CN109877724A - A kind of wafer withdrawing device - Google Patents
A kind of wafer withdrawing device Download PDFInfo
- Publication number
- CN109877724A CN109877724A CN201910147580.XA CN201910147580A CN109877724A CN 109877724 A CN109877724 A CN 109877724A CN 201910147580 A CN201910147580 A CN 201910147580A CN 109877724 A CN109877724 A CN 109877724A
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- Prior art keywords
- disk body
- grapple
- wafer
- mandril
- bar portion
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- 230000000630 rising effect Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of wafer withdrawing device, wherein includes: disk body；A plurality of mandrils are connected radially to disk body by the first telescopic device；At least three grapples are connected radially to disk body by the second telescopic device, and are staggered with a plurality of mandrils in horizontal direction；Handle, vertical is connected to disk body center, and the first telescopic device of operable connection and the second telescopic device, extends radially out and retracts in disk body to control a plurality of mandrils and at least three grapples.The beneficial effects of the present invention are: it to control a plurality of mandrils and at least three grapples in disk body extends radially out and retracts by be operably connected the first telescopic device and the second telescopic device of handle, wafer can be taken out to be implemented without with hand contact wafer, and structure is simple, it is highly-safe convenient for operation.
Description
Technical field
The present invention relates to semiconductor processing technology field more particularly to a kind of wafer withdrawing devices.
Background technique
At present during wafer is cleaned and is etched, usually wafer is transmitted in cavity, and by multiple solid
Rationed marketing is fixed, and to be cleaned and be etched to wafer, and the gap of cavity is smaller, and usually automatically delivers to realize
Wafer is taken.
In the prior art, during the cleaning of wafer and etching, when cleaning and etching machine failure, cleaning
Wafer can not be carried out by the transmitting function of itself with etching machine taking, can only remove wafer of taking by manpower, but chamber
The gap of body is smaller, wafer difficulty of manually taking, and impression of the hand may be left on wafer by hand transmitting, and wafer is caused to lack
Falling into can possibly even make manpower injured；And hand is be easy to cause crystal column surface damaged, keeps wafer normal when touching wafer
It uses, to influence the production of factory.
Summary of the invention
For the above-mentioned problems in the prior art, a kind of simple wafer withdrawing device of structure is now provided.
Specific technical solution is as follows:
A kind of wafer withdrawing device, wherein include:
Disk body；
A plurality of mandrils are connected radially to disk body by the first telescopic device；
At least three grapples are connected radially to disk body by the second telescopic device, and with a plurality of mandrils in horizontal direction
It is staggered；
Handle, vertical is connected to disk body center, and the first telescopic device of operable connection and the second telescopic device, uses
It extends radially out and retracts to control a plurality of mandrils and at least three grapples in disk body.
Preferably, wafer withdrawing device, wherein each mandril includes:
Mandril bar portion, the radial slidable connection disk body of mandril bar portion；
Ejection part, ejection part are set to mandril bar portion towards one end of disk body circumferential direction；
The one end at mandril bar portion towards disk body center connects the first telescopic device.
Preferably, wafer withdrawing device, wherein the first telescopic device includes:
Turntable, turntable are rotatably sheathed on handle, and the protrusion of corresponding mandril quantity and position is circumferentially arranged in turntable.
Preferably, wafer withdrawing device, wherein further include the first resetting apparatus, the first resetting apparatus is connected to mandril bar
Portion is towards between the one end and disk body center at disk body center.
Preferably, wafer withdrawing device, wherein each grapple includes:
Grapple bar portion, the radial slidable connection disk body of grapple bar portion；
Hook portion, hook portion are set to grapple bar portion towards one end of disk body circumferential direction, and hook portion includes coupler body, and coupler body is towards disk body
Lower section；
Grapple interconnecting piece, grapple interconnecting piece are set to grapple bar portion towards the one end at disk body center, stretch to connect second
Compression apparatus.
Preferably, wafer withdrawing device, wherein the second telescopic device includes:
Sliding sleeve, sliding sleeve are slidably sheathed on handle；
Annular protrusion is set to the one end of sliding sleeve towards disk body, is provided with the first inclined-plane on the outside of annular protrusion；
Grapple interconnecting piece is provided with the second inclined-plane of cooperation annular protrusion, to push grapple when annular protrusion pushes
Interconnecting piece is moved radially outward along disk body.
Preferably, wafer withdrawing device, wherein further include the second resetting apparatus, the second resetting apparatus is connected to grapple company
Between socket part and disk body center, reset grapple interconnecting piece in annular protrusion rising.
Preferably, wafer withdrawing device, wherein the first resetting apparatus is spring.
Preferably, wafer withdrawing device, wherein the second resetting apparatus is spring.
Preferably, wafer withdrawing device, wherein the quantity of mandril is 4 or 6.
Above-mentioned technical proposal have the following advantages that or the utility model has the advantages that by handle be operably connected the first telescopic device and
Second telescopic device is extended radially out and is retracted to control a plurality of mandrils and at least three grapples in disk body, and wafer is taken
Out, have the advantages that structure it is simple, convenient for operation and highly-safe.
Detailed description of the invention
With reference to appended attached drawing, more fully to describe the embodiment of the present invention.However, appended attached drawing be merely to illustrate and
It illustrates, and is not meant to limit the scope of the invention.
Fig. 1 is the top view of wafer withdrawing device embodiment of the present invention；
Fig. 2 is the front view of wafer withdrawing device embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without creative labor it is obtained it is all its
His embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
The present invention includes a kind of wafer withdrawing device, as shown in Figs. 1-2, comprising:
Disk body 1；
A plurality of mandrils 2 are connected radially to disk body 1 by the first telescopic device；
At least three grapples 3 are connected radially to disk body 1 by the second telescopic device, and with a plurality of mandrils 2 in level
Direction is staggered；
Handle 4, vertical is connected to 1 center of disk body, and the first telescopic device of operable connection and the second telescopic device,
It extends radially out and retracts in disk body 1 to control a plurality of mandrils 2 and at least three grapples 3.
In the above-described embodiments, the first telescopic device and the second telescopic device are operably connected to control by handle 4
A plurality of mandrils 2 and at least three grapples 3 are extended radially out and are retracted in disk body 1, contact crystalline substance with hand to be implemented without
Circle can take out wafer, and structure is simple, highly-safe convenient for operation.
Further, as preferred embodiment, above-mentioned wafer withdrawing device can be applied to monolithic process apparatus and grab
During taking wafer, monolithic process apparatus includes multiple fixed pins for fixing wafer, when cleaning and etching machine occur
When failure, cleaning and etching machine can not carry out taking for wafer by the transmitting function of itself, and a plurality of fixed pins are solid
Surely wafer is lived, the difficulty for wafer of taking more is increased；
The quantity of mandril 2 in above-mentioned wafer withdrawing device can be consistent with the quantity of fixed pin, and adjustable crystalline substance
The position of each mandril 2 in circle withdrawing device, so that each mandril 2 and fixed pin are also arranged in a one-to-one correspondence in position, and
And a plurality of mandrils 2 in above-mentioned wafer withdrawing device are connected radially to disk body 1 by the first telescopic device；
Three grapples 3 can be set in above-mentioned wafer withdrawing device, and above three grapple 3 passes through the second telescopic device, diameter
To being connected to disk body 1, and above three grapple 3 is staggered with a plurality of mandrils 2 in horizontal direction and three grapples 3 can be steady
Fixed crawl wafer, so that wafer is not fallen in the process of grasping.
And the first telescopic device of operable connection of handle 4 and the second telescopic device, to realize through user to handle
Hand 4 carries out operation and is extended radially out three grapples 3 in disk body 1 by the second telescopic device, and wafer is taken out included in wafer
Within the scope of the crawl of device, so by user handle 4 is operated three grapples 3 are radially contracted in disk body 1, with realize
Wafer is fixed in wafer withdrawing device, and does not fall off it, since a plurality of fixed pins in monolithic process apparatus will be brilliant
Circle is fixed in the cavity, therefore operating handle 4 the first telescopic devices of control stretch a plurality of mandrils 2 in 1 radial direction of disk body again
A plurality of fixed pins to be opened out, and handle 4 is carried out by user to operate wafer of taking, aforesaid operations are simple and effective, and
It can not need wafer can be taken out with hand contact wafer, more safety.
Further, as preferred embodiment, when the quantity of fixed pin is 4, the quantity of mandril 2 can be corresponded to
4 are set as, and 4 mandrils 2 are arranged in a mutually vertical manner, each mandril 2 corresponds in position with corresponding fixed pin.
Further, as preferred embodiment, when the quantity of fixed pin is 6, the quantity of mandril 2 can also be right
It should be set as 6, and the angle of 6 mandrils 2 between any two is 60 degree, each mandril 2 and corresponding fixed pin are in position
It corresponds.
Further, in the above-described embodiments, each mandril 2 includes:
Mandril bar portion 21, the radial slidable connection disk body 1 of mandril bar portion 21；
Ejection part 22, ejection part 22 are set to the one end circumferential towards disk body 1 of mandril bar portion 21；
The one end at mandril bar portion 21 towards 1 center of disk body connects the first telescopic device.
Further, as preferred embodiment, disk body 1 can radially be provided with attachment base, each mandril bar portion
21 are threaded through inside attachment base, to realize the radial slidable connection disk body 1 of mandril bar portion 21.
Further, as preferred embodiment, disk body 1 can radially be provided with multiple sliding slots, each mandril bar
Portion 21 is arranged inside corresponding sliding slot, to realize the radial slidable connection disk body 1 of mandril bar portion 21.
Further, in above-mentioned preferred embodiment, the shape of ejection part 22 can be with the fixed part of fixed pin
Shape is correspondingly arranged, wherein in use, ejection part 22 is contacted with fixed part；
For example, ejection part 22 is correspondingly arranged as circular sleeve when the fixed part of fixed pin is cylindrical；
For example, when the fixed part of fixed pin is oval or cuboid, card that ejection part 22 is correspondingly arranged as correspondingly-shaped
Slot；
It should be noted that the shape of ejection part 22 be not limited to it is above two.
Further, as preferred embodiment, the first telescopic device may include:
Turntable 5, turntable 5 are rotatably sheathed on handle 4, and turntable 5 is circumferential to be arranged the convex of corresponding 2 quantity of mandril and position
Play 51.And turntable 5 can be driven to be rotated by rotating handles 4 so that a plurality of mandrils 2 in disk body 1 extend radially out with
And it retracts.
Further, as preferred embodiment, turntable 5 can be set to disk, and turntable 5 is circumferential to be arranged corresponding mandril
The circular arc of 2 quantity and the outwardly convex of position 51.Turntable 5 can be driven to be rotated by rotating in the forward direction handle 4, circular arc pushes
Mandril 2 is extended radially out in disk body 1, when the extension elongation of mandril 2 reaches vertex, continues to rotate in the forward direction handle 4, can be by the
One resetting apparatus is radially contracted in disk body 1 by mandril 2, and since the effect of circular arc can control 2 retraction speed of mandril, thus
It avoids scratching wafer；It can also be by reversely rotating handle 4, so that mandril 2 is radially contracted in disk body 1.
Further, as preferred embodiment, the first telescopic device may include:
Gear structure can drive gear structure to be rotated by rotating handles 4, so that a plurality of mandrils 2 are in disk body 1
It extends radially out and retracts.
It should be noted that the first telescopic device is not limited to above two structure, it can be other transmission devices.
It further, in the above-described embodiments, further include the first resetting apparatus, the first resetting apparatus is connected to mandril bar portion
21 towards between 1 center of one end and disk body at 1 center of disk body.When mandril 2 reaches vertex in the radially-protruding extension elongation of disk body 1
When, it can be radially contracted in disk body 1 by mandril 2 by the first resetting apparatus.
Further, as preferred embodiment, the first resetting apparatus can be spring.
Further, in the above-described embodiments, each grapple 3 includes:
Grapple bar portion 31, the radial slidable connection disk body 1 of grapple bar portion 31；
Hook portion 32, hook portion 32 are set to the one end circumferential towards disk body 1 of grapple bar portion 31, and hook portion 32 includes coupler body, coupler body
Towards the lower section of disk body 1；Prevent wafer from falling off in the process of grasping；
Grapple interconnecting piece 33, grapple interconnecting piece 33 are set to grapple bar portion 31 towards the one end at 1 center of disk body, to connect
Second telescopic device.
Further, as preferred embodiment, disk body 1 can radially be provided with attachment base, each grapple bar portion
31 are threaded through inside attachment base, to realize the radial slidable connection disk body 1 of grapple bar portion 31.
Further, as preferred embodiment, disk body 1 can radially be provided with multiple sliding slots, each grapple bar
Portion 31 is arranged inside corresponding sliding slot, to realize the radial slidable connection disk body 1 of grapple bar portion 31.
Further, as preferred embodiment, hook portion 32 prevents wafer from falling off in the process of grasping at L-shaped, from
And protect wafer.
Further, as preferred embodiment, the second telescopic device may include:
Sliding sleeve 61, sliding sleeve 61 are slidably sheathed on handle 4；
Annular protrusion 62 is set to sliding sleeve 61 towards one end of disk body 1, is provided with the first inclined-plane on the outside of annular protrusion 62
63；
Grapple interconnecting piece 33 be provided with cooperation annular protrusion 62 the second inclined-plane 64, in annular protrusion 62 push when,
Grapple interconnecting piece 33 is pushed to be moved radially outward along disk body 1.
User can drive annular protrusion 62 to push by pressing down on handle 4, to push grapple interconnecting piece 33 along disk
Body 1 is moved radially outward, and when the extension elongation of grapple 3 reaches vertex, retracts handle 4 upwards, can be resetted and be filled by second
It sets 9 to move radially inwardly grapple 3 in disk body 1, and is grabbed since the effect on the first inclined-plane 63 of annular protrusion 62 can control
3 retraction speed of hook to avoid scratching wafer, and then is effectively protected wafer.
Further, as preferred embodiment, annular protrusion 62 towards disk body 1 open up on one side one it is first recessed
Slot 7, the first groove 7 are used to accommodate the turntable 5 in above-mentioned first telescopic device；Multiple second are opened up in the radial direction of annular protrusion 62
Groove 8, each setting of mandril bar portion 21 is in corresponding second groove, 8 the inside.
Further, as preferred embodiment, the second telescopic device may include:
Gear structure can drive gear structure to be rotated, so that a plurality of grapples 3 are in disk body 1 by stretching handle 4
It extends radially out and retracts.
It should be noted that the second telescopic device is not limited to above two structure, it can be other transmission devices.
It further, in the above-described embodiments, further include the second resetting apparatus 9, the second resetting apparatus 9 is connected to grapple company
Between 1 center of socket part 33 and disk body, reset grapple interconnecting piece 33 in the rising of annular protrusion 62.When the stretching of grapple 3 is long
When degree reaches vertex, handle 4 is retracted upwards, can be moved radially inwardly grapple 3 in disk body 1 by the second resetting apparatus 9.
Further, as preferred embodiment, the second resetting apparatus 9 can be spring.
Further, as preferred embodiment, one first connection can be set on the center of 1 bottom of disk body
Block, and corresponding second link block has can be set in the side of each mandril bar portion 21 towards 1 bottom of disk body, and each second connects
Block is connect to connect by the second resetting apparatus 9 being arranged radially in disk body 1 with the first link block；
Corresponding third link block, Mei Ge has can be set in the side of each grapple interconnecting piece 33 towards 1 bottom of disk body
Three link blocks are connect by the first resetting apparatus being arranged radially in disk body 1 with the first link block.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic content
Equivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.
Claims (10)
1. a kind of wafer withdrawing device characterized by comprising
One disk body；
A plurality of mandrils are connected radially to the disk body by one first telescopic device；
At least three grapples are connected radially to the disk body by one second telescopic device, and with a plurality of mandrils in water
Square to being staggered；
Leader, vertical is connected to the disk body center, and operable connection first telescopic device and described second
Telescopic device is extended radially out and is contracted in the disk body to control a plurality of mandrils and at least three grapple
It returns.
2. wafer withdrawing device as described in claim 1, which is characterized in that each mandril includes:
Mandril bar portion, the mandril bar portion radially slidably connect the disk body；
Ejection part, the ejection part are set to the mandril bar portion towards one end of the disk body circumferential direction；
The one end at the mandril bar portion towards the disk body center connects first telescopic device.
3. wafer withdrawing device as claimed in claim 2, which is characterized in that first telescopic device includes:
One turntable, the turntable are rotatably sheathed on the handle, and circumferentially setting corresponds to the mandril quantity to the turntable
With the protrusion of position.
4. wafer withdrawing device as claimed in claim 2, which is characterized in that further include the first resetting apparatus, described first is multiple
Position device is connected to the mandril bar portion towards between the one end and the disk body center at the disk body center.
5. wafer withdrawing device as described in claim 1, which is characterized in that each grapple includes:
Grapple bar portion, the grapple bar portion radially slidably connect the disk body；
Hook portion, the hook portion are set to the grapple bar portion towards one end of the disk body circumferential direction, and the hook portion includes coupler body, institute
Coupler body is stated towards the lower section of the disk body；
Grapple interconnecting piece, the grapple interconnecting piece are set to the grapple bar portion towards the one end at the disk body center, to even
Connect second telescopic device.
6. wafer withdrawing device as claimed in claim 5, which is characterized in that second telescopic device includes:
Sliding sleeve, the sliding sleeve are slidably sheathed on handle；
Annular protrusion is set to the sliding sleeve towards one end of the disk body, and the annular protrusion outside is provided with the first inclined-plane；
The grapple interconnecting piece is provided with the second inclined-plane for cooperating the annular protrusion, in the annular protrusion push when,
The grapple interconnecting piece is pushed to be moved radially outward along the disk body.
7. wafer withdrawing device as claimed in claim 6, which is characterized in that further include the second resetting apparatus, described second is multiple
Position device is connected between the grapple interconnecting piece and the disk body center, to make the grapple in annular protrusion rising
Interconnecting piece resets.
8. wafer withdrawing device as claimed in claim 3, which is characterized in that first resetting apparatus is spring.
9. wafer withdrawing device as claimed in claim 7, which is characterized in that second resetting apparatus is spring.
10. wafer withdrawing device as described in claim 1, which is characterized in that the quantity of the mandril is 4 or 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910147580.XA CN109877724B (en) | 2019-02-27 | 2019-02-27 | Wafer taking-out device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910147580.XA CN109877724B (en) | 2019-02-27 | 2019-02-27 | Wafer taking-out device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109877724A true CN109877724A (en) | 2019-06-14 |
| CN109877724B CN109877724B (en) | 2022-02-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910147580.XA Active CN109877724B (en) | 2019-02-27 | 2019-02-27 | Wafer taking-out device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109877724B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6332949A (en) * | 1986-07-24 | 1988-02-12 | Yokogawa Hewlett Packard Ltd | Hot chucking device |
| JPH0621202A (en) * | 1992-03-18 | 1994-01-28 | Internatl Business Mach Corp <Ibm> | Substrate handling device |
| CN102945820A (en) * | 2012-10-23 | 2013-02-27 | 北京七星华创电子股份有限公司 | Disk holding device |
| CN103046097A (en) * | 2012-12-31 | 2013-04-17 | 上海新阳半导体材料股份有限公司 | Wafer processing device |
| CN204216018U (en) * | 2014-10-16 | 2015-03-18 | 中芯国际集成电路制造(北京)有限公司 | A kind of wafer gripping tool |
-
2019
- 2019-02-27 CN CN201910147580.XA patent/CN109877724B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6332949A (en) * | 1986-07-24 | 1988-02-12 | Yokogawa Hewlett Packard Ltd | Hot chucking device |
| JPH0621202A (en) * | 1992-03-18 | 1994-01-28 | Internatl Business Mach Corp <Ibm> | Substrate handling device |
| CN102945820A (en) * | 2012-10-23 | 2013-02-27 | 北京七星华创电子股份有限公司 | Disk holding device |
| CN103046097A (en) * | 2012-12-31 | 2013-04-17 | 上海新阳半导体材料股份有限公司 | Wafer processing device |
| CN204216018U (en) * | 2014-10-16 | 2015-03-18 | 中芯国际集成电路制造(北京)有限公司 | A kind of wafer gripping tool |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109877724B (en) | 2022-02-25 |
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Address after: 430205 No.18, Gaoxin 4th Road, Donghu Development Zone, Wuhan City, Hubei Province Patentee after: Wuhan Xinxin Integrated Circuit Co.,Ltd. Country or region after: China Address before: 430205 No.18, Gaoxin 4th Road, Donghu Development Zone, Wuhan City, Hubei Province Patentee before: Wuhan Xinxin Semiconductor Manufacturing Co.,Ltd. Country or region before: China |