CN109799636A - Flexible substrate substrate and preparation method thereof, display panel and display device - Google Patents
Flexible substrate substrate and preparation method thereof, display panel and display device Download PDFInfo
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- CN109799636A CN109799636A CN201910046924.8A CN201910046924A CN109799636A CN 109799636 A CN109799636 A CN 109799636A CN 201910046924 A CN201910046924 A CN 201910046924A CN 109799636 A CN109799636 A CN 109799636A
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Abstract
This application discloses a kind of flexible substrate substrate and preparation method thereof, display panel and display devices, the flexible substrate substrate includes two organic mold layer, and it is set to the inorganic film between two organic mold layer, wherein, two surfaces contacted between the inorganic film and at least any organic film are complementary patterned surface；And/or the inorganic film includes the different inoranic membrane of stress types of at least two-layer laminate setting.Solves technical problem easily peelable between flexible substrate substrate organic film and inorganic film in the prior art.
Description
Technical field
This application involves technical field of liquid crystal display more particularly to a kind of flexible substrate substrate and preparation method thereof, display
Panel and display device.
Background technique
In existing display device, flexible substrate substrate include two organic mold layer, and be set to two it is described organic
Inorganic film between mold layer, the thickness of general inorganic film is in 1000nm or more.Due to PI (Polyimide, polyimides)
There are material stable chemical resistance, radiation resistance, heat resistance and good dielectric properties to be widely used as flexible substrate
The organic film of substrate, and the rigid materials such as silica, silicon nitride are widely used as inorganic film.
With the development of flexible technology technology, flexible display device is required to be bent, bend, to meet user
The deformation requirement different to flexible display device, still, because there is thicker inorganic film in existing flexible substrate substrate,
When being bent or being bent to flexible display device, on the one hand, due to being caused inorganic film and organic film to be shelled by external force
From, on the other hand, since inorganic film and organic film are removed, the neutral line positional shift in flexible display device, inoranic membrane
Layer is influenced by tow sides stress, and inorganic film is easily cracked, and when discharging stress or external force, inorganic film is split
Line continues to expand, and the risk and steam for causing inorganic film to be broken penetrate between inorganic film and organic film, drop
The low reliability of product, and then influence the quality of product.
Summary of the invention
The application provides a kind of flexible substrate substrate and preparation method thereof, display panel and display device, to solve
Flexible substrate substrate organic film and the easily peelable technical problem of inorganic film in the prior art.
In a first aspect, the application provides a kind of flexible substrate substrate, the flexible substrate substrate includes two organic mold layer,
And it is set to the inorganic film between two organic mold layer, wherein
Two surfaces contacted between the inorganic film and at least any organic film are complementary patterning table
Face；And/or
The inorganic film includes the different inoranic membrane of the stress types of at least two-layer laminate setting.
In embodiment provided by the present application, pass through the inorganic film and at least any organic film in flexible substrate substrate
Two surfaces contacted between layer are that complementary patterned surface and/or the inorganic film are arranged including at least two-layer laminate
The different inoranic membrane of stress types.Therefore, application scheme, not only by the inoranic membrane and at least any organic film it
Between two surfaces contacting be complementary patterned surface, increase the contact area of the organic film and inorganic film, into
And increase the adhesiveness between the organic film and the inorganic film, it can also be different by being arranged in the inorganic film
Stress types increase the adhesiveness between the organic film and the inorganic film.
In a kind of possible embodiment, the patterned surface has a kind of types of patterns or multiple patterns type.
In embodiment provided by the present application, contacted between the inorganic film and at least any organic film two
The patterned surface of a complementation has a kind of types of patterns or multiple patterns type, not only increases the inorganic film or described
Organic film patterned surface it is rich, can also pass through different types of patterns and change the inorganic film and the organic film
The stress types on the surface of layer contact, and then improve the adhesiveness between the inorganic film and the organic film.
In a kind of possible embodiment, the types of patterns includes circular pattern, argyle design or curvilinear patterns.
In a kind of possible embodiment, the patterned surface includes isolated protrusion or groove is constituted pattern or
The pattern that continuous protrusion or groove are constituted.
In a kind of possible embodiment, the different pattern type that the patterned surface has is staggered.
In embodiment provided by the present application, when the patterned surface has a variety of different types of patterns, pass through
Different pattern is staggered, and not only adjusts the stress types of the inorganic film or the organic film, when the inoranic membrane
When layer is broken, the diffusion of the crackle in the inorganic film can be also blocked.
In a kind of possible embodiment, the thickness of the most thin position of the inorganic film is greater than preset threshold.
In a kind of possible embodiment, the inorganic film includes the tensile stress inoranic membrane being stacked and compression
Inoranic membrane.
Second aspect, the application provide a kind of preparation method of flexible substrate substrate, the preparation method, comprising:
The first organic film, inorganic film and the second organic film are sequentially prepared on rigid substrate substrate；
Wherein, when preparing the first organic film, patterned process is carried out to the surface of first organic film；With/
Or, carrying out patterned process to the surface of the inorganic film when preparing inorganic film；And/or preparing inorganic film
When, the different types of inoranic membrane of deposition stress at least twice；
The rigid substrate substrate is removed, flexible substrate substrate is obtained.
The third aspect, the application provide a kind of display panel, and the display panel includes flexible liner described in first aspect
Substrate, and the function element on the flexible substrate substrate.
Fourth aspect, the application provide a kind of display device, and the display device includes display surface described in the third aspect
Plate.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of flexible substrate substrate provided by the embodiment of the present application；
Fig. 2 is a kind of section signal of the organic film and inorganic film of patterned surface provided by the embodiment of the present application
Figure；
Fig. 3 is a kind of section separation of the organic film and inorganic film of patterned surface provided by the embodiment of the present application
Schematic diagram；
Fig. 4 a provides a kind of top view of patterned surface by the embodiment of the present application；
Fig. 4 b is a kind of top view of patterned surface provided by the embodiment of the present application；
Fig. 4 c is a kind of top view of patterned surface provided by the embodiment of the present application；
Fig. 5 a is a kind of top view of circular pattern type provided by the embodiment of the present application；
Fig. 5 b is the top view of another kind circular pattern type provided by the embodiment of the present application；
Fig. 5 c is a kind of top view of argyle design type provided by the embodiment of the present application；
Fig. 5 d is a kind of top view of curvilinear patterns type provided by the embodiment of the present application；
Fig. 5 e is the top view of another kind curvilinear patterns type provided by the embodiment of the present application；
Fig. 6 is a kind of flexible substrate substrate the schematic diagram of the section structure provided by the embodiment of the present application；
Fig. 7 is a kind of structural schematic diagram of flexible substrate substrate provided by the embodiment of the present application；
Fig. 8 is a kind of flow chart of flexible substrate base plate preparation method provided by the embodiment of the present application.
Drawing reference numeral: 1- organic film；2- inorganic film；The second inorganic film of 3-；4- metal line layer；5- inorganic film is most
Thin position；The first organic film of 11-；The second organic film of 12-；21- tensile stress inoranic membrane；22- compression inoranic membrane.
Specific embodiment
In scheme provided by the embodiments of the present application, described embodiment is only some embodiments of the present application, rather than
Whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not making creative work premise
Under all other embodiment obtained, shall fall in the protection scope of this application.
In order to better understand the above technical scheme, below by attached drawing and specific embodiment to technical scheme
It is described in detail, it should be understood that the specific features in the embodiment of the present application and embodiment are to the detailed of technical scheme
Thin explanation, rather than the restriction to technical scheme, in the absence of conflict, the embodiment of the present application and embodiment
In technical characteristic can be combined with each other.
This application provides a kind of flexible substrate substrate and preparation method thereof, display panel and display devices, for improving
The adhesiveness of flexible substrate substrate organic film and inorganic film avoids organic film and the easily peelable problem of inorganic film, into
One step improves the quality of product.
With reference to the accompanying drawing, to a kind of flexible substrate substrate provided by the embodiments of the present application and preparation method thereof, display surface
The specific embodiment of plate and display device is described in detail.
The thickness of each film layer and shape do not reflect actual proportions in attached drawing, and purpose is schematically illustrate teachings herein.
Referring to Fig. 1, a kind of flexible substrate substrate provided by the embodiments of the present application, the flexible substrate substrate, which includes two, to be had
Machine mold layer 1, and the inorganic film 2 being set between two organic mold layer 1.It should be understood that flexible substrate substrate is in addition to packet
The inorganic film 2 for including two organic films 1 and being set between two organic mold layer 1, in flexible substrate substrate
Setting the second inorganic film 3 and inorganic described second is attached on surface of two organic films 12 far from the inorganic film 2
Metal line layer 4, in the embodiment of the present application, the second inorganic film 3 and gold is arranged far from the surface of the second organic film 12 in film layer 3
Belong to line layer 4 set-up mode and material similarly to the prior art, herein with no restrictions.
In order to avoid flexible substrate substrate is in bending or bending, organic film 1 and inorganic film 2 are removed, and are caused inorganic
The risk and steam that film layer is broken penetrate between inorganic film and organic film, reduce the reliability of product, into
And the quality of product is influenced, the embodiment of the present application can enhance in several ways between organic film 1 and inorganic film 2
Adhesiveness.
Specifically, as shown in Fig. 2, two contacted between the inorganic film 2 and at least any organic film 1
Surface is complementary patterned surface；And/or the inorganic film 2 includes the stress types difference of at least two-layer laminate setting
Inoranic membrane.
Above-mentioned flexible substrate substrate includes organic film 1 and inorganic film 2, wherein organic film includes the first organic film
Layer 11 and the second organic film 12, are arranged inorganic film 2, and inorganic between the first organic film 11 and the second organic film 12
Film layer 2 is contacted respectively at the first organic film 11 and the second organic film 12, by inorganic film 2 and the first organic film 11 or the
Two patterned surfaces contacted between at least any organic film of two organic films 12 handle to obtain complementary patterned surface,
Contact area i.e. between inorganic film 2 and the first organic film 11 or the second organic film 12 increases；And/or inorganic film 2
The different inoranic membrane 21 and 22 of stress types including the setting of at least two-layer laminate, wherein the inoranic membrane 21 be tensile stress without
Machine film, the inoranic membrane 22 are compression inoranic membrane.
Therefore, indirectly in the inorganic film and at least any organic film in above-mentioned flexible substrate substrate
Two surfaces of touching are complementary patterned surface；And/or inorganic film 2 includes the stress types of at least two-layer laminate setting
Different organic films is conducive to improve the adhesiveness between inorganic film and organic film.
In order to make it easy to understand, below with reference to Fig. 3, Fig. 4 a, Fig. 4 b and Fig. 4 c with inorganic film 2 and at least any organic film
Two surfaces contacting are to illustrate how to improve organic film 1 and inorganic film 2 for complementary patterned surface between layer 1
Between adhesiveness.
Specifically, two organic films 1 include the first organic film 11 and the second organic film 12 in flexible substrate substrate,
Inorganic film 2 is set between two organic films 1, inorganic film 2 and the first organic film 11 and the second organic film 12
Contact, two surfaces contacted between inorganic film 2 and the first organic film 11 can be complementary patterning surface, can be
Two surfaces contacted between inorganic film 2 and the second organic film 12 are complementary patterning surface, are also possible to inoranic membrane
Layer 2 is complementary patterning with the surface contacted between the first organic film 11 and inorganic film 2 and the second organic film 12
Surface.
For example, as shown in figure 3, two surfaces contacted between inorganic film 2 and the first organic film 11 are complementary figure
Case surface, the patterned surface of inorganic film 2 are the pattern that isolated protrusion is constituted, the patterned surface of the first organic film 11
It is any isolated raised more with 11 corresponding position of the first organic film in inorganic film 2 to be also to isolate the raised pattern constituted
The groove that a isolated protrusion surrounds is mutually complementary, and then increases the contact area between inorganic film 2 and the first organic film 11, mentions
Adhesiveness between high inorganic film 2 and the first organic film 11.
When two surfaces contacted between inorganic film 2 and at least one organic film 1 are complementary patterned surface,
A kind of types of patterns can be set on the patterned surface, may also set up multiple patterns type, i.e., the described patterned surface
With a kind of types of patterns or multiple patterns type.
Specifically, two surfaces contacted between inorganic film 2 and at least any organic film 1 carry out patterned process,
And inorganic film 2 or 1 surface of organic film carry out there are many modes of patterned process, for example, photoetching process, wet etching method or
Dry etching etc., herein with no restrictions, the organic film 1 or the inorganic film 2 obtain a kind of figure by patterned process
The surface of case type or the surface of multiple patterns type.For example, shown in Fig. 4 a, Fig. 4 b and Fig. 4 c.
It, can during carrying out patterned process when any patterned surface has multiple patterns type simultaneously
With by the pattern etch of same type in adjacent region, can also by the adjacent different types of pattern of region etch so that
Different pattern type is obtained to be staggered, and in the different types of patterns of the surface etch of inorganic film 2, due to different pattern class
Type can change the stress of 2 different location of inorganic film, and then adjust the stress types of inorganic film 2, when inorganic film 2 with have
When machine film layer 1 contacts, under the action of 2 stress of inorganic film, so that organic film 1 is close to the inorganic film 2, Jin Erzeng
Adhesiveness between strong inorganic film 2 and organic film 1.
For example, as illustrated in fig. 4 c, at least one patterned surface that the inorganic film 2 is contacted with organic film 1
Pattern is arranged with ellipse and alternate, the ellipse or circular pattern can be protrusion, be also possible to groove,
It is inorganic to change by the way that different types of patterns is arranged in different positions during the patterned surface of inorganic film 2
The stress of 2 different location of film layer, and then change inorganic film 2 to the stress of organic film 1, as organic film 1 is located at inoranic membrane
On layer 2, when being that organic film 1 contacts due to inorganic film 2, in order to enable the closer attaching of organic film 1 with it is inorganic
Film layer 2, the stress that inorganic film 2 acts on organic film 1 should be a pulling force, therefore inorganic film 2 should be tensile stress inoranic membrane.
Further, inorganic film 2 or 1 patterned surface of organic film include isolated protrusion or groove is constituted pattern or
The pattern that continuous protrusion or groove are constituted, and pattern or continuous protrusion that isolated protrusion or groove are constituted or the figure that groove is constituted
Case includes a plurality of types of patterns again.
Specifically, the pattern that the patterned surface is made of circular protrusions or groove, wherein the circular pattern can
To be the isolated protrusion or groove on the patterned surface, for example, the circular pattern includes a variety of different types
Circular pattern, the top view of two kinds of circular patterns common on patterned surface is given as shown in Fig. 5 a, Fig. 5 b；It can also be
The surface of the inorganic film 2 or organic film 1 carries out patterned process and obtains diamond groove or protrusion as shown in Figure 5 c；Also
Patterned process can be carried out on the surface of the inorganic film 2 or organic film 1 obtain full curve protrusion or groove, for example,
As shown in Fig. 5 d, Fig. 5 e, full curve protrusion or groove include continuous bent curved convex or groove, or continuous S-shaped song
Line protrusion or groove.
Referring to Fig. 6, when two surfaces that inorganic film 2 is contacted with the first organic film 11 and the second organic film 12 are equal
When two patterned surfaces for patterned surface, and inorganic film 2 are isolated or continuous protrusion, in order to guarantee the
The effect that water oxygen completely cuts off between one organic film 11 and the second organic film 12, the thickness in the most thin position of inorganic film 2 are greater than
Preset threshold value, so that the first organic film 11 and the second organic film do not contact, wherein the most thin position of inorganic film 2 should be
In Fig. 6 marked as 5 shown in position.
In order to make it easy to understand, below including different inorganic of stress types of at least two-layer laminate setting with inorganic film 2
It illustrates how to improve the adhesiveness between organic film 1 and inorganic film 2 for film.
Specifically, shown in Figure 7, inorganic film 2 includes that the tensile stress inoranic membrane 21 being stacked and compression are inorganic
Film 22.During prepared by inorganic film 2, at least deposited to form tensile stress inoranic membrane 21 and compression inoranic membrane twice
Layer 22, wherein tensile stress inoranic membrane 21 is contacted with the first organic film 11, and the tensile stress in tensile stress inoranic membrane 21, which to draw, answers
The enhancing of the adhesiveness of power inoranic membrane 21 and the first organic film 11, compression inoranic membrane 22 are contacted with the second organic film 12, are pressed
Compression in stress inorganic film 22 enhances the adhesiveness of compression inoranic membrane 22 and the second organic film 12.Ying Li
It solves, can be complementation by two surfaces contacted between inorganic film 2 and at least any organic film 1 in flexible substrate substrate
Patterned surface and inorganic film 2 include at least two-layer laminate setting the different inoranic membrane of stress types, Lai Tigao has
The adhesiveness of machine film layer 1 and inorganic film 2.
Based on the same inventive concept, the application provides a kind of preparation method of flexible substrate substrate, referring to Fig. 8, the system
Preparation Method, comprising:
Step 801, the first organic film, inorganic film and the second organic film are sequentially prepared on rigid substrate substrate；
Wherein, when preparing the first organic film, patterned process is carried out to the surface of first organic film；With/
Or, carrying out patterned process to the surface of the inorganic film when preparing inorganic film；And/or preparing inorganic film
When, the different types of inoranic membrane of deposition stress at least twice.
Step 802, the rigid substrate substrate is removed, flexible substrate substrate is obtained.
Specifically, the coating polyimide solution on rigid substrate substrate, and the solution is subjected to heat cure processing, one
As when being heated to 300 degrees Celsius, the polyimide solution, that is, curable forms the first organic film, then, to described first
Organic film carries out patterned process far from the surface of rigid substrate substrate side, and the mode of patterned process includes more
Kind, for example, photoetching corrosion, wet etching and dry etching etc., then the table after the first organic film patterned process
Face coating inorganic film layer, wherein the inorganic film can obtain a type of inorganic film using primary depositing, can also be with
The inoranic membrane of a variety of different stress types is obtained using Multiple depositions, a variety of inoranic membranes are stacked to obtain inoranic membrane
Layer is carrying out patterned process, and the nothing after patterned process far from the surface of the first organic film to the inorganic film
Machine film surface continues coating polyimide solution, and it is organic to use such as identical preparation method of the first organic film to obtain second
Film layer obtains flexible substrate substrate finally, removing the rigid substrate substrate.
Based on the same inventive concept, the application provides a kind of display panel, and the display panel includes above-mentioned flexible liner
Substrate, and the function element on the flexible substrate substrate.This is located at the effector on the flexible substrate substrate
Part includes display device, driving element and luminescent device etc..
Based on the same inventive concept, the application provides a kind of display device, and the display device includes above-mentioned display surface
Plate.The display device can be with are as follows: mobile phone, tablet computer, television set, display, laptop, Digital Frame, navigator etc.
Any products or components having a display function.The implementation of the display device may refer to the embodiment of above-mentioned display panel, weight
Multiple place repeats no more.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (10)
1. a kind of flexible substrate substrate, which is characterized in that the flexible substrate substrate includes two organic mold layer, and is set to
Inorganic film between two organic mold layer, wherein
Two surfaces contacted between the inorganic film and at least any organic film are complementary patterned surface；
And/or
The inorganic film includes the different inoranic membrane of the stress types of at least two-layer laminate setting.
2. flexible substrate substrate as described in claim 1, which is characterized in that the patterned surface has a kind of types of patterns
Or multiple patterns type.
3. flexible substrate substrate as claimed in claim 2, which is characterized in that the types of patterns includes circular pattern, diamond shape
Pattern or curvilinear patterns.
4. flexible substrate substrate as claimed in claim 3, which is characterized in that the patterned surface includes isolated protrusion or recessed
Pattern or continuous protrusion that slot is constituted or the pattern that groove is constituted.
5. flexible substrate substrate as claimed in claim 2, which is characterized in that the different pattern class that the patterned surface has
Type is staggered.
6. flexible substrate substrate as described in claim 1, which is characterized in that the thickness of the most thin position of the inorganic film is greater than
Preset threshold.
7. flexible substrate substrate as claimed in any one of claims 1 to 6, which is characterized in that the inorganic film includes that stacking is set
The tensile stress inoranic membrane and compression inoranic membrane set.
8. a kind of preparation method of flexible substrate substrate characterized by comprising
The first organic film, inorganic film and the second organic film are sequentially prepared on rigid substrate substrate；
Wherein, when preparing the first organic film, patterned process is carried out to the surface of first organic film；And/or
When preparing inorganic film, patterned process is carried out to the surface of the inorganic film；And/or when preparing inorganic film, at least
The different types of inoranic membrane of deposition stress twice；
The rigid substrate substrate is removed, flexible substrate substrate is obtained.
9. a kind of display panel, which is characterized in that the display panel includes flexible substrate as claimed in claim 1
Substrate, and the function element on the flexible substrate substrate.
10. a kind of display device, which is characterized in that the display device includes display panel as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910046924.8A CN109799636A (en) | 2019-01-18 | 2019-01-18 | Flexible substrate substrate and preparation method thereof, display panel and display device |
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| CN201910046924.8A CN109799636A (en) | 2019-01-18 | 2019-01-18 | Flexible substrate substrate and preparation method thereof, display panel and display device |
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Cited By (6)
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| CN110189636A (en) * | 2019-05-31 | 2019-08-30 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN110634403A (en) * | 2019-08-29 | 2019-12-31 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and manufacturing method thereof |
| WO2020124968A1 (en) * | 2018-12-19 | 2020-06-25 | 武汉华星光电半导体显示技术有限公司 | Flexible substrate and preparation method therefor |
| CN112086469A (en) * | 2020-09-09 | 2020-12-15 | 武汉华星光电半导体显示技术有限公司 | Array substrate, preparation method thereof and display device |
| WO2021056736A1 (en) * | 2019-09-25 | 2021-04-01 | Tcl华星光电技术有限公司 | Display panel and preparation method therefor, and display device |
| CN114280823A (en) * | 2021-12-21 | 2022-04-05 | Tcl华星光电技术有限公司 | Display panel, preparation method of display panel and repair method of display panel |
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