CN109871100A - A kind of main frame radiator of novel improved structure - Google Patents

A kind of main frame radiator of novel improved structure Download PDF

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Publication number
CN109871100A
CN109871100A CN201711252789.XA CN201711252789A CN109871100A CN 109871100 A CN109871100 A CN 109871100A CN 201711252789 A CN201711252789 A CN 201711252789A CN 109871100 A CN109871100 A CN 109871100A
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CN
China
Prior art keywords
radiator
cooling fin
main frame
improved structure
novel improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711252789.XA
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Chinese (zh)
Inventor
徐宏
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Individual
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Individual
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Publication date
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Priority to CN201711252789.XA priority Critical patent/CN109871100A/en
Publication of CN109871100A publication Critical patent/CN109871100A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a kind of main frame radiators of novel improved structure, including mainboard and cooling fin, the mainboard front surface is fixed with heat exchange sheet at center, and cooling fin is equidistantly fixed on heat exchange sheet, the cooling fin front surface is disposed with the first radiator fan and the second radiator fan from right to left in the horizontal direction, it is provided with heat sink above the cooling fin, and heat sink is fixedly connected by liquid transfer tube with water cooling box.In the present invention, in the cooling fin front surface setting of stacking, there are two radiator fans first, it can accelerate the air flowing between cooling fin, the effective efficiency for improving heat dissipation, secondly the two sides up and down of cooling fin and heat exchange sheet contact position are provided with the heat sink that liquid transfer tube is connected with water cooling box, water-cooling are formed, so that the main frame radiator of the novel improved structure, it has been effectively combined cooling fin, radiator fan and water-cooled radiator, has improved the efficiency of heat dissipation.

Description

A kind of main frame radiator of novel improved structure
Technical field
The present invention relates to heat sink technology field more particularly to a kind of main frame radiators of novel improved structure.
Background technique
High temperature is the formidable enemy of integrated circuit.High temperature not only will lead to system operation shakiness, reduced service life, or even having can Certain components can be made to burn.The effect of radiator is exactly then these heat absorptions are diffused in cabinet or outside cabinet, protected The temperature for demonstrate,proving machine element is normal, and the type of radiator is very more, CPU, video card, board chip set, hard disk, cabinet, power supply Even CD-ROM drive and memory can all need radiator, these different radiators cannot be used with, and wherein we most often contact Be exactly CPU radiator.According to the mode for taking away heat from radiator, radiator can be divided into active heat removal and passively dissipated Heat.The former commonly air-cooled radiator, and the latter it is common be exactly cooling fin.Radiating mode is further segmented, can be divided into It is air-cooled, heat pipe, liquid cooling, semiconductor refrigerating, compressor refrigeration etc..
However there is some shortcomings, the structures of radiator in use for existing main frame radiator Design unreasonable, the efficiency of heat dissipation is lower, does not secondly have dust-proof effect.
Summary of the invention
The purpose of the present invention is to solve disadvantages existing in the prior art, and a kind of novel improved structure proposed Main frame radiator.
To achieve the goals above, present invention employs following technical solutions: a kind of calculating owner of novel improved structure Machine radiator, including mainboard and cooling fin, the mainboard front surface are fixed with heat exchange sheet at center, and equidistant on heat exchange sheet It is fixed with cooling fin, the cooling fin front surface is disposed with the first radiator fan and second from right to left in the horizontal direction and dissipates Hot-air fan, and the first radiator fan is internally provided with flabellum, is provided with heat sink above the cooling fin, and heat sink passes through liquid Body transfer tube is fixedly connected with water cooling box, and a kind of main frame radiator of novel improved structure further includes novel with this The matching used dust-proof mesh enclosure of main frame radiator and the dust suction piece inside dust-proof mesh enclosure for improving structure, it is described anti- Dirt mesh enclosure front surface two sides are symmetrically welded with the first fixed block and the second fixed block at center, and the first fixed block offers fixation Hole offers the circular hole passed through for liquid transfer tube on one side body of dust-proof mesh enclosure.
It is as above-mentioned technical proposal to further describe:
There are two the heat sink is arranged altogether, and two heat sinks are symmetrical above and below about cooling fin.
It is as above-mentioned technical proposal to further describe:
The fixing bolt of the fixed dust-proof mesh enclosure of cooperation fixation hole is provided on the mainboard.
It is as above-mentioned technical proposal to further describe:
The heat sink is mutually perpendicular to cooling fin, and the width of heat sink is equal to the half of heat sink length.
It is as above-mentioned technical proposal to further describe:
Flabellum is also equipped with inside second radiator fan.
It is as above-mentioned technical proposal to further describe:
Fixation hole is also offered on second fixed block.
In the present invention, the main frame radiator of the novel improved structure is arranged in the cooling fin front surface of stacking first There are two radiator fan, the air flowing between cooling fin can be accelerated, the effective efficiency for improving heat dissipation, secondly cooling fin with The two sides up and down of heat exchange sheet contact position are provided with the heat sink that liquid transfer tube is connected with water cooling box, form water cooling and dissipate Heat, so that the main frame radiator of the novel improved structure, has been effectively combined cooling fin, radiator fan and water-cooling Device, improves the efficiency of heat dissipation, next is provided with dust-proof mesh enclosure, can cover the main frame radiator, has dust-proof Effect.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the main frame radiator of novel improved structure proposed by the present invention;
Fig. 2 is the structural schematic diagram of dust-proof mesh enclosure of the present invention.
Marginal data:
1- mainboard, 2- heat exchange sheet, 3- cooling fin, the first radiator fan of 4-, 5- flabellum, the second radiator fan of 6-, 7- water Ice chest, 8- liquid transfer tube, 9- heat sink, 10- dust-proof mesh enclosure, 11- dust suction piece, the first fixed block of 12-, 13- fixation hole, 14- Second fixed block, 15- circular hole.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1-2, a kind of main frame radiator of novel improved structure, including mainboard 1 and cooling fin 3, mainboard 1 It is fixed with heat exchange sheet 2 at front surface center, and is equidistantly fixed with cooling fin 3 on heat exchange sheet 2,3 front surface of cooling fin is along water Square to being disposed with the first radiator fan 4 and the second radiator fan 6 from right to left, and it is arranged inside the first radiator fan 4 There is flabellum 5, heat sink 9 is provided with above cooling fin 3, and heat sink 9 is fixedly connected by liquid transfer tube 8 with water cooling box 7, one The main frame radiator of kind novel improved structure further includes mating with the main frame radiator of the novel improved structure The dust-proof mesh enclosure 10 used and the dust suction piece 11 inside dust-proof mesh enclosure 10, it is symmetrical at 10 front surface two sides center of dust-proof mesh enclosure It is welded with the first fixed block 12 and the second fixed block 14, and the first fixed block 12 offers fixation hole 13,10 side of dust-proof mesh enclosure The circular hole 15 passed through for liquid transfer tube 8 is offered on shell.
There are two heat sink 9 is arranged altogether, and two heat sinks 9 are symmetrical above and below about cooling fin 3, are provided with and match on mainboard 1 The fixing bolt of the fixed dust-proof mesh enclosure 10 of fixation hole 13 is closed, heat sink 9 is mutually perpendicular to cooling fin 3, and the width of heat sink 9 Equal to the half of 3 length of heat sink, it is also equipped with flabellum 5 inside the second radiator fan 6, is also offered on the second fixed block 14 solid Determine hole.
Working principle: the main frame radiator of the novel improved structure is in use, the heat first on mainboard 1 passes through Heat conduction layer 2 is transferred to cooling fin 3, while the cold water inside water cooling box 7 is transferred to inside heat sink 9 by liquid transfer tube 8, To which heat sink 9 can absorb the heat on cooling fin 3, radiate, secondly 6 meeting of the first radiator fan 4 and the second radiator fan It starts to work, is blowed, to accelerate the air flowing between cooling fin 3, improve the radiating efficiency of cooling fin 3, entirely Device entire run.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto, Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.

Claims (6)

1. a kind of main frame radiator of novel improved structure, including mainboard (1) and cooling fin (3), which is characterized in that institute It states and is fixed with heat exchange sheet (2) at mainboard (1) front surface center, and be equidistantly fixed with cooling fin (3), institute on heat exchange sheet (2) It states cooling fin (3) front surface and is disposed with the first radiator fan (4) and the second radiator fan from right to left in the horizontal direction (6), and the first radiator fan (4) is internally provided with flabellum (5), is provided with heat sink (9) above the cooling fin (3), and is dissipated Hot plate (9) is fixedly connected by liquid transfer tube (8) with water cooling box (7), a kind of main frame of novel improved structure Radiator further includes with the matching used dust-proof mesh enclosure of main frame radiator (10) of the novel improved structure and positioned at anti- It is fixed to be symmetrically welded with first at dust-proof mesh enclosure (10) the front surface two sides center for dirt mesh enclosure (10) internal dust suction piece (11) Block (12) and the second fixed block (14), and the first fixed block (12) offers fixation hole (13), dust-proof mesh enclosure (10) side The circular hole (15) passed through for liquid transfer tube (8) is offered on shell.
2. a kind of main frame radiator of novel improved structure according to claim 1, which is characterized in that described to dissipate There are two hot plate (9) is arranged altogether, and two heat sinks (9) are symmetrical above and below about cooling fin (3).
3. a kind of main frame radiator of novel improved structure according to claim 1, which is characterized in that the master The fixing bolt of cooperation fixation hole (13) fixed dust-proof mesh enclosure (10) is provided on plate (1).
4. a kind of main frame radiator of novel improved structure according to claim 1, which is characterized in that described to dissipate Hot plate (9) is mutually perpendicular to cooling fin (3), and the width of heat sink (9) is equal to the half of heat sink (3) length.
5. a kind of main frame radiator of novel improved structure according to claim 1, which is characterized in that described Flabellum (5) are also equipped with inside two radiator fans (6).
6. a kind of main frame radiator of novel improved structure according to claim 1, which is characterized in that described Also fixation hole (13) are offered on two fixed blocks (14).
CN201711252789.XA 2017-12-01 2017-12-01 A kind of main frame radiator of novel improved structure Pending CN109871100A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711252789.XA CN109871100A (en) 2017-12-01 2017-12-01 A kind of main frame radiator of novel improved structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711252789.XA CN109871100A (en) 2017-12-01 2017-12-01 A kind of main frame radiator of novel improved structure

Publications (1)

Publication Number Publication Date
CN109871100A true CN109871100A (en) 2019-06-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711252789.XA Pending CN109871100A (en) 2017-12-01 2017-12-01 A kind of main frame radiator of novel improved structure

Country Status (1)

Country Link
CN (1) CN109871100A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111176404A (en) * 2019-12-23 2020-05-19 重庆师范大学 Heat abstractor for computer motherboard of high-efficient heat dispersion

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111176404A (en) * 2019-12-23 2020-05-19 重庆师范大学 Heat abstractor for computer motherboard of high-efficient heat dispersion

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Application publication date: 20190611