CN109794698A - A kind of laser process equipment with microchannel heat sink - Google Patents
A kind of laser process equipment with microchannel heat sink Download PDFInfo
- Publication number
- CN109794698A CN109794698A CN201910254848.XA CN201910254848A CN109794698A CN 109794698 A CN109794698 A CN 109794698A CN 201910254848 A CN201910254848 A CN 201910254848A CN 109794698 A CN109794698 A CN 109794698A
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- China
- Prior art keywords
- heat sink
- microchannel
- laser
- upper cover
- cover plate
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000008569 process Effects 0.000 title claims abstract description 29
- 239000004065 semiconductor Substances 0.000 claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims description 43
- 239000007788 liquid Substances 0.000 claims description 39
- 238000009434 installation Methods 0.000 claims description 21
- 239000012530 fluid Substances 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000010992 reflux Methods 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 9
- 238000001816 cooling Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000649 photocoagulation Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to technical field of laser processing, more particularly to a kind of laser process equipment with microchannel heat sink, laser head including rack and in rack, laser head is equipped with microchannel heat sink, semiconductor laser in laser head is set on the upper cover plate of microchannel heat sink, in laser head work, the region that upper cover plate is equipped with semiconductor laser will form high-temperature area, and microchannel heat sink can cool down to high-temperature area.The present invention reliable and stable, efficiently can quickly reduce the temperature of high-temperature area by setting microchannel heat sink, enable the work that semiconductor laser is reliable and stable, and then ensure the reliability of entire laser process equipment service performance, guarantee laser process equipment can it is reliable and stable, rapidly and efficiently process.
Description
Technical field
The present invention relates to microchannel falling temperature technique fields, in particular to a kind of swashing with microchannel heat sink
Light process equipment.
Background technique
Laser processing is the most common application of laser system, wherein laser heat processing is the most common application form.Specifically
For, laser heat processing refers to the fuel factor generated using laser beam projects to material surface to complete process, including swashs
Photocoagulation, laser cutting, surface modification, laser mark, laser drill and micro Process etc..In the system of laser heat processing,
Semiconductor laser is core component, spends and generates high-intensitive laser beam.
In recent years, with the raising of user's demand and going deep into for research, the performance of high power semiconductor lasers is obtained
Quick promotion is arrived.But with the increase of high power semiconductor lasers power, the heat that device generates is also increasingly
Greatly.After semiconductor laser temperature steeply rises, can output wavelength be changed, incident photon-to-electron conversion efficiency reduces, output work
Rate reduces, and influences processing efficiency and machining accuracy.
Traditional radiating mode includes semiconductor refrigerating, adopting heat pipes for heat transfer, misting cooling, these radiating modes are able to satisfy laser
The control of device temperature, but heat-sinking capability is limited, is unable to satisfy the radiating requirements of high power laser.
Summary of the invention
The purpose of the present invention is to provide a kind of laser process equipments with microchannel heat sink, to solve existing skill
Traditional heat-dissipating mode is unable to satisfy the problem of high power laser radiating requirements in art.
To achieve the goals above, the present invention provides a kind of laser process equipment with microchannel heat sink, packets
Including rack and the laser head in the rack, the laser head are equipped with microchannel heat sink, the microchannel heat dissipation dress
It sets including successively stacking setting from the bottom to top and shape and the consistent lower plate of size, heat sink and upper cover plate, the laser head
In semiconductor laser be set on the upper cover plate, in laser head work, the upper cover plate is equipped with and described partly leads
The region of body laser will form high-temperature area,
Wherein, the upper cover plate is equipped with inlet opening and fluid hole, and the inlet opening and the fluid hole are located on described
The same end of cover board, the heat sink is equipped with admission chamber corresponding with the inlet opening, along the length direction of the heat sink,
The heat sink is equipped with heat dissipation cavity far from one end of the admission chamber, and the heat dissipation cavity is equipped with micro- far from the side of the admission chamber
Channel, by the liquid-conveying ducts connection of back-shaped bending setting between the admission chamber and the heat dissipation cavity, from the liquid-conveying ducts
Liquid into the heat dissipation cavity can be vaporized by the high-temperature area on the upper cover plate, form steam fog,
It is equipped with back cavity in the back side of heat sink position corresponding with the heat dissipation cavity, the microchannel is far from institute
The one end for stating admission chamber, which is equipped with, flows back to hole with what the back cavity was connected to, opposite with the fluid hole at the back side of the heat sink
The position answered is equipped with reflux fluid hole, and the reflux fluid hole is connected to the back cavity by return flow line.
Optionally, the heat dissipation cavity is the broadening formation towards the microchannel openings, and the microchannel is prominent for middle part
Mountain font, two sides and the microchannel two sides outstanding that the heat dissipation cavity is opened form long and narrow drainage channel.
Optionally, the drainage channel is the broadening formation being open towards liquid-conveying ducts liquid flow source.
Optionally, mounting hole is correspondingly provided on the lower plate, the heat sink and the upper cover plate.
Optionally, the supporting beam of the rack two sides is equipped with sliding slot, and the supporting beam is equipped with can be along the cunning
The mobile sliding block of slot, along the length direction of the rack, two sliding blocks pass through installation crossbeam connection, the installation crossbeam
It is equipped with installation sliding block, the laser head is set on the installation sliding block, and the installation sliding block can be with the laser head edge
The rack length direction installation crossbeam on slide.
As above, it applies the technical scheme of the present invention, a kind of laser with microchannel heat sink provided by the invention adds
Construction equipment reliable and stable, efficiently can quickly reduce the temperature of high-temperature area by setting microchannel heat sink, so that half
Conductor laser can be reliable and stable work, and then ensure the reliability of entire laser process equipment service performance, guarantee to swash
Light process equipment can it is reliable and stable, rapidly and efficiently process.
Further, the microchannel heat sink in the present invention is by using enclosed microchannel Phase cooling mode,
So that the semiconductor laser on upper cover plate can be good at cooling down, realize good cooling effect, have cooling efficiency height and
Good cooling results, compact-sized advantage.Meanwhile into the liquid of admission chamber can be entered by liquid-conveying ducts heat dissipation cavity and
Microchannel greatly improves liquid cooling so that can take away a large amount of heat into the liquid of heat dissipation cavity and microchannel
Efficiency.
For above content of the invention can be clearer and more comprehensible, be cited below particularly preferred embodiment and in conjunction with attached drawing specifically
It is bright.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present invention, and of the invention shows
Examples and descriptions thereof are used to explain the present invention for meaning property, does not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 diagrammatically illustrates a kind of laser process equipment overall structure with microchannel heat sink of the invention
Figure；
Fig. 2 diagrammatically illustrates microchannel in a kind of laser process equipment with microchannel heat sink of the invention and dissipates
The structure broken away view of thermal；
Fig. 3 diagrammatically illustrates microchannel on a kind of laser process equipment with microchannel heat sink of the invention and dissipates
The front elevation of heat sink in thermal；
Fig. 4 diagrammatically illustrates microchannel on a kind of laser process equipment with microchannel heat sink of the invention and dissipates
The back view of heat sink in thermal；
Fig. 5 diagrammatically illustrates microchannel in a kind of laser process equipment with microchannel heat sink of the invention and dissipates
The cross-sectional view of thermal.
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this specification
Revealed content is understood other advantages and efficacy of the present invention easily.Although description of the invention will combine preferred embodiment
It introduces together, but this feature for not representing the invention is only limitted to the embodiment.On the contrary, being invented in conjunction with embodiment
The purpose of introduction is to be possible to the other selections extended or transformation to cover based on claim of the invention.In order to mention
For that will include many concrete details in depth understanding of the invention, being described below.The present invention can also be thin without using these
Section is implemented.In addition, in order to avoid confusion or obscuring emphasis of the invention, some details will be omitted in the de-scription.
Referring to shown in Fig. 1-5, embodiment according to the present invention provides a kind of laser with microchannel heat sink and adds
Construction equipment 00, the laser head 07 including rack 01 and in the rack 01, the laser head 07 are equipped with microchannel heat dissipation dress
Set 08, wherein the semiconductor laser 6 in the laser head 07 is set on the upper cover plate 5 of microchannel heat sink 08, described
When laser head 07 works, the region that the upper cover plate 5 is equipped with the semiconductor laser 6 will form high-temperature area 51.Pass through
Be arranged microchannel heat sink 08 can it is reliable and stable, efficiently quickly reduce high-temperature area 51, enable semiconductor laser 6
Enough reliable and stable work.
Specifically, referring to fig. 2 and as shown in connection with fig. 1, in the present embodiment, microchannel heat sink 08 includes from the bottom to top
It successively stacks setting and shape and the consistent lower plate 1 of size, heat sink 2 and upper cover plate 3, the upper cover plate 3 is equipped with feed liquor
Hole 30 and fluid hole 31, the inlet opening 30 and the fluid hole 31 are located at the same end of the upper cover plate 3, the heat sink 2
Equipped with admission chamber 20 corresponding with the inlet opening 30, along the length direction V of the heat sink 2, the heat sink 2 is far from institute
The one end for stating admission chamber 20 is equipped with heat dissipation cavity 23, and the heat dissipation cavity 23 is equipped with microchannel 24 far from the side of the admission chamber 20,
It is connected between the admission chamber 20 and the heat dissipation cavity 23 by the liquid-conveying ducts 22 of back-shaped bending setting, from the liquid-conveying ducts
22 liquid for entering the heat dissipation cavity 23 can be vaporized by the high-temperature area 32 on the upper cover plate 3, form steam fog.
That is, inlet opening 30, admission chamber 20, liquid-conveying ducts 22, heat dissipation cavity 23 and microchannel 24 together form liquid
Body channel (as shown in solid arrow in Fig. 3) enters the liquid of liquid-conveying ducts 22 in feed liquor from inlet opening 30 by admission chamber 20
Microchannel 24 is entered by heat dissipation cavity 23 under the action of 30 pressure of hole, by the upper cover plate 3 in heat dissipation cavity 23 and microchannel 24
On some or all of vaporization of high-temperature area 32, formed steam fog.Liquid is vaporized into gas by liquid during forming aerosol
State can absorb a large amount of heat during undergoing phase transition, so that the temperature of the high-temperature area 32 on upper cover plate 3 declines, it can
With the good effect for realizing cooling.Meanwhile admission chamber 20 and liquid-conveying ducts 22 can be passed through into the liquid of inlet opening 30
Into in heat dissipation cavity 23 and microchannel 24, a large amount of heat can be taken away into the liquid in heat dissipation cavity 23 and microchannel 24, greatly
The big efficiency for improving liquid cooling.
The area of microchannel 24 is bigger, vaporizes the more of the heat taken away.Therefore, in actual application, it should
Increase the amount of liquid in the area and microchannel 24 of microchannel 24 as far as possible.In the present embodiment, micro- logical in heat dissipation cavity 23
Road 24 is made of several elongated slits.In other embodiments, microchannel can also be curved pore and bending
Slit constitute.
In addition, have enough liquid in order to ensure retaining in heat sink, so that there is sufficient liquid to flow into heat dissipation cavity, ginseng
As shown in Fig. 2-3, in the present embodiment, liquid-conveying ducts 22 are arranged to back-shaped curved shape, and back-shaped curved shape can
Very big memory space is provided, convenient for injecting a large amount of liquid by inlet opening 30 and admission chamber 20, so that saving in heat sink 2
The sufficient liquid being used for into heat dissipation cavity 23.
In the present embodiment, semiconductor laser 4 is installed on upper cover plate 3, when semiconductor laser 4 works,
A large amount of heat can be generated so that on upper cover plate 3 formed high-temperature area 32,32 meeting of high-temperature area so that into heat dissipation cavity 23 and it is micro- lead to
Liquid vaporization in road 24, vaporescence can absorb a large amount of heat, and then at a temperature of enabling to semiconductor laser 4
Drop, it is ensured that the work that semiconductor laser 4 can be reliable and stable.
It should be noted that the present invention to the specific material of the concrete type of liquid and heat sink without limitation, Ke Yigen
It is reasonably selected according to actual needs.In the present embodiment, liquid is ethyl alcohol, and heat sink 2 is process for red copper, wherein
Ethyl alcohol is conducive to vaporization, and red copper is conducive to heat dissipation, easy to process.In other embodiments, liquid may be methanol or distilled water,
Heat sink may be other materials, and which is not limited by the present invention.
Further, referring to fig. 2 shown in -5, in the present invention, in the back side and 23 phase of heat dissipation cavity of the heat sink 2
Corresponding position is equipped with back cavity 25, and the microchannel 24 is equipped with far from one end of the admission chamber 20 to be connected with the back cavity 25
Logical flows back to hole 240, is equipped with reflux fluid hole 21 in the back side of the heat sink 2 position corresponding with the fluid hole 31,
The reflux fluid hole 21 is connected to the back cavity 25 by return flow line 26.
It is collectively formed that is, flowing back to hole 240, back cavity 25, return flow line 26, reflux fluid hole 21 and fluid hole 31
Current return circuit (such as dotted arrow in Fig. 5 and realize shown in the setting of arrow interval).Into the liquid of heat dissipation cavity 23 and microchannel 24
Body forms a large amount of steam fog after some or all of vaporization of high-temperature area 32 being capped on plate 3, steam fog and is not vaporized
Liquid pass sequentially through flow back to hole 240, back cavity 25, return flow line 26, reflux fluid hole 21 and fluid hole 31 be discharged, together
When, a large amount of heat has been taken away, so that the temperature of high-temperature area 32 obtains very big decline on upper cover plate 3, has realized drop well
Temp effect.
In addition, preferably flowed to preferably radiate with liquid, referring to fig. 2 shown in -5, in the present invention, the heat dissipation
Chamber 23 is the broadening formation being open towards the microchannel 24, and the microchannel 24 is middle part mountain font outstanding, the heat dissipation
Two sides and the microchannel 24 two sides outstanding that chamber 23 opens form long and narrow drainage channel 230.The drainage channel 230 is
The broadening formation being open towards the 22 liquid flow source of liquid-conveying ducts.
Specifically, shown in Figure 3, in the present embodiment, heat dissipation cavity 23 is broadening formation, is entered by liquid-conveying ducts 22
The liquid of the heat dissipation cavity 23 can rapidly enter in microchannel 24, increase the diffusional area of liquid, namely increase scattered
The area of radiator liquid in hot chamber 23.Meanwhile long and narrow drainage channel 230 is provided towards the outflow of 22 liquid of liquid-conveying ducts
The broadening formation for locating opening, so that liquid flows to the flow velocity in the microchannel 24 of two sides faster, it is ensured that flow into heat dissipation cavity 23
Liquid can be flowed into simultaneously in each microchannel 24, preferably realize the effect of heat dissipation.Into the flow rate of liquid meeting of microchannel 24
It speeds, the area of liquid also will increase, and is capable of the heat-sinking capability of further heat radiation chamber 23, realizes better heat dissipation effect.
Further, for the ease of installation, meanwhile, so that can be reliable close between lower plate, heat sink and upper cover plate
Envelope and closely connection, referring to fig. 2 shown in -5, in the present invention, the lower plate 1, the heat sink 2 and the upper cover plate 3
On be correspondingly provided with mounting hole 11, fastening bolt can be applicable in during installation across mounting hole 11, so that lower plate 1, heat sink 2
It closely links together with upper cover plate 3.
Further, referring to Fig. 1, in the present embodiment, the supporting beam 02 of 01 two sides of rack is equipped with sliding slot 03, sliding
Slot 03 is arranged along the width direction X of rack 01, and the supporting beam 02 is equipped with the sliding block that can be moved along the sliding slot 03
04, along the length direction Y of the rack 01, two sliding blocks 04 are connected by installation crossbeam 05, the installation crossbeam 05
It is equipped with installation sliding block 06, the laser head 07 is set on the installation sliding block 06, and the installation sliding block 06 can be with described
Laser head 07 slides on installation crossbeam 13 along the length direction Y of the rack 01.It can be along rack by being applied in combination
The 01 width direction X mobile sliding block 04 installation sliding block 06 mobile with 01 length direction Y of rack is capable of, enables to laser head 07
It is moved to any position of processing plane, convenient for the processing and use of equipment.
It should be noted that the present invention to the concrete type of laser process equipment without limitation, can be laser cutting and set
It is standby, it is also possible to laser welding apparatus, can also be laser engraving equipment, can be specifically answered according to needs of production
With.
According to above-described embodiment it is recognised that a kind of laser processing with microchannel heat sink provided by the invention is set
The standby temperature that high-temperature area reliable and stable, efficiently can be quickly reduced by setting microchannel heat sink, so that semiconductor
Laser can be reliable and stable work, and then ensure the reliability of entire laser process equipment service performance, guarantee that laser adds
Construction equipment can it is reliable and stable, rapidly and efficiently process.
Further, the microchannel heat sink in the present invention is by using enclosed microchannel Phase cooling mode,
So that the semiconductor laser on upper cover plate can be good at cooling down, realize good cooling effect, have cooling efficiency height and
Good cooling results, compact-sized advantage.Meanwhile into the liquid of admission chamber can be entered by liquid-conveying ducts heat dissipation cavity and
Microchannel greatly improves liquid cooling so that can take away a large amount of heat into the liquid of heat dissipation cavity and microchannel
Efficiency.
In conclusion provided by the invention, the above-described embodiments merely illustrate the principles and effects of the present invention, rather than
For limiting the present invention.Any person skilled in the art all without departing from the spirit and scope of the present invention, to above-mentioned reality
It applies example and carries out modifications and changes.Therefore, such as those of ordinary skill in the art without departing from disclosed
Spirit with technical idea under all equivalent modifications or change for being completed, should be covered by the claims of the present invention.
Claims (5)
1. a kind of laser process equipment with microchannel heat sink, the laser head including rack and in the rack,
It is characterized in that, the laser head is equipped with microchannel heat sink, the microchannel heat sink includes successively folding from the bottom to top
Put setting and shape and the consistent lower plate of size, heat sink and upper cover plate, the semiconductor laser in the laser head is set to
On the upper cover plate, in laser head work, the region that the upper cover plate is equipped with the semiconductor laser be will form
High-temperature area,
Wherein, the upper cover plate is equipped with inlet opening and fluid hole, and the inlet opening and the fluid hole are located at the upper cover plate
The same end, the heat sink be equipped with admission chamber corresponding with the inlet opening, it is described along the length direction of the heat sink
Heat sink is equipped with heat dissipation cavity far from one end of the admission chamber, and the heat dissipation cavity is equipped with micro- logical far from the side of the admission chamber
Road, between the admission chamber and the heat dissipation cavity by it is back-shaped bending setting liquid-conveying ducts connection, from the liquid-conveying ducts into
The liquid for entering the heat dissipation cavity can be vaporized by the high-temperature area on the upper cover plate, form steam fog,
Be equipped with back cavity in the back side of heat sink position corresponding with the heat dissipation cavity, the microchannel far from it is described into
One end of sap cavity, which is equipped with, flows back to hole with what the back cavity was connected to, corresponding with the fluid hole at the back side of the heat sink
Position is equipped with reflux fluid hole, and the reflux fluid hole is connected to the back cavity by return flow line.
2. as described in claim 1 with the laser process equipment of microchannel heat sink, which is characterized in that the heat dissipation cavity
For towards the broadening formation of the microchannel openings, the microchannel is middle part mountain font outstanding, what the heat dissipation cavity was opened
Two sides and the microchannel two sides outstanding form long and narrow drainage channel.
3. as claimed in claim 2 with the laser process equipment of microchannel heat sink, which is characterized in that the drainage is logical
Road is the broadening formation being open towards liquid-conveying ducts liquid flow source.
4. as described in claim 1 with the laser process equipment of microchannel heat sink, which is characterized in that the bottom
Mounting hole is correspondingly provided on plate, the heat sink and the upper cover plate.
5. as described in claim 1 with the laser process equipment of combined micro-channel radiator, which is characterized in that described
The supporting beam of rack two sides is equipped with sliding slot, and the supporting beam is equipped with the sliding block that can be moved along the sliding slot, along institute
The length direction of rack is stated, for two sliding blocks by installation crossbeam connection, the installation crossbeam is equipped with installation sliding block, described
Laser head is set on the installation sliding block, and the installation sliding block can be with the laser head along the length direction of the rack
It is slided on installation crossbeam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910254848.XA CN109794698B (en) | 2019-04-01 | 2019-04-01 | Laser processing equipment with microchannel heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910254848.XA CN109794698B (en) | 2019-04-01 | 2019-04-01 | Laser processing equipment with microchannel heat abstractor |
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| Publication Number | Publication Date |
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| CN109794698A true CN109794698A (en) | 2019-05-24 |
| CN109794698B CN109794698B (en) | 2021-07-23 |
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ID=66564401
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910254848.XA Expired - Fee Related CN109794698B (en) | 2019-04-01 | 2019-04-01 | Laser processing equipment with microchannel heat abstractor |
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| Country | Link |
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| CN (1) | CN109794698B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022116486A1 (en) | 2022-07-01 | 2024-01-04 | Precitec Gmbh & Co. Kg | LASER PROCESSING HEAD WITH A TWO-PHASE CLOSED HEAT EXCHANGER |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009146694A2 (en) * | 2008-06-05 | 2009-12-10 | Dirk Lorenzen | Cooling element for an electronic component and apparatus comprising an electronic component |
| CN201402913Y (en) * | 2009-01-23 | 2010-02-10 | 北京工业大学 | Micro-channel heat sink of semiconductor laser |
| CN201570775U (en) * | 2009-10-10 | 2010-09-01 | 中国科学院理化技术研究所 | Single-chip laser diode micro-channel phase change heat sink |
| CN201682169U (en) * | 2009-11-11 | 2010-12-22 | 中国科学院理化技术研究所 | Micro-channel flowing boiling heat sink for cooling high-power solid laser |
| CN202103311U (en) * | 2011-07-01 | 2012-01-04 | 中国电子科技集团公司第十三研究所 | Micro-channel heat sink for laser |
| CN104051952A (en) * | 2014-07-04 | 2014-09-17 | 成都三鼎日新激光科技有限公司 | Internal micro-channel heat sink |
| CN206116864U (en) * | 2016-09-30 | 2017-04-19 | 西安炬光科技股份有限公司 | Microchannel liquid refrigeration piece |
-
2019
- 2019-04-01 CN CN201910254848.XA patent/CN109794698B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009146694A2 (en) * | 2008-06-05 | 2009-12-10 | Dirk Lorenzen | Cooling element for an electronic component and apparatus comprising an electronic component |
| CN201402913Y (en) * | 2009-01-23 | 2010-02-10 | 北京工业大学 | Micro-channel heat sink of semiconductor laser |
| CN201570775U (en) * | 2009-10-10 | 2010-09-01 | 中国科学院理化技术研究所 | Single-chip laser diode micro-channel phase change heat sink |
| CN201682169U (en) * | 2009-11-11 | 2010-12-22 | 中国科学院理化技术研究所 | Micro-channel flowing boiling heat sink for cooling high-power solid laser |
| CN202103311U (en) * | 2011-07-01 | 2012-01-04 | 中国电子科技集团公司第十三研究所 | Micro-channel heat sink for laser |
| CN104051952A (en) * | 2014-07-04 | 2014-09-17 | 成都三鼎日新激光科技有限公司 | Internal micro-channel heat sink |
| CN206116864U (en) * | 2016-09-30 | 2017-04-19 | 西安炬光科技股份有限公司 | Microchannel liquid refrigeration piece |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022116486A1 (en) | 2022-07-01 | 2024-01-04 | Precitec Gmbh & Co. Kg | LASER PROCESSING HEAD WITH A TWO-PHASE CLOSED HEAT EXCHANGER |
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| Publication number | Publication date |
|---|---|
| CN109794698B (en) | 2021-07-23 |
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