CN109851996A - A kind of preparation method of be carbonized silicon modified epoxy resin and its composite material - Google Patents
A kind of preparation method of be carbonized silicon modified epoxy resin and its composite material Download PDFInfo
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- CN109851996A CN109851996A CN201811574387.6A CN201811574387A CN109851996A CN 109851996 A CN109851996 A CN 109851996A CN 201811574387 A CN201811574387 A CN 201811574387A CN 109851996 A CN109851996 A CN 109851996A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 89
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 89
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 239000010703 silicon Substances 0.000 title claims abstract description 41
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 38
- 239000002131 composite material Substances 0.000 title claims abstract description 36
- 239000000835 fiber Substances 0.000 claims abstract description 66
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 claims abstract description 58
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 claims abstract description 58
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000001263 FEMA 3042 Substances 0.000 claims abstract description 46
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 claims abstract description 46
- 229920002258 tannic acid Polymers 0.000 claims abstract description 46
- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 claims abstract description 46
- 229940033123 tannic acid Drugs 0.000 claims abstract description 46
- 235000015523 tannic acid Nutrition 0.000 claims abstract description 46
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 39
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 30
- 238000003763 carbonization Methods 0.000 claims abstract description 28
- 229960000935 dehydrated alcohol Drugs 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000004593 Epoxy Substances 0.000 claims abstract description 13
- 239000000243 solution Substances 0.000 claims description 23
- 238000005303 weighing Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 20
- 238000000576 coating method Methods 0.000 claims description 20
- 239000007983 Tris buffer Substances 0.000 claims description 14
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 claims description 14
- 230000004048 modification Effects 0.000 claims description 10
- 238000012986 modification Methods 0.000 claims description 10
- 230000009514 concussion Effects 0.000 claims description 7
- 239000002270 dispersing agent Substances 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 7
- 229960004756 ethanol Drugs 0.000 claims description 7
- 235000019441 ethanol Nutrition 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000010907 mechanical stirring Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 229920001864 tannin Polymers 0.000 claims 1
- 235000018553 tannin Nutrition 0.000 claims 1
- 239000001648 tannin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 14
- 239000011347 resin Substances 0.000 abstract description 14
- 239000003153 chemical reaction reagent Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract description 3
- -1 3-8gNaCl Chemical compound 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- 239000003085 diluting agent Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920010741 Ultra High Molecular Weight Polyethylene (UHMWPE) Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000011157 advanced composite material Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229920006253 high performance fiber Polymers 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Abstract
The invention discloses the preparation methods of a kind of carbonization silicon modified epoxy resin and its composite material, a kind of preparation method of be carbonized silicon modified epoxy resin and its composite material, raw material including following parts by weight proportion: ultra high molecular weight polyethylene fiber, 0.03-0.5gTris, 200ml water, 0.1-0.8g tannic acid, 3-8gNaCl, silicon carbide, dehydrated alcohol, epoxy resin, 1,3- bis- (aminomethyl) benzene curing agent.Carbonization silicon modified epoxy resin prepared by the present invention, simple process, at low cost, reagent used is conventional reagent, does not need special installation, therefore have the characteristics that industrializing implementation is easy, carbonization silicon modified epoxy resin prepared by the present invention, by the way that silicon carbide is added in the epoxy, silicon carbide not only improves resin property, it can also be by playing the role of enhancing in the crossover network of resin and tannic acid, to improve interfacial adhesion.
Description
Technical field
The present invention relates to the technical field of composite materials of fiber and resin, specially a kind of carbonization silicon modified epoxy resin and
The preparation method of its composite material.
Background technique
Ultra-high molecular weight polyethylene (UHMWPE) fiber is to succeed in developing the early 1980s, after carbon fiber and
The third generation high-performance fiber occurred after aramid fiber is current specific strength and the highest fiber of specific modulus in the world.It has
There are a series of excellent performances, such as: high specific strength, high ratio modulus, specific strength are more than ten times of same section steel wire, and specific modulus is only
Inferior to superfine carbon fiber.Extension at break is low, work to break is big, with the very strong ability for absorbing energy, thus has outstanding anti-
Impact and anti-cut.Fibre density is low, and density is 0.97-0.98g/cm3, can bubble through the water column.With excellent uvioresistant
Beta radiation, anti-neutron and gamma-rays, specific energy absorption is high, dielectric constant is low, electromagnetic wave tansmittivity is high.Wear-resisting, resistant to chemical etching,
There is longer flex life.But due to UHMWPE fiber surface non-polar group, no chemical activity, surface can be low, nonpolarity
The disadvantages such as substance is difficult to infiltrate, and fusing point is low, to limit its application.Especially in terms of reinforced resin based composites,
Adhesive property between resin matrix is poor, causes shock resistance low, composite material is caused to occur fibre in use
The problems such as with resin matrix degumming and resin matrix cracking occur for dimension.
It is proved that fiber/epoxy resin composite material physics can be improved after epoxy resin is added in inorganic nano-particle
And chemical property.Therefore, nano particle is dispersed in epoxy resin-base, for increasing substantially composite material
Mechanical property has very important meaning.
Silicon carbide (SiC) has many advantages, such as, such as: fusing point, intensity and elasticity modulus are high, thermal expansion coefficient is low, chemical
Stability and wearability are outstanding etc., are at present also one of the ideal additive of advanced composite material.Nanometer silicon carbide grain diameter
Small, high surface activity is added into epoxy resin-base, it is easy to and the functional group of resin matrix has an effect, and is conducive to
Interface adhesive strength is improved, the mobility of matrix is reduced, to make the biggish improvement of the mechanical characteristic of composite material.
And the present invention proposes a kind of new thinking, starts with from the angle of resin, silicon carbide is added in trial in the epoxy,
Playing the role of nanoparticle between the fiber that resin and tannic acid are modified enhances, the cohesive force of reinforced resin and matrix, most
The intensity of composite material is greatly improved eventually.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides the systems of a kind of carbonization silicon modified epoxy resin and its composite material
Preparation Method has simple process and low cost, and reagent used is conventional reagent, does not need special installation, therefore have industry
Change and implements the advantages that being easy.
(2) technical solution
To achieve the above object, the invention provides the following technical scheme: a kind of carbonization silicon modified epoxy resin and its compound
The preparation method of material, the raw material including following parts by weight proportion: ultra high molecular weight polyethylene fiber, 0.03-
0.5gTris, 200ml water, 0.1-0.8g tannic acid, 3-8gNaCl, silicon carbide, dehydrated alcohol, epoxy resin, bis- (ammonia of 1,3-
Methyl) benzene curing agent, comprising the following steps:
1) preparation of tannic acid coating ultra high molecular weight polyethylene fiber
1. ultra high molecular weight polyethylene fiber is soaked for a period of time in ethyl alcohol, removal fiber surface is remaining organic molten
Agent then takes out drying.
2. the Tris for weighing 0.03-0.5g is dissolved in 200ml water, pH value of solution=8.5 are adjusted, 0.1-0.8g is then weighed
Tannic acid, 3-8gNaCl are dissolved in above-mentioned Tris solution and stir, ultra high molecular weight polyethylene fiber is immersed in this solution,
3-12h of concussion coating.
It is dried 3. afterwards taking out ultra high molecular weight polyethylene fiber, ultra-high molecular weight polyethylene is fine after being made tannic acid modified
Dimension.
2) preparation of carbonization silicon modified epoxy resin
1. weighing a certain amount of silicon carbide, a certain amount of dehydrated alcohol is added as dispersing agent, while also doing epoxy resin
Diluent, 1-3h of ultrasonic disperse.
2. weighing a certain amount of epoxy resin into beaker, scattered silicon carbide is added in beaker, mechanical stirring 1-
2h is completely dispersed silicon carbide in the epoxy.
3. it is added 1,3- bis- (aminomethyl) benzene curing agent, 5-10min of vacuum defoamation at 60 DEG C.
3) preparation of composite material
The ultra high molecular weight polyethylene fiber that tannic acid coats is put into mold, the epoxy resin for the Si modification that is carbonized is infused
Enter in mold, demoulded after curing molding at room temperature, obtains tannic acid coating ultra high molecular weight polyethylene fiber and doping is carbonized
The epoxy resin composite material of silicon.
Preferably, the mass percent of the silicon carbide and epoxy resin is 0% -10%.
Preferably, the mass ratio of the dehydrated alcohol and epoxy resin is 1:1-1:6.
Preferably, the mass ratio of the curing agent and epoxy resin is 1:1-1:6.
(3) beneficial effect
Compared with prior art, the present invention provides the preparation sides of a kind of carbonization silicon modified epoxy resin and its composite material
Method, have it is following the utility model has the advantages that
1, carbonization silicon modified epoxy resin prepared by the present invention, simple process and low cost, reagent used are conventional examination
Agent does not need special installation, therefore has the characteristics that industrializing implementation is easy.
2, carbonization silicon modified epoxy resin prepared by the present invention, by the way that silicon carbide is added in the epoxy, silicon carbide is not
But improve resin property, it can also be by playing the role of enhancing in the crossover network of resin and tannic acid, to improve boundary
Face cohesive force.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical solution in the embodiment of the present invention is clearly and completely retouched
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Embodiment one
A kind of preparation method of be carbonized silicon modified epoxy resin and its composite material, the original including following parts by weight proportion
Material: ultra high molecular weight polyethylene fiber, 0.03-0.5gTris, 200ml water, 0.1-0.8g tannic acid, 3-8gNaCl, carbonization
Silicon, dehydrated alcohol, epoxy resin, 1,3- bis- (aminomethyl) benzene curing agent, comprising the following steps:
1) preparation of tannic acid coating ultra high molecular weight polyethylene fiber
1. ultra high molecular weight polyethylene fiber is soaked for a period of time in ethyl alcohol, removal fiber surface is remaining organic molten
Agent then takes out drying.
2. the Tris for weighing 0.121g are dissolved in 200ml water, pH value of solution=8.5 are adjusted, 0.4g tannic acid is then weighed,
3gNaCl is dissolved in above-mentioned Tris solution and stirs, ultra high molecular weight polyethylene fiber is immersed in this solution, concussion coating
3h。
It is dried 3. afterwards taking out ultra high molecular weight polyethylene fiber, ultra-high molecular weight polyethylene is fine after being made tannic acid modified
Dimension.
2) preparation of carbonization silicon modified epoxy resin
1. weighing a certain amount of silicon carbide, the mass percent for controlling silicon carbide and epoxy resin is 0.5%, is added certain
The dehydrated alcohol of amount also makees the diluent of epoxy resin as dispersing agent, controls the quality of dehydrated alcohol and epoxy resin
Than for 1:3, ultrasonic disperse 1h.
2. weighing a certain amount of epoxy resin into beaker, scattered silicon carbide is added in beaker, mechanical stirring 1h,
It is completely dispersed silicon carbide in the epoxy.
3. being added 1,3- bis- (aminomethyl) benzene curing agent, the mass ratio for controlling curing agent and epoxy resin is 1:3, at 60 DEG C
Lower vacuum defoamation 5min.
3) preparation of composite material
The ultra high molecular weight polyethylene fiber that tannic acid coats is put into mold, the epoxy resin for the Si modification that is carbonized is infused
Enter in mold, demoulded after curing molding at room temperature, obtains tannic acid coating ultra high molecular weight polyethylene fiber and doping is carbonized
The epoxy resin composite material of silicon.
Embodiment two
A kind of preparation method of be carbonized silicon modified epoxy resin and its composite material, the original including following parts by weight proportion
Material: ultra high molecular weight polyethylene fiber, 0.03-0.5gTris, 200ml water, 0.1-0.8g tannic acid, 3-8gNaCl, carbonization
Silicon, dehydrated alcohol, epoxy resin, 1,3- bis- (aminomethyl) benzene curing agent, comprising the following steps:
1) preparation of tannic acid coating ultra high molecular weight polyethylene fiber
1. ultra high molecular weight polyethylene fiber is soaked for a period of time in ethyl alcohol, removal fiber surface is remaining organic molten
Agent then takes out drying.
2. the Tris for weighing 0.242g are dissolved in 200ml water, pH value of solution=8.5 are adjusted, 0.5g tannic acid is then weighed,
4gNaCl is dissolved in above-mentioned Tris solution and stirs, ultra high molecular weight polyethylene fiber is immersed in this solution, concussion coating
6h。
It is dried 3. afterwards taking out ultra high molecular weight polyethylene fiber, ultra-high molecular weight polyethylene is fine after being made tannic acid modified
Dimension.
2) preparation of carbonization silicon modified epoxy resin
1. weighing a certain amount of silicon carbide, the mass percent for controlling silicon carbide and epoxy resin is 1.0%, is added certain
The dehydrated alcohol of amount also makees the diluent of epoxy resin as dispersing agent, controls the quality of dehydrated alcohol and epoxy resin
Than for 1:4, ultrasonic disperse 1.5h.
2. weighing a certain amount of epoxy resin into beaker, scattered silicon carbide is added in beaker, mechanical stirring
1.5h is completely dispersed silicon carbide in the epoxy.
3. being added 1,3- bis- (aminomethyl) benzene curing agent, the mass ratio for controlling curing agent and epoxy resin is 1:4, at 60 DEG C
Lower vacuum defoamation 5min.
3) preparation of composite material
The ultra high molecular weight polyethylene fiber that tannic acid coats is put into mold, the epoxy resin for the Si modification that is carbonized is infused
Enter in mold, demoulded after curing molding at room temperature, obtains tannic acid coating ultra high molecular weight polyethylene fiber and doping is carbonized
The epoxy resin composite material of silicon.
Embodiment three
A kind of preparation method of be carbonized silicon modified epoxy resin and its composite material, the original including following parts by weight proportion
Material: ultra high molecular weight polyethylene fiber, 0.03-0.5gTris, 200ml water, 0.1-0.8g tannic acid, 3-8gNaCl, carbonization
Silicon, dehydrated alcohol, epoxy resin, 1,3- bis- (aminomethyl) benzene curing agent, comprising the following steps:
1) preparation of tannic acid coating ultra high molecular weight polyethylene fiber
1. ultra high molecular weight polyethylene fiber is soaked for a period of time in ethyl alcohol, removal fiber surface is remaining organic molten
Agent then takes out drying.
2. the Tris for weighing 0.363g are dissolved in 200ml water, pH value of solution=8.5 are adjusted, 0.6g tannic acid is then weighed,
5gNaCl is dissolved in above-mentioned Tris solution and stirs, ultra high molecular weight polyethylene fiber is immersed in this solution, concussion coating
9h。
It is dried 3. afterwards taking out ultra high molecular weight polyethylene fiber, ultra-high molecular weight polyethylene is fine after being made tannic acid modified
Dimension.
2) preparation of carbonization silicon modified epoxy resin
1. weighing a certain amount of silicon carbide, the mass percent for controlling silicon carbide and epoxy resin is 1.5%, is added certain
The dehydrated alcohol of amount also makees the diluent of epoxy resin as dispersing agent, controls the quality of dehydrated alcohol and epoxy resin
Than for 1:5, ultrasonic disperse 2h.
2. weighing a certain amount of epoxy resin into beaker, scattered silicon carbide is added in beaker, mechanical stirring 2h,
It is completely dispersed silicon carbide in the epoxy.
3. being added 1,3- bis- (aminomethyl) benzene curing agent, the mass ratio for controlling curing agent and epoxy resin is 1:5, at 60 DEG C
Lower vacuum defoamation 5min.
3) preparation of composite material
The ultra high molecular weight polyethylene fiber that tannic acid coats is put into mold, the epoxy resin for the Si modification that is carbonized is infused
Enter in mold, demoulded after curing molding at room temperature, obtains tannic acid coating ultra high molecular weight polyethylene fiber and doping is carbonized
The epoxy resin composite material of silicon.
Example IV
A kind of preparation method of be carbonized silicon modified epoxy resin and its composite material, the original including following parts by weight proportion
Material: ultra high molecular weight polyethylene fiber, 0.03-0.5gTris, 200ml water, 0.1-0.8g tannic acid, 3-8gNaCl, carbonization
Silicon, dehydrated alcohol, epoxy resin, 1,3- bis- (aminomethyl) benzene curing agent, comprising the following steps:
1) preparation of tannic acid coating ultra high molecular weight polyethylene fiber
1. ultra high molecular weight polyethylene fiber is soaked for a period of time in ethyl alcohol, removal fiber surface is remaining organic molten
Agent then takes out drying.
2. the Tris for weighing 0.484g are dissolved in 200ml water, pH value of solution=8.5 are adjusted, 0.7g tannic acid is then weighed,
6gNaCl is dissolved in above-mentioned Tris solution and stirs, ultra high molecular weight polyethylene fiber is immersed in this solution, concussion coating
10h。
It is dried 3. afterwards taking out ultra high molecular weight polyethylene fiber, ultra-high molecular weight polyethylene is fine after being made tannic acid modified
Dimension.
2) preparation of carbonization silicon modified epoxy resin
1. weighing a certain amount of silicon carbide, the mass percent for controlling silicon carbide and epoxy resin is 2%, is added a certain amount of
Dehydrated alcohol as dispersing agent, while also making the diluent of epoxy resin, control the mass ratio of dehydrated alcohol and epoxy resin
For 1:5, ultrasonic disperse 2.5h.
2. weighing a certain amount of epoxy resin into beaker, scattered silicon carbide is added in beaker, mechanical stirring 2h,
It is completely dispersed silicon carbide in the epoxy.
3. being added 1,3- bis- (aminomethyl) benzene curing agent, the mass ratio for controlling curing agent and epoxy resin is 1:5, at 60 DEG C
Lower vacuum defoamation 5min.
3) preparation of composite material
The ultra high molecular weight polyethylene fiber that tannic acid coats is put into mold, the epoxy resin for the Si modification that is carbonized is infused
Enter in mold, demoulded after curing molding at room temperature, obtains tannic acid coating ultra high molecular weight polyethylene fiber and doping is carbonized
The epoxy resin composite material of silicon.
Embodiment five
A kind of preparation method of be carbonized silicon modified epoxy resin and its composite material, the original including following parts by weight proportion
Material: ultra high molecular weight polyethylene fiber, 0.03-0.5gTris, 200ml water, 0.1-0.8g tannic acid, 3-8gNaCl, carbonization
Silicon, dehydrated alcohol, epoxy resin, 1,3- bis- (aminomethyl) benzene curing agent, comprising the following steps:
1) preparation of tannic acid coating ultra high molecular weight polyethylene fiber
1. ultra high molecular weight polyethylene fiber is soaked for a period of time in ethyl alcohol, removal fiber surface is remaining organic molten
Agent then takes out drying.
2. the Tris for weighing 0.5g are dissolved in 200ml water, pH value of solution=8.5 are adjusted, 0.8g tannic acid is then weighed,
8gNaCl is dissolved in above-mentioned Tris solution and stirs, ultra high molecular weight polyethylene fiber is immersed in this solution, concussion coating
12h。
It is dried 3. afterwards taking out ultra high molecular weight polyethylene fiber, ultra-high molecular weight polyethylene is fine after being made tannic acid modified
Dimension.
2) preparation of carbonization silicon modified epoxy resin
1. weighing a certain amount of silicon carbide, the mass percent for controlling silicon carbide and epoxy resin is 8%, is added a certain amount of
Dehydrated alcohol as dispersing agent, while also making the diluent of epoxy resin, control the mass ratio of dehydrated alcohol and epoxy resin
For 1:6, ultrasonic disperse 3h.
2. weighing a certain amount of epoxy resin into beaker, scattered silicon carbide is added in beaker, mechanical stirring 2h,
It is completely dispersed silicon carbide in the epoxy.
3. being added 1,3- bis- (aminomethyl) benzene curing agent, the mass ratio for controlling curing agent and epoxy resin is 1:6, at 60 DEG C
Lower vacuum defoamation 10min.
3) preparation of composite material
The ultra high molecular weight polyethylene fiber that tannic acid coats is put into mold, the epoxy resin for the Si modification that is carbonized is infused
Enter in mold, demoulded after curing molding at room temperature, obtains tannic acid coating ultra high molecular weight polyethylene fiber and doping is carbonized
The epoxy resin composite material of silicon.
In conclusion carbonization silicon modified epoxy resin prepared by the present invention, simple process and low cost, reagent used are equal
For conventional reagent, special installation is not needed, therefore has the characteristics that industrializing implementation is easy, carbonization Si modification prepared by the present invention
Epoxy resin, by the way that silicon carbide is added in the epoxy, silicon carbide not only improves resin property, can also by resin and
Play the role of enhancing in the crossover network of tannic acid, to improve interfacial adhesion.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (4)
1. the preparation method of a kind of carbonization silicon modified epoxy resin and its composite material, the original including following parts by weight proportion
Material: ultra high molecular weight polyethylene fiber, 0.03-0.5gTris, 200ml water, 0.1-0.8g tannic acid, 3-8gNaCl, carbonization
Silicon, dehydrated alcohol, epoxy resin, 1,3- bis- (aminomethyl) benzene curing agent, which comprises the following steps:
1) preparation of tannic acid coating ultra high molecular weight polyethylene fiber
1. ultra high molecular weight polyethylene fiber is soaked for a period of time in ethyl alcohol, the remaining organic solvent of fiber surface is removed,
Then take out drying；
2. the Tris for weighing 0.03-0.5g is dissolved in 200ml water, pH value of solution=8.5 are adjusted, 0.1-0.8g tannin is then weighed
Acid, 3-8gNaCl are dissolved in above-mentioned Tris solution and stir, ultra high molecular weight polyethylene fiber is immersed in this solution, concussion
Coat 3-12h；
It is dried 3. afterwards taking out ultra high molecular weight polyethylene fiber, ultra high molecular weight polyethylene fiber after being made tannic acid modified；
2) preparation of carbonization silicon modified epoxy resin
1. weighing a certain amount of silicon carbide, a certain amount of dehydrated alcohol is added as dispersing agent, while being also the dilute of epoxy resin
Release agent, 1-3h of ultrasonic disperse；
2. weighing a certain amount of epoxy resin into beaker, scattered silicon carbide is added in beaker, 1-2h of mechanical stirring,
It is completely dispersed silicon carbide in the epoxy；
3. it is added 1,3- bis- (aminomethyl) benzene curing agent, 5-10min of vacuum defoamation at 60 DEG C；
3) preparation of composite material
The ultra high molecular weight polyethylene fiber that tannic acid coats is put into mold, the epoxy resin for the Si modification that is carbonized is injected into mould
It in tool, is demoulded after curing molding at room temperature, obtains tannic acid coating ultra high molecular weight polyethylene fiber and doped silicon carbide
Epoxy resin composite material.
2. the preparation method of a kind of carbonization silicon modified epoxy resin according to claim 1 and its composite material, feature
It is, the mass percent of the silicon carbide and epoxy resin is 0% -10%.
3. the preparation method of a kind of carbonization silicon modified epoxy resin according to claim 1 and its composite material, feature
It is, the mass ratio of the dehydrated alcohol and epoxy resin is 1:1-1:6.
4. the preparation method of a kind of carbonization silicon modified epoxy resin according to claim 1 and its composite material, feature
It is, the mass ratio of the curing agent and epoxy resin is 1:1-1:6.
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| CN114808446A (en) * | 2022-06-06 | 2022-07-29 | 江南大学 | Environment-friendly explosion-proof modified ultrahigh molecular weight polyethylene fiber and preparation method thereof |
| CN115216119A (en) * | 2022-07-05 | 2022-10-21 | 上海冷盟精密电机有限公司 | Epoxy resin composite material and preparation method thereof |
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