CN109904107A - A kind of microdevice supplementary device, replenishment system and compensation process - Google Patents
A kind of microdevice supplementary device, replenishment system and compensation process Download PDFInfo
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- CN109904107A CN109904107A CN201910237947.7A CN201910237947A CN109904107A CN 109904107 A CN109904107 A CN 109904107A CN 201910237947 A CN201910237947 A CN 201910237947A CN 109904107 A CN109904107 A CN 109904107A
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Abstract
The invention discloses a kind of microdevice supplementary device, replenishment system and compensation process, belong to electronic manufacturing field.Difficult problem is detected and supplemented after the transfer for microdevice existing in the prior art, the present invention provides a kind of microdevice supplementary devices, replenishment system and compensation process, this programme passes through electric field transfer techniques, the flood tide transfer and supplement of the microdevice of small size may be implemented, by being detected to the substrate after transfer, obtain corresponding bad microdevice position, corresponding replenishment system and removal system are sent to by control system, and the removal of the device by carrying out bad position, and it is supplemented accordingly, accuracy rate is good, it can complete the smooth of whole industry and automation transfer, it is at low cost, it is high-efficient.
Description
Technical field
The present invention relates to electronic manufacturing field, more specifically to a kind of microdevice supplementary device, replenishment system and
Compensation process.
Background technique
Microdevice size is small, and precision is high, the transfer and assembly of existing microdevice mainly by way of absorption come
It is shifted, if vacuum system absorption the methods of shift, but transfer efficiency is low, and it is at high cost, it is directed to microdevice such as
Micro- light emitting diode or other Miniature electronic devices.
With the progress of Optoelectronics Technology, the volume of many photoelectric subassemblys is gradually toward miniaturization, in recent years more successively
Release various micro-displays (Micro-display) technology.Wherein, due to the breakthrough on Light-emitting diode LED manufactured size, mesh
It is preceding by light emitting diode with array arrangement production micro- light emitting diode, i.e., Micro-LED display on the market gradually by
Pay attention to.The different active luminescence component displays of micro- light emitting diode indicator, in addition in terms of contrast and energy consumption insolently
In outside Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display, reliability and service life also
Absolute predominance is occupied, therefore, micro- light emitting diode indicator has very high potential to answer as future action communication electronics with Internet of Things
With the main flow display technology of wearable electronics.
During microdevice commercialization, key is how to realize " transfer of flood tide crystal grain ", i.e., how will be big
The microdevice of amount is transferred on substrate.In the prior art, it generallys use MEMS (MEMS) and picks up microdevice, so
And flatness, the cleanliness etc. that MEMS pick-up process shifts front and back place substrate to microdevice have very high requirement, pick up
The control of process is complicated, and cost is very high.And after pickup, how how the microdevice after pickup is checked, is removed
Incorrect device is installed, the device for supplementing removal is problem to be solved.
Existing design is all normal transfer method, such as Chinese patent application, and application number 201711354228.0 is open
In on May 8th, 2018 day, invention provides a kind of micro- light emitting diode transfer method, provides a LED chip initial substrate, described
LED chip initial substrate is provided with multiple LED chips.Meanwhile the transfer bottom plate for being provided with multiple grooves being provided, it will be described
Multiple LED chips are transferred in the multiple groove, obtain the transfer bottom plate for carrying the multiple LED chip.Also, provide one
A circuit substrate is bonded the transfer bottom plate with the circuit substrate, and by the electrode of the multiple LED chip and the electricity
Base board welding.The transfer bottom plate is separated with the circuit substrate.The multiple LED chip is set to the LED core
Piece initial substrate, and the multiple LED chip is transferred to by the circuit substrate by the transfer bottom plate, it can shift every time
A large amount of LED chip, improves production efficiency, avoids chip offset.It is micro- to draw using electrostatic force, magnetic force or pull of vacuum
Light emitting diode.And above-mentioned method, for device size, luminescence component can not reach smaller device at 1 to 100 micron
To required effect.The absorption transfer equipment of conventional electrostatic power mainly uses micro electro mechanical system (MEMS) technology, has complicated architectures, height
The disadvantages of cost and low yield.The absorption transfer equipment of conventional magnetic is also that tool is multiple using micro electro mechanical system (MEMS) technology, therefore equally
The disadvantages of miscellaneous framework, high cost and low yield.Furthermore, it is necessary to additionally be coated with magnetic force material in micro- light emitting diode, thus need
Additional processing procedure and cost.The absorption transfer equipment of traditional vacuum suction uses micro-vacuum suction nozzle, the ratio of height and internal diameter
It is necessarily less than a critical numerical value, just can ensure that absorption ability.When the size of micro- light emitting diode is very small, the height of vacuum slot
Degree, thickness also need and then to become smaller.Therefore, it be easy to cause the deformation for drawing transfer equipment when operation and reduces extraction efficiency, very
To cause draw transfer equipment rupture therefore, the absorption transfer equipment of traditional vacuum suction is unsuitable for the suction of smaller micromodule
It takes.It does not provide in the prior art and how microdevice is detected and supplemented accordingly.
Summary of the invention
1. technical problems to be solved
Difficult problem is detected and supplemented after the transfer for microdevice existing in the prior art, the present invention provides
A kind of microdevice supplementary device, replenishment system and compensation process, it may be implemented to carry out the microdevice after transfer corresponding
Supplement, supplement high-efficient, accuracy rate is high.
2. technical solution
The purpose of the present invention is achieved through the following technical solutions.
A kind of microdevice supplementary device, including,
One or more microdevices supplement casket, and microdevice supplement casket is corresponding with supplementary mechanism, for storing miniature device
Part, and microdevice is transferred on the supplement sensing device of supplementary mechanism；
Supplementary mechanism utilizes benefit including supplement sensing device and the supplement transcription wheel being oppositely arranged with supplement sensing device
The electric field induction filled between sensing device, microdevice and supplement transcription wheel carries out the transfer of the microdevice of corresponding position, will
Microdevice on supplement sensing device is transferred on transfer base substrate.
Further, it supplements and is provided with supplement induction hole location on sensing device, supplement induction hole location diameter is greater than miniature
Device outer diameter, supplement induction hole location arrangement mode correspond to the arrangement mode in transfer base substrate upper substrate hole.
It further, further include boost charge device, boost charge device is close to supplement sensing device.
It further, further include light supply apparatus, light supply apparatus light source direction removal sensing device.
Further, further include cleaning mechanism, recycled complete microdevice is not shifted on supplement sensing device.
Further, the cleaning mechanism includes supplementary device scraper and supplement recovery bin, and supplementary device scraper is tight
The outer rim for filling sensing device is subsidized, supplement recovery bin is disposed adjacent with supplement sensing device, is not shifted complete microdevice and is returned
It receives to supplement recovery bin.
Further, supplement sensing device is the multiple roller structures of connection that a Metal Contact Rollers or outside pass through belt,
Metal Contact Rollers or belt upper surface are provided with conductive photoreceptor layer.Conductive photoreceptor layer is light-sensitive device, is mainly made of light-guide material.
Light-guide material has cadmium sulfide (CdS), selenium-arsenic (Se-As).
Further, supplement sensing device is induction wheel, and induction wheel is internally provided with supplement idler wheel magnet and/or supplement
Transcription wheel is internally provided with supplement transcription wheel magnet.
It further, further include recovery system, recovery system is set in microdevice supplement casket and/or is set to benefit
Mechanism back segment is filled, the microdevice for being not installed at corresponding position is recycled.
Further, the recovery system structure being set in microdevice supplement casket is as follows, and microdevice supplements in casket
The adjacent position of supplement idler wheel be provided with supplement recycling round, supplement idler wheel is close to supplement recycling round, inside supplement recycling round
Supplement idler wheel side is provided with supplement recycling round magnet, supplement recycling round inside is away from supplement idler wheel side non-magnet.
Further, the recovery system structure for being set to supplementary mechanism back segment is as follows, including supplement recycling round and with benefit
The corresponding supplement pinch roller of recycling round is filled, transfer base substrate passes through between supplement recycling round and supplement pinch roller, supplements inside recycling round
Supplement pinch roller side is provided with supplement recycling round magnet, supplement recycling round inside is returned away from supplement pinch roller side non-magnet
It receives pinch roller and is internally provided with recycling pinch roller magnet.
A kind of microdevice replenishment system is mended including one or more supplementary device described above and control system
It fills to set and be connect with control system, obtain corresponding supplemental information, transfer base substrate passes through supplementary device, and supplementary device is by microdevice
From being transferred on the corresponding supplementary view of transfer base substrate in supplementary device, control system controls the work of several supplementary devices and turns
Move the advance of substrate.
It further, further include detection device before supplementary device is set, detection device detects the micro- of transfer base substrate
Corresponding detection information is sent in control system by type device.
It further, further include one or more removal device, removal device setting is in supplementary device and detection dress
Between setting, removal device carries out the removal of bad microdevice by the detection information obtained from control system.
A kind of microdevice compensation process, using any of the above-described replenishment system, steps are as follows:
The location information that supplementary device supplements required for being obtained by control system；
Supplementary device supplements casket by microdevice, and microdevice is transferred to supplementary mechanism from microdevice supplement casket
It supplements on sensing device；
It supplements and turning for microdevice is carried out using electric field induction compensation process by setting supplement transcription wheel on sensing device
It moves, the microdevice supplemented on sensing device is supplemented on the corresponding supplementary view of transfer base substrate, the benefit of microdevice is completed
It fills.
Further, before supplement, removal device is first carried out bad by the detection information obtained from control system
The removal of microdevice, after corresponding supplement is carried out to the position of removal.
Further, the location information for requiring supplementation with and/or removing of control system is detected by detection device and is obtained.
Further, specific electric field induction compensation process is as follows, and boost charge device is to supplement sensing device surface
Cloth electricity makes its surface cloth rest potential, and supplement light supply apparatus corresponds to supplement sensing device surface according to the position of required supplement
The position of supplement be exposed, form electric hole on supplement sensing device surface, supplement sensing device, which is rotated to microdevice, to be mended
The supplement scroll wheel positions of casket are filled, supplement roller surface, which is given, is greater than supplement sensing device crystal morphology, so that supplement induction dress
It sets surface electric hole position and supplement idler wheel generates field effect, through driven Design, supplement sensing device surface electric hole position and mend
It fills the microdevice position that roller surface requires supplementation with to correspond to each other, it is micro- that supplement transcription wheel supplements roller surface under electric field action
Type device is supplemented to supplement sensing device surface, completes supplement roller surface microdevice and is transferred to supplement sensing device surface,
It is not added light supply apparatus irradiation position, supplement sensing device surface potential is less than or equal to supplement roller surface current potential, mends
Fill the microdevice on idler wheel will not be passed to supplement sensing device be retained in supplement idler wheel on；Supplement sensing device rotate to
Transcription wheel is supplemented, supplement transcription wheel surface gives rest potential, so that it is generated electric field to supplement sensing device surface, supplement is incuded
Apparatus surface microdevice is transferred on the corresponding position of transfer base substrate.
3. beneficial effect
Compared with the prior art, the present invention has the advantages that
This programme may be implemented the flood tide transfer and supplement of the microdevice of small size, passed through by electric field transfer techniques
Substrate after transfer is detected, corresponding bad microdevice position is obtained, corresponding benefit is sent to by control system
Charging system and removal system, and the removal of the device by carrying out bad position, and supplemented accordingly, accuracy rate is good, can
It is at low cost to complete the smooth of whole industry and automation transfer, it is high-efficient.
Detailed description of the invention
Fig. 1 is replenishment system overall structure diagram of the invention；
Fig. 2 is structure of the detecting device schematic diagram；
Fig. 3 is removal device structural schematic diagram；
Fig. 4 is supplementary device structural schematic diagram；
Fig. 5 is the section enlarged diagram that microdevice is transferred to transfer base substrate when supplementary device supplements；
Fig. 6 is transfer base substrate schematic diagram；
Fig. 7 is transfer base substrate enlarged schematic partial view；
Fig. 8 is micro device structure schematic diagram；
Fig. 9 is microdevice bottom schematic view；
Figure 10 is microdevice diagrammatic cross-section；
Figure 11 is that microdevice is mounted on transfer base substrate diagrammatic cross-section；
Figure 12 is the supplementary device schematic diagram of the supplement sensing device of belt transmission；
Figure 13 is the supplementary device schematic diagram equipped with magnet；
Figure 14 is the removal device schematic diagram of the supplement sensing device of belt transmission；
Figure 15 is the removal device schematic diagram equipped with magnet；
Figure 16 is to recycle adsorption structure in the schematic device of supplementary mechanism back segment.
Figure label explanation:
1, microdevice；101, first electrode；102, second electrode；103, luminescent layer；204, sensor；
5, transfer base substrate；501, substrate aperture；502, grating；503, first electrode circuit；504, second electrode circuit；505,
Base；
8, detection device；801, delivery roller；802, photographic device；803, conductive casters；
9, removal device；901, light supply apparatus；902, sensing device is removed；903, transcription means are removed；904, charging roller；
905, scraper is removed；906, recovery bin is removed；
10, supplementary device；111, microdevice supplements casket；112, sensing device is supplemented；1121, idler wheel magnet is supplemented；
113, transcription wheel is supplemented；1131, transcription wheel magnet is supplemented；114, stirring rod is supplemented；115, supplementary device scraper；116, it supplements back
Receive storehouse；117, boost charge device；118, light supply apparatus is supplemented；
121, idler wheel is supplemented；122, recycling round is supplemented；123, recycling round scraper；124, roller scraping cutter is supplemented；125, it supplements
Idler wheel magnet；216, pinch roller is supplemented.
Specific embodiment
With reference to the accompanying drawings of the specification and specific embodiment, the present invention is described in detail.
Embodiment 1
To solve the above-mentioned problems, present solution provides the dresses that microdevice supplement is carried out in the way of electric field induction
It sets, as shown in figure 4, a kind of microdevice supplementary device, including, one or more microdevices supplement casket 111, and microdevice is mended
It is corresponding with supplementary mechanism to fill casket 111, for storing microdevice 1, microdevice herein supplement casket 111 may include it is monochromatic or
The microdevice of polychrome or the microdevice for being different other performances, microdevice can be micro- light emitting diode.And it will be micro-
Type device 1 is transferred on the supplement sensing device 112 of supplementary mechanism；It is provided with and stirs in microdevice supplement 111 inside bottom of casket
Device is mixed, the present embodiment is supplement stirring rod 114, or the agitating device of other forms.
Supplementary mechanism, including supplement sensing device 112 and the supplement transcription wheel being oppositely arranged with supplement sensing device 112
113, corresponding position is carried out using the electric field induction between supplement sensing device 112, microdevice 1 and supplement transcription wheel 113
The microdevice 1 supplemented on sensing device 112 is transferred on transfer base substrate 5 by the transfer of microdevice 1.Supplement sensing device
Supplement induction hole location is provided on 112, supplement induction hole location diameter is greater than 1 outer diameter of microdevice, supplement induction hole location arrangement side
Formula corresponds to the arrangement mode in 5 upper substrate hole 501 of transfer base substrate.The supplement induction hole location of arrangement can be with the miniature device of corresponding position
Part 1 is supplemented into substrate aperture 501, and installation site is corresponding.
Further include cleaning mechanism, is recycled complete microdevice 1 is not shifted on supplement sensing device 112.Described is clear
Clean mechanism includes supplementary device scraper 115 and supplement recovery bin 116, and supplementary device scraper 115 is close to supplement sensing device 112
Outer rim, supplement recovery bin 116 are disposed adjacent with sensing device 112 is supplemented, do not shift complete microdevice 1 and be recycled to and supplement back
It receives in storehouse 116.
It further include boost charge device 117, boost charge device 117 is close to supplement sensing device 112.It further include supplement light
Source device 118, supplement 118 light source of light supply apparatus direction supplement sensing device 112.Light supply apparatus 118 is supplemented to be used to give supplement sense
It answers device 112 to expose, is allowed to generate electric hole.
Microdevice 1 in this programme is micro- light emitting diode or other miniature electronic building bricks, can be photoelectricity group
Part, such as light emitting diode, optical sensing subassembly, solar battery etc. or other electronic building bricks unrelated with light are such as sensed
Device, transistor etc., it is only necessary to which being electrode, perhaps side can be adsorbed by electric field absorption or magnet in one direction in bottom surface
Component is all within the scope of this programme, such as micro- light emitting diode, as shown in Figure 8,9, 10, micro- light-emitting diodes that this programme uses
Tube exterior is round, spherical, rectangular or polygon, and first electrode 101 and second electrode 102 are in the same side, electrode tip tapering
Shape, the smaller micro- light emitting diode substrate hole of electrode tip appearance is in a taper shape, and the big bottom in electrode tip top is small, such structure with it is micro-
Light emitting diode can have guiding to be accurately positioned effect, the first electrode 101 of microdevice and the table at 102 end of second electrode when shifting
Face metal is the material that can be adsorbed by magnet, such as iron, nickel, cobalt are constituted.As shown in Figure 6,7, micro- light emitting diode shifts base
Plate 5 is a thin soft translucent material, and to there is multiple aligned identical display substrates to combine on roll fashion, substrate aperture 501 is in square
Battle array arrangement, substrate aperture 501 is tapered, top be greater than bottom, such structure be easier during transfer with micro- light emitting diode 1
The apparent taper shape of electrode side, which mutually guides, to be agreed with.
Microdevice supplements the shell that casket 111 includes microdevice supplement casket 111, is provided with supplement idler wheel 121 in shell,
Supplement idler wheel 121 is conductive material, and such as aluminium can also be attached with elastomer layer made of the materials such as one layer of rubber or plastic cement outside,
Supplement 121 surface of idler wheel is provided with several transfer roller transfers hole 223.One or more microdevice supplement caskets 111 can be to one
A supplement idler wheel 121 can be polychrome or monochrome.The supplement sensing device 112 and supplement 121 spacing of idler wheel of this programme exist
0~2.5mm to guarantee that its electric field strength is enough, and will not influence the transfer of microdevice 1, supplement 112 rest potential of sensing device
It is all this standard when positive and negative electrostatic pressure less than <supplement 121 rest potential of idler wheel.Positive and negative rest potential includes direct current, hands over
Galvanic electricity or direct current add alternating current to mix, and electric field level is directly proportional to 1 size of microdevice, microdevice 1 larger electricity
Field also increases, and 1 size of microdevice of this programme is less than 100 μm, it is ensured that very small microdevice 1 is suitable for this programme
Device supplemented.
Supplementing sensing device 112 is a Metal Contact Rollers or the external multiple roller structures of connection for passing through belt, Metal Contact Rollers
Or belt upper surface is provided with conductive photoreceptor layer.Conductive photoreceptor layer is light-sensitive device, is mainly made of light-guide material.Light-guide material
There are cadmium sulfide (CdS), selenium-arsenic (Se-As).Metal Contact Rollers are by having conductive Metal Contact Rollers material to be made, such as iron, aluminium, alloy
Steel, as shown in figure 12, sensing device 202 may be the external multiple roller structures of connection for passing through belt, be three in this figure
Idler wheel, outside are provided with belt, drive belt transmission by three idler wheels, adsorb microdevice 1, three idler wheels point by belt
It is not corresponding with microdevice transfer casket 201, recyclable device and transcription wheel 203.
It further include recovery system, recovery system is set in microdevice supplement casket 111 and/or after being set to supplementary mechanism
Section, the microdevice 1 for being not installed at corresponding position is recycled.The recovery system being set in microdevice supplement casket 111
Structure is as follows, and supplement idler wheel 121 is internally provided with supplement idler wheel magnet 125, supplements the electricity of the adsorbable microdevice 1 of idler wheel 121
Pole-face, supplement idler wheel magnet 125 are permanent magnet magnetic core, supplement and are provided with supplement idler wheel transfer hole on idler wheel 121, as shown in figure 4,
Supplement roller scraping cutter 124 is provided on supplement idler wheel 121, the adjacent position of supplement roller scraping cutter is provided with magnetic rollers mechanism benefit
It fills recycling round 122 and absorption supplement 121 surface of idler wheel is filtered out into 1 electrode position direction of microdevice mistake in supplement idler wheel transfer hole
It is correct to leave 1 electrode direction of microdevice in the supplement idler wheel transfer hole on supplement 121 surface of idler wheel for microdevice 1 accidentally
Microdevice 1 can will supplement 1 electrode direction mistake of microdevice in idler wheel transfer hole and screen, herein be recovery system
The structure being set in microdevice transfer casket is supplemented back as shown in figure 4, supplement idler wheel 121 is close to supplement recycling round 122
It receives wheel 122 and is internally provided with supplement recycling round magnet, supplement recycling round magnet is semicircular body, and disc is close to supplement idler wheel 121 1
Side supplements and is equipped with recycling round scraper 123 outside idler wheel 121, returns in microdevice supplement casket 111 for removing microdevice 1.
1 electrode direction of microdevice will correctly be added idler wheel 121 and adsorb, and 1 electrode direction mistake of microdevice will be added back
Receive 122 absorption of wheel.One microdevice supplement casket 111 can correspond to the scraper and recycling round group of multiple groups.
The structure of another kind supplement recycling absorption, as shown in figure 16, recovery system is set to supplementary mechanism back segment, will not pacify
Microdevice mounted in corresponding position is recycled, including supplement recycling round 122 and supplement corresponding with supplement recycling round 122 are pressed
Wheel 216, transfer base substrate 5 pass through between supplement recycling round 122 and supplement pinch roller 216, and 122 inside of supplement recycling round is close to supplement
216 side of pinch roller is provided with supplement idler wheel magnet 125, supplements and deviates from supplement 216 side non-magnet of pinch roller inside recycling round 122,
Supplement pinch roller 216 is internally provided with magnet to be continued to move forwards after transfer base substrate 5 is by supplement transcription wheel 113, and operation is extremely returned
When receipts system, due to magnetic effect, the downward microdevice 1 of electrode is added the attraction of pinch roller 216, is fixed on transfer base substrate
On 5, the upward microdevice 1 of electrode is added the attraction of recycling round 122, is detached from transfer base substrate 5, the mistake installation upward to electrode
Microdevice 1 is recycled.
In specific works, as shown in figure 5, electric field induction compensation process is as follows, 117 pairs of supplement induction dresses of boost charge device
Setting 112 surface cloth electricity makes its surface cloth rest potential, and supplement light supply apparatus 118 incudes supplement according to the position of required supplement
The position of the corresponding supplement in 112 surface of device is exposed, and forms electric hole, supplement induction dress on supplement 112 surface of sensing device
112 rotations are set to 121 position of supplement idler wheel of microdevice supplement casket 111, supplement 121 surface of idler wheel, which is given, is greater than supplement induction
112 crystal morphology of device, so that supplement 112 surface electric hole position of sensing device and supplement idler wheel 121 generate field effect, warp
1 position of microdevice that driven Design, supplement 112 surface electric hole position of sensing device and supplement 121 surface of idler wheel require supplementation with
It corresponds to each other, supplement transcription wheel 113 supplements 121 surface micro device 1 of idler wheel under electric field action and is supplemented to supplement sensing device
112 surfaces complete supplement 121 surface micro device 1 of idler wheel and are transferred to supplement 112 surface of sensing device, be not added light
118 irradiation position of source device, supplement 112 surface potential of sensing device are less than or equal to supplement 121 surface potential of idler wheel, supplement idler wheel
Microdevice 1 on 121 will not be passed to supplement sensing device 112 and be retained on supplement idler wheel 121；Supplement sensing device
Rest potential is given on 112 rotations to supplement transcription wheel 113, supplement 113 surface of transcription wheel, makes it to supplement 112 surface of sensing device
Electric field is generated, supplement 112 surface micro device 1 of sensing device is transferred on the corresponding position of transfer base substrate 5.
Embodiment 2
Embodiment 2 is substantially the same manner as Example 1, such as Figure 13, also resides in, when supplementing sensing device 112 is induction wheel,
Induction wheel is internally provided with supplement idler wheel magnet 1121 and/or supplement transcription wheel 113 is internally provided with supplement transcription wheel magnet
1131.It is three idler wheels in this figure, outside is provided with belt, drives belt transmission by three idler wheels, is adsorbed by belt micro-
Type device 1, three idler wheels are corresponding with microdevice supplement casket 111, recyclable device and supplement transcription wheel 113 respectively.
Induction wheel and supplement transcription wheel 113 inside magnet can one of them be arranged, can also be arranged simultaneously, induction wheel
Internal magnet can be adsorbed on by force the attachment dynamics of the component on induction wheel, will not be because falling off and being displaced caused by induction wheel high speed rotation.It mends
Fill inside transcription wheel 113 and increase magnet, magnet can stiffener assembly be transferred in transfer substrate so that component electrode tip and transfer base
Turning circuit contact is more stable and reliable on material.And due to the surface at the first electrode of microdevice 101 and 10 end of second electrode gold
Category is the material that can be adsorbed by magnet, such as iron, nickel, cobalt are constituted, and can preferably carry out absorption microdevice by magnet
1。
Embodiment 3
A kind of microdevice replenishment system is as shown in Figure 1, include one or more supplementary device 10 and control system, benefit
It fills and sets 10 and connect with control system, obtain corresponding supplemental information, transfer base substrate 5 passes through supplementary device 10, and supplementary device 10 will
For microdevice 1 from being transferred on the corresponding supplementary view of transfer base substrate 5 in supplementary device 10, control system controls several supplement dresses
Set 10 work and the advance of transfer base substrate 5.
It further include the detection device 8 before supplementary device 10 is set, detection device 8 detects the microdevice of transfer base substrate 5
1, corresponding detection information is sent in control system.
A kind of microdevice detection device that this programme provides, as shown in Fig. 2, including delivery roller 801 and conductive casters
803, transfer base substrate 5 is pressed between delivery roller 801 and conductive casters 803, and photographic device 802 is set to 5 top of transfer base substrate,
Lens direction is vertical with 5 direction of motion of transfer base substrate downwards, and control system connects photographic device 802, obtains camera shooting information.Camera shooting
Device 802 can be optical microscopy.Multiple detection devices 8 can be set on transfer base substrate 5.It can through photographic device 802
Magnifying each microdevice 1, whether function is normal, and detection content includes bright or do not work, luminous intensity and luminescent color, table
Whether face is defective.
Conductive casters 803 are contacted with transfer base substrate 5, are powered for transfer base substrate 5, are arranged in 5 upper substrate hole 501 of transfer base substrate
Microdevice 1 is powered.It is additionally provided with sensor 204, sensor 204 is set to 5 top of transfer base substrate, detects on transfer base substrate 5
Grating 502, sensor 204 connect with control system, obtains corresponding transfer base substrate 5 and transmits information.
Delivery roller 801 is made of translucent material, and translucent material is optical glass or plastic cement.Due to having used light transmission material
Material, the photographic device 802 are set to inside delivery roller 801.
801 surface of delivery roller is provided with transparency conducting layer, and conductive layer is made of an electrically conducting material, and is also translucent material.Thoroughly
Bright electro-conductive glass such as TCO (transparent conductive film), including the transparent electro-conductive glass (In of doping Sn2O3Transparent conducting glass), FTO
(the SnO of doping fluorine2Transparent conducting glass), AZO (the ZnO transparent conducting glass of adulterated al).Through transparent on delivery roller 801
It is transparent on conducting microdevice 1 and 5 circuit of transfer base substrate or delivery roller 801 to lead when conductive layer and conductive casters 803 press
When electric layer and conductive casters 803 press, microdevice 1 and 5 circuit of transfer base substrate individually is connected by conductive casters 803, so that miniature device
Part 1 is lighted.The camera lens that photographic device 802 is set to inside delivery roller 801 is right against delivery roller 801, conductive casters 803 and turns
Substrate 5 is moved to be in contact position.This design can reduce volume, will not influence whole detection effect, and can targetedly set
It sets in detection position 8, preferably identifies microdevice 1.
Micro- light emitting diode substrate is constituted by way of substrate is rolled up, and substrate volume axial direction is provided with one piece or more
Block transfer base substrate 5, substrate volume are made of several 5 sequences of transfer base substrate, corresponding one, the X-direction coordinate of each grating 502
Or more than one transfer base substrate 5 combines, and has grating 502 and substrate aperture 501 on transfer base substrate 5, photographic device 802 has several groups
Conjunction mode, corresponding at Y direction coordinate, each photographic device 802 corresponds to multiple in the Y direction coordinate in a region
Microdevice 1, it is known that the corresponding X-direction coordinate of grating 502 and photographic device 802 have several combinations to correspond into Y direction coordinate,
During substrate motion, sensor 204 reads grating 502X axis direction coordinate and the reading of photographic device 802 is corresponding at Y-axis side
To coordinate, 501 position of substrate aperture for placing micro- light emitting diode on transfer base substrate 5 is judged by the position that crosses of X-axis and Y-axis, is obtained
Obtain corresponding position data.
It further include one or more removal device 9, removal device 9 is arranged between supplementary device 10 and detection device 8,
Removal device 9 carries out the removal of bad microdevice 1 by the detection information obtained from control system.
A kind of microdevice removal device, as shown in figure 3, include removal sensing device 902 and with removal sensing device 902
The removal transcription means 903 being oppositely arranged, using between removal sensing device 902, microdevice 1 and removal transcription means 903
Electric field induction carry out microdevice 1 transfer, by the microdevice 1 on transfer base substrate 5 be transferred to removal sensing device 902
On.
Specific electric field induction mode is using the removal charged 904 cloth electricity of roller of sensing device 902 in removal sensing device
Light source is opened in estimated position via the control system control light supply apparatus 901 of outside or inside in 902 surfaces, here pre-
Meter position refers to the position for the bad microdevice 1 that control system obtains, so that removal 902 surface of sensing device generates electricity
Hole in removal 902 surface electric hole position of sensing device attachment microdevice 1 and removes the generation electric field between transcription means 903
Induction carries out the transfer of microdevice 1, and the microdevice 1 on transfer base substrate 5 is transferred on removal sensing device 902.Herein
Electric hole refer to a circular potential difference, hole is also known as electric hole (Electron hole), refers in solid state physics covalent
An electronics is lost on key, finally the phenomenon that leaving vacancy on covalent bond.Some valence electrons i.e. in covalent bond are due to heat fortune
It is dynamic to obtain some energy, so that getting rid of the constraint of covalent bond becomes free electron, while vacancy is left on covalent bond, we claim
These vacancy are hole, also referred to as electric hole.
It further include charging roller 904, charging roller 904 is close to removal sensing device 902.It further include light supply apparatus 901, light source dress
Micro- light emitting diode or laser generator can be used by setting 901.
Light supply apparatus 901 light source direction removal sensing device 902.It removes 902 length of sensing device and is greater than light supply apparatus 901
Projection length.
Preferably, this programme further includes recovering mechanism, and recovering mechanism is close to removal sensing device 902, recycles the micro- of removal
Type device 1.Recovering mechanism includes removal scraper 905 and removal recovery bin 906, and removal scraper 905 is close to removal sensing device 902
Outer rim, removal recovery bin 906 with remove sensing device 902 be disposed adjacent.
Microdevice removal device is in the bad microdevice location point for learning detection device offer in removal sensing device
Corresponding position generates electric hole, and electric hole position corresponds to and generates electric field between the two o'clock of bad microdevice position, acts in electric field force
Lower extract bad microdevice is attached to removal sensing device, without the device that the corresponding qualification in electric hole position is miniature
It can remain.
Transfer base substrate 5 removes sensing device 902 and turns across removal sensing device 902 and removal transcription means 903
5 spacing of substrate is moved in 0~5mm.
Embodiment 4
As shown in figure 14, substantially the same manner as Example 3, difference is, removal sensing device 902 is for a Metal Contact Rollers or outside
Portion passes through the multiple roller structures of connection of belt, and surface thoughts optical conductive layer is arranged on Metal Contact Rollers or belt.Conductive photoreceptor layer
It is light-sensitive device, is mainly made of light-guide material, light-guide material has cadmium sulfide (CdS), selenium-arsenic (Se-As).Metal Contact Rollers are by having
There is conductive Metal Contact Rollers material to be made, such as iron, aluminium, steel alloy, sensing device 202 or the external connection by belt
Multiple roller structures are three idler wheels in this figure, and outside is provided with belt, drive belts transmission by three idler wheels, pass through skin
Band absorption microdevice 1, two idler wheels are corresponding with removal transcription means 903 and removal recovery bin 906 respectively, can also be according to need
Seek the idler wheel of setting quantity required.
Embodiment 5
As shown in figure 15, substantially the same manner as Example 3, difference is, removal sensing device 902 is removal induction wheel, goes
Removal transcription is internally provided with except induction wheel is internally provided with removal sensing device magnet 9022 and/or removes transcription means 903
Magnet 9031.Remove sensing device 902 and remove transcription means 903 inside magnet can one of them be arranged, can also be same
When be arranged, induction wheel internal magnet can reinforce the 1 attachment dynamics of microdevice being adsorbed on induction wheel, will not because induction wheel high speed revolve
Turn to cause to fall off and be displaced.Increase magnet inside removal transcription means 903, magnet can reinforce microdevice 1 and be adsorbed on transfer base
On plate 5 so that 1 electrode tip of microdevice contacted with turning circuit on transfer base substrate 5 it is more stable and reliable.
Embodiment 6
A kind of microdevice compensation process, using the replenishment system, steps are as follows:
A, the location information supplemented required for supplementary device 10 is obtained by control system；
It is used herein as the citing that micro- light emitting diode carries out embodiment, when being worked, transfer base substrate 5 moves to inspection
Location is set, and transfer base substrate 5 is sandwiched between conductive casters 803 and delivery roller 801, as shown in figure 11, so that microdevice 1 and substrate
Upper conductiving point is steadily contacted, using the separation up and down of the two-tier circuit plate of transfer base substrate 5,5 side of transfer base substrate upside and
Downside is respectively arranged with exposed circuit, the circuit of exposure in the conducting lower board of conductive casters 803, in the conducting of delivery roller 801
The power supply of the circuit of side group plate exposure, microdevice 1 can be lighted by conductive casters 803 to circuit board electric conduction on transfer base substrate 5
Microdevice 1 or delivery roller 801 and conductive casters 803 respectively give a positive and negative power supply electric conduction, are joined by the circuit of leakage
Logical microdevice 1, lights corresponding micro- light emitting diode, carries out image through the photographic device 802 in delivery roller 801 and adopts
Collection, the image of acquisition is sent in control system, every microdevice of control system procuratorial work 1 whether function is normal, comprising bright
Or do not work, luminous intensity and luminescent color, whether surface is defective, and corresponding image judges system and corresponding judgment method is
What the prior art may be implemented can use, and seldom illustrate herein, unqualified microdevice 1, via system record position,
502 position of grating and photographic device are read by sensor 204 by the grating 502 on 5 outside of transfer base substrate in 1 position of microdevice
802 corresponding calculated crosswises and judgement, can judge unqualified 1 position of microdevice.New accordingly store, by this position
It sets and reaches control system, data are provided and are supported for removal and supplementary device.
B, a kind of microdevice removal, steps are as follows,
1) the removal system is used；Removal system is passed through by the transfer base substrate 5 for the microdevice 1 being mounted with；It goes
Except sensing device 902 and 5 linear speed of transfer base substrate are compared in 1:1 ± 5%.Guarantee that speed is consistent, removal when will not identify mistake.
2) detection device 8 obtains the position of corresponding bad microdevice 1, and information is sent into control system；
3) removal device 9 obtains the position of corresponding bad microdevice 1 by control system；
4) position for the unqualified microdevice 1 that the light supply apparatus 901 of removal device 9 is provided according to upper station detection device 8
It sets, unqualified position is corresponded on removal sensing device 902 via light supply apparatus 901 and irradiates generation electric hole；
5) removal transcription means 903 are powered, and current potential is connected, when removal sensing device 902 and removal transcription means 903 rotate
When, removal sensing device 902 is irradiating generation electric hole position and removal 903 surface potential of transcription means by light supply apparatus 901
There is potential difference to generate electric field force；It is less than etc. not by 901 irradiation position of light supply apparatus, removing 902 surface potential of sensing device
In removal 903 surface potential of transcription means, therefore qualified microdevice 1 will not be passed to removal sensing device 902 and retain
On transfer base substrate 5.The definition of field strength is that have the characteristics of active force to obtain microdevice charge according to electric field.The list of field strength
Position is ox/library or volt/rice, two organization differences, but size is the same.Field strength is numerically equal to what unit charge was received in the point
The direction of electric field force, field strength is identical as positive charge Impact direction.The characteristic of electric field is that have active force to microdevice charge, this
Active force is exactly electric field force, and positive charge Impact direction is identical as direction of an electric field, and negative electrical charge Impact direction is opposite with direction of an electric field.
6) it is corresponded to by the electric hole position on control system removal 902 surface of sensing device known on transfer base substrate 5
Bad 1 position of microdevice moves to removal sensing device by the bad microdevice 1 on transfer base substrate 5 under electric field force effect
Removal unqualified microdevice 1 on transfer base substrate 5 is completed on 902 surfaces.
Preferably, the unqualified microdevice 1 on removal 902 surface of sensing device is adsorbed on via removal scraper 905, removal
It is attached to the bad microdevice 1 on removal 902 surface of sensing device.
Under normal circumstances, when removal, microdevice and transfer base substrate are also unlocked when in detection and removal process, i.e.,
Unwelded completion, microdevice are only located on transfer base substrate, in this way in the state of the work that is removed.
Scheme is removed on sensing device 902 using the field effect of removal sensing device 902 and removal transcription means 903
The position for the unqualified microdevice 1 that light supply apparatus 901 is provided according to upper station detection device, on removal sensing device 902
Corresponding unqualified position is irradiated via light supply apparatus 901 generates electric hole, this electric hole position corresponds to bad 1 position of microdevice, when
When removing the rotation of sensing device 902 to removal 903 position of transcription means, current potential, removal induction is connected in removal transcription means 903
Device 902 and removal transcription means 903 generate electric field force, F=Eq { F: electric field force (N), q: the microdevice 1 by electric field force
The electricity (C) of charge, E: electric field strength (N/C) }, it removes bad micro- on the electric hole attraction substrate on 902 surface of sensing device
Type device 1 moves to removal 902 surface of sensing device, completes removal unqualified microdevice 1 on substrate.Control system is such as counted
Then the Content Transformation that calculation machine arranges needs passes the data to removal dress at the original image of data-sequence form again
It sets.The pattern that these data are translated into dot matrix in removal device, the pattern of dot matrix are bad device position, the point after translation
System of battle formations sample is sent to light supply apparatus 901, herein can be laser generator, and laser generator is made rapidly according to the content of pattern
The reaction of Push And Release on the removal sensing device 902 laser beam projects a to rotation through overcharge, removes sensing device
The all local charges being irradiated with a laser in 902 surface are all released, and the electric hole that surface forms one by one is known as electrostatic
Sub-image, and those laser do not shine place is still with charge, leads to electric hole caused by laser irradiation, on transfer base substrate 5
Microdevice 1 between removal sensing device 902 and removal transcription means 903 between, except transcription means 903 be connected and remove
The opposite current potential of sensing device 902 is situated between so that generating field effect between removal sensing device 902 and removal transcription means 903
The electric hole position that microdevice 1 is irradiated with a laser again in electric field generates electric field force, can transfer on transfer base substrate 5 with charge
Microdevice 1 be transferred to removal 902 surface of sensing device, 902 position of removal sensing device not being irradiated with a laser and removal
It is suitable that current potential is connected in transcription means 903, therefore qualified microdevice 1 is retained on transfer base substrate 5, undesirable microdevice
1 is adsorbed in removal sensing device 902.
C, the location information for requiring supplementation with and/or removing of 10 control system of supplementary device is obtained by the detection of detection device 8
Corresponding supplemental information is obtained, casket 111 is supplemented by microdevice, microdevice 1 is transferred to supplement from microdevice supplement casket 111
On the supplement sensing device 112 of mechanism；
It supplements and miniature device is carried out using electric field induction compensation process by setting supplement transcription wheel 113 on sensing device 112
The microdevice 1 supplemented on sensing device 112 is supplemented on the corresponding supplementary view of transfer base substrate 5 by the transfer of part 1, is completed
The supplement of microdevice 1.
Specific electric field induction compensation process is as follows, and electric field induction compensation process is as follows, 117 pairs of boost charge device supplements
112 surface cloth electricity of sensing device makes its surface cloth rest potential, supplements light supply apparatus 118 according to the position of required supplement, to benefit
The position for filling the corresponding supplement in 112 surface of sensing device is exposed, and forms electric hole, supplement on supplement 112 surface of sensing device
The rotation of sensing device 112 to 121 position of supplement idler wheel of microdevice supplement casket 111, supplement 121 surface of idler wheel is given to be greater than and be mended
112 crystal morphology of sensing device is filled, so that supplement 112 surface electric hole position of sensing device and supplement idler wheel 121 generate electric field
Effect supplements 112 surface electric hole position of sensing device and supplements the miniature device that 121 surface of idler wheel requires supplementation with through driven Design
1 position of part corresponds to each other, and supplement transcription wheel 113 supplements 121 surface micro device 1 of idler wheel under electric field action and is supplemented to supplement sense
Answer 112 surface of device, complete supplement 121 surface micro device 1 of idler wheel and be transferred to supplement 112 surface of sensing device, not by
118 irradiation position of light supply apparatus is supplemented, supplement 112 surface potential of sensing device is less than or equal to supplement 121 surface potential of idler wheel, mends
The microdevice 1 filled on idler wheel 121 will not be passed to supplement sensing device 112 and be retained on supplement idler wheel 121；Supplement induction
Rest potential is given on the rotation of device 112 to supplement transcription wheel 113, supplement 113 surface of transcription wheel, makes it to supplement sensing device 112
Surface generates electric field, and supplement 112 surface micro device 1 of sensing device is transferred on the corresponding position of transfer base substrate 5.
This programme quickly supplements microdevice 1 by detection, removal, supplementary device, and passes through multiple tracks work
Sequence, supplement is sufficiently and perfect, high-efficient, at low cost.
Schematically the invention and embodiments thereof are described above, description is not limiting, not
In the case where spirit or essential characteristics of the invention, the present invention can be realized in other specific forms.Institute in attached drawing
What is shown is also one of the embodiment of the invention, and actual structure is not limited to this, any attached in claim
Icon note should not limit the claims involved.So not departed from if those of ordinary skill in the art are inspired by it
In the case where this creation objective, frame mode similar with the technical solution and embodiment are not inventively designed, it should all
Belong to the protection scope of this patent.In addition, one word of " comprising " is not excluded for other elements or step, "one" word before the component
It is not excluded for including " multiple " element.The multiple element stated in claim to a product can also by an element by software or
Person hardware is realized.The first, the second equal words are used to indicate names, and are not indicated any particular order.
Claims (13)
1. a kind of microdevice supplementary device, which is characterized in that including,
One or more microdevices supplement casket (111), and microdevice supplement casket (111) is corresponding with supplementary mechanism, for storing
Microdevice (1), and microdevice (1) is transferred on the supplement sensing device (112) of supplementary mechanism；
Supplementary mechanism, including supplement sensing device (112) and the supplement transcription wheel being oppositely arranged with supplement sensing device (112)
(113), it using supplement sensing device (112), microdevice (1) and supplements the electric field induction between transcription wheel (113) and carries out pair
The microdevice (1) supplemented on sensing device (112) is transferred to transfer base substrate (5) by the transfer for answering the microdevice (1) of position
On.
2. a kind of microdevice supplementary device according to claim 1, which is characterized in that in supplement sensing device (112)
It is provided with supplement induction hole location, supplement induction hole location diameter is greater than microdevice (1) outer diameter, supplement induction hole location arrangement mode pair
Answer the arrangement mode in transfer base substrate (5) upper substrate hole (501).
3. a kind of microdevice supplementary device according to claim 1 or 2, which is characterized in that further include boost charge dress
It sets (117), boost charge device (117) is close to supplement sensing device (112).
4. a kind of microdevice supplementary device according to claim 3, which is characterized in that further include supplement light supply apparatus
(118), supplement light supply apparatus (118) light source direction supplement sensing device (112).
5. a kind of microdevice supplementary device according to claim 1, which is characterized in that supplementing sensing device (112) is
One Metal Contact Rollers or the external multiple roller structures of connection for passing through belt, Metal Contact Rollers or belt upper surface are provided with conductive photoreceptor
Layer.
6. a kind of microdevice supplementary device according to claim 1, which is characterized in that supplementing sensing device (112) is
Induction wheel, induction wheel is internally provided with supplement idler wheel magnet (1121) and/or supplement transcription wheel (113) is internally provided with supplement and turns
Write wheel magnet (1131).
7. a kind of microdevice replenishment system, which is characterized in that including one or more supplement dress described in claim 1-6
(10) and control system are set, supplementary device (10) is connect with control system, obtains corresponding supplemental information, and transfer base substrate (5) passes through
Supplementary device (10), it is corresponding that microdevice (1) is transferred to transfer base substrate (5) by supplementary device (10) from supplementary device (10)
On supplementary view, control system controls the work of several supplementary devices (10) and the advance of transfer base substrate (5).
8. a kind of microdevice replenishment system according to claim 11, which is characterized in that further include that setting is filled in supplement
Detection device (8) before setting (10), detection device (8) detect the microdevice (1) of transfer base substrate (5), by corresponding detection information
It is sent in control system.
9. a kind of microdevice replenishment system according to claim 7 or 8, which is characterized in that further include one or more
A removal device (9), removal device (9) are arranged between supplementary device (10) and detection device (8), and removal device (9) passes through
The detection information obtained from control system carries out the removal of bad microdevice (1).
10. a kind of microdevice compensation process, using any replenishment system of claim 7-9, steps are as follows:
The location information that supplementary device (10) supplements required for being obtained by control system；
Supplementary device (10) supplements casket (111) by microdevice, and microdevice (1) is turned from microdevice supplement casket (111)
It moves on the supplement sensing device (112) of supplementary mechanism；
It supplements and miniature device is carried out using electric field induction compensation process by setting supplement transcription wheel (113) on sensing device (112)
The microdevice (1) supplemented on sensing device (112) is supplemented to the corresponding supplementary view of transfer base substrate (5) by the transfer of part (1)
On, complete the supplement of microdevice (1).
11. a kind of microdevice compensation process according to claim 10, which is characterized in that before supplement, removal dress
Set the removal that (9) first carry out bad microdevice (1) by the detection information obtained from control system, after to the position of removal into
The corresponding supplement of row.
12. a kind of microdevice compensation process described in 0 or 11 according to claim 1, which is characterized in that the needs of control system
Supplement and/or the location information of removal are obtained by detection device (8) detection.
13. a kind of microdevice compensation process according to claim 10, which is characterized in that specific electric field induction supplement
Method is as follows, and boost charge device (117) makes its surface cloth rest potential, supplement light to supplement sensing device (112) surface cloth electricity
Source device (118) exposes the position of the corresponding supplement in supplement sensing device (112) surface according to the position of required supplement
Light forms electric hole on supplement sensing device (112) surface, and supplement sensing device (112) rotation to microdevice supplements casket (111)
Supplement idler wheel (121) position, supplement idler wheel (121) surface give be greater than supplement sensing device (112) crystal morphology so that
It supplements sensing device (112) surface electric hole position and supplement idler wheel (121) generates field effect, through driven Design, supplement induction
Device (112) surface electric hole position is corresponded to each other with microdevice (1) position that supplement idler wheel (121) surface requires supplementation with, and is mended
Fill transcription wheel (113) supplemented under electric field action idler wheel (121) surface micro device (1) be supplemented to supplement sensing device (112)
Surface completes supplement idler wheel (121) surface micro device (1) and is transferred to supplement sensing device (112) surface, be not added
Light supply apparatus (118) irradiation position, supplement sensing device (112) surface potential are less than or equal to supplement idler wheel (121) surface potential,
Microdevice (1) in supplement idler wheel (121) will not be passed to supplement sensing device (112) and be retained in supplement idler wheel (121)
On；Sensing device (112) rotation is supplemented to supplement transcription wheel (113), supplement transcription wheel (113) surface gives rest potential, makes it
Electric field is generated to supplement sensing device (112) surface, supplement sensing device (112) surface micro device (1) is transferred to transfer
On the corresponding position of substrate (5).
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112309948A (en) * | 2019-08-01 | 2021-02-02 | 陕西坤同半导体科技有限公司 | Chip transfer device and chip transfer method |
| WO2021134579A1 (en) * | 2019-12-31 | 2021-07-08 | 重庆康佳光电技术研究院有限公司 | Detection processing method and system, and storage medium |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10280170A (en) * | 1997-04-11 | 1998-10-20 | Omron Corp | Formation of etching mask and apparatus therefor |
| JP2007281402A (en) * | 2006-03-14 | 2007-10-25 | Waida Seisakusho:Kk | Device, method and system for mounting solder ball |
| JP2011091261A (en) * | 2009-10-23 | 2011-05-06 | Ulvac Japan Ltd | Substrate processing apparatus and method, and the substrate processed by the method |
| US20130017477A1 (en) * | 2011-07-13 | 2013-01-17 | Xerox Corporation | Electrostatic imaging member and methods for using the same |
| CN107833526A (en) * | 2016-09-15 | 2018-03-23 | 伊乐视有限公司 | Pick up the restorative procedure of removal system and active display |
| CN109524339A (en) * | 2018-11-20 | 2019-03-26 | 韩进龙 | A kind of microdevice transfer device, transfer system and transfer method |
| CN209607720U (en) * | 2019-03-27 | 2019-11-08 | 韩进龙 | A kind of microdevice supplementary device and replenishment system |
-
2019
- 2019-03-27 CN CN201910237947.7A patent/CN109904107A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10280170A (en) * | 1997-04-11 | 1998-10-20 | Omron Corp | Formation of etching mask and apparatus therefor |
| JP2007281402A (en) * | 2006-03-14 | 2007-10-25 | Waida Seisakusho:Kk | Device, method and system for mounting solder ball |
| JP2011091261A (en) * | 2009-10-23 | 2011-05-06 | Ulvac Japan Ltd | Substrate processing apparatus and method, and the substrate processed by the method |
| US20130017477A1 (en) * | 2011-07-13 | 2013-01-17 | Xerox Corporation | Electrostatic imaging member and methods for using the same |
| CN107833526A (en) * | 2016-09-15 | 2018-03-23 | 伊乐视有限公司 | Pick up the restorative procedure of removal system and active display |
| CN109524339A (en) * | 2018-11-20 | 2019-03-26 | 韩进龙 | A kind of microdevice transfer device, transfer system and transfer method |
| CN209607720U (en) * | 2019-03-27 | 2019-11-08 | 韩进龙 | A kind of microdevice supplementary device and replenishment system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112309948A (en) * | 2019-08-01 | 2021-02-02 | 陕西坤同半导体科技有限公司 | Chip transfer device and chip transfer method |
| WO2021134579A1 (en) * | 2019-12-31 | 2021-07-08 | 重庆康佳光电技术研究院有限公司 | Detection processing method and system, and storage medium |
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