CN109827997A - A kind of moisture sensor - Google Patents
A kind of moisture sensor Download PDFInfo
- Publication number
- CN109827997A CN109827997A CN201910111490.5A CN201910111490A CN109827997A CN 109827997 A CN109827997 A CN 109827997A CN 201910111490 A CN201910111490 A CN 201910111490A CN 109827997 A CN109827997 A CN 109827997A
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- Prior art keywords
- circuit board
- probe
- moisture sensor
- injection molding
- internal model
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- 239000000523 sample Substances 0.000 claims abstract description 44
- 238000001746 injection moulding Methods 0.000 claims abstract description 23
- 238000004891 communication Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000005259 measurement Methods 0.000 claims description 4
- 239000002689 soil Substances 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 11
- 229920000647 polyepoxide Polymers 0.000 abstract description 11
- 239000004568 cement Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Testing Or Calibration Of Command Recording Devices (AREA)
Abstract
The invention discloses a kind of moisture sensors, including shell, communication cable, circuit board, probe, probe sealed support and injection molding internal model, the probe and the probe sealed support are assembled to the circuit board after forming entirety, while the communications cable is connected to the circuit board built-up circuit board group part；The circuit board is formed by the way of low-temp low-pressure injection molding, by the way that the injection molding internal model is encased circuit board and part probe support while reserving the communications cable, so that circuit board is in closed state and has waterproof performance；The shell wraps the injection molding internal model.The present invention substitutes epoxy resin encapsulated technique in such a way that low-temp low-pressure is molded internal model, and epoxy resin spot is avoided to remain.Increase probe sealed support simultaneously, its satiable accurate structure size can greatly improve the precision of sensor while applying the waterproof performance of Shooting Technique.
Description
Technical field
The present invention relates to a kind of moisture sensors.
Background technique
Soil/substrate water content sensor includes shell, communication cable, circuit board, probe, epoxy resin filler material.Mesh
Preceding technique, shell A and B are bonded into cup-shaped shell, probe, the communications cable, circuit board composition by ultrasonic bonding or glue
Circuit board assemblies；Circuit board assemblies inject cup-shaped shell, and cable sheath diameter is with cup-shaped shell cabling in the raised floor hole location size close-fitting；
Cup-shaped shell opening injection epoxy resin is potted from probe.Cup-shaped shell bottom outlet hole and cable dimensions close-fitting can
Operability is poor, is easy to damage cable.Epoxy resin is potted, and curing time is long, is unfavorable for producing in batches, glue flow behavior
Cause excessive glue, probe and case surface stain dirty.The exposed serious finished appearance of epoxy resin.Epoxy resin is potted, and surface is recessed
Convex injustice influences measurement accuracy so that the protruded length of probe is different.
Summary of the invention
In order to solve the above-mentioned technical problem, the purpose of the present invention is to provide a kind of moisture sensors.
The present invention is achieved through the following technical solutions:
In a kind of moisture sensor, including shell, communication cable, circuit board, probe, probe sealed support and injection molding
Mould, which is characterized in that the probe and the probe sealed support are assembled to the circuit board, while communication line after forming entirety
Cable is connected to the circuit board built-up circuit board group part；The circuit board using low-temp low-pressure injection molding by the way of form, pass through by
The injection molding internal model encases circuit board and part probe support while reserving the communications cable so that circuit board be in closed state and
With waterproof performance；The shell wraps the injection molding internal model.
Preferably, the shell includes upper housing and lower case, and the upper housing and lower case fit in the injection molding
It is fixed after mould using ultrasonic wave fusion or glue bonding or machine screws mode.
Preferably, the probe and the probe sealed support be formed by the conventional Shooting Technique of high temperature and pressure it is whole
Body.
Preferably, the communications cable is to be connected to the circuit board by welding.
Preferably, the probe and the probe sealed support form whole with using filature between the circuit board
The fixed mode of tool is attached.
Preferably, the moisture sensor is the moisture content for measuring soil or matrix.
Preferably, the probe is for detecting the moisture content of measurement object and obtaining detectable signal.
Preferably, the signal that the circuit board is used to measure the probe carries out signal processing.
Preferably, the signal that the communication cable is used to handle the circuit board transmits.
Preferably, the moisture sensor has waterproof performance.
Epoxy resin is substituted in such a way that low-temp low-pressure is molded internal model the invention has the following beneficial effects: the present invention to fill
Envelope technique improves production efficiency, while epoxy resin spot being avoided to remain.Increase probe sealed support simultaneously, in high temperature and pressure
The plastic cement of injection molding is again with the plastic cement sealing of low-temp low-pressure injection molding, its is satiable while applying the waterproof performance of Shooting Technique
Accurate structure size can greatly improve the precision of sensor.
Detailed description of the invention
It, below will be to required in embodiment or description of the prior art in order to illustrate more clearly of technical solution of the present invention
The attached drawing used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, right
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
Its attached drawing.
Fig. 1 is decomposition diagram of the invention.
Fig. 2 is the schematic diagram after circuit board of the invention is molded.
Fig. 3 is schematic diagram of the invention.
In figure: 1, probe；2, probe support；3, circuit board；4, communication cable；5, it is molded internal model；6, lower case；7, upper casing
Body；8, the circuit board after injection molding；9, moisture sensor.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, carries out to the technical solution in inventive embodiments clear, complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on this
The embodiment of invention, those of ordinary skill in the art's every other reality obtained without making creative work
Example is applied, shall fall within the protection scope of the present invention.
Reference book attached drawing 1-3, a kind of moisture sensor, including shell, communication cable 4, circuit board 3, probe 1,
Probe sealed support 2 and injection molding internal model 5, the probe 1 and the probe sealed support 2 form the conventional note by high temperature and pressure
After modeling technique forms entirety, it is assembled to the circuit board 3 in such a way that screw machine is fixed, while the communications cable 4 passes through weldering
The mode connect is connected to the 3 built-up circuit board group part of circuit board；The circuit board 3 using low-temp low-pressure injection molding by the way of at
Type is formed by the way that the injection molding internal model 5 is encased circuit board 3 and part probe support 2 while reserving the communications cable 4 by note
Circuit board 8 after modeling, so that circuit board 3 is in closed state and has waterproof performance；The shell includes lower case 6 and upper casing
Body 7, the upper housing 7 and lower case 6 fit to after the injection molding internal model using ultrasonic wave fusion or glue bonding or machine
Tool screw fashion is fixed；The shell wraps the injection molding internal model, forms the moisture sensor 9.
The moisture sensor 9 is the moisture content for measuring soil or matrix, and the probe is used for measurement object
Moisture content detected and obtain detectable signal；The signal that the circuit board is used to measure the probe carries out at signal
Reason；The signal that the communication cable is used to handle the circuit board transmits；The moisture sensor has waterproof
Performance.
The present invention substitutes epoxy resin encapsulated technique in such a way that low-temp low-pressure is molded internal model, improves production efficiency, together
When avoid epoxy resin spot remain.Increase probe sealed support simultaneously, in the plastic cement that high temperature and pressure is molded again with low-temp low-pressure
The plastic cement of injection molding seals, its satiable accurate structure size can be significantly while applying the waterproof performance of Shooting Technique
Improve the precision of sensor.
The preferred embodiment of the present invention has shown and described in above description, as previously described, it should be understood that the present invention is not office
Be limited to form disclosed herein, should not be regarded as an exclusion of other examples, and can be used for various other combinations, modification and
Environment, and can be changed within that scope of the inventive concept describe herein by the above teachings or related fields of technology or knowledge
It is dynamic.And changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, then it all should be appended by the present invention
In scope of protection of the claims.
Claims (10)
1. a kind of moisture sensor, including shell, communication cable, circuit board, probe, probe sealed support and injection molding internal model,
It is characterized in that, the probe and the probe sealed support are assembled to the circuit board, while the communications cable after forming entirety
It is connected to the circuit board built-up circuit board group part；The circuit board is formed by the way of low-temp low-pressure injection molding, by by institute
It states injection molding internal model to encase circuit board and part probe support while reserving the communications cable, so that circuit board is in closed state and tool
There is waterproof performance；The shell wraps the injection molding internal model.
2. moisture sensor according to claim 1, which is characterized in that the shell includes upper housing and lower case,
The upper housing and lower case fit to after the injection molding internal model using ultrasonic wave fusion or glue bonding or machine screws
Mode is fixed.
3. moisture sensor according to claim 1, which is characterized in that the probe is with the probe sealed support
Entirety is formed by the conventional Shooting Technique of high temperature and pressure.
4. moisture sensor according to claim 1, which is characterized in that the communications cable is by welding
It is connected to the circuit board.
5. moisture sensor according to claim 1, which is characterized in that the probe and the probe sealed support shape
It is integral with being attached in such a way that screw machine is fixed between the circuit board.
6. moisture sensor described in one of -5 according to claim 1, which is characterized in that the moisture sensor is to be used for
Measure the moisture content of soil or matrix.
7. moisture sensor described in one of -5 according to claim 1, which is characterized in that the probe is used for measurement object
Moisture content detected and obtain detectable signal.
8. moisture sensor according to claim 7, which is characterized in that the circuit board is for measuring the probe
Signal carry out signal processing.
9. moisture sensor according to claim 8, which is characterized in that the communication cable is used for the circuit board
The signal handled is transmitted.
10. moisture sensor described in one of -5 according to claim 1, which is characterized in that the moisture sensor has
Waterproof performance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910111490.5A CN109827997A (en) | 2019-02-12 | 2019-02-12 | A kind of moisture sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910111490.5A CN109827997A (en) | 2019-02-12 | 2019-02-12 | A kind of moisture sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109827997A true CN109827997A (en) | 2019-05-31 |
Family
ID=66863540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910111490.5A Pending CN109827997A (en) | 2019-02-12 | 2019-02-12 | A kind of moisture sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109827997A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115087282A (en) * | 2021-03-16 | 2022-09-20 | 武汉智行者科技有限公司 | PCBA sealing process of electronic product |
| CN116100742A (en) * | 2023-04-11 | 2023-05-12 | 天津德科智控股份有限公司 | Packaging technology of PCB and EPS torque sensor based on PCB |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2422643Y (en) * | 2000-05-25 | 2001-03-07 | 中国农业大学 | Soil moisture measuring sensor |
| KR200397748Y1 (en) * | 2005-07-27 | 2005-10-06 | 한국하니웰 주식회사 | Magnetic sensor |
| CN201225993Y (en) * | 2008-06-03 | 2009-04-22 | 华南农业大学 | Soil moisture sensor |
| CN201247106Y (en) * | 2008-07-01 | 2009-05-27 | 敬岩松 | Temperature sensor |
| CN102393260A (en) * | 2011-11-10 | 2012-03-28 | 青岛旭瑞电子有限公司 | Integrated injection molding temperature sensor and manufacturing method thereof |
| CN102435645A (en) * | 2011-12-28 | 2012-05-02 | 江苏大学 | Measuring method for moisture content and conductivity of soilless culture substrate and sensor thereof |
| CN202330335U (en) * | 2011-11-25 | 2012-07-11 | 无锡信大气象传感网科技有限公司 | Soil humidity sensor |
| CN104111276A (en) * | 2014-08-12 | 2014-10-22 | 成都诚欣然科技有限公司 | Apparatus and method for detecting moisture content of soil by use of double-frequency method |
| CN104316094A (en) * | 2014-10-14 | 2015-01-28 | 联合汽车电子有限公司 | Rubber sealing type sensor and manufacturing process thereof |
| CN106768360A (en) * | 2016-12-19 | 2017-05-31 | 上海安誉智能科技有限公司 | The dirty explosion-proof flame detector of one kind inspection |
| CN206878212U (en) * | 2017-04-01 | 2018-01-12 | 东莞讯滔电子有限公司 | Plug connector |
| CN107706616A (en) * | 2016-08-08 | 2018-02-16 | 东莞莫仕连接器有限公司 | Micro coaxial cable connector assembly |
| CN108123285A (en) * | 2018-01-29 | 2018-06-05 | 上海哲宏机器人自动化有限公司 | A kind of water proof type encoder for servo motor cable connector |
| CN210442290U (en) * | 2019-02-12 | 2020-05-01 | 拓霸(厦门)电子有限公司 | Water content sensor |
-
2019
- 2019-02-12 CN CN201910111490.5A patent/CN109827997A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2422643Y (en) * | 2000-05-25 | 2001-03-07 | 中国农业大学 | Soil moisture measuring sensor |
| KR200397748Y1 (en) * | 2005-07-27 | 2005-10-06 | 한국하니웰 주식회사 | Magnetic sensor |
| CN201225993Y (en) * | 2008-06-03 | 2009-04-22 | 华南农业大学 | Soil moisture sensor |
| CN201247106Y (en) * | 2008-07-01 | 2009-05-27 | 敬岩松 | Temperature sensor |
| CN102393260A (en) * | 2011-11-10 | 2012-03-28 | 青岛旭瑞电子有限公司 | Integrated injection molding temperature sensor and manufacturing method thereof |
| CN202330335U (en) * | 2011-11-25 | 2012-07-11 | 无锡信大气象传感网科技有限公司 | Soil humidity sensor |
| CN102435645A (en) * | 2011-12-28 | 2012-05-02 | 江苏大学 | Measuring method for moisture content and conductivity of soilless culture substrate and sensor thereof |
| CN104111276A (en) * | 2014-08-12 | 2014-10-22 | 成都诚欣然科技有限公司 | Apparatus and method for detecting moisture content of soil by use of double-frequency method |
| CN104316094A (en) * | 2014-10-14 | 2015-01-28 | 联合汽车电子有限公司 | Rubber sealing type sensor and manufacturing process thereof |
| CN107706616A (en) * | 2016-08-08 | 2018-02-16 | 东莞莫仕连接器有限公司 | Micro coaxial cable connector assembly |
| CN106768360A (en) * | 2016-12-19 | 2017-05-31 | 上海安誉智能科技有限公司 | The dirty explosion-proof flame detector of one kind inspection |
| CN206878212U (en) * | 2017-04-01 | 2018-01-12 | 东莞讯滔电子有限公司 | Plug connector |
| CN108123285A (en) * | 2018-01-29 | 2018-06-05 | 上海哲宏机器人自动化有限公司 | A kind of water proof type encoder for servo motor cable connector |
| CN210442290U (en) * | 2019-02-12 | 2020-05-01 | 拓霸(厦门)电子有限公司 | Water content sensor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115087282A (en) * | 2021-03-16 | 2022-09-20 | 武汉智行者科技有限公司 | PCBA sealing process of electronic product |
| CN116100742A (en) * | 2023-04-11 | 2023-05-12 | 天津德科智控股份有限公司 | Packaging technology of PCB and EPS torque sensor based on PCB |
| CN116100742B (en) * | 2023-04-11 | 2023-07-07 | 天津德科智控股份有限公司 | Packaging technology of PCB and EPS torque sensor based on PCB |
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