CN109856441B - Crimping type IGBT device chip current online measurement system - Google Patents
Crimping type IGBT device chip current online measurement system Download PDFInfo
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- CN109856441B CN109856441B CN201910297476.9A CN201910297476A CN109856441B CN 109856441 B CN109856441 B CN 109856441B CN 201910297476 A CN201910297476 A CN 201910297476A CN 109856441 B CN109856441 B CN 109856441B
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- 238000005259 measurement Methods 0.000 title claims abstract description 48
- 238000002788 crimping Methods 0.000 title claims abstract description 34
- 238000004804 winding Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 7
- 230000010354 integration Effects 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- QHZSDTDMQZPUKC-UHFFFAOYSA-N 3,5-dichlorobiphenyl Chemical compound ClC1=CC(Cl)=CC(C=2C=CC=CC=2)=C1 QHZSDTDMQZPUKC-UHFFFAOYSA-N 0.000 description 1
- YTBRNEUEFCNVHC-UHFFFAOYSA-N 4,4'-dichlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=C(Cl)C=C1 YTBRNEUEFCNVHC-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
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Abstract
The invention discloses a crimping type IGBT device chip current online measurement system, which comprises: the integrated circuit comprises an integrating circuit and at least two groups of PCB boards, wherein a plurality of current measuring coils are arranged on each group of PCB boards, a boss penetrates through the current measuring coils, the boss current is equal to the chip current, the current measuring coils comprise a coil framework, a first wire and a second wire, one end of the first wire is connected with a first input of the integrating circuit, the first wire is uniformly wound around the coil framework to form a coil winding, the other end of the first wire is connected with one end of the second wire, the other end of the second wire is connected with a second input of the integrating circuit, and the integrating circuit determines the current in the chip according to the voltage signal of the current measuring coils.
Description
Technical Field
The invention relates to the technical field of current measurement of electronic devices, in particular to a crimping type IGBT device chip current on-line measurement system.
Background
Along with the rapid development of the modern power industry, the power electronic power device is also developed towards high voltage and high power, wherein the most widely applied IGBT device in the high voltage field, and the currently mainstream IGBT device has two types of welding type and crimping type, wherein the crimping type IGBT device has the advantages of high power density, double-sided heat dissipation, failure short circuit, easy series connection and the like, so the crimping type IGBT device is widely applied to the high voltage high power system field such as a smart grid.
In the transient process of switching on/off of the crimping IGBT device, the incomplete symmetry of the device packaging structure causes the inconsistency of parasitic parameters of each chip, so that the current distribution of the chips in the switching on/off process is unbalanced, and when the imbalance reaches a certain degree, the chip is excessively high in instant current to cause overheat breakdown and then produce avalanche chain reaction, and finally the whole device is damaged. Meanwhile, in the on state, the increase of the chip current can directly lead to the rise of the chip junction temperature, the imbalance of the temperature distribution causes the imbalance of the stress distribution of each sub-module, and the current distribution of each IGBT chip is influenced, so that the overheat breakdown occurs when the current of one part of IGBT chips is overlarge. It can be seen that the chip current is an important physical quantity related to the reliability of the device.
In-line measurement equipment is currently used for measuring the current passing through the whole device, but the in-line measurement of the current of a chip inside the device is difficult. Although the current of the chip inside the device can be measured on line by using a measuring instrument such as a commercial Rogowski coil or a commercial hall current sensor, the device package structure needs to be opened, and only the current of a part of the chip can be measured.
Disclosure of Invention
Based on the above, it is necessary to provide an online measurement system for the chip current of the crimping type IGBT device, so as to realize online measurement of the current of all chips in the crimping type IGBT device at the same time.
In order to achieve the above object, the present invention provides the following solutions:
The utility model provides an on-line measurement system of crimping IGBT device chip electric current, there is a plurality of bosss on the crimping IGBT device, measurement system includes: the integrated circuit comprises an integrating circuit and at least two groups of PCB boards, wherein each group of PCB boards sequentially comprises a first layer of PCB board, a second layer of PCB board and a third layer of PCB board from top to bottom, a plurality of current measuring coils are arranged on each group of PCB boards, and the bosses penetrate through the current measuring coils;
The current measuring coil comprises a coil framework, a first lead and a second lead, wherein the coil framework is formed by a PCB (printed circuit board) between a first circle and a second circle, the first circle and the second circle are concentric circles with different diameters, and a plurality of first through holes are uniformly distributed on the circumferences of the first circle and the second circle;
The second conducting wire is arranged on the second layer of PCB in a circumferential manner, the circle where the second conducting wire is arranged is concentric with the first circle, and the second conducting wire is arranged between the first circle and the second circle;
The first lead one end with the first input of integration circuit is connected, the first lead other end passes adjacent first through-hole on first circle and the second circle circumference in proper order, first lead encircles the coil skeleton evenly twines into coil winding, the first lead other end with second lead one end is connected, the second lead other end with the second input of integration circuit is connected.
Optionally, the current measuring coil is wired in a fishbone shape.
Optionally, a first insulating layer is disposed between the first layer PCB and the second layer PCB, and a second insulating layer is disposed between the second layer PCB and the third layer PCB.
Optionally, an insulating layer is disposed between each group of PCB boards.
Optionally, the materials used for the first wire and the second wire are copper.
Optionally, the thickness of each group of the PCB boards is 0.5mm.
Optionally, the current measurement coil further includes a second through hole, the second through hole is disposed on a circumference where the second wire is located, and the other end of the first wire passes through the second through hole and is connected with one end of the second wire.
Optionally, the current measurement coil further includes a first pin pad and a second pin pad, one end of the first wire is connected to the integrating circuit through the first pin pad, and the other end of the second wire is connected to the integrating circuit through the second pin pad.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
The online measurement system in the invention comprises: the integrated circuit comprises an integrating circuit and at least two groups of PCB boards, wherein a plurality of current measuring coils are arranged on each group of PCB boards, a boss penetrates through the current measuring coils, the boss current is equal to the chip current, the current measuring coils comprise a coil framework, a first wire and a second wire, one end of the first wire is connected with a first input of the integrating circuit, the first wire is uniformly wound around the coil framework to form a coil winding, the other end of the first wire is connected with one end of the second wire, the other end of the second wire is connected with a second input of the integrating circuit, and the integrating circuit determines the current in the chip according to the voltage signal of the current measuring coils.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a circuit arrangement on a first layer PCB of a current measuring coil according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a circuit layout on a second layer PCB of a current measuring coil according to an embodiment of the present invention;
fig. 3 is a schematic diagram of circuit layout on a third layer PCB board of a current measuring coil according to an embodiment of the present invention;
fig. 4 is a partial top view of a crimping type IGBT device chip current online measurement system according to an embodiment of the invention;
FIG. 5 is a schematic view of a fishbone interconnect in accordance with an embodiment of the invention;
fig. 6 is a partial front view of a crimping type IGBT device chip current on-line measurement system according to an embodiment of the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention aims to provide a chip current online measurement system for a crimping IGBT device, which realizes the simultaneous online measurement of the currents of all chips in the crimping IGBT device.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Fig. 1 is a schematic diagram of circuit arrangement on a first layer PCB of a current measurement coil according to an embodiment of the present invention, fig. 2 is a schematic diagram of circuit arrangement on a second layer PCB of a current measurement coil according to an embodiment of the present invention, and fig. 3 is a schematic diagram of circuit arrangement on a third layer PCB of a current measurement coil according to an embodiment of the present invention.
Referring to fig. 1-3, the invention provides an on-line measurement system for chip current of a crimping type IGBT device, the crimping type IGBT device is provided with a plurality of bosses, the on-line measurement system comprises: the integrated circuit comprises an integrating circuit and at least two groups of PCB boards, wherein each group of PCB boards sequentially comprises a first layer of PCB board, a second layer of PCB board and a third layer of PCB board from top to bottom, a plurality of current measuring coils are arranged on each group of PCB boards, and the boss penetrates through the current measuring coils.
Specifically, fig. 4 is a partial top view of a chip current online measurement system of a crimping type IGBT device according to an embodiment of the present invention, as shown in fig. 4, two sets of PCB boards stacked up and down are adopted in this embodiment, each set of PCB boards is provided with a plurality of current measurement coils, the current measurement coils are also referred to as Rogowski coils, each boss in the crimping type IGBT device passes through each current measurement coil, so that two sets of PCB boards are placed inside the device, the boss is connected in series with the chip, the boss current is equal to the chip current, specifically, 501 is a current measurement coil on a first set of PCB boards, 502 is a current measurement coil on a second set of PCB boards, and a boss in the device 504 passes through the current coil on the second set of PCB boards, so that the current of each chip is guaranteed to be measured by stacking the PCB boards.
The bosses are distributed in two dimensions and are arranged compactly, the distance between two adjacent rows and two adjacent columns is very small, the embodiment adopts two groups of PCB boards which are stacked up and down, the number of Rogowski coils for measuring chip current on the PCB boards is increased, each boss has a corresponding Rogowski coil in the two groups of PCB boards for measuring the current, and the problem that the number of Rogowski coils on a single group of PCB boards is insufficient if adjacent Rogowski coils distributed on one group of PCB boards are overlapped due to too close distance of the bosses is avoided. Meanwhile, the sectional area of each single-turn coil 5 of the Rogowski coil is increased by adopting two groups of PCB boards, namely, the mutual inductance of the Rogowski coil and a boss flowing through a current to be measured is increased, so that the current measurement sensitivity is increased. Therefore, on the premise of ensuring that the sensitivity is unchanged compared with a Rogowski coil for measuring the current of a single chip, the voltage quantity which is proportional to the current change rate is output to all the chip currents in the crimping IGBT device. Each Rogowski coil outgoing line is connected to a corresponding pin pad, and is connected to an external integrating circuit through the pin pad, and the integrating circuit integrates the voltage signals to finally obtain voltage signals proportional to the current to be measured. Meanwhile, a PCB with a small size is used as a carrier of the measuring system, so that limited space in the device is effectively utilized, and the device can be integrated to carry out on-line measurement of current.
The current measuring coil comprises a coil framework 3, a first lead 1 and a second lead 9, wherein the coil framework 3 is formed by a PCB (printed circuit board) between a first circle and a second circle, the first circle and the second circle are concentric circles with different diameters, a plurality of first through holes 2 are uniformly distributed on the circumferences of the first circle and the second circle, the second lead 9 is circumferentially arranged on the second layer PCB, the circle where the second lead 9 is located and the first circle are concentric circles, and the second lead 9 is arranged between the first circle and the second circle; the first wire 1 one end with the first input of integration circuit is connected, the first wire 1 other end passes adjacent first through-hole 2 on first circle and the second circle circumference in proper order, first wire 1 encircles coil skeleton 3 evenly winds into coil winding, first wire 1 other end with second wire 9 one end is connected, the second wire 9 other end with the second input of integration circuit is connected, the integration circuit is according to the voltage signal of first input and second input confirm electric current in the electric current measurement coil.
Preferably, the current measuring coil is wired in a fishbone shape.
Specifically, fig. 5 is a schematic diagram of fishbone wiring in an embodiment of the present invention, as shown in fig. 5, two adjacent first through holes on a first circle and a second circle and wires connected between the two first through holes form a single-turn coil 5, the single-turn coil 5 is rectangular, the upper side of the rectangle is a top layer wiring 8 located on a first layer PCB board, the lower side of the rectangle is a bottom layer wiring 10 located on a third layer PCB board, the left and right sides of the rectangle are the first through holes on the first circle and the first through holes on the second circle, all the single-turn coils 5 are uniformly arranged in a circular shape, and the boss is surrounded in the center. The first single-turn coil is led out through wiring, so that one end of a first wire is connected to the first pin pad 6, a single-turn coil connecting wire 11 starts from the first single-turn coil 5 and ends at the last single-turn coil 5, two adjacent single-turn coils 5 are connected, the wiring mode is called fishbone wiring, the single-turn coil connecting wire 11 connected at the last single-turn coil 5 is not connected with the first single-turn coil 5 any more, but is connected with one end of a second wire 9 through a second through hole, if the second layer PCB translates upwards to the first layer PCB, the second wire 9 is overlapped with each section of single-turn coil connecting wire 11, and the other end of the second wire 9 is led out from the Rogowski coil and connected to the second pin pad 7.
By adopting the fishbone wiring mode, noise interference caused by surrounding of the current measuring coil and other external currents can be effectively eliminated, and measuring errors caused by the existence of the external currents can be effectively reduced.
Preferably, a first insulating layer is arranged between the first layer of PCB and the second layer of PCB, a second insulating layer is arranged between the second layer of PCB and the third layer of PCB, and specifically, the insulating layer is a framework of the PCB, so that the PCB is supported and the two-layer current is isolated.
Preferably, the materials used for the first conductive wire 1 and the second conductive wire 9 are copper, which plays a role in transmitting current.
Preferably, the thickness of each group of PCB boards is 0.5mm. Specifically, the total thickness of the two groups of PCB boards is about 1mm, the size is very small, the integrated IGBT device is convenient to integrate inside the crimping IGBT device, the original packaging structure of the device is not influenced, the current measurement is carried out under the condition that the device works normally, and the PCB boards are good in strength and can withstand high temperature.
Preferably, the current measuring coil further comprises a second through hole 4, the second through hole 4 is arranged on the circumference where the second wire 9 is located, and the other end of the first wire 1 passes through the second through hole 4 and is connected with one end of the second wire 9.
Preferably, the current measuring coil further comprises a first pin pad 6 and a second pin pad 7, one end of the first wire 1 is connected with the first input of the integrating circuit through the first pin pad 6, and the other end of the second wire 9 is connected with the second input of the integrating circuit through the second pin pad 7.
Working principle:
Fig. 6 is a partial front view of a chip current on-line measurement system of a crimping type IGBT device according to an embodiment of the invention, referring to fig. 6, the upper side is a first group of PCB boards 12, the lower side is a second group of PCB boards 13, insulating materials are filled between the two groups of PCB boards, each group of PCB boards includes a first layer of PCB boards 14, a second layer of PCB boards 15 and a third layer of PCB boards 16, the first layer of PCB boards 14 is also called a top layer of PCB boards, the second layer of PCB boards 15 is also called a loop layer of PCB boards, the third layer of PCB boards 16 is also called a bottom layer of PCB boards, when the crimping type IGBT device works normally, current flows from a collector electrode plate 17 to an emitter electrode plate 18 through a chip 19, the boss current is equal to the chip current, the boss passes through the current measurement coil, the current flowing through the boss generates a magnetic field in each single turn coil 5, when the current changes, an induced voltage is generated in each single turn coil 5 by faraday electromagnetic induction law, and the induced voltage of each single turn coil 5 is proportional to the change of current, and the induced voltage is added to the output ratio of all single turns 5. The current to be measured also generates induced voltages in each section of single-turn coil connecting wire 11, the sum of the induced voltages generated by each section of single-turn coil connecting wire 11 is approximately equal to the magnitude of the induced voltages generated by the current to be measured in the second lead 9, and the induced voltages have opposite signs and can be basically counteracted, so that the first layer of PCB 14 and the second layer of PCB 15 are required to be as close as possible, the second lead 9 is close to all the single-turn coil connecting wires 11 in distance, the generated induced voltages are counteracted more, and the resulting measurement error is smaller. Thus, the open circuit voltage across the first pin pad 6 and the second pin pad 7 is approximately the sum of the induced voltages generated by all single turn coils 5, which is proportional to the rate of change of the chip current. The first pin pad 6 and the second pin pad 7 are connected with an external integrating circuit, and the voltage quantity integrated by the integrating circuit is in direct proportion to the current to be measured, namely mutual inductance exists between the current detection coil and the boss, and the open circuit voltage is equal to the mutual inductance multiplied by the change rate of the current in the boss. The open circuit voltage is divided by this mutual inductance and then integrated over time as the current in the boss.
The crimping IGBT device has compact packaging structure, and each sub-module is very close in distance, so that a current measuring instrument is inconvenient to install for measuring the chip current. In the current measurement technology of the chip of the prior crimping IGBT device, the packaging structure of the device can only be opened first, and the current of a part of chips is measured by using measuring instruments such as a commercial Rogowski coil or a commercial Hall current sensor, but the current in all chips in the device can not be measured on line at the same time under the condition that the packaging structure of the device is not opened. The online measurement system for the chip current of the crimping IGBT device provided by the embodiment of the invention has small size, can be integrated in the device to realize online measurement, and can measure all the chip currents at the same time.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to assist in understanding the methods of the present invention and the core ideas thereof; also, it is within the scope of the present invention to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the invention.
Claims (6)
1. The utility model provides an on-line measurement system of crimping IGBT device chip electric current, there is a plurality of bosss on the crimping IGBT device, boss and chip connection, its characterized in that, measurement system includes: the integrated circuit comprises an integrating circuit and at least two groups of PCB boards, wherein each group of PCB boards sequentially comprises a first layer of PCB board, a second layer of PCB board and a third layer of PCB board from top to bottom, a plurality of current measuring coils are arranged on each group of PCB boards, and the bosses penetrate through the current measuring coils; two groups of PCB boards which are stacked up and down are adopted, insulating materials are filled between the two groups of PCB boards, the number of Rogowski coils for measuring chip current on the PCB boards is increased, and each boss has a corresponding Rogowski coil in the two groups of PCB boards to measure the current of the corresponding Rogowski coils;
the current measuring coil comprises a coil framework (3), a first lead (1) and a second lead (9), wherein the coil framework (3) is formed by a first layer of PCB (printed circuit board) between a first circle and a second circle, the first circle and the second circle are concentric circles with different diameters, and a plurality of first through holes (2) are uniformly distributed on the circumferences of the first circle and the second circle;
the second lead (9) is arranged on the second layer of PCB in a circumferential manner, the circle where the second lead (9) is positioned and the first circle are concentric circles, and the second lead (9) is arranged between the first circle and the second circle;
One end of the first wire (1) is connected with a first input end of the integrating circuit, the other end of the first wire (1) sequentially penetrates through first through holes (2) adjacent to a first circle and a second circle, the first wire (1) is uniformly wound around the coil framework (3) to form a coil winding, the other end of the first wire (1) is connected with one end of the second wire (9), the other end of the second wire (9) is connected with a second input end of the integrating circuit, and the integrating circuit determines current in the current measuring coil according to voltage signals of the first input end and the second input end;
a first insulating layer is arranged between the first layer of PCB and the second layer of PCB, and a second insulating layer is arranged between the second layer of PCB and the third layer of PCB;
The current measuring coil further comprises a second through hole (4), the second through hole (4) is arranged on the circumference where the second wire (9) is located, and the other end of the first wire (1) penetrates through the second through hole (4) and is connected with one end of the second wire (9);
The first layer of PCB board and the second layer of PCB board are as close as possible.
2. The crimping type IGBT device chip current online measurement system according to claim 1, wherein the wiring mode of the current measurement coil adopts a fishbone-shaped wiring.
3. The online measurement system of the chip current of the crimping type IGBT device according to claim 1, wherein an insulating layer is arranged between each two groups of the PCB boards.
4. The crimping type IGBT device chip current online measurement system according to claim 1, wherein the materials adopted by the first lead (1) and the second lead (9) are copper.
5. The crimping type IGBT device chip current online measurement system of claim 1, wherein the thickness of each set of PCB boards is 0.5mm.
6. The crimping type IGBT device chip current online measurement system according to claim 1, characterized in that the current measurement coil further comprises a first pin pad (6) and a second pin pad (7), one end of the first wire (1) is connected with the first input of the integrating circuit through the first pin pad (6), and the other end of the second wire (9) is connected with the second input of the integrating circuit through the second pin pad (7).
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| CN110133354B (en) * | 2019-04-26 | 2020-07-10 | 华中科技大学 | PCB Rogowski coil for measuring current of crimping IGBT module chip |
| CN112730943A (en) * | 2019-10-14 | 2021-04-30 | 北京交通大学 | Circular PCB Rogowski coil for measuring internal current of crimping type IGBT |
| CN112858862B (en) * | 2021-01-07 | 2022-06-28 | 清华大学 | Magnetic field inversion current calculation method for semiconductor current density analysis |
| KR20220136754A (en) | 2021-04-01 | 2022-10-11 | 삼성전자주식회사 | Integrated circuit device, semiconductor substrate and test system including integrated circuit device |
| CN114019216A (en) * | 2021-11-01 | 2022-02-08 | 华北电力大学 | Online measurement system for chip current of elastic compression joint IGBT device |
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