CN109822480A - Microns vacuum sucker and its preparation process - Google Patents
Microns vacuum sucker and its preparation process Download PDFInfo
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- CN109822480A CN109822480A CN201910222156.7A CN201910222156A CN109822480A CN 109822480 A CN109822480 A CN 109822480A CN 201910222156 A CN201910222156 A CN 201910222156A CN 109822480 A CN109822480 A CN 109822480A
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- sucker
- vacuum
- attraction block
- microns
- groove body
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Abstract
The invention belongs to vacuum chucks to manufacture processing technique field, more particularly to microns vacuum sucker, including sucker ontology and Attraction block, this volume array of sucker opens up multiple groove bodies, Attraction block is mounted in groove body, and in the same plane, this body side surface of sucker opens up multiple channels for the top surface of Attraction block and sucker body top surface, channel opens up multiple vacuum pumping holes, the corresponding connection groove body of vacuum pumping hole in the axial direction；Attraction block and groove body tight fit, Attraction block open up multiple micron openings, and micron openings is connected to vacuum pumping hole.The invention also discloses the preparation processes of above-mentioned microns vacuum sucker.Microns vacuum sucker structure provided by the invention is simple, strong adsorption force, and the maximization for realizing vacuum suction area simplifies processing flow, realizes and adsorbs without sealing.
Description
Technical field
The invention belongs to vacuum chucks to manufacture processing technique field, and in particular to a kind of microns vacuum sucker and its preparation work
Skill.
Background technique
Processing, tooling field in industries such as machinery, electronics, materials, often use vacuum chuck, to realize to workpiece
Clamping, positioning etc. require.Vacuum chuck in the prior art needs sealing strip, in addition, inhaling now with many lattice vacuum
Disk increases adsorption area, but due to still there is adsorption area deficiency, processing channel class part needs other enclosing sealing
Item.
Summary of the invention
The invention aims to solve the above problems, it is simple that the present invention provides structures, easy to maintain, and adsorption capacity is high,
Microns vacuum sucker and its preparation process without sealing strip.
Specific microns vacuum sucker provided by the invention, specific technical solution are as follows:
Microns vacuum sucker, including sucker ontology and Attraction block, described this volume array of sucker open up multiple groove bodies, the suction
Attached piece is mounted in the groove body, the top surface of the Attraction block and the sucker body top surface in the same plane,
Described this body side surface of sucker opens up multiple channels, and the channel opens up multiple vacuum pumping holes in the axial direction,
The vacuum pumping hole is corresponding to be connected to the groove body；
The Attraction block and the groove body tight fit, the Attraction block open up multiple micron openings, and the micron openings is connected to institute
State vacuum pumping hole.
In some embodiments, the micron openings is evenly distributed on the Attraction block, and the micron bore dia is 35-
40 microns.
In some embodiments, the channel array is distributed in the side of the sucker ontology, and the channel diameter is
10-20 millimeters.
In some embodiments, the diameter of the vacuum pumping hole is 0.2-0.8 millimeters.
The present invention also provides the preparation processes of microns vacuum sucker, are used to prepare the work of above-mentioned microns vacuum sucker
Skill includes the following steps:
S1 prepares sucker ontology: blank being carried out tempering destressing processing, then carries out the processing of liquid nitrogen ice-coldization, at acquisition
Part is managed, processing opens up multiple channels in the side of the handling member, multiple groove bodies is opened up in the top surface of the handling member, described
The bottom of groove body opens up vacuum pumping hole, is connected to the channel, obtains sucker ontology；
S2 prepares Attraction block: the metal powder of two kinds of unlike materials of mixing is simultaneously sintered, and obtains metal block, the gold
The size for belonging to block is greater than the size of groove body, and the metal block obtains the Attraction block with micron openings into chemical corrosion method processing is crossed；
S3 assembles Attraction block and sucker ontology: the Attraction block is being impregnated in liquid nitrogen, will impregnate the Attraction block completed
Taking-up is mounted in the groove body, and by warming up treatment, the inner wall of the Attraction block and the groove body is adjacent to completely, generates interference
Cooperation.
S4, process chuck surface: the temperature of Attraction block returns to room temperature, after being sufficiently bonded with the sucker ontology, by beating
Processing micron vacuum chuck surface is ground, makes sucker ontology and Attraction block in the same plane.
In some embodiments, channel described in step S1 is completed the process by depth drill, and array distribution is in the suction
The side of disk ontology, the channel diameter are 10-20 millimeters；
The groove body is completed the process by cnc numerically-controlled machine tool, and the groove body array distribution is on the top surface of the sucker ontology；
The vacuum pumping hole is completed the process by accurate punch, and the diameter of the vacuum pumping hole is 0.2-0.8 millimeters.
In some embodiments, micron openings described in step S2 is evenly distributed on the Attraction block, the micron openings
Diameter is 35-40 microns.
In some embodiments, the time of immersion described in step S3 is 5-10 hours.
The invention has the following advantages: microns vacuum sucker structure provided by the invention is simple, and it is easy to maintain, it compares
Vacuum chuck in the prior art improves 1.67 times of adsorption areas, realizes the maximization of vacuum suction area, is not necessarily to enclosing silicon
Glue foaming sealing strip, simplifies processing flow, realizes and adsorb without sealing；The preparation work of microns vacuum sucker provided by the invention
Skill can directly process through-hole and vacuum suction when part needs to process through-hole and vacuum pumping hole in preparing process
Hole realizes the automatic leakage-blocking sealing in preparation process, time saving and energy saving, does not need additional customized disk；Process it is widely applicable, can
Absorption and processing through-hole and surface itself have hole part.
Detailed description of the invention
Fig. 1 is microns vacuum sucker schematic perspective view of the invention；
Fig. 2 is the schematic perspective view of the sucker ontology of microns vacuum sucker of the invention；
Fig. 3 is the schematic perspective view of the Attraction block of microns vacuum sucker of the invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Attached drawing 1-3, the present invention is described in more detail.
The present invention provides microns vacuum sucker, specific technical solution is as follows:
Microns vacuum sucker, including sucker ontology 1 and Attraction block 2,1 array of sucker ontology open up multiple groove bodies 11, absorption
Block 2 is mounted in groove body 11, and the top surface and 1 top surface of sucker ontology of Attraction block 2 are in the same plane.1 side of sucker ontology opens up
Multiple channels 12, channel 12 open up multiple vacuum pumping holes 13, the corresponding connection groove body 11 of vacuum pumping hole 13 in the axial direction.
Attraction block and 11 tight fit of groove body, Attraction block 2 open up multiple micron openings 21, and micron openings 21 is connected to vacuum pumping hole 13.In this way, most
There are a vacuum pumping hole 13 in the increase vacuum suction area changed greatly, each 2 lower section of Attraction block, and the lower section of vacuum pumping hole 13 is all
There is through-hole 12, for vacuum storage pressure and draining, each Attraction block 2 forms vacuum passage on sucker ontology 1.Further, since slot
11 array distribution of body is on the top surface of sucker ontology 1.In this way, Attraction block 2 is just uniformly mounted on sucker ontology 1, thus micron
The adsorption capacity of vacuum chuck adsorbent parts is evenly distributed.
Preferably, micron openings 21 is evenly distributed on Attraction block 2, and the diameter of micron openings 21 is 35-40 microns.In this implementation
In example, the diameter of micron openings 21 is 37 microns.In this way, since vacuum suction acts on, what the part work in-process being adsorbed generated
Liquid is formed by vacuum adsorption force without the Attraction block 2 under sealing state, is naturally formed water when Attraction block 2 adsorbs cutting fluid and is gushed
Sealing, to realize automatic sealing function.
Preferably, for 12 array distribution of through-hole in the side of sucker ontology 1,12 diameter of through-hole is 10-20 millimeters.The present embodiment
The diameter of middle through-hole 12 is 15 millimeters, and through-hole 12 can be used as negative pressure access port and discharge outlet simultaneously.
Preferably, the diameter of vacuum pumping hole 13 is 0.2-0.8 millimeters.The diameter of the vacuum pumping hole 13 of the present embodiment
0.5 millimeter.Since the diameter of vacuum pumping hole 13 is much smaller than the diameter of through-hole 12, make to take out very in the through-hole 12 of microns vacuum sucker
Sky amount is far longer than the leakage rate of vacuum pumping hole 13.
The present invention also provides the preparation processes of microns vacuum sucker, are used to prepare the work of above-mentioned microns vacuum sucker
Skill includes the following steps:
S1 prepares sucker ontology 1: blank (blank material is 7075T6 aluminium alloy) is subjected to tempering destressing processing, then
The processing of liquid nitrogen ice-coldization is carried out, handling member is obtained.This guarantees that final finished product will not be deformed under normal real-world environment.?
The side processing of handling member opens up multiple channels 12, opens up multiple groove bodies 11 in the top surface of handling member, opens in the bottom of groove body 11
If vacuum pumping hole 13, communicating passage 12 obtains sucker ontology 1.
S2, the metal powder for preparing 2: two kinds of unlike materials of Attraction block are mixed and are sintered, and obtain metal block.This implementation
In example, the size of Attraction block 2 is 15*15*6 millimeter, and the size of metal block is greater than the size of groove body 11, and metal block is into excessively chemical
Etch processing, obtains the Attraction block 2 with micron openings 21.2 opposite side size Control of Attraction block is at 15.02-15.04 millimeters.By
Small in 21 diameter of micron openings, general iron is cut can not be by this one small hole, so also functioning to prevents impurity due to vacuum
Microns vacuum sucker can be entered when effect with negative pressure, accumulation will affect vacuum action later.
S3 assembles Attraction block 2 and sucker ontology 1: Attraction block 2 is being impregnated in liquid nitrogen, in the present embodiment, Attraction block 2
Opposite side can be contracted to 14.8-14.9 millimeters due to the immersion of liquid nitrogen.The taking-up of Attraction block 2 completed will be impregnated and be mounted on groove body 11
In, since temperature slowly returns to room temperature, outer dimension slowly becomes larger Attraction block 2, until Attraction block 2 and the inner wall of groove body 11 are complete
It is adjacent to, generates interference fit.Hereafter microns vacuum sucker in winter or summer regardless of using, since the heat expansion of metal material is cold
Contracting, sucker ontology 1 and Attraction block 2 will be unaffected, and sucker ontology 1 is heated to swell, and Attraction block 2 is also heated and swells, otherwise the same.
S4, process chuck surface: the temperature of Attraction block 2 returns to room temperature, after being sufficiently bonded with sucker ontology 1, by polishing
Processing micron vacuum chuck surface makes sucker ontology 1 and Attraction block 2 in the same plane.
In some embodiments, channel 12 is completed the process by depth drill in step S1, and array distribution is in sucker ontology 1
Side, 12 diameter of channel be 10-20 millimeters；The diameter in channel 12 is 15 millimeters in the present embodiment, and channel 12 can be made simultaneously
It is negative and crimps entrance and discharge outlet.
Groove body 11 is completed the process by cnc numerically-controlled machine tool, and 11 array distribution of groove body is on the top surface of sucker ontology 1；In this way, inhaling
Just it is uniformly mounted on sucker ontology 1 for attached piece 2, so that the adsorption capacity of microns vacuum sucker suction part is evenly distributed.Vacuum is taken out
Stomata 13 is completed the process by accurate punch, and the diameter of vacuum pumping hole 13 is 0.2-0.8 millimeters.The vacuum suction of the present embodiment
0.5 millimeter of the diameter in hole 13.Since the diameter of vacuum pumping hole 13 is much smaller than the diameter in channel 12, make in microns vacuum sucker
12 amount of vacuumizing of channel is far longer than the leakage rate of vacuum pumping hole 13.
In some embodiments, micron openings 21 is evenly distributed on Attraction block 2 in step S2, and 21 diameter of micron openings is
35-40 microns.In the present embodiment, the diameter of micron openings 21 is 37 microns.In this way, being adsorbed since vacuum suction acts on
The liquid that part work in-process generates is poured in channel 12, vacuum pumping hole 13 by vacuum adsorption force, to be formed without sealing state
Under Attraction block 2, naturally form water when Attraction block 2 adsorbs cutting fluid and gush sealing, to realize automatic sealing function.
In some embodiments, the time impregnated in step S3 is 5-10 hours.Specifically, when the immersing in liquid nitrogen of use
Between can be 5 hours, 8 hours, 10 hours.Due to the pole cold-working use by liquid nitrogen, Attraction block 2 is metal material, therefore to the cold
It shrinks.
In conclusion microns vacuum sucker provided by the invention is mainly made of sucker ontology 1 and Attraction block 2, Attraction block 2
It is interference fitted with ontology.When Attraction block 2 is 15*15 millimeters of size, keep uniformly distributed 867 of its surface straight using chemical corrosion method
The micron openings 21 that 0.037 millimeter of diameter, iron when micron openings 21 both prevents adsorbent parts from processing are cut inside sucking vacuum chuck
Channel 12 effectively obstructs cutting fluid further through the vacuum pumping hole 13 of 0.5mm and largely pours in microns vacuum sucker, sucker sheet
The equipment connection that the connection of multiple channels 12 on body 1 generates negative pressure generates negative pressure, vacuum pumping hole 13 and 2 quantity phase of Attraction block
Deng each Attraction block 2 has vacuum passage.When microns vacuum sucker suction part, uniformly produced in the Attraction block 2 of feature bottom
The vacuum suction of part is fixed in raw negative pressure, formation, remaining Attraction block 2 not covered by part is due to 12 amount of vacuumizing of channel
It is far longer than the leakage rate of vacuum pumping hole 13, and the cutting fluid in processing, since vacuum suction acts on, cutting fluid is by vacuum
Adsorption capacity is formed after pouring in Milling Machining through-hole, milling through slot without the Attraction block 2 under sealing state, when Attraction block 2 adsorbs cutting fluid
It naturally forms water and gushes sealing, to realize automatic sealing function, similarly, part diameter enlarging (12), milling in process
When through slot, cutting fluid is poured in when logical since part is processed, and naturally also formation water gushes sealing.
Above-mentioned preferable possible embodiments only of the invention, are not limitations of the present invention, the present invention is also not limited to above-mentioned
Citing, those skilled in the art, within the essential scope of the present invention, made variations, modifications, additions or substitutions,
Also it should belong to protection scope of the present invention.
Claims (8)
1. microns vacuum sucker, which is characterized in that including sucker ontology (1) and Attraction block (2), sucker ontology (1) array
Open up multiple groove bodies (11), the Attraction block (2) is mounted in the groove body (11), the top surface of the Attraction block (2) with it is described
Sucker ontology (1) top surface in the same plane,
Sucker ontology (1) side opens up multiple channels (12), and the channel (12) opens up multiple vacuum in the axial direction
Aspirating hole (13), the vacuum pumping hole (13) is corresponding to be connected to the groove body (11)；
The Attraction block and the groove body (11) tight fit, the Attraction block (2) open up multiple micron openings (21), the micron openings
(21) it is connected to the vacuum pumping hole (13).
2. microns vacuum sucker according to claim 1, which is characterized in that the micron openings (21) is evenly distributed on described
On Attraction block (2), micron openings (21) diameter is 35-40 microns.
3. microns vacuum sucker according to claim 1, which is characterized in that channel (12) array distribution is in the suction
The side of disk ontology (1), channel (12) diameter are 10-20 millimeters.
4. microns vacuum sucker according to claim 1, which is characterized in that the diameter of the vacuum pumping hole (13) is
0.2-0.8 millimeters.
5. the preparation process of microns vacuum sucker, which is characterized in that be used to prepare micro- as described in claim 1-4 any one
The technique of rice vacuum chuck, includes the following steps:
S1 prepares sucker ontology (1): blank being carried out tempering destressing processing, then carries out the processing of liquid nitrogen ice-coldization, is handled
Part, in the side of the handling member, processing opens up multiple channels (12), opens up multiple groove bodies (11) in the top surface of the handling member,
Vacuum pumping hole (13) are opened up in the bottom of the groove body (11), are connected to the channel (12), are obtained sucker ontology (1)；
S2 is prepared Attraction block (2): the metal powder of two kinds of unlike materials of mixing is simultaneously sintered, and obtains metal block, the metal
The size of block is greater than the size of groove body (11), and for the metal block into chemical corrosion method processing is crossed, obtaining has micron openings (21)
Attraction block (2)；
S3 assembles Attraction block (2) and sucker ontology (1): the Attraction block (2) is being impregnated in liquid nitrogen, will impregnate completion
Attraction block (2) taking-up is mounted in the groove body (11), by warming up treatment, the Attraction block (2) and the groove body (11)
Inner wall is adjacent to completely, generates interference fit.
S4, process chuck surface: the temperature of Attraction block (2) returns to room temperature, after being sufficiently bonded with the sucker ontology (1), passes through
Polishing processing micron vacuum chuck surface, makes sucker ontology (1) and Attraction block (2) in the same plane.
6. the preparation process of microns vacuum sucker according to claim 5, which is characterized in that channel described in step S1
(12) it is completed the process by depth drill, and array distribution, in the side of the sucker ontology (1), channel (12) diameter is 10-
20 millimeters；
The groove body (11) is completed the process by cnc numerically-controlled machine tool, and groove body (11) array distribution is in the sucker ontology (1)
On top surface；
The vacuum pumping hole (13) is completed the process by accurate punch, and the diameter of the vacuum pumping hole (13) is 0.2-0.8
Millimeter.
7. the preparation process of microns vacuum sucker according to claim 5, which is characterized in that micron openings described in step S2
(21) it is evenly distributed on the Attraction block (2), micron openings (21) diameter is 35-40 microns.
8. the preparation process of microns vacuum sucker according to claim 5, which is characterized in that immersion described in step S3
Time is 5-10 hours.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910222156.7A CN109822480A (en) | 2019-03-22 | 2019-03-22 | Microns vacuum sucker and its preparation process |
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Family
ID=66870698
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116252111A (en) * | 2023-05-15 | 2023-06-13 | 深圳市玉沣科技有限公司 | Precise machining method of semiconductor wafer sucker |
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| CN1221364A (en) * | 1996-04-09 | 1999-06-30 | 德尔西斯药品公司 | Chucks and methods for positioning multiple objects on a substrate |
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| CN116252111A (en) * | 2023-05-15 | 2023-06-13 | 深圳市玉沣科技有限公司 | Precise machining method of semiconductor wafer sucker |
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