnormal temperature rise of the system, can not find the abnormal temperature rise of the system in time when the heat dissipation of the system is abnormal, and meanwhile, the speed regulation mechanism of the fans can not fundamentally solve the problem of the abnormal temperature rise of the system, thereby increasing the fault probability of the whole machine. 2. The method is characterized in that a client device maintainer regularly cleans a dustproof net of the communication device to ensure that an air inlet of the communication device is unobstructed, and the method is a regular cleaning method and cannot find whether the air inlet of the communication device is blocked to cause abnormal temperature rise of the system or not in time.
Therefore, communication equipment needs to have good environmental adaptability and high stability and reliability so as to meet the requirements of application in important fields and users in a wide area, but the current solution cannot discover and fundamentally solve the problem of abnormal temperature rise of a system, so that the heat dissipation of the system has risks, and the stability and reliability of the system are reduced.
Disclosure of Invention
The invention aims to solve the problem that the abnormal temperature rise of a communication equipment system is not detected at present, and provides a communication equipment heat dissipation control system and a communication equipment heat dissipation control method.
The invention solves the technical problem, adopts the technical proposal that the heat dissipation control system of the communication equipment comprises at least one service card, a system management unit and a fan control unit, wherein the service card comprises a service processing unit, the service processing unit and the fan control unit are respectively connected with the system management unit,
the service processing unit is used for realizing service processing and forwarding, and acquiring and reporting the current board card temperature and the current high-power chip temperature of the service card to the system management unit in real time;
the fan control unit is used for adjusting the rotating speed of the fan in real time according to the control of the system management unit and feeding back the real-time rotating speed of the fan to the system management unit;
the system management unit is used for acquiring the current environment temperature in real time, controlling the fan control unit to adjust the rotating speed of the fan in real time according to the current board temperature of each service card reported by each service processing unit and the current high-power chip temperature, judging whether abnormal temperature rise occurs or not according to the current environment temperature, the real-time rotating speed of the fan, the current board temperature of each service card and the current high-power chip temperature in combination with pre-stored information, and reporting the abnormal temperature rise and the reason thereof to the management system or giving a prompt when the abnormal temperature rise occurs; the pre-stored information comprises board card temperatures and high-power chip temperatures corresponding to the service cards under normal conditions, different environmental temperatures, different service types and different service volumes, and fan rotating speeds corresponding to the service cards when the service cards stably work.
Specifically, the acquiring and reporting of the current board temperature and the current high-power chip temperature of the service card to the system management unit by the service processing unit in real time means that: the service card acquires the current board card temperature and the current high-power chip temperature of the service card in real time through the onboard microprocessor, synchronizes the current board card temperature and the current high-power chip temperature to the onboard processor of the service card, and reports the current board card temperature and the current high-power chip temperature to the system management unit through the onboard processor.
Furthermore, the system also comprises a main control card, and the system management unit is positioned in the main control card.
Specifically, the real-time collection of the current ambient temperature by the system management unit means: and a temperature detection pipe is arranged on the main control card panel and is connected to the microprocessor in the board, so that the current environment temperature is acquired.
Furthermore, the reason of the abnormal temperature rise is air inlet blockage or failure of heat conduction silicone grease of the high-power chip.
Specifically, whether abnormal temperature rise occurs is judged according to the combination of the current environment temperature, the real-time rotating speed of the fan, the current board temperature of each business card and the current temperature of the high-power chip and the prestored information, and the reason for judging the abnormal temperature rise is as follows: inquiring prestored information according to the current environment temperature, the current service type of a certain service card and the current service volume of the service card, and acquiring the corresponding board card temperature, the high-power chip temperature and the fan rotating speed in the prestored information;
when the difference value between the real-time rotating speed of the fan and the rotating speed of the fan in the pre-stored information is divided by the rotating speed of the fan corresponding to the pre-stored information and is larger than a preset threshold value, and the current board temperature and the current temperature of the high-power chip are larger than the board temperature and the temperature of the high-power chip corresponding to the pre-stored information, judging that the air inlet is blocked;
and when the subtraction of the current board temperature and the board temperature corresponding to the pre-stored information is smaller than a first set value, but the subtraction of the current high-power chip temperature and the high-power chip temperature corresponding to the pre-stored information is larger than a second set value, determining that the heat-conducting silicone grease of the high-power chip on the service card is invalid.
Still further, the threshold, the first set value and the second set value are set by a maintenance person according to actual conditions.
Specifically, the step of controlling the fan control unit to adjust the fan speed in real time according to the current board temperature and the current high-power chip temperature of each service card reported by each service processing unit is as follows: when the current board card temperature and/or the current high-power chip temperature rises, the system processing unit controls the fan control unit to increase the output PWM duty ratio, and otherwise, the output PWM duty ratio is reduced.
The heat dissipation control method of the communication equipment is applied to the heat dissipation control system of the communication equipment and comprises the following steps:
the system prestores board card temperatures and high-power chip temperatures corresponding to different environment temperatures, different service types and different service volumes under normal conditions of each service card, and fan rotating speeds corresponding to the stable operation of each service card as prestore information;
when the system works:
each business card acquires the current board card temperature and the current high-power chip temperature in real time and uploads the current board card temperature and the current high-power chip temperature to the system, and the system acquires the current environment temperature and the real-time rotating speed of the fan in real time;
the system adjusts the rotating speed of the fan in real time according to the reported current board card temperature and the current high-power chip temperature of each business card;
the system judges whether abnormal temperature rise occurs or not according to the current environment temperature, the real-time rotating speed of the fan, the current board card temperature of each business card and the current high-power chip temperature in combination with pre-stored information at any moment, and reports the abnormal temperature rise and the reason thereof to a management system or sends a prompt when abnormal temperature rise occurs.
Specifically, the reason for the abnormal temperature rise is air inlet blockage or failure of heat-conducting silicone grease of the high-power chip.
Further, whether abnormal temperature rise occurs is judged according to the combination of the current environment temperature, the real-time rotating speed of the fan, the current board temperature of each business card and the current temperature of the high-power chip and the prestored information, and the reason for judging the abnormal temperature rise is as follows: inquiring prestored information according to the current environment temperature, the current service type of a certain service card and the current service volume of the service card, and acquiring the corresponding board card temperature, the high-power chip temperature and the fan rotating speed in the prestored information;
when the difference value of the real-time rotating speed of the fan and the rotating speed of the fan in the pre-stored information is divided by the fact that the corresponding rotating speed of the fan in the obtained pre-stored information is larger than a preset threshold value, and the current board temperature and the current temperature of the high-power chip are larger than the corresponding board temperature and the corresponding temperature of the high-power chip in the obtained pre-stored information, judging that the air inlet is blocked;
and when the subtraction of the current board temperature and the board temperature corresponding to the pre-stored information is smaller than a first set value, but the subtraction of the current high-power chip temperature and the high-power chip temperature corresponding to the pre-stored information is larger than a second set value, determining that the heat-conducting silicone grease of the high-power chip on the service card is invalid.
Specifically, the threshold, the first set value and the second set value are set by a maintenance worker according to actual conditions.
The heat dissipation control system and the heat dissipation control method for the communication equipment have the advantages that abnormal temperature rise can be found in time and maintenance personnel can be informed (after the reason of the abnormal temperature rise is reported, the management system can inform the maintenance personnel inevitably), so that the communication equipment is maintained by the maintenance personnel, the aging speed of the communication equipment is indirectly reduced, the service life of the communication equipment is prolonged, the fault probability of the communication equipment is reduced, the risk and the loss are further reduced, and the hardware cost is not increased basically.
Drawings
Fig. 1 is a system block diagram of a heat dissipation control system of a communication device in an embodiment of the present invention.
Detailed Description
The technical solution of the present invention is described in detail below with reference to the embodiments and the accompanying drawings.
The invention relates to a communication equipment heat dissipation control system, which comprises a system management unit, a fan control unit and at least one service card, wherein the service card comprises a service processing unit, the service processing unit and the fan control unit are respectively connected with the system management unit, and the service processing unit is used for realizing service processing and forwarding, and acquiring and reporting the current board card temperature and the current high-power chip temperature of the service card to the system management unit in real time; the fan control unit is used for adjusting the rotating speed of the fan in real time according to the control of the system management unit and feeding back the real-time rotating speed of the fan to the system management unit; the system management unit is used for acquiring the current environment temperature in real time, controlling the fan control unit to adjust the rotating speed of the fan in real time according to the current board temperature of each service card reported by each service processing unit and the current high-power chip temperature, judging whether abnormal temperature rise occurs or not according to the current environment temperature, the real-time rotating speed of the fan, the current board temperature of each service card and the current high-power chip temperature in combination with pre-stored information, and reporting the abnormal temperature rise and the reason thereof to the management system or sending a prompt when the abnormal temperature rise occurs; the pre-stored information comprises board card temperatures and high-power chip temperatures corresponding to different ambient temperatures, different service types and different service volumes of each service card under normal conditions, and fan rotating speeds corresponding to the stable working of each service card.
The invention discloses a heat dissipation control method of communication equipment, which is applied to a heat dissipation control system of the communication equipment and specifically comprises the following steps: the system prestores board card temperatures and high-power chip temperatures corresponding to different environment temperatures, different service types and different service volumes under normal conditions of each service card, and fan rotating speeds corresponding to the stable operation of each service card as prestore information; when the system works: each business card acquires the current board card temperature and the current high-power chip temperature in real time and uploads the current board card temperature and the current high-power chip temperature to the system, and the system acquires the current environment temperature and the real-time rotating speed of the fan in real time; the system adjusts the rotating speed of the fan in real time according to the reported current board card temperature and the current high-power chip temperature of each business card; the system judges whether abnormal temperature rise occurs or not according to the current environment temperature, the real-time rotating speed of the fan, the current board card temperature of each business card and the current high-power chip temperature in combination with pre-stored information at any moment, and reports the abnormal temperature rise and the reason thereof to a management system or sends a prompt when abnormal temperature rise occurs.
Examples
The system block diagram of the heat dissipation control system of the communication equipment in the embodiment of the invention is shown in fig. 1, and the heat dissipation control system comprises a system management unit, a fan control unit and at least one service card, wherein the service card comprises a service processing unit, and the service processing unit and the fan control unit are respectively connected with the system management unit.
Here, the service processing unit is configured to implement service processing and forwarding, acquire and report a current board temperature and a current high-power chip temperature of the service card to the system management unit in real time, and specifically may be: the service card acquires the current board card temperature and the current high-power chip temperature of the service card in real time through the onboard microprocessor, synchronizes the current board card temperature and the current high-power chip temperature to the onboard processor of the service card, and reports the current board card temperature and the current high-power chip temperature to the system management unit through the onboard processor.
And the fan control unit is used for adjusting the rotating speed of the fan in real time according to the control of the system management unit and feeding back the real-time rotating speed of the fan to the system management unit.
The system management unit is used for acquiring the current environment temperature in real time, controlling the fan control unit to adjust the rotating speed of the fan in real time according to the current board temperature and the current high-power chip temperature of each service card reported by each service processing unit, judging whether abnormal temperature rise occurs or not according to the current environment temperature, the real-time rotating speed of the fan, the current board temperature and the current high-power chip temperature of each service card in combination with pre-stored information, judging the reason when the abnormal temperature rise occurs, and reporting the abnormal temperature rise and the reason to the management system or sending a prompt; the pre-stored information comprises board card temperatures and high-power chip temperatures corresponding to different ambient temperatures, different service types and different service volumes of each service card under normal conditions, and fan rotating speeds corresponding to stable operation of each service card.
The communication device generally further includes a main control card, and the system management unit may be located in the main control card, and the system management unit may acquire the current ambient temperature in real time as follows: and a temperature detection pipe is arranged on the main control card panel and is connected to the microprocessor in the board, so that the current environment temperature is acquired. The reasons for abnormal temperature rise are generally two situations, namely air inlet blockage or failure of heat-conducting silicone grease of a high-power chip.
Judging whether the temperature rises abnormally according to the combination of the current environment temperature, the real-time rotating speed of the fan, the current board card temperature of each business card and the current temperature of the high-power chip and prestored information, wherein the reason for judging the abnormal temperature rise can be specifically as follows:
inquiring prestored information according to the current environment temperature, the current service type of a certain service card and the current service volume of the service card, and acquiring the corresponding board card temperature, the high-power chip temperature and the fan rotating speed in the prestored information;
when the difference value of the real-time rotating speed of the fan and the rotating speed of the fan in the pre-stored information is divided by the fact that the corresponding rotating speed of the fan in the obtained pre-stored information is larger than a preset threshold value, and the current board temperature and the current temperature of the high-power chip are larger than the corresponding board temperature and the corresponding temperature of the high-power chip in the obtained pre-stored information, judging that the air inlet is blocked;
and when the subtraction of the current board temperature and the board temperature corresponding to the pre-stored information is smaller than a first set value, but the subtraction of the current high-power chip temperature and the high-power chip temperature corresponding to the pre-stored information is larger than a second set value, determining that the heat-conducting silicone grease of the high-power chip on the service card is invalid.
The threshold, the first set value and the second set value are set by a maintenance person according to actual conditions, and different service cards are not necessarily the same in position, type of the high-power chip, environment and the like, so that the maintenance person is required to perform corresponding setting according to the actual conditions.
In addition, the real-time control of the fan control unit to adjust the fan speed according to the current board temperature and the current high-power chip temperature of each service card reported by each service processing unit means that: when the current board card temperature and/or the current high-power chip temperature rises, the system processing unit controls the fan control unit to increase the output PWM duty cycle, and otherwise, the output PWM duty cycle is decreased. Reporting the abnormal temperature rise and the reason thereof to the management system or sending a prompt can be as follows: the abnormal temperature rise and the reason thereof are reported to a computer or other management equipment for managing the maintenance personnel, the management equipment can also inform the maintenance personnel in a mode of sending short messages to a mobile communication terminal of the maintenance personnel, and the like, or a light or sound alarm module is added in the system management unit for sending out a prompt.
The heat dissipation control method of the communication equipment in the embodiment of the invention is applied to the heat dissipation control system of the communication equipment, and comprises the following steps:
the system prestores board card temperatures and high-power chip temperatures corresponding to different ambient temperatures, different service types and different service volumes of each service card under normal conditions, and fan rotating speeds corresponding to the service cards in stable operation as prestore information.
When the system works:
each business card acquires the current board card temperature and the current high-power chip temperature in real time and uploads the current board card temperature and the current high-power chip temperature to the system, and the system acquires the current environment temperature and the real-time rotating speed of the fan in real time.
And the system adjusts the rotating speed of the fan in real time according to the reported current board card temperature and the current high-power chip temperature of each service card.
The system judges whether abnormal temperature rise occurs or not according to the current environment temperature, the real-time rotating speed of the fan, the current board card temperature of each business card and the current high-power chip temperature in combination with pre-stored information at any moment, and reports the abnormal temperature rise and the reason thereof to a management system or sends a prompt when abnormal temperature rise occurs.
Here, as in the case of the heat dissipation control system of the communication device in this example, the reason of the abnormal temperature rise is generally two cases, namely, the air inlet is blocked or the heat-conducting silicone grease of the high-power chip is failed, and then whether the abnormal temperature rise occurs is determined according to the current ambient temperature, the real-time rotation speed of the fan, the current board temperature of each service card and the current temperature of the high-power chip in combination with the pre-stored information, and the reason of the abnormal temperature rise may be determined as follows:
inquiring prestored information according to the current environment temperature, the current service type of a certain service card and the current service volume of the service card, and acquiring the corresponding board card temperature, the high-power chip temperature and the fan rotating speed in the prestored information;
when the difference value of the real-time rotating speed of the fan and the rotating speed of the fan in the pre-stored information is divided by the fact that the corresponding rotating speed of the fan in the obtained pre-stored information is larger than a preset threshold value, and the current board temperature and the current temperature of the high-power chip are larger than the corresponding board temperature and the corresponding temperature of the high-power chip in the obtained pre-stored information, judging that the air inlet is blocked;
and when the subtraction of the current board temperature and the board temperature corresponding to the pre-stored information is smaller than a first set value, but the subtraction of the current high-power chip temperature and the high-power chip temperature corresponding to the pre-stored information is larger than a second set value, determining that the heat-conducting silicone grease of the high-power chip on the service card is invalid.
Similarly, the threshold, the first setting value and the second setting value are set by the maintenance personnel according to the actual situation, and different service cards are not necessarily the same in position, type of the high-power chip, environment and the like, so that the maintenance personnel are required to perform corresponding setting according to the actual situation.
Claims (6)
1. The heat dissipation control system of the communication equipment is characterized by comprising at least one service card, a system management unit and a fan control unit, wherein the service card comprises a service processing unit, the service processing unit and the fan control unit are respectively connected with the system management unit,
the service processing unit is used for realizing service processing and forwarding, and acquiring and reporting the current board card temperature and the current high-power chip temperature of the service card to the system management unit in real time;
the fan control unit is used for adjusting the rotating speed of the fan in real time according to the control of the system management unit and feeding back the real-time rotating speed of the fan to the system management unit;
the system management unit is used for acquiring the current environment temperature in real time, controlling the fan control unit to adjust the rotating speed of the fan in real time according to the current board temperature of each service card reported by each service processing unit and the current high-power chip temperature, judging whether abnormal temperature rise occurs or not according to the current environment temperature, the real-time rotating speed of the fan, the current board temperature of each service card and the current high-power chip temperature in combination with pre-stored information, and reporting the abnormal temperature rise and the reason thereof to the management system or giving a prompt when the abnormal temperature rise occurs; the pre-stored information comprises board card temperatures and high-power chip temperatures corresponding to the service cards under normal conditions, different environmental temperatures, different service types and different service volumes, and fan rotating speeds corresponding to the service cards when the service cards stably work;
the reason of the abnormal temperature rise is air inlet blockage or failure of heat conduction silicone grease of the high-power chip;
the step of judging whether the abnormal temperature rise occurs or not according to the combination of the current environment temperature, the real-time rotating speed of the fan, the current board card temperature of each business card and the current temperature of the high-power chip and the prestored information is as follows: inquiring prestored information according to the current environment temperature, the current service type of a certain service card and the current service volume of the service card, and acquiring the corresponding board card temperature, the high-power chip temperature and the fan rotating speed in the prestored information;
when the difference value of the real-time rotating speed of the fan and the rotating speed of the fan in the pre-stored information is divided by the fact that the corresponding rotating speed of the fan in the obtained pre-stored information is larger than a preset threshold value, and the current board temperature and the current temperature of the high-power chip are larger than the corresponding board temperature and the corresponding temperature of the high-power chip in the obtained pre-stored information, judging that the air inlet is blocked;
and when the subtraction of the current board temperature and the board temperature corresponding to the pre-stored information is smaller than a first set value, but the subtraction of the current high-power chip temperature and the high-power chip temperature corresponding to the pre-stored information is larger than a second set value, determining that the heat-conducting silicone grease of the high-power chip on the service card is invalid.
2. The heat dissipation control system of claim 1, wherein the acquiring and reporting of the current board temperature and the current high-power chip temperature of the service card to the system management unit by the service processing unit in real time means:
the service card acquires the current board card temperature and the current high-power chip temperature of the service card in real time through the onboard microprocessor, synchronizes the current board card temperature and the current high-power chip temperature to the onboard processor of the service card, and reports the current board card temperature and the current high-power chip temperature to the system management unit through the onboard processor.
3. The communication device heat dissipation control system of claim 1, wherein the system further comprises a main control card, the system management unit is located in the main control card, and the real-time collection of the current ambient temperature by the system management unit is: and a temperature detection pipe is arranged on the main control card panel and is connected to the microprocessor in the board, so that the current environment temperature is acquired.
4. The heat dissipation control system of claim 1, wherein the controlling the fan control unit to adjust the fan speed in real time according to the current board temperature and the current high-power chip temperature of each service card reported by each service processing unit is: when the current board card temperature and/or the current high-power chip temperature rises, the system processing unit controls the fan control unit to increase the output PWM duty ratio, and otherwise, the output PWM duty ratio is reduced.
5. The heat dissipation control method of the communication equipment is applied to the heat dissipation control system of the communication equipment as claimed in any one of claims 1 to 4, and is characterized by comprising the following steps:
the system prestores board card temperatures and high-power chip temperatures corresponding to different environment temperatures, different service types and different service volumes under normal conditions of each service card, and fan rotating speeds corresponding to the stable operation of each service card as prestore information;
when the system works:
each business card acquires the current board card temperature and the current high-power chip temperature in real time and uploads the current board card temperature and the current high-power chip temperature to the system, and the system acquires the current environment temperature and the real-time rotating speed of the fan in real time;
the system adjusts the rotating speed of the fan in real time according to the reported current board card temperature and the current high-power chip temperature of each business card;
the system judges whether abnormal temperature rise occurs or not according to the combination of the current environment temperature, the real-time rotating speed of the fan, the current board card temperature of each business card and the current high-power chip temperature and prestored information at any moment, and reports the abnormal temperature rise and the reason thereof to a management system or sends a prompt when abnormal temperature rise occurs;
the reason of the abnormal temperature rise is air inlet blockage or failure of heat conduction silicone grease of the high-power chip;
the step of judging whether the abnormal temperature rise occurs or not according to the combination of the current environment temperature, the real-time rotating speed of the fan, the current board card temperature of each business card and the current temperature of the high-power chip and the prestored information is as follows: inquiring prestored information according to the current environment temperature, the current service type of a certain service card and the current service volume of the service card, and acquiring the corresponding board card temperature, the high-power chip temperature and the fan rotating speed in the prestored information;
when the difference value of the real-time rotating speed of the fan and the rotating speed of the fan in the pre-stored information is divided by the fact that the corresponding rotating speed of the fan in the obtained pre-stored information is larger than a preset threshold value, and the current board temperature and the current temperature of the high-power chip are larger than the corresponding board temperature and the corresponding temperature of the high-power chip in the obtained pre-stored information, judging that the air inlet is blocked;
and when the subtraction of the current board temperature and the board temperature corresponding to the pre-stored information is smaller than a first set value, but the subtraction of the current high-power chip temperature and the high-power chip temperature corresponding to the pre-stored information is larger than a second set value, determining that the heat-conducting silicone grease of the high-power chip on the service card is invalid.
6. The method according to claim 5, wherein the threshold value, the first set value, and the second set value are set by a maintenance person according to actual conditions.
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