CN109841600A - 硅光子光模块的封装结构及其封装方法 - Google Patents
硅光子光模块的封装结构及其封装方法 Download PDFInfo
- Publication number
- CN109841600A CN109841600A CN201910099878.8A CN201910099878A CN109841600A CN 109841600 A CN109841600 A CN 109841600A CN 201910099878 A CN201910099878 A CN 201910099878A CN 109841600 A CN109841600 A CN 109841600A
- Authority
- CN
- China
- Prior art keywords
- mating surface
- chip
- silicon photon
- cuw
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Semiconductor Lasers (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910099878.8A CN109841600B (zh) | 2019-01-31 | 2019-01-31 | 硅光子光模块的封装结构及其封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910099878.8A CN109841600B (zh) | 2019-01-31 | 2019-01-31 | 硅光子光模块的封装结构及其封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109841600A true CN109841600A (zh) | 2019-06-04 |
CN109841600B CN109841600B (zh) | 2020-06-12 |
Family
ID=66884449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910099878.8A Active CN109841600B (zh) | 2019-01-31 | 2019-01-31 | 硅光子光模块的封装结构及其封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109841600B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112859259A (zh) * | 2021-03-09 | 2021-05-28 | 亨通洛克利科技有限公司 | 光电协同封装硅光引擎 |
CN113009647A (zh) * | 2019-12-20 | 2021-06-22 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
WO2021120433A1 (zh) * | 2019-12-20 | 2021-06-24 | 青岛海信宽带多媒体技术有限公司 | 光模块 |
CN113534366A (zh) * | 2021-08-13 | 2021-10-22 | 亨通洛克利科技有限公司 | 高密cpo硅光引擎 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080145968A1 (en) * | 1999-08-04 | 2008-06-19 | Super Talent Electronics, Inc. | Manufacturing Method For Micro-SD Flash Memory Card |
US20140185312A1 (en) * | 2012-12-29 | 2014-07-03 | Duane Louderback | Method and apparatus for implementing optical modules in high temperatures |
CN205213227U (zh) * | 2015-10-30 | 2016-05-04 | 武汉电信器件有限公司 | 一种cob的散热结构 |
CN106711763A (zh) * | 2017-02-21 | 2017-05-24 | 武汉联特科技有限公司 | 基于低温加热技术延伸其工作温度范围的光模块 |
US9671580B1 (en) * | 2015-07-01 | 2017-06-06 | Inphi Corporation | Photonic transceiving device package structure |
CN107819515A (zh) * | 2017-11-20 | 2018-03-20 | 江苏亨通光网科技有限公司 | 一种硅光子芯片高度集成多通道光收发模块和有源光缆 |
CN108761673A (zh) * | 2018-08-20 | 2018-11-06 | 武汉华工正源光子技术有限公司 | 基于cob工艺贴装的光模块及其制作方法 |
CN108761666A (zh) * | 2018-03-30 | 2018-11-06 | 武汉联特科技有限公司 | 一种光模块 |
-
2019
- 2019-01-31 CN CN201910099878.8A patent/CN109841600B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080145968A1 (en) * | 1999-08-04 | 2008-06-19 | Super Talent Electronics, Inc. | Manufacturing Method For Micro-SD Flash Memory Card |
US20140185312A1 (en) * | 2012-12-29 | 2014-07-03 | Duane Louderback | Method and apparatus for implementing optical modules in high temperatures |
US9671580B1 (en) * | 2015-07-01 | 2017-06-06 | Inphi Corporation | Photonic transceiving device package structure |
CN205213227U (zh) * | 2015-10-30 | 2016-05-04 | 武汉电信器件有限公司 | 一种cob的散热结构 |
CN106711763A (zh) * | 2017-02-21 | 2017-05-24 | 武汉联特科技有限公司 | 基于低温加热技术延伸其工作温度范围的光模块 |
CN107819515A (zh) * | 2017-11-20 | 2018-03-20 | 江苏亨通光网科技有限公司 | 一种硅光子芯片高度集成多通道光收发模块和有源光缆 |
CN108761666A (zh) * | 2018-03-30 | 2018-11-06 | 武汉联特科技有限公司 | 一种光模块 |
CN108761673A (zh) * | 2018-08-20 | 2018-11-06 | 武汉华工正源光子技术有限公司 | 基于cob工艺贴装的光模块及其制作方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113009647A (zh) * | 2019-12-20 | 2021-06-22 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
WO2021120433A1 (zh) * | 2019-12-20 | 2021-06-24 | 青岛海信宽带多媒体技术有限公司 | 光模块 |
CN113009647B (zh) * | 2019-12-20 | 2022-06-21 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
US11927818B2 (en) | 2019-12-20 | 2024-03-12 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
CN112859259A (zh) * | 2021-03-09 | 2021-05-28 | 亨通洛克利科技有限公司 | 光电协同封装硅光引擎 |
CN113534366A (zh) * | 2021-08-13 | 2021-10-22 | 亨通洛克利科技有限公司 | 高密cpo硅光引擎 |
Also Published As
Publication number | Publication date |
---|---|
CN109841600B (zh) | 2020-06-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109841600A (zh) | 硅光子光模块的封装结构及其封装方法 | |
JP3087676B2 (ja) | ゲル状樹脂を用いた光結合系及び実装構造 | |
CN101521194B (zh) | 高速光电组件 | |
CN101520530B (zh) | 新型侧向耦合光纤构件及其加工方法 | |
US7200295B2 (en) | Optically enabled hybrid semiconductor package | |
CN1231965C (zh) | 半导体器件 | |
JP4050402B2 (ja) | 光電子装置およびその製造方法 | |
EP1022822B1 (en) | Optical module | |
CN103984066B (zh) | 用于高速传输的多路并行光组件及其组装方法 | |
CN106980159A (zh) | 基于光电混合集成的光电模块封装结构 | |
US7195955B2 (en) | Technique for protecting photonic devices in optoelectronic packages with clear overmolding | |
US6765801B1 (en) | Optical track drain package | |
CN103376517B (zh) | 光耦合器及制造光耦合器的方法 | |
US6963123B2 (en) | IC package, optical transmitter, and optical receiver | |
US20020001428A1 (en) | Optomodule and connection configuration | |
JP2018098465A (ja) | 半導体装置およびその製造方法 | |
CN113534366A (zh) | 高密cpo硅光引擎 | |
CN206820247U (zh) | Dfb激光器 | |
CN103633551B (zh) | 用于片上光互连的激光器封装方法 | |
CN216083183U (zh) | 一种800g光模块 | |
JP2006269783A (ja) | 光半導体パッケージ | |
CN107315229A (zh) | 集成封装结构及用于制作集成封装结构的工艺 | |
US6897485B2 (en) | Device for optical and/or electrical data transmission and/or processing | |
CN209690567U (zh) | 一种非气密性封装装配结构的光器件 | |
CN215494242U (zh) | 一种含有光纤阵列的光电器件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210624 Address after: 215200 No.88, Hengtong Avenue, Qidu Town, Wujiang District, Suzhou City, Jiangsu Province Patentee after: HENGTONG OPTIC-ELECTRIC Co.,Ltd. Patentee after: HENGTONG ROCKLEY TECHNOLOGY Co.,Ltd. Address before: 215200 Hengdao 88, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: HENGTONG ROCKLEY TECHNOLOGY Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215200 No.88, Hengtong Avenue, Qidu Town, Wujiang District, Suzhou City, Jiangsu Province Patentee after: HENGTONG OPTIC-ELECTRIC Co.,Ltd. Patentee after: Suzhou Zhuoyu Photon Technology Co., Ltd Address before: 215200 No.88, Hengtong Avenue, Qidu Town, Wujiang District, Suzhou City, Jiangsu Province Patentee before: HENGTONG OPTIC-ELECTRIC Co.,Ltd. Patentee before: Hengtong Rockley Technology Co., Ltd |