CN109836580A - Silicone epoxy containing four si-h bonds is applied with it - Google Patents
Silicone epoxy containing four si-h bonds is applied with it Download PDFInfo
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Abstract
The invention discloses a kind of silicone epoxy containing four si-h bonds, typical structure is shown below:
Description
Technical field
Contain four si-h bonds present invention relates particularly to a kind of silicone epoxy containing four si-h bonds, comprising described
The curable silicon composition etc. of silicone epoxy can be applied to such as light emitting diode (LED) semiconductor
The encapsulation field of device, electronic device.
Background technique
LED (semiconductor light-emitting-diode) is widely used in because having many advantages, such as low energy consumption, long-life, small size
The fields such as illumination, backlight.And packaging process is a very important process in LED processing procedure, for the workability of LED
Energy, cost etc. have the influence of highly significant.
With the development of semiconductor devices, the performance requirement of packaging plastic is stepped up.For example, with light emitting diode
(LED) continuous improvement of power and brightness proposes the optical property, physical property and chemical property etc. of silicon composition
Higher requirement, traditional epoxy resin encapsulating material have been unable to meet actual needs.
Currently, using by the polysiloxane-based component containing unsaturated bond and as the component containing si-h bond of crosslinking agent
High-power and high-luminance is carried out by the polysiloxane-based compound that hydrosilylation heat cure is formed in the presence of a catalyst
The encapsulation of white light LEDs has become the mode that industry is commonly used.However, existing crosslinking agent there are still it is some be difficult to overcome lack
It falls into.For example, using the organic silicon packaging glue of existing crosslinking agent usually exist curing rate is slow, curing time is long, solidify after have
The defects of machine silicon packaging plastic hardness is smaller and index of refraction under low and high temperature compared with cracking, therefore be applied to carry out the encapsulation of LED etc.
When, it often will affect its light extraction efficiency, light quality, photochromic homogeneity, device reliability etc..
Summary of the invention
The main purpose of the present invention is to provide a kind of silicone epoxies containing four si-h bonds, curable organic
Silicon composition and its application, to overcome deficiency in the prior art.
For realization aforementioned invention purpose, the technical solution adopted by the present invention includes:
The embodiment of the invention provides a kind of silicone epoxies containing four si-h bonds, with knot shown in following formula
Structure:
The embodiment of the invention also provides the silicone epoxy containing four si-h bonds as crosslinking agent in silicon
Application in addition reaction of hydrogen.
The embodiment of the invention also provides a kind of method for preparing the silicone epoxy containing four si-h bonds,
Include:
There is the cyclic compound containing multiple vinyl existing for catalyst with the compound containing multiple si-h bonds
Under the conditions of carry out hydrosilylation, generate the silicone epoxy containing four si-h bonds.It should be noted that by
In silicon hydrogenation reaction have anti-Markonikov's rule and markovnikov's rule addition product (referring to Silicon in Organic,
Organometallic, and Polymer Chemistry by Michael A.Brook, Wiley Interscience, pp
401-458), it will lead to the presence of multiple isomers, these isomers are also within the scope of the present patent application.
Preferably, the cyclic compound containing multiple vinyl has structure shown in following formula:
Preferably, the compound containing multiple si-h bonds has structure shown in following formula:
The embodiment of the invention also provides a kind of curable silicon compositions, including the polysiloxanes containing vinyl
Class component, the component and hydrosilylation catalysts of silicon-hydrogen bond containing；The component of the silicon-hydrogen bond containing includes described containing four silicon
The silicone epoxy of hydrogen bond.
The embodiment of the invention also provides the curable silicon compositions in article bonding, prepares article surface painting
Application in layer or article encapsulation.
Silicone epoxy containing four si-h bonds of the invention application be hydrosilylation crosslinking agent when, compared with
Existing crosslinking agent have many advantages, such as more high refractive index, more high viscosity, more high crosslink density, and include the present invention containing four silicon
The silicon composition of the silicone epoxy of hydrogen bond also have that curing efficiency is high, hardness is higher after solidification and index of refraction compared with
The features such as not cracking under high, thermogravimetric weight loss low and high temperature.
Technical solution of the present invention is more specifically illustrated with reference to embodiments, but not as to the present invention
Restriction.
Specific embodiment
A kind of silicone epoxy containing four si-h bonds that the one aspect of the embodiment of the present invention provides has following formula
Shown in structure:
Silicone epoxy containing four si-h bonds of the invention application be hydrosilylation crosslinking agent when, compared with
Existing crosslinking agent have many advantages, such as more high refractive index, more high viscosity, more high crosslink density, and include the present invention containing four silicon
The silicon composition of the silicone epoxy of hydrogen bond also has curing efficiency height, curing rate, and hardness is higher fastly, after solidification
And index of refraction is higher, does not crack under thermogravimetric weight loss low and high temperature, the features such as viscosity is suitable for industrial application.
The embodiment of the present invention another aspect provides the silicone epoxy conducts containing four si-h bonds
Application of the crosslinking agent in hydrosilylation.
The one aspect of the embodiment of the present invention provides the silicone epoxy for containing four si-h bonds described in a kind of prepare
Method comprising:
There is the cyclic compound containing multiple vinyl existing for catalyst with the compound containing multiple si-h bonds
Under the conditions of carry out hydrosilylation, generate the silicone epoxy containing four si-h bonds.Due to silicon hydrogenation reaction
There is the addition product of anti-Markonikov's rule and markovnikov's rule (referring to Silicon in Organic, Organometallic, and
Polymer Chemistry by Michael A.Brook, Wiley Interscience, pp 401-458), it will lead to more
The presence of a isomers, these isomers are also within the scope of the present patent application.
Wherein, the cyclic compound containing multiple vinyl has structure shown in following formula:
Wherein, the compound containing multiple si-h bonds has structure shown in following formula:
In some more specific embodiments, the preparation method is specifically included: will contain multiple vinyl
After cyclic compound, the compound containing multiple si-h bonds, catalyst and organic solvent mixing, it is heated to reflux carry out Si―H addition reaction
Reaction generates the silicone epoxy for containing four si-h bonds.
Wherein, the organic solvent, which can be selected from, can will contain the cyclic compound of multiple vinyl, containing multiple
The compound of si-h bond dissolves, but not with the cyclic compound containing multiple vinyl, the compound containing multiple si-h bonds,
The common organic solvents such as organic solvent of any reaction, such as benzene, toluene in catalyst.
Further, the condition of aforementioned hydrosilylation can be with reference to " hydrosilylation and research " (Shaoyang teachers training school
Journal, the 2nd phase in 1998, p82-84) etc. documents.
The silicon composition curable another aspect provides one kind of the embodiment of the present invention, including contain vinyl
Polysiloxane-based component, the component and hydrosilylation catalysts of silicon-hydrogen bond containing；The component of the silicon-hydrogen bond containing includes described
The silicone epoxy containing four si-h bonds.
In some preferred embodiments, the polysiloxane-based component containing vinyl contains at least two and silicon key
The aromatic radical of the alkenyl of conjunction and at least one and silicon bonding.
Preferably, the index of refraction of the polysiloxane-based component containing vinyl is not less than 1.5, especially preferably 1.50
~1.65.
Preferably, the polysiloxane-based component containing vinyl in 25 DEG C viscosity be 10~10,000cPs, especially
Preferably 50~5000cPs.
Preferably, polysiloxane-based group containing vinyl is selected from linear polymer, branched polymers or netted poly-
Close the one or more of object.
It is further preferred that polysiloxane-based group containing vinyl is selected from linear polymer.
Still more preferably, the polysiloxane-based component containing vinyl has structure shown in following formula:
Wherein, D=1~500, M=1~500, N=1~500；More preferably, D=1~50, M=1~500, N=1
~50.In some preferred embodiments, vinyl contained in the polysiloxane-based component containing vinyl with it is described
The molar ratio of si-h bond contained in the component of silicon-hydrogen bond containing is 10:1~1:10, preferably 2:1~1:2.
In the present invention, the dosage of preceding hydrosilylation catalyst should be enough to promote consolidating for silicon composition of the present invention
Change.These hydrosilylation catalysts are as known in the art and are commercially available, such as be may be selected from but not limited to
Following substance: platinum group metal: platinum, rhodium, ruthenium, palladium, osmium or iridium metals or its organo-metallic compound and combinations thereof.Specifically
, platinum black, the compound such as reaction product of chloroplatinic acid, chloroplatinic acid hexahydrate and monohydric alcohol, bis- (ethyls can be selected from
Acetoacetate) platinum, bis- (acetopyruvic acid) platinum, platinous chloride and the compound and alkene or low molecular weight organic poly- silicon oxygen
Alkane or in matrix or core-shell type structure the platinum compounds of microencapsulation compound.The organopolysiloxane of platinum and low molecular weight
Compound, including 1,3- divinyl -1,1 with platinum, 3,3- tetramethyl disiloxane compounds.These compounds can be in
Microencapsulation in resinous substrates.Optionally, catalyst may include 1, the 3- divinyl -1,1 with platinum, 3,3- tetramethyl, two silicon oxygen
Alkane compound.These hydrosilylation catalysts can refer to CN1863875A (0020-0021 sections of specification), US 3,159,
601, US3,220,972, US3,296,291, No. US3,419,593, US3,516,946, US3,814,730, US3,989,
668, US4,784,879, US5,036,117, No. US5,175,325, EP 0 347 895 B, US4,766,176, US5,017,
654 equal documents.And/or at least one UV active Pt catalyst, it can refer to US8,314,200.More specifically, the hydrogenation
Silylation catalyst can be selected from platinum catalyst, rhodium catalyst or the palladium catalyst of catalytic amount；Preferably, the platinum catalyst choosing
From platinum micro mist, chloroplatinic acid, the alcoholic solution of chloroplatinic acid, platinum/alkenylsiloxane complex, platinum/alkene complex and platinum/carbonyl network
Close the one or more of object.Preferably, dosage of the hydrosilylation catalysts in the silicon composition is
0.1ppm to 1,0000ppm.
In some case study on implementation, based on the weight of silicon composition of the present invention, preceding hydrosilylation catalyst
Amount can be following range of platinum group metal: 0.1ppm to 1,0000ppm is optionally 1ppm to 1000ppm, and is optionally
10ppm to 100ppm.
Among some embodiments, the silicon composition also may include solvent or diluent.Preferably, described
The dosage of solvent or diluent is enough to cooperate with each component of the silicon composition and form homogeneous phase solution.In the present invention
In, solvent or diluent above-mentioned can be the mixture of applicable any type, such as water, organic solvent or both, preferably
From organic solvent, such as it may be selected from but not limited to n-hexane, toluene, chloroform, methylene chloride, ethyl alcohol, acetone, 2- butanone, 4- first
Base -2 pentanone, rouge, photoresist solvent (such as PGME, PGMEA) etc., to be with remaining combination of materials in the composition
Liquid with good fluidity, especially homogeneous phase solution.
Among some embodiments, the silicon composition also may include inhibitor.The inhibitor, i.e. silicon hydrogen
Addition reaction inhibitor, which refers to, can result in the undesirable substance of hydrosilylation, with reference to CN1863875A (the 0025th section) etc.,
It can be selected from alkynol compound, alkene-alkine compounds, siloxanes or benzotriazole and other hydrosilanes reaction suppressors.Example
Such as, alkynol compound inhibitor can be selected from 2- phenyl -3- butyne-2-alcohol, 2- methyl -3- butyne-2-alcohol, 3,5- dimethyl -
1- hexin -3- alcohol etc.；Alkene-alkine compounds can be selected from 3- methyl-pirylene etc., and siloxanes can be selected from 1,3,5,7-
Four hexenyl cyclotetrasiloxane of tetramethyl -1,3,5,7-, 1,3,5,7- tetramethyl -1,3,5,7- tetravinyl cyclotetrasiloxane
Deng.Wherein preferred alkynol compound, particularly preferred 2- phenyl -3- butyne-2-alcohol.
Among some embodiments, the silicon composition also may include other additives, such as small molecule silicon
Alkane (can be with or without ethylene or Si-H functional group), adhesion promoters, heat or the cured epoxy/acrylic acid/polyurethane of UV/
The resins such as bismaleimide, inorganic filler, rheology modifier, tackifier, wetting agent, defoaming agent, levelling agent, dyestuff and glimmering
Any one of light powder antisettling agent (such as SHIN-ETSU HANTOTAI DM-30, Sanwell SH series LED fluorescent powder anti-settling agent etc.) or two kinds with
On combination.
Wherein, the tackifier or adhesive accelerant can be selected from ethyl orthosilicate, vinyltrimethoxysilane, boric acid
N-butyl, boric acid isopropyl ester, isooctyl acid titanium, zirconium iso-octoate, tetrabutyl titanate, isopropyl titanate, KH-171, KH-560, KH-
570, (the reference such as ethenylmethoxy silicone homopolymer, 3- glycidyl ether oxypropyltrimethoxysilane
The 0026th section of CN1863875A specification etc.), the adhesive accelerant that commercially available approach can obtain can produce for Dow Corning Corporation
JCR6101, JCR6101UP, EG6301, OE6336, JCR6175, JCR6109, Hipec4939, Hipec1-9224,
OE6250, SR7010, SE9207, SE1740, SE9187L etc., but not limited to this.
Wherein, the inorganic filler can be as known in the art and be commercially available, such as may include
Inorganic filler such as silica, for example, colloidal silicon dioxide, pyrogenic silica, silica flour, titanium oxide, glass, oxidation
Aluminium, zinc oxide, or combinations thereof, filler can be micron or nanometer particle, it is however preferred to have 5000 nanometers or smaller average grain
Diameter and will not be by scattering or absorbing reduction percent transmission.
And about such as rheology modifier, wetting agent, defoaming agent, levelling agent, dyestuff etc., definition is that industry notes,
And it can freely be chosen out of industry common respective material.
Preferably, the content of additive is not more than 50wt% in the curable silicon composition, particularly preferably exists
10wt% is hereinafter, more preferably in 5wt% or less.
In addition, also may include except the present invention in silicon composition of the invention in some feasible embodiments
The component of other one or more silicon-hydrogen bond containings except silicone epoxy containing four si-h bonds, such as three (dimethyl
Siloxy group) phenyl silane etc..Certainly, the effect of these embodiments may be to be inferior to only in silicon composition of the invention
Those of silicone epoxy of the middle addition present invention containing four si-h bonds embodiment.
In some more specifically preferred embodiments, the silicon composition includes: containing for 10~95 parts by weight
There are the polysiloxane-based component of vinyl, the component of the silicon-hydrogen bond containing of 5~90 parts by weight, the hydrosilanes of 0.1~10000ppm
Change catalyst, the hydrosilanes reaction suppressor of 0.001~1.0 parts by weight, the additive of 0.001~5 parts by weight, 0.001~
The diluent of 90 parts by weight.
Further, the index of refraction of the silicon composition is 1.35~2.0, preferably 1.50~1.60.
Further, the viscosity of the silicon composition is 1~10,000,000cPs, preferably 1,000~100,
000cPs。
Silicon composition of the invention can refer to the group of formula of the widely applied organic silica gel mixture of current industry
Formula is prepared, for example, its component is divided into component A (mainly comprising the polysiloxane-based component containing vinyl, platinum catalysis
Agent, additive etc.) and component B ((main includes component, the additive etc. of silicon-hydrogen bond containing), when in use by two component of A, B by one
Certainty ratio mixing.Compared to the organic silica gel for being applied to semiconductor packages at present, silicon composition of the invention also has packet
Contain but be not limited to the advantages of listing as follows, comprising: still has long service life (greater than 8h without significantly gluing at room temperature
Degree variation), simplify semiconductor devices (such as LED) encapsulation process and improve yield, and, storage-stable is more preferably (at 0-5 DEG C
Under, it is greater than 1 month, preferably 3 months, more preferably 6 months).
What the other side of the embodiment of the present invention additionally provided the curable silicon composition is fully cured object.
The other side of the embodiment of the present invention, which additionally provides, prepares the completely solid of the curable silicon composition
The method of compound may include: to keep the silicon composition complete by heating or electromagnetic irradiation (such as the irradiation of UV light)
Solidification.
In certain specific embodiments of the invention, the system that object is fully cured of the curable silicon composition
Preparation Method may include:
In a planet strrier special plastic cup, it is added by the composition of the curable silicon composition each
Component is simultaneously uniformly mixed；
By the fluid stirred evenly (preferably liquid) at 25~300 DEG C 1~5,000min of heat cure.
Preferably, the hardness that object is fully cured is shore hardness A20~shore hardness D 95, especially preferably shore
Hardness 20~shore hardness of A D65.
Preferably, it is described be fully cured object for visible light light transmittance be 80%~100%, especially preferably 95%~
100%.
By silicon composition of the present invention, can make between device or device and the external world be able to maintain it is good every
From, including physics and chemical isolation, and/or device is made to be able to maintain good light output or intake efficiency.
Meanwhile the object that is fully cured of the silicon composition also shows good bonding force and flexibility, and dielectric
The performances such as constant, heat transfer efficiency, anti-aging are also ideal.
Postscript, compared to existing organic silica gel class product, silicon composition of the invention also have comprising but it is unlimited
In list as follows the advantages of, comprising: still have at room temperature long service life (be greater than 8h without significant viscosity change),
Better blind performance simplifies the encapsulation process of semiconductor devices (such as LED) and improves yield, and, storage-stable
More preferably (at 0-5 DEG C, it is greater than 1 month, preferably 3 months, more preferably 6 months).
Correspondingly, the other side of the embodiment of the present invention additionally provides the curable silicon composition in article
Be bonded, prepare article surface covering or article encapsulation in application.
In the present invention, " encapsulation " (packaging) should be understood that including at least following connotation e.g. passes through
More than two articles are bonded (adhesive) by the silicon composition, alternatively, by the silicon composition in article
The some regions on surface are formed by curing protective layer (coating), alternatively, the part of one or more articles is immersed to be had by described
Machine silicon composition formed solidfied material in, alternatively, by one or more articles integrally embed sealing (encapsulation) in by
In the solidfied material that the silicon composition is formed, certainly, the functions such as bonding above-mentioned, coating, sealing also can be achieved at the same time.
The other side of the embodiment of the present invention additionally provides a kind of adhering method comprising:
Apply between the first article and/or the second article surface and/or the first article and the second article described curable
Silicon composition,
Make the silicone composition, realizes that the first article is bonding with the second article；
Preferably, the cured condition includes: to keep the silicon composition completely solid by heating or electromagnetic irradiation
Change.
The other side of the embodiment of the present invention additionally provides a kind of semiconductor packages material, comprising described curable
Silicon composition and/or the silicon composition solidfied material.
The other side of the embodiment of the present invention additionally provides a kind of film or coating, is mainly had by described curable
Machine silicon composition is formed by curing.
The other side of the embodiment of the present invention additionally provides a kind of semiconductor light-emitting apparatus comprising: semiconductor light emitting
Chip, and, the film or coating；And the semiconductor luminous chip and the film or coating interval are arranged.
The other side of the embodiment of the present invention additionally provides a kind of packaging method comprising:
Article to be packaged is provided,
The curable silicon composition is applied on the article to be packaged, and by radiation and/or is added
Heat makes the silicone composition and realizes the encapsulation of the article.
Preferably, the article to be packaged includes semiconductor devices or electronic device.It is further preferred that described partly lead
Body device includes semiconductor photoelectric device.Still more preferably, the semiconductor photoelectric device includes light emitting semiconductor device
Such as LED etc..The other side of the embodiment of the present invention additionally provides a kind of device, and it includes what is formed by aforementioned encapsulation method
Encapsulating structure.
Preferably, the encapsulating structure is mainly by the solidfied material of the curable silicon composition and by the solidification
The article composition of object encapsulation, wherein packed article includes semiconductor devices or electronic device.
Preferably, the semiconductor devices includes semiconductor photoelectric device.It is further preferred that the semiconductor light electric appliance
Part includes light emitting semiconductor device such as LED, especially chip size packages semiconductor devices or wafer level semiconductor device etc..
In addition, silicon composition of the invention with fluorescent materials such as fluorescent powder, fluorescence quantums in use, can also assist
With using, for example, aforementioned fluorescent material can be mixed the silicon composition, then to packaged articles.In the process,
Inventor is also found surprisingly that very much, silicon composition of the invention can pole significantly reduce and even be eliminated phosphor
The sedimentation that material, especially fluorescent powder generate at any time, for example, when commonly all kinds of fluorescent materials are combined with of the invention by industry
After object mixing, at room temperature, there is no a precipitation status greater than 8h, preferably for 24 hours more than, thus can produce more uniform
Packaging effect improves the Luminescence Uniformity etc. of light emitting semiconductor device class.
For example, in some embodiments of the invention, a kind of fluorescence encapsulating composition may include the organosilicon group
Close object and the fluorescent material that is dispersed in the silicon composition, the fluorescent material includes fluorescent powder and/or glimmering
Light quanta point etc..
Preferably, in the fluorescence encapsulating composition fluorescent material account for non-solvent component content be 0.01wt%~
90wt%, further preferably 1wt%~80wt%, more preferably 3wt%~70wt%.
Aforementioned fluorescent powder includes rare earth phosphor, rare-earth garnet fluorescent powder, sulfurized alkaline earth metal gallate, alkaline-earth metal
Sulfide, vulcanization zinc-type, alkali earth metal aluminate, phosphate, borate, silicate, fluorine arsenate, fluogermanate, rare earth sulphur
Compound, rare earth oxide, vanadate, any one two or more combination in nitride phosphor.The fluorescence encapsulation group
It is preferably 1.0wt%~90wt% that fluorescent powder, which accounts for the content of non-solvent component, in conjunction object, more preferably 1.0wt%~70wt%.
More preferably, aforementioned fluorescent powder can use nano-phosphor.
The composition material of aforementioned fluorescent quantum dot include II-VI group or iii-v element, such as can be ZnSe, CdS,
Any one two or more combination material in CdSe and CdSe.Fluorescence quantum accounts for non-in the fluorescence encapsulating composition
The content of solvent composition is preferably 0.01~50wt%, more preferably 0.01~5.0wt%.
Fluorescence encapsulating composition above-mentioned is particularly suitable for the application in semiconductor light emitting device packages, comprising: wafer scale
Encapsulate (WLP), chip size packages (CSP), LED filament encapsulation etc..
Technical solution of the present invention is made specifically below in conjunction with several more specifically embodiments and corresponding comparative example
Explanation.But still it is emphasized that these embodiments are not to be construed as constituting any restrictions to protection scope of the present invention.
Postscript, unless otherwise specified, all numbers, percentage, the ratio etc. in description of the invention are by weight.
The component of silicon composition can be refering to table 1 in following each embodiment and reference examples.And these embodiments, control
The component applied in example is specific as follows:
Resin: the mixture of resin 1 and resin 2 that mass ratio is about 0.833:13, the equivalent of vinyl contained therein
It (equivalentweight) is about 1.66mmol/g.
Resin 1:50wt% diphenyldimethyl methylvinyl-polysiloxane, ethenyl blocking, refractive index 1.541 are glued
Spend 10700cPs.
Resin 2: the silsesquioxane of methyl (Me), phenyl (Ph), vinyl, refractive index 1.550, viscosity are had
55000cPs。
Crosslinking agent 1: refractive index 1.5028, viscosity 6.0cPs.
Crosslinking agent 2:30wt% diphenyldimethyl methylhydrogenpolysi,oxane, refractive index 1.4630, viscosity 400.0cPs.
Crosslinking agent 3: refractive index 1.460, viscosity 2.5cPs.
Crosslinking agent 4: refractive index 1.5133, viscosity 388.0cPs.
Adhesion promoters (Adhesion Promoter): 3- glycidyl ether oxypropyltrimethoxysilane.
Inhibitor (Si―H addition reaction inhibitor): 2- phenyl -3- butyne-2-alcohol.
Catalyst (hydrosilylation catalyst): platinum catalyst.
Aforementioned resin 1, crosslinking agent 1, crosslinking agent 2, crosslinking agent 3, crosslinking agent 4 are as follows.
(silicon hydrogen adds for aforementioned resin, resin 1, resin 2, crosslinking agent 1, crosslinking agent 2, crosslinking agent 3, adhesion promoters, inhibitor
At inhibitor), catalyst (hydrosilylation catalyst) etc. can be obtained by the approach such as commercially available.
Aforementioned crosslinking agent 4 can synthesize as follows:
(1) 0.5g hydrosilylation catalyst platinum is taken, 5mL dilution with toluene is added, is then added in 250mL three-neck flask；
(2) 3.45g t etram-ethyltetravinylcyclotetrasiloxane (tetramethyl- is taken
Tetravinylcyclotetrasiloxane, molecular weight MW=345g/mol), three necks burning is added after 20mL dilution with toluene is added
Bottle；
(3) 11.66g 1 is taken, (1,3-Bis (dimethylsilyl) benzene divides bis- (dimetylsilyl) benzene of 3-
Son amount=194.42), three-neck flask is added after 25mL dilution with toluene is added；
(4) it is arranged 130 DEG C of oil bath temperature, opens stirring, opens condensed water, until when temperature is 119 DEG C in three-neck flask, instead
Mixture is answered to start to flow back；
(5) it flows back after a period of time, draws a small amount of reaction mixture and carry out IR test, to judge whether reaction has carried out
Entirely.
After (6) 48 hours, IR as the result is shown carbon-free carbon double bond absorption peak then indicate reaction terminate, 1H NMR as the result is shown without
Reaction mixture is transferred to Rotary Evaporators at this time and steams solvent by vinyl H, be precipitated product crosslinking agent 4 (FT-IR:3090~
3010,2980~2898,2122,1592~1370,1256,1106,881,839,764,732cm-1；1H NMR δ: 7.58~
7.18,4.32~4.27,2.50~2.00,1.00~-0.50).
It should be noted that the product is the mixture that hydrosilylation is formed.
Characterization and test: further, inventor is also in such a way that industry is commonly seen to foregoing embodiments, control
Performance change situation, solidification situation and condensate performance of the silicon composition involved in example in room temperature environment, including
Light transmittance, hardness etc. are investigated respectively, as a result if the following table 2 is (it should be noted that each test data therein is multiple examinations
The average value of the test result of sample).
Table 1
Table 2
Likewise, other compounds and proportion that inventor is also addressed using this specification are assembled as raw material and are formd
Other multiple groups silicon compositions, and its properties is tested one by one, test result is also admirably suitable for industry
Using.
It can be seen that using the silicone epoxy containing four si-h bonds of the invention as the friendship of hydrosilylation
Join agent, not only have many advantages, such as more high refractive index, more high viscosity, more high crosslink density, but also can make comprising the organic of its
Silicon composition also has that curing efficiency is high, curing rate is fast, hardness is higher after solidification and index of refraction is higher, thermogravimetric weight loss is low, more
The features such as temperature tolerance well, viscosity are suitble to industrial application.To be allowed to be suitable for the encapsulating material of great power LED, it is also possible to
In the encapsulation of other semiconductor photoelectric devices, electronic device such as optical switch, photoelectrical coupler, solid-state image pickup element etc.；In addition,
The silicon composition can be used for optical adhesive, photoelectric device surface protection etc..
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or equipment for including a series of elements not only includes those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or equipment institute it is intrinsic
Element.
It should be appreciated that the technical concepts and features of above-described embodiment only to illustrate the invention, its object is to allow be familiar with this
The personage of item technology cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all
Equivalent change or modification made by Spirit Essence according to the present invention, should be covered by the protection scope of the present invention.
Claims (13)
1. a kind of silicone epoxy containing four si-h bonds, which is characterized in that the silicone ring for containing four si-h bonds
Oxide has structure shown in following formula:
2. the silicone epoxy described in claim 1 for containing four si-h bonds is as crosslinking agent in hydrosilylation
Using.
3. a kind of preparation method of the silicone epoxy containing four si-h bonds, characterized by comprising: make containing multiple second
That Si―H addition reaction is carried out under the conditions of having existing for catalyst is anti-with the compound containing multiple si-h bonds for the cyclic compound of alkenyl
It answers, generates the silicone epoxy described in claim 1 for containing four si-h bonds；
Preferably, the cyclic compound containing multiple vinyl has structure shown in following formula:
Preferably, the compound containing multiple si-h bonds has structure shown in following formula:
Preferably, the preparation method specifically includes: by the cyclic compound containing multiple vinyl, containing multiple si-h bonds
Compound, after organic solvent and catalyst mixing, be heated to reflux carry out hydrosilylation, generate and described contain four si-h bonds
Silicone epoxy.
4. a kind of curable silicon composition, including the polysiloxane-based component containing vinyl, the component of silicon-hydrogen bond containing
And hydrosilylation catalysts；It is characterized by: the component of the silicon-hydrogen bond containing includes described in claim 1 containing four silicon hydrogen
The silicone epoxy of key；
Preferably, the polysiloxane-based component containing vinyl contains the alkenyl and at least one of at least two Yu silicon bonding
A aromatic radical with silicon bonding；Preferably, the index of refraction of the polysiloxane-based component containing vinyl is not less than 1.5, especially
It is preferably 1.50~1.65；Preferably, the polysiloxane-based component containing vinyl in 25 DEG C viscosity be 10~10,
000cPs, especially preferably 50~5000cPs；Preferably, polysiloxane-based group containing vinyl be selected from linear polymer,
Branched polymers or network polymers it is one or more；It is further preferred that described contain the polysiloxane-based of vinyl
Group is selected from linear polymer；It is tied shown in following formula it is further preferred that the polysiloxane-based component containing vinyl has
Structure:
Wherein, D=1~500, M=1~500, N=1~500；More preferably, D=1~50, M=1~500, N=1~
50；Preferably, the hydrosilylation catalysts are selected from platinum catalyst, rhodium catalyst or the palladium catalyst of catalytic amount；Preferably,
The platinum catalyst is selected from platinum micro mist, chloroplatinic acid, the alcoholic solution of chloroplatinic acid, platinum/alkenylsiloxane complex, platinum/alkene network
It closes object and platinum/carbonyl complex is one or more；Preferably, the hydrosilylation catalysts are in the silicon composition
In dosage be 0.1ppm to 10,000ppm；
Preferably, in the component of vinyl contained in the polysiloxane-based component containing vinyl and the silicon-hydrogen bond containing
The molar ratio of contained si-h bond is 10:1~1:10, preferably 2:1~1:2；
Preferably, the curable silicon composition further include hydrosilanes reaction suppressor and/or additive and/or
Diluent；Preferably, the hydrosilanes reaction suppressor is selected from alkynol compound, alkene-alkine compounds, siloxanes or benzo
Triazole；Preferably, the content of additive is not more than 50wt% in the curable silicon composition, particularly preferably exists
5wt% or less；Preferably, the dosage of the diluent is enough to cooperate and formed homogeneous with each component of the silicon composition
Solution；
It is further preferred that the silicon composition includes: polysiloxane-based group containing vinyl of 10~95 parts by weight
Divide, the component of silicon-hydrogen bond containing of 5~90 parts by weight, the hydrosilylation catalysts of 0.1~10,000ppm, 0.001~1.0 weight
Measure the hydrosilanes reaction suppressor of part, the additive of 0.001~5 parts by weight, 0.001~90 parts by weight diluent；
Preferably, the index of refraction of the silicon composition is 1.35~2.0, preferably 1.50~1.60；And/or described have
The viscosity of machine silicon composition is 1~10,000,000cPs, preferably 1,000~100,000cPs.
5. object is fully cured in curable silicon composition as claimed in claim 4；Preferably, the object of being fully cured
Hardness is shore hardness A20~shore hardness D 95, especially preferably 20~shore hardness of shore hardness A D65；Preferably, institute
Stating and object is fully cured is 80%~100%, especially preferably 95%~100% for the light transmittance of visible light；Preferably, described
The preparation method that object is fully cured includes: that the silicon composition is fully cured by heating or electromagnetic irradiation.
6. fluorescence encapsulating composition, it is characterised in that comprising curable silicon composition as claimed in claim 4 and
The even fluorescent material being scattered in the silicon composition, the fluorescent material include fluorescent powder and/or fluorescence quantum；
Preferably, the content that fluorescent material accounts for non-solvent component in the fluorescence encapsulating composition is 0.01wt%~90wt%,
Further preferably 1wt%~80wt%, more preferably 3wt%~70wt%；
Preferably, the fluorescent powder includes rare earth phosphor, rare-earth garnet fluorescent powder, sulfurized alkaline earth metal gallate, alkaline earth
It is metal sulfide, vulcanization zinc-type, alkali earth metal aluminate, phosphate, borate, silicate, fluorine arsenate, fluogermanate, dilute
Native sulfide, rare earth oxide, vanadate, any one two or more combination in nitride phosphor；
Preferably, it is preferably 1.0wt%~90wt% that fluorescent powder, which accounts for the content of non-solvent component, in the fluorescence encapsulating composition,
More preferably 1.0wt%~70wt%；
More preferably, the fluorescent powder uses nano-phosphor；
Preferably, the composition material of the fluorescence quantum includes II-VI group or iii-v element；More preferably, described glimmering
The composition material of light quanta point includes any one two or more combination in ZnSe, CdS, CdSe and CdSe；
Preferably, in the fluorescence encapsulating composition fluorescence quantum account for the content of non-solvent component be preferably 0.01~
50wt%, more preferably 0.01~5.0wt%.
7. curable silicon composition described in claim 4 or fluorescence encapsulating composition as claimed in claim 6 are in article
Be bonded, prepare article surface covering or article encapsulation in application.
8. a kind of adhering method, characterized by comprising:
Applying between the first article and/or the second article surface and/or the first article and the second article can described in claim 4
Cured silicon composition,
Make the silicone composition, realizes that the first article is bonding with the second article；
Preferably, the cured condition includes: that the silicon composition is fully cured by heating or electromagnetic irradiation.
9. semiconductor packages material includes silicon composition and/or the organosilicon curable described in claim 4
The solidfied material of the solidfied material of composition or fluorescence encapsulating composition as claimed in claim 6 and/or the fluorescence encapsulating composition.
10. film or coating, main silicon composition curable as described in claim 4 or as claimed in claim 6 glimmering
Light encapsulating composition is formed by curing.
11. semiconductor light-emitting apparatus, characterized by comprising: semiconductor luminous chip, and, film described in any one of claim 10
Or coating；And the semiconductor luminous chip and the film or coating interval are arranged.
12. a kind of packaging method, characterized by comprising:
Article to be packaged is provided,
Silicon composition curable described in claim 4 or fluorescence encapsulating composition as claimed in claim 6 are applied to
On the article to be packaged, and the silicone composition is set to realize the article by radiation and/or heating
Encapsulation；
Preferably, the article to be packaged includes semiconductor devices or electronic device；It is further preferred that the semiconductor device
Part includes semiconductor photoelectric device；Still more preferably, the semiconductor photoelectric device includes light emitting semiconductor device, described
Light emitting semiconductor device includes LED.
13. a kind of device, it is characterised in that include the encapsulating structure formed by claim 12 the method；Preferably, described
Mainly silicon composition curable as described in claim 4 or fluorescence as claimed in claim 6 encapsulate combination to encapsulating structure
The solidfied material of object and the article encapsulated by the solidfied material form, wherein packed article includes semiconductor devices or electronics device
Part；Preferably, the semiconductor devices includes semiconductor photoelectric device；It is further preferred that the semiconductor photoelectric device packet
Light emitting semiconductor device is included, the light emitting semiconductor device includes LED, preferably chip size packages semiconductor devices or wafer
Level semiconductor device.
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| CN113795078A (en) * | 2021-08-25 | 2021-12-14 | 江苏运鸿辉电子科技有限公司 | Display drive package based on semi-flexible printed circuit board and manufacturing method thereof |
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