CN109901178A - A kind of miniaturization TOF circuit module and TOF mould group - Google Patents
A kind of miniaturization TOF circuit module and TOF mould group Download PDFInfo
- Publication number
- CN109901178A CN109901178A CN201711290857.1A CN201711290857A CN109901178A CN 109901178 A CN109901178 A CN 109901178A CN 201711290857 A CN201711290857 A CN 201711290857A CN 109901178 A CN109901178 A CN 109901178A
- Authority
- CN
- China
- Prior art keywords
- tof
- circuit
- circuit module
- miniaturization
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 20
- 230000003287 optical effect Effects 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 230000003139 buffering effect Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims 1
- 238000012856 packing Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000003381 stabilizer Substances 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000005457 optimization Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 210000001508 eye Anatomy 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000005304 optical glass Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000005252 bulbus oculi Anatomy 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 230000004992 fission Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Studio Devices (AREA)
Abstract
A kind of miniaturization TOF circuit module and TOF mould group, belong to TOF technical field.It includes: light source unit that the present invention, which minimizes TOF circuit module, for providing active light source to object；Photosensitive unit, for receiving the reflection signal of object, to obtain range information of the object apart from the circuit module；Wherein, TOF light source in the light source unit is naked to be packaged on the circuit module.TOF mould group of the present invention includes lens assembly and above-mentioned TOF circuit module；Light is projected to the TOF circuit module by the lens assembly, to obtain the above-mentioned camera module of range information by the TOF circuit module.The present invention uses new packing forms, and under the premise of ensuring electric property reliability, realizes the compact in size of module and mould group.
Description
Technical field
The invention belongs to TOF technical field more particularly to a kind of miniaturization TOF circuit module and TOF mould groups.
Background technique
With optical measurement and the development of computer vision, optical three-dimensional measurement technology is graduallyd mature, has been gradually appeared
In the consumer electronics industry such as mobile phone, security protection and monitoring, robot in medical treatment and the fields such as biology, also become current measurement neck
Hot spot in domain, and these application processes all be unable to do without 3D camera module.
TOF(Time-Of-Flight, flight time) technology is more outstanding one in numerous three dimensional optical measuring technologies
Kind.The basic principle of TOF technology is that the light of active light source transmitting is captured after testee reflects by TOF device, then
TOF device calculates the distance of testee according to light by issuing to the time difference of capture or phase difference, to generate depth letter
Breath.Furthermore it is shot in conjunction with traditional camera, so that it may which the three-D profile of object is represented to the figure of different distance in different colors
Shape mode shows.
TOF depth camera is the application apparatus based on TOF technology to grow up in recent years, can not only be to traditional 2D
Camera obtains light intensity information like that, moreover it is possible in real time obtain sensor devices on each pixel to target object it is corresponding away from
From.But with the rapid development of smart machine, TOF depth camera can not keep up with the hair of smart machine in terms of 3D
Step is opened up, the demand of smart machine is unable to satisfy.
The integrated level of existing TOF depth camera is low, has a single function, and is an existing obvious problem.With depth camera
For application in recognition detection, in detection identification process, TOF depth, which is added, to be needed and scanner, information processing equipment
Etc. matching, measurement process is separated from each other with imaging, and process flow is complicated, and corresponding hardware device is more, is completely inappropriate for answering
For existing smart machine, the lightening development of smart machine in the prior art is not able to satisfy especially, such as mobile phone, tablet computer
Deng not being able to satisfy the 3D camera module for needing to configure small volume for safety monitoring, robot, medical biological field.
Utility model patent CN206532072U discloses a kind of optical projection apparatus and its depth camera, specific open
Optical projection apparatus includes light source, and light source includes the light source battle array of semiconductor substrate and setting on the semiconductor substrate
Column, for emitting light beam；Circuit board is installed on the semiconductor substrate and is provided with through-hole, and the through-hole makes the light beam
Pass through；Light beam generator is mounted on the circuit board and for projecting pattern beam outward after receiving the light beam.The reality
It uses new patent by reducing the thickness of device using the semiconductor substrate in light source as support base, and then meets intelligence and set
Standby demand small in size.It but is only the thickness of reduction pedestal to reach the purpose of optical projection apparatus thickness diminution, to inside
The stability and reliability of signal processing do not have improvement.
Application for a patent for invention CN106817794A discloses a kind of TOF circuit module and its application.This application will be by that will lead
The driving and controlling circuits and TOF circuit of dynamic light source blend to solve the problems, such as additionally to use driving circuit.This application passes through
Improve circuit structure mode, mainly equipment compatibility is optimized, not to TOF circuit module be based on volume minimize and
Carry out the optimization of circuit reliability.
Summary of the invention
The object of the present invention is to provide a kind of electric property high reliablity, TOF circuit module and TOF mould compact in size
Group.
According to above-mentioned purpose, the present invention provides a kind of miniaturization TOF circuit module, comprising:
Light source unit, for providing active light source to object；
Photosensitive unit, for receiving the reflection signal of object, to obtain range information of the object apart from the circuit module；
Wherein, TOF light source in the light source unit is naked to be packaged on the circuit module.
Preferably as the present invention, the TOF light source is packaged on the circuit module in a manner of wafer.
Preferably as the present invention, the TOF light source is externally provided with needed for the active light source for providing different launch angles
Optical element.
Preferably as the present invention, the optical element is optical glass.
Preferably as the present invention, the TOF light source is VCSEL.
Preferably as the present invention, the light source unit includes light source driving circuit, and the light source driving circuit is for driving
The TOF light source working.
Preferably as the present invention, the light source driving circuit includes buffer, switching device or opening with switching device
Powered-down road；The photosensitive unit connects the buffer, and the buffer connects the switching device or the switching circuit.
Preferably as the present invention, the switching device is mosfet transistor.
As of the invention preferred, the buffer, the switching device or the switching circuit with switching device, neighbouring institute
State the setting of TOF light source.
Preferably as the present invention, the light source unit includes temperature sensing circuit, and the temperature sensing circuit is for detecting
TOF light-source temperature.
Preferably as the present invention, the temperature sensing circuit is connected to the photosensitive unit.
Preferably as the present invention, the temperature sensing circuit includes thermistor.
Preferably as the present invention, the thermistor is arranged adjacent to the TOF light source.
Preferably as the present invention, the light source unit includes protection circuit, and it is pre- that the protection circuit provides the TOF light source
Fixed limitation power.
Preferably as the present invention, the protection circuit includes sample circuit, comparison circuit, current detection switch circuit；Institute
It states sample circuit and connects the current detection switch circuit through the comparison circuit.
Preferably as the present invention, the sample circuit includes current sense amplifier.
Preferably as the present invention, the comparison circuit includes comparator.
Preferably as the present invention, the current detection switch circuit includes current limiting load switch.
Preferably as the present invention, the light source unit further includes power supply circuit, and the power supply circuit is the photosensitive unit
In sensitive chip power supply.
Preferably as the present invention, the power supply circuit includes voltage-stablizer, and the voltage-stablizer connects external power supply.
Preferably as the present invention, the photosensitive unit includes sensitive chip.
Preferably as the present invention, the sensitive chip is CMOS sensitive chip.
Preferably as the present invention, the photosensitive unit further includes the thermistor connecting with the sensitive chip.
Preferably as the present invention, the photosensitive unit further includes filter circuit, and the filter circuit is connected to described photosensitive
The power end of chip.
Preferably the circuit module further includes voltage regulation unit as of the invention, described in connect and thinking with external power supply
Light source unit, the photosensitive unit provide reliable source of power respectively.
Preferably as the present invention, the voltage regulation unit includes LDO voltage stabilizer.
Preferably as the present invention, the circuit module further includes storage unit, for saving the calibration number of the TOF light source
According to.
Preferably as the present invention, the storage unit includes memory.
Preferably as the present invention, the memory is EEPROM storage chip.
Preferably as the present invention, the storage unit is connected to the photosensitive unit.
Preferably as the present invention, the circuit module further includes interface unit, and the interface unit is used for output information.
Preferably as the present invention, the light source unit and the photosensitive unit are set on an at least circuit board.
Preferably as the present invention, the light source unit and the photosensitive unit are set on the circuit board for stacking arrangement, and
At least stacking arrangement is constituted by two pieces of circuit boards.
Preferably as the present invention, the circuit board that the circuit board of arrangement folds arrangement for the folded arrangement of 2 layer heaps or 3 layer heaps is stacked.
Preferably as the present invention, the driving circuit and/or temperature sensing circuit in the light source unit, which are set to, stacks arrangement
Circuit board close to the position of TOF light source.
Preferably as the present invention, it stacks and passes through disjunctor stack manner in the circuit board of arrangement between adjacent layer circuit board or divide
Body stack manner stacks.The present invention also provides a kind of miniaturization TOF mould groups, including lens assembly, and TOF electricity as described above
Road module；Light is projected to the TOF circuit module by the lens assembly, to obtain distance by the TOF circuit module
Information.
The invention has the following advantages:
A kind of miniaturization TOF circuit module of the present invention and TOF mould group, package dimension are small, it is ensured that before electric property reliability
It puts, save electric components quantity and simplifies wiring, further minimize module or mould packet size.
Detailed description of the invention
Fig. 1 is the structure chart of present invention miniaturization TOF circuit module inner light source unit；
Fig. 2 is the circuit diagram of present invention miniaturization TOF circuit module inner light source driving circuit；
Fig. 3 is the circuit diagram that present invention miniaturization TOF circuit module really feels photon unit and its peripheral circuit；
Fig. 4 is the circuit diagram of voltage regulation unit in present invention miniaturization TOF circuit module；
Fig. 5 is the circuit diagram that eyeball protects circuit in present invention miniaturization TOF circuit module；
Fig. 6 is the circuit diagram of storage circuit in present invention miniaturization TOF circuit module；
Fig. 7 is the structural schematic diagram of present invention miniaturization TOF mould group；
Fig. 8 is the schematic diagram of internal structure that TOF mould group removes after encapsulating shell in Fig. 7.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description
Basic principle of the invention can be applied to other embodiments, variant schemes, improvement project, equivalent program and do not carry on the back
Other technologies scheme from the spirit and scope of the present invention.
TOF is one of the main technical schemes that current 3D depth camera uses, and has and postpones advantage small, at low cost.TOF
Technology has application scenarios abundant, in automobile, industry, recognition of face, health, game, amusement, film special efficacy, 3D printer
There is application with numerous areas such as robots.In some specific fields, such as mobile phone consumer electronics industry, pass through TOF
Mould group obtains rapidly depth information, carries out action detection, Expression Recognition, entertainment interactive in conjunction with corresponding APP；For another example security protection is supervised
The machine vision of control, the test object supervision application of sensitive area；For another example robot is in automatic Pilot field avoidance；It is for another example medical
With the facial 3D identification etc. in terms of biology, the image resolution ratio of 3D detection, precision, detection range all have higher requirements, and
It is relatively high to the small form factor requirements of application size.
Currently, VCSEL(Vertical Cavity Surface Emitting Laser, Vertical Cavity Surface emits laser
Device) because having lesser far-field divergence angle, narrow transmitting beam and circle, coupling efficiency height is, it can be achieved that high packaging density and Low threshold
Electric current；Active area dimensions are small, stablize, and the service life is long etc. a little, as the Primary Component in optoelectronic applications, with photosensitive element knot
It closes and realizes TOF technology.
Existing TOF circuit module includes two parts, and a part is for providing active light source to the light source list of object
Member, another part is the reflection signal for receiving object, to obtain the sense of range information of the object apart from circuit module
Light unit.The TOF circuit module and lens assembly encapsulation constitute TOF mould group.TOF light source in light source unit uses VCSEL,
COB encapsulation is carried out according to its specification.Size after general original package is 4.1mm*4.1mm, and the VCSEL of original package is in TOF
Certain space, the especially position mould group leader * wide space are occupied in mould group.In non-enclosed package, naked DIE form
The size of VCSEL is about 0.557mm*0.673mm, it is seen that the size of the VCSEL of Die encapsulation is at least than original package VCSEL
More than size is half.Referring to attached drawing 7 as it can be seen that naked encapsulation TOF light source 50, due to eliminating outer enclosure shell, so that mould group
Interior device arrangement is more compact, and the overall dimensions of TOF mould group greatly reduce.For this purpose, the invention proposes a kind of miniaturization TOF
Circuit module is packaged in the TOF light source in light source unit is naked on circuit module.Preferably, the TOF light source is with VCSEL crystalline substance
Circle mode encapsulates (referring to Fig.1), can save big quantity space.The TOF light source of naked encapsulation is unable to satisfy the requirement for not stopping launch angle,
For this purpose, the VCSEL of different launch angles is designed by different DOE outside TOF light source, that is, useful in TOF light source peripheral hardware
Optical element, such as optical glass needed for the active light source for providing different launch angles, can be suitble to different scenes to develop thus
Use demand, matches different types of optical element, and TOF mould group uses more flexible.
The light source unit, for providing active light source to object.Object will reflect signal project it is described photosensitive
Unit, the photosensitive unit receive reflection signal and are handled, and then combine optical signal and the analysis of reflection signal, calculate
Range information to object apart from circuit module, and then obtain the image information for having depth information.
The light source unit includes light source driving circuit, for driving light source to generate modulation light.Fig. 2 shows light source drivings
One embodiment of circuit, the light source driving circuit include buffer, switching device.The photosensitive unit connects the buffering
Device, the buffer connect the switching device.Such as Fig. 2, the buffer is a buffer logic chip U3, the switching device
Output end for mosfet transistor U4, the buffer logic chip U3 connects the grid of the mosfet transistor U4, described
The drain electrode of mosfet transistor U4 is connect with the cathode of light emitting diode D1, the source electrode ground connection of the mosfet transistor U4.Institute
The power end for stating buffer logic chip U3 is grounded through the 25th capacitor C25, the input terminal of the buffer logic chip U3 and institute
It states photosensitive unit connection and input terminal is grounded through second resistance R2.Peak power when in order to ensure VCSEL work, improves and visits
Environment bright when depth information is surveyed, is parallel with the 19th capacitor C19, the 20th capacitor on the supply lines of VCSEL connection power supply
C20.Wherein, the switching device can be replaced the switching circuit with switching device.For improve electric property reliability and
Accuracy, the buffer, the switching device or the switching circuit with switching device, the neighbouring TOF light source are arranged.
The light source unit further includes modulator, modulates the driving frequency of LED buffer in the LED drive circuit, makes
It obtains the fiber-optic signal frequency that LED is generated by driving to change, to change measurable operating distance of the TOF circuit module.
The light source unit further includes temperature sensing circuit, and the temperature sensing circuit is for detecting TOF light-source temperature.With
It is that TOF light source is detected using the temperature sensing circuit with warming chip for temperature sensing circuit.Warming chip has certain
Size, and need to read the temperature value that warming chip detects by I2C interface, then judge whether light source is in normal work
Otherwise state is not handled if then handling present image.The mode of this indirect thermometric, needs to use more component, no
Conducive to circuit configuration optimization, and signal-obtaining processing needs transfer, and efficiency is lower.For this purpose, temperature sensing circuit of the present invention includes
Thermistor.The temperature sensing circuit is connected to the photosensitive unit, and specifically, the thermistor is connected to photosensitive unit
Interior sensitive chip.Thermistor NTC detection TOF light-source temperature is directlyed adopt in this way, can directly obtain the temperature on the periphery VCSEL
Degree measures more acurrate, to not only save number of devices, arrange in space and mould group on circuit board space, also saves on I2C
Data.For the reliability and detection accuracy for improving electric property, the thermistor is arranged adjacent to the TOF light source.
The light source unit further includes protection circuit, and the protection circuit provides the scheduled limitation power of TOF light source.
Such as Fig. 5, the protection circuit includes sample circuit, comparison circuit, current detection switch circuit.The sample circuit is through the ratio
Compared with current detection switch circuit described in circuit connection.The sample circuit includes current sense amplifier.The comparison circuit packet
Include comparator.The current detection switch circuit includes current limiting load switch.As Fig. 5, the current sense amplifier U5 will be examined
Through comparator U6 multilevel iudge after the Current amplifier measured, judge whether the current value of VCSE light source is more than the receivable electricity of human eye
Secure threshold range is flowed, and current limiting load switch U7 output is controlled according to judging result, reaches protection eye to limit transmission power
The purpose of ball.The protection circuit further includes shunt circuit, the shunt circuit include the 8th resistance R8, the 8th resistance with
The current sense amplifier U5 is electrically connected side by side, to carry out separating flow sampling.The protection circuit further includes average low pass circuit,
The average low pass circuit includes being connected between the current sense amplifier U5 output end and the comparator U6 input terminal
The tenth resistance R10, and be connected between the current sense amplifier U5 ground terminal and the comparator U6 input terminal
17th capacitor C17.When current sense amplifier U5 output current information to the average low pass circuit, the average low pass electricity
Road handles the current information and obtains current average.The protection circuit further includes wrong latch cicuit, and the mistake latches
Circuit include two be connected in series between the shunt circuit and the current detection switch circuit the 9th resistance R9, the 11st
Resistance R11.The shunt circuit is exported to the wrong latch cicuit, and the mistake latch cicuit exports the TOF light source
Status information is to the current detection switch circuit.The current detection switch circuit is according to the wrong latch cicuit and described
The information of comparison circuit controls TOF light source working.The protection circuit includes peak current limit circuit, the peak point current limit
Circuit processed includes the twelfth resistor R12 for being connected to the current limiting load switch U7, and the peak current limit circuit can limit
Circuit peak working load power.The protection circuit is equipped with also between the current detection switch circuit and the shunt circuit and connects
Ground capacitor.Under foregoing circuit cooperation, scheduled different brackets output power, the protection circuit are hindered by adjusting in order to obtain
Capacitance changes limitation power.
The light source unit further includes power supply circuit, and the power supply circuit is that the sensitive chip in the photosensitive unit supplies
Electricity.The power supply circuit includes the first power supply sub-circuit and the second power supply sub-circuit.The first power supply sub-circuit includes first
Voltage-stablizer, first voltage-stablizer connect external power supply.Specifically, first voltage-stablizer be LDO voltage stabilizer U8, described first
The input terminal of voltage-stablizer U8 is grounded through the 21st capacitor C21, and output end is grounded through the 22nd capacitor C22.Described second
Sub-circuit of powering includes the second voltage-stablizer, and second voltage-stablizer is connect with external power supply.Specifically, second voltage-stablizer is
LDO voltage stabilizer U9.The input terminal of the second voltage-stablizer U9 is grounded through the 23rd capacitor C23, and output end is through the 24th
Capacitor C24 ground connection.LDO voltage stabilizer can adjust output voltage, will fluctuate supply voltage larger and that electric appliance requirement is not achieved and stablize
In the setting range of electric appliance, various circuits or electrical equipment is enable to work normally under rated operational voltage.
Such as Fig. 3, the photosensitive unit includes sensitive chip, such as CD sensor or cmos sensor.The sensitive chip is negative
Image Acquisition is blamed, including photoelectric conversion, frame of pixels are read and the operating process such as transfer, the amplification output of charge voltage conversion signal.
The photosensitive unit further includes filter circuit, and the filter circuit is connected to the power end of the sensitive chip.It is logical
Setting LDO voltage stabilizer is crossed, the reliability of power supply is optimized, then increases the reliability of mould group.In the electricity of this optimization design
The filter circuit quantity connecting with sensitive chip is further saved under road.In the case where external power supply reliability is poor, need
It uses a plurality of filter circuit or filter circuit needs more shunt capacitances to filter clutter.For example, 3V3 power supply is original in Fig. 3
Two filter circuits, and a filter circuit for needing to be made of 5 shunt capacitances are needed, another is by 3 shunt capacitance
The filter circuit of composition.And it is present, after increasing LDO voltage stabilizer, a filter circuit can be omitted.As it can be seen that power supply
Under optimization, not only improve power supply reliability, at the same can clipped filter capacitor, and then save number of devices, arrange on circuit board
Space in cloth space and mould group.The TOF circuit module further includes storage unit.The storage unit includes memory.Institute
It states storage unit and is connected to the photosensitive unit.The storage unit is used to save the nominal data of the TOF light source, such as photosensitive
The element time for exposure to carry out shutter control level conversion and the control of clamped level, and accurately controls the CCD time for exposure.Institute
Stating storage circuit includes FLASH chip and its peripheral circuit (referring to attached drawing 6).Previous storage circuit using eeprom chip and its
Peripheral circuit, and eeprom chip is I2C interface, eeprom chip size itself is quite big, and the time of data recording
With data reliability not as good as FLASH chip.For this purpose, eeprom chip to be changed to the Flash chip of SPI interface, chip is reduced
Size saves arrangement space, and improves the burning rate and data reliability of data.
The TOF circuit module further includes control unit (not shown).Described control unit controls the light source list
The first and described photosensitive unit work.Light source driving circuit in the light source unit is communicatively coupled to described control unit, passes through
Interworking between described control unit coordinated control light source driving circuit and equipment.
The TOF circuit module further includes interface unit.Interface unit is for TOF circuit module internal unit and various outer
Peripheral equipment is communicated in a serial fashion to exchange information.Peripheral equipment can be FLASHRAM, network controller, MCU etc..It is described to connect
Mouth unit includes SPI interface, so that TOF circuit module easily transmits data, is easily communicated with external control host foundation.Institute
Stating interface unit further includes power interface, for connecting external power supply.
In addition, the pcb board of integrated foregoing circuit had also been made on TOF circuit module or even the spatial arrangement of TOF mould group into
One step is improved.In the past, the circuit in TOF circuit module was integrated on one layer of PCB, such as one piece is set to TOF mould group bottom
Pcb board or two pieces of pcb boards set on TOF mould group bottom different location.It is arranged so down, because of circuit element needed for TOF mould group
It is more, need to arrange all circuit elements on one layer of plane where bottom, if you need to exist to TOF circuit module or TOF mould group
Minification, becomes particularly difficult in the range of long * wide.For this purpose, the invention proposes the structure that circuit board stacks arrangement, it is described
Light source unit and the photosensitive unit are set on the circuit board for stacking arrangement, and stacking arrangement is at least made of two pieces of circuit boards
Structure.The circuit board for stacking arrangement can be the circuit board of the folded arrangement of 2 layer heaps or the folded arrangement of 3 layer heaps.Such as Fig. 8, the light
Source unit and the photosensitive unit are integrated on the circuit board of the folded arrangement of 2 layer heaps.It is examined based on electric property reliability and accuracy
Consider, by the light source unit driving circuit and/or temperature sensing circuit be set to stack arrangement circuit board close to TOF light source
Position, i.e. place driving circuit and/or temperature sensing circuit on upper layer circuit board in Fig. 8.
When there is multiple-level stack, adjacent two layers stacked structure is divided into the upper and lower herein, and continue below with this
Description.The thickness of general TOF mould group can be accomplished within 6 millimeters, even more thin.For this purpose, needing to consider when carrying out stacking arrangement
Pcb board is stacked into the thickness that the height after being arranged and being encapsulated is no more than TOF mould group.It is found that the left side of TOF mould group is felt in figure
Light part has occupied larger space on TOF mould group thickness direction, then stack design is more difficult and difficult on the photosensitive part in left side
To arrange the PCB for being more than two layers；Stack design is preferably carried out on right side source part thus.
Such as Fig. 8, for two layers, including 10 and of layer circuit board is gone up in upper layer circuit board 10, lower circuit plate 20 and connection
The connecting plate 30 of lower circuit plate 20.It stacks and passes through disjunctor stack manner in the circuit board of arrangement between adjacent layer circuit board or divide
Body stack manner stacks.Disjunctor stack manner, the upper layer circuit board 10, lower circuit plate plate 20,30 three one of connecting plate
It is body formed, in this way in order to which TOF circuit module to be assemblied in TOF mould group, and it is convenient for TOF module packaging.Seperated stack manner,
The upper layer circuit board 10 is integrally formed with connecting plate 30, when needing to stack arrangement, the mode that can be matched, by it under
Layer circuit board plate 20 connects.The connecting plate 30 be fixed on the mode of the lower circuit plate of adjacent layer circuit board for welding, riveting,
Any one in being spirally connected, being bonded.Under one embodiment, the connecting plate 30 is made of Rigid Flex, including is connected to phase
The hardboard 301 of the lower circuit plate of adjacent circuit plate, one end connects the hardboard 301 and the other end is connected to the upper of adjacent circuit plate
The soft board 302 of layer circuit board.Under another embodiment, the connecting plate is made of soft board and stiffening plate, including is connected to adjacent
The stiffening plate of the lower circuit plate of circuit board, one end connect the upper layer circuit of the stiffening plate and other end connection adjacent circuit plate
The soft board of plate.Wherein, the stiffening plate can be steel plate, also can help to radiate while connecting adjacent circuit plate.It is described
The junction that soft board 302 is connected to the upper layer circuit board 10 of adjacent circuit plate is connected in arcuation.
Under layer stack, the TOF mould group has also been made adaptability encapsulation and improves.To lower circuit plate 20 and upper layer circuit
Space is encapsulated by lower encapsulating shell 11 in conjunction with connecting plate 30 between plate 10；Upper envelope is passed through to upper 10 or more space of layer circuit board
Dress shell 21 encapsulates.The encapsulating housing size for stacking the bottom circuit board in the circuit board of arrangement is greater than other layer circuit boards
The size that outer encapsulating housing size, such as size of the lower encapsulating shell 21 are greater than the upper encapsulating shell 22.Due to layer stack,
Encapsulating housing is not original integral packaging, so that there is the problems such as sealing, heat dissipation in the encapsulation between adjacent housings, for this purpose, this
Location hole is also arranged in invention on circuit boards, and positioning column is arranged on the package, and positioning column is positioned and fixed in location hole；
And fixation is packaged using glue；In addition, increasing the further auxiliary heat dissipations of heat sink materials such as heat-conducting silicone grease when packaged；Encapsulation
Shell and welding circuit board are fixed afterwards, increasing protective rubber at solder joint prevents solder joint from aoxidizing and enhance encapsulation bonding strength.This hair
After the seperated encapsulation of bright progress, the device on every layer circuit board can be entirely sealed in encapsulating shell plastic.Compared to integral packaging
For, fission encapsulation is more preferable for the protection of device and sealing performance, is influenced to further decrease by dust etc.；It further reduces
The size requirements of existing TOF mould group realize miniaturization；Also completely cut off between device, as device mutually passes between multilayer circuit board
A possibility that heat conduction amount.The present invention uses above-mentioned stack manner, can greatly save mould group space, improve the utilization rate in space.
Further, not only naked encapsulation TOF light source, and using under above-mentioned stack manner, the size of TOF circuit module and TOF mould group is big
It is big to reduce, and also meet the diversified demand of configuration.
TOF mould group of the present invention combines above-mentioned TOF circuit module to form modular TOF device with optical device.Institute
Stating TOF mould group includes lens assembly 40 and TOF circuit module.The lens assembly 40 is installed on above the TOF circuit module,
For the light for being incident in TOF mould group to be modulated, so that penetrate by the light that object reflects in TOF mould group, thus
The image and depth, the information of distance of target are obtained by light information.The TOF mould group is in the image for realizing the target that is taken
The depth information of target can be obtained while intake, to realize 3D camera function, and the circuit module of the TOF mould group
Highly integrated and compact-sized arrangement with optical device so that TOF mould group is achieved modularity be suitable for being installed on
The smart machine of different sizes and functional requirement.
The TOF mould group is as follows in the concrete principle for the 3D rendering for absorbing the target: the light source of the TOF circuit module
Light source driving circuit driving light source in unit generates the optical signal of predetermined modulation frequency, and it is made to be projected to object；Projection
Optical signal to object obtains reflection signal after object reflects；It reflects signal to be received by TOF mould group, passes through the mirror
Head assembly enters the TOF module internal；The photosensitive unit of the TOF circuit module receives light and photosensitive, and optical signal is turned
Become electronic signal and the incident light and reflected light signal that are projected to object are analyzed, handled, and then obtains object
3D rendering and range information.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating
And it is not intended to limit the present invention.The purpose of the present invention completely effectively realizes.Function and structural principle of the invention is in reality
It applies and shows and illustrate in example, under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (34)
1. a kind of miniaturization TOF circuit module characterized by comprising
Light source unit, for providing active light source to object；
Photosensitive unit, for receiving the reflection signal of object, to obtain range information of the object apart from the circuit module；
Wherein, TOF light source in the light source unit is naked to be packaged on the circuit module.
2. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the TOF light source is with wafer side
Formula is packaged on the circuit module.
3. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the TOF light source peripheral hardware is useful
The optical element needed for the active light source that different launch angles are provided.
4. a kind of miniaturization TOF circuit module according to claim 3, which is characterized in that the optical element is optics
Glass.
5. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the TOF light source is VCSEL.
6. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the light source unit includes light
Source driving circuit, the light source driving circuit is for driving the TOF light source working.
7. a kind of miniaturization TOF circuit module according to claim 6, which is characterized in that the light source driving circuit packet
Include buffer, switching device or the switching circuit with switching device；The photosensitive unit connects the buffer, the buffering
Device connects the switching device or the switching circuit.
8. a kind of miniaturization TOF circuit module according to claim 7, which is characterized in that the switching device is
Mosfet transistor.
9. a kind of miniaturization TOF circuit module according to claim 7, which is characterized in that the buffer, the switch
Device or switching circuit with switching device, the neighbouring TOF light source are arranged.
10. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the light source unit includes temperature
Detection circuit is spent, the temperature sensing circuit is for detecting TOF light-source temperature.
11. a kind of miniaturization TOF circuit module according to claim 10, which is characterized in that the temperature sensing circuit
It is connected to the photosensitive unit.
12. a kind of miniaturization TOF circuit module according to claim 10, which is characterized in that the temperature sensing circuit
Including thermistor.
13. a kind of miniaturization TOF circuit module according to claim 12, which is characterized in that the thermistor is neighbouring
The TOF light source setting.
14. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the light source unit includes protecting
Protection circuit, the protection circuit provide the scheduled limitation power of TOF light source.
15. a kind of miniaturization TOF circuit module according to claim 14, which is characterized in that the protection circuit includes
Sample circuit, comparison circuit, current detection switch circuit；The sample circuit connects the current detecting through the comparison circuit
Switching circuit.
16. a kind of miniaturization TOF circuit module according to claim 15, which is characterized in that the sample circuit includes
Current sense amplifier.
17. a kind of miniaturization TOF circuit module according to claim 15, which is characterized in that the comparison circuit includes
Comparator.
18. a kind of miniaturization TOF circuit module according to claim 15, which is characterized in that the current detection switch
Circuit includes current limiting load switch.
19. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the light source unit further includes
Power supply circuit, the power supply circuit are that the sensitive chip of the photosensitive unit is powered.
20. a kind of miniaturization TOF circuit module according to claim 19, which is characterized in that the power supply circuit includes
Voltage-stablizer, the voltage-stablizer are connect with external power supply.
21. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the photosensitive unit includes sense
Optical chip.
22. a kind of miniaturization TOF circuit module according to claim 21, which is characterized in that the sensitive chip is
CMOS sensitive chip.
23. a kind of miniaturization TOF circuit module according to claim 21, which is characterized in that the photosensitive unit also wraps
Filter circuit is included, the filter circuit is connected to the power end of the sensitive chip.
24. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the circuit module further includes
Storage unit, the storage unit are used to save the nominal data of the TOF light source.
25. a kind of miniaturization TOF circuit module according to claim 24, which is characterized in that the storage unit includes
Memory.
26. a kind of miniaturization TOF circuit module according to claim 25, which is characterized in that the memory is FLASH
Storage chip.
27. a kind of miniaturization TOF circuit module according to claim 25, which is characterized in that the storage unit connection
In the photosensitive unit.
28. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the circuit module further includes
Interface unit, the interface unit are used for output information.
29. a kind of miniaturization TOF circuit module according to claim 1, which is characterized in that the light source unit and described
Photosensitive unit is set on an at least circuit board.
30. a kind of miniaturization TOF circuit module according to claim 29, which is characterized in that the light source unit and institute
It states photosensitive unit to be set on the circuit board for stacking arrangement, and at least constitutes stacking arrangement by two pieces of circuit boards.
31. a kind of miniaturization TOF circuit module according to claim 30, which is characterized in that stack the circuit board of arrangement
For the circuit board of the folded arrangement of 2 layer heaps or the folded arrangement of 3 layer heaps.
32. a kind of miniaturization TOF circuit module according to claim 30, which is characterized in that in the light source unit
Driving circuit and/or temperature sensing circuit are set to the circuit board for stacking arrangement close to the position of TOF light source.
33. a kind of miniaturization TOF circuit module according to claim 30, which is characterized in that stack the circuit board of arrangement
In stacked by disjunctor stack manner or seperated stack manner between adjacent layer circuit board.
34. a kind of miniaturization TOF mould group, which is characterized in that including lens assembly, and as described in one of claim 1-33
TOF circuit module；Light is projected to the TOF circuit module by the lens assembly, to be obtained by the TOF circuit module
Range information.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711290857.1A CN109901178A (en) | 2017-12-08 | 2017-12-08 | A kind of miniaturization TOF circuit module and TOF mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711290857.1A CN109901178A (en) | 2017-12-08 | 2017-12-08 | A kind of miniaturization TOF circuit module and TOF mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109901178A true CN109901178A (en) | 2019-06-18 |
Family
ID=66939906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711290857.1A Pending CN109901178A (en) | 2017-12-08 | 2017-12-08 | A kind of miniaturization TOF circuit module and TOF mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109901178A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112857248A (en) * | 2019-11-12 | 2021-05-28 | 宁波舜宇光电信息有限公司 | Depth information camera module, projection module and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101141048A (en) * | 2007-06-19 | 2008-03-12 | 中兴通讯股份有限公司 | Laser bias current current limiting circuit |
| JP2013183425A (en) * | 2012-03-05 | 2013-09-12 | Toshiba Corp | Camera module |
| CN105705964A (en) * | 2013-10-09 | 2016-06-22 | 微软技术许可有限责任公司 | Illumination modules that emit structured light |
| CN105895645A (en) * | 2015-02-17 | 2016-08-24 | 全视科技有限公司 | Pixel array and image sensing system |
| CN106104296A (en) * | 2014-03-14 | 2016-11-09 | 赫普塔冈微光有限公司 | Including the optical imagery module of time-of-flight sensor and optical detecting module |
| CN106817794A (en) * | 2015-11-30 | 2017-06-09 | 宁波舜宇光电信息有限公司 | TOF circuit modules and its application |
| CN107132720A (en) * | 2017-07-07 | 2017-09-05 | 深圳奥比中光科技有限公司 | Light-emitting device and its optical projection module |
-
2017
- 2017-12-08 CN CN201711290857.1A patent/CN109901178A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101141048A (en) * | 2007-06-19 | 2008-03-12 | 中兴通讯股份有限公司 | Laser bias current current limiting circuit |
| JP2013183425A (en) * | 2012-03-05 | 2013-09-12 | Toshiba Corp | Camera module |
| CN105705964A (en) * | 2013-10-09 | 2016-06-22 | 微软技术许可有限责任公司 | Illumination modules that emit structured light |
| CN106104296A (en) * | 2014-03-14 | 2016-11-09 | 赫普塔冈微光有限公司 | Including the optical imagery module of time-of-flight sensor and optical detecting module |
| CN105895645A (en) * | 2015-02-17 | 2016-08-24 | 全视科技有限公司 | Pixel array and image sensing system |
| CN106817794A (en) * | 2015-11-30 | 2017-06-09 | 宁波舜宇光电信息有限公司 | TOF circuit modules and its application |
| CN107132720A (en) * | 2017-07-07 | 2017-09-05 | 深圳奥比中光科技有限公司 | Light-emitting device and its optical projection module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112857248A (en) * | 2019-11-12 | 2021-05-28 | 宁波舜宇光电信息有限公司 | Depth information camera module, projection module and preparation method thereof |
| CN112857248B (en) * | 2019-11-12 | 2023-07-25 | 宁波舜宇光电信息有限公司 | Depth information camera module, projection module and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207704030U (en) | A kind of miniaturization TOF circuit modules and TOF modules | |
| CN207704031U (en) | A kind of miniaturization TOF circuit modules and TOF modules | |
| CN207382424U (en) | TOF camera modules and electronic equipment | |
| US9430686B2 (en) | Package-on-package based integrated circuit chip imager | |
| CN206650757U (en) | A kind of device | |
| US9424454B2 (en) | Chip on board based highly integrated imager | |
| US9111159B2 (en) | Imaging based barcode scanner engine with multiple elements supported on a common printed circuit board | |
| US8492720B2 (en) | Small low-profile optical proximity sensor | |
| CN107884066A (en) | Optical sensor and its 3D imaging devices based on flood lighting function | |
| CN207706284U (en) | TOF circuit modules and TOF modules | |
| EP3674848A1 (en) | Optical sensing apparatus and terminal | |
| CN106817794A (en) | TOF circuit modules and its application | |
| CN208298205U (en) | Encapsulation module and electronic device | |
| CN109901178A (en) | A kind of miniaturization TOF circuit module and TOF mould group | |
| CN109508600A (en) | Optical finger print recognizer component and its manufacturing method and electronic device | |
| CN108074941A (en) | Input and output module and electronic device | |
| CN109901179A (en) | A kind of miniaturization TOF circuit module and TOF mould group | |
| EP3557951A1 (en) | Camera using light source having subject eye protection function | |
| CN112217982A (en) | Compact TOF camera module for 3D sensing | |
| CN210867879U (en) | Face identification module and intelligent lock | |
| CN111596507A (en) | Camera module and manufacturing method thereof | |
| CN104869293A (en) | Image obtaining apparatus for imaging target area | |
| CN212460578U (en) | External hanging type biological identification image capturing device | |
| CN109991703A (en) | A kind of optical module | |
| CN204681462U (en) | A kind of image acquiring device for target area imaging |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |