CN109830485B - Display panel, preparation method thereof and display device - Google Patents
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- CN109830485B CN109830485B CN201910144120.1A CN201910144120A CN109830485B CN 109830485 B CN109830485 B CN 109830485B CN 201910144120 A CN201910144120 A CN 201910144120A CN 109830485 B CN109830485 B CN 109830485B
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- 238000002360 preparation method Methods 0.000 title abstract description 13
- 238000004806 packaging method and process Methods 0.000 claims abstract description 124
- 239000002245 particle Substances 0.000 claims abstract description 95
- 239000012790 adhesive layer Substances 0.000 claims abstract description 74
- 238000000034 method Methods 0.000 claims abstract description 41
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 238000000149 argon plasma sintering Methods 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 30
- 238000007650 screen-printing Methods 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 11
- 239000004568 cement Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 9
- 239000004973 liquid crystal related substance Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 241000219122 Cucurbita Species 0.000 claims description 5
- 235000009852 Cucurbita pepo Nutrition 0.000 claims description 5
- 239000002775 capsule Substances 0.000 claims description 5
- 229920001967 Metal rubber Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000005245 sintering Methods 0.000 abstract description 11
- 238000005381 potential energy Methods 0.000 abstract description 9
- 238000001125 extrusion Methods 0.000 abstract 1
- 230000035882 stress Effects 0.000 description 41
- 238000005538 encapsulation Methods 0.000 description 19
- 239000005022 packaging material Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000005483 Hooke's law Effects 0.000 description 1
- 241000219000 Populus Species 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
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- 230000006355 external stress Effects 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
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Abstract
According to the display panel, the preparation method and the display device provided by the embodiment of the invention, the high-temperature-resistant elastic particles are added in the packaging adhesive layer, in the process of sintering the packaging adhesive layer by adopting laser, the elastic particles cannot be completely melted by high temperature generated by laser sintering, the high-temperature-resistant elastic particles can keep a certain shape, when stress exists due to uneven cooling in the cooling process after the packaging adhesive layer is sintered, the stress can extrude the elastic particles, the elastic particles deform by extrusion, and partial stress can be absorbed and converted into elastic potential energy in the deformation process, so that the purpose of reducing the residual stress in the packaging adhesive layer is achieved, and the packaging strength is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device.
Background
The display screen is usually packaged by sealing the cover plate and the glass substrate with the display structure with a packaging material, so that external water and oxygen molecules cannot enter the display screen.
In the conventional technology, a glass frit is coated on a package cover plate and cured, and then a laser is irradiated to melt a package material and fuse the package material with a glass substrate, thereby forming a sealed space.
However, in the conventional technology, when the package material is cooled after laser sintering, residual stress exists inside the package material due to uneven cooling, and cracks occur inside the package layer due to the existence of the residual stress, which affects the package strength.
Disclosure of Invention
The embodiment of the invention provides a display panel, a preparation method thereof and a display device, which are used for solving the problems that in the prior art, in the cooling process of a packaging material after laser sintering, residual stress exists in the packaging material due to uneven cooling, cracks are generated in the packaging layer due to the existence of the residual stress, and the packaging strength is influenced.
An embodiment of the present invention provides a display panel, including: the display substrate, the packaging cover plate, the display unit and the packaging adhesive layer are oppositely arranged; the display substrate is provided with a display area and a packaging area surrounding the display area, the packaging adhesive layer is positioned in the packaging area and between the display substrate and the packaging cover plate, and the display unit is positioned in the display area and between the display substrate and the packaging cover plate; wherein the content of the first and second substances,
the packaging adhesive layer comprises high-temperature-resistant elastic particles, and the high-temperature-resistant elastic particles are used for absorbing residual stress existing in the packaging adhesive layer after laser sintering due to uneven cooling.
Optionally, in a specific implementation manner, in the display panel provided in the embodiment of the present invention, the material of the elastic particles is a material having a young's modulus of elasticity of less than 7.84 Mpa.
Optionally, in a specific implementation manner, in the display panel provided in the embodiment of the present invention, a material of the elastic particles includes a metal rubber material.
Optionally, in practical implementation, in the display panel provided in the embodiment of the present invention, a ratio of a mass of the elastic particles to a total mass of the encapsulating adhesive layer is less than or equal to 30%.
Optionally, in practical implementation, in the display panel provided in the embodiment of the present invention, the high temperature range of the elastic particles resistant to high temperature is greater than or equal to 500 ℃.
Optionally, in a specific implementation, in the display panel provided in the embodiment of the present invention, a high temperature range of the elastic particles is: 500-600 ℃.
Optionally, in a specific implementation manner, in the display panel provided in the embodiment of the present invention, the shape of the elastic particles is smooth and has no corner.
Optionally, in a specific implementation manner, in the display panel provided in the embodiment of the present invention, the shape of the elastic particles includes one or a combination of a spherical shape, an elliptical shape, a gourd shape, and a capsule shape.
Optionally, in practical implementation, in the display panel provided in the embodiment of the present invention, a maximum diameter of the elastic particles is less than or equal to 5 μm.
Optionally, in a specific implementation, in the display panel provided in the embodiment of the present invention, a material of the encapsulation adhesive layer except for the elastic particles is glass cement.
Optionally, in a specific implementation manner, in the display panel provided in the embodiment of the present invention, the display unit includes a liquid crystal display unit or an organic light emitting display unit.
Correspondingly, the embodiment of the invention also provides a display device which comprises the display panel provided by the embodiment of the invention.
Correspondingly, the embodiment of the invention also provides a preparation method of the display panel, which comprises the following steps:
forming a display unit in a display area of a display substrate;
forming a packaging adhesive layer on the packaging cover plate in an area corresponding to the packaging area of the display substrate; wherein the packaging adhesive layer comprises high-temperature-resistant elastic particles;
and aligning and attaching the packaging cover plate and the display substrate, carrying out laser sintering on the packaging adhesive layer, and bonding the packaging cover plate and the display substrate together after the packaging adhesive layer is cooled to form the display panel.
Optionally, in a specific implementation, in the preparation method of the display panel provided in an embodiment of the present invention, the forming of the encapsulation adhesive layer on the encapsulation cover plate in a region corresponding to the encapsulation region of the display substrate specifically includes:
doping the elastic particles in glass cement to form packaging cement;
and coating the packaging glue on the packaging cover plate through a screen printing process to form the packaging glue layer.
Optionally, in a specific implementation, in the preparation method of the display panel provided in the embodiment of the present invention, a maximum diameter of the elastic particles is smaller than a screen aperture of the screen printing process and smaller than a height of the encapsulation adhesive layer.
The invention has the following beneficial effects:
the embodiment of the invention provides a display panel, a preparation method thereof and a display device, wherein the display panel comprises: the display substrate, the packaging cover plate, the display unit and the packaging adhesive layer are oppositely arranged; the display substrate is provided with a display area and a packaging area surrounding the display area, the packaging adhesive layer is positioned in the packaging area and between the display substrate and the packaging cover plate, and the display unit is positioned in the display area and between the display substrate and the packaging cover plate; the packaging adhesive layer comprises high-temperature-resistant elastic particles, and the high-temperature-resistant elastic particles are used for absorbing residual stress existing in the packaging adhesive layer after laser sintering due to uneven cooling. According to the invention, the high-temperature-resistant elastic particles are added in the packaging adhesive layer, in the process of sintering the packaging adhesive layer by adopting laser, the elastic particles cannot be completely melted by the high temperature generated by laser sintering, the high-temperature-resistant elastic particles can keep a certain shape, when stress exists due to uneven cooling in the cooling process after the packaging adhesive layer is sintered, the stress can extrude the elastic particles, the elastic particles are extruded to deform, and partial stress can be absorbed and converted into elastic potential energy in the deformation process, so that the purpose of reducing the residual stress in the packaging adhesive layer is achieved, and the packaging strength is improved.
Drawings
Fig. 1 is a schematic partial cross-sectional view of a display panel according to an embodiment of the present invention;
fig. 2 is a second schematic cross-sectional view of a display panel according to an embodiment of the invention;
fig. 3 is a third schematic partial cross-sectional view of a display panel according to an embodiment of the present invention;
fig. 4 is a fourth schematic cross-sectional view of a display panel according to an embodiment of the present invention;
fig. 5 is a fifth schematic cross-sectional view of a display panel according to an embodiment of the present invention;
fig. 6 is a sixth schematic sectional view of a display panel according to an embodiment of the present invention;
fig. 7 is a seventh schematic partial cross-sectional view of a display panel according to an embodiment of the invention;
fig. 8 is a schematic flow chart illustrating a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 9 is a second schematic flowchart of a method for manufacturing a display panel according to an embodiment of the invention;
fig. 10A and 10B are schematic structural diagrams of a method for manufacturing a display panel according to an embodiment of the present invention after performing the steps.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, specific embodiments of a display panel, a manufacturing method thereof and a display device according to an embodiment of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the preferred embodiments described below are only for illustrating and explaining the present invention and are not to be used for limiting the present invention. And the embodiments and features of the embodiments in the present application may be combined with each other without conflict. It should be noted that the thickness and shape of the respective layers in the drawings do not reflect the true scale of the display panel, and are only for the purpose of schematically illustrating the present invention. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
The present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the present embodiment is intended to better explain the present invention, but not to limit the present invention.
Need pass through laser high temperature sintering process among the present packaging structure, packaging material can absorb the heat among the high temperature sintering process, then release the heat in cooling process, because uneven cooling can make the inside residual stress that produces of packaging material in the cooling process after the high temperature sintering, can find that the crackle starting point takes place at the encapsulation district mostly in broken screen analysis experience before, residual stress makes the encapsulation district become the weakest region of intensity of display screen, consequently reduces residual stress and can effectively improve display screen bulk strength.
In view of this, an embodiment of the present invention provides a display panel, as shown in fig. 1, including: the display device comprises a display substrate 1, a packaging cover plate 2, a display unit 3 and a packaging adhesive layer 4 which are oppositely arranged; the display substrate is provided with a display area A and a packaging area B surrounding the display area A, the packaging adhesive layer 4 is positioned in the packaging area B and positioned between the display substrate 1 and the packaging cover plate 2, and the display unit 3 is positioned in the display area A and positioned between the display substrate 1 and the packaging cover plate 2; wherein the content of the first and second substances,
the packaging adhesive layer 4 comprises high-temperature-resistant elastic particles 01, and the high-temperature-resistant elastic particles 01 are used for absorbing residual stress existing in the packaging adhesive layer 4 when the packaging adhesive layer 4 has residual stress due to uneven cooling after laser sintering.
According to the display panel provided by the embodiment of the invention, the high-temperature-resistant elastic particles are added in the packaging adhesive layer, in the process of sintering the packaging adhesive layer by adopting laser, the elastic particles are not completely melted by high temperature generated by laser sintering, the high-temperature-resistant elastic particles can keep a certain shape, when stress exists due to uneven cooling in the cooling process after the packaging adhesive layer is sintered, the stress can extrude the elastic particles, the elastic particles are extruded to deform, and partial stress can be absorbed and converted into elastic potential energy in the deformation process, so that the purpose of reducing residual stress in the packaging adhesive layer is achieved, and the packaging strength is improved.
Further, in practical implementation, in the display panel provided in the embodiment of the present invention, the material of the elastic particles is a material having a young's modulus of elasticity of less than 7.84 Mpa. Young's modulus is a physical quantity that characterizes the tensile or compressive strength of a material within its elastic limits, and is the modulus of elasticity in the machine direction, which is also a term in material mechanics. In 1807, the results obtained by England physician and physicist Tomas Populus (Thomas Young, 1773-. According to hooke's law, the stress is proportional to the strain within the elastic limits of an object, and the ratio is called the young's modulus of a material, which is a physical quantity characterizing the properties of the material and depends only on the physical properties of the material itself. The magnitude of the Young's modulus indicates the rigidity of the material, and the larger the Young's modulus, the less likely it will deform. The elastic particles are made of materials with Young's modulus of elasticity smaller than 7.84Mpa, and the materials with the numerical value are easy to deform, so when stress exists due to uneven cooling in the cooling process after the packaging adhesive layer is sintered, the stress can extrude the elastic particles, the elastic particles are extruded and can deform, and partial stress can be absorbed and converted into elastic potential energy in the deformation process, so that the purpose of reducing the residual stress in the packaging adhesive layer is achieved, and the packaging strength is improved.
Specifically, the package cover plate and the display substrate are sealed together after being sintered at a high temperature through a package material, the high-temperature sintering process can reach 500 ℃, the elastic particles provided by the embodiment of the invention can not be completely melted at the temperature of 500 ℃, the elastic particles can slightly deform, but the overall shape is not influenced, after the sintering is finished, the elastic particles are left in the package adhesive layer, and when residual stress exists in the package adhesive layer, the elastic particles are extruded and deformed, so that the stress is converted into elastic potential energy in the elastic particles, the purpose of absorbing the residual stress is achieved, and the package strength of a package area is increased. The conversion relationship of the external stress to the internal potential energy of the elastic particles can be expressed by the following green formula:
wherein sigmaijWhich represents the stress in each direction to which the elastic particles are subjected,
indicating the deformation in each direction after being subjected to stress,
representing the elastic potential energy per unit volume stored in the elastic particles due to deformation.
Further, in practical implementation, in the display panel provided in the embodiment of the present invention, the material of the elastic particles may include a metal rubber material. The material has certain elasticity and can resist high temperature generated in laser sintering.
Further, in order to ensure that the residual stress can be completely absorbed by the elastic particles in the implementation, in the display panel provided in the embodiment of the present invention, a ratio of the mass of the elastic particles to the total mass of the encapsulating adhesive layer is less than or equal to 30%.
Further, in practical implementation, since the temperature of laser irradiation in the laser sintering process is not lower than 500 ℃, in the display panel provided in the embodiment of the present invention, the high temperature range of the elastic particles resistant to high temperature is greater than or equal to 500 ℃.
Further, in practical implementation, since the temperature of laser irradiation in the laser sintering process is generally in the range of 500 ℃ to 600 ℃, in the display panel provided in the embodiment of the present invention, the high temperature range in which the elastic particles can withstand high temperature is: 500-600 ℃.
Further, in practical implementation, in the display panel provided in the embodiment of the present invention, the shape of the elastic particles is smooth and has no corner. This is because the sharp corner may generate a large stress to the outside when being pressed, which may affect the strength of the encapsulant layer.
Further, in an implementation manner, in the display panel provided in the embodiment of the invention, the shape of the elastic particles may include one or a combination of a spherical shape, an elliptical spherical shape, a gourd shape, and a capsule shape. Specifically, as shown in fig. 2, the elastic particles 01 are spherical; as shown in fig. 3, the elastic particles 01 have an elliptical spherical shape; as shown in fig. 4, the elastic particles 01 have a gourd shape; as shown in fig. 5, the elastic particles 01 are in the shape of capsules; as shown in fig. 6, the shape of the elastic particle 01 may include a spherical shape and an elliptical spherical shape; as shown in fig. 7, the shape of the elastic particle 01 may include a spherical shape, a gourd shape, and a capsule shape; the shape of the elastic particles may be any combination of the above shapes, but is not specifically listed here.
Further, in the specific implementation, as shown in fig. 10B, since the encapsulation adhesive layer 4 doped with the elastic particles 01 is formed by a screen printing process, and the encapsulation material doped with the elastic particles 01 permeates through the holes 02 of the screen printing plate 5 onto the display substrate 1, the maximum diameter of the elastic particles 01 is smaller than the hole diameter of the holes 02 of the screen printing plate 5, since the hole diameter of the screen printing plate 5 is generally 5 μm and the height of the encapsulation adhesive layer 4 is generally smaller than 5 μm, if the diameter of the elastic particles 01 is larger than the height of the encapsulation adhesive layer 4, the elastic particles 01 will be pressed and deformed by the display substrate 1 and the encapsulation cover plate 2, which affects the effect of absorbing residual stress and affects the encapsulation reliability, and therefore, in the display panel provided by the embodiment of the present invention, the maximum diameter of the elastic particles 01 is smaller than or equal to 5 μm.
Further, in a specific implementation, in the display panel provided in the embodiment of the present invention, the material of the encapsulating adhesive layer except for the elastic particles is glass cement.
Further, in practical implementation, in the display panel provided in the embodiment of the present invention, the display unit includes a liquid crystal display unit or an organic light emitting display unit.
In the display panel provided by the embodiment of the invention, the display unit may be a liquid crystal display unit or an Organic Light Emitting (OLED) display unit. When the display unit is a liquid crystal display unit, the formed display panel is a liquid crystal display panel, the encapsulation cover plate is a color film substrate at the moment, and the liquid crystal display unit comprises a liquid crystal molecular layer. When the display unit is an OLED display unit, the formed display panel is an OLED display panel, the packaging cover plate is a glass cover plate, and the OLED display unit comprises a cathode, an anode and a light-emitting structure, wherein the cathode and the anode are oppositely arranged, and the light-emitting structure is positioned between the cathode and the anode.
Based on the same inventive concept, an embodiment of the present invention further provides a method for manufacturing a display panel, as shown in fig. 8, including:
s801, forming a display unit in a display area of a display substrate;
s802, forming a packaging adhesive layer on the packaging cover plate in a region corresponding to the packaging region of the display substrate; wherein the packaging adhesive layer comprises high-temperature resistant elastic particles;
and S803, aligning and attaching the packaging cover plate and the display substrate, performing laser sintering on the packaging adhesive layer, and bonding the packaging cover plate and the display substrate together after the packaging adhesive layer is cooled to form the display panel.
According to the preparation method of the display panel provided by the embodiment of the invention, the high-temperature-resistant elastic particles are added in the packaging adhesive layer, and in the process of sintering the packaging adhesive layer by adopting laser, the elastic particles are not completely melted by high temperature generated by laser sintering, the high-temperature-resistant elastic particles can keep a certain shape, when stress exists due to uneven cooling in the cooling process after sintering of the packaging adhesive layer, the stress can extrude the elastic particles, the elastic particles are extruded to deform, and partial stress can be absorbed and converted into elastic potential energy in the deformation process, so that the purpose of reducing the residual stress in the packaging adhesive layer is achieved, and the packaging strength is improved.
Further, in a specific implementation, in the preparation method provided in an embodiment of the present invention, an encapsulation glue layer is formed on an area of the encapsulation cover plate corresponding to the encapsulation area of the display substrate, as shown in fig. 9, which specifically includes:
s901, doping elastic particles in glass cement to form packaging cement;
s902, coating the packaging glue on the packaging cover plate through a screen printing process to form a packaging glue layer.
Further, in a specific implementation, in the preparation method provided in the embodiment of the present invention, the maximum diameter of the elastic particles is smaller than the aperture of the screen printing plate in the screen printing process and smaller than the height of the encapsulation adhesive layer.
The following describes in detail a method for manufacturing the display panel shown in fig. 1 according to the embodiment of the present invention:
(1) forming a display unit 3 in a display area a of the display substrate 1 as shown in fig. 10A;
(2) doping the elastic particles 01 in the glass cement to form packaging cement;
(3) penetrating the packaging glue formed in the step (2) into the packaging cover plate 2 through the holes 02 of the silk-screen printing plate 5 by adopting a silk-screen printing process in the area of the packaging cover plate 2 corresponding to the packaging area B of the display substrate 1 to form a packaging glue layer 4, as shown in FIG. 10B;
(4) aligning and attaching the packaging cover plate 2 formed in the step (3) and the display substrate 1, performing laser sintering on the packaging adhesive layer 4, cooling the packaging adhesive layer 4, and bonding the packaging cover plate 2 and the display substrate 1 together to form a display panel, as shown in fig. 1;
the display panel provided in fig. 1 of the embodiment of the present invention can be prepared through the above steps (1) to (4).
It should be noted that, in the above manufacturing method provided in the embodiment of the present invention, no matter the display unit is a liquid crystal display unit or an organic light emitting display unit, the display panel is only for explaining the film layer of the encapsulation adhesive layer, and of course, the display panel further includes other film layers known to those skilled in the art, which are not described in detail herein.
Based on the same inventive concept, the embodiment of the invention further provides a display device, which comprises the display panel provided by the embodiment of the invention. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device are understood by those skilled in the art, and are not described herein or should not be construed as limiting the invention. The display device can be implemented by referring to the above embodiments of the display panel, and repeated descriptions are omitted.
The embodiment of the invention provides a display panel, a preparation method thereof and a display device, wherein the display panel comprises: the display substrate, the packaging cover plate, the display unit and the packaging adhesive layer are oppositely arranged; the display substrate is provided with a display area and a packaging area surrounding the display area, the packaging adhesive layer is positioned in the packaging area and between the display substrate and the packaging cover plate, and the display unit is positioned in the display area and between the display substrate and the packaging cover plate; the packaging adhesive layer comprises high-temperature-resistant elastic particles, and the high-temperature-resistant elastic particles are used for absorbing residual stress existing in the packaging adhesive layer after laser sintering due to uneven cooling. According to the invention, the high-temperature-resistant elastic particles are added in the packaging adhesive layer, in the process of sintering the packaging adhesive layer by adopting laser, the elastic particles cannot be completely melted by the high temperature generated by laser sintering, the high-temperature-resistant elastic particles can keep a certain shape, when stress exists due to uneven cooling in the cooling process after the packaging adhesive layer is sintered, the stress can extrude the elastic particles, the elastic particles are extruded to deform, and partial stress can be absorbed and converted into elastic potential energy in the deformation process, so that the purpose of reducing the residual stress in the packaging adhesive layer is achieved, and the packaging strength is improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (12)
1. A display panel, comprising: the display substrate, the packaging cover plate, the display unit and the packaging adhesive layer are oppositely arranged; the display substrate is provided with a display area and a packaging area surrounding the display area, the packaging adhesive layer is positioned in the packaging area and between the display substrate and the packaging cover plate, and the display unit is positioned in the display area and between the display substrate and the packaging cover plate; wherein the content of the first and second substances,
the packaging adhesive layer comprises high-temperature-resistant elastic particles, and the high-temperature-resistant range is greater than or equal to 500 ℃; the high-temperature-resistant elastic particles are used for absorbing residual stress existing in the packaging adhesive layer after laser sintering due to uneven cooling;
the material of the elastic particles comprises a metal rubber material.
2. The display panel of claim 1, wherein a ratio of a mass of the elastic particles to a total mass of the encapsulating adhesive layer is less than or equal to 30%.
3. The display panel of claim 1, wherein the elastic particles are resistant to high temperatures in the range of: 500-600 ℃.
4. The display panel according to claim 1, wherein the elastic particles have a smooth and corner-free shape.
5. The display panel of claim 4, wherein the shape of the elastic particles comprises one or a combination of a spherical shape, an elliptical spherical shape, a gourd shape, and a capsule shape.
6. The display panel according to claim 1, wherein the elastic particles have a maximum diameter of 5 μm or less.
7. The display panel according to claim 1, wherein a material of the encapsulating adhesive layer other than the elastic particles is glass adhesive.
8. The display panel according to claim 1, wherein the display unit comprises a liquid crystal display unit or an organic light emitting display unit.
9. A display device characterized by comprising the display panel according to any one of claims 1 to 8.
10. A method for manufacturing a display panel according to any one of claims 1 to 8, comprising:
forming a display unit in a display area of a display substrate;
forming a packaging adhesive layer on the packaging cover plate in an area corresponding to the packaging area of the display substrate; the packaging adhesive layer comprises high-temperature-resistant elastic particles, and the high-temperature-resistant range is greater than or equal to 500 ℃; the material of the elastic particles comprises a metal rubber material;
and aligning and attaching the packaging cover plate and the display substrate, carrying out laser sintering on the packaging adhesive layer, and bonding the packaging cover plate and the display substrate together after the packaging adhesive layer is cooled to form the display panel.
11. The method according to claim 10, wherein forming a package adhesive layer on the package cover plate in a region corresponding to the package region of the display substrate specifically comprises:
doping the elastic particles in glass cement to form packaging cement;
and coating the packaging glue on the packaging cover plate through a screen printing process to form the packaging glue layer.
12. The method of claim 11, wherein a maximum diameter of the elastic particles is smaller than a screen aperture of the screen printing process and smaller than a height of the encapsulating adhesive layer.
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| CN110911578A (en) * | 2019-11-07 | 2020-03-24 | 深圳市华星光电半导体显示技术有限公司 | Display panel |
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| WO2006057360A1 (en) * | 2004-11-25 | 2006-06-01 | Nec Corporation | Semiconductor device and production method therefor, wiring board and production method therefor, semiconductor package and electronic apparatus |
| JP2009096851A (en) * | 2007-10-15 | 2009-05-07 | Three M Innovative Properties Co | Nonconductive adhesive composition, nonconductive adhesive film, and methods for production and use thereof |
| JP4877380B2 (en) * | 2009-11-09 | 2012-02-15 | Ｎｏｋ株式会社 | Rubber metal laminate |
| KR20130023435A (en) * | 2011-08-29 | 2013-03-08 | 주식회사 세아 이앤티 | Sealing structure of dye-sensitized solar cell using the elastic ball |
| CN103788880B (en) * | 2014-01-27 | 2015-08-19 | 北京京东方光电科技有限公司 | A kind of sealant composition and preparation method thereof |
| CN104749828B (en) * | 2015-04-22 | 2017-12-29 | 京东方科技集团股份有限公司 | sealant composition, display panel and display device |
| CN105602459B (en) * | 2016-01-05 | 2018-09-11 | 京东方科技集团股份有限公司 | A kind of sealant, display panel and display device |
| CN107331792B (en) * | 2017-07-24 | 2018-11-09 | 深圳市华星光电技术有限公司 | OLED encapsulation method and OLED encapsulating structures |
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