CN109901462B - Power management and information acquisition circuit - Google Patents
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- CN109901462B CN109901462B CN201910118141.6A CN201910118141A CN109901462B CN 109901462 B CN109901462 B CN 109901462B CN 201910118141 A CN201910118141 A CN 201910118141A CN 109901462 B CN109901462 B CN 109901462B
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Abstract
The invention relates to a power supply management and information acquisition circuit, which comprises a power supply management module, an LMV358 signal acquisition circuit, a relay, an MAX490 communication chip, an MAX232 communication chip and an STM32 main control chip circuit, wherein the power supply management module converts an external power supply and outputs 12V, 10V and 5V power supplies and outputs 3.3V voltage to supply power for the LMV358 signal acquisition circuit, the MAX490 communication chip, the MAX232 communication chip and the STM32 main control chip, the LMV358 signal acquisition circuit provides an analog signal source by external analog voltage signals and analog current signals, the LMV358 signal acquisition circuit provides digital signals for the STM32 main control chip, the MAX490 communication chip and the MAX232 communication chip are communicated with the outside through an RS422 interface and an RS232 interface, the MAX490 communication chip and the MAX232 communication chip are connected with the STM32 main control chip through TTL level, the STM32 main control chip outputs PWM signals and I/O high-low level signals, the invention has reasonable design, can effectively save the space of the airplane and improve the overall performance of the airplane.
Description
Technical Field
The invention belongs to the technical field of power management, information acquisition communication and control of an aircraft avionics system, and particularly relates to a power management and information acquisition circuit.
Background
The integration level of an avionic system of a modern unmanned aerial vehicle is higher and higher, and main equipment comprises flight control, load, a data chain and an electrical box, wherein the electrical box mainly manages a power supply system of the aircraft and supplies power to different electric equipment on the aircraft; the invention provides a power management and information acquisition circuit based on the characteristics that the information of various sensors on an airplane is acquired, the information is converted and communicated with flight control, the flight control command is received, the work of part of airborne equipment is controlled, and the functions are integrated into a circuit board, so that the efficiency is greatly improved, the weight is reduced, a large space is saved for the airplane, the design of equipment arrangement and the like of the airplane is facilitated, and the overall performance of the airplane is improved.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a power supply management and information acquisition circuit which is reasonable in design, can effectively save the space of an airplane and improve the overall performance of the airplane.
In order to achieve the purpose, the invention is realized by the following technical scheme: a power management and information acquisition circuit comprises a power management module, an LMV358 signal acquisition circuit, a relay, an MAX490 communication chip, an MAX232 communication chip and an STM32 main control chip circuit, wherein the power management module converts an external power supply and outputs 12V, 10V and 5V power supplies, outputs 3.3V voltage to supply power to the LMV358 signal acquisition circuit, the MAX490 communication chip, the MAX232 communication chip and an STM32 main control chip, the LMV358 signal acquisition circuit provides an analog signal source by an external analog voltage signal and an analog current signal, the LMV358 signal acquisition circuit provides a digital signal for the STM32 main control chip, the MAX490 communication chip and the MAX232 communication chip are communicated with the outside through an RS422 interface and an RS232 interface, the MAX490 communication chip and the MAX232 communication chip are connected with the STM32 main control chip through TTL levels, the STM32 main control chip outputs PWM signals and I/O high and low level signals, and the STM32 chip provides control signals for the main control relay, the number of the relays is 2, two relays respectively output a 12V power supply and a 5V power supply, and the power supply management module comprises THN30-2412, THN30-2411, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a MAX232 communication chip and a 490 communication chip.
As a preferable mode of the invention, one end of the capacitor C1 is connected with the VI + pin of the THN30-2412 module, the other end of the capacitor C1 is connected with the VO + pin of the THN30-2412 module, one end of the capacitor C2 is connected with the VI-pin of the THN30-2412 module, the other end of the capacitor C2 is connected with the VO-pin of the THN30-2412 module, one end of the capacitor C3 is connected with the VI + pin of the THN30-2412 module, the other end of the capacitor C3 is connected with the VI-pin of the THN30-2412 module, one end of the capacitor C4 is connected with the VI + pin of the THN30-2411 module, the other end of the capacitor C4 is connected with the VO + pin of the THN30-2411 module, one end of the capacitor C5 is connected with the VI-pin of the THN30-2411 module, the other end of the capacitor C5 is connected with the VO-30-2411 module, one end of the capacitor C6 is connected with a VI + pin of the THN30-2411 module, the other end of the capacitor C6 is connected with a VI-pin of the THN30-2411 module, one end of the resistor R1 is connected with a T pin of the HN30-2412 module, the other end of the resistor R1 is connected with a VO-pin of the THN30-2412 module, one end of the resistor R2 is connected with a T pin of the HN30-2411 module, the other end of the resistor R2 is connected with a VO-pin of the THN30-2411 module, one end of the capacitor C7 is connected with a C1+ pin of the MAX232 communication chip, the other end of the capacitor C7 is connected with a C1-pin of the MAX232 communication chip, one end of the capacitor C8 is connected with a C2+ pin of the MAX232 communication chip, the other end of the capacitor C8 is connected with a C2-pin of the MAX232 communication chip, one end of the capacitor C9 is connected with a MAX232 communication chip, the other end of electric capacity C9 is connected with the GND pin of MAX232 communication chip, the one end of electric capacity C10 is connected with the V + pin of MAX232 communication chip, the other end of electric capacity C10 is connected with the VCC pin of MAX232 communication chip, the one end of electric capacity C11 is connected with the VCC pin of MAX232 communication chip, the other end of electric capacity C11 is connected with the GND pin of MAX232 communication chip, the one end of electric capacity C12 is connected with the VCC pin of MAX490 communication chip, the other end of electric capacity C12 is connected with the GND pin of MAX490 communication chip, the one end of resistance R3 is connected with the A pin of MAX490 communication chip, the other end of resistance R3 is connected with the B pin of MAX490 communication chip, the one end of resistance R4 is connected with the Y pin of MAX490 communication chip, the other end of resistance R4 is connected with the Z pin of MAX490 communication chip.
In a preferred embodiment of the present invention, the capacitor C3 and the capacitor C6 function to stabilize the input power voltage, and the capacitor C9, the capacitor C10, the capacitor C11, and the capacitor C12 function to stabilize the input power voltage of the MAX232 communication chip and the MAX490 communication chip.
In a preferred embodiment of the present invention, the resistor R1 adjusts a voltage value of 12V output, the resistor R2 adjusts a voltage value of 5V output, the resistor R3 is configured to be resistant to interference at a receiving end of RS422 communication, and the resistor R4 is configured to be resistant to interference at a transmitting end of RS422 communication.
As a preferable mode of the invention, the model of the STM32 main control chip is STM32F103C8T6, and the STM32 main control chip is based on a cotext-M3 kernel.
In a preferred embodiment of the present invention, the LMV358 signal acquisition circuit employs an LMV358 chip.
The invention has the beneficial effects that:
1. this power management and information acquisition circuit can manage the electrical power generating system to the aircraft and supply power for different consumer on the aircraft, gather the information of various sensors on the aircraft, after the conversion with fly to control the communication, accept to fly the command of accuse and control part airborne equipment work these functions integrated to a circuit board, can make efficiency improve greatly, weight reduction saves very big space for the aircraft, is favorable to the design such as the equipment arrangement of aircraft, improves aircraft wholeness ability.
2. The power management and information acquisition circuit can integrate scattered control modules, power modules and acquisition modules of the airplane together, and is in modular design, so that the inner space of the airplane is saved, the wiring design is convenient, and the electromagnetic compatibility of the whole airplane is improved.
3. This power management and information acquisition circuit reasonable in design can the effectual wholeness ability that improves the aircraft after the use, and is with low costs, and the sexual valence relative altitude is fit for promoting.
Drawings
FIG. 1 is a schematic diagram of a power management and information acquisition circuit;
FIG. 2 is a schematic diagram of the 12V and 5V output circuits of a power management and information acquisition circuit;
fig. 3 is a schematic diagram of a communication principle of a power management and information acquisition circuit.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1-3, the present invention provides a technical solution: a power management and information acquisition circuit comprises a power management module, an LMV358 signal acquisition circuit, a relay, an MAX490 communication chip, an MAX232 communication chip and an STM32 main control chip circuit, wherein the power management module converts an external power supply and outputs 12V, 10V and 5V power supplies, outputs 3.3V voltage to supply power to the LMV358 signal acquisition circuit, the MAX490 communication chip, the MAX232 communication chip and an STM32 main control chip, the LMV358 signal acquisition circuit provides an analog signal source by an external analog voltage signal and an analog current signal, the LMV358 signal acquisition circuit provides a digital signal for the STM32 main control chip, the MAX490 communication chip and the MAX232 communication chip are communicated with the outside through an RS422 interface and an RS232 interface, the MAX490 communication chip and the MAX232 communication chip are connected with the STM32 main control chip through TTL levels, the STM32 main control chip outputs PWM signals and I/O high and low level signals, and the STM32 chip provides control signals for the main control relay, the number of the relays is 2, two relays respectively output a 12V power supply and a 5V power supply, and the power supply management module comprises THN30-2412, THN30-2411, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a MAX232 communication chip and a 490 communication chip.
As a preferable mode of the invention, one end of the capacitor C1 is connected with the VI + pin of the THN30-2412 module, the other end of the capacitor C1 is connected with the VO + pin of the THN30-2412 module, one end of the capacitor C2 is connected with the VI-pin of the THN30-2412 module, the other end of the capacitor C2 is connected with the VO-pin of the THN30-2412 module, one end of the capacitor C3 is connected with the VI + pin of the THN30-2412 module, the other end of the capacitor C3 is connected with the VI-pin of the THN30-2412 module, one end of the capacitor C4 is connected with the VI + pin of the THN30-2411 module, the other end of the capacitor C4 is connected with the VO + pin of the THN30-2411 module, one end of the capacitor C5 is connected with the VI-pin of the THN30-2411 module, the other end of the capacitor C5 is connected with the VO-30-2411 module, one end of the capacitor C6 is connected with a VI + pin of the THN30-2411 module, the other end of the capacitor C6 is connected with a VI-pin of the THN30-2411 module, one end of the resistor R1 is connected with a T pin of the HN30-2412 module, the other end of the resistor R1 is connected with a VO-pin of the THN30-2412 module, one end of the resistor R2 is connected with a T pin of the HN30-2411 module, the other end of the resistor R2 is connected with a VO-pin of the THN30-2411 module, one end of the capacitor C7 is connected with a C1+ pin of the MAX232 communication chip, the other end of the capacitor C7 is connected with a C1-pin of the MAX232 communication chip, one end of the capacitor C8 is connected with a C2+ pin of the MAX232 communication chip, the other end of the capacitor C8 is connected with a C2-pin of the MAX232 communication chip, one end of the capacitor C9 is connected with a MAX232 communication chip, the other end of electric capacity C9 is connected with the GND pin of MAX232 communication chip, the one end of electric capacity C10 is connected with the V + pin of MAX232 communication chip, the other end of electric capacity C10 is connected with the VCC pin of MAX232 communication chip, the one end of electric capacity C11 is connected with the VCC pin of MAX232 communication chip, the other end of electric capacity C11 is connected with the GND pin of MAX232 communication chip, the one end of electric capacity C12 is connected with the VCC pin of MAX490 communication chip, the other end of electric capacity C12 is connected with the GND pin of MAX490 communication chip, the one end of resistance R3 is connected with the A pin of MAX490 communication chip, the other end of resistance R3 is connected with the B pin of MAX490 communication chip, the one end of resistance R4 is connected with the Y pin of MAX490 communication chip, the other end of resistance R4 is connected with the Z pin of MAX490 communication chip.
In a preferred embodiment of the present invention, the capacitor C3 and the capacitor C6 function to stabilize the input power voltage, and the capacitor C9, the capacitor C10, the capacitor C11, and the capacitor C12 function to stabilize the input power voltage of the MAX232 communication chip and the MAX490 communication chip.
As a preferable mode of the present invention, the resistor R1 adjusts a voltage value output by 12V, the resistor R2 adjusts a voltage value output by 5V, the resistor R3 plays an anti-interference role for a receiving end of RS422 communication, the resistor R4 plays an anti-interference role for a transmitting end of RS422 communication, and the STM32 main control chip is based on a context-M3 core.
The working principle is as follows: the main components of the circuit comprise an STM32 chip, a MAX232 communication chip, a MAX490 communication chip, an LMV358 chip, THN30-2412, THN30-2411 and other electronic components, wherein the STM32 chip, the LMV358 chip and the THN30-2412 module are core components of the circuit, an external power supply supplies power to a power management module, the THN30-2412 circuit outputs 12V, the THN30-2411 circuit outputs 5V, the 12V and 5V power supplies can be directly supplied to the outside and can also be supplied to the outside through a relay, a 3.3V power supply supplies power to circuits such as an STM32 chip, a MAX232 communication chip, a MAX490 communication chip, an LMV358 chip acquires analog voltage signals, the analog current signals are converted into digital signals and are transmitted to the STM32 chip, the STM32 chip processes the signals and then transmits the TTL 232 and MAX490 communication chips through TTL level signals, the standard RS232 level signals or RS422 level signals to communicate with the outside, the interface with external information interaction is RS232 and RS422, receives external information and converts the external information into TTL level of internal communication, transmits the TTL level to the STM32 chip, and the STM32 chip outputs I/O high-low level signals, PWM signals, control signals and the like after processing, thereby controlling the on-off of the relay and controlling the output of a corresponding power supply.
While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.
Claims (5)
1. A power management and information acquisition circuit comprises a power management module, an LMV358 signal acquisition circuit, a relay, an MAX490 communication chip, an MAX232 communication chip and an STM32 main control chip circuit, and is characterized in that the power management module converts an external power supply and outputs 12V, 10V and 5V power supplies and outputs 3.3V voltage to supply power for the LMV358 signal acquisition circuit, the MAX490 communication chip, the MAX232 communication chip and the STM32 main control chip, the LMV358 signal acquisition circuit provides an analog signal source by an external analog voltage signal and an analog current signal, the LMV358 signal acquisition circuit provides a digital signal for the STM32 main control chip, the 490 communication chip and the MAX232 communication chip are communicated with the outside through an RS422 interface and an RS232 interface, the MAX490 communication chip and the MAX232 communication chip are connected with the STM32 main control chip through TTL level, the STM32 main control chip outputs PWM signals and I/O high and low level signals, the STM32 main control chip provides control signals for the relays, the number of the relays is 2, two relays respectively output 12V power supplies and 5V power supplies, the power management module comprises a THN30-2412 module, a THN30-2411 module, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8, a capacitor C9, a capacitor C10, a resistor R10 and a resistor R10, one end of the capacitor C10 is connected with the VI + 2414 of the THN 10-2412 module, the other end of the capacitor C10 is connected with the VO + 2414 pin of the THN 10-2412 module, one end of the capacitor C10 is connected with the VI-2412 pin of the THN 10-2412 module, and the other end of the THN 10-6852 module is connected with the VO + 10 pin of the THN 10-2412 module, the other end of the capacitor C3 is connected with a VI-pin of the THN30-2412 module, one end of the capacitor C4 is connected with a VI + pin of the THN30-2411 module, the other end of the capacitor C4 is connected with a VO + pin of the THN30-2411 module, one end of the capacitor C5 is connected with a VI-pin of the THN30-2411 module, the other end of the capacitor C5 is connected with a VO-pin of the THN30-2411 module, one end of the capacitor C6 is connected with a VI + pin of the THN30-2411 module, the other end of the capacitor C6 is connected with a VI-pin of the THN30-2411 module, one end of the resistor R1 is connected with a T pin of the HN30-2412 module, the other end of the resistor R1 is connected with a VO-pin of the THN30-2412 module, one end of the resistor R2 is connected with a T pin of the THN30-2411 module, and the other end of the THN 2 is connected with a VO-30 module, one end of the capacitor C7 is connected with a C1+ pin of the MAX232 communication chip, the other end of the capacitor C7 is connected with a C1-pin of the MAX232 communication chip, one end of the capacitor C8 is connected with a C2+ pin of the MAX232 communication chip, the other end of the capacitor C8 is connected with a C2-pin of the MAX232 communication chip, one end of the capacitor C9 is connected with a V-pin of the MAX232 communication chip, the other end of the capacitor C9 is connected with a GND pin of the MAX232 communication chip, one end of the capacitor C10 is connected with the V + pin of the MAX232 communication chip, the other end of the capacitor C10 is connected with the VCC pin of the MAX232 communication chip, one end of the capacitor C11 is connected with the VCC pin of the MAX232 communication chip, the other end of the capacitor C11 is connected with a GND pin of the MAX232 communication chip, one end of the capacitor C12 is connected with the VCC pin of the MAX490 communication chip, the other end of the capacitor C12 is connected with the GND pin of the MAX490 communication chip, one end of the resistor R3 is connected with a pin A of the MAX490 communication chip, the other end of the resistor R3 is connected with a pin B of the MAX490 communication chip, one end of the resistor R4 is connected with a pin Y of the MAX490 communication chip, and the other end of the resistor R4 is connected with a pin Z of the MAX490 communication chip.
2. The power management and information acquisition circuit of claim 1 wherein the capacitor C3 and the capacitor C6 function to stabilize the input power voltage, and the capacitor C9, the capacitor C10, the capacitor C11 and the capacitor C12 function to stabilize the input power voltage of the MAX232 communication chip and the MAX490 communication chip.
3. The power management and information collection circuit of claim 1, wherein said resistor R1 regulates a voltage value of 12V output, said resistor R2 regulates a voltage value of 5V output, said resistor R3 is anti-jamming for receiving end of RS422 communication, and said resistor R4 is anti-jamming for transmitting end of RS422 communication.
4. The power management and information acquisition circuit of claim 1, wherein the model of the STM32 master control chip is STM32F103C8T6, and the STM32 master control chip is based on a cotext-M3 core.
5. The power management and information acquisition circuit of claim 1 wherein the LMV358 signal acquisition circuit employs an LMV358 chip.
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KR20100006608A (en) * | 2008-07-10 | 2010-01-21 | 세빈기술주식회사 | Wireless data acquisition control device |
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