CN109852065A - Silica gel pad and preparation method thereof - Google Patents
Silica gel pad and preparation method thereof Download PDFInfo
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- CN109852065A CN109852065A CN201910068090.0A CN201910068090A CN109852065A CN 109852065 A CN109852065 A CN 109852065A CN 201910068090 A CN201910068090 A CN 201910068090A CN 109852065 A CN109852065 A CN 109852065A
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- Prior art keywords
- silica gel
- heat filling
- gel pad
- silane
- heat
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Abstract
The invention discloses a kind of silica gel pads and preparation method thereof, which is characterized in that by mass percentage, the formula composition of the silica gel pad includes liquid silastic 5-20%, heat filling 70-90%, enhances heat filling dosage 0.05 ~ 10%.Heating conduction is more preferable compared with the existing technology for silica gel pad of the present invention, and performance is more stable, effectively prevents frangible, the problem of deforming and after-tacking.
Description
Technical field
The present invention relates to silica gel pad preparation technical fields more particularly to a kind of silica gel pad and preparation method thereof.
Background technique
Currently, heat conductive silica gel gasket product thermal coefficient in the market is all in 1-5w/mk, not only poor thermal conductivity, unstable
It is fixed, and it is easy to appear frangible, the problems such as deforming, after-tacking.As electronics is integrated higher and higher, low thermal conductivity product is
It is difficult to meet user's requirement.
Summary of the invention
It is a primary object of the present invention to propose a kind of silica gel pad and preparation method, it is intended to which solution exists in the prior art
The technical issues of, the thermal conductivity and stability of silica gel pad are improved, frangible, the problem of deforming and after-tacking is avoided the occurrence of.
To achieve the above object, the present invention proposes a kind of silica gel pad, by mass percentage, the formula of the silica gel pad
Composition includes liquid silastic 5-20%, heat filling 70-90%, enhances heat filling dosage 0.05~10%.
Wherein, the viscosity of the liquid silastic is 100~2000cP.
Wherein, the heat filling uses one of aluminium oxide, aluminium nitride or composite granule.
Wherein, the partial size of the aluminium oxide is 2~90um, the partial size of the aluminium nitride is 1~10um.
Wherein, the enhancing heat filling is using in four acicular type zinc oxide crystal whisker, titanium oxide nano wire, silicon carbide whisker
A kind of or composite granule.
Wherein, the diameter of the titanium oxide nano wire is 20~80nm, and length is 2~10um, the silicon carbide whisker
Diameter is 20~80nm, and length is 2~10um.
The present invention also proposes a kind of method for preparing silica gel pad as described above, the described method comprises the following steps:
Step S1, the surface for carrying out filler using the complex method of silane coupling agent combination polysiloxanes is modified, is changed
Property filler；
Step S2, in vacuum kneader, modified filler is mixed with liquid silastic component A, adds component B, mixed
After closing uniformly, composite mortar is obtained；
Step S3, sheet material is made in the composite mortar by calender；
Step S4, the sheet material is heat-treated 10~60 minutes at 100~150 DEG C, obtains silica gel pad.
Wherein, the filler includes heat filling and enhancing heat filling, and the step S1 includes:
By heat filling and enhancing heat filling after high-speed mixer and mixing is uniform, the mixing that silane and ethyl alcohol is added is molten
Liquid carries out mixed at high speed and is modified, polysiloxanes is then added, and carries out mixed at high speed and is modified, is then heat-treated 2 at 80~100 DEG C
Hour, obtain modified filler, wherein the volume ratio of the silane and ethyl alcohol is 1:1.
Wherein, the silane using vinyltrimethoxysilane, vinyltriethoxysilane, vinyl tris silane,
Three tert-butoxy silane of vinyl, vinyl silane tri-butyl peroxy, vinyltriacetoxy silane, 3- propyl trimethoxy
One or two kinds of compounds of base silane, the silane dosage are the 0.2 of the heat filling and the enhancing total dosage of heat filling
~5%.
Wherein, the polysiloxanes uses methylvinyl-polysiloxane, one kind of phenylethylene based polysiloxane or two
Kind compound, the dosage of the polysiloxanes are the 0.5~5% of the heat filling and the enhancing total dosage of heat filling.
The beneficial effects of the present invention are: heating conduction is more preferable compared with the existing technology for silica gel pad of the present invention, performance is more
Stablize, effectively prevents frangible, the problem of deforming and after-tacking.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
Preferably embodiment of the invention is described in further detail below.
The present invention proposes a kind of silica gel pad, and by mass percentage, the formula composition of the silica gel pad includes liquid silicon
Rubber 5-20%, heat filling 70-90% enhance heat filling dosage 0.05~10%.
For example, as an implementation, by mass percentage, the formula composition of the silica gel pad includes liquid silicon rubber
Glue 5%, heat filling 90% enhance heat filling dosage 0.05%；As another embodiment, by mass percentage, institute
The formula composition for stating silica gel pad includes liquid silastic 20%, and heat filling 70% enhances heat filling dosage 10%；At it
In his embodiment, the formula composition of the silica gel pad can also include liquid silastic 12.5%, heat filling 80%, enhancing
Heat filling dosage 5%.
Further, in this implementation, the viscosity of the liquid silastic is 100~2000cP.
Since liquid silastic has lower viscosity, be conducive to the dispersibility that material is processed and improves system, compared with
Low viscosity can fill the heat filling of higher amount, obtain highly heat-conductive material.
Further, in the present embodiment, the heat filling uses one of aluminium oxide, aluminium nitride or composite powder
Body.Wherein, the partial size of the aluminium oxide is 2~90um, the partial size of the aluminium nitride is 1~10um.
Further, in the present embodiment, the enhancing heat filling uses four acicular type zinc oxide crystal whisker, TiOx nano
One of line, silicon carbide whisker or composite granule.Wherein, the diameter of the titanium oxide nano wire is 20~80nm, length 2
~10um, the diameter of the silicon carbide whisker are 20~80nm, and length is 2~10um.
In the present embodiment, the introducing of tetrapod-shaped nano-whisker and nano wire improves the interaction between conductive particle, has
Conducive to raising heating conduction, meanwhile, one-dimensional nano structure can increase the intensity of material, improve mechanical performance.
To further illustrate the present invention, Fig. 1 is please referred to, Fig. 1 is the schematic diagram of product structure of silica gel pad of the present invention.The silicon
Glue gasket includes that liquid silicon matrix 1 and compound height lead filler 2.
Heating conduction is more preferable compared with the existing technology for silica gel pad of the present invention, and performance is more stable, effectively prevent it is frangible,
The problem of deforming and after-tacking.
The present invention also proposes a kind of method for preparing silica gel pad, this state method the following steps are included:
Step S1, the surface for carrying out filler using the complex method of silane coupling agent combination polysiloxanes is modified, is changed
Property filler.
Using the modified compounded mix of the double action of silane and siloxanes, interfacial interaction is increased, reduces interface heat
Resistance is conducive to the heating conduction for improving silica gel pad.
Step S2, in vacuum kneader, modified filler is mixed with liquid silastic component A, adds component B, mixed
After closing uniformly, composite mortar is obtained.Wherein, the component proportion of component A and component B is 10:1 or 1:1.
Bi-component liquid silicone rubber with respect to solid high-temperature sulphurated siliastic for, be liquid glue, have mobility
Good, vulcanization is fast, safer environmental protection.Liquid silastic has lower viscosity, is conducive to the dispersion that material is processed and improves system
Property, lower viscosity can fill the heat filling of higher amount, obtain highly heat-conductive material.
Step S3, sheet material is made in the composite mortar by calender.
Step S4, the sheet material is heat-treated 10~60 minutes at 100~150 DEG C, obtains silica gel pad.
For example, the sheet material can be heat-treated 60 at 100 DEG C after sheet material is made in the composite mortar by calender
Minute, it can also be heat-treated 10 minutes, can also be heat-treated 35 minutes at 125 DEG C, when it is implemented, can basis at 150 DEG C
Actual conditions are heat-treated in suitable temperature.
Further, the filler includes heat filling and enhancing heat filling, and the step S1 includes:
By heat filling and enhancing heat filling after high-speed mixer and mixing is uniform, the mixing that silane and ethyl alcohol is added is molten
Liquid, it is modified to carry out mixed at high speed, and polysiloxanes is then added, and it is modified to carry out mixed at high speed, then 80~100 DEG C (such as
80 DEG C or 90 DEG C or 100 DEG C) heat treatment 2 hours, obtain modified filler, wherein the volume ratio of the silane and ethyl alcohol
For 1:1.
Further, in the present embodiment, the silane uses vinyltrimethoxysilane, vinyl triethoxyl silicon
Alkane, vinyl tris silane, three tert-butoxy silane of vinyl, vinyl silane tri-butyl peroxy, vinyl triacetoxy
One or two kinds of compounds of silane, 3- propyl trimethoxy silicane, the silane dosage are that the heat filling and enhancing are led
0.2~5% (such as 0.2% or 2.5% or 5%) of the hot total dosage of filler.
The polysiloxanes is compound using methylvinyl-polysiloxane, the one or two of phenylethylene based polysiloxane
Object, the dosage of the polysiloxanes be the heat filling and enhance the total dosage of heat filling 0.5~5% (such as 0.5%,
Or 2.5% or 5%).
Using the modified compounded mix of the double action of silane and siloxanes, interfacial interaction is increased, reduces interface heat
Resistance is conducive to the heating conduction for improving gasket silica gel.
The beneficial effect that the present invention prepares the method for silica gel pad is:
1, liquid silastic has lower viscosity, is conducive to the dispersibility that material is processed and improves system, lower viscous
Degree can fill the heat filling of higher amount, obtain highly heat-conductive material；
2, the introducing of tetrapod-shaped nano-whisker and nano wire improves the interaction between conductive particle, is conducive to improve
Heating conduction, meanwhile, one-dimensional nano structure can increase the intensity of material, improve mechanical performance；
3, using the modified compounded mix of double action of silane and siloxanes, interfacial interaction is increased, interface is reduced
Thermal resistance is conducive to improve heating conduction；
4, the design of material system reduces solidification temperature, saves energy consumption, is conducive to curing reaction and sufficiently carries out, avoid
The residual and precipitation of uncured components.
The above is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (10)
1. a kind of silica gel pad, which is characterized in that by mass percentage, the formula composition of the silica gel pad includes liquid silicon rubber
Glue 5-20%, heat filling 70-90% enhance heat filling dosage 0.05~10%.
2. silica gel pad according to claim 1, which is characterized in that the viscosity of the liquid silastic be 100~
2000cP。
3. silica gel pad according to claim 1, which is characterized in that the heat filling is using in aluminium oxide, aluminium nitride
One kind or composite granule.
4. silica gel pad according to claim 3, which is characterized in that the partial size of the aluminium oxide is 2~90um, the nitrogen
The partial size for changing aluminium is 1~10um.
5. silica gel pad according to claim 1, which is characterized in that the enhancing heat filling uses four-needle-like zinc oxide
One of whisker, titanium oxide nano wire, silicon carbide whisker or composite granule.
6. silica gel pad according to claim 5, which is characterized in that the diameter of the titanium oxide nano wire be 20~
80nm, length are 2~10um, and the diameter of the silicon carbide whisker is 20~80nm, and length is 2~10um.
7. a kind of method for preparing silica gel pad as claimed in any one of claims 1 to 6, which is characterized in that the method packet
Include following steps:
Step S1, the surface for carrying out filler using the complex method of silane coupling agent combination polysiloxanes is modified, obtains modification and fills out
Material；
Step S2, in vacuum kneader, modified filler is mixed with liquid silastic component A, adds component B, mixing is equal
After even, composite mortar is obtained；
Step S3, sheet material is made in the composite mortar by calender；
Step S4, the sheet material is heat-treated 10~60 minutes at 100~150 DEG C, obtains silica gel pad.
8. preparation method according to claim 7, which is characterized in that the filler includes that heat filling and enhancing thermally conductive is filled out
Material, the step S1 include:
By heat filling and enhancing heat filling after high-speed mixer and mixing is uniform, the mixed solution of silane and ethyl alcohol is added, into
Row mixed at high speed is modified, and polysiloxanes is then added, and carries out mixed at high speed and is modified, is then heat-treated 2 hours at 80~100 DEG C,
Obtain modified filler, wherein the volume ratio of the silane and ethyl alcohol is 1:1.
9. preparation method according to claim 8, which is characterized in that the silane using vinyltrimethoxysilane,
Vinyltriethoxysilane, vinyl tris silane, three tert-butoxy silane of vinyl, vinyl silane tri-butyl peroxy,
One or two kinds of compounds of vinyltriacetoxy silane, 3- propyl trimethoxy silicane, the silane dosage are described
The 0.2~5% of heat filling and the enhancing total dosage of heat filling.
10. preparation method according to claim 8, which is characterized in that the polysiloxanes uses the poly- silicon of methyl ethylene
One or two kinds of compounds of oxygen alkane, phenylethylene based polysiloxane, the dosage of the polysiloxanes be the heat filling and
Enhance the 0.5~5% of the total dosage of heat filling.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2018101353615 | 2018-02-09 | ||
| CN201810135361 | 2018-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109852065A true CN109852065A (en) | 2019-06-07 |
Family
ID=66895983
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| CN201910068090.0A Pending CN109852065A (en) | 2018-02-09 | 2019-01-24 | Silica gel pad and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113881250A (en) * | 2021-10-20 | 2022-01-04 | 广州集泰化工股份有限公司 | Heat-conducting filler and surface treatment method thereof |
| CN114188072A (en) * | 2021-12-02 | 2022-03-15 | 浙江荣泰电工器材股份有限公司 | Special-shaped mica insulation product suitable for three-dimensional modeling and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113881250A (en) * | 2021-10-20 | 2022-01-04 | 广州集泰化工股份有限公司 | Heat-conducting filler and surface treatment method thereof |
| CN114188072A (en) * | 2021-12-02 | 2022-03-15 | 浙江荣泰电工器材股份有限公司 | Special-shaped mica insulation product suitable for three-dimensional modeling and preparation method thereof |
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Application publication date: 20190607 |