CN109803484B - Detachable connection method for fabric circuit board and electronic component - Google Patents
Detachable connection method for fabric circuit board and electronic component Download PDFInfo
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- CN109803484B CN109803484B CN201910023143.7A CN201910023143A CN109803484B CN 109803484 B CN109803484 B CN 109803484B CN 201910023143 A CN201910023143 A CN 201910023143A CN 109803484 B CN109803484 B CN 109803484B
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Abstract
The invention relates to a detachable connection method of a fabric circuit board and an electronic component, wherein the fabric circuit board is connected with pins of the electronic component through a conductive channel, the conductive channel is in a spiral structure, one end of the conductive channel is electrically connected with the fabric circuit board, and the other end of the conductive channel is spirally wound on the pins of the electronic component to form a connection part; when the conductive channel is stretched, the conductive channel of the spiral structure winds the pins of the electronic components tightly. The invention ensures that the whole fabric circuit can still keep better mechanical property and conductive stability under tensile deformation.
Description
Technical Field
The invention relates to a flexible connection technology in the technical field of wearability, in particular to a detachable connection method of a fabric circuit board and an electronic component.
Background
The implementation of reliable interconnection between conductive paths and electronic components in a fabric circuit is a crucial step in the discovery process of wearable textiles from the research stage to the wide application, because the stability of the connection can affect the accuracy of signal transmission of the whole circuit.
Conventional interconnection techniques include resistance soldering, use of an interposer as an electronic component carrier, button-type connection, or connection using a conductive adhesive such as silver filled epoxy, silicone, SWCNT conductive rubber, etc. The effective interconnection of the connecting positions is realized by using a resistance welding mode, and a micro cutter is used for cutting a conductive wire or a laser ablation technology, so that the disconnection and isolation of a circuit are realized. In the circuit board prepared by using the welding method, because the distribution of the welding flux at the cross points is not easy to control, the bending rigidity is influenced to a certain extent, and the mechanical property of the conductive fabric is damaged to a certain extent by a high-temperature treatment mode, so that the reliability of the connection points of the circuit and the electronic components is lower. And embedding a hard inserter into the woven conductive fabric, and then performing wire arrangement by using the through holes of the inserter to complete the integration of the electronic components. However, the connection method is the same as resistance welding, the prepared connection part has no flexibility and stretchability, and the reliability of the connection point of the circuit and the electronic component under large strain is poor, so that the contact resistance is increased, and the conductivity is unstable. A button type connecting method is used for interconnection between transmission lines in a textile circuit, but the connecting method does not relate to interconnection between an electronic element and the transmission lines, and has certain application limitation at present. The joint prepared by the conductive adhesive has certain flexibility but can not be stretched; the connection mode can increase the strength of the substrate around the connection position of the element, thereby protecting the connection position from being damaged in the stretching deformation process, but the quantity of the adhesive is not easy to control, causing the bending rigidity of the connection position of the fabric circuit to be larger, and weakening the integral stretching performance.
Disclosure of Invention
The invention aims to provide a detachable connection method of a fabric circuit board and an electronic component, which can ensure that the whole fabric circuit can still keep better mechanical property and conductive stability under tensile deformation.
The technical scheme adopted by the invention for solving the technical problems is as follows: the method comprises the steps of connecting a fabric circuit board with pins of electronic components through conductive channels, wherein the conductive channels are of spiral structures, one ends of the conductive channels are electrically connected with the fabric circuit board, and the other ends of the conductive channels are spirally wound on the pins of the electronic components to form connecting parts; when the conductive channel is stretched, the conductive channel of the spiral structure winds the pins of the electronic components tightly.
The Young modulus of the fabric circuit board is not greater than that of human skin.
And packaging the connecting part, wherein elastic silicon rubber is used as a packaging layer during packaging.
When the elastic silicon rubber is used for packaging treatment, the elastic silicon rubber is prepared into a silica gel column shape to be wrapped outside the connecting part, and pins of the electronic component can be drawn out and inserted from the elastic silicon rubber column wrapping the connecting part to realize detachable connection.
The conductive channel is made of silver coating conductive yarn.
Advantageous effects
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects: the invention realizes the flexible connection between the conductive channel in the fabric circuit board and the electronic component, has stable connection position, hardly influences the integral mechanical property and electrical stability, and can be disassembled, thereby realizing the preparation of a complex wearable electronic equipment system.
Drawings
FIG. 1 is a schematic diagram of the connection of a fabric circuit board to electronic components in accordance with the present invention;
fig. 2 is a schematic view of the conductive path of the present invention.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.
The embodiment of the invention relates to a detachable connection method of a fabric circuit board and an electronic component, as shown in fig. 1 and fig. 2, a fabric circuit board 1 is connected with a pin 2 of the electronic component through a conductive channel 4, wherein the conductive channel 4 is in a spiral structure, one end of the conductive channel is electrically connected with the fabric circuit board 1, and the other end of the conductive channel is spirally wound on the pin 2 of the electronic component to form a connection part 3; when the conductive channel 4 is stretched, the conductive channel 4 with the spiral structure winds the pin 2 of the electronic component tightly.
Due to the adoption of the spiral conductive channel, the connected fabric circuit system can be stretched by more than 30 percent based on the spiral telescopic characteristic, and the performance can be still kept stable at about 30 percent, so that the fabric circuit system conforms to the stretching property of human skin, and the connection mode has flexibility, stretchability and mechanical durability. The electrical resistance of the connection portion is negligible compared to the electrical resistance of the electronic component itself. The young's modulus of the fabric circuit board in this embodiment should not be greater than the young's modulus of human skin, and is not affected by the interconnection between the electronic component and the conductive channel.
In order to ensure the mechanical strength of the connection portion, the connection portion is also subjected to an encapsulation process to reduce the influence of the stress concentration of the connection portion on the mechanical performance of the entire device system. In the encapsulation process, an elastic silicone rubber (PDMS) having flexibility and a young's modulus similar to that of a fabric is used as an encapsulation layer. It has the characteristics of biocompatibility, softness, high stretchability (> 200%) and insulation, is usually applied to the preparation of elastic substrates or artificial skin, and is suitable for development and application in the wearable field. When PDMS is used for packaging, the elastic silicon rubber is prepared into a shape of a silica gel column to be wrapped outside the connecting part, so that the pin of the rigid electronic element can be pulled out of the elastic silicon rubber column wrapping the connecting part and then inserted into the elastic silicon rubber column to be repeatedly and detachably used. The elastic silicone rubber used in this embodiment may be Dow Corning 184 silicone rubber (the ratio of the base component A and the curing agent B is 10: 1).
The invention is further illustrated below by means of four specific examples.
Example 1:
the connection process of the fabric circuit board and the hard resistor comprises the following steps:
the conductive fabric with a specific structure is woven and manufactured in an advanced rapier loom according to a designed circuit pattern by taking one upper twill, three lower twills and a right twill as basic tissues of a fabric circuit board, taking 100X 4D silver coating nylon yarns and 140D/70D/70D spandex coated yarns as warp yarns and cotton yarns as weft yarns.
The silver conductive yarn in the fabric circuit board is tightly wound on a pin of a hard resistor for 10 circles, the winding height is 5cm, then a customized die is utilized, a Dow Corning glass silica gel is uniformly coated around the pin wound with the silver wire in an injection mode, and then the Dow Corning glass silica gel is cured at normal temperature to form a cylindrical silica gel column with the diameter of 3 mm.
The detachable process of the fabric circuit board and the hard resistor comprises the following steps:
the joint is detachable for cleaning. The resistance pins are pulled out from the silica gel column to form holes similar to bread boards, so that the electronic components can be conveniently inserted for use again, the tight connection is kept, and the contact is stable. The silicone rubber imparts flexibility as well as stretchability to the joint.
Example 2:
the copper fiber is used as a raw material, and a fine flat knitting machine technology is adopted to complete the weaving of the flexible fabric circuit board. And then, the pins of the LED lamps are tightly connected with the conductive copper fibers in the fabric circuit board in a spiral connection mode, and glass silica gel is injected into the pins to form a detachable reliable connection part.
Example 3:
silver/nylon fiber is used as a yarn raw material, and is integrated into an elastic fabric through a weaving method, so that the stretchable conductive fabric is woven and used as a fabric circuit board. A group of LED lamps are arranged in a matrix mode, a plurality of conductive yarns on the fabric circuit board are respectively and tightly wound on each LED lamp pin, and then PDMS is uniformly injected around the conductive yarns to form a detachable matrix row arrangement connection part, so that the LED matrix can be lightened.
Example 4:
utilize carbon coating fibre and spandex cladding yarn to mix and weave out the electrically conductive knitted fabric that has high electric conductivity, with the rotatory array of LED lamp on the specific position of fabric, then make on the fabric electrically conductive yarn screwed connection who corresponds on the LED lamp base pin, closely arrange, utilize good elasticity and the flexible effect of glass silica gel afterwards, wrap the base pin of twining electrically conductive yarn, place 5 hours back at normal atmospheric temperature, form stable connection, it can to extract the base pin when washing or trading electronic components.
Claims (5)
1. A detachable connection method of a fabric circuit board and an electronic component is characterized in that the fabric circuit board is connected with pins of the electronic component through a conductive channel, wherein the conductive channel is in a spiral structure, one end of the conductive channel is electrically connected with the fabric circuit board, and the other end of the conductive channel is spirally wound on the pins of the electronic component to form a connection part; when the conductive channel is stretched, the conductive channel of the spiral structure winds the pins of the electronic components tightly.
2. The method for detachably connecting a fabric circuit board and an electronic component as claimed in claim 1, wherein the young's modulus of the fabric circuit board is not greater than the young's modulus of human skin.
3. The method for detachably connecting the fabric circuit board and the electronic component as claimed in claim 1, wherein the connecting portion is externally encapsulated, and an elastic silicone rubber is used as an encapsulating layer during the encapsulating process.
4. The method for detachably connecting the fabric circuit board and the electronic component as claimed in claim 3, wherein when the elastic silicone rubber is used for packaging treatment, the elastic silicone rubber is prepared into a shape of a silica gel column to wrap the connecting part, and pins of the electronic component can be drawn out and inserted from the elastic silicone rubber column wrapping the connecting part to realize detachable connection.
5. The method of claim 1, wherein the conductive channels are made of silver coated conductive yarn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910023143.7A CN109803484B (en) | 2019-01-10 | 2019-01-10 | Detachable connection method for fabric circuit board and electronic component |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910023143.7A CN109803484B (en) | 2019-01-10 | 2019-01-10 | Detachable connection method for fabric circuit board and electronic component |
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| CN109803484A CN109803484A (en) | 2019-05-24 |
| CN109803484B true CN109803484B (en) | 2021-07-02 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1781216A (en) * | 2003-03-24 | 2006-05-31 | 李泽豫 | Electrical contact |
| WO2007114790A1 (en) * | 2006-03-31 | 2007-10-11 | Agency For Science, Technology And Research | Method of fabricating an interconnection for electrically connecting an electrical component to a substrate |
| CH697245B1 (en) * | 2005-06-15 | 2008-07-31 | Textilma Ag | Textile PCB. |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100326723B1 (en) * | 1996-04-12 | 2002-04-17 | 마에다 츠구요시 | Conductive Contact Unit System |
| DE10333583A1 (en) * | 2003-02-18 | 2004-09-30 | Textilforschungsinstitut Thüringen-Vogtland e.V. (TITV e.V.) | Textile surface structure of an array of a plurality of conductive or conductive properties having threads and methods for their preparation |
| KR102061127B1 (en) * | 2015-01-27 | 2020-01-02 | 한국전자통신연구원 | Electrically conductive stretchable interconnect using twisted nature of yarn fibers and method of manufacturing thereof |
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2019
- 2019-01-10 CN CN201910023143.7A patent/CN109803484B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1781216A (en) * | 2003-03-24 | 2006-05-31 | 李泽豫 | Electrical contact |
| CH697245B1 (en) * | 2005-06-15 | 2008-07-31 | Textilma Ag | Textile PCB. |
| WO2007114790A1 (en) * | 2006-03-31 | 2007-10-11 | Agency For Science, Technology And Research | Method of fabricating an interconnection for electrically connecting an electrical component to a substrate |
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| CN109803484A (en) | 2019-05-24 |
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