CN109899728A

CN109899728A - A kind of LED light

Info

Publication number: CN109899728A
Application number: CN201811492241.7A
Authority: CN
Inventors: 王名斌; 江涛; 熊爱明; 周林
Original assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Current assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Priority date: 2017-12-08
Filing date: 2018-12-07
Publication date: 2019-06-18
Anticipated expiration: 2038-12-07
Also published as: WO2019109991A1; CN212456343U; CN109899728B; CN111520652B; CN211475541U; CN212456342U; CN214675778U; CN211010828U; CN110513627A; CN111520652A; CN213237005U; CN212156709U; CN111520653A; CN110513627B; CN212461721U; CN212156699U; CN111520653B; CN214147459U

Abstract

The invention discloses a kind of LED light characterized by comprising lamp housing；Passive heat radiation component, the passive heat radiation component includes radiator, and the radiator includes radiating fin and heat dissipation base, and the radiator is connect with the lamp housing；Power supply, the power supply are located in the lamp housing；And lamp plate, it is connected on the radiator, the lamp plate includes LED chip, and the power supply is electrically connected with the LED chip；The first heat dissipation channel is formed in the inner cavity of the lamp housing, first heat dissipation channel has the first air inlet in one end of the lamp housing, and the other end opposite on the lamp housing has heat release hole；The second heat dissipation channel is formed in the radiating fin and the heat dissipation base, second heat dissipation channel has the second air inlet, and air is after second air inlet entrance, by second heat dissipation channel, finally flows out from the space between the radiating fin.

Description

A kind of LED light

Technical field

The present invention relates to a kind of LED light, especially high-capacity LED lamp, belong to lighting area.

Background technique

LED light is because have energy conservation, efficiently, environmental protection, the advantages that service life is long and be widely adopted in many lighting areas. LED lamp is as energy saving green light source, and the heat dissipation problem of high-capacity LED is taken seriously increasingly, since excessively high temperature will lead to hair Light efficiency decaying directly can cause to cause if high-capacity LED operates generated waste heat and can not effectively shed to the service life of LED The influence of life property, therefore, the solution of high-capacity LED heat dissipation problem becomes the research and development important topic of many relatives in recent years.

In some applications, for entire LED light, there may be weight limitations.For example, when LED light uses certain specific rule The lamp cap of lattice, and LED light in a manner of hanging in use, the maximum weight of LED light is restricted in a certain range.Therefore, it removes After the necessary component such as power supply, lampshade, lamp housing, weight of the LED light for the radiator of heat dissipation is limited in a limited model In enclosing.And for certain high-power LED lamps, such as power is 150W~300W, luminous flux can reach 20000 lumens extremely 45000 lumens or so, that is to say, that radiator needs to dissipate from 20000 to 45000 lumens of generation in the limitation of its weight LED light caused by heat.

The component of the heat dissipation of current LED light mostly use greatly fan, heat pipe, cooling fin, or combinations thereof design, with penetrate Heat transfer, convection current and/or the mode of radiation are by heat energy dissipation caused by LED light.In the case where passive heat radiation (fan-free), the quality of integral heat sink effect depend on the thermal coefficient and heat dissipation area of radiator material itself, lead identical Under conditions of hot coefficient, either which kind of radiator be all can only distribute heat by two methods of convection current and radiation, and this The heat-sinking capability of two ways is all directly proportional with the heat dissipation area of radiator itself, therefore, limits in radiator there are weight Under the premise of, the radiating efficiency of radiator how is improved, is the approach for the cost for improving LED light quality and reducing entire LED light.

LED light in the prior art generally comprises light source, radiator, power supply, lamp housing and lampshade, and light source and radiator are solid Fixed, power supply is set in lamp housing, and lamp housing is connect with radiator, and lamp housing includes the lamp cap for connecting lamp holder.It is in the prior art LED light has the disadvantages that.

1, the design of radiator is unreasonable: only with passive heat radiation, and radiator is in certain weight Under restrictive condition, can not it is certain solve high-powered LED lamps LED heat dissipation problem, heat when leading to LED operation can not It disperses in time, will affect the service life of LED under long-time.Specifically, for example, radiator includes radiating fin, and radiating fin with Unreasonable, the heat for causing LED to generate at work is arranged in the relative positional relationship of LED, in heat transfer to radiating fin, Thermally conductive pathways are too long, cause heat dissipation to LED not in time.

For another example, the convection design between the radiating fin of radiator is unreasonable, such as Authorization Notice No. is CN Fanless led shot-light disclosed in the Chinese invention patent of 204717489U, the fin of radiator is without pair from bottom to up Stream, after causing the heat of fin to be radiated to air, the heat of air can not disperse in time, so that the air themperature around fin An important factor for rising, and influencing fin radiation efficiency, is the temperature difference of fin and surrounding air, therefore, air themperature Rise, will affect the subsequent heat radiation of fin.

For another example, the unreasonable structural design of the radiating fin of radiator, such as the middle promulgated by the State Council of publication number CN107345628A Bright patent discloses a kind of LED light, radiating fin width having the same in LED light short transverse, and dissipates to LED light For heat, mainly the LED heat generated is conducted to heat radiating fin close to the radiating fin of LED in LED light short transverse Piece, and the radiating fin for being relatively distant from LED is then to need by heat radiation and convection current, and its heat is dissipated to ambient enviroment, That is, the radiating fin far from LED is mainly to pass through heat radiation and heat loss through convection, therefore do not need excessive fin face Product, and LED light disclosed in above-mentioned patent, the design of radiating fin will lead to the increase of LED light overall weight, however dissipate The thermal efficiency but can not be promoted accordingly.

In addition, the radiating fin of radiator can also there is a problem of in some structures, such as high-power LED lamp, ruler Very little larger, width can reach 150mm or more, highly reach 180mm or more, correspondingly, radiating fin also has biggish length With the size of width, if radiating fin lacks corresponding support, when machine-shaping, radiating fin is easy to happen deflection；For another example, Radiating fin is unreasonable in the design of LED light radially outer profile, its heat dissipation effect is caused to decline, and can not be adapted to well with The lamps and lanterns being used cooperatively.

2, the setting of power supply is unreasonable: for certain high-power LED lamps, when reaching 150W~300W such as power, to electricity The heat dissipation no less important in source, if LED light works, the heat that power supply generates can not disperse in time, then will affect some electronics The service life of component (the especially high component of heat sensitivity, such as capacitor), to influence the service life of whole lamp.In general, in the prior art Radiator and power supply between without effective heat management, it will cause to influence each other between the heat of radiator and the heat of power supply, example Such as, Authorization Notice No. is to disclose a kind of binary channels cross-ventilation lamps and lanterns heat dissipation in the Chinese invention patent of CN 203190364U (a part of cavity is formed directly into radiator to the cavity of structure and the PAR lamp for using it, radiating fin and receiving power supply On) between, without being effectively thermally isolated between light source and the cavity for accommodating power supply, the heat that radiating fin and light source generate is easy It is directly entered cavity by heat transfer, and influences the intracorporal power supply of chamber.

In addition, the arrangement planning of the electronic building brick of power supply is unreasonable, such as by heat generating component (such as resistance, inductance, transformation Device) it is arranged together, then it is unfavorable for the formation of the temperature gradient of heat generating component and surrounding air, to influence heat generating component heat It is radiated to the efficiency of air.It is further noted that when external cross-ventilation is to power supply, such as without targetedly setting Meter, then insect, dust etc. are easy to attach on power supply, to influence the heat dissipation of power supply.

Other than the problem of radiating, high-power LED illumination product net weight itself is heavier, while at work due to temperature It is higher, it is therefore desirable to consider high mechanical strength structural member demand under the high temperature conditions.General high-power LED illumination product dress Mainly each component is attached with screw fashion with mode, it is contemplated that creepage distance of insulation requires, lamp neck more than radiator Position generallys use plastic part, and the most common structure is the shell of plastic part together with cap screw thread, and lamp cap rotation lock is attached to On shell, the realization of riveting pin hole is added to be located by connecting.Cumbersome technique is not only needed on manufacturing process using screw connection, Cost is also higher simultaneously.Therefore high-power LED illumination product mechanism combination be also the product research and development important directions it One.

When being related to the packed and transported of LED light, the lampshade of LED light is convexly equipped in outside lamp plate, such as Publication No. CN In the Chinese invention patent application of 107345628 A, the lampshade of LED light may with external contact, collision and become stress point, and Lampshade generally uses the materials such as glass or plastics, there is a problem of frangible.Thus, in packed and transported, need to lampshade into The special protection of row, is just avoided that and damages because of collision, and aforesaid operations undoubtedly will increase the cost of packaging.

When being related to the light-out effect of LED light, in general, ideally, it is desirable to which the light of LED light is invested LED light In certain region of lower section, to guarantee the brightness in the region.But in fact, a big chunk light may directive two sides The waste of this some light is caused in region, leads to the reduction of the delivery efficiency of light.For example, Publication No. CN 107345628A Chinese invention patent application in, disclose solid state lamp comprising solid state light emitter on circuit boards, part solid state light emitter are installed It is laterally disposed, when in use, it will usually be used with combined lamps.That is, the part that solid state light emitter is laterally disposed, needs to lead to Cross lamps and lanterns emit to lower section and light out, and transmitting and out by way of light, in reflection process, have certain light loss, therefore, Influence the light extraction efficiency of whole lamp.

In addition, the bias that the prior art chats bright general driving circuit is all by taking on bus for circuit part The mode of partial pressure generates.But in the application of high-capacity LED lamp (HID-LED, High intensity Discharge-LED) Under, general bias circuit in order to avoid excessive power dissipation, bias circuit usually arrange in pairs or groups bulky capacitor design, will so make It is slower that speed is lighted at HID-LED, and general bias fashion starting speed is about 1 second, influences usage experience.

In view of the above problem, the present invention and embodiment set forth below.

Summary of the invention

The invention mainly solves the technical problem of providing a kind of LED light, to solve the above problems.

The present invention provides a kind of LED light characterized by comprising

Lamp housing；

Passive heat radiation component, the passive heat radiation component includes radiator, the radiator include radiating fin and Heat dissipation base, the radiator are connect with the lamp housing；

Power supply, the power supply are located in the lamp housing；And

Lamp plate is connected on the radiator, and the lamp plate includes LED chip, the power supply and LED chip electricity Connection；

The first heat dissipation channel is formed in the inner cavity of the lamp housing, first heat dissipation channel has in one end of the lamp housing First air inlet, and the other end opposite on the lamp housing has heat release hole；

The second heat dissipation channel is formed in the radiating fin and the heat dissipation base, second heat dissipation channel has second Air inlet, air from second air inlet entrance after, by second heat dissipation channel, finally from the radiating fin it Between space outflow；

Optionally, the lamp plate offers third opening, third opening respectively with first heat dissipation channel and institute State the connection of the second heat dissipation channel.

Optionally, third opening is set to the region at the center of the lamp plate, and first air inlet and described the Two air inlets are respectively from third opening air inlet.

Optionally, the weight of the radiator accounts for 50% or more of the weight of the LED light, and the body of the radiator Product accounts for 20% or more of the volume of LED light totality.

Optionally, the volume of the radiator accounts for the 20%~60% of the volume of the LED light totality.

Optionally, the radiating fin include the first radiating fin and the second radiating fin, first radiating fin and Bottom of second radiating fin in LED light axial direction is connect with the heat dissipation base, first radiating fin and institute It states the second radiating fin and is spaced each other interactive setting, the shape of second radiating fin is the Y shape being divided into two.

It optionally, further include lampshade, the lampshade includes light output surface and end face, and the end face is equipped with air hole, Air enters first heat dissipation channel and second heat dissipation channel, first air inlet by the air hole Region shared by the end face is projected in LED light axial direction forms first part, and other regions on the end face are formed Second part, the area of the air hole in the first part are greater than the face of the air hole on the second part Product.

The beneficial effects of the present invention are: compared with prior art, the present invention includes following any effect or any combination thereof:

(1) pass through the setting of the first heat dissipation channel, the heat that can be taken away in the first heat dissipation channel with this (produces when power work It is raw, by the setting of the second heat dissipation channel, the heat loss through convection to radiator can be increased, and pass through the first heat dissipation channel and the The setting of two heat dissipation channels increases the efficiency of whole lamp free convection, so that the corresponding required heat dissipation area drop of radiator It is low.

(2) third opening is connected to the first radiating channel and the second radiating channel respectively, and third opening is set to lamp plate The region at center, and third is provided with the region at the center of lamp plate, makes the first air inlet and the second air inlet that can share one Therefore the entrance of a air inlet can avoid occupying the excessive region of lamp plate, thus avoid the region of the setting LED chip of lamp plate Area is reduced because opening up multiple holes.

(3) weight of radiator accounts for 50% or more of the weight of LED light, and the volume of radiator accounts for the body of LED light totality Long-pending 20% or more, in the identical situation of thermal coefficient of radiator, volume shared by radiator is bigger, can be used as dissipating The area of heat is bigger.Therefore, to a certain extent, when the volume of radiator accounts for 20% or more of the volume of LED light totality, heat dissipation Device can have more available spaces, to increase its heat dissipation area.

(4) by being the Y shape being divided into two by the shape of the second radiating fin, so that radiator 1 is occupying same volume In the case where, possess more heat dissipation areas.

(5) area of the air hole in first part is greater than the area of the air hole on second part, conducive to major part is made Air enters the first heat dissipation channel, to preferably radiate to power supply, prevents the electronic building brick of power supply heated and accelerates old Change.

Detailed description of the invention

Fig. 1 is the schematic view of the front view of LED light in the present embodiment；

Fig. 2 is the schematic cross-sectional view of the LED light of Fig. 1；

Fig. 3 is the decomposition diagram of the LED light of Fig. 1；

Fig. 4 is the schematic cross-sectional view of LED light, shows the first radiating channel and the second radiating channel；

Fig. 5 is the schematic perspective view one of the LED light of Fig. 1；

Fig. 6 is the structural schematic diagram that Fig. 5 removes light output surface；

Fig. 7 is the light transmission schematic diagram of the present embodiment；

Fig. 8 is the light type figure of Fig. 7；

Fig. 9 is the decomposition diagram of the LED light in some embodiments, shows baffle vane；

Figure 10 is the stereoscopic schematic diagram of the LED light in some embodiments；

Figure 11 is the schematic diagram that Figure 10 removes light output surface；

Figure 12 is the cross-sectional view of the LED light in some embodiments, shows straight light output surface；

Figure 13 a is the cooperation schematic diagram of the lamp plate and lampshade in some embodiments；

Figure 13 b is the cooperation schematic diagram of the lamp plate and lampshade in some embodiments；

Figure 13 c is the cooperation schematic diagram of the lamp plate and lampshade in some embodiments；

Figure 14 is the cooperation schematic diagram of the lamp plate and lampshade in some embodiments；

Figure 15 is the schematic diagram of the end face of the lampshade in the present embodiment；

Figure 16 is the schematic diagram of the end face of the lampshade in some embodiments；

Figure 17 is the schematic diagram of the other direction of the end face of Figure 16；

Figure 18 a is the schematic diagram of the lampshade in some embodiments；

Figure 18 b is the schematic diagram of the lampshade in some embodiments；

Figure 18 c is the schematic diagram of the lampshade in some embodiments；

Figure 18 d is the schematic diagram of the lampshade in some embodiments；

Figure 18 e is the schematic diagram of the lampshade in some embodiments；

Figure 18 f is the schematic diagram of the lampshade in some embodiments；

Figure 18 g is the schematic diagram of the lampshade in some embodiments；

Figure 18 h is the schematic diagram of the lampshade in some embodiments；

Figure 18 i is the schematic diagram of the lampshade in some embodiments；

Figure 19 a is the schematic cross-sectional view of the radiator in some embodiments；

Figure 19 b is the schematic diagram using the LED light of the radiator of Figure 19 a；

Figure 20 is the schematic cross-sectional view for removing lampshade of the LED light in some embodiments；

Figure 21 is the perspective view of the present embodiment LED light；

Figure 22 is the cross-sectional view of the LED light in the present embodiment；

Figure 23 is the top view of the radiator in the present embodiment；

Figure 24 is the enlarged diagram in Figure 23 at E；

Figure 25 is the schematic diagram that air forms vortex at the second radiating fin 112；

Figure 26 is the partial schematic diagram of the radiator in some embodiments；

Figure 27 is the main view of the LED light in some embodiments；

Figure 28 is the main view of the LED light in some embodiments；

Figure 29 is that the LED light of Fig. 1 removes the bottom view of lampshade；

Figure 30 is the enlarged diagram in Figure 29 at A；

Figure 31 is the cross-sectional view of LED light in the present embodiment；

Figure 32 is the enlarged diagram in Figure 31 at C；

Figure 33 is the stereoscopic schematic diagram of the lampshade in the present embodiment；

Figure 34 is the cooperation schematic diagram of the lampshade and lamp plate in some embodiments；

Figure 35 is the bottom view of Figure 34；

Figure 36 a is the schematic diagram of the radiator in some embodiments；

Figure 36 b is the schematic diagram of the radiator in some embodiments；

Figure 36 c is the schematic diagram of the radiator in some embodiments；

Figure 36 d is the schematic diagram of the radiator in some embodiments；

Figure 36 e is the schematic diagram of the radiator in some embodiments；

Figure 36 f is the schematic diagram of the radiator in some embodiments；

Figure 36 g is the schematic diagram of the radiator in some embodiments；

Figure 36 h is the schematic diagram of the radiator in some embodiments；

Figure 36 i is the schematic diagram of the radiator in some embodiments；

Figure 36 j is the schematic diagram of the radiator in some embodiments；

Figure 36 k is the schematic diagram of the radiator in some embodiments；

Figure 36 l is the schematic diagram of the radiator in some embodiments；

Figure 36 m is the schematic diagram of the radiator in some embodiments；

Figure 37 a is the schematic diagram of the radiator in some embodiments；

Figure 37 b is the schematic diagram of the radiator in some embodiments；

Figure 37 c is the schematic diagram of the radiator in some embodiments；

Figure 37 d is the schematic diagram of the radiator in some embodiments；

Figure 38 a is the top view of the radiator in some embodiments；

Figure 38 b is the top view of the radiator in some embodiments；

Figure 38 c is the top view of the radiator in some embodiments；

Figure 38 d is the top view of the radiator in some embodiments；

Figure 38 e is the top view of the radiator in some embodiments；

Figure 38 f is the top view of the radiator in some embodiments；

Figure 38 g is the top view of the radiator in some embodiments；

Figure 38 h is the top view of the radiator in some embodiments；

Figure 38 i is the top view of the radiator in some embodiments；

Figure 39 is the top view of the radiator of the present embodiment；

Figure 40 is the cooperation schematic diagram of the present embodiment radiating fin and LED chip；

Figure 41 is the cooperation schematic diagram of radiating fin and LED chip in some embodiments；

Figure 42 is the schematic diagram of the lamp plate in some embodiments；

Figure 43 is the schematic diagram of the lamp plate in the present embodiment；

Figure 44 a is the schematic diagram of the lamp plate in some embodiments；

Figure 44 b is the schematic diagram of the lamp plate in some embodiments；

Figure 44 c is the schematic diagram of the lamp plate in some embodiments；

Figure 44 d is the schematic diagram of the lamp plate in some embodiments；

Figure 44 e is the schematic diagram of the lamp plate in some embodiments；

Figure 44 f is the schematic diagram of the lamp plate in some embodiments；

Figure 45 a is the front view of the lamp plate in some embodiments；

Figure 45 b is the front view of the lamp plate in some embodiments；

Figure 45 c is the front view of the lamp plate in some embodiments；

Figure 45 d is the front view of the lamp plate in some embodiments；

Figure 45 e is the front view of the lamp plate in some embodiments；

Figure 45 f is the front view of the lamp plate in some embodiments；

Figure 45 g is the front view of the lamp plate in some embodiments；

Figure 46 a is the perspective view one of power supply in the present embodiment；

Figure 46 b is the perspective view two of power supply in the present embodiment；

Figure 46 c is the perspective view three of power supply in the present embodiment；

Figure 46 d is the main view of power supply in the present embodiment；

Figure 47 is the schematic diagram of power supply in some embodiments；

Figure 48 is the main view of clump weight in Figure 47；

Figure 49 is the demonstration graph of Figure 48；

Figure 50 is the schematic diagram of transformer；

Figure 51 is the schematic diagram of power supply in some embodiments；

Figure 52 is the schematic diagram of power supply in some embodiments；

Figure 53 a is the schematic diagram of the power panel in some embodiments；

Figure 53 b is the schematic diagram of the power panel in some embodiments；

Figure 53 c is the schematic diagram of the power panel in some embodiments；

The cross-sectional view of LED light in Figure 54 the present embodiment；

The cross-sectional view of LED light in Figure 55 the present embodiment；

Figure 56 is the cooperation schematic diagram of power supply and inner sleeve in some embodiments；

Figure 57 is the enlarged drawing in Fig. 2 at B；

Figure 58 is the partial schematic diagram of LED light；

Figure 59 a is the stereoscopic schematic diagram one of lamp neck in the present embodiment；

Figure 59 b is the stereoscopic schematic diagram two of lamp neck in the present embodiment；

Figure 59 c is the stereoscopic schematic diagram of lamp neck in some embodiments；

Figure 60 is the stereoscopic schematic diagram of inner sleeve in the present embodiment；

Figure 61 is the cross-sectional view of the LED light in some embodiments；

Figure 62 is the setting schematic diagram of the convection channel in the LED light of Figure 61；

Figure 63 is the main view that LED light in some embodiments removes radiator；

Figure 64 is the decomposition diagram of Figure 63；

Figure 65 a is the decomposition diagram of the lamp housing of LED light in some embodiments；

Figure 65 b is the assembling schematic diagram of Figure 65 a；

Figure 65 c is the decomposition diagram one of the LED light of the lamp housing comprising Figure 65 a；

Figure 65 d is the decomposition diagram two of the LED light of the lamp housing comprising Figure 65 a

Figure 65 e is the cross-sectional view of the LED light of the lamp housing comprising Figure 65 a；

Figure 66 is the main view of the LED light in the present embodiment；

Figure 67 is the cooperation schematic diagram of the LED light and lamps and lanterns in the present embodiment；

Figure 68 is the schematic diagram of the LED light in some embodiments；

Figure 69 is LED light main view in the present embodiment；

Figure 70 a is the cooperation schematic diagram of the LED light and lamps and lanterns in the present embodiment；

Figure 70 b is the cooperation schematic diagram of the LED light and lamps and lanterns in the present embodiment；

Figure 70 c is the cooperation schematic diagram of the LED light and lamps and lanterns in the present embodiment；

Figure 71 is the circuit layout schematic diagram one of the LED module in some embodiments；

Figure 72 is the enlarged diagram in Figure 71 at D；

Figure 73 is the circuit layout schematic diagram two of LED module in some embodiments；

Figure 74 is a kind of power module schematic diagram of one embodiment of the application；

Figure 75 is the schematic diagram of the electromagnetic interference suppression circuit of one embodiment of the application；

Figure 76 is the rectification circuit of one embodiment of the application and the schematic diagram of filter circuit；

Figure 77 is the schematic diagram of the circuit of power factor correction of one embodiment of the application；

Figure 78 is the schematic diagram of the power-switching circuit of one embodiment of the application；

Figure 79 is the schematic diagram of the bias generating circuit of the application first embodiment；

Figure 80 is the schematic diagram of the bias generating circuit of the application second embodiment；

Figure 81 is the temperature sensing circuit schematic diagram of one embodiment of the application；

Figure 82 is the temperature-compensation circuit schematic diagram of one embodiment of the application.

Specific embodiment

To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing Give presently preferred embodiments of the present invention.But the present invention can be realized by many different forms, however it is not limited under Face described embodiment.On the contrary, purpose of providing these embodiments is makes to understand more the disclosure It is thorough and comprehensive.It is for clearer showing structure hereinafter with regard to direction such as " axial direction ", " top ", " lower section " Positional relationship, not limitation of the present invention.In the present invention, described " vertical ", the "horizontal", " parallel " is defined as: be included in ± 10% situation on the basis of standard definition.For example, being vertically often referred to relative datum wire clamp angle is 90 degree, but in the present invention In, it vertically refers to including the situation within 80 degree to 100.In addition, the service condition of heretofore described LED illumination lamp, making With state, refers to use situation of the LED light in a manner of lamp cap hanging straight up, will separately be done if any other exceptions Explanation.

Fig. 1 is the main view of the LED light in the embodiment of the present invention.Fig. 2 is the cross-sectional view of the LED light of Fig. 1.Fig. 3 is Fig. 1 Decomposition diagram.As shown in Figure 1, Figure 2 and Figure 3, the LED light, comprising: radiator 1, lamp housing 2, lamp plate 3, lampshade 4 and electricity Source 5.In the present embodiment, lamp plate 3 is connected on radiator 1 in a manner of fitting, in favor of the heat generated when the work of lamp plate 3 It quickly conducts to radiator 1.Specifically, lamp plate 3 and radiator 1 rivet in some embodiments, and in some embodiments, lamp Plate 3 is bolted with radiator, and in some embodiments, lamp plate 3 is welded and fixed with radiator 1, in some embodiments In, lamp plate 3 is fixed with 1 gluing of radiator.In this present embodiment, radiator 1 is connected to lamp housing 2, and lampshade 4 is located at lamp plate 3 Outside, so that the light that generates of the light source of lamp plate 3 is projected by lampshade 4, power supply 5 is located in the inner cavity of lamp housing 2, and power supply 5 and LED chip 311 is electrically connected, to power to LED chip 311.

As shown in figure 4, the cross-sectional view of the LED light in display the present embodiment.As shown in Figures 2 and 4, the lamp housing in the present embodiment The first heat dissipation channel 7a is formed in 2 inner cavity, and the first heat dissipation channel 7a has the first air inlet 2201 in one end of lamp housing 2, And the other end opposite on lamp housing 2 has heat release hole 222 (being specifically opened in 22 top of lamp neck).Air is from the first air inlet 2201 Into, and be discharged from heat release hole 222, with this, heat (the mainly work of the power supply 5 when institute in the first heat dissipation channel 7a can be taken away The heat of generation).Specifically for heat dissipation path, the heat that the heat generating component in power supply 5 generates when working, first with heat radiation Mode transfer heat in the air in the first heat dissipation channel 7a (air near heat generating component), outside air is with convection current Mode enter the first radiating channel 7a, to take away internal air and radiate.In other embodiments, can also by Heat release hole 222 is opened up on lamp neck 22 and is directly radiated.

As shown in Figure 1, Figure 2 and Figure 4, radiating fin 11, the second heat dissipation channel 7b is formed in heat dissipation base 13, second dissipates Passage of heat 7b has the second air inlet 1301, and air is after the entrance of the second air inlet 1301, by the second heat dissipation channel 7b, most It is flowed out afterwards from the space between radiating fin 11.With this, the heat on radiating fin 11 can be taken away, accelerates radiating fin 11 Heat dissipation.Specifically for heat dissipation path, the heat heat transfer that LED chip 311 generates is to radiator 1, the heat radiating fin of radiator 1 Heat is radiated to surrounding air by piece 11, when the second heat dissipation channel 7b heat loss through convection, is taken away the air in radiator 1 and is carried out Heat dissipation.

As shown in Figure 1 and Figure 4, third heat dissipation channel 7c is arranged in radiator 1, and third heat dissipation channel 7c is formed in two heat radiating fins Space between piece 11 or between two sheet bodies that same radiating fin 11 extends, the radial outside between two radiating fins 11 Part constitutes the entrance of third heat dissipation channel 7c, and air enters third heat dissipation channel from the region of the radial outside of LED light In 7c, and take away the heat that radiating fin 11 is radiated air.

Fig. 5 is the schematic perspective view of the LED light in the present embodiment, shows the combination of radiator 1 and lampshade 4.Fig. 6 is Fig. 5 removes the structural schematic diagram on light output surface 43.As shown in Figure 5 and Figure 6, in the present embodiment, lampshade 4 includes light output table Face 43 and end face 44, end face 44 are equipped with air hole 41, and air enters the first heat dissipation channel 7a and the by air hole 41 Two heat dissipation channel 7b.When LED chip 311 (shown in Fig. 6) shines, light is through the light output surface 43, and from lampshade 4 It projects.In the present embodiment, light-transmitting materials in the prior art, such as glass, PC material etc. are can be selected in light output surface 43.This " LED chip " so-called in all embodiments is invented, all light emitting sources based on LED (light emitting diode) are referred to, including But be not limited to LED lamp bead, LED light bar or LED filament etc., therefore the LED chip group of this specification meaning can also be equal to LED Lamp bead group, LED light bar group or LED filament group etc..As shown in figure 5, in the present embodiment, the area on light output surface 43 and end face The ratio of 44 area is 1:4~7.Preferably, light output surface 43 area (area of 43 single side surface of light output surface, The area on the surface i.e. far from 311 side of LED chip) and (area of 44 single side surface of end face, i.e., far from LED chip of end face 44 The area on the surface of 311 sides, the area including air hole 41) area ratio be 1:5~6.Most preferably, light output The ratio of the area of the area and end face 44 on surface 43 is 1:5.5.End face 44 is used to pass through for air to the first heat dissipation Channel 7a and the second heat dissipation channel 7b, light output surface 43 then goes out light with light source, therefore can use and reach between light and heat dissipation Balance.In the present embodiment, in order to meet the air inlet demand of the first heat dissipation channel 7a and the second heat dissipation channel 7b, the area of lampshade 4 Ratio with the area of end face 44 is 5~8.Preferably, the ratio of the area of lampshade 4 and the area of end face 44 is 6~7.With This, so that reaching balance between air needed for the range of light output and heat dissipation.

In the present embodiment, the area (area of 43 single side surface of light output surface, i.e., far from LED core on light output surface 43 The area on the surface of 311 side of piece) it is 3 times or more of area of surface of all LED chips 31 in light direction, and do not surpass 10 times are crossed, while enough output optical zone domains are provided, controls its width dimensions.

As shown in Figure 5 and Figure 6, it in the present embodiment, is set on the light output surface 43 of lampshade 4 in the inside of LED light radially Set interior reflective surface 4301, interior reflective surface 4301 is with respect to the LED chip 311 on lamp plate 3, and interior reflective surface 4301 any one relatively LED chip 311 is located at the inside of LED light radial direction.In one embodiment, light output surface 43 is in LED light radially outer External reflectance face 4302 is arranged in side, and with respect to the LED chip 311 on lamp plate 3, external reflectance face 4302 is relatively any in external reflectance face 4302 One LED chip 311 is located at the more lateral of LED light radial direction.The setting of interior reflective surface 4301 and external reflectance face 4302, is used for Adjust LED chip group 31 goes out optical range, concentrates light more, to improve the effect of local brightness, that is to say, that In the case where identical luminous flux, the illumination of LED light is improved.Specifically, when the LED chip 311 in the present embodiment is arranged, All set on 3 lower surface of lamp plate (when use state), that is to say, that LED chip 311 do not have it is lateral go out light, when work, The main light-emitting surface of LED chip 311 is all downwards, and the light of LED chip 311 at least 60% or more is directly from light output table Face 43 is projected, and without being subjected to reflection, accordingly, with respect to the LED light with main light-emitting surface lateral direction light emission, (lateral light passes through Go out light downwards after lamps and lanterns or lampshade reflection, and there is a certain proportion of light loss after reflecting), the LED chip 311 of the present embodiment Light extraction efficiency it is more preferable, that is to say, that at identical lumen (luminous flux), the LED light of the present embodiment has higher Illumination.And it is reflected by internally reflective the setting in face 4301 and external reflectance face 4302, can use light more concentrates, and is promoted in a region Illumination, such as region (the light-emitting angle model of 120 degree to 130 degree of LED light lower section below LED light between 120 degree to 130 degree It encloses).And when the height of LED light setting is higher, under the light-emitting angle, the range of the irradiation of LED light still meet demand, and There can be higher illumination within this range.Fig. 7 is the light transmission schematic diagram of the present embodiment, and Fig. 8 is the light type figure of Fig. 7.Such as figure 6, shown in Fig. 7 and Fig. 8, for light-out effect, on the projecting direction of LED light, that is, the lower section of LED light is thrown with light It penetrates region M, there is extraction regions m in light transmission region M, and LED lamp includes reflecting surface, it will at least partly LED chip 311 with this Emitted light reflexes to extraction regions m, to improve the brightness of extraction regions m.Reflecting surface includes interior reflective surface 4301 and external reflectance The light of LED chip 311 is at least partly reflexed to extraction regions m by face 4302, interior reflective surface 4301 and external reflectance face 4302. In the present embodiment, it is preferred that at least 5% reflection Jing Guo interior reflective surface 4301 and external reflectance face 4302 of the luminous flux of light source It is projected afterwards from light output surface 43, it is defeated from light after the reflection in interior reflective surface 4301 and external reflectance face 4302 for reality The light total amount that surface is projected out is at least 1000 lumens, it is preferred that by the reflection of interior reflective surface 4301 and external reflectance face 4302 It is at least 1500 lumens from the light total amount that light output surface is projected afterwards.And passes through the light total amount that external reflectance face 4302 is reflected and be greater than By the light total amount that interior reflective surface 4302 reflects, it will thus be seen that about glare problem, for the LED light of high lumen, setting The outer surface of emission 4302 can reflect significant component of lateral luminous flux, be of great significance for reducing dazzle.The present embodiment In extraction regions m be an annular section, the axis institute of inboard boundary and LED light is 20 ° at central angle, outer boundaries with The axis institute of LED light is 50 ° at central angle.In the present embodiment, LED light projects the total luminous flux of luminous flux Zhan of extraction regions m 35%~50% between, with this make extraction regions m have preferable lighting effect.In addition, being reflected by internally reflective face 4301 and outer anti- The setting in face 4302 is penetrated, unnecessary lateral direction light emission on the one hand can be reduced, to prevent the generation of dazzle, on the other hand can also be incited somebody to action The light of LED chip 311 at least partly reflexes to light transmission region M, so as to improve the illumination in the M of light projection region.

Interior reflective surface 4301 to reflect some light emitted by the LED chip 311 of the most interior LED chip group 31 enclosed, Some light emitted by the LED chip 311 of LED chip group 31 of the external reflectance face 4302 to emit outermost.Wherein, most The quantity of LED chip 311 included by the LED chip group 31 of periphery is greater than LED included by the most interior LED chip group 31 enclosed The quantity of chip 311.The area in external reflectance face 4302 is greater than the area of interior reflective surface 4301, because of the LED chip group of outermost 31 include more LED chips 311, it is therefore desirable to which more reflective areas reconcile out light.

In the present embodiment, interior reflective surface has the first area A1, and external reflectance face has second area A2, the LED of outermost The quantity of LED chip 311 included by chipset 31 is N2, LED chip 311 included by the most interior LED chip group 31 enclosed Quantity be N1；Meet following relationship:

(A1/N1): (A2/N2) is 0.4~1.

The area of the interior surface of emission 4301 corresponding to the single led chip 311 in the most interior LED chip group 31 enclosed with it is outermost The ratio of the area of the outer surface of emission 4302 corresponding to single led chip 311 falls into above-mentioned model in the LED chip group 31 enclosed When enclosing, the LED chip 311 of the LED chip group 31 of the LED chip 311 and outermost of the most interior LED chip group 31 enclosed is all had Preferable light-out effect.

As shown in fig. 6, interior reflective surface 4301 is abutted close to one end of lamp plate 3 with lamp plate 3, prevent the light from interior with this Gap between reflecting surface 4301 and lamp plate 3 passes through, and avoids loss some light.Likewise, external reflectance face 4302 is close to lamp plate 3 one end is abutted with lamp plate 3, is prevented gap of the light between external reflectance face 4302 and lamp plate 3 from passing through with this, is avoided damaging Lose this some light.

As shown in Fig. 2, shape has angle between interior reflective surface 4301 and the extension line in external reflectance face 4302 in the present embodiment The angle of a, angle a are between 80 degree to 150 degree, it is preferred that the angle is between 90 degree to 135 degree, it is furthermore preferred that should Angle is between 100 degree to 120 degree.The structure that similar reflector is formed between interior reflective surface 4301 and external reflectance face 4302, from And plays the role of controlling LED chip light extraction range or improve the brightness of part.In the present embodiment, external reflectance face 4302 with The included angle of lamp plate 2 is 30 to 60 degree, and in some embodiments, the angle is 40 to 50 degree.

As shown in Fig. 2, the height of interior reflective surface 4301 is lower than the height in external reflectance face 4302 in the present embodiment.The height Refer to the relative altitude of the two on LED light axial direction.By the way that the height of interior reflective surface 4301 is set below external reflectance The height in face 4302 can avoid the light distribution for reducing region immediately below LED light, prevent the middle part in the light distribution region of LED light Subregion forms dark space.In this implementation, the height in LED light axial direction in external reflectance face 4302 is no more than 20mm, it is preferred that The height in LED light axial direction in external reflectance face 4302 is no more than 15mm.It is said from another angle, for the height for controlling LED light entirety Size is spent, the height that the height in external reflectance face 4302 accounts for the whole lamp of LED is no more than 9%, it is preferred that the height in external reflectance face 4302 The height for accounting for the whole lamp of LED is no more than 6%, for the function in external reflectance face 4302, it is ensured that the height in external reflectance face 4302 accounts for 2% or more of the height of the whole lamp of LED, it is preferred that the height in external reflectance face 4302 accounts for 3% or more of the height of the whole lamp of LED.? That is comprehensively considering the functions such as control and reflection, optically focused, the anti-dazzle of the height dimension of LED light, need external reflectance The height in face 4302 is set as between account for the height of the whole lamp of LED 2%~9%.Preferably, the height in external reflectance face 4302 is set It is set between the 3%~6% of the height for accounting for the whole lamp of LED.

The lampshade 4 of LED light in some embodiments can eliminate the setting of interior reflective surface or external reflectance face, such as only set Set baffle vane 47, specifically, as shown in figure 9, on the excircle of lampshade 4 be arranged baffle vane 47, to improve the light extraction efficiency of lamp, The inner surface of baffle vane 47 has the function of reflection (similar external reflectance face), and lampshade 4 is buckled in when on radiator 1, baffle vane 47 It is equal with the peripheral diameter of lamp plate 3 or outer slightly larger than lamp plate 3 close to the periphery of lamp plate 3, such as the peripheral diameter of baffle vane 47 Enclose diameter.

As shown in Figure 2, Figure 5 and Figure 6, in the present embodiment, to prevent dust deposit from reducing LED to 311 surface of LED chip The light efficiency of chip 311 influences the heat dissipation of LED chip 311, and LED chip 311 can be arranged in enclosure space, to prevent ash Dirt enters and deposits to 311 surface of LED chip.For example, a closed cavity 9 is formed between lampshade 4 and lamp plate 3, specifically For, a closed cavity 9 is formed (herein between light output surface 43, interior reflective surface 4301, external reflectance face 4302 and lamp plate 3 It is closed also refer to without obvious hole, do not include inevitable gap in assembling process).It, can in some embodiments To save the setting of interior reflective surface 4301 and external reflectance face 4302, then cavity 9 be formed at lamp plate 3, light output surface 43 it Between or lamp plate 3, light output surface 43 and radiator 1 between.

Figure 10 is the perspective view of the LED light in some embodiments, opens up hole on cavity 9 unlike the present embodiment Hole.Figure 11 is the schematic diagram that Figure 10 removes light output surface 43.As shown in Figure 10 and Figure 11, in some embodiments, lampshade 4 A cavity 9 is formed between lamp plate 3, specifically, light output surface 43, interior reflective surface 4301, external reflectance face 4302 and lamp plate A cavity 9 is formed between 3, the LED chip 311 of lamp plate 3 is located in the cavity 9.The cavity 9 has one first opening 91 and one Second opening 92, which is configured to be connected to outside, and the second opening 92 is then configured to and the first heat dissipation channel 7a And second heat dissipation channel 7b connection.For heat dissipation angle, it on the one hand can make to form gaseous exchange at cavity 9, can be taken away with this The heat that part LED chip 311 generates, for another aspect, outside air is entered inside LED light by cavity 9, this For the first heat dissipation channel 7a and the second heat dissipation channel 7b, it can play the role of increasing convection current, improve radiating efficiency.Other In embodiment, may be omitted with the setting of interior reflective surface 4301 and external reflectance face 4302, that is to say, that light output surface 43 and A cavity 9 is formed between lamp plate 3.

As shown in Figure 10, in some embodiments, hole is opened up on light output surface 43, and forms the first above-mentioned opening 91, it is preferred that the first opening 91 opens up the marginal position with 43 radial outside of light output surface, defeated so that it will not influence light The translucent effect on surface 43 out.From structure, light output surface 43 is heated there may be thermal deformation when LED light works, And the setting of the first opening 91, make light output surface 43 that there is deformable space at the first opening 91, prevents light output table Extruded heat sinks due to thermal deformation of face 43 cause light output surface 43 to be damaged.In the present embodiment, the first opening 91 is in light output Several are provided in the circumferential direction on surface 43.It with this, on the one hand can increase the convection current of air, on the other hand, can further be promoted Structural strength when light output surface 43 is heated.

As shown in figure 11, in some embodiments, notch is set in interior reflective surface 4301, to form the second above-mentioned opening 92.In the present embodiment, the second opening 92 is provided with several in the circumferential direction of interior reflective surface 4301.And 92 configuration of the second opening Quantity with first opening 91 configuration quantity relationship, substantially, second opening 92 quantity with first opening 91 quantity Ratio be 1:1~2, preferably 1:1.5.In this way, a balance can be formed in air inlet and the outlet.In other embodiments, the One opening 91 and the second opening 92 can also be formed on the other component of lampshade 4, such as lamp plate 3 or the heat dissipation base of radiator 1 On 13.

As shown in Figure 10 and Figure 11, in some embodiments, a cavity 9 is formed between lampshade 4 and lamp plate 3, specifically, A cavity 9 is formed between light output surface 43, interior reflective surface 4301, external reflectance face 4302 and lamp plate 3, LED chip 311 is located at In the cavity 9, cavity 9 has pressure-releasing hole, to avoid in cavity 9, causes in cavity 9 due to fever when LED chip 311 works Temperature increases, to make pressure rise.Pressure-releasing hole can be the first opening 91 opened up on light output surface 43, be also possible to The second opening 92 being arranged in interior reflective surface 4301, or can also be the corresponding and chamber opened up on lamp plate 3 or radiator 1 The hole that body 9 is connected to, as long as discharge effect can be reached.

As shown in figure 4, light output surface 43 is in LED light radially outward direction, at a distance from LED lamp panel 3 gradually It is incremented by, to make light output surface 43 in inner concavity.With this, compared to straight surface, the structure on this light output surface 43 is strong Degree gets a promotion, in addition, light output surface 43 will not generate angle, therefore by above-mentioned this more smooth transient mode The thickness on light output surface 43 is relatively uniform, thus does not interfere with light-out effect.Finally, for use state, lamp plate 3 Fever is generated due to light source in LED light work, if light output surface 43 is a smooth face, and is parallel to horizontal plane (under the use state of hanging installation), then horizontally outer expansion when light output surface is heated, it is thus possible to be squeezed by radiator 1 Pressure and it is damaged.In the present embodiment, when light output surface 43 is inner concavity, when 4 expanded by heating of lampshade, the direction of expansion occurs Change (under the use state of hanging installation, if light output surface 43 is smooth face, after being heated, the master of light output surface 43 To expand in the horizontal direction, if light output surface 43 be inner concavity, expansion direction be decomposed into horizontal direction part and downwards Part), lampshade 4 will be reduced in the expansion in direction horizontally outward, avoid lampshade 4 damaged because being squeezed by radiator 1.

As shown in figure 12, in some embodiments, light output surface 43 may be set to be straight face, but need to examine Consider the thermal expansion coefficient of the material of output surface 43, the spacing on light output surface 43 and radiator 1 and light output surface 43 Ability of anti-deformation.For example, when light output surface 43 is straight face, then it can be by light output surface 43 and radiator 1 in diameter Set up a spacing, it is ensured that will not be squeezed due to the expansion on light output surface 43 by radiator 1.

In some embodiments, optical coating is arranged in light output surface 43, and diffusion barrier such as is arranged on light output surface 43 431, the light that LED chip 311 generates is pierced by lampshade 4 by diffusion barrier 431.Diffusion barrier 431 issues LED chip 311 Light plays the role of diffusion, therefore, as long as lampshade 4, the cloth of diffusion barrier 431 are pierced by again after light can be made to penetrate diffusion barrier 431 Set can there are many form, such as: diffusion barrier can be coated or covered on the inner surface on light output surface 43 (such as Figure 13 a institute Show), perhaps covered coated on the diffusion coating (as illustrated in fig. 13b) on 311 surface of LED chip or as an outer cover The diffusion barrier sheet (as shown in figure 13 c) of (or covering) outside LED chip 311.

Figure 14 is the cooperation schematic diagram of lampshade 4 and lamp plate 3.As shown in figure 14, in some embodiments, light output surface 43 Anti-reflection coating 432 is set in the inside of the side close to LED chip 311, that is, light output surface 43, LED core can be reduced The light of piece 311 light output surface 43 reflection, to improve the light penetration at light output surface 43.In the present embodiment Anti-reflection coating 432 refractive index between air and glass.It include metal oxide, metal in anti-reflection coating 432 The content of oxide accounts for the 1%~99% of 432 material of anti-reflection coating, and the reflectivity of anti-reflection coating 432 is less than 2%.This Metal oxide in embodiment can be zirconium oxide, tin oxide, tin oxide, aluminium oxide etc..

Above-mentioned diffusion barrier 431 and anti-reflection coating 432 can be used simultaneously, or select a use.It specifically can be according to actually going out Light demand and select.

Figure 15 shows the schematic diagram of the end face 44 of lampshade 4 in the present embodiment.As shown in figure 15, the area of section of air hole 41 The ratio of summation and the entire area (the unilateral area in end face 44, such as far from the side of LED chip 311) of end face 44 is 0.01 ~0.7, it is preferred that the ratio of the entire area of the area of section summation and end face 44 of air hole 41 is 0.3~0.6, more preferably , the ratio of the entire area of the area of section summation and end face 44 of air hole 41 is 0.4~0.55, by by air hole 41 Area and the ratio of 44 area of end face be limited in above-mentioned range, on the one hand can guarantee the air inflow of air hole 41, it is another Aspect, it can be ensured that the size of air hole 41 is adjusted in the case where guaranteeing the structural strength of end face 44.When saturating When the area of stomata 41 and the ratio of 44 area of end face are 0.4~0.55, the air inflow of air hole 41 both can ensure that, to meet The radiating requirements of LED light, and air hole 41 may make to be unlikely to influence the structural strength of end face 44, prevent end face 44 from opening If becoming easy breakage because colliding or squeezing after air hole 41.

Figure 16 shows the schematic diagram of the end face 44 of the lampshade 4 in other embodiments.Figure 17 shows the end face 44 of Figure 16 The schematic diagram of other direction.As shown in FIG. 16 and 17, the edge of air hole 41 has increased thickness, to form flank 411, air guide hole 412 is formed between adjacent flank 411 on the airintake direction of air hole 41.The edge of air hole 41 has There is increased thickness, on the one hand can increase the structural strength of end face 44, prevents from leading to overall structure because opening up air hole 41 The reduction of intensity, on the other hand, the air guide hole 412 formed has and leads wind action, by air guide hole when admitting air into 412 effect and have certain directionality.Moreover, because of the presence of flank 411, reducing end face 44 when end face 44 is formed On because open up air hole 41 due to caused by 44 strength reduction of end face influence, therefore, end face 44 is not easy because air hole 41 being deposited And deform, the yield of production can be improved.In the present embodiment, flank 411 is formed in end face 44 close to the one side of lamp plate 3.

As shown in figure 17, the increased thickness in the edge of air hole 41 is bigger than the thickness at remaining position of end face 44.It, can with this Further increase the intensity and wind-guiding effect at air hole 41.

As shown in figure 15, the maximum inscribed circle diameter of air hole 41 be less than 2mm, preferably 1 to 1.9mm.In this way, On the one hand it can prevent insect from entering, and most of dust can be prevented to pass through, on the other hand, air hole 41 is also able to maintain preferably Gas circulation efficiency.In other words, it is also possible to air hole 41 and defines a length direction and a width direction, that is, thoroughly Stomata has length and width, and length dimension is greater than width dimensions, and the width of air hole the widest part is less than 2mm, implements in one In example, the width of the widest part is 1mm to 1.9mm.In addition, the width of 41 maximum of air hole is greater than 1mm, if it is less than 1mm, Then air needs bigger pressure just to can enter air hole 41, therefore will be unfavorable for air circulation.

Figure 18 a to Figure 18 g shows the shape of various air holes 41 in some embodiments.As shown in Figure 18 a to Figure 18 g, tool For body, circle, strip, arc, trapezoidal, in diamond shape wherein one or more groups of combined shapes are can be selected in air hole 41 Shape.As shown in figure 18 a, if air hole 41 selects circle, diameter is less than 2mm, prevents insect from entering to reach, and prevents Most of dust passes through, and is also able to maintain the effect of preferable gas circulation efficiency.As shown in Figure 18 b and Figure 18 c, if thoroughly Stomata 41 selects strip or arc, then its width is less than 2mm, to reach above-mentioned technical effect.As shown in Figure 18 d, if Air hole 11d selection is trapezoidal, then its bottom is less than 2mm, to reach above-mentioned technical effect.As shown in Figure 18 e, if ventilative Fillet rectangle is selected in hole 41, then width is less than 2mm, to reach above-mentioned technical effect.As shown in Figure 18 f and 18g, breathe freely Hole 41 can also select triangle or water-drop-shaped, and its maximum inscribed circle is less than 2mm.

In some embodiments, several are distributed on end face 44 in air hole 41.Such as, air hole 41 can be along end face 44 Circumferential annular spread has several, with this, can be the more uniform entrance of air-flow.For another example, air hole 41 can be in end face 44 are distributed with several in the radial direction.Air hole 41 can also be distributed using asymmetric mode.

In some embodiments, on the axial direction of LED light, also air hole 41 can be set as to favour LED light It is axial, that is to say, that the axis of air hole 41 can be axially formed an angle with LED light.As shown in Figure 18 h, at least partly The axis of air hole 41 favours the axis of LED light, and the inclined direction of this part air hole 41 is directed towards the first heat dissipation and leads to The first air inlet 2201 of road 7a, it therefore, can be towards the first heat dissipation channel 7a's after air passes through this part air hole 41 First air inlet 2201 and convection current so that more air enter the first heat dissipation channel 7a, and dissipate the power supply 6 in it Heat.As shown in Figure 18 i, at least partly 41 axis of the air hole axis that favours LED light, and the inclination of this part air hole 41 Direction be directed towards the and the second air inlet 1301 of heat dissipation channel 7b, therefore, after air passes through this part air hole 41, Can towards the second heat dissipation channel 7b the second air inlet 1301 and convection current, so as to enter the second heat dissipation logical for more air Road 7b, to radiate to radiator 1.

By taking Figure 18 a as an example, in Figure 18 a, there are two dotted lines on end face 44, the dotted line of inner ring represents the first air inlet 2201 Project to the position of end face 44, the region in the dotted line of inner ring is first part (the first open region 433), outer ring and inner ring it Between region be second part (the second open region 434), in the present embodiment, the first air inlet 2201 projects in LED light axial direction First part (the first open region 433) is formed to region shared by end face 44, and other regions on end face 44 form second Divide (the second open region 434), the area of the air hole 41 in first part is greater than the area of the air hole 41 on second part. This setup, to preferably radiate to power supply 5, is prevented conducive to making most of air enter the first heat dissipation channel 7a Only the electronic building brick of power supply 5 is heated and accelerated ageing.These characteristics are equally applicable to the air hole 41 in above-mentioned other embodiments.

In other embodiments, the first air inlet 2201 projects to region shared by end face 44 in LED light axial direction and is formed First part (the first open region 433), and other regions on end face 44 form second part (the second open region 434), first The area of air hole 41 on part is less than the area of the air hole 41 on second part.It, can be preferably to radiating fin with this 11 radiate, and in favor of the heat dissipation of LED chip 311, prevent from forming local high-temperature area at LED chip 311.Specifically , the area of first part and second part can be selected according to practical radiating requirements.

In some applications, for entire LED light, there may be weight limitations.For example, when LED light uses E39 lamp cap, The maximum weight of LED light is restricted within 1.7 kilograms.Therefore, after removing the components such as power supply, lampshade, lamp housing, in some implementations In example, the weight of radiator is limited within 1.2 kilograms.For certain high-power LED lamps, power be 150W~ 300W, lumen number can reach 20000 lumens to 45000 lumens or so, that is to say, that radiator needs in the limitation of its weight Dissipate heat caused by the LED light from 20000 to 45000 lumens of generation.In Natural Heat Convection, general 1W Power need 35 square centimeters or more of heat dissipation area.And following embodiment, purpose of design are guaranteeing power supply 5 In the case where installation space and heat dissipation effect, the heat dissipation area that 1W power needs is reduced, and then limit in 1 weight of radiator And reach optimal heat dissipation effect under the premise of the limitation of power supply 5.

As depicted in figs. 1 and 2, in the present embodiment, LED includes or only passive heat radiation component the passive heat radiation component It radiates only with the major ways such as free convection and radiation, without using active radiating subassembly, such as fan etc.. Passive heat radiation component in the present embodiment includes radiator 1, and radiator 1 includes radiating fin 11 and heat dissipation base 13, heat dissipation Fin 11 is radial uniformly circumferentially distributed along heat dissipation base, and connect with heat dissipation base 13.When LED light in use, LED Heat caused by chip 311 in thermo-conducting manner conducts at least part heat to radiator 1, and radiator 1 is at least A part of heat is scattered in outside air by way of heat radiation and convection current.The outer profile radially of radiator 1 is straight Diameter is when short transverse is upward, trend that the diameter of outer profile successively decreases or generally tapers off.It can preferably and lamps and lanterns with this Cooperation.Radiator 1 in the present embodiment when heat dissipation, at least partly it is hot be by the air of heat radiation to surrounding into Row heat dissipation.And an important factor for influencing heat radiation is then the radiance or radiation coefficient of object itself.For heat radiation device 1 Radiance or radiation coefficient, the surface of the radiator 1 in the present embodiment carries out respective handling, for example, in the table of radiator 1 Heat loss through radiation paint or electrophoretic coating is arranged in face, to improve the efficiency of heat loss through radiation, so that the heat of radiator 1 is quickly dispersed, Or the porous alumina layer of nanostructure is formed on the surface of radiating fin 11 by passing through anodic oxidation in the electrolytic solution, So one layer of alumina nanohole can be formed on the surface of radiating fin 11, while not increasing by 11 quantity of radiating fin Enhance the heat-sinking capability of cooling fin, for another example, the surface of radiating fin 11 coats thermal radiation resistance layer, with reduce radiating fin 11 with Heat radiation between radiating fin 11 is radiated the heat of radiating fin 11 more in air, and thermal radiation resistance layer can be used Paint or oxide covering etc., paint can be using common paint either heat loss through radiation paints.In order to further enhance dissipating for radiator 1 Thermal effect, for example, the radiator 1 in some embodiments includes each component of following mass percent: 0.5~0.7 part of silicon, iron 0.5~0.6 part, copper 0.05~0.3, manganese 0.3~0.7, magnesium 2.1~2.9, chromium 0.18~0.28, zinc 5.1~6.1, titanium 0.2~ 0.3 part；It preferably, further include aluminium, such as a small amount of or micro aluminium.It, can shape by using the zinc and magnesium of above-mentioned mass percent At the significant MgZn2 of strengthening effect, a zinc bianry alloy so that the thermal effectiveness of radiator 1 is much won, tensile strength will It can be greatly improved, and stress corrosion resistant and anti-strip corrosive power also will increase, heat-conductive characteristic is also larger, dissipates The good heat dispersion performance of hot device 1.In addition, radiator 1 can be made of low thermal resistance/high thermal conductivity material, such as aluminium alloy.? In some embodiments, radiator 1 can use the anodization 6061T6 aluminium of thermal conductivity k=167W/m.k., heat emissivity coefficient e=0.7 Alloy is made.In other embodiments, other materials, such as thermal conductivity k=225W/m.k., heat emissivity coefficient e=can be used 0.9 6063T6 or 1050 aluminium alloys.In other embodiments, other alloys, such as AL 1100 etc. still can be used.Another In some embodiments, the diecasting alloys with heat conductivity are used.In other embodiments, radiator 1 may include copper etc. Other metals.Figure 19 a is the schematic cross-sectional view of the radiator 1 in some embodiments.Shown in Figure 19 a, in some embodiments In, radiator 1 increases thermal column 12 compared to the radiator 1 in the present embodiment, specifically, radiator 1 include thermal column 12, Radiating fin 11 and heat dissipation base 13, thermal column 12 connect heat dissipation base 13, and the outer circle of thermal column 12 is arranged in radiating fin 11 Zhou Shang, radial to be uniformly distributed, the root of radiating fin 11 is connect on the excircle of thermal column 12 with heat dissipation base 13. The setting of thermal column 12 is played a supporting role to radiating fin 11, is prevented in process, 11 deflection of radiating fin.Work as LED Lamp in use, thermal column 12 or heat dissipation base 13 heat transfer that generates LED chip 311 to radiating fin 11, thermal column 12 There is the hollow structure of opening for both ends, such as thermal column 12 is cylinder-like structure；The material selection of thermal column 12 can be with heat dissipation Device 1 is consistent, is mainly preferred, for example, aluminum alloy material with the good material of heat conductivity so that radiator 1 realize it is light And effect at low cost.In other specific embodiments of the invention, the material of thermal column 12 can be also copper material, be dissipated with enhancing The heat-conductive characteristic of hot device 1 realizes the effect of express delivery heat transfer and heat dissipation.In other specific embodiments of the invention, thermal column 12 The settable one layer of heat-conducting layer of inner sidewall, heat-conducting layer with a thickness of 0.1mm~0.5mm, to further enhance heat dissipation effect.It dissipates The specific surface area of hot fin 11 is 4~10 times, preferably 6~8 times of the specific surface area of thermal column 12.Figure 19 b is using figure The top view of the LED light of the radiator of 19a.Such as Figure 19 b, when LED light is high-power illumination equipment, in the bottom of thermal column 12 Diameter r can be 10~15mm, i.e. thermal column central axes XX to thermal column inner surface distance can be 10~15mm.Due to heat dissipation There is radiating fin radial distribution in the outer surface of column, may range from being greater than using the edge of radiating fin as the internal diameter R of circumference Or be equal to 15 to less than 20mm, i.e., the distance at radiating fin edge to radiator central axes for more than or equal to 15 to less than 20mm.From the bottom of radiator to top, the internal diameter as defined by radiating fin can be the same or different.That is, Every radiating fin can be the short transverse along radiator 1 to the length (i.e. R-r) that the central axes XX of radiator extends and fix It is constant, can also along radiator 1 short transverse and change.The length that each radiating fin 11 extends along 1 inner surface of radiator Degree can be identical or not

As shown in Fig. 2, Fig. 4 and Fig. 5, there is a lower end surface 133, lower end surface 133 on the heat dissipation base 13 of radiator 1 In the other side of the heat dissipation base 13 with respect to radiating fin 11, that is to say, that lower end surface 133 and lamp plate 3 are located at the same side.This reality It applies in example, lower end surface 133 exceeds lamp plate 3 in the axial direction of LED light, that is to say, that in a state of use, lamp plate 3 is arranged downward When, the position of lower end surface 133 is lower than the position of lamp plate 3.In this way, which the position of lower end surface 133, can play guarantor to LED lamp plate 3 Shield effect, when colliding, can first collide lower end surface 133, and be unlikely to direct collision to lamp plate 3.Such as the institute of Fig. 2 and 4 Show, said from another angle, heat dissipation base 13 has depressed area 132, and lamp plate 3 is placed in depressed area 132, and depressed area 132 is circle Cylinder or rough cylindrical structure or frustum cone structure, if it is cylindrical structure, then the diameter of cylindrical body is less than heat dissipation The diameter of pedestal 13.The form of depressed area 132 is set in heat dissipation base 13, facilitates the glare effect for reducing LED light, mentions Rising user, (side wall of the inside of depressed area 132 blocks at least part of in the direct-view sense and comfort for using the product The lateral of LED chip 311 shines, to reduce dazzle).In some body embodiments, heat dissipation base 13 can also not have Depressed area guarantees heat dissipation effect, the preferably surface of heat dissipation base 13 to make lamp plate 3 and radiator 1 have Maximum Contact area For flat surface.

Figure 20 is the schematic cross-sectional view that LED light removes lampshade 4 in some embodiments.As shown in figure 20, in some embodiments In, lower end surface 133 is set as inclined surface (relative level tilts in LED light vertical hanging), when inclined surface is in LED light When radial upper flat inclination, the angle of inclined surface and horizontal plane is 3 to 4 degree, and in other embodiments, which is greater than 0 It spends and is less than or equal to 6 degree.When inclined surface LED light radially for curved inclination when, tangent plane to a surface and horizontal plane Angle is 3 to 4 degree, and in other embodiments, which is greater than 0 degree and is less than or equal to 6 degree.When lower end surface 133 tilts certain angle After degree (such as when the angle in end face 133 and external reflectance face 4302 be 120 degree to 180 degree when), can be used as external reflectance face 4302 Extension, and play certain reflex.

Figure 21 is the perspective view of the present embodiment LED light.As shown in Fig. 2 and Figure 21, the heat dissipation base 13 of radiator 1 is opposite The other side of lower end surface 133 has a back side 134, and 11 one end of radiating fin is extended to abut with the back side 134, therefore, heat dissipation 11 at least part of fin exceeds LED lamp panel 3 in the axial direction.In other words, on the axial direction of LED light, radiating fin 11 Position between the back side of heat dissipation base 13 134 and lamp plate 3 forms an extension 1101.By increasing the extension 1101, The heat dissipation area of radiating fin 11 can be increased, heat dissipation effect is improved, in addition, the setting of extension 1101, does not also increase additionally The whole height of LED light, to be conducive to the whole height of control LED light.

Figure 22 is the cross-sectional view of the LED light in the present embodiment.As shown in figure 22, in the present embodiment, the back of heat dissipation base 13 Face 134 be obliquely installed, that is to say, that under LED light hanging state, LED light radially inwardly on, the back side 134 to On be obliquely installed.For another angle, LED light in the radial direction, on the direction towards the axle center of LED, the back side 134 are gradually incremented by distance of the lamp plate 3 in the axial direction of LED light.Such set-up mode is conducive to the air of convection current along back Face 134 imports and takes away the heat at the back side 134, prevents the back side 134 from hindering the entrance of air.

As shown in Figure 2 and Figure 5, in a state of use, when lamp plate 3 is arranged downward, the position of lower end surface 133 is lower than lampshade 4 End face 44 and light output surface 43 position.In this way, pack, transport or when use state, in case of colliding, then Lower end surface 133 can be collided, can prevent from colliding lampshade 3 with this, and damages end face 44 or light output surface 43.

As shown in Figure 2 and Figure 5, it is surrounded between lower end surface 133 accommodating space (depressed area 132), lampshade 4 is placed in the accommodating In space, after lampshade is placed in accommodating space, the height of lampshade 4 is without departing from lower end surface 133.The height of LED light generally comprises lamp housing The height of 2 height, the height of radiator 1 and lampshade 4, in the present embodiment, the position that lampshade 4 is arranged is no more than radiator 1 Lower end surface 133, can control the height of whole lamp, will not additionally increase the setting of lampshade 4 by the height of whole lamp, from another point of view For, radiator 1 then add additional its part that can be radiated (where lower end surface 133 with respect to lamp plate 3 and under convex portion Point).In other embodiments, 4 part of lampshade can also be made beyond lower end surface 133.

As shown in Fig. 2, Fig. 4 and Fig. 5, end face 44 and lamp plate 3 keep spacing, so as to form a cavity 8, the cavity 8 difference Be connected to the second air inlet 1301 of the first air inlet 2201 of the first heat dissipation channel 7a and the second heat dissipation channel 7b, air from After the air hole 41 of end face 44 enters cavity 8, the first heat dissipation channel 7a and the second heat dissipation channel 7b is being entered.Cavity 8 Setting, so that having the process mixed in cavity, then further according to the first heat dissipation channel 7a and second after air enters Negative pressure (negative pressure the generated due to the temperature difference) situation of heat dissipation channel 7b and be allocated so that the distribution of air-flow is more reasonable.

In the present embodiment, using passive heat radiation (fan-free), the power (watt) and radiator 1 of LED light Heat dissipation area (square centimeter) ratio between 1:20~30, that is to say, that every watt need 20 square centimeters to 30 squares Centimetre heat dissipation area do and radiate.Preferably, the ratio of the heat dissipation area of the power Yu radiator 1 of LED light be 1:22~26 it Between.It is furthermore preferred that the ratio of the heat dissipation area of the power of LED light and radiator 1 is 25.First is formed in the inner cavity of lamp housing 2 to dissipate Passage of heat 7a, and the first heat dissipation channel 7a has the first air inlet 2201 in one end of lamp housing 2, and it is opposite another on lamp housing 2 End has heat release hole 222.Air enters from air inlet 2201, and is discharged from heat release hole 222, and with this, it is logical can to take away the first heat dissipation Heat in road 7a.Form the second heat dissipation channel 7b in radiating fin 11, heat dissipation base 13, the second heat dissipation channel 7b has the Two air inlets 1301, air is after the entrance of the second air inlet 1301, by the second heat dissipation channel 7b, finally from radiating fin 11 Between space outflow.With this, the heat that radiating fin 11 is radiated to surrounding air can be taken away, accelerates dissipating for radiating fin 11 Heat.By the setting of the first heat dissipation channel 7a and the second heat dissipation channel 7b, so that the efficiency of free convection is increased, so that dissipating The corresponding required heat dissipation area of hot device 1 reduces, and makes the ratio of the power of LED light and the heat dissipation area of radiator 1 20~30 Between.In the present embodiment, the weight of the whole lamp of LED light is less than 1.7kg, to LED light provide about 200W (300W hereinafter, it is preferred that , 250W or less) electric energy when, LED chip 311 is lit, and at least issues the luminous flux of 25000 lumens.

As shown in Figure 1, the weight of radiator 1 accounts for 50% or more of the weight of LED light in the present embodiment, in some embodiments In, the weight of radiator 1 accounts for the 55~65% of the weight of LED light, and at this point, the volume of radiator 1 accounts for the body of LED light totality Long-pending 20% or more, in the identical situation of thermal coefficient of radiator 1 (namely radiator 1 is whole uses same material, Or tend to identical different material using two kinds of thermal coefficients), volume shared by radiator 1 is bigger, can be used as heat dissipation Area is bigger.Therefore, to a certain extent, when the volume of radiator 1 accounts for 20% or more of the volume of LED light totality, radiator 1 There can be more available spaces, to increase its heat dissipation area.In the installation space in view of power supply 5, lampshade 4 and lamp housing 2 Afterwards, it is preferred that the volume of radiator 1 accounts for the 20%~60% of the volume of LED light totality, more preferably, the body of radiator 1 Product accounts for the 25%~50% of the volume of LED light totality, limited in LED light overall dimensions with this, and needs to guarantee power supply 5, lamp When the installation space of cover 4 and lamp housing 2, make 1 volume maximization of radiator, the more conducively design on LED light integral heat sink.

Figure 23 is the top view of the radiator 1 in the present embodiment.As shown in figure 23, in radiator 1 by above-mentioned volume Under limitation, at least part in radiating fin 11 extends at least two sheet bodies in the radial direction of LED light outward, this Two sheet body interval settings, by this set, make radiating fin 11 in fixed space, have bigger heat dissipation area, In addition, two sheet bodies extended, play a supporting role to the radiating fin 11, the support for keeping radiating fin 11 more firm On heat dissipation base 13, prevent radiating fin 11 from deflecting.

Specifically, as shown in figure 23, radiating fin 11 includes the first radiating fin 111 and the second radiating fin 112, the The bottom of one radiating fin 111 and the second radiating fin 112 in LED light axial direction is connect with heat dissipation base 13, the first heat dissipation Fin 111 is spaced each other with the second radiating fin 112 and interacts setting.The shape of second radiating fin 112 is the Y being divided into two Shape, by setting the structure being divided into two for the second radiating fin 112, so that radiator 1 is the case where occupying same volume Under, possess more heat dissipation areas.In the present embodiment, the first radiating fin 111 is spaced each other with the second radiating fin 112 and sets It sets, each first radiating fin 111 is circumferentially uniformly distributed, and each second radiating fin 112 is circumferentially uniformly distributed, adjacent Two the second radiating fins 112 are symmetrical arranged with one first radiating fin 111.In the present embodiment, the first radiating fin 111 with Spacing between second radiating fin 112 is 8~12mm, in general, to keep the air circulation in radiator 1 smooth, in turn Radiator 1 is set to play maximum heat dissipation effect, the line space design between each radiating fin should make every effort to tend to uniformity.

Figure 27 is the main view of the LED light in some embodiments.In LED light as shown in figure 27, radiating fin 11 is existed LED light is radially divided into two parts, i.e. the radian of first part 111a is less than second part 111b, first part 111a's Radian is less than second part 111b (radian herein refers to its radian on the profile of LED light).In other embodiments, The radian of first part 111a is greater than or equal to second part 111b.

Figure 28 is the main view of the LED light in some embodiments.As shown in figure 28, the two sides of radiating fin 11, which are equipped with, dissipates Hot item 16, wherein the heat sink strip 16 on one side is located on another side between adjacent two heat sink strip 16, that is to say, that two sides It is not overlapped on 16 transverse projection direction of heat sink strip on face.In the present embodiment, wherein on one side between adjacent two heat sink strip 16 Distance it is equal with the distance between two heat sink strip 16 adjacent on another side.The setting of heat sink strip 16 can increase radiating fin 11 whole surface areas, so that radiating fin 11 has the area that more can be used for heat radiation, so that heat radiation device 1 dissipates Hot property.In other embodiments, for the surface area for increasing radiating fin 11, wave can be set by 11 surface of radiating fin Shape.

As shown in figure 23, an at least radiating fin 11 is radially divided into two parts in LED light, and this two parts interval is set It sets, with this, runner can be formed in above-mentioned interval, so that air can carry out convection current in above-mentioned interval.In addition, above-mentioned Interval, when being projected at lamp plate 3 in the axial direction of LED light, the position of above-mentioned interval, corresponding to LED is arranged on lamp plate 3 The region of chip 311, thus, the heat dissipation effect to LED chip 311 can be improved in increased convection current herein.And it is whole from LED lamp For the limited viewpoint of weight, the San Re Sushi piece 11 in part carries out interval setting, reduces the dosage of San Re Sushi piece 11, drops Low 1 overall weight of radiator, provides LED light other abundant design spaces of components Yu.In other embodiments, in Figure 27 LED light, radiating fin 11 can also not have above-mentioned interval, that is to say, that radiating fin 11 is radially in LED lamp With whole structure.

Figure 24 is the enlarged diagram at the E in Figure 23.As shown in figure 23 and figure 24, specifically, radiating fin 11 wraps The first radiating fin 111 and the second radiating fin 112 are included, the first radiating fin 111 is divided into two parts in the radial direction of LED light, i.e., First part 111a and second part 111b, and this two parts is arranged at the radially interval of LED light, between interval formation Septal area 111c.First part 111a is radially located at the inside of second part 111b.Second radiating fin 112 has third portion 112a and Part IV 112b, Part IV 112b is divided to extend from Part III 112a, Part IV 112b compares Part III The position change of 112a in the circumferential, and Part IV 112b is located at the radial outside of radiator 1 with respect to Part III 112a, To improve space utilization rate, to have the area for the radiating fin 11 that can more make to radiate.As shown in figure 24, third portion 112a and Part IV 112b is divided to connect by changeover portion 113, changeover portion 113 has breeze way 113a and boot segment 113b, delays It rushes section 113a and boot segment 113b is arc shape, and the two forms " S " font or " S " font.Breeze way 113a's sets It sets, air as shown in figure 25 is avoided, to when radial outside convection current, to be hampered on 112 surface of the second radiating fin and form vortex, into And the case where hindering convection current, but the air of boot segment 113b guidance convection current continues along 112 surface of the second radiating fin and Xiang Jing It flows outward.

As shown in figure 24, one second radiating fin 112 includes a Part III 112a and two Part IV 112b, and two the Four part 112b are symmetrical arranged using Part III 112a as symmetry axis.In other embodiments, one second radiating fin 112 It can be including a Part III 112a and multiple Part IV 112b, such as three or four Part IV 112b (not shown), And the Part IV 112b of two sides of second radiating fin 112 in LED light circumferential direction is adjacent with the first radiating fin 111.

As shown in figure 24, direction pointed by any tangent line of boot segment 113b is staggered with spacer region 111c, avoids convection current Guided section of 113b of air guidance and enter spacer region 111c so that convection path is elongated and influences radiating efficiency.It is preferred that , direction pointed by any tangent line of boot segment 113b is located at the outside of spacer region 111c radially.In other embodiments, Direction pointed by least part tangent line of boot segment 113b is located at the inside of spacer region 111c radially.

As shown in figure 26, in other embodiments, direction pointed by least part tangent line of boot segment 113b is dropped into Spacer region 111c so that convection current is more abundant, but can accordingly increase the path of convection current.

As shown in figure 21, radiating fin 11 have lug boss 1102, lug boss 1102 with respect to radiating fin 11 surface and Protrusion, lug boss 1102 and contact radiator base 13 along the axially extending setting of lamp.In addition to this, 1102 surface of lug boss can The form of periphery is selectively used, or using rule or irregular polygon cylinder.The setting of lug boss 1102 can increase Add the surface area of radiating fin 11, increases radiating efficiency, in addition, lug boss 1102 also plays a supporting role to radiating fin 11, When preventing machine-shaping, 11 position of radiating fin deflects.In some embodiments, same radiating fin 11, in LED lamp Be radially divided into two parts, at least one corresponding lug boss 1102 is provided on each part, to the two portions Divide and plays a supporting role.In this present embodiment, lug boss 1102 is set to the end of radiating fin 11 radially in LED light, For example, set on the end of first part 111a and 111b (close to one end of spacer region 111c).

In some embodiments, when radiating fin 11 is integral, that is, does not have aforementioned compartment, lug boss 1102 also may be disposed at the surface (not shown) of San Re Sushi piece 11, to increase the surface area of radiating fin 11, and to radiating fin 11 play a supporting role, and when preventing machine-shaping, 11 position of radiating fin deflects.

Figure 29 is that the LED light of Fig. 1 removes the bottom view of lampshade 4.Figure 30 is the enlarged drawing in Figure 29 at A.Such as Figure 29 and figure Shown in 30, radiator 1 is sheathed on the radial periphery of inner sleeve 21, inner sidewall and lamp radially of the radiating fin 11 in LED light The inner sleeve 21 of shell 2 keeps spacing, so, on the one hand, when preventing work, inner sleeve expanded by heating, and by radiating fin 11 The extruding of inner sidewall and it is damaged, on the other hand, prevent the inner sidewall of radiating fin 11 from directly contact inner sleeve 21 and form heat biography It leads, is transmitted to the heat of radiating fin 11 inside inner sleeve 21, so that the electronic building brick of the power supply 5 in lamp housing 2 is influenced, finally, Radiating fin 11 has air in the spacing of the inner sidewall radially of LED light and the inner sleeve of lamp housing 2, and air itself has Heat-blocking action, therefore further prevent the power supply 5 in the heat affecting inner sleeve 21 of radiator 1.In other embodiments, to make to dissipate Hot fin 11 has radial supportive to inner sleeve 21, and the radial inner sidewall that may be alternatively provided as a part of radiating fin 11 connects The outer peripheral surface of inner sleeve 21 is touched and supports, and a part of radiating fin 11 then keeps spacing with inner sleeve 21, which can be applied to figure In 29 LED light.As shown in figure 29, lamp plate 3 includes third opening 32 so that the first air inlet 2201 and the second air inlet 1301 Expose.In some embodiments, in order to which the thermal energy for generating power supply 5 is quickly discharged, the sectional area of the first air inlet 2201 and The ratio of the sectional area of two air inlets 1301 is greater than 1 and to be less than or equal to 2.In some embodiments, in order to by lamp version 3 The thermal energy that LED is generated quickly is discharged, and the sectional area of the second air inlet 1301 and the ratio of the sectional area of the first air inlet 2201 are Greater than 1 and it is less than or equal to 1.5.

As shown in figure 21 and figure, radiating fin 11 the innermost position radially of LED light LED light radial direction It is located at the more lateral of heat release hole 222 on direction, that is to say, that most inner side and heat dissipation radially of the radiating fin 11 in LED light In the radial direction holding spacing of the position in hole 222 in LED light.In this way, when the heat that distributes of radiating fin 11 is upward, It will not gather at heat release hole 222, so that certain spacing can be kept with heat release hole 222, make to dissipate to avoid hot gas influence Temperature near hot hole 222 increases and influences the convection velocity of the first heat dissipation channel 7a (it is logical that convection velocity depends on the first heat dissipation The temperature difference of the road two sides 7a, when nearby temperature increases heat release hole 222, then convection velocity can accordingly slow down).

Figure 31 is the cross-sectional view of LED light in the present embodiment.Figure 32 is the enlarged drawing in Figure 31 at C.Such as Figure 31 and Figure 32 institute Show, radiator 1 includes radiating fin 11 and heat dissipation base 13, and heat dissipation base 13 has protrusion 135, and protrusion 135 is in LED lamp It is down-set on axial direction, protrusion 135 in the axial direction of LED light be more than lamp plate 3, and protrusion 135 lowermost position (under End face 133) height almost the same (on the axial direction of LED light) with the light output surface 43 of lampshade 4 or protrusion 135 Bottom only slight beyond the light output surface 43 of lampshade 4, for example, the bottom of protrusion 135 is more than that the light of lampshade 4 is defeated About 1 to 10 millimeter of surface 43 out so that radiator 1 LED light overall height dimension it is constant or slightly become larger in the case where, Increase volume, so that radiating fin 11 and heat dissipation base 13 have bigger heat dissipation area.

Protrusion 135 in the present embodiment is set as cyclic annular, and collectively defines a concave inward structure, light with heat dissipation base 13 Source and lampshade 4 are set in the concave inward structure, and are played a protective role to light source and lampshade 4, and the concave inward structure can play it is anti-dazzle The effect (the lateral light that concave inward structure has blocked light source) of light.

As shown in figure 32, heat dissipation base 13 has the first inner surface 136, and lampshade 4 has periphery wall 45, correct in lampshade 4 After being installed on LED light, the first inner surface 136 corresponds to the periphery wall 45 (the radial outside of lampshade 4) of lampshade 4, and table in first Face 136 and periphery wall 45 maintain gap, and when preventing LED light from working, 4 expanded by heating of lampshade is caused because of fever, thus by First inner surface 136 squeeze and it is damaged.Gap is kept with periphery wall 45 by the first inner surface 136, above-mentioned extruding can be reduced Or avoid the generation squeezed.It in other embodiments, also can be set into, in a part and first of the periphery wall 45 of lampshade 4 Surface 136 contacts, so that the first inner surface 136 plays support to the radial direction of lampshade 4, and other portions of the periphery wall 45 of lampshade 4 Divide and then keeps gap with the first inner surface 136.

As shown in figure 32, the first above-mentioned inner surface 136 is set as inclined surface, keeps certain angle with lamp plate 3, should Angle can be obtuse angle.Thus, when 4 expanded by heating of lampshade, when periphery wall 45 is against on inclined surface, the first inner surface 136 The extruding force in the outside radial to lampshade 4 is decomposed into a downward component and a horizontal component, facilitates reduction level To the extruding of lampshade 4 on direction (extruding of horizontal direction is the damaged main cause of lampshade 4).It, can be by periphery in other embodiments The circumferential surface of wall 45 is connected to (not shown) on the first inner surface 136, plays support or position-limiting action to lampshade 4 whereby, and due to First inner surface 136 is inclined surface, therefore can reduce the probability damaged due to expanded by heating is extruded of lampshade 4, can also be by periphery The end abutment of wall 45 can reduce the whole contact area with heat dissipation base 13 of periphery wall 45 on the first inner surface 136, with this, Avoid excessive heat transfer.

As shown in figure 32, heat dissipation base 13 also have the second inner surface 137, lampshade 4 have periphery wall 45, periphery wall 45 with First inner surface 136 holding gap, and the second inner surface of end abutment 137 of periphery wall 45, the first inner surface 136 and lamp plate 3 Angle less than the second inner surface 137 and lamp plate 3 angle, that is to say, that the second inner surface 137 compares the first inner surface 136 That comes is more flat, therefore in second inner surface of the end abutment of periphery wall 45 137, and when 4 expanded by heating of lampshade, in second Surface 137 is smaller to the lateral extrusion of lampshade 4.In the present embodiment, the angle of the second inner surface 137 and lamp plate 3 be 120 ° extremely Between 150 °, if angle is excessive, support radially effectively can not be played to lampshade 4 in LED light, and if angle Too small, one can not play the role of exerting a force to 4 reduction level of lampshade after 4 expanded by heating of lampshade, and two can not be in LED lamp Limitation and supporting role are played to lampshade 4 on axial, and at above-mentioned section, then it can be good at being balanced.In other realities It applies in example, the second inner surface 137 and the first inner surface 136 can be curved surface, the second inner surface 137 and the first inner surface 136 The distance of the axis of opposite LED light, gradually increases when downward, and still, on the whole, the second inner surface 137 is compared in first Surface 136 is more flat.

As shown in figure 33, convex wall 451, circumferentially-spaced row of the convex wall 451 in periphery wall 45 is arranged in the end of periphery wall 45 Cloth, convex wall 451 are that the part of second inner surface 137 of the practical contact in the end of periphery wall 45 can be subtracted by the setting of convex wall 451 The periphery wall 45 of small lampshade 4 and the contact area of heat dissipation base 13, avoid the heat of radiator 1 from being transmitted on lampshade 4, make lamp It is excessively high to cover 4 temperature.

As shown in Figure 31 and Figure 32, there is gap, and heat dissipation base 13 between the periphery wall 45 and heat dissipation base 13 of lampshade 4 On open up hole, which is connected to gap, and the other side then corresponds to radiating fin 11, that is to say, that air can be from Gap enters, and reaches radiating fin 11 by hole, increases convection current, convection path, then such as the arrow in Figure 32 with this Shown, which can form the 4th heat dissipation channel 7d of the present embodiment LED light.And at this point, outside due to convex wall 451 The circumferentially-spaced arrangement of peripheral wall 45, air can pass through from the gap between convex wall 451, to complete above-mentioned convection current.Such as Shown in Figure 34 and Figure 35, in other embodiments, the 4th heat dissipation channel 7d be may also set up in other positions, need to only be connected to LED lamp Region between lower section and radiating fin 11.For example, through-hole is arranged between the adjacent LED chip group 31 on lamp plate 3 315, and at this point, lampshade 4 may be configured as it is split type, that is, include multiple portions, to be located at different LED chipsets 31 respectively On, and through-hole 315 is located at the position between 4 two parts of lampshade, makes to be connected to below through-hole 315 and LED light with this, and upper Space between Fang Liantong radiating fin 11.

Radiator 1 in the present embodiment is an integral structure, and therefore, is conducive to reduce radiating fin 11 and heat dissipation base 13 Between thermal resistance.In other embodiments, for convenience of processing and forming, radiating fin 11 and heat dissipation base 13 can also be designed as Detachable.

In the present embodiment, 11 different location of radiating fin has different temperature, for example, close to LED chip 311 Part is 80 DEG C, and the temperature of the top of radiating fin 11 can slightly decline.With the difference of radiating fin interior temperature distribution, Heat dissipation capacity can be reduced to a few percent that radiating fin 11 is homogenization temperature, and we term it the efficiency of radiating fin, heat radiating fins The efficiency of piece 11 can be calculated by pyroconductivity and size.Heat transfer system of the efficiency of radiating fin 11 with radiating fin 11 Number, thickness, width and height are related.

In the present embodiment, it is the efficiency of heat radiation fin 11, sets 0.8~2mm for the thickness of radiating fin 11, it is excellent It is selected as 1~1.5mm.The thickness of radiating fin 11 and the ratio of length are not less than 1:80, it is preferred that the thickness of radiating fin 11 It is not less than 1:70 with the ratio of length, it is furthermore preferred that the thickness of radiating fin 11 and the ratio of length are 1:60~80.With this Reach balance between the heat dissipation effect of radiating fin 11, the weight and heat dissipation area of entire radiator 1, so that radiating fin 11 With preferably efficiency.The length of radiating fin 11 refers to the height in LED light axial direction herein.The present embodiment will radiate The width of fin 11 and the ratio of length are set greater than 1:1.5, it is preferred that the width of radiating fin 11 and the ratio of length Greater than 1:1.3, keep the heat transfer coefficient of radiating fin 11 more excellent, with the efficiency of heat radiation fin 11.Radiating fin 11 herein Length refers to the height in LED light axial direction, and width refers to the length of the radiating fin 11 of LED light radially.If Radiating fin 11 is not the direction structure of rule, then the width of radiating fin 11 can take the maximum of its average value or width The half of value adds the half of minimum value, and length can take the half of the maximum value of its average value or width to add minimum value Half.

H represents the heat transfer coefficient of radiating fin, and unit is [W/ (m²·℃)]；

V represents the flow velocity of convected air；

L represents the length of radiating fin on convection current direction；

It can be seen that by above-mentioned formula, when considering that heat at least part of radiating fin 11 passes through heat loss through convection, heat transfer system Number is affected by radiating surface setting situation.In addition, radiating fin 11, in heat transfer, thickness (sectional area) is also important Factor.The air temperature downstream of airflow direction can rise, and cooling capacity also accordingly declines, so, in heat dissipation of the same area On fin 11, if radiating fin 11, heat dissipation capacity are configured in such a way that length is shorter and laterally wider in the direction of the air flow Increase, in addition, the present embodiment controls the height of radiating fin 11, so that radiating fin 11 has under identical heat dissipation area More areas close to LED chip 311, to accelerate LED chip 311 to arrive the heat transfer of radiating fin 11.And radiating fin 11 Thickness also will affect the efficiency of radiating fin 11, and the thickness of radiating fin 11 is bigger, then efficiency is higher, but needs to balance again Weight and heat dissipation area.Taking into account the above, the ratio of the thickness of radiating fin 11 and length is set as not less than 1:80, and incite somebody to action The width of radiating fin 11 and the ratio of length are set greater than 1:1.5.

Figure 36 a~36m is the schematic diagram of various radiators 10 in some embodiments, can be applied to LED light, with replacement as schemed The radiator 1 of LED light shown in 1.

It is a kind of radiator 10 that the first preferred embodiment of the invention is proposed as shown in Figure 36 a.The radiator includes First radiating fin 101 and the second radiating fin 102.First circumference for being projected on heat dissipation base 130 is defined on radiator 1 R1 and the second circumference R2, and the second circumference R2 is greater than the first circumference R1.In on heat dissipation base 130, the first radiating fin 101 prolongs Stretching in column accommodating space, (for accommodating the part of inner sleeve 21, the column accommodating space that following other embodiments are previously mentioned is same The definition of the column accommodating space of this embodiment) periphery, and be no more than the second circumference R2, such as the first radiating fin 101 First circumference R1 is extended to by the periphery of column accommodating space just.Second radiating fin 102 extends the first circumference R1, but No more than the second circumference R2, such as the second circumference R2 is extended to just.In radially, the first radiating fin 101 and second dissipates Hot fin 102 is alternately arranged circumferentially, and every two second radiating fin 102 is symmetrically set with first radiating fin 101 It sets.First radiating fin 101 and the second radiating fin 102 have gap each other, pass through air-flow, and extend The path that air-flow flows between the first radiating fin 101 and the second radiating fin 102, with increase radiating fin 101,102 with Heat exchange amount between air-flow.

As shown in Figure 36 b, for the radiator 10 that is proposed of the second preferred embodiment of the present invention.Second preferred embodiment proposes 1 different from the first embodiment of radiator be, radiator 10 further include interval radiating fin 108, in heat dissipation base 130 On the second circumference R2 extended to by the periphery of column accommodating space, it is interconnected in circumferential direction and the first radiating fin 101, and It is interconnected with the second radiating fin 102 between the first circumference R1 and the second circumference R2, to form every two first heat radiating fin Piece 101 is symmetrical arranged with an interval radiating fin 108, with every two second radiating fin 102 with an interval radiating fin 108 are symmetrical arranged.

As shown in Figure 36 c, the radiator 10 that is proposed for third preferred embodiment of the present invention.Third preferred embodiment proposes Radiator 10 and the difference of the second preferred embodiment be that radiator 10 further includes third radiating fin 103, and is radiated Device 10 is further upper to define a third circumference R3 for being projected on heat dissipation base 103, and third circumference R3 is greater than the second circumference R2. In on heat dissipation base 103, the first radiating fin 101 extends to the first circumference R1, the second heat dissipation by the periphery of column accommodating space Fin 102 extends to the second circumference R2 by the first circumference R1, and third radiating fin 103 extends to third circle by the second circumference R2 All R3.In radially, the second radiating fin 102 and third radiating fin 103 are alternately arranged circumferentially, and every two Three radiating fins 103 are symmetrical arranged with second radiating fin 102.

The radiating fin of third preferred embodiment can be expanded further to the n-th fin, and n is the integer greater than two.Also It is to define the first circumference R1 to the n-th circumference on heat dissipation base 130 from small to large, the first radiating fin 101 is by column accommodating space Periphery extend to the first circumference R1, the n-th radiating fin extends to the n-th circumference by the (n-1)th circumference.In radially, (n-1)th dissipates Hot fin and the n-th radiating fin are alternately arranged circumferentially, and every two n-th radiating fin is with (n-1)th radiating fin It is symmetrical arranged.In addition, in 101 to the n-th radiating fin of the first radiating fin, it is at least a part of on heat dissipation base 130 with LED lamp panel 3 is overlapped (projection in LED light axial direction), to ensure that LED lamp panel 3 to radiating fin has direct heat conduction path.

As shown in Figure 36 c, between the n-th radiating fin and the (n-1)th radiating fin, in the configuration that is not overlapping in circumferential direction, It is exactly as shown in Figure 36 c, the lateral border of the (n-1)th radiating fin is no more than the (n-1)th circumference, and the n-th radiating fin is by the (n-1)th circle Start in week to extend.Such as second the lateral border of radiating fin 102 be no more than the second circumference R2, and third radiating fin 103 is by the Two circumference R2 start to extend and are no more than third circumference R3.

As shown in Figure 36 d, in the radiating fin of third preferred embodiment, the n-th radiating fin and the (n-1)th radiating fin it Between, in being also possible to the configuration that is overlapping in circumferential direction.Namely as shown in Figure 36 d, the lateral border of the (n-1)th radiating fin is more than (n-1)th circumference but the n-th circumference of no arrival, and the n-th radiating fin extends by the (n-1)th circumference.Such as second radiating fin 12 lateral border is more than the second circumference R2 but no arrival third circumference R3, and third radiating fin 13 is opened by the second circumference R2 Begin to extend.

In the embodiment of Fig. 1 to Fig. 2, the outer ledge of radiating fin 11 is arc-shaped.In other embodiments, it radiates The outer ledge of fin can wavy or radiating fin outer ledge can be linear or ladder-like.

As shown in Figure 36 e, the radiator 10 that is proposed by the 4th preferred embodiment.The radiator 10 that fourth embodiment proposes It is with the difference of Fig. 1, the radiating fin of radiator 1, such as the first radiating fin 101, outer ledge is perpendicular to heat dissipation bottom Seat 130, therefore, from perpendicular to axially direction from the first radiating fin 101, radiating fin be present square type (rectangle Or square), rather than outer ledge has the shape of upward tapered curve.First radiating fin 101 of square type, in identical height It under degree and width limitation, can effectively increase the area of the first radiating fin 101, increase the heat exchange with air-flow.

As shown in Figure 36 f, in a specific embodiment, the radiating fin of radiator 1, including the first radiating fin 101 to N-th radiating fin, 101 to the n-th radiating fin of the first radiating fin all have hole 101a, and hole 101a runs through radiating fin Two sides.For example, the first radiating fin 101 shown in Figure 36 f has the hole 101a through two sides.Through radiating fin Two sides hole 101a, can accelerate to radiate with the flowing of promoting air flow, meanwhile, reduce radiator 1 weight.

As shown in Figure 36 g, in a specific embodiment, the radiating fin of radiator 1, including the first radiating fin 101 to N-th radiating fin can be set to two stages drop.First stage 1011 extends on heat dissipation base 130, second stage 1012 extend the first stage 1011.Length of the first stage 1011 in LED light radially is greater than second stage 1012 in LED The length of lamp radially, height of the first stage 1011 in LED light axial direction, lower than second stage 1012 in LED light axial direction Height.Therefore, from perpendicular to axially direction from the first radiating fin 101 be present stairstepping.This set side Formula so that radiator 1 can guarantee lower part have it is enough for conduct LED chip 311 work caused by heat fin face Product, and top then mainly radiate and convection current by way of, thus from loss of weight angle, can suitably reduce fin area.

As shown in Figure 36 h, for the radiator 10 that is proposed of the 5th preferred embodiment of the present invention.5th preferred embodiment dissipates Hot device 10 is to be further configured with the second radiating fin 102, the outside of the second radiating fin 102 based on the 4th preferred embodiment Edge-perpendicular is in heat dissipation base 130, so that the second radiating fin 102 is that square type (rectangle or square) is presented.Meanwhile the Height of height of two radiating fins 102 on heat dissipation base 130 less than the first radiating fin 101, and the second radiating fin 102 with the first radiating fin 101 be alternately to configure.Therefore, the second radiating fin 102 can increase and air-flow heat-exchange surface Product, but due to highly smaller, it is possible to reduce the heat radiation between the first radiating fin 101 and the second radiating fin 102 is handed over It changes.In the present embodiment, if in the total quantity of the first radiating fin 101 and the second radiating fin 102 and the 4th preferred embodiment Radiating fin quantity it is identical (namely in the identical situation of number of fins), then the design of the present embodiment is then more advantageous In the loss of weight that radiator 10 is whole, and the heat radiation between the first radiating fin 11 and the second radiating fin 102 can be reduced Exchange.

As shown in Figure 36 i, for the radiator 1 that is proposed of the 6th preferred embodiment of the present invention.6th preferred embodiment dissipates Hot device 10 is further to configure outer support wall 106 and inner support wall 105 based on embodiment above-mentioned.The outer support wall 106 The outer ledge of the first radiating fin 101 is connected, the inner support wall 105 connects the inside edge of the first radiating fin 101, To prevent the deflection of the first radiating fin 101.As Figure 36 i is presented, radiator 10, outer support are observed down from above Wall 106 and inner support wall 105 are all that annulus shape is presented, and allow the first radiating fin 101 from radially connected.Outer support Wall 106 and inner support wall 105 can connect in heat dissipation base 130, also with regard to when extend vertically upper table in heat dissipation base 130 Face, outer support wall 106 only can also connect the first radiating fin 101 with inner support wall 105, the upper surface with heat dissipation base 130 Keep spacing distance.In the axial direction, height of the height of outer support wall 106 and inner support wall 105 less than the first radiating fin 11 Degree, to maintain air-flow in the radial direction unimpeded.Outer support wall 106 and inner support wall 105 can only select a configuration, it is not necessary to So simultaneously configured with outer support wall 106 and inner support wall 105.As shown in Figure 36 j, outer support wall 106 and inner support wall 105 Can be segmented setting, that is, supporting walls 106 are illustrated in addition, can be set as on the same circumference it is multiple equidistant or not etc. between Segmental arc 1061 away from arrangement, segmental arc 1061 are at least connected with two group of first radiating fin 101, can be further reduced pair with this The influence of convection current.

As shown in Figure 36 k, for the radiator 10 that is proposed of the 7th preferred embodiment of the present invention.7th preferred embodiment dissipates Hot device 10 is to modify the form of the first radiating fin 101 based on embodiment above-mentioned.In the 7th preferred embodiment, first Radiating fin 101 includes first part 101a, second part 101b and coupling part 101c.First part 101a and second Divide 101b to extend radial direction, and is interconnected by coupling part 101c.Wherein, first part 101a is accommodated empty by column Between periphery extend outwardly, second part 101b is prolonged further out by coupling part 101c connection first part 101a It stretches.Coupling part 101c is not parallel to radial direction, in a specific embodiment, coupling part 101c approximately along circumferentially extending or It is perpendicular to radial direction, and makes first part 101a and second part 101b interconnected radially, without in same diameter To on extension line.The configuration of coupling part 101c, can increase the area of the first radiating fin 11, to promote air-flow and The heat exchange amount of one radiating fin 11 can prevent the first heat radiating fin in addition, the setting of coupling part 101c, plays a supporting role The deflection of piece 11.

As shown in Figure 36 l and Figure 36 m, for the radiator 1 that the 8th preferred embodiment of the invention is proposed,.8th is preferably real The radiator 10 for applying example is to modify the form of the first radiating fin 101 based on embodiment above-mentioned.In the 8th preferred embodiment In, multiple concentric circles with different radii are defined on radiating bottom plate 130, the first radiating fin 101 is respectively in radiating bottom plate On 130, extended vertically by each concentric circles in radiating bottom plate 130.

In Figure 36 l, the first radiating fin 101 on each concentric circles is continuous kenel, that is, the first radiating fin 101 are presented cyclic annular kenel, and first radiating fin 101 is configured on each concentric circles.

In Figure 36 m, the first radiating fin 101 on each concentric circles is discontinuous kenel, that is, the first heat radiating fin Arcuation kenel is presented in piece 101, and the first radiating fin 101 of multiple arcuations is configured on each concentric circles, and with together On heart circle, there is gap, so that air-flow circulates radially between the first adjacent radiating fin 101.

In some embodiments, the radiator 1 has a central axes XX, using the central axes XX as the plane of normal A-A and central axes XX meets at an intersection point 91, and intersection point 91 is located at the column accommodating space of radiator 1.In some embodiments, The distance at edge of the central axes XX along plane A-A to radiating fin 11 is greater than zero, as shown in Figure 37 a to Figure 37 d.Scheming It is the center of circle with the intersection point 91 in the example of 37a, distance D1 is radius, and an imaginary circles are established on the plane A-A (such as Shown in Figure 37 a dotted line), radiator 1 has at least one radiating fin 11, and the imaginary circles and 11 edge of radiating fin interlock. When the radiator 1 has multiple radiating fins 11, the central axes of edge to the radiator 1 of the multiple radiating fin 1 have Identical distance D1, the imaginary circles and 11 edge of the multiple radiating fin all interlock.It is described to dissipate in some embodiments Hot device 1 has multiple radiating fins 11, and the edge of at least two radiating fins in the multiple radiating fin 1 is along plane A-A Distance D1 and D2 to the central axes XX of radiator is unequal, and it is the center of circle with the intersection point 91 that distance D1, which is less than distance D2, should Relatively short distance D1 be radius, established on the plane A-A imaginary circles (as shown in Figure 37 b dotted line), the imaginary circles and Distance is that 11 edge of radiating fin of D2 does not interlock, and the graphical representation of exemplary of the present embodiment is see Figure 37 b.

In some embodiments, the radiator 1 has multiple radiating fins 11, the side of the multiple heat radiating fin 11 Edge to distance D1, D2 of central axes XX of radiator 1, D3 ..., Dn (only showing D1, D2 and D3 in Figure 37 c) it is unequal, Distance D1 is less than distance D2, and it is the center of circle with the intersection point 91, using shortest distance D1 as radius, in institute that distance D2, which is less than distance D3, State and established on plane A-A an imaginary circles (as shown in Figure 37 c dotted line), the imaginary circles 30 and it is other be greater than most short square from D1 11 edge of radiating fin do not interlock, the graphical representation of exemplary of the present embodiment is see Figure 37 c.

In some embodiments, the radiator 1 has multiple radiating fins 11, the edge of the multiple heat radiating fin 11 Distance D1, D2 and D3 to the central axes XX of radiator 1 is unequal, and distance D1 is less than distance D2, and distance D2 is less than distance D3, It is the center of circle with the intersection point 91, using described distance D1, D2 and D3 as radius, establishes multiple imaginary circles on the plane A-A (as shown in Figure 37 d dotted line), partial virtual is round and 11 edge of part radiating fin does not interlock, partial virtual circle penetration portion Dividing radiating fin 11, the graphical representation of exemplary of the present embodiment is see Figure 16, using distance D1 as radius, the institute on the plane A-A The imaginary circles of foundation, and radiating fin 11 of the distance greater than D1 do not interlock；Using distance D2 as radius, the institute on the plane A-A The imaginary circles of foundation, penetration range are less than the radiating fin 11 of D2, and the heat radiating fin 11 with distance greater than D2 does not interlock；With distance D3 is radius, the imaginary circles established on the plane A-A, and penetration range is greater than the radiating fin 11 of D3.

Figure 38 a~38i is the top view of the radiator 1 in some embodiments, replaces the heat dissipation in Fig. 1 for convenience of description Device 1.As shown in Fig. 1 and Figure 38 a, radiator 1 includes heat-sink unit and heat dissipation base 13, and each heat-sink unit is along LED light Heat dissipation base 13 is extended axially in, the specific implementation of heat-sink unit is radiating fin 11, and heat-sink unit is radial equal It is evenly circumferentially distributed along heat dissipation base 13.The root of each heat-sink unit is connect with heat dissipation base 13.The inner side edge of heat-sink unit Edge defines a column accommodating space 14, and accommodating space 14 is for being arranged inner sleeve 21.When LED light in use, heat dissipation base 22 will The heat transfer that lamp plate 3 generates further is transmitted in outside air to heat-sink unit by heat-sink unit, to enhance heat dissipation. Lamp housing 1 is connected to radiator 1, and is generally the upper limb for being connected to heat-sink unit.The upper limb of multiple heat-sink units at least exists Part close to LED light axis is to cut flat with along radial, and define a flat joint face, and lamp housing 2 and heat-sink unit Upper limb corresponding fastener can be set, be connected to radiator 1 to allow the lower end of lamp housing 2 to be connected to joint face.

As shown in Figure 1, Figure 2 and shown in Figure 38 a, joint face above-mentioned radially defines one first section A 1, heat dissipation along the LED light Device 1 and 3 joint face of lamp plate are along LED light radial direction one second section A 2 of definition.In one embodiment, heat-sink unit is in the axis of LED light To the quantity for being projected on the first section A 1, less than heat-sink unit in LED light axis projection in the quantity in the second section.Also It is to say, in the axial direction, due to the upward convection current of air, heat-sink unit avoids being blocked by lamp housing 2 as far as possible, so that most of heat dissipation The upper limb of unit can be openly exposed in air, and form the heat dissipation channel not blocked by lamp housing 2, to reinforce dissipating The convection effect of hot cell.For other angles, heat-sink unit in LED light axis projection in the quantity of the first section A 1, it is small In heat-sink unit in quantity of the axis projection outside the first section A 1 of LED light, to reach above-mentioned technical effect.From heat dissipation For the area of the axis projection of unit, heat-sink unit in LED light axis projection in the area of the first section A 1, be less than and dissipate Hot cell is in area of the axis projection outside the first section A 1 of LED light, to reach above-mentioned technical effect.

As shown in Figure 38 a, radiator 1 defines multiple ring regions from inside to outside radially, and ring region is defined as possessing in circumferential direction The region of identical heat-sink unit quantity, in other words, with the heat-sink unit of different number in different ring regions, for example, The quantity for the heat-sink unit that ring region positioned inside has, less than the quantity of heat-sink unit that has of ring region in outside, and The quantity or area of axial upper ring region Chong Die with the first projection of section A 1 of LED light, be less than LED light axial direction above and second section The quantity or area of the ring region of face A2 projection overlapping.

More specifically, heat-sink unit may include having multiple first heat-sink units 15 and multiple second as shown in Figure 38 b (the first radiating fin 111 of the first heat-sink unit 15 and second heat-sink unit 16 and Figure 23 and Figure 24 herein of heat-sink unit 16 Using different naming rules and different mode classifications is used with the second radiating fin 112), in Figure 38 b, the first heat dissipation Unit 15 is the radiating fin of radially inner side, and the second heat-sink unit 16 is the radiating fin of radial outside.Wherein, the first heat dissipation 15 main projection of unit in be located inside ring region, and 16 main projection of the second heat-sink unit in be located at outside ring region, and The outer ledge of every one first heat-sink unit 15 extends two 16 (the first heat dissipation list of the second heat-sink unit along radial fork When first 15 outer ledges extend the second heat-sink unit 16, the first heat-sink unit 15 can be with the second heat-sink unit 16 and connect , it is also possible to disconnection, i.e. the first heat-sink unit 15 and the second heat-sink unit 16 radially keep spacing) so that second dissipates The quantity of hot cell 16 is greater than the quantity of the first heat-sink unit 15.Meanwhile first section A 1 be again the ring being projected on positioned inside Area, and the second section A 2 is projected on the ring region positioned at outside so that the first heat-sink unit 111 in LED light axis projection in interior The ring region of side, the second heat-sink unit 16 in LED light axis projection in the ring region in outside.Therefore, the first heat-sink unit 15 in The axis projection of LED lamp is in the quantity or area of the first section A 1, less than the second heat-sink unit 16 in the axis projection of LED light In the quantity or area of the first section A 1.

As shown in Figure 38 c and Figure 38 d, if the thickness value in the first heat-sink unit 15 is greater than the thickness of the second heat-sink unit 16 Value, close to the distance values of the first heat-sink unit 15 of LED light axis, is less than far from LED light axis because being radial arrangement The second heat-sink unit 16 in distance values.Match the thickness value of the first heat-sink unit 15 and the second heat-sink unit 16 is appropriate Set down, the first heat-sink unit 15 in the first section A 1 any circumference side length (Δ X1 summation) be equal to the second heat-sink unit 16 in Any circumference side length (Δ X2 summation) of second section A 2.Circumference side length refers to LED axis (and axis of radiator 2) For the center of circle, any imaginary circles cut through the arc total length of the first heat-sink unit 15 or the second heat-sink unit 16.

More specifically, the first heat-sink unit 15 or the second heat-sink unit 16 are all radiating fins, and radiating fin is radiating The radially radial distribution of device 1.Radiator 1 is divided into the first ring region C1 and the second ring region C2, radiator from inside to outside radially 1 further includes column holding area 14, and positioned at the inside of the first ring region C1, column holding area 14 is mainly used for accommodating part Power panel, and a heat dissipation channel is provided.Imaginary circles are established as the center of circle using the axis of radiator 1, when imaginary circles fall into the first ring region The arc total length that radiating fin is cut through when C1 is X1 (Δ X1 summation), and imaginary circles cut through radiating fin when falling into the second ring region C2 Arc total length be X2 (Δ X2 summation), then X1 < X2, and imaginary circles cut through arc total length and the week of imaginary circles of radiating fin Long ratio can allow radiating fin to have enough sectional areas between 0.06~0.2 to carry out heat transfer, but still can be with The distance values between radiating fin are maintained, to maintain convection channel size, and guarantee that the radiating fin under identical weight has foot Enough surface areas radiate to do.

Furthermore, it is understood that if radiating fin needs biggish sectional area to carry out heat transfer in the first ring region C1, such as The density that the LED chip 311 of lamp plate 3 is projected in the first ring region C1 is greater than the density (density herein for being projected on the second ring region C2 Refer to the distributed quantity of the LED chip 311 in the unit area of ring region), and X1 and X2 account for the perimeter of place imaginary circles respectively Ratio R a1 and Ra2, Ra1 > Ra2 or X1 > X2 can be set at this time so that radiating fin have in the first ring region C1 it is biggish Sectional area can maintain the distance values between radiating fin in the second ring region C2 to carry out heat transfer, to maintain to circulation Road size.

On the contrary, if radiating fin needs biggish sectional area to carry out heat transfer, such as lamp plate 3 in the second ring region C2 LED chip 311 be projected in the density of the first ring region C1 and be greater than and be projected on the density of the second ring region C2, and X1 and X2 are accounted for respectively The ratio R a1 and Ra2 of the perimeter of place imaginary circles can set Ra1 < Ra2 or X1 < X2 at this time, so that radiating fin is Two ring region C2 have biggish sectional area to carry out heat transfer, and between the first ring region C1 can maintain between radiating fin Away from value, to maintain convection channel size.

If the density that the LED chip 311 of lamp plate 3 is projected in the first ring region C1, which is equal to, is projected on the close of the second ring region C2 Degree, then can set Ra1=Ra2 or X1=X2, so that radiating fin has approximately in the first ring region C1 and the second ring region C2 Heat conduction efficiency avoids the temperature difference for occurring too big on lamp plate 3.

As shown in Figure 38 e, in some embodiments, only the outer ledge of the first heat-sink unit 15 of part is along radial direction Fork extends two the second heat-sink unit 16 or the first heat-sink unit 15 with the second heat-sink unit 16 is respectively independently to set It sets and has different arranging densities.In the radiator 1 of Figure 38 f, the first heat-sink unit 15 in LED light axis projection in The quantity or area of one section A 1, greater than the second heat-sink unit 16 in LED light axis projection in the first section A 1 quantity or Area.Similarly with the airborne of multiple ring regions from the point of view of, just will form the first heat-sink unit 15 in the axis projection of LED light In the quantity or area of the ring region of inside, greater than the second heat-sink unit 16 in LED light axis projection in outside ring region number Amount or area.

Similarly, in Figure 38 f, if thickness value in the first heat-sink unit 15 is less than the thickness of the second heat-sink unit 16 Value, the distance values of the first heat-sink unit 15 can be greater than the distance values in the second heat-sink unit 16.In the first heat-sink unit 15 and Under the thickness value configuration appropriate of two heat-sink units 16, the first heat-sink unit 15 is in any circumference side length etc. of the first section A 1 In the second heat-sink unit 16 in any circumference side length of the second section A 2.

As shown in Figure 38 f, in a specific embodiment, only the outer ledge of the first heat-sink unit 15 of part is along diameter Extend two the second heat-sink units 16 or the first heat-sink unit 15 to fork and the second heat-sink unit 16 is respective independence Setting, but present and correspond configuration along what same radial line extended, so that the first heat-sink unit 15 is in the axial direction of LED light Be projected on the quantity of the first section A 1, equal to the second heat-sink unit 16 in LED light axis projection in the number of the first section A 1 Amount.Radiator 1 is equally divided into two from inside to outside radially with ring region, the first heat-sink unit 15 is thrown in the axial direction of LED light Shadow can be equal to the second heat-sink unit 16 in the axis projection of LED light in the ring region in outside in the quantity or area of the ring region of inside Quantity or area.

As shown in Figure 38 f, more specifically, if the thickness value of the first heat-sink unit 15 is equal to the thickness of the second heat-sink unit 16 Angle value, and the distance values of the first heat-sink unit 15 be equal to the second heat-sink unit 16 in distance values, then the first heat-sink unit 15 in Any circumference side length of first section A 1 is equal to the second heat-sink unit 16 in any circumference side length of the second section A 2.

As shown in Figure 38 a and Figure 38 g, the ring region of radiator 1 can be extended to more by two, such as radiator 1 also wraps Third ring region C3 is included, positioned at the outside of the second ring region C2, the arc that radiating fin is cut through when imaginary circles fall into third ring region C3 is total Length X3 (Δ X3), and X1 < X2 < X3.If ratio R a1, Ra2 and R3 of the perimeter of imaginary circles where X1, X2 and X3 are accounted for respectively, The value of then Ra1=0.06~0.13, Ra2=0.1~0.18, Ra3=0.12~0.16, and Ra1, Ra2 and Ra3 are each fallen within In 0.06~0.2 section, allows radiating fin there are enough sectional areas to carry out heat transfer, but still can maintain scattered Distance values between hot fin to maintain convection channel size, and guarantee that the radiating fin under identical weight has enough tables Area radiates to do.

As shown in Figure 11, Figure 38 h and Figure 38 i, definition has chip setting area (substantially 311 institute of LED chip on lamp plate 3 Region), the chip setting area on lamp plate 3 is arranged in LED chip 311.Chip setting area at least part is fallen into In the projection of second ring region C2 or third ring region C3, specifically, chip setting area system is overlapped in as far as possible on radiator 1 Positioned at outside ring region, so that corresponding radiating fin (the first heat-sink unit 111 or the second heat-sink unit 112), is located at and dissipates The lateral border of hot pedestal 13 and have preferable convection current cooling effect, and more heat-sink units (heat dissipation list in outside can be corresponded to First quantity is more than the heat-sink unit of inside).In one embodiment, chip setting area at least 80% falls into the second ring In the projection of area C2 and/or third ring region C3；Preferably, chip setting area entirely falls in the second ring region C2 and/or third ring In the projection of area C3, as shown in Figure 38 i.

If radiating fin is in the radially radial distribution of radiator 1, and thickness is uniform, when imaginary circles fall into the first ring region The quantity N1 of the radiating fin cut through when C1, imaginary circles cut through the quantity N2 of radiating fin, and N1 < when falling into the second ring region C2 N2 can substantially reach X1 < X2 at this time.Similarly it is located at the outside of the second ring region C2, imaginary circles in consideration third ring region C3 The quantity N3 of radiating fin, and N1 < N2 < N3 are cut through when falling into third ring region C3, and essence reaches X1 < X2 < X3.This Under configuration, the configuration mode as shown in Figure 38 h is still can be used in chip setting area.

Figure 39 is the top view of the radiator 1 in the present embodiment.As shown in figure 39, radiator 1 includes multiple first heat dissipations Unit 15 and multiple second heat-sink units 16 (the first heat-sink unit 15 and second heat-sink unit 16 and Figure 23 and Figure 24 herein The first radiating fin 111 and the second radiating fin 112 using different naming rule and use different mode classifications).The One heat-sink unit 15 and the second heat-sink unit 16 are all radiating fins.It is radial that every one first heat-sink unit 15 is included in radiator 1 The first radiating fin 15a and one of upper radial distribution first passage 15b radially, first passage 15b are to be located at two the The gap of the part of one heat-sink unit 15a.Radiator 1 defines multiple ring regions, i.e. the first ring region C1 from inside to outside radially, the Two ring region C2 and third ring region C3, and the first passage 111b for being located at different ring regions has different in width.In same ring region, First passage 15b positioned at outside, width are greater than the width of the first passage 15b positioned inside.

In Figure 39, the first heat-sink unit 15 can take different Density and distributions in different ring regions, and first dissipates First radiating fin of hot cell 15 is actually that can extend between at least two ring regions, so that the first heat-sink unit 15 Staggeredly interspersed configuration is presented, so that the first passage 15b for being located at different ring regions has different in width.Or first dissipate Hot fin extends between at least two ring regions, and discontinuous in the intersection of two ring regions.

As shown in figure 39, every one second heat-sink unit 16 including two second radiating fin 16a and is formed in two second heat dissipations The side of second channel 16b between fin, second channel 16b towards 1 axis of radiator is to be not attached to open or close.Its In, the first heat-sink unit 15 can be from the second heat-sink unit 16 positioned at different ring regions, and where the second heat-sink unit 16 Ring region, positioned at the outside of the ring region where the first heat-sink unit 15.

As shown in figure 39, in the case where the side of second channel 16b towards 1 axis of radiator is closed situation, two second dissipate Hot fin 16 can be the outer rim for extending the first radiating fin 15, the closed end of the second radiating fin and the first radiating fin Outer rim be located in same radial line, but be not attached to and have a gap, form additional channel.

LED can generate heat when luminous.LED heat transfer design when, crucial parameter first is that thermal resistance, thermal resistance It is smaller, then it is better to represent heat transfer.The influence factor of thermal resistance substantially has length, heat-conducting area and the Heat Conduction Material of thermally conductive pathways Thermal coefficient.It is formulated as follows:

Thermal resistance=thermally conductive pathways length L/ (heat-conducting area S* thermal coefficient).

That is, thermally conductive pathways are smaller, heat-conducting area is bigger, thermal coefficient is higher, then thermal resistance is lower.

As shown in figure 29, in the present embodiment, lamp plate 3 includes an at least LED chip group 31, and LED chip group 31 includes LED Chip 311.

As shown in figure 29, in the present embodiment, lamp plate 3 is divided into interior border, mesosphere and outlet in the radial direction thereof, and LED chipset 31 is set to interior border, mesosphere and outlet accordingly, that is to say, that interior border, mesosphere and outlet are equal It is provided with corresponding LED chip group 31.For another angle, lamp plate 3 includes three LED chip groups 31, these three LED chips Group 31 is respectively arranged on interior border, mesosphere and the outlet of lamp plate 3.LED chip group in interior border, mesosphere and outlet 31 include at least one LED chip 311.As shown in figure 29,4 dotted lines, the range limited between two dotted lines of outermost are limited For the range of outlet, the range limited between two dotted lines of most inner side limits between intermediate two dotted lines as the range of interior border Range be mesosphere range.In other embodiments, lamp plate 3 can also be divided to and be enclosed for two, and LED chip group 31 is set accordingly In this two circle.

As shown in figure 29, set on same circumference or several LED chips 311 being located substantially on same circumference composition one LED chipset, and lamp plate 3 is equipped with several groups LED chip group 31, in same LED chip group 31, two adjacent LEDs chip 311 center is away from for L2, any LED chip 311 of any group of LED chip group 31, in adjacent LED chip group 31 The center of an immediate LED chip 311 is away from for L3, meeting following relationship, and: L2:L3 is 1:0.8~2, preferably L2: L3 is 1:1~1.5.Make the distribution of LED chip 311 more uniform with this, to achieve the purpose that uniform in light emission.

Figure 40 is the cooperation schematic diagram of radiating fin 11 and LED chip 311 in the present embodiment.As shown in Figure 29 and Figure 40, In the present embodiment, when an at least radiating fin 11 is along axis projection to the 31 place plane of LED chip group of LED light, the heat radiating fin The projection of piece 11 at least contacts at least one LED chip 311 in LED chip group 31.Specifically, an at least radiating fin 11 When along axis projection to the 31 place plane of LED chip group of LED light, the projection of the radiating fin 11 at least contact interior border, in Between enclose or outlet LED chip group 31 at least one LED chip 311.As shown in figure 40, radiating fin 11 in figure One LED chip 311 of the contact projection, as indicated by the arrows in the figure, for the heat dissipation path of the LED chip 311 and the radiating fin 11, As shown in figure 41, the projection of radiating fin 11 does not contact the LED chip 311 in diagram in figure, as indicated by the arrows in the figure, for this The heat dissipation path of LED chip 311 and the radiating fin 11, it will be evident that the heat dissipation path of the latter is farther compared with the former, thus, By making the projection of radiating fin at least contact at least one of the LED chip group 31 of interior border, mesosphere or outlet LED chip 311, makes the thermally conductive pathways of the LED chip 311 shorten, and with this thermal resistance is reduced, more conducively heat transfer.It is preferred that , when radiating fin 11 is along axis projection to the 31 place plane of LED chip group of LED light, any one radiating fin 11 (first Radiating fin 111 or the second radiating fin 112) projection at least contact LED chip group 31 at least one LED chip 311。

In the present embodiment, the quantity for the radiating fin 11 that the LED chip group 31 of outlet corresponds to is greater than the LED of interior border 11 quantity of radiating fin corresponding to chipset 31.Signified correspondence herein, refers to LED light axial direction projection relation, than If the LED chip group 31 of outlet is when the axis projection of LED light is at radiating fin 11,31 institute of LED chip group of outlet What is corresponded to is the radiating fin 11 of the radiator 1 of opposite exterior lateral sides.The LED chip group 31 of the outlet at this place has most The LED chip 311 of amount, therefore when radiating to it, need more radiating fins 11 (area) to radiate to do.

As shown in Fig. 1 and Figure 29, lamp plate 3 has an inboard boundary 3002 and an outer boundaries 3003, inboard boundary 3002 And after outer boundaries 3003 upwardly extend in LED light axial direction, a region is formed, radiating fin 11 is located in the region Area is greater than the area being located at outside the region.In this way, make the radiating fin 11 of radiator 1 is most of to both correspond to lamp plate 3 (thermally conductive pathways are short) utilization rate of radiating fin 11 can be improved with this, increase effectively the leading to LED chip 311 of radiating fin 11 Heat area.

As shown in Fig. 3, Fig. 5 and Figure 29, reflection region 3001, light is arranged in interior border to the region between 3 outer rim of lamp plate The light that reflecting region 3001 can be reflected towards to light output surface 43, with this, can reduce light in LED light axial direction with Loss on the opposite direction of light direction increases whole luminous intensity out.

As shown in figures 4 and 9, lamp plate 3 opens up third opening 32, third opening 32 respectively with the first heat dissipation channel 7a and the Two heat dissipation channel 7b connection, that is to say, that third opening 32 while space and lamp between the radiating fin 11 of radiator 1 The cavity of shell 2 is connected to, to make to form cross-ventilation outside the cavity and LED light in the space and lamp housing 2 between radiating fin 11 Path.Third opening 32 is in the inside for being radially located at interior border of LED light.Therefore, reflection region 3001 will not be occupied Space, and influence reflection efficiency.Specifically, third opening 32 is set to the region at the center of lamp plate 3, and the first air inlet 2201 and second air inlet 1301 respectively from air inlet at same opening (third opening 32), that is, the air of convection current passes through the After three openings 32, the first air inlet 2201 and the second air inlet 1301 are being entered.Third opening 32 is provided in lamp plate 3 The region of the heart makes the first air inlet 2201 and the second air inlet 1301 that can share the entrance of an air inlet, therefore, can avoid accounting for With the region that lamp plate 3 is excessive, so that the area in the region of the setting LED chip 311 of lamp plate 3 be avoided to subtract because opening up multiple holes It is few.On the other hand, inner sleeve 21 corresponds to third opening 32, therefore when air inlet, the air of convection current plays heat-blocking action, that is, prevents Temperature inside and outside inner sleeve 21 influences each other.In other embodiments, if the first air inlet 2201 and the second air inlet 1301 In different positions, then third opening 32 is settable multiple, to correspond to the first air inlet 2201 and the second air inlet 1301, tool Body, as shown in figure 42, the settable regions such as between 3 middle part of lamp plate, outside or LED chip 311 of third opening 32, with this To correspond to the first air inlet 2201 and the second air inlet 1301.

As shown in figure 29, in an embodiment, in inner ring, during the axle center of two adjacent LED chips 311 and LED light is formed Heart angle A, in mesosphere, the axle center of two adjacent LED chips 311 and LED light forms central angle B, and the angle of central angle B is small In the angle of central angle A.In outer ring, the axle center of two adjacent LED chips 311 and LED light forms central angle C, central angle C Angle be less than central angle B angle.For example, therefore outer ring has LED chips 311 more more than mesosphere, because This, in outer ring the spacing of adjacent LED chip 311 be unlikely to the LED chip 311 more adjacent than in mesosphere spacing it is too many greatly, Even, between the two away from can be close to or equal, thus, the arrangement of LED chip 311 can be more uniform, enables to obtain light more Uniformly.In other words, LED chip group 31 is equipped with several groups, and each group is set on lamp plate 3 in the form of cricoid, relatively The angle of the formed central angle in axle center of adjacent two LED chip 311 and LED light of the LED chip group 31 of inside is greater than The angle of the formed central angle in axle center of adjacent two LED chip 311 and LED lamp of the LED chip group 31 of opposite more lateral Degree.That is, the LED chip group 311 of more lateral has more LED chips compared to the LED chip group 311 of inside 311, with the LED core of the spacing of adjacent two LED chip 311 of this LED chip group 31 for making more lateral and opposite inside 311 spacing of adjacent two LED chip of piece group 31 is more nearly, thus, the arrangement of LED chip 311 can be more uniform, makes It is more uniform to show that light is able to.

As shown in figure 40, insulating coating 34 is arranged in 3 upper surface of lamp plate, which is configured to high reflectance, Material with high reflectivity in the prior art, such as heat-conducting silicone grease can be used.When insulating coating 34 is arranged, insulating coating 34 are applied to the edge of lamp plate 3, and the distance at lamp plate 3 radially outermost LED chip 311 to 3 edge of lamp plate is greater than 4mm, Preferably, the distance at outermost LED chip 311 to 3 edge of lamp plate is greater than 6.5mm and is less than 35mm on lamp plate 3.It, can with this Guarantee outermost LED chip 311 and radiator 1 creepage distance, prevent outermost LED chip 311 and radiator 1 sparking and Influence personal safety.In addition, insulating coating 34 plays certain heat-blocking action, the temperature mistake of lampshade 4 for making to contact is avoided It is high and deform.

Figure 43 is the schematic diagram of the lamp plate 3 in the present embodiment.As shown in figure 43, in the present embodiment, LED chip group 31 is set At least two groups are equipped with, at least two groups LED chip group 31 is successively arranged in the radial direction lamp plate 3, each group of LED chip group 31 include at least one LED chip 311, any LED chip in the wherein one group of LED chip group 31 of lamp plate 3 radially Any LED chip 311 of the 311 another group LED chip groups 31 radially adjacent with lamp plate is submitted in the radial direction of lamp plate 3 Mistake setting, that is to say, that different in being radially located at for LED light between the LED chip 311 of different LED chip groups 31 Direction, that is, any one line for originating in LED light axis and extend LED light radial direction such as switches to two or more LED chips 311, then it can switch to the different location of this two or more LED chip 311, that is, two or more LED cores will not be switched to The same position of piece 311.Thus, it is assumed that 3 surface of lamp plate have convection current, air in the radially convection current of lamp plate 3, by Relationship in air circulation path, on circulation path, air and the contact of LED chip 311 are more abundant, so that heat dissipation effect Fruit is more preferable.In addition, for illumination effect, the arrangement mode of this LED chip 311, the more conducively uniformity of light out.

In the present embodiment, there is open area 312 in same LED chip group 31 between two adjacent LED chips 311, To allow air to flow between LED chip 311, generated heat when LED chip 311 works is taken away with this.And 3 diameter of lamp plate Two groups of adjacent LED chip groups 31 upwards, wherein in one group of LED chip group 31 between any two adjacent LED chips 311 Open area 312 and another group of LED chip group 31 in open area 312 between any two adjacent LED chips 311 What it is in lamp plate 3 is radially staggered, and be interconnected.Thus, it is assumed that air lamp plate 3 radially convection current, by Relationship in air circulation path, on circulation path, air and the contact of LED chip 311 are more abundant, so that heat dissipation effect Fruit is more preferable.If two groups of radially adjacent LED chip groups 31 of lamp plate 3, wherein any two phases in one group of LED chip group 31 Open area 312 between adjacent LED chip 311 and any two adjacent LED chips 311 in another group of LED chip group 31 Between open area 312 in lamp plate 3 be radially that in the same direction, then air is just directly along lamp plate Radial Flow, On circulation path, air contact with LED chip 311 is reduced, and is unfavorable for the heat dissipation of LED chip 311.

For example, LED chip group 31 is provided with three groups, and sets gradually along the radial direction of lamp plate 3, this three groups corresponding In LED chipset arbitrary open area 312 lamp plate 3 in the radial direction not in the same direction.Optimize lamp plate 3 with this The circulation path of the convection current on surface, improving heat radiation efficiency.

In some applications, LED has a light distribution region when luminous below LED light, indicates light source each The light distribution in a space.In the light source design of LED light, it is desirable to which light distribution region concentrates on a certain region, to improve part Brightness.

Figure 44 a~44f is the schematic diagram of the lamp plate 3 in some embodiments.As shown in Figure 44 a and 44b, lamp plate 3 includes matching It is set to the first area 35 for LED chip group 31 to be arranged, is located at 35 inside of first area in the radial direction in lamp plate 3 Second area 36 and the third region 37 for being located at 35 more lateral of first area in the radial direction in lamp plate 3, first area 31 limit The installation region of LED chip 31.It is settable on the first area 35 of lamp plate 3, second area 36 and third region 37 that there is reflection The insulating coating 34 of rate.

As shown in Figure 44 a and 44b, third region 37 lamp plate 3 in the radial direction far from first area 35 when, third area Domain 37 is gradually incremented by with the spacing of first area 35 in the axial direction, and therefore, the surface in third region 37 forms one and is located at LED core The external reflectance region 371 in the outside of piece group 31, thus when LED chip group 31 is worked generated at least partly light guide to Light output surface 43 can play the role of optically focused with this, concentrate light to a certain region.

As shown in fig. 44b, second area 36 lamp plate 3 in the radial direction far from first area 35 when, second area 36 Gradually it is incremented by with the spacing of first area 35 in the axial direction, therefore, the surface of second area 36 forms one and is located at LED chip group The internal reflection region 361 of 31 insides, thus when LED chip group 31 is worked generated at least partly light guide it is defeated to light Surface 43 out can play the role of optically focused with this, concentrate light to a certain region.

The interior reflective surface on the internal reflection region 361 on lamp plate 3, external reflectance region 371 and lampshade 4 in above-described embodiment 4301, external reflectance face 4302 can arbitrarily arrange in pairs or groups, and realize various optical effects.Such as can only be arranged external reflectance face 371 or 4302, or interior reflective surface 361 or 4301 is only set, or one of setting external reflectance face 371 or 4302 and interior reflective surface One of 361 or 4301.

As shown in Figure 44 a and Figure 44 b, internal reflection region 361 or external reflectance region 371 be straight surface and with the firstth area Domain 35 is angled, or is arc surface.

In some embodiments, also it can specifically go out light side by adjusting the setting direction of LED chip 311 to adjust it To.Specifically, the structure of adjustable lamp plate 3, to make LED chip 311 that there is different light-out effects.For example, such as Shown in Figure 44 c, in some embodiments, lamp plate 3 includes the first area 35 for being configured for setting LED chip group 31, in lamp Plate 3 is located at first area positioned at the second area 36 of 35 inside of first area and in lamp plate 3 in the radial direction in the radial direction The third region 37 of 35 more laterals.There is several LED chip groups 31, radial direction of several LED chip groups 31 in lamp plate 3 on lamp plate 3 Upper configuration.In the present embodiment, at least one of group of LED chip group 31 is set on third region 37, and third region 37 is opposite First area 36 is in an angle, and after at least one set of LED chip group 31 is set to third region 37, light-emitting angle changes, and can be in Light distribution can be changed with this in existing different light-out effect.

Similarly, at least one of group of LED chip group 31 is set on second area 36, and 36 opposing first regions of second area 36 be in an angle, and after at least one set of LED chip group 31 is set to second area 36, light-emitting angle changes, and can present different Light distribution can be changed with this in light-out effect.

For the lamp plate 3 shown in Figure 44 c, LED chip group 31 is equipped with three groups, positioned at radially outermost of lamp plate 3 LED chip group 31 is set on third region 37, and lamp plate 3 is radially in the LED core in the middle position of three groups of LED chip groups 31 Piece group 31 is set on first area 35, and is located at the innermost LED chip group 31 of lamp plate 3 radially and is set to second area 36 On.

In above-described embodiment, second area 36 and third region 37 can be the specific area for being used to be arranged LED chip 311 Domain, the corresponding second area 36 of each LED chip 311 or third region 37.Second area 36 and third region 37 can also be with It is a whole region, the LED chip 311 of same group of LED chip group 31 is all set on second area 36 or third region 37.

It as shown in fig. 44d,, can be in LED chip 311 in order to improve the light efficiency of LED chip 311 in some embodiments Layer of silica gel 313 is arranged in surface, is respectively provided with individual layer of silica gel 313 in each LED chip 311, layer of silica gel 313 is far from LED chip 311 surface is set as the arcwall face of evagination, so that layer of silica gel 313 plays the role of similar lens, sends out from LED chip 311 Light out plays the role of optically focused, so that light-out effect is more preferable, conducive to the promotion of illumination.In addition, the setting of layer of silica gel 313, it can The efficiency (increasing its swept area) of the heat radiation of LED chip 311 is promoted, in favor of the heat dissipation of LED chip 311.

As shown in Figure 44 e, in some embodiments, light source includes lamp plate 3, LED chip 311 and layer of silica gel 313, the silicon Glue-line 313 includes the second layer of silica gel 3132 set on first layer of silica gel 3131 on 3 surface of lamp plate and set on 311 surface of LED chip. The wherein setting of the first layer of silica gel 3131, keeps lamp plate 3 not exposed, and lamp plate 3 is isolated from the outside, to realize the exhausted of lamp plate 3 Edge processing.Second layer of silica gel 3132 has the arcwall face of an evagination, so that the second layer of silica gel 3132 plays the work of similar lens With playing the role of optically focused to LED chip 311, so that light-out effect is more preferable, conducive to the promotion of illumination.It is set in layer of silica gel 313 When setting, the first layer of silica gel 3131 and the second layer of silica gel 3132 are an integral structure composition, can prevent dust with this and enter, At this point, the setting of lampshade 4 can be saved, while the promotion for being conducive to light efficiency (is arranged lampshade 4 and inevitably reflects a part Light causes light loss).When LED is encapsulated, including chip, fluorescent powder and silica gel, chip, fluorescent powder and layer of silica gel from inside to outside with This setting, as shown in Figure 44 f, in some embodiments, can directly save silica gel when encapsulation, and directly outside fluorescent powder 314 Layer of silica gel 313 is set, that is to say, that fluorescent powder 314 is arranged outside chip 3111, and layer of silica gel is directly arranged outside fluorescent powder 314 313.In addition, the setting of layer of silica gel 313, can promote the efficiency (increasing its swept area) of the heat radiation of LED chip 311.

Figure 45 a~45g is the schematic diagram of the lamp plate 3 of some embodiments, shows the different arrangement modes of LED chip 311. In Figure 45 a, the LED chip 311 of single LED chip group 31 is directly equidistantly configured on substrate 33, that is, any two The distance between adjacent LED chip 311 is identical, so that the entire all uniformly light-emittings of LED lamp panel 3.It is single in Figure 45 b and Figure 45 c Array arrangement is presented in the LED chip 311 of LED chip group 31, this array can be the square type array such as Figure 45 b, be also possible to It is possibly even the circular array such as aforementioned concentric circle best-fit such as the triangular array of Figure 45 c.Array arrangement can be by LED Chip 311 concentrates on regional area on substrate 33, and forms centralized lighting effect, and can reach in this regional area Uniformly go out light.

And Figure 45 d is then each one array of self-forming of LED chip 311 of multiple LED chip groups 31, that is, will be multiple LED chip 311 is configured to multiple arrays, shows a LED chip group 31 in the dotted line frame of triangle.Between retaining between array Gauge is from greater than the spacing distance of adjacent LED chip 311 in array, so that form airflow channel, to promote sky between array Gas is along 3 surface convection current of lamp plate.

As shown in Figure 45 e, in some embodiments, the LED chip 311 of LED chip group 31 is rectangle, has long side And short side.As shown in Figure 45 e, LED chip 311 can be configured along a circumference, and the radial direction of LED lamp panel 3 described in long edge Setting, so that radial arrangement is presented in LED chip 311, therefore, on this circumference, can arrange more LED chips 311, And LED chip 311 is concentrated on into a zonule；Meanwhile long side provides radially longer water conservancy diversion road strength, increases air-flow With the heat exchange of LED chip 311.LED chip 311 can also be configured along a circumference, and short side is along the diameter of the LED lamp panel 3 To setting, LED chip 311 is allowed to be dispersed in big region, and shorten the spacing between LED chip 311, so that LED core Piece group 31 such as the same Luminous Ring.Aforementioned two kinds of configuration modes, can select an implementation, can also implement simultaneously.

Figure 45 f and 45g show the partial schematic diagram of the lamp plate 3 of the different patterns in some embodiments.Such as Figure 45 f and figure Shown in 45g, in some embodiments, one or more reflectors 334 are configured on the substrate 33 of LED lamp panel 3, reflector 334 is opened Mouth is directed away from the direction of substrate 33.A LED chip 311 is configured in the inside bottom of each reflector 334.Reflector 334 Inner wall has high reflectance material, and specific embodiment is included in the coating of 334 inner wall of reflector, plating high reflectance applies Layer, or reflector 334 is directly made with high reflectance material and the inner wall of reflector 334 is processed by shot blasting.Instead 334 inner wall of light cup can reflect the light out of LED chip 311 laterally dissipated, and the light that goes out of LED chip 311 is concentrated on The direction that LED chip 311 is directed toward.If Figure 25 is the variation of Figure 24, multiple LED are configured in the inside bottom of each reflector 334 Chip 311.That is, configuring at least one LED chip 311 in the inside bottom of each reflector 334.

Figure 46 a~Figure 46 c is the perspective view of all directions of the power supply 5 in the present embodiment, and Figure 46 d is electricity in the present embodiment The main view in source 5.Power supply 5 is electrically connected with LED chip 311, and for powering to LED chip 311.Such as Figure 46 a~Figure 46 c institute Show, power supply 5 includes power panel 51 and electronic building brick, and electronic building brick is set on power panel 51.

Transformer 54 as shown in Figure 46 c, in electronic building brick comprising magnetic core 541 and coil 542, magnetic core 541 have one Cavity, coil are set in the cavity, upside opening setting of the cavity in the axial direction of LED light, so that coil generates when work Heat can be upward, and its heat dissipation direction it is consistent with the direction of convection path of the first heat dissipation channel 7a, in favor of radiate.

As shown in Figure 46 b and 46c, the open setting in two sides of the cavity in the axial direction of LED light can be further increased to line The heat dissipation effect of circle.In addition, coil can keep gap with the inner wall of cavity, so that air can be from after coil installation in the cavity Gap is flowed through, and the heat dissipation effect of coil can be further promoted with this.

As shown in Figure 46 b, transformer 54 has the first face 5401 and the second face 5402, the first face 5401 and the second face 5402 Be each perpendicular to power panel, wherein the first face 5401 perpendicular to lamp axial direction, the area in the first face 5401 less than the second face 5402, Therefore, after the small one side of area being arranged such, the obstruction of the convection current to the first heat dissipation channel 7a can be reduced.

It include an at least inductance 55 in electronic building brick, an at least inductance includes ring-shaped magnetic core 551, coil as shown in Figure 46 c It is wound on (not shown) on ring-shaped magnetic core 551, the axial direction for being axially parallel to LED light of ring-shaped magnetic core 551, so that coil can be with It is greater area of to be contacted with the air of convection current, to increase the heat dissipation to inductance.In addition, since ring-shaped magnetic core 551 is ring-type, And it is corresponding with the convection path of the first heat dissipation channel 7a, thus, the air of convection current can be by ring-shaped magnetic core 551 inside, can Further increase the heat dissipation to inductance 55.

As shown in Figure 46 a and Figure 46 b, the heat generating component in electronic building brick includes integrated circuit (IC) 56, diode, crystal Pipe, transformer 54, inductance 55 and resistance, above-mentioned heat generating component are separately positioned on the different surfaces of power panel 51, with Heat source, can be provided separately by this, avoid the formation of localized hyperthermia.In addition, can be respectively set on the different surface of power panel 51 scattered Hot component, to radiate for above-mentioned heat generating component, at this point, corresponding heat generating component thermally contacts radiating subassembly.

As shown in Figure 46 a and Figure 46 b, power panel 51 is arranged in other heat generating components for an at least integrated circuit 56 difference On surface.With this, on the one hand heat source can be provided separately, avoid the formation of localized hyperthermia, on the other hand, can avoid other hairs Hot component impacts the integrated circuit 56.

As shown in Figure 46 a and Figure 46 b, (i.e. perpendicular on 51 direction of power panel on the direction perpendicular to power panel 51 Projection relation), above-mentioned integrated circuit 56 is not Chong Die with any heat generating component, avoids heat from being superimposed with this.Preferably, it integrates Circuit 56 is not be overlapped with transformer 54.

As shown in figure 22, power panel 51 is parallel to the axial direction of LED light, therefore, on the axial direction of LED light, by power supply Plate 51 divides for top half and lower half portion, and top half and the installation space of the electronic building brick of lower half portion are consistent or substantially It is consistent, be conducive to electronic building brick and preferably arrange, in addition, being tilted, one if power panel 51 is opposite axial with LED light Determine the circulation that can hinder air in degree, is unfavorable for the heat dissipation of power supply 5.

As shown in figure 22, power panel 51 divides lamp housing 2 for first part 201 and second part 202, in first part 201 The area of corresponding heat release hole 222 is greater than the area of corresponding heat release hole 222 on second part 202, therefore, electronic building brick cloth When setting, most or all of electronic building brick can be set in first part 201, or by the biggish component of calorific value, such as electricity Sense, resistance, transformer, rectifier bridge or transistor etc. are set in first part 201.

As shown in figure 25, the inner cavity of lamp housing 2 is divided into first part 201 and second part 202 by power panel 51, and first 201 volume is divided to be set to most or all of electronic building brick when electronic building brick is arranged greater than the volume of second part 202 In first part 201, or by the biggish component of volume, such as capacitor, inductance, resistance, transformer, rectifier bridge or transistor, In first part 201.

Further, the area of corresponding first air inlet 2201 is corresponding greater than on second part 202 in first part 201 The area of the first air inlet 2201 therefore allow more air into first part 201, thus to electronic building brick into Row heat dissipation.The relationship with the first air inlet 2201 referred to, refers specifically to, and the first air inlet 2201 is big by power panel 51 Cause is divided into two parts, that is, the corresponding first part 201 of a part, another part correspond to second part 202, to make more Air is entered in first part 201 by the first air inlet 2201.

It as shown in figure 22, include heat generating component 501 in electronic building brick, wherein at least one heat generating component 501 is close to lamp cap 23, and radiated by lamp cap 23, the radiating resource without occupying the first heat dissipation channel 7a.It is above-mentioned at least one close to lamp cap 23 heat generating component 501 is inductance, resistance, rectifier bridge or control circuit.

As shown in figure 22, at least one heat generating component 501 is that heat is reached lamp by way of heat transfer or heat radiation On first 23, and heat is scattered in air by lamp cap 23.

As shown in figure 22, at least one heat generating component 501 thermally contacts lamp cap 23, specifically, at least one heat generating component 501 In lamp cap 23, and the heat generating component 501 is contacted by Heat Conduction Material 53 with lamp cap, and the heat generating component 501 is by above-mentioned Heat Conduction Material 53 and lamp cap 23 are fixed.With this, by the setting of Heat Conduction Material 53, the work to lamp cap heat transfer both can achieve With, fixed heat generating component can also be played the role of, avoid the heat generating component 501 loosen." heat generating component 501 described herein In lamp cap 23 ", specific aspect is, in the projection perpendicular to LED light axial direction, lamp cap 23 and heat generating component 501 have weight Folded region.

As shown in figure 22, Heat Conduction Material 53 is arranged in lamp cap 23 by way of encapsulating, realizes lamp cap 23 and hair with this The connection of hot component 501, Heat Conduction Material 53 only covers the region of the end of power supply 5, and the position of Heat Conduction Material 53 is higher than heat dissipation The position in hole 22, to prevent that weight is excessively increased because of Heat Conduction Material 53.In addition, Heat Conduction Material 53 selects insulating materials, with true It ensures safety, prevents electronic building brick from contacting with the metal portion 231 of lamp cap 23.In other embodiments, Heat Conduction Material 53 is also possible to connect Connect the (not shown) such as the conducting wire of conductive pin of power supply 5 and lamp cap 23.

As shown in figure 22, lamp cap 23 includes metal portion 231, and Heat Conduction Material 53 thermally contacts metal portion 231.That is, golden The wall for the inner cavity that the inner wall at least part in category portion 231 can constitute lamp housing 2 can make Heat Conduction Material be directly connected to metal portion with this 231, and radiated using metal portion 231.231 a part of metal portion can be radiated by air, a part of then can lead to The lamp holder that connect with metal portion 231 is crossed to radiate.

As shown in Fig. 2 Figure 46 a, in the present embodiment, in the electronic building brick in power supply 5, closest to the first heat dissipation channel 7a's The electronic building brick of first air inlet 2201 is thermo-labile component, such as capacitor, especially electrolytic capacitor 502, by by thermo-labile group Part to avoid keeping the temperature of thermo-labile component excessively high, and influences its performance close to the first air inlet 2201.

In addition, being influenced to reduce electrolytic capacitor 502 by heat generating component, anti-spoke can be set on 502 surface of electrolytic capacitor Layer or thermal insulation layer (not shown) are penetrated, with this is avoided heat generating component heat radiation and influences electrolytic capacitor 502.The thermal insulation layer at this place can Select plastic material in the prior art, and paint in the prior art, silver coating, aluminium foil can be selected for antiradiation layer or other are anti- The material of heat radiation.

As shown in Figure 46 a, in the present embodiment, at least at least part of an electrolytic capacitor is not limited in power panel 51 In the range of, that is, at least part of electrolytic capacitor is more than power panel 51 in the axial direction of LED light, is carrying identical quantity When electronic building brick, the length of plate 51 capable of reducing power source reduces the material cost of power panel 51.In addition, can further make electrolysis electricity Hold close to the first air inlet 2201, it is ensured that the electrolytic capacitor is in opposite low-temperature space.

As shown in figure 22, position of at least heat generating component 501 in the axial direction of LED light is higher than the position of heat release hole 222, The most of heat for being higher than the heat generating component 501 of heat release hole 222 is radiated by lamp cap 2 or other approach.Therefore, it generates Most of heat radiates not by heat release hole 222, does not interfere with the convection velocity of the first heat dissipation channel 7a.The heat generating component 501 be resistance, inductance, integrated circuit, voltage device or rectifier bridge.

As shown in figure 22, power panel 51 has upper and lower part in the axial direction of LED light, and upper and lower part is provided with hair Hot component, wherein in the heat generating component on top, at least one heat generating component is located at the top of heat release hole 222, so as to reduce Top is located at the problem near heat release hole 222, so that the temperature difference near the heat release hole 222 on lower part and top increases, to accelerate Convection current.

As shown in Fig. 2,3 and Figure 46 a, power panel 51 when being assembled to lamp housing 2, have be located at lamp neck 22 in part and Part in inner sleeve 21, it is first part that power panel 51, which is located at the part in lamp neck 22, and power panel 51 is located in inner sleeve Part be second part, second part compared to first part closer to the first heat dissipation channel 7a the first air inlet 2201, due to Closer to the first air inlet 2201, the air of convection current can reach second part first, that is to say, that second part compares first Part has better heat dissipation effect, therefore, will at least partly thermo-labile component (such as electrolytic capacitor, or more sensitive to high temperature Component) be set to second part on.Preferably, all electrolytic capacitors are set on second part.The power panel 51 of second part Area is greater than first part, therefore 51 second part of power panel has the space of more settable electronic building bricks, and being conducive to will more More thermo-labile component/heat-sensitive components are set on second part.In the present embodiment, thermo-labile component/heat-sensitive components can It is respectively arranged on the obverse and reverse of second part.In other embodiments, the more electronic building brick that can also will generate heat is set to second Divide upper (such as transformer, inductance, resistance, integrated circuit or transistor), so as to radiate faster to it.

Figure 51 is the schematic diagram of power supply 5 in some embodiments.As shown in figure 51, there is thermal insulation board 513, electricity on power panel 51 Source plate 51 is separated out two parts region with thermal insulation board 513, a portion region be arranged heat generating component (such as transformer, resistance, The component to generate heat when the work such as inductance), thermo-labile component/heat-sensitive components (such as electrolytic capacitor) are arranged in another part region, That is thermal insulation board separates heat generating component and thermo-labile component/heat-sensitive components, avoid generating due to heat generating component with this Excessive heat radiation, and influence thermo-labile component/heat-sensitive components.In other embodiments, there is thermal insulation board on power panel 51 513, power panel 51 is separated out two parts region with thermal insulation board 513, and heat generating component (such as transformer, electricity is arranged in a portion The component to generate heat when the work such as resistance, inductance), another part is also provided with heat generating component (when such as transformer, resistance, inductance work The component of fever), that is to say, that thermal insulation board is spaced apart by heat generating component and heat generating component, and mutual hot spoke is avoided with this It penetrates, so that heat is superimposed, on the other hand, temperature is the important factor in order of heat radiation, therefore avoids heat generating component and fever group It is mutually radiated between part, the temperature difference between heat generating component and neighbouring air can be improved, radiation efficiency can be improved with this.It is preferred that , thermal insulation board 513 is arranged along the axial setting of LED light or along the convection current direction of the first heat dissipation channel 7a, so that when convection current, The heat on both sides will not be assembled due to convection current in the width direction in power panel 51.Thermal insulation board 513 is along the first heat dissipation channel 7a Convection current direction be extended, that is to say, that thermal insulation board 513 is that the axially extending setting along LED light therefore will not be to right The air of stream, which is formed, to be hindered.In other embodiments, thermal insulation board 513 can also be it is certain inclined so that it has air Certain guide functions.

Further, thermal insulation board 513 can be circuit board, therefore, electronic building brick can be arranged on thermal insulation board 513, to increase Add the area of settable electronic building brick.

The function of thermal insulation board 513 can also be replaced with electronic building brick.As shown in Figure 46 d, on power panel 51 there are three tools Electronic building brick 503,504,505, in the radial direction (or power panel of these three electronic building bricks 503,504,505 in LED light In 51 width direction) projection it is least partially overlapped, wherein an electronic building brick 504 is interposed between another two electronic building brick 503,505 Between, i.e., wherein an electronic building brick 504 is located among another two electronic building brick 503,505, to avoid another two electronic building brick 503,505 mutual heat radiations, to be conducive to form the larger temperature difference between heat generating component and neighbouring air, in favor of hair The heat radiation of hot component is into air.An another two electronic building brick 503,505 mentioned above respectively heat generating component is (such as Transformer, resistance, inductance or transistor) and a thermo-labile component/heat-sensitive components (such as electrolytic capacitor) therefore generating heat When component generates heat, at least part meeting heat radiation is to intermediate electronic building brick 504, so that reducing heat generating component generates heat Measure the radiation effect to thermo-labile component/heat-sensitive components.

In other embodiments, electronic building brick 503 there are three having on power panel 51,504,505, these three electronic building bricks 503,504,505 LED light in the radial direction (504 be located at another two electronic building brick 503,505 among, to avoid another two Electronic building brick 503,505 mutual heat radiations, thus be conducive to form the larger temperature difference between heat generating component and neighbouring air, In favor of heat generating component heat radiation into air.Another two electronic building brick 503,505 mentioned above is aforementioned definitions Heat generating component (such as transformer, resistance, inductance or transistor), therefore, in two 503,505 adstante febres of heat generating component, at least one Part meeting heat radiation, to reduce the heat superposition generated between two heat generating components, is caused to intermediate electronic building brick 504 The temperature in 51 region of power panel is excessively high and influences the running quality of LED light, and is conducive to be formed between heat generating component and neighbouring air The larger temperature difference, in favor of heat generating component heat radiation into air.

Preferably, the selection of electronic building brick 504 is located in the middle not generate heat or heat-resisting electronic building brick, as temperature sensor, Capacitor etc..

As shown in Figure 46 d, electronic building brick 506 there are three tools on power panel 51,507,508, these three electronic building bricks 506, 507, the 508 (convection current or on the length direction of power panel 51, i.e., along the first heat dissipation channel 7a on the axial direction of LED light On direction) projection it is least partially overlapped, wherein an electronic building brick 507 is interposed between another two electronic building brick 506,508, i.e., Wherein an electronic building brick 507 is located among another two electronic building brick 506,508, to avoid 506,508 phase of another two electronic building brick Heat radiation between mutually, to be conducive to form the larger temperature difference between heat generating component and neighbouring air, in favor of the heat of heat generating component It is radiated in air.Another two electronic building brick 506,508 mentioned above is heat generating component (such as transformer, resistance, inductance Or transistor), therefore, in two 506,508 adstante febres of heat generating component, at least part meeting heat radiation to intermediate electronics group Part 504 avoids heat from being superimposed to reduce the heat radiation between two heat generating components, and is conducive to heat generating component and neighbouring air Between form the larger temperature difference, in favor of heat generating component heat radiation into air.In the present embodiment, due to electronic building brick 507 Setting when the air of convection current is upward, hinders the air of convection current, that is to say, that underlying electronics in a certain range It after the heat of component 503 is with the air heat dissipation of convection current, needs around intermediate electronic building brick 507, and avoids the air of convection current straight The electronic building brick 508 of contact above.In the present embodiment, intermediate electronic building brick 507 is not heat generating component (such as capacitor). In other embodiments, in another two electronic building brick 506,508, one of them is heat generating component (such as resistance, inductance, transformer Deng), another is thermo-labile component (such as capacitor).

Figure 52 is the schematic diagram of the power supply 5 in some embodiments.As shown in figure 52, in some embodiments, in order to increase Radiating layer 509 can be arranged on heat generating component surface in the radiation efficiency of the heat generating component of power supply 5, what heat generating component generated when working Heat can conduct in thermo-conducting manner to radiating layer 509, and heat is radiated to the air of surrounding by radiating layer 509 again, When in order to the first heat dissipation channel 7a convection current, the air of heat is taken away.The radiation efficiency of radiating layer 509 is greater than heat generating component Radiation efficiency, thus, the radiating efficiency of heat generating component greatly promotes after setting radiating layer 509.Radiative material in the present embodiment 509 can be selected black glue in the prior art, with increase its heat radiation to air effect.When black glue is set, black glue can be covered In the surface of power supply 5, and black glue can be thermally contacted directly with lamp cap 23, that is to say, that the heat of the heat generating component of power supply 5, one Partial radiation is to surrounding air, and another part, and directly by black glue heat transfer to 23 (not shown) of lamp cap, lamp cap 23 is gold Belong to lamp cap, outside can be dissipated to by lamp cap 23 again.Black glue in the present embodiment is thin layer structure, is set to heat generating component Surface can't hinder the convection current to the first heat dissipation channel 7a, and increased limited mass, to the whole weight of LED light It influences smaller.In other embodiments, black glue is also optionally set, for example, being arranged on the higher heat generating component of fever black Glue, such as on transformer, inductance, transistor.

In addition, in above-described embodiment, it, can be by radiative material 509 for the radiation efficiency for further promoting radiative material 509 Surface is set as rough surface, to increase the surface area of radiative material 509.

Figure 47 is the schematic diagram of the power supply 5 in some embodiments, can be applied to the LED light of Fig. 4 to replace the LED light of Fig. 4 Power supply 5.As shown in figure 47, in some embodiments, power panel 51 is divided and is set for first with an axis X by power panel 51 Region 511 and the second setting area 512 are set, the first setting area 511 and the second setting area 512 are using axis X as boundary, and second The sum of weight of electronic building brick on setting area 512 is greater than the sum of the weight of electronic building brick on the first setting area 511. Clump weight 52 is arranged in first setting area 511, so that the weight of 51 two sides of balance electric source plate, prevents 51 two sides of power panel because of electricity The weight of sub-component is uneven and impacts, and prevents under LED light hanging state, due to the weight of 51 two sides of power panel unevenness Lead to LED light run-off the straight.

Figure 48 is the main view of the clump weight in Figure 47.Figure 49 is the bottom view of Figure 48.As shown in Figure 48 and Figure 49, in In some embodiments, clump weight 52 is the radiating subassembly with heat sinking function, is set on power panel 51.In some implementations In example, there is cooling fin 521 on radiating subassembly, and increases its heat dissipation area.Clump weight 52 is the metal material with high-termal conductivity Matter is made, such as aluminium, copper.In the present embodiment, cooling fin 521 along LED light axial direction be extended, and cooling fin 521 it Between form channel, and for air passage, and this mode, the heat dissipation area of clump weight 52 can be increased.In addition to this, counterweight Block 52 includes a long side and short side, and channel and long side are also the state of being parallel to each other, while long side being configured and LED light axial direction side To parallel or substantially parallel with air current flow direction, so that airflow is more smoothly.

As shown in figure 47, meeting heating temperature higher heat generating component when in electronic building brick including work, at least one fever Component is close to radiating subassembly, to distribute the heat of a part by radiating subassembly.Preferably, the transformer in heat generating component, electricity Sense, resistance, diode, transistor or integrated circuit (IC) are close to radiating subassembly.It is furthermore preferred that transformer in heat generating component, Inductance, resistance, diode, transistor or integrated circuit (IC) directly thermally contact radiating subassembly.

As shown in Figure 47, Figure 48 and Figure 49, in some embodiments, in electronic building brick include work when can heating temperature compared with High heat generating component, at least one heat generating component is close to radiating subassembly 52, to distribute a part by radiating subassembly 52 Heat.Preferably, the transformer in heat generating component, inductance, resistance, diode, transistor or integrated circuit (IC) are close to heat dissipation group Part.It is furthermore preferred that transformer, inductance, resistance, diode, transistor or integrated circuit (IC) the directly heat in heat generating component connect Touch radiating subassembly.Preferably, there is cooling fin 521 on radiating subassembly 52, and increase its heat dissipation area.Radiating subassembly 52 is tool There is the metal material of high-termal conductivity to be made, such as aluminium, copper.In the present embodiment, cooling fin 521 extends along the axial direction of LED light Setting, and forms channel between cooling fin 521, and for air passage, and this mode, the heat dissipation of clump weight 52 can be increased Area.In addition to this, radiating subassembly 52 includes a long side and short side, and channel and long side are also the state of being parallel to each other, while will be grown Side configuration is parallel with LED light axial direction or substantially parallel with air current flow direction, so that airflow is more smoothly.In In some embodiments, it can be respectively provided with radiating subassembly 52 in the front and back sides of power panel 51, on the one hand 51 two sides of power panel can distinguished It radiates, on the other hand, the weight of the two sides of power panel 51 can be balanced.

As shown in figure 47, in some embodiments, power panel 51 divides power panel 51 for the first setting area with an axis X Domain 511 and the second setting area 512, the first setting area 511 and the second setting area 512 are using axis X as boundary, the second setting The quantity of electronic building brick on region 512 is more than the quantity of the electronic building brick on the first setting area 511, so that the first setting Air-flow at region 511 is more smooth, reduces the obstruction of electronic building brick.In the present embodiment, the first setting area 511 and second is set It sets region 512 and all has heat generating component, so that heat source separates.

As shown in Fig. 4, Figure 47 and Figure 50, in some embodiments, the first radiating channel 7a includes interior channel 7a1 and outer logical Road 7a2, outer tunnel 7a2 are formed between the electronic building brick at 51 edge of power panel and the inner wall of the inner cavity of lamp housing 2, and internal channel 7a1 is formed in the gap between electronic building brick.With this heat dissipation effect of power supply 5 is got a promotion.Specifically, will scheme Power panel 51 in 47 divides for two parts (left and right two parts, not necessarily symmetrically), i.e. first part and second part, and first Point and second part on all have electronic building brick, the electronic building brick in first part and second part respectively with 2 inner wall shape of lamp housing At outer tunnel 7a2, internal channel 7a1 is formed between the electronic building brick of first part and the electronic building brick of second part.The present embodiment In, the transformer 54 of electronic building brick comprising magnetic core 541 and coil 542, magnetic core 541 have a cavity, and coil 542 is set to should In cavity, cavity is in at least side opening setting radially of LED light, so that coil exposed, which corresponds to internal channel 7a1 or outer tunnel 7a2, so that the heat that coil 542 generates is discharged rapidly by the convection current of internal channel 7a1 or outer tunnel 7a2. Preferably, for cavity in the open setting in the two sides radially of LED light, wherein side opening corresponds to internal channel 7a1, another Side opening corresponds to outer tunnel 7a2 and further increases the heat dissipation to transformer with this.

Figure 53 a~Figure 53 c is the schematic diagram of the power panel 51 of various different patterns.The power panel 51 as shown in Figure 53 a It is electrically connected mutually comprising multiple daughter boards 512, and between multiple daughter boards 512.As shown in Figure 53 a, between multiple daughter boards 512 Multiple electric wires can be combined into soft cable when using multiple electric wires 513 with the connection of one or more electric wires 513.Pass through The bending of electric wire 513 can change relative position between multiple daughter boards 512, for example, make two daughter boards 512 parallel to each other and Spacing distance is kept, and different electronic building brick groups is respectively configured.As shown in Figure 53 b, between multiple daughter boards 512 with one or Multiple electric connectors 514 connect.Linked by electric connector 514 and is combined into fixed structure between multiple daughter boards 512, and by It is configured to state parallel to each other or arranged side by side, such as makes two daughter boards 512 parallel to each other and keeps spacing distance, and is divided Different electronic building brick groups is not configured.As shown in Figure 53 c, the power panel 51 includes the first area 51a and the second area 51b. The width of second area 51b is greater than the first area 51a, for accommodating more thermo-labile electronic building brick.It is then by the in configuration Two area 51b are close to the air inlet 172 of heat dissipation base 17, and the first area 51a is close to the heat release hole 222 of lamp neck 22.

Figure 54 is the cross-sectional view of LED light in the present embodiment.As shown in figure 54, power panel 51 along heat dissipation channel (herein Heat dissipation channel refers to the first heat dissipation channel 7a) it is axial heat dissipation channel is divided into first passage S1 and second channel S2, the Correspond to first passage S1 on one side, and the second face corresponds to second channel S2.

When the volume of electronic building brick is larger, the heat dissipation channel at place needs biggish volume, so that heat dissipation channel After volume deducts the total volume of electronic building brick, there are also enough channel spaces.Therefore, when the volume of first passage S1 is less than When the volume of two channel S2, the volume (the sum of the volumes of all electronic building bricks in the first face) positioned at the electronic building brick in the first face is needed It is less than the volume (the sum of the volumes of all electronic building bricks in the second face) of the electronic building brick positioned at the second face.Aforementioned first passage The ratio of the volume of the volume and second channel S2 of S1 is set as R1, and the range of R1 can be 0.3~0.5；It is aforementioned to be located at the first face The ratio of volume and the volume for the electronic building brick for being located at the second face of electronic building brick be set as R2, the range of R2 can be 0.05 ~0.2.Compare from proportionate relationship, the ratio R 1 of the volume of the volume and second channel S2 of first passage S1 needs to be less than position In the ratio R 2 of the volume and the volume for the electronic building brick for being located at the second face of the electronic building brick in the first face.If the electricity in the first face Less than the weight of the electronic building brick in the second face then clump weight (not shown) can also be arranged in the first face in the weight of sub-component, with Balance the weight on two sides.

Figure 55 is the cross-sectional view of LED light in the present embodiment.As shown in figure 55, if further separating upper and lower relation, same On one side on (the first face or the second face), heat dissipation channel (heat dissipation channel herein refers to the first heat dissipation channel 7a) is also considered, The namely relationship of air circulation region (non-overlay electronic component).It is fixed in the second face with X-axis and Y-axis by taking the second face as an example Adopted first quartile Q1, the second quadrant Q2, third quadrant Q3 and fourth quadrant Q4, first quartile Q1, the second quadrant Q2, third as Limit Q3 and fourth quadrant Q4 is interconnected, and first quartile Q1 and the second quadrant Q2 correspond to lamp housing, third quadrant Q3 and four-quadrant It limits Q4 and corresponds to radiator 2, first quartile Q1 is adjacent with third quadrant Q3, and the second quadrant Q2 is adjacent with fourth quadrant Q4. Above-mentioned X-axis falls within the top edge of radiator 2, and Y-axis is the location mid-shaft of diagram.

As shown in figure 55, ideal mode is exactly to allow electronic building brick to be located at unilateral (side of Y-axis), such as concentrate on Second quadrant Q2 and fourth quadrant Q4, and the electronic building brick (same to electronic building brick) of lower part is fewer than top electronic building brick, allows hair High fever or heat labile electronic building brick (such as transformer, electrolytic capacitor) are located at lower part.Therefore as shown, being located at the second quadrant The volume of electronic building brick in Q2, less than the volume of the electronic building brick in first quartile Q1, so that the sky that the second quadrant Q2 is shown Gas circulating area (non-overlay electronic component) be greater than first quartile Q1, and possess one can allow air-flow quickly through region. Therefore, by taking the second face as an example, the body of the volume of the first passage S1 in the second quadrant Q2 and the electronic building brick in the second quadrant Q2 Long-pending ratio is greater than 3, so that the air circulation region in the second quadrant Q2 has enough size.Of course, it can be reversed makes The ratio of the volume of first passage S1 in first quartile Q1 and the volume of the electronic building brick in the second quadrant Q2 is greater than 3.

The volume of the aforementioned electronic building brick being located in the second quadrant Q2, less than the body of the electronic building brick in first quartile Q1 Product, if from the point of view of with proportionate relationship, can be set as the ratio of the volume of the electronic building brick in the second quadrant Q2, less than first The ratio of the volume of electronic building brick in quadrant Q1.

Further than the configuration of lower part, the volume of the electronic building brick in fourth quadrant Q4 is less than third quadrant Q3 In electronic building brick volume, therefore fourth quadrant Q4 to first quartile Q2 can maintain enough airflow channels.Equally with than From the point of view of example relationship, the ratio of the volume of the volume and first passage S1 in fourth quadrant Q4 of the electronic building brick in fourth quadrant Q4 Value, the ratio of the volume less than the first passage S1 in the volume and third quadrant Q3 of the electronic building brick in third quadrant Q3.

If being classified as multiple a electronic building bricks comprising heat generating component, it is to be located at top that heat generating component, which preferably configures, Namely first quartile Q1 and the second quadrant Q2, therefore configuring upper heat generating component is to be located at first quartile Q1 and the second quadrant Q2, That is, heat generating component can the end of heat dissipation channel contact cooling air-flow, to avoid first to cooling air-flow heat and Influence the cooling of other electronic building bricks.The heat generating component of first quartile Q1 radially with the heat generating component of the second quadrant Q2 Quantity in correspondence with each other, the quantity ratio with the heat generating component of the second quadrant Q2 use reduction and are located at same section between 0~0.5 Heat generating component quantity on face pulls open temperature gradient conducive on same section, so that heat is radiated to week by heat generating component Air is enclosed, specifically, the heat of generation need to be radiated to air by heat radiation by heat generating component, and the temperature difference is that heat radiation is closed One of key factor, it is therefore desirable to the interference between heat generating component is avoided as far as possible, guarantees the temperature difference of heat generating component and air with this, To ensure the efficiency of heat radiation.

It is also contemplated that cooling air-flow flows up and down relationship, the body of third quadrant Q3 and the first passage S1 in fourth quadrant Q4 Product, greater than the volume of the first passage S1 in first quartile Q1 and the second quadrant Q2, is just touched to avoid cooling air-flow at starting point end To high flow resistance, cooling air-flow flowing is influenced.

Therefore, generally speaking, electronic building brick is in the sectional area of LED light radial direction, with heat dissipation channel in radial sectional area Ratio between 0~0.4 be it is best, wherein ratio 0, which refers to, does not have electronic building brick on section, ratio 0.4, which refers to, avoids electronic building brick In radial sectional area more than half heat dissipation channel.

Just with single side, such as the first face, in first passage S1 electronic building brick in radial sectional area, with first passage S1 in The ratio of radial sectional area is between 0~0.3, otherwise in the second face, and electronic building brick is cut in radial in second channel S2 Area, with second channel S2 in radial sectional area ratio between 0~0.6.That is, first face and the second face electronic building brick Using different allocation ratios, so that one side has the flowing of preferable air-flow.

As shown in figure 54, ratio above-mentioned can be handled through the off-axis configuration of power panel 51, and power panel 51 and heat dissipation are logical There is an off-axis distance G, the ratio of the radius of off-axis distance G and heat dissipation channel is between 0.15~0.4 between the axis in road.Partially Configuration of the wheelbase from G, while also adjustable center of gravity, so that the equivalent center of gravity of power panel 5 is fallen on the axis of heat dissipation channel.

Figure 56 is the cooperation schematic diagram of the power supply 5 and inner sleeve 21 in some embodiments.As shown in figure 56, power panel 51 is matched The axis Y that can favour LED light, the big one side of flow resistance, such as the one side more than electronic building brick quantity are set, is configurable to incline Oblique power panel 51 is in upper one side；The small one side of flow resistance, such as the one side that electronic building brick quantity is few are configurable to inclination power supply One side of the plate 51 under；So that the high one side of flow resistance still has enough air-flows to pass through.And clump weight 52 is then according to skewed One side of the state configuration inclination power panel 51 under makes the center of gravity of LED light maintain axis Y to balance the weight on axis Y.

As shown in Figure 1, Figure 2, Figure 3 and Figure 4, lamp housing 2 includes lamp cap 23, lamp neck 22 and inner sleeve 21；Lamp cap 23 and lamp neck 22 Connection, lamp neck 22 connect inner sleeve 21.Wherein, inner sleeve 21 be located at radiator 1 inside (in LED light axial direction, inner sleeve 21 all or Largely, 80% or more such as in inner sleeve height is no more than radiator 1), lamp neck 22 is then the outside for being exposed to radiator 1.It is logical The setting of inner sleeve 21, lamp neck 22 is crossed, provides enough spaces with this to accommodate power supply 5, and radiate, it is especially high-power LED light power supply 5 (the relatively low power LED light of the power supply of high-power LED lamp, power supply form more complicated, overall ruler It is very little bigger).It include the part of power supply 5 in lamp neck 22 and lamp cap 23, the sum of lamp neck 22 and the height of lamp cap 23 are greater than heat dissipation The height of device 1, with this to provide the space of more setting power supplys 5, and lamp neck 22 and lamp cap 23 are separated with radiator 1 (not being overlapped in axial direction, in comparison, inner sleeve 21 is covered by radiator 1), therefore the power supply 5 in lamp neck 22 and lamp cap 23 Smaller (heat of radiator 1 will not radially be conducted to lamp neck 22 and lamp cap 23) is influenced by radiator 1.In addition, lamp neck 22 Height setting, conducive to the stack effect of the first heat dissipation channel 7a, it is ensured that the convection efficiency in the first heat dissipation channel 7a.? In other embodiments, the height of lamp neck 22 is at least 80% or more of 1 height of radiator, to reach above-mentioned effect.Inner sleeve 21 For heat-barrier material, heat and the heat of power supply for preventing radiating fin influence each other.

As shown in Fig. 2, the second air inlet 1301 is located at the downside of radiator 1 and radially corresponds to the inside of radiator 1 It is or internal, that is to say, that inside or inside of second air inlet 1301 corresponding to radiating fin 11, and the inside of radiating fin 11 Or (the radial inside of radiating fin 11 is close or is directly connected to inner sleeve for the outer wall of the internal inner sleeve 21 for then corresponding to lamp housing 2 On 21), therefore the air of convection current is after the entrance of the second air inlet 1301, the convection current along 21 outer wall of inner sleeve in uphill process, together When radially radiate to the outer wall of the inside of radiating fin 11 or inside and inner sleeve 21, to play heat-insulated effect, that is, It says, can prevent the heat of radiator 1 from conducting by the outer wall of inner sleeve 21 to the inside of inner sleeve 21, and then influence power supply 5.By Above it is found that the second heat dissipation channel 7b can not only accelerate the heat dissipation of radiating fin 11, heat-insulated effect is also acted as.Second air inlet Compared to for LED chip 311, the second air inlet 1301 is radial closer to LED light compared to any one LED chip 311 in hole 1301 Inside.

Figure 57 is the enlarged drawing in Fig. 2 at B.As shown in figure 57, lamp cap 23 includes metal portion 231 and insulation division 232, electricity The conducting wire in source 5 passes through insulation division 232 and connect with external power supply unit.Metal portion 231 is connect with lamp neck 22, specifically, as schemed Shown in 58, the inner surface of metal portion 231 is provided with screw thread, and is threadedly coupled by screw thread with the realization of lamp neck 22.When passing through metal Portion 231 and when radiating to the power supply 5 in lamp housing 2 (as recorded in previous embodiment, at least part meeting of the inner wall of metal portion 231 The wall for constituting the inner cavity of lamp housing 2 can make Heat Conduction Material be directly connected to metal portion 231 with this, and be carried out using metal portion 231 Heat dissipation), bulge-structure 2311 (as shown in figure 50) is arranged in 231 outer surface of metal portion, so that the table of the outer surface of metal portion 231 Area increases, to keep the heat dissipation area of metal portion 231 bigger, improves its radiating efficiency.For power supply 5, power supply 5 is extremely Few a part can be located in lamp cap 23, and at least part of heat dissipation of power supply 5 is done by lamp cap 23.Metal portion 231 it is interior Bulge-structure can be arranged equally to increase the surface area that inner wall corresponds to the inner cavity of lamp housing 2 in wall.In the present embodiment, by lamp Screw thread is arranged in the inner surface of first 23 metal portion 231, and forms above-mentioned bulge-structure, achievees the purpose that increase surface area.

Figure 59 a is the stereoscopic schematic diagram one of lamp neck 22 in the present embodiment.Figure 59 b is the three-dimensional signal of the present embodiment lamp neck 22 Figure two.Figure 60 is the stereoscopic schematic diagram of the present embodiment inner sleeve 21.As shown in Fig. 2, Figure 59 a, Figure 59 b and Figure 60, lamp neck 22 is logical The form fastened is crossed to connect with inner sleeve 21.Specifically, there is the first positioning unit 211 in inner sleeve 21, and have on lamp neck 22 Second positioning unit 221, the first positioning unit 211 and the second positioning unit 221 fasten, so that inner sleeve 21 is connect with lamp neck 22.

The present embodiment, the first positioning unit 211 are to be provided with buckling parts on interior set, and the second positioning unit 221 is to open The buckle being located on lamp neck, and buckling parts is fastened and connected with buckle.In other embodiments, it is also possible to the first positioning unit 211 buckle to be provided on interior set, and the second positioning unit 221 is the buckling parts being provided on lamp neck, and buckling parts and card Button is fastened and connected.

In the present embodiment, inner sleeve 21 has interconnecting piece 212, and interconnecting piece 212 includes at least two groups piece in the circumferential direction of LED light Shape body 2121, the first positioning unit 211 are formed on plates 2121, and when lamp neck 22 and the cooperation of inner sleeve 21, the second positioning is single Member 221 buckles into the first positioning unit 211, and when buckling into, the second positioning unit 221 has extruding radially to plates 2121, When plates 2121 have multiple in the circumferential, then its structural strength in the radial direction is weakened, so that the movement buckled into It is more laborsaving, and interconnecting piece 212 radially has more deformation space in LED light on the whole.In the present embodiment, buckling parts is The slot or through-hole being opened on plates 2121.

In the present embodiment, there is gap between two groups of plates 2121, and the gap forms locating slot 213.And lamp neck 22 It is upper to have and the matched third positioning unit 223 of locating slot 213, when inner sleeve 21 and lamp neck 22 cooperate, third positioning unit 223 insertion locating slots 213, are rotated relative to lamp neck 22 in the circumferential with limiting inner sleeve 21.

In the present embodiment, interconnecting piece 212 is sheathed in lamp neck 22, and by way of socket, interconnecting piece 212 is deposited with lamp neck 22 Each other be oriented to, support effect, make to connect it is more convenient, and connect after structural stability it is more preferable.

In other embodiments, lamp neck 22 and inner sleeve 21 are an integral structure (not shown), to simplify the structure of lamp housing 2.

As shown in Figure 59 b, lamp neck 22 has the card slot 224 that is made of two sheet bodies 225, specifically, two sheet bodies 225 it Between form the card slot 224, power panel 51 can be caught in card slot 224 and fix.In the present embodiment, axis of the sheet body 225 in LED light Upward subsection setup, so that in the axial direction of LED light, after keeping gap, power panel 51 to be inserted between sheet body 225, power panel 51 Two sides can carry out convection current by gap.In the present embodiment, when the subsection setup in the axial direction of LED light of sheet body 225, position The length L1 of part card slot 224 and the length L2 of power panel 51 are formed by the sheet body 225 of the axial bottom of lamp neck 22 Ratio between 1:14~22, when being in the ratio, power panel 51 is inserted into the sheet body of the axial bottom of lamp neck 22 225 are formed by part card slot 224, and 51 two sides of power panel are limited by card slot 224, will not generate big deflection, and make it It is difficult to be formed by card slot 224 with next group of sheet body 224 and be aligned, to reduce assembly difficulty.

In the present embodiment, two sheet bodies 225 are two rib being parallel to each other compositions, and corresponding two rib is set to lamp neck 22 inner wall, and along the axially extending of lamp neck 22.After power panel 51 is inserted into card slot 224, corresponding two ribs are parallel to power supply Plate 51.

Two sheet bodies 225 in the present embodiment form third positioning unit 223, the opposite both side surface of two sheet bodies 225 It corresponds respectively in locating slot 213, and plays the role of positioning and guiding.

Figure 59 c is the perspective view of the lamp neck 22 in some embodiments.As shown in Figure 59 c, in some embodiments, sheet body 225 upwardly extend and are integral (individual sheet body), the sheet body 225 of this form, the card being formed by the axis of LED light Slot 224, it is more stable with the cooperation of power panel 51.In the present embodiment, the length of sheet body 225 is the length of power panel 51 Between 15%~45%.Guarantee the more stable support power panel 51 of card slot 224 with this.

In other embodiments, card slot 224 is also possible to the fluting (not shown) on the inner wall of lamp neck 22.Without Sheet body 225 is set, it is simpler in structure.

As shown in Figure 59 b and Figure 31, there is the first stopper section 226 in the present embodiment in lamp neck 22, the first stopper section 226 with Power panel 51 cooperates, and after power panel 51 is avoided power panel 51 from being further inserted into after being inserted by the limitation of the first stopper section 226, makes The electronic building brick of 51 end of power panel is squeezed and damaged by 23 end of lamp cap, and on the other hand, the setting of the first stopper section 226 can Power panel 51 and 23 end of lamp cap is set to keep gap, to guarantee the convection current of gap location.

As shown in figure 31, there is the second stopper section 215, the second stopper section 215 cooperates with power panel 51, with limit in inner sleeve 21 Power panel 51 processed is made in the axially downward direction activity of LED light by the first stopper section 226 of setting and the second stopper section 215 Two sides in 51 axial direction of power panel are limited, so that power panel 51 be made to be fixed in the axial direction.

As shown in Fig. 1 and Figure 31, lamp housing 2 has a current limliting face 214, extends radially outwards setting simultaneously in LED light Radially far from heat release hole 222, the covering of current limliting face 214 at least partly radiating fin 11.When radiating fin 11 radiates, quilt During the hot gas that the radiating fin 11 of 214 covering part of current limliting face is distributed rises, stopped by current limliting face 214, and changes The direction (outward along current limliting face 214) of heating flow of air, to, far from heat release hole 222, avoid radiating when increase hot gas Hole 222 collects around to form high temperature, and influences the convection velocity of the first heat dissipation channel 7a itself, and can rise to avoid hot gas When, entered in the inner cavity of lamp housing 2 by heat release hole 222, so that power supply 5 is influenced, finally, hot gas is avoided to rise and contact lamp First 23 metal portion 231, influences the heat dissipation of metal portion 231 or even hot gas is directly conducted by metal portion 231 into lamp housing 2 Chamber.Current limliting face 214 can be formed in inner sleeve 21.As shown in figure 12, in other embodiments, current limliting face 214 can also be formed in lamp neck On 22.

As shown in figure 31, in the present embodiment, upside of the radiating fin 11 in the axial direction of LED light at least partly with current limliting face 214 is corresponding, when lamp housing 2 is inserted into radiator 1, plays position-limiting action to lamp housing 2.In the present embodiment, radiating fin 11 and current limliting face 214 offset.

As shown in figure 31, in the present embodiment, the thermal coefficient of material used by inner sleeve 21 is less than the material of lamp neck 22 Thermal coefficient, current limliting face 214 are formed in inner sleeve 21, and the height in 1 axial direction of radiator is no more than current limliting face 214, are dissipated with reducing The contact area of hot device 1 and lamp neck 22.For inner sleeve 21, material thermal conductivity is lower, then radiator 1 is transmitted to inner sleeve Heat inside 21 is fewer, and the influence to power supply 5 is smaller, and for lamp neck 22, lamp neck 22 and the contact area of radiator 1 are got over Small, then heat transfer is lower, and the thermal coefficient of lamp neck 22 material itself is higher than the material of inner sleeve 21, and lamp neck 22 itself can At least part heat caused by internal power supply 5 is dissipated by lamp neck 22.In other embodiments, inner sleeve 21 is used Material and the material of lamp neck 22 can be identical material, for example, being all made of the lower material of thermal coefficient, such as plastics.

As shown in figure 31, in the present embodiment, the wall portion of inner sleeve 21 and the wall portion of lamp neck 22 have collectively constituted the interior of lamp housing 2 The wall portion of chamber, the height of radiator 1 in the axial direction is no more than the height of inner sleeve 21, so that radial direction of the radiator 1 in LED light It is upper to correspond to inner sleeve 21, that is to say, that inner sleeve 21 plays heat-insulated effect, and the heat of radiator 1 is avoided to conduct into inner sleeve 1, And influence the electronic building brick of the power supply 5 in it.And lamp neck 22 is on the whole all higher than the position of radiator 1, that is to say, that Radially, radiator 1 is not be overlapped with lamp neck 22 for LED light, can avoid the heat transfer between radiator 1 and lamp neck 22 as far as possible, prevents Only radiator 1 is conducted heat to inside lamp neck 22 by heat transfer, to influence the electronic building brick in it.Just because of such as This, the heat transfer efficiency of the wall portion of inner sleeve 21 can be set below the heat transfer efficiency of the wall portion of lamp neck 22 by the present embodiment, this to set The benefit for setting mode is on the one hand can to reduce radiator 1 in inner sleeve 21 by setting low heat transfer efficiency for inner sleeve 21 Heat transfer, avoid radiator 1 influence inner sleeve 21 inside electronic building brick, on the other hand, due to be not necessarily to consider that radiator 1 is right Therefore the heat transfer of lamp neck 22 improves the heat transfer efficiency of lamp neck 22, facilitate generation when the electronic building brick work of internal electric source 5 Heat, distributed by lamp neck 22, avoid the temperature of power supply 5 excessively high and influence the service life of electronic building brick.In the present embodiment, For make the heat transfer efficiency of the wall portion of inner sleeve 21 be set below lamp neck 22 wall portion heat transfer efficiency, inner sleeve 21 can be selected low The material of thermal coefficient, and lamp neck 22 is selected to the material of relatively high thermal coefficient, in order to improve the thermally conductive system of lamp neck 22 Number, can also open up heat release hole 222 on lamp neck 22, or heat-conducting part (not shown) is arranged on lamp neck 22, and metal is such as arranged Equal high heat conductive materials.

As shown in figure 31, lamp neck 22 has upper and lower part, and heat release hole 222 therein is set to top, the cross section on top Product is less than the cross section street of lower part, and the air velocity on top can be faster than the flow velocity of the air of lower part, so that air is from heat dissipation Initial velocity when hole 222 is discharged increases, and hot-air is avoided to be deposited in 222 attachment of heat release hole.In the present embodiment, lamp neck 22 Cross-sectional area successively decreases in the direction of LED light axially upwards, avoids flowing to form obstruction to air.In the present embodiment, inner sleeve 21 The cross-sectional area of the entrance of lower part is greater than the cross-sectional area on the top of lamp neck 22.

As shown in Figure 1, the heat release hole 222 on lamp neck 22 is strip, and along the axially extending of LED light, due to LED light Self gravity, lamp neck 22 can set the strip hole axially extending along LED light for heat release hole 222 in the axial direction by pulling force, It can avoid opening up heat release hole 222 and impacting the intensity of lamp neck 22.The maximum inscribed circle diameter of heat release hole 222 is less than 2mm, Preferably 1 to 1.9mm.In this way, on the one hand can prevent insect from entering, and most of dust can be prevented to pass through, another party Face, air hole 41 are also able to maintain preferable gas circulation efficiency.On the other hand, if being designed as heat release hole along lamp neck 22 Outer peripheral surface and extend, then lamp neck 22, so that heat release hole becomes larger, may make heat release hole 222 due to the weight of radiator 1 by pulling force It is unable to satisfy the requirement that maximum inscribed circle diameter is less than 2mm.

As shown in figure 21, outlet of the heat release hole 222 in LED light radially radially exceeds the outer of metal portion 231 in LED Surface, the i.e. outlet of heat release hole 222 are in LED light radially positioned at the outside of the outer surface of metal portion 231.Reduce outlet row To the influence of metal portion 231 when heat out is upward, heat is avoided to be conducted again by metal portion 231 to the inner cavity of lamp housing 2 Influence the electronic building brick of power supply.

Figure 61 is the cross-sectional view of the LED light in some embodiments.Figure 62 is the setting of the convection channel in the LED light of Figure 61 Schematic diagram.As shown in Figure 61 and Figure 62, in some embodiments, the basic structure of LED light is the same as LED light shown in FIG. 1.Yu Yi In a little embodiments, inner sleeve 21 has upper and lower part, is connected between upper and lower part by a guide face 216, guide face 216 On the direction axially upwards along LED light (along the convection current direction of the first heat dissipation channel 7a), the radius in section gradually increases Add, that is to say, that there is guide face 216 direction by the air of the second heat dissipation channel 7b toward the radial outside of radiator 1 to draw The effect led so that air be made to contact with the radiating fin 11 of more many areas, and then takes away more heat on radiating fin 11 Amount.Inner sleeve 21 includes first part and second part in the axial direction, and second part is the inner sleeve of the part below of guide face 216 21 (parts including guide face 216), and the inner sleeve 21 that first part is then 216 above section of guide face (does not include guide face 216 parts), it include thermo-labile component in the electronic building brick in the second part of inner sleeve 21 in the electronic building brick of power supply 5, Such as capacitor, especially electrolytic capacitor, so that thermo-labile component is worked at a lower temperature (close to the first air inlet 2201).Its In his embodiment, high heat generating component can also be set to the second part of inner sleeve 21, such as resistance, inductance, transformer.It corresponds to For second heat dissipation channel 7b, when the air of convection current enters the second heat dissipation channel 7b, at the lower part of inner sleeve 21, the sky of convection current Gas can close to the outer wall of inner sleeve 21 and it is upward, to play heat-blocking action, that is, prevent the heat of radiating fin 11 conduct to Inner sleeve 21 it is interior, and influence the thermo-labile component in it, and when the air of convection current is continued up, the air of convection current is in guide face Under the action of 216, the air of convection current will along radiating fin 11 radial outside and flow, contact the air of convection current more with this The radiating fin 11 of many areas, to improve the thermal diffusivity on 11 surface of radiating fin.In this present embodiment, the inner cavity of inner sleeve 21 is Channel design wide at the top and narrow at the bottom greatly strengthens the effect of stack effect, helps to push the air flowing inside inner sleeve 21.This Outside, the top of lamp neck 22 is arranged in heat release hole 222, farthest at a distance from air hole, and design further strengthens stack effect whereby Effect.

Figure 63 is the main view that LED light in some embodiments removes radiator 1.Figure 64 is the exploded view of Figure 63.This reality The feature being previously mentioned applied in example can be applied in the LED light of Fig. 1.As shown in Figure 63, in some embodiments, inner sleeve 21 Runner 219 is set on periphery wall, so that the convected air of the part in inner sleeve 21 can be circulated to heat dissipation by runner 219 Device 1.In this present embodiment, runner 219 can be the gap for being provided with the lower part of 21 periphery wall of inner sleeve, be also possible to be provided with The hole of the lower part of 21 periphery wall of inner sleeve.Runner 219 be provided with it is multiple, multiple runners 219 along inner sleeve 21 circumferential direction and be distributed. At this point, the position of convex block 217 accordingly adjusts.

As shown in Figure 64, there is line pressing portion 210, line pressing portion 210 is downwardly convex compared to the lower end of inner sleeve 21 in inner sleeve 21 If opening up pressuring line groove 2101 in line pressing portion 210, so that the conducting wire of connection power supply 5 and lamp plate 3 can be caught in pressuring line groove 2101, with Complete the fixation to conducting wire.

As shown in Figure 64, there is the 4th positioning unit 2102 in inner sleeve 21, and lampshade 4 has the 5th positioning unit 46, the Four positioning units 2102 and the 5th positioning unit 46 cooperate, to limit inner sleeve 21 relative to the rotation of lampshade 4.Specific 4th is fixed Bit location 2102 is a positioning hole, and the 5th positioning unit 46 is a positioning column, and positioning column is inserted into location hole and cooperates, and is needed It is noted that positioning column is not provided on the axial direction of inner sleeve 21.Preferred positioning column and positioning hole are equipped with multiple groups.Other In embodiment, the 4th positioning unit 2102 is a positioning column, and the 5th positioning unit 46 is a positioning hole, and positioning column insertion is fixed Position hole and cooperate.

As shown in Figure 1, the outer profile of display the present embodiment LED light, establishes rectangular coordinate system, with the axial for y of LED light Axis, with the radial for x-axis of LED, using LED light bottom center as origin.The outer profile of the side of LED light is with a contour line around LED 360 degree of axis of lamp turn round and are formed the outer profile (not including lamp cap 23) of LED light, and (lamp cap 23 is usual for outer contour arbitrary point For the lamp cap of standard, therefore, do not include lamp cap 23 herein, specially the outer profile that is constituted of radiator 1 and lamp neck 22) meet Following formula:

Y=-ax³+bx²-cx+K

Wherein K is constant, the range that the range that the range of K is 360~450, a is 0.001~0.01, b is 0.05~ 0.3, c range is 5~20, preferably 10~18, more preferably 12~16.

Hereinafter, for a, b, c take following values respectively:

Y=-0.0012x³+0.2235x²-14.608x+K

And the range of K is 360~450.

Above-mentioned formula content is also it is understood that the arbitrary point on contour line falls into y=-0.0012x³+0.2235x²- 14.608x+ 360, and y=-0.0012x³+0.2235x²- 14.608x+450, between this two lines.

In general, comprehensively consider the factors such as heat dissipation effect, thermodynamic principles, hydrodynamics, meet the relationship of the formula It can reach good heat dissipation effect.

Specifically, on the one hand, when contour line arbitrary point meets above-mentioned formula, keep LED light preferably (special with lamps and lanterns It is not the lamps and lanterns of cone-shaped) matching (as shown in Figure 66).On the other hand, when contour line arbitrary point meets above-mentioned formula, so that By its bottom along its axially upward direction, the width of LED light entirety substantially successively decreases shape LED lamp.For radiator 1, heat dissipation The lower part of device 1 is rapidly transferred to the generated thermal energy in LED light operation of LED chip 311 mainly by the mode of conduction It radiates on radiator 1, and top mainly radiates to radiator 1 by modes such as radiation and convection current.Therefore, it radiates The lower part design of device 1 has more areas to carry out heat transfer (1 width of radiator of lower part is big, has bigger heat dissipation area).It is right For lamp neck 22, lamp neck 22 be down big up small shape, that is to say, that the sectional area of lamp neck 22 LED axially upwards when, Sectional area tapers off state, is radiated when lamp neck 22 provides power supply 5 by convection type, and heat release hole 222 is opened in lamp neck 22 tops, the then when air of convection current is upward, because 22 decreasing cross-sectional area of lamp neck promotes its convection velocity to increase, so that the sky of convection current When heat release hole 222 is discharged in gas, there is biggish initial velocity, and then air is made, far from heat release hole 222, to prevent hot gas when being discharged It is gathered near heat release hole 222.

In the present embodiment, contour line is continuous lines.In other embodiments, contour line can be the lines of multisection type (as shown in Figure 66).

In the present embodiment, contour line is smooth or substantially smooth curve, cuts hand to avoid angle is formed, on the other hand For, the air of convection current can be made more smooth along the convection current of the outside of LED light.The contour line of LED light in the present embodiment is substantially For a serpentine curve, the curve of the serpentine includes the curve on curve and radiator 1 on lamp neck 22.22 outer wheels of lamp neck Serpentine curve is collectively formed in the curve on curve and radiator 1 on exterior feature.It should be noted that lamp neck 22 and radiator 1 Junction may will form angle, and with the flatness of the part of damage curve, so in general, contour line is whole or in flat Sliding shape.In addition, the LED light under same width dimensions, if contour line is curve, compares straight line, has bigger face Long-pending outer surface, to provide the area that more can be used for heat radiation.

As shown in Figure 66, the outer profile for showing LED light in the present embodiment, establishes rectangular coordinate system, is with the axial direction of LED light Y axis, with the radial for x-axis of LED, using LED light bottom center as origin.The outer profile of the side of LED light with a contour line around 360 degree of axis of LED light turn round and are formed the outer profile (not including lamp cap 23) of LED light.Contour line includes the profile of lamp neck 22 The contour line of line and radiator 1.

Wherein, lamp neck 22 is used to accommodate power supply 5, is mainly radiated with convection type to the power supply 5 in it, lamp neck 22 It is constant that contour line, which has slope an a, a,.It as shown in Figure 66, can a virtual straight line when the contour line of lamp neck 22 is curve Come represent lamp neck 22 contour line rough slope.For example, the line L1 for taking the vertex of 22 contour line of lamp neck to bottom point carrys out generation 22 contour line of table lamp neck, or the center at the top of lamp neck 22 is taken to represent 22 contour line of lamp neck to the line L2 of bottom point.This reality The vertex of 22 contour line of lamp neck will be taken in example to the line L1 of bottom point to represent 22 contour line of lamp neck, to explain by applying.

Wherein, radiator 1 is mainly used for radiating to LED chip 311 with conduction pattern, the contour line tool of radiator 1 Having slope a b, b is constant.As shown in Figure 66, when the contour line of radiator 1 is curve, can a virtual straight line represent The rough slope of the contour line of radiator 1.For example, taking the vertex of the contour line of radiator 1 to the line L3 of bottom point to represent The center at the top of 1 contour line of radiator or radiator 1 represents 1 contour line of radiator to the line L4 of bottom point.This reality It applies and takes the vertex of the contour line of radiator 1 in example to the line L3 of bottom point to represent 1 contour line of radiator, to explain.

In the present embodiment, absolute value of the slope a greater than slope b or slope a is greater than the absolute value of slope b.Therefore, always From the point of view of on body, the contour line of lamp neck 22 is steeper than the contour line of radiator 1.For lamp neck 22, in required setting power supply 5 Under the unanimous circumstances of space, to guarantee stack effect when convection current in lamp neck 22, lamp neck 22 is needed to keep certain height, such as The profile of fruit lamp neck 22 is more flat (slope is small), and in the case where keeping identical altitudes, the internal volume of lamp neck 22 be will increase, so And actual help is had no for power supply real space.For radiator 1, in the case where guaranteeing heat dissipation effect, to control In addition the height for making whole lamp, more flat (slope is small) that therefore, it is necessary to radiator 1 is arranged are dissipated with controlling its whole height When hot device 1 more flat (slope is small), under the premise of heat dissipation area is identical, the lower part of radiator 1 can have more for LED The area of the heat dissipation conduction of chip 311.

In the present embodiment, the value of slope a is greater than 2, preferably 2.5~5, more preferably 3~4, most preferably 3.2~3.8. So as to have better stack effect in lamp neck 22 when heat loss through convection.

In the present embodiment, the value of slope b be less than 3, preferably 1~2.5, more preferably 1.4~2, most preferably 1.5~ 1.9.So that the lower part of radiator 1 has more areas for conducting.

In the present embodiment, the contour line of LED light is continuous lines, the i.e. bottom of the contour line of lamp neck 22 and radiator 1 Contour line at the top of connect.In other embodiments, contour line can be the lines (as shown in Figure 66) of multisection type, than Such as, the top of the contour line of the bottom of the contour line of lamp neck 22 and radiator 1 has interval, therefore contour line is not on the whole Continuously.

In the present embodiment, the contour line of lamp neck 22 is the curve of indent, that is to say, that by the vertex of the contour line of lamp neck 22 With the virtual straight line of line of bottom point, the contour line of lamp neck 22 is entirely located in the inside of the straight line (close to the one of LED light axis Side), and the contour line of radiator 1 is the curve of evagination, by the line on the vertex of the contour line of radiator 1 and bottom point virtual one Straight line, the contour line of radiator 1 are entirely located in the outside of the straight line (side far from LED light axis).And contour line is smooth Or substantially smooth curve, hand is cut to avoid angle is formed, for another aspect, the air of convection current can be made along the outer of LED light The convection current in portion is more smooth.The contour line of LED light in the present embodiment substantially a serpentine curve or the curve of falling serpentine, should Curve includes the curve on curve and radiator 1 on lamp neck 22.The curve on curve and radiator 1 on lamp neck 22 is common Form serpentine or " S " curve.It should be noted that the junction of lamp neck 22 and radiator 11, may will form angle, with The flatness of the part of damage curve, but generally from the point of view of, contour line is whole or in smooth shape.In addition, lamp neck 22 with Radiator 1 is it could also be possible that (for example lamp neck 22 and radiator 1 keep certain interval) separated, that is to say, that on lamp neck 22 Curve and radiator 1 on curve be disconnect, but generally from the point of view of, contour line is whole or in smooth shape.Lamp neck 22 outer profile is the curve of indent, therefore during downwards, the increasing degree of the size of lamp neck 22 increases, so that most There is biggish size to be combined with radiator 1 for the bottom of whole lamp neck 22, that is to say, that the initial position on the top of radiator 1 It can get biggish size.The outer profile of radiator 1 is the curve of evagination, therefore during upwards, the size of radiator Reduction amplitude is incremented by, and therefore, the size decaying of the lower part of radiator 1 is slower, and therefore, lower part, which has, more can be used for radiating Radiating fin 11 area.In other embodiments, the outer profile of lamp neck 22 can be straightway, and the outer profile of radiator 1 For curve, in addition, the straight line can be parallel with LED light.In other embodiments, the contour line of lamp neck 22 and the profile of radiator 1 Line can be the combination of straightway or multiple spot straightway.

The arbitrary point of the contour line of lamp neck 22 meets following formula in the present embodiment:

Y=-ax+k1+h,

Wherein k1 is constant, and h is the height of radiator 1.

The arbitrary point of the contour line of radiator 1 meets following formula:

Y=-bx+k2,

Wherein, k2 is constant.

In the present embodiment, when the whole width dimensions of LED light are controlled in 100mm to 220mm, the value of k1 be 100 to 200.The value of k2 is 100 to 200.For example, when the width dimensions of LED light are up to 200mm, the value of k1 is 140~ 150, k2 value is 170~200.

In the present embodiment, the height of lamp neck 22 is greater than 80% or more of the height of radiator 1.Due to lamp neck 22 and radiator 1 in the axial direction when separate, the two without coincidence, therefore the power supply 5 in lamp neck 22 influenced by radiator 1 it is smaller, therefore, when When the height of lamp neck 22 is greater than 80% or more of the height of radiator 1, it can get more spaces to be arranged power supply 5, and this portion Independent power source is influenced smaller by radiator 1.In addition, when the power supply 5 in lamp housing 2 reaches heat dissipation effect by convection type, lamp neck The setting of 22 height, it is ensured that the height of lamp housing 2, to guarantee stack effect when heat loss through convection.

As shown in Figure 69, the outer profile for showing LED light in the present embodiment, establishes rectangular coordinate system, is with the axial direction of LED light Y axis, with the radial for x-axis of LED, using LED light bottom center as origin.The outer profile of the side of LED light with a contour line around 360 degree of axis of LED light turn round and are formed the outer profile (not including lamp cap) of LED light.Contour line includes the contour line of lamp neck 22 With the contour line of radiator 1.As shown in Figure 69, the outer profile of the LED light in the present embodiment includes that first surface and second are bent Face, first surface and the second curved surface collectively constitute the curved surface of the outer profile of LED light, and first surface includes the outer profile of lamp neck 22 Curved surface or lamp neck 22 outer profile and partial radiator 1 outer profile curved surface, the second curved surface includes radiator 1 The curved surface of the outer profile of the curved surface or part heat sink 1 of outer profile.

The contour line of lamp neck 22 in the present embodiment is a curve or rough curve, and the contour line of radiator 1 is one bent Line or rough curve cut hand to avoid angle is formed, for another aspect, the air of convection current can be made along the outside of LED light Convection current it is more smooth.The radius of curvature of the contour line of lamp neck 22 in the present embodiment is greater than the profile curvature of a curve of radiator 1 Radius, it should be noted that the radius of curvature of the contour line for the lamp neck 22 that this place refers to is greater than the song of the contour line of radiator 1 Rate radius refers to 60% or more of the contour line for the radiator 1 that 60% radius of curvature of the contour line of lamp neck 22 is greater than Radius of curvature, i.e., it is believed that the radius of curvature of the contour line of lamp neck 22 be greater than radiator 1 contour line radius of curvature.

As shown in Figure 69, the radius of curvature of the contour line of the lamp neck 22 in the present embodiment is 120mm~3000mm, preferably 150mm~200mm, more preferably 160mm~190mm, most preferably 170mm~185mm.The profile curvature of a curve of radiator 1 Radius is 30mm~150mm, preferably 70mm~130mm, more preferably 80mm~120mm, most preferably 90mm~110mm. Based on above-mentioned statement, if there is 60% or more radius of curvature is in this range or the song of the curve most identical with contour line Rate is considered as the radius of curvature of the contour line of lamp neck 22 or radiator 1.Such as lamp neck 22,60% or more song of contour line Rate radius is 180mm, then it is assumed that the radius of curvature of lamp neck 22 is 180mm.Based on above-mentioned statement, it is also understood that being, with wheel The similar curve of profile, Lai Daibiao profile curvature of a curve, that is to say, that contour line itself can not be curve.Some implementations In example, in the case where considering the width dimensions of LED light entirety, the contour line of the contour line of lamp neck 22 and radiator 1 respectively with The width of the whole lamp of LED is related, LED light width dimensions (size of LED light the widest part) are L, then the lamp neck 22 in the embodiment The radius of curvature of contour line is 0.6L~15L, preferably 0.75L~L, more preferably 0.8~0.95L, most preferably 0.85L ~0.925L.The radius of curvature of the contour line of radiator 1 be 0.15L~0.75L, preferably 0.35L~0.65L, more preferably 0.4L~0.6L, most preferably 0.45L~0.55L.That is, the profile curvature of a curve of lamp neck 22 and the profile of radiator 1 Curvature of a curve changes with the change width of the whole lamp of LED light.In some embodiments, the outer diameter of 22 maximum of lamp neck is R, then The radius of curvature of the contour line of radiator 1 is greater than L/2-R/2, to guarantee that radiator has enough height, to guarantee second The stack effect of heat dissipation channel 7b.

In the present embodiment, central angle c shared by the contour line of lamp neck 22 is 10~50 degree, preferably 20 degree to 35 degree, more excellent It is selected as 25 to 30 degree.Keep lamp neck 22 in certain height with this, to guarantee the stack effect of the convection current in lamp neck 22.

In the present embodiment, central angle d shared by the contour line of radiator 1 spends for 40 to 120, and preferably 55 degree to 90 degree, more Preferably 65 to 80 degree, most preferably 70 to 75 degree.To control the whole height of radiator 1.

In the present embodiment, the contour line of lamp neck 22 is the curve of indent, by the vertex of the contour line of lamp neck 22 and bottom point The virtual straight line of line, the contour line of lamp neck 22 is entirely located in the inside of the straight line (close to the side of LED light axis), and dissipates The contour line of hot device is the curve of evagination, by the virtual straight line of the line on the vertex of the contour line of radiator 1 and bottom point, heat dissipation The contour line of device 1 is entirely located in the outside (side far from LED light axis) of the straight line.And contour line is smooth or substantially flat Sliding curve cuts hand to avoid angle is formed, for another aspect, the air of convection current can be made along the convection current of the outside of LED light It is more smooth.The contour line of LED light in the present embodiment substantially a serpentine curve or the curve of falling serpentine, the curve include The curve on curve and radiator 1 on lamp neck 22.Serpentine is collectively formed in the curve on curve and radiator 1 on lamp neck 22 Or fall " S " curve.It should be noted that the junction of lamp neck 22 and radiator 11, may will form angle, with damage curve Part flatness, but generally from the point of view of, contour line is whole or in smooth shape.In addition, lamp neck 22 and radiator 1 It could also be possible that (for example lamp neck 22 and radiator 1 keep certain interval) of separation, that is to say, that the curve on lamp neck 22 Be with the curve on radiator 1 disconnect, but generally from the point of view of, contour line is whole or in smooth shape.Outside lamp neck 22 Profile is the curve of indent, therefore during downwards, the increasing degree of the size of lamp neck 22 increases, so that final lamp neck There is biggish size to be combined with radiator 1 for 22 bottom, that is to say, that the initial position on the top of radiator 1 can get Biggish size.The outer profile of radiator 1 is the curve of evagination, therefore during upwards, the reduction width of the size of radiator Degree is incremented by, and therefore, the size decaying of the lower part of radiator 1 is slower, and therefore, lower part has the heat dissipation that more can be used for radiating The area of fin 11.

As shown in Figure 70 a, the cooperation schematic diagram of LED light and lamps and lanterns 6 in the present embodiment is shown.Lamps and lanterns 6 in the present embodiment With an accommodating cavity 61, LED light is set in the accommodating cavity 61.The lower part opening of accommodating cavity 61 is arranged, so that LED light is from lamp The lower part of tool 6 is packed into accommodating cavity 61, and LED light during the work time caused by after thermal expansion is scattered in accommodating cavity 61, can be via Cross-ventilated mode sheds outward from open-mouth.In the present embodiment, when LED light radiates, a part of heat can be directly with heat radiation Form be transferred on lamps and lanterns 6, lamps and lanterns 6 are transferred heat to again outside lamps and lanterns 6, some heat to conduct and convection current Mode is transmitted in the air in the space between lamps and lanterns 6 and LED light, then by modes such as convection current, conduction or radiation, is transmitted to Outside lamps and lanterns 6.

As shown in Figure 70 b, the cooperation schematic diagram of LED light and lamps and lanterns 6 in an embodiment is shown.Lamps and lanterns 6 in the present embodiment On open up convection holes 62, convection holes 62 are set to the top of lamps and lanterns.So, the heat transfer of LED light to accommodating cavity 61 sky It, can be by the upward convection current of convection holes 62, so that hotter air be taken away when gas.

As shown in Figure 70 c, the cooperation schematic diagram of LED light and lamps and lanterns 6 in an embodiment is shown.Lamps and lanterns 6 in the present embodiment With a closed accommodating cavity 61.LED light due to being isolated from the outside, thus can play dust-proof after being packed into accommodating cavity 61 Effect avoids dust from accumulating in the outside or inside of LED light.At this point, generated heat when LED light work, is being transferred to accommodating After in the air of chamber 61, air is recycled in the inside of accommodating cavity 61, and is transferred heat to by way of heat transfer, heat radiation On lamps and lanterns 6, then by lamps and lanterns 6 heat is reached into outside.

In above-described embodiment, lamps and lanterns 6 can use metal material or plastic material, can be more sharp if metal material In heat dissipation, and if using plastic material, weight is lighter, and cost reduces, and using if plastic material, can set lamps and lanterns 6 It is calculated as with translucency.In the closed situation of lamps and lanterns 6, consider in heat dissipation, then lamps and lanterns 6 preferably use metal material.

Figure 65 a is the decomposition diagram of the lamp housing 20 of the LED light in some embodiments, shows the lamp housing 20 of different patterns. Figure 65 b is the assembling schematic diagram of Figure 65 a.Figure 65 c is the decomposition diagram one of the LED light in Figure 65 a.Figure 65 d is in Figure 65 a LED light decomposition diagram two.Figure 65 e is the cross-sectional view of the LED light in Figure 65 a.Such as Figure 65 a, Figure 65 b and Figure 65 c institute Show, in some embodiments, lamp housing 20 includes lamp cap 230, lamp neck 220 and inner sleeve 210；Lamp cap 230 and 220 screw thread of lamp neck connect It connects, lamp neck 220 connects inner sleeve 210, and inner sleeve 210 connects radiator 10, and specifically, 220 surrounding side of lamp neck is equipped with groove 2230,2110 alignment indentation 2230 of raised line in inner sleeve 210, inner sleeve 210 is promoted to 220 direction of lamp neck, then in a rotative pattern will Lamp neck 220 and inner sleeve 210 are clamped；Radiator 10 is equipped with locating slot 1210, and locating slot 1210 is located at the inside of thermal column 120 On wall.Card slot 2140 is equipped in inner sleeve 210, power supply 50 includes power panel 510, power panel 510 is caught in card slot 2140, from And realize the fixation of power supply 50, the quantity of card slot 2140 is arranged according to the shape of power panel 510, such as power panel 510 is two dimension When shape, the quantity of card slot 2140 is 2.In addition to this, in other examples, the form of card slot can be set to rib Power panel 510 is fixed on inner sleeve in 210 inner wall edge of inner sleeve in the form of upper and lower rib or two orthogonal ribs by strip In 210, however invention is not limited thereto.Power supply 50 is also possible that electronic building brick, such as transformer, capacitor, resistance, electricity Sense, fuse, metal-oxide-semiconductor etc. are easier to generate heat, or work as LED light when power panel 510 is inserted into inner sleeve 210 in power supply 50 The higher electronic building brick of temperature, such as transformer, capacitor or MOS pipe are generated when work, in the arrangement design of power panel 510 It is disposed in proximity to the bottom end of inner sleeve 210, that is, the airflow channel entrance compared to the closer radiator 10 of other electronic building bricks Place.Because working as the higher electronic building brick of those operating temperatures, such as transformer, capacitor or metal-oxide-semiconductor, close to the bottom end of inner sleeve 210 When, the path that cold air stream passes to the higher electronic building brick of those temperature is most short, can be well to the serious electronic building brick that generates heat It radiates, further decreases the cavity temperature of lamp housing 20, and then promote the job stability of LED lamp.Inner sleeve 210 is equipped with Positioning column 2120 corresponding with the locating slot 1210 of radiator 10, positioning column 2120 is inserted into locating slot 1210, by inner sleeve 210 It is pushed away to 10 direction of radiator, realizes that inner sleeve 210 and radiator 10 fasten.

As shown in Figure 65 a~65e, when LED light assembles, first lamp cap 230 is threadedly coupled with lamp neck 220, then by power panel 510 are caught in the card slot 2140 of 210 inside of inner sleeve, and lamp neck 220 is then connected inner sleeve 210, the positioning column in 210 outside of inner sleeve In the locating slot 1210 of 2120 insertion radiators 10, wear inner sleeve 210 to the bottom of radiator 1 by 1 center cavity of radiator； Last lamp plate 3 is to be, for example, that lampshade 40 is fastened on radiator 10 after riveting method is fixed on radiator 1.The present invention exists When assembling, using the click-on design of repeatable dismounting, easy disassembly while guaranteeing bonding strength is not broken in disassembly process Bad any part, part is reusable, solves in technology that time-consuming using screw connection, high labor cost and lamp body Structural elements high disadvantage of scrappage during repair demolition.

As shown in Figure 65 c, radiating fin includes the first radiating fin 1110 and the second radiating fin 1120, the first heat radiating fin Piece 1110 is spaced each other with the second radiating fin 1120 and interacts setting, and the second radiating fin 1120 is equipped with detent slot 150, card Position slot 150 and the detent item 2130 in 210 outside of inner sleeve are correspondingly arranged, and reinforce the bonding strength of inner sleeve 210 and radiator 10.

As shown in Figure 65 c and 65b, hollow column type is substantially presented in the shape of inner sleeve 210, under the inner cavity of inner sleeve 210 can be Narrow channel design (cross-sectional area that the cross-sectional area of 210 lower part of inner sleeve is less than top), the height of entire inner sleeve structural body on width It is wide that than being greater than 2.5, stack effect can be more obvious, and preferably 2.5~10.According to most common A19, A20 on the market with The standard of A67 bulb lamp, the whole height H of inner sleeve 210 can be 40~80mm.This low wide and up narrow structure can reinforce chimney The effect of effect helps to push the air flowing inside inner sleeve 210.It is dredged at the top of the top of inner sleeve 210 and lamp neck 220 Linking after the hot gas inside inner sleeve 210 is pooled to its top, can be transmitted to lamp neck via road is dredged at the top of lamp neck 220 220 heat release hole 2220, is then discharged out lamp housing 20 and achievees the purpose that heat dissipation.Above-described 210 specification size of inner sleeve only table Show that this one of practices mode, cannot function as limiting the range to be advocated.

The heat dissipating method of LED light:

In the present embodiment, the heat dissipating method of LED light includes the heat dissipation to LED chip 311 and the heat dissipation to power supply, wherein

As shown in Fig. 1, Fig. 4 and Fig. 6, for the heat dissipation (heat that generates when LED chip 311 works) of LED chip 311, The following steps are included:

S101 is arranged a lamp plate 3, LED chip 311 is installed on lamp plate 3, generates when LED chip 311 is worked At least partly heat reached on lamp plate 3 in thermo-conducting manner；

A radiator 1 is arranged in S102, and lamp plate 3 is set on radiator 1, at least portion that LED chip 311 generates when working Divide heat that can reach in thermo-conducting manner on radiator 1 via the heat of lamp plate 3, and by 1 heat radiation of radiator to week Air is enclosed, and the cross-ventilation of heat is gone out with convection type.

In above-mentioned steps S102, specifically include:

A., radiating fin 11 is set on radiator 1, and radiator 1b includes one second heat dissipation channel 7b, the second radiating channel 7b configures the second air inlet 1301, and the air of convection current enters the space between radiating fin 11 through the second air inlet 1301, To take away the heat that radiating fin 11 is radiated to air, wherein the second air inlet 1301 is set to the lower area of radiator 1；

B. radiator 1 is arranged third heat dissipation channel 7c, and third heat dissipation channel 7c is formed between two radiating fins 11 or same The space between two sheet bodies that one radiating fin 11 extends, the radial outside portion between two radiating fins 11 constitute the The entrance of three heat dissipation channel 7c, air enters in third heat dissipation channel 7c from the region of the radial outside of LED light, and band Walk the heat that radiating fin 11 is radiated air.

As shown in figure 21, in the present embodiment, an at least radiating fin 11 is radially divided into two parts LED light, and This two parts is arranged at the radially interval of LED light, to form runner in above-mentioned interval, radiates in radiator 1 When, the air of convection current can be in interval convection current, to promote the efficiency of convection current.

When radiating to LED chip 311, it is preferred that 20 to 30 square centimeters of power configuration of every watt of LED light Radiator 1 heat dissipation area so that the volume and weight of the heat dissipation effect of LED chip 311, radiator 1 have it is preferable Balance, it is ensured that in the case where heat dissipation effect, control the volume and weight of radiator 1.In the present embodiment, to have LED light The area that can more radiate, therefore configure account for 50% or more of LED light for the weight of radiator 1, preferably 55%~ 65%, and configure the volume of radiator 1 to account for 20% or more of the volume of LED light, preferably 25%~50%.

As shown in figure 40, when being radiated for LED chip 311, at least part radiating fin 11 is in LED light The projection (projection to 311 place plane of LED chip) of short transverse (axial direction) at least contacts a LED chip 311, That is in the short transverse (axial direction) of LED light, the projection of at least part radiating fin 11 and at least one LED core Piece 311 is overlapped or partly overlaps.Therefore, radiation processes being carried out, the thermally conductive pathways of LED chip 311 are shorter, thermal resistance can be reduced, Conducive to heat transfer.Preferably, (projection is extremely in the projection of the short transverse (axial direction) of LED light for any one radiating fin 11 311 place plane of LED chip) at least contact a LED chip 311.

As shown in Fig. 1 and Figure 29, for LED chip 311 radiated when, lamp plate 3 have an inboard boundary 3002 and After one outer boundaries 3003, inboard boundary 3002 and outer boundaries 3003 are upwardly extended along LED light axis, a region is formed, it will The area that radiating fin 11 is configured to the radiating fin 11 being located in the region is greater than the radiating fin 11 being located at outside the region Radiating fin 11 can be improved in this way, make the radiating fin 11 of radiator 1 is most of to both correspond to lamp plate 3 with this in area Utilization rate, increase radiating fin 11 to the effective area of LED chip 311.

As shown in figure 4, in an embodiment, for heat dissipation (heat caused by power supply when LED light works) method of power supply, The following steps are included:

S201, lamp housing 2 of the setting one with the first heat dissipation channel 7a, power supply 5 is set in the first heat dissipation channel 7a, wherein First heat dissipation channel 7a has the first air inlet 2201 and heat release hole 222；

The air of S202, convection current enter the first heat dissipation channel 7a from the first air inlet 2201, what power supply 5 generated when working Heat is radiated surrounding air, and the air of heat is discharged from heat release hole 222 by way of convection current for the air of convection current.So It can avoid power supply 5 to work under high temperature environment, and affect service life and the craftmanship of power supply.

As shown in figure 22, it will at least a heat generating component 501 (resistance, inductance, integrated circuit, transformer or rectifier bridge etc.) set Close to the position of lamp cap 23 in the first heat dissipation channel 7a, in the projection perpendicular to LED light axial direction, at least one fever When component 501 by way of heat transfer or heat radiation, heat is reached on lamp cap 23, and is scattered to heat by lamp cap 23 In air or on the lamp holder that is attached thereto.

In other embodiments, at least one heat generating component 501 thermally contacts lamp cap 23, at least one heat generating component 501 is located at In lamp cap 23, and the heat generating component 501 is contacted by Heat Conduction Material 53 with lamp cap, and the heat generating component 501 is by above-mentioned thermally conductive Material 53 and lamp cap 23 are fixed.With this, by the setting of Heat Conduction Material 53, the effect to lamp cap heat transfer both can achieve, It can play the role of fixed heat generating component, the heat generating component 501 is avoided to loosen.

In the heat dissipation design of power supply 5, position of at least heat generating component 501 in the axial direction of LED light is higher than heat release hole 222 position should be radiated higher than most of heat of the heat generating component 501 of heat release hole 222 by lamp cap 2 or other approach.

In 5 heat dissipation design of power supply, an at least heat generating component and other heat generating components are arranged in the difference of power panel 51 On surface, when cross-ventilation, the heat that heat generating component is radiated to surrounding air is taken away along this both side surface convection current respectively.

The assemble method of LED light:

As shown in Fig. 2, in an embodiment, the assemble method of LED light the following steps are included:

S301 configures a lamp plate 3, in setting LED chip 311 on lamp plate 3；

S302 configures radiator 1；

S303 configures power supply 5；

S304 configures lamp housing 2；

Sequence in above-mentioned steps S301~S304 can be arbitrarily arranged,

S305, by power supply 5 in lamp housing 2；

S306 by lamp housing 2 on radiator 1, and realizes that power supply 5 is electrically connected with lamp plate 3；

S307 configures a lampshade 4, lampshade 4 is covered at lamp plate 3 and being fixed on radiator 1, so that LED core Light caused by piece 311 penetrates the light output surface 43 of lampshade 4 and projects.

In above-mentioned steps, it can need to come set-up procedure sequence according to actual assembly.It, can be in step in above-mentioned steps After 304, lamp plate 3 is connect in a manner of fitting with radiator 1, so that lamp plate 3 and 1 shape of radiator are integral.

In step s 304, when configuring lamp housing 2, screw thread is accordingly set on lamp cap 23 and lamp neck 22, so that 23 He of lamp cap Lamp neck 22 directly realizes connection by screw thread.

In step S307, the inner sleeve 21 of lamp housing 2 is first connected to heat dissipation dismountable connection type such as to engage, fasten On device 11.Herein, after lamp housing 2 being completed installation, inner sleeve 21 is directly connect with radiator 11 together with 2 entirety of lamp housing, It is also possible to after individually connecting inner sleeve 21 with radiator 1, then the other component of lamp housing 2 and inner sleeve 21 is completed to fix, It is exactly lamp neck 22 and inner sleeve 21 is connected and fixed.

As shown in Figure 31 and Figure 60, the connection structure and method of inner sleeve 21 and radiator 1 is specific as follows: radiator 1 has Centre bore, 21 surface of inner sleeve have convex block 217, have the first confined planes 2171, the periphery of opposite inner sleeve 21 on convex block 217 Surface and be convexly equipped in the peripheral surface, and between the radiating fin 11 of radiator 1, for radial inside, its spacing is greater than The width of convex block 217, when inner sleeve 21 is inserted into the centre bore of radiator 1, convex block 217 is aligned between two radiating fins 11 and It is inserted into radiator 1, until the first confined planes 2171 of convex block 217 exceed the bottom of radiating fin 11 in the axial direction of LED light Face rotates inner sleeve 21 at this time, so that the first confined planes 2171 and the bottom surface of radiating fin 11 is offseted, in addition to this, inner sleeve 21 also has There are the second confined planes 218, when the bottom surface of the first confined planes 2171 and radiating fin 11 offsets, the second confined planes 218 are butted on scattered On the top surface of hot fin 11, with this, inner sleeve 21 is realized with radiator 1 just and is connect, and without the external structure such as bolt Part dismounts more convenient.When need to dismantle inner sleeve 21, by above-mentioned steps inverse operation.

Preferably, setting third confined planes 2172 are inside put on, third confined planes 2172 are located at convex in the circumferential direction of inner sleeve 21 The side of block 217, to limit the rotation of radiating fin 11, in the installation of inner sleeve 21 to radiator 1, by the alignment of convex block 217 and two It is inserted into radiator 1 between radiating fin 11, until the first confined planes 2171 of convex block 217 surpass in the axial direction of LED light The bottom surface of radiating fin 11 out rotates inner sleeve 21 at this time, so that the first confined planes 2171 and the bottom surface of radiating fin 11 is offseted, directly Until the side and third confined planes 2172 for turning to radiating fin 11 offset, make the first limit to prevent inordinate rotation Face 2171 and radiating fin 11 misplace.

As shown in Figure 59 a~59b, the connection method of the lamp neck of inner sleeve 21 and lamp housing 2 is as follows: having first to determine in inner sleeve 21 Bit location 211, and there is the second positioning unit 221 on lamp neck 22, the first positioning unit 211 and the second positioning unit 221 are detained It closes.Specifically, the first positioning unit 211 is to be provided with buckling parts on interior set, and the second positioning unit 221 is to be provided with lamp Buckle on neck, and buckling parts is directly fastened and connected with buckle.

As shown in Figure 31~Figure 33, in step S308, lampshade 4 and the specific connection method of radiator 1 are as follows: lampshade 4 one engaging portion 46 of setting, and hole is arranged in corresponding position on radiator 1, and the engaging portion 46 of lampshade 4 is passed through above-mentioned gap and is blocked At the back side of heat dissipation base 13 134.

Figure 71 is the circuit layout schematic diagram one of the LED module in some embodiments.Figure 72 is that the amplification in Figure 71 at D is shown It is intended to.Figure 73 is the circuit layout schematic diagram two of LED module in some embodiments.In LED module and Figure 72 in Figure 71 LED module can be applied in the LED light of Fig. 1.As shown in Figure 71, Figure 72 and Figure 73, LED module 70 includes at least one LED Unit 710.LED unit 710 is two or more, and is connected in parallel between LED unit.Each LED unit 710 includes at least One LED711.When a LED unit 710 includes multiple LED711, the LED711 of the same LED unit 710, which connects, to be connected It connects, the anode of first LED 711 couples the anode of the LED unit 710, and the negative terminal coupling of first LED 711 is next Or second LED 711.And the anode of the last one LED711 couples the negative terminal of previous LED 711, the last one LED 711 Negative terminal couple the negative terminal of the LED unit 710.

As shown in Figure 71, in some embodiments, LED module 70 includes five LED units 710, for showing in scheming, LED module 70 is distributed on two circumference, i.e. inner periphery and the outer periphery, is wherein arranged in inner circumferential there are two complete LED unit 710, And there are two complete LED units 710 for setting on periphery, and for the 5th LED unit 710, major part LED611 is set to On periphery, and small part is set in inner circumferential, that is to say, that the 5th LED unit 710 is located at the LED711 in inner circumferential less than position In the LED711 on periphery.

As shown in Figure 73, in some embodiments, LED module 70 includes 10 LED units 710, is come with display in scheming It says, LED module 70 is distributed on three circumference, i.e. inner circumferential, centre and periphery, and wherein there are two complete LED for setting in inner circumferential Unit 710, and complete LED unit 710 there are four being arranged on periphery, intermediate then three complete LED units 710 of setting, and For tenth LED unit 710, major part LED711 is set in inner circumferential, and small part is set on periphery, that is to say, that the Ten LED units 710 are located at the LED711 in inner circumferential and are more than the LED711 being located on periphery.

The quantity of LED711 in LED unit 710, preferably 10 to 20, more preferably 12 to 16.

As shown in Figure 71, Figure 72 and Figure 73, LED711 is substantially being circumferentially arranged along lamp plate 3 on lamp plate 3, It is to be connected between LED711 by the first conducting wire 712 if the LED711 of same LED unit 710 is respectively positioned on same circumference It connects, in other words, the series connection between LED711 on same circumference is realized by the first conducting wire 712.Same LED unit If 710 LED is divided into two parts, a portion is located on a circumference, and another part is located on different circumference, then It is connected between LED711 on the same circumference of same LED unit 710 by the first conducting wire 712, and same LED unit 710 Connected between LED711 on different circumference by the second conducting wire 713, the width of the second conducting wire 713 less than the first conducting wire 712, In order to preferably carry out the arrangement of LED711, if the width of the second conducting wire 713 is excessive, will affect on corresponding circumference The spacing of relevant LED711 makes the spacing be significantly greater than the spacing of other LED711.

As shown in Figure 71, Figure 72 and Figure 73, the first conducting wire 712 has a width, and width is at least more than LED711 (LED Chip 311) width, and the first conducting wire 712 use metal material be conducive to LED711 with good heating conduction The heat dissipation of (LED chip 311), and the width due to the width of the first conducting wire 712 at least more than LED711 (LED chip 311), The more conducively installation of LED711 makes it be easier to be electrically connected with the formation of the first conducting wire 712.

As shown in Figure 71, Figure 72 and Figure 73, LED711 is distributed on the different circumference on lamp plate 3, that is to say, lamp plate 3 On at least there are two groups of circumference LED711 is arranged, what this two groups of circumference were substantially concentric.Positioned at most inner side or outermost The first conducting wire 712 for using when connecting between the LED711 on circumference, at least partly first conducting wire 712 its width therein are big The first conducting wire used when connecting between other the first conducting wires 712, the LED711 in most inner side or outermost circumference 712, due on the outside or setting of the inside without other LED711, making its width, there is no limit therefore most inner side or outermosts Circumference on LED711 between when connecting the first conducting wire 712 for using in radial inner or outer side setting expand part 7121, increase its width, to increase the area of the first conducting wire 712, more conducively radiates.It illustrates by Figure 73, has three The circumference of a setting LED711, wherein the width of the first conducting wire 712 in most inner side and outermost circumference is significantly greater than intermediate The width of the first conducting wire 712 on the circumference of side.

Hole location 301 for installing lamp plate 3 is set as shown in Figure 71 and 72, on lamp plate 3, and lamp plate 3 passes through above-mentioned hole location 301 And rivet or be threadedly connected on heat dissipation base 13, since hole location 301 occupies space, the corresponding to hole location 301 One conducting wire 712 avoids hole location 301 compared to the first conducting wire 712 on same circumference and closer to inner or outer side, with this.And Compared with the width of first conducting wire corresponding to the hole location 301 there is the width for the first conducting wire 712 for expanding part 7121 to want small, with This, can reduce the amplitude of the first conducting wire 712 evacuation hole location 301.

As shown in Figure 71 and Figure 72, perpendicular on the direction of lamp plate 3, single led 711 area is M1, perpendicular to lamp On the direction of plate 3, single led 711 are projected on lamp plate 3, and the area for the first conducting wire 712 that the region of covering includes is M2, It meets following relationship: M2:M1=1:(0.85~0.96), preferably M2:M1=1:(0.9~0.96).So that LED611 can Correspond to the area that more can be used for the first conducting wire 711 to radiate.

It as shown in Figure 71 and Figure 72, is connected between different LED units 710 by privates 714, privates 714 connects The anode or privates 714 for meeting first LED711 of two different LED units 710 connect two difference LED units The cathode of 710 the last one LED711.The width of privates 714 is less than the first conducting wire 712.

As shown in Figure 71 and Figure 72, LED module 70 includes two electrode terminals, is as shown in this embodiment positive terminal 701 With negative terminal 702, positive terminal 701 is compared any LED711 with negative terminal 702, the first conducting wire 712, second is led Line 713 or privates 714 are located at the inside of 3 radial direction of lamp plate of LED light.It, can also be by positive terminal in other embodiments 701 are set as comparing any LED711, the first conducting wire 712, the second conducting wire 713 or privates with negative terminal 702 714 are located at the more lateral of LED lamp panel radial direction.To make positive terminal 701 and negative terminal 702 be conducive to complete to connect with power supply 5 It connects.In addition, positive terminal 701 and negative terminal 702 have different shapes, distinguished in favor of making.

Please refer to Figure 74-Figure 82.A kind of power module for powering for LED light is provided in the application embodiment, is wrapped It includes: for receiving the input terminal (ACN, ACL) of alternating current drive signal；First rectification circuit 100 is used to drive the exchange Dynamic signal is converted to rectified signal；Filter circuit 200 is used to the rectified signal being converted to filtered signal；Electricity Power-switching circuit 400 is used to being converted to filtered signal into the power supply signal that can light LED light source 500；With it is described defeated Enter end (ACN, ACL), the bias generating circuit 600 that power-switching circuit 400 is connected；600 energy of bias generating circuit The alternating current drive signal is depressured to the operating voltage to form the power-switching circuit 400.

Alternating current drive signal is depressured by power module provided by present embodiment by the way that bias generating circuit 600 is arranged The operating voltage of the power-switching circuit 400 is formed, provides operating voltage for power-switching circuit 400 so that power supply turns The operation of circuit 400 is changed, the driving of LED light source 500 is lighted.As it can be seen that the power module passes through master using bias generating circuit 600 The power supply conversion regime of dynamic formula carries out power supply conversion to externally input alternating current drive signal, can quickly form power supply conversion Operating voltage needed for circuit 400, and then effectively promote LED light starting speed.

When utilizing the power module in Figure 75-Figure 82 illustrated embodiment, the starting speed of HID-LED can be down to about 60ms has very high application value and good usage experience.

The power module can be adapted in high-capacity LED lamp, wherein the output power of power-switching circuit 400 can be with In 30W or more.As shown in Fig. 2, input terminal can be two pins of power module: the first pin ACL, the second pin ACN. Pass through two pin input AC driving signals.Alternating current drive signal can be 220V AC signal, or other voltages The AC signal of value.Certainly, input terminal (ACN, ACL) also can have multiple pins, for example, four pins etc., only need energy Enough input AC electricity, the application and with no restriction.

In the application embodiment, the first rectification circuit 100 can be a bridge rectifier.As shown in Figure 76, scheme 76 be the rectification circuit of one embodiment of the application and the schematic diagram of filter circuit.First rectification circuit 100 include diode D7, D8, D9,D10.First rectification circuit 100 can carry out full-wave rectification to alternating current drive signal (alternating current), to generate direct current drive Dynamic signal (direct current).

Specifically as shown in Figure 76, an anode of diode D7, D9 are electrically connected the first end of the filter circuit 200, and two The anode of diode D8, D10 is electrically connected in the cathode of pole pipe D7, D9, and the cathode of the diode D08, D10 electrically connect Connect the second end of the filter circuit 200.The tie point of above-mentioned diode D7 and diode D8 is electrically connected the first pin ACL. The anode of diode D7, D9 are electrically connected one end of the filter circuit 200, and cathode is electrically connected the anode of diode D8, D10, And the cathode of diode D8 is electrically connected the cathode of diode D10.The tie point of above-mentioned diode D9 and D10 is electrically connected Second pin ACN.

In addition, the first rectification circuit 100 is also possible to other kinds of full-wave rectifying circuit or half-wave rectifying circuit, without Influence the present invention program function to be reached.

In the present embodiment, which includes capacitor C1 and C2 and inductance L1.Capacitor C1's and inductance L1 First end is electrically connected the cathode of diode D8 and D10 as the second end of filter circuit 200, and the second end of inductance L1 is electrical The first end of capacitor C1 is connected, and the second end of capacitor C1 and C2 are electrically connected two poles as the first end of filter circuit 200 The anode of pipe D7 and D9.The filter circuit 200 receives the direct current (rectified signal) after the rectification of the first rectification circuit 100, And filter out the radio-frequency component in direct current.Through the filtered direct current of filter circuit 200, waveform is a smooth direct current wave Shape.Through filtered signal late-class circuit can be given to by connecting pin 301 and 302.

In some embodiments, which only can also realize filter function comprising capacitor C1, without influencing The application function to be reached.

In the application embodiment, it is also provided between input terminal ACN, ACL and rectification circuit 100 as shown in Figure 75 Electromagnetic interference suppression circuit 900 (being referred to as EMI suppression circuit).It can be reduced by electromagnetic interference suppression circuit 900 Magnetic field is interfered to influence driving signal bring.In the electromagnetic interference suppression circuit 900, two of input terminal ACN, ACL Be connected with magnet exciting coil LF2 on the power supply line (bus, main line) that pin is connected, by main line connection resistance branch (such as electricity Branch where hindering R1) and multiple capacitive branch (such as capacitor CX2, CX1, CX3) place branch, and it is respectively and dry at two Inductance Li1, Li2 of road are electrically connected.

Certainly, electromagnetic interference suppression circuit 900 can use electromagnetic interface filter circuit, which is equipped with multiple filtering groups Part, specifically, the electromagnetic interface filter circuit is equipped with differential mode capacitor, common mode inductance and common mode capacitance.

In the application embodiment, power-switching circuit 400, which can be converted to filtered signal, can light LED light source 500 power supply signal.Power-switching circuit 400 can carry out the change of voltage value to filtered signal, form target voltage values DC driven signal.Power-switching circuit 400 has output end, is driven with exporting the direct current of target voltage to LED light source 500 Dynamic signal.

In addition, fuse F1 can also be in series on the main line that input terminal ACN, ACL are connected.Fuse F1 can be Current insurance silk, or Thermal Cutoffs, present embodiment and with no restriction.

Figure 78 is the schematic diagram of the power-switching circuit of one embodiment of the application.As shown in Figure 74, Figure 78, power supply conversion electricity Road 400 receives the signal that front stage circuits provide by connecting pin 401 and 402, and passes through connecting pin 501 and 502 for generation Power supply signal is provided to rear class, wherein the power-switching circuit 400 can use PWM (Pulse Width Modulation) Circuit realizes the output of echo signal by control pulse width.Specifically, power-switching circuit 400 may include controller U2, power switch Q2, voltage transformer T2 and diode D10, by controller U2, power switch Q2, diode D10 with Energy storage coil (coil between power switch Q2 and connecting pin 502 is serially connected in voltage transformer T2) matches needed for output The power supply signal (DC driven signal) of voltage value and/or current value.Wherein, switching controller U2 generates electricity in response to bias Operating voltage VCC signal that road 600 is supplied and start, to export pwm control signal to control cutting for power switch Q2 It changes, fills the energy storage coil repeatedly in response to the switching of power switch Q2 and can and release energy, and tieed up by two pole D4 pipes Lasting stream, and then required power supply signal is formed between connecting pin 501 and connecting pin 502.

Wherein, power switch Q2 can be MOS switch pipe.The first end (power end) of controller U2 connects the bias The output end of generation circuit 600, the second end of controller U2 connect one end of the induction coil of the voltage transformer T2.Its In, the negative pole end (that is, connecting pin 502) of one end connection DC output end of the energy storage coil of the voltage transformer T2 is another The anode of end connection diode D4.The positive terminal (that is, connecting pin 501) of the anode connection DC output end of diode D4.Control One end of the induction coil for the voltage transformer T2 that the second end of device U2 is connected, the other end ground connection of the induction coil.Control The third end of device U2 connects the control terminal of the power switch Q2 by resistance R9, and the first end of power switch Q2 connects two poles Tie point between pipe D4 and voltage transformer T2, and the 4th end of the second end connection controller U2 of power switch Q2.Electricity Power-switching circuit 400 can also be equipped with sample circuit to sample its working condition, and the ginseng as controller U2 output signal It examines.

For example, the sample circuit such as line of induction comprising resistance R8 and R10, capacitor C6 and voltage transformer T2 Circle, wherein controller U2 can sample busbar voltage from resistance R8 and capacitor C6 by first end, pass through second end from the sense It answers coil sampled output current and flows through the electric current of power switch Q2 from the sampling of one end of resistance R10 by the 4th end.It adopts The setting of sample circuit is related with the control mode of controller U2, this exposure is not limited only to this.

In the present embodiment, at least one end of switch controller U3 is connected with the branch where inductance L2, switch control Filtering unit and/or current stabilization component, the application and with no restriction can be equipped between device and inductance.

To mitigate influence of the harmonic wave to circuit characteristic, transition loss is reduced.The power-switching circuit 400 and the filtering Circuit of power factor correction 300 can be also equipped between circuit 200.The circuit of power factor correction 300 can be by adjusting institute The characteristics of signals (such as phase, level or frequency etc.) for stating filtered signal promotes the power factor of the filtered signal；Institute Circuit of power factor correction 300 is stated to be connected with the output end of the bias generating circuit 600.Specifically, the power factor school Positive circuit is pfc circuit, which can be active power factor correction circuit 300.

Figure 77 is the schematic diagram of the circuit of power factor correction of one embodiment of the application.As shown in Figure 77, the power factor Correcting circuit 300 can receive signal from filter circuit 300 by connecting pin 301 and 302, and pass through connecting pin 401 and 402 Corrected signal is sent to the power-switching circuit 400 of rear class to, the circuit of power factor correction 300 includes controller U1, the power switch Q1 being connected with controller U1, voltage transformer T1 and diode D3.Power switch Q1 can be MOS switch pipe.The first end (power end) of controller U1 connects the output end 607 of the bias generating circuit 600.Controller The second end of U1 connects one end of the voltage transformer T1, and a coil of voltage transformer T1 is connected on main line, control The other end for the coil that the second end of device U1 is connected is grounded.The positive terminal of main line connection DC output end (is referred to as Third pin 501).Diode D3 is connected on main line.The anode of diode D3 connect one end of the voltage transformer T1 with And filter circuit 200, cathode connects a connecting pin 401, to connect the end power-switching circuit 400, third pin 501. The third end of controller U1 connects the power switch Q1, one end connection diode D3 and voltage transformer of power switch Q1 The 5th tie point between T1.Controller U1 can also be connected with sample circuit (tie point between resistance R2 and capacitor C3 with Controller U1 is connected, and capacitor C3 is parallel with resistance R3) and other circuits, it specifically can be with reference to shown in Fig. 5.

Certainly, it is contemplated that pfc circuit has a variety of ways of realization, and can quote in the present embodiment, herein no longer Detailed description.

Figure 79 is the schematic diagram of the bias generating circuit of the application first embodiment.Please refer to Figure 75, Figure 79, the bias Generation circuit 600a may include taking electric unit 610, switch controller U3 and energy storage afterflow unit 630.It is described to take electric unit The 610 connections input terminal (ACN, ACL), the switch controller U3.The switch controller U3 connection energy storage is continuous Flow unit 630.The energy storage afterflow unit 630 has the output end 607 for output services voltage.The output end 607 connects The power-switching circuit 400 is connect, to supply operating voltage (VCC) to the power-switching circuit 400.

Wherein, the switch controller U3 taken according to electric unit 610 take electric signal control energy storage afterflow unit 630 Switching frequency to form the operating voltage of the power-switching circuit 400, and using the output end 607 to the power supply 400 output services voltage of conversion circuit.Wherein, switch controller U3 starts in response to taking the taking electric signal of electric unit 610, And by control energy storage afterflow unit 630 turn-on time, constantly turn-on deadline and repeatedly fill can and release can, and benefit Afterflow is maintained with diode D5, the operating voltage of the power-switching circuit 400 is formed whereby, recycles the output end 607 It is exported to the power-switching circuit 400.

In the particular embodiment, described to take electric unit 610 that be transformed into the alternating current drive signal and exchange drive The direct current that the voltage of dynamic signal is equal takes electric signal.As shown in Figure 75, Figure 79.It is described to take electric unit 610 whole by second Current circuit implements (beneath be known as the second rectification circuit 610).Second rectification circuit 610 is opposite including the polarity that is connected in series First diode D1, the second diode D2 (that is, the cathode of first diode D1 and the second diode D2 link together). Second rectification circuit 610 is equipped between the first diode D1, the second diode D2 and takes electric end 601.It is described to take electricity The 601 connection switch controller U3 of end.Exchange is driven by opposite polarity first diode D1, the second diode D2 Signal rectification, and then electric end 601 is being taken to export DC driven signal.

Specifically, described one end for taking electric end 501 to be also connected with first capacitor C9, the other end connection of the first capacitor C9 Ground terminal GND.The other end of one end of the switch controller U3 connection inductance L2, the inductance L2 connects the output end 607.Wherein, inductance L2 can play the role of energy storage when switch controller U3 is switched and release energy afterflow.

In the present embodiment, the energy storage afterflow unit 630 may include inductance L2, third diode D5 and the second electricity Hold C11.There is connecting pin 603 between the switch controller U3 and inductance L2.The connecting pin 603 connects third diode D5 Cathode, the anode of third diode D5 connects the ground terminal GND.Have between the inductance L2 and the output end 607 Second tie point 604.Second tie point 604 connects one end of the second capacitor C11, and the other end of the second capacitor C11 connects Meet the ground terminal GND.Third tie point (Figure 75 is not shown) is additionally provided between second tie point 604 and output end 607, it should Third tie point connects one end of load resistance, and the other end of load resistance connects the ground terminal GND.

Further, switch controller U3 can be MOS switch, be specifically as follows the IC chip for being integrated with MOS switch. Certainly, in the embodiment having, switch controller U3 may be the switching tubes such as triode.Switch controller U3 has multiple Connecting pin is referred to as connectivity port.Wherein, it takes to be formed between electric end 601 and ground terminal GND and takes electric branch；First capacitor C9 is connected on this and takes electric branch road.At least one connecting pin of switch controller U3 takes electric end described in electric branch connection by taking 601, take branch where electric branch and inductance C9 to be connected by the 4th tie point 602 with electric end 601 is taken.Ground terminal GND connection On ground path 640, third diode D5, the second capacitor C11 and load resistance are all connected with ground path 640.

Bias generating circuit 600 can also be equipped with sample circuit to sample its working condition, and as switch controller U3 The reference of output signal.

For example, sample circuit may include the first sample circuit 650 and the second sample circuit 620.Described first Sample circuit 650 takes electric end 601 (tie point 605 is formed in Figure 79), the switch controller U3 described in connecting.Described second Sample circuit 620 connects the output end 607, the switch controller U3.The switch controller U3 is adopted according to described first The sampled signal control switch frequency of sample circuit 650 and second sample circuit 620 is to export stable operating voltage.Sampling The setting of circuit is related with the control mode of switch controller U3, this exposure is not limited only to this.Fig. 7 is that the application second is implemented The schematic diagram of the bias generating circuit of example；

In further carrying out example, the bias generating circuit can be also used for providing work for temperature sensing circuit 700 Make voltage, wherein Fig. 7 is the schematic diagram of the bias generating circuit of the application second embodiment, and Figure 81 is one embodiment of the application Temperature sensing circuit schematic diagram.As shown in Figure 80, Figure 81, the temperature sensing circuit 700 and the power-switching circuit 400 are connected, and temperature detection signal is sent to the power-switching circuit 400.Temperature sensing circuit 700 can be equipped with Temperature sensor, the temperature sensor can be connected with bias generating circuit 600b, thus, bias generating circuit 600b to Temperature sensor provides operating voltage.

In this embodiment, compared to 79 embodiment of earlier figures, the bias generating circuit 600b of the present embodiment further includes crystalline substance Body pipe Q3, diode D6, resistance R12 and capacitor C10.The transistor Q3 can be (beneath with three poles for example by taking triode as an example Pipe Q3 is referred to as).Temperature sensing circuit 700 is connected with the triode Q3 of bias generating circuit 600b.Wherein, triode Q3 Collector connects the 6th tie point between the output end 607 and the 6th tie point.The emitter of triode Q3 connects The power input of temperature sensor.The base stage of triode Q3 is connected with ground line, which has ground terminal GND.

Wherein, the work that temperature sensing circuit 700 is provided in response to bias generating circuit 600b from connecting pin 701 and 702 Voltage and start, and to the controller U2 feedback temperature information (Vtemp) of power-switching circuit 400.It is more than threshold value in temperature When (that is, temperature is excessively high), the controller U2 of power-switching circuit 400 can reduce output power, so that cooling control is carried out, Guarantee the operational safety of circuit.

Further, as shown in Figure 82, the temperature sensing circuit 700 is also connected with temperature-compensation circuit 800, wherein scheming 82 be the temperature-compensation circuit schematic diagram of one embodiment of the application.The temperature sensing circuit 700 is connected to the temperature-compensating Between circuit 800 and the bias generating circuit 600b.The temperature-compensation circuit 800 and 400 phase of power-switching circuit Connection.

The temperature-compensation circuit 800 can make the reference temperature of the free end of temperature sensor more reasonable.Wherein, this reality The temperature-compensation circuit 800 for applying example can be realized (but being not limited only to this) using comparator CP, an input of the comparator CP End can receive the voltage that temperature information is indicated caused by temperature sensing circuit 700 by connecting pin 801, and will instruction temperature The voltage of degree information is compared with the reference voltage Vref on another input terminal of the comparator CP, uses judgement temperature It spends whether temperature detected by detection circuit 700 is more than threshold value, and generates instruction temperature on the output end of comparator CP Whether be more than threshold value a temperature detection signal Vtemp.The output end of temperature-compensation circuit 800 can be connected to power supply conversion electricity On the controller U2 on road 400, the temperature detection signal Vtemp is made to be fed back to the controller U2 of power-switching circuit 400 In, so that controller U2 be made to may be in response to current system ambient temperature to adjust output power.

In other embodiments, zener diode and thermistor also be can have on the temperature-compensation circuit 800.? After thermistor, amplifying circuit is connected to by an adjustable potentiometer, by the amplifying circuit negative terminal and temperature-compensation circuit 800 output end is connected.

Specifically, the circuit diagram of the temperature-compensation circuit 800 can be as shown in Figure 81, certainly, it is contemplated that the temperature is mended Repay circuit way of realization have it is a variety of, the application not with circuit shown in Figure 82 be limitation.

A kind of high-capacity LED lamp is also provided in the application embodiment, comprising: LED light source 500；As above any described Power module is connected with the LED light source 500.The high-capacity LED lamp can refer to output power 30W's or more Any kind LED light, the LED light with the output power for being equivalent to xenon lamp 30W or more either LED light source 500 are to use The LED light of high-power lamp bead (such as the lamp bead of rated current greater than 20mA).

Herein cited any digital value all include between lower limit value to upper limit value with the lower value of an incremented and The all values of upper value, there are the intervals of at least two units between any lower value and any much higher value.For example, If the value of the quantity or process variable (such as temperature, pressure, time etc.) that elaborate a component be from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, then purpose is in order to illustrate such as 15 to 85,22 are also clearly listed in the specification To 68,43 to 51,30 to 32 equivalences.For the value less than 1, suitably think a unit be 0.0001,0.001,0.01, 0.1.These are only intended to the example clearly expressed, it is believed that the institute for the numerical value enumerated between minimum and peak It is possible that combination is all expressly set forth in the specification in a similar manner.

Unless otherwise indicated, all ranges all include all numbers between endpoint and endpoint.It is used together with range " about " or " approximation " be suitable for two endpoints of the range.Thus, " about 20 to 30 " are intended to cover that " about 20 to big About 30 ", including at least the endpoint indicated.

All articles and reference disclosed, including patent application and publication, for various purposes by quoting knot Together in this.Describe combined term " substantially by ... constitute " should including identified component, ingredient, component or step and Essentially without other assemblies, ingredient, component or the step of the basic novel feature for influencing the combination.Use term "comprising" Or " comprising " describes the combination of component here, ingredient, component or step it is also contemplated that substantially by these components, ingredient, portion The embodiment that part or step are constituted.Here by using term " can with ", it is intended to illustrate described that " can with " includes What attribute is all optional.

Multiple components, ingredient, component or step can be provided by single integrated package, ingredient, component or step.Optionally Ground, single integrated package, ingredient, component or step can be divided into multiple components, ingredient, component or the step of separation.It is used to The open "a" or "an" for describing component, ingredient, component or step is not said to exclude other components, ingredient, portion Part or step.

It should be understood that above description is to illustrate rather than to be limited.By reading above-mentioned retouch State, many embodiments except provided example and many applications all will be for a person skilled in the art it is aobvious and It is clear to.Therefore, the range of this introduction should not be determined referring to foregoing description, but should referring to appended claims with And these claims full scopes of equivalent for being possessed determines.For comprehensive purpose, all articles and with reference to packet The disclosure of patent application and bulletin is included all by reference to being incorporated herein.It is omitted in preceding claims disclosed herein Any aspect of theme is not intended to abandon the body matter, also should not be considered as inventor and is not thought of as the theme A part of disclosed invention theme.

Claims

1. a kind of LED light characterized by comprising

Lamp housing；

Passive heat radiation component, the passive heat radiation component includes radiator, and the radiator includes radiating fin and heat dissipation Pedestal, the radiator are connect with the lamp housing；

Power supply, the power supply are located in the lamp housing；And

Lamp plate is connected on the radiator, and the lamp plate includes LED chip, and the power supply is electrically connected with the LED chip It connects；

The first heat dissipation channel is formed in the inner cavity of the lamp housing, first heat dissipation channel has first in one end of the lamp housing Air inlet, and the other end opposite on the lamp housing has heat release hole；

The second heat dissipation channel is formed in the radiating fin and the heat dissipation base, second heat dissipation channel has the second air inlet Hole, air is after second air inlet entrance, by second heat dissipation channel, finally from the sky between the radiating fin Between flow out.

2. LED light as described in claim 1, which is characterized in that the lamp plate offers third opening, the third opening point It is not connected to first heat dissipation channel and second heat dissipation channel.

3. LED light as claimed in claim 2, which is characterized in that the third opening is set to the region at the center of the lamp plate, And first air inlet and second air inlet are respectively from third opening air inlet.

4. LED light as described in claim 1, which is characterized in that the weight of the radiator accounts for the weight of the LED light 50% or more, and the volume of the radiator accounts for 20% or more of the volume of LED light totality.

5. LED light as claimed in claim 4, which is characterized in that the volume of the radiator accounts for the volume of the LED light totality 20%~60%.

6. LED light as claimed in claim 4, which is characterized in that the radiating fin includes that the first radiating fin and second dissipate Hot fin, the bottom of first radiating fin and second radiating fin in LED light axial direction with the heat dissipation base Connection, first radiating fin are spaced each other with second radiating fin and interact setting, the shape of second radiating fin Shape is the Y shape being divided into two.

7. LED light as described in claim 1, which is characterized in that further include lampshade, the lampshade includes light output surface and end Face, the end face are equipped with air hole, and air enters first heat dissipation channel and described second by the air hole Heat dissipation channel, first air inlet project to region shared by the end face in LED light axial direction and form first part, and institute It states other regions on end face and forms second part, the area of the air hole in the first part is greater than described second The area of the air hole on point.