CN109792836B - 电子装置及其制造方法 - Google Patents
电子装置及其制造方法 Download PDFInfo
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- CN109792836B CN109792836B CN201780060052.XA CN201780060052A CN109792836B CN 109792836 B CN109792836 B CN 109792836B CN 201780060052 A CN201780060052 A CN 201780060052A CN 109792836 B CN109792836 B CN 109792836B
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Abstract
电子装置(100)具备电子元件(12)、埋设电子元件(12)而对其进行固定的树脂成型体(11)、与树脂成型体(11)连接并且能够弯折的弯折部(20)。例如,弯折部(20)与树脂成型体(11)一体地成型。由此,能够使电子装置(100)小型化和薄型化。
Description
技术领域
本技术涉及一部分能够弯折的电子装置及其制造方法。
背景技术
近年来,随着便携式设备等的超小型化的需求日益高涨,对搭载电子元件的刚性基板进行固定的部位是有限的。因此,为了将未配置在同一平面上的多个刚性基板连接,公知使用能够弯折的柔性基板的技术。
图11是表示对刚性基板和柔性基板进行组合的电子装置的例子的图。图11所示的电子装置具备刚性基板70,75和柔性基板80。
在刚性基板70上形成有配线72a,72b,并且搭载有与该配线72a,72b连接的电子元件71。在刚性基板75上形成有配线77a~77c,并且搭载有与该配线77a~77c连接的电子元件76a,76b。在柔性基板80上形成的导电层81通过导电性粘接层90a与基板70的配线72b连接,并且通过导电性粘接层90b与基板75的配线77a连接。由此,基板70,75通过能够弯折的柔性基板80电连接。
然而,在图11所示的电子装置中,刚性基板70,75需要与柔性基板80连接的端子部,基板面积大型化。并且,装配工序增加造成制造成本增加。
于是,在特开平6-177490号公报(专利文献1)中,公开了通过从柔性配线板的上下通过刚性配线板经由粘接层对柔性配线板进行夹持,从而使柔性配线板与刚性配线板一体化的印刷配线板。在特开平6-177490号公报所述的技术中,能够通过过孔等层间电路配线将柔性配线板与刚性配线板连接。由此,不需要为了与柔性基板连接而设置端子部,能够防止基板面积的大型化。
现有技术文献
专利文献
专利文献1:(日本)特开平6-177490号公报
发明内容
发明所要解决的技术问题
然而,在特开平6-177490号公报所述的技术中,从柔性配线板的上下夹住刚性配线板,因此产生印刷配线基板变厚的问题。另外,由于在印刷配线基板上通过钎焊等而搭载有电子元件,因此进一步变厚与电子元件相对应的量。
并且,为使刚性配线板与柔性基板多层化而需要层压等工序或大型的装置,存在制造成本变高的问题。
本发明是着眼于上述现有技术的问题而做出的,其目的在于提供一种具备能够弯折的弯折部并且能够实现小型化和薄型化的电子装置,并且提供一种能够抑制该电子装置的制造成本的制造方法。
用于解决技术问题的技术方案
根据某一方面,电子装置具备:电子元件;树脂成型体,其埋设电子元件而对该电子元件进行固定;弯折部,其与树脂成型体连接能够弯折。
优选弯折部通过树脂与树脂成型体一体地成型。或者,树脂成型体可以埋设弯折部的一部分而对其进行支承。
优选树脂成型体的表面包含使电子元件露出的露出面。弯折部的表面包含与露出面连续的连续面。电子装置进一步具备在露出面和连续面上形成并且与电子元件连接的配线。
例如,配线从电子元件到连续面上连续地形成。或者,配线可以包含:第一配线,其形成在露出面上,并且与电子元件连接;第二配线,其预先形成在连续面上,并且与第一配线连接。
弯折部的材料的断裂时的伸长率比树脂成型体的材料的断裂时的伸长率大。
例如,弯折部可以通过断裂时的伸长率为300%以上的树脂形成。树脂成型体可以通过断裂时的伸长率为150%以下的树脂形成。树脂成型体可以包含填充物。
根据另一方面,电子装置的制造方法具备:将电子元件粘贴于片材的工序;将片材配置在成型模具内,向成型模具内填充树脂,由此使埋设有电子元件的树脂成型体和比树脂成型体薄且能够弯折的弯折部一体地成型的工序;在通过将片材从树脂成型体剥离而露出的树脂成型体中的与片材接触过的片材接合面和通过将片材从树脂成型体剥离而露出的弯折部中的与片材接合面连续的连续面上形成配线的工序。
根据又一方面,电子装置的制造方法具备:将电子元件粘贴于片材的工序;将片材依次配置在两种成型模具内,通过二次成型法,对埋设有电子元件的树脂成型体和与树脂成型体连接且能够弯折的弯折部一体地进行成型的工序;在通过将片材从树脂成型体剥离而露出的树脂成型体中的与片材接触过的片材接合面和通过将片材从树脂成型体剥离而露出的弯折部中的与片材接合面连续的连续面上形成配线的工序。
根据又一方面,电子装置的制造方法具备:将电子元件和能够弯折的弯折部粘贴于片材的工序;将片材配置在成型模具内,向成型模具内填充树脂,由此对埋设有电子元件和弯折部的一部分的树脂成型体进行成型的工序;在通过将片材从树脂成型体剥离而露出的树脂成型体中的与片材接触过的片材接合面形成第一配线的工序。
优选弯折部的表面包含与片材接合面连续的连续面。在形成第一配线的工序中,也在连续面上形成第一配线。
或者,可以在弯折部的表面预先形成第二配线。然后,可以在粘贴的工序中,以第二配线与片材对置的方式将弯折部粘贴于片材,在形成第一配线的工序中,以与第二配线连接的方式形成第一配线。
发明的效果
根据本公开,能够得到具备能够弯折的弯折部并且实现小型化和薄型化的电子装置。
附图说明
图1是表示实施方式1的电子装置的概略构成的平面图。
图2是沿着图1的X-X线的向视剖面图。
图3是对实施方式1的电子装置的制造方法进行说明的图。
图4是表示实施方式2的电子装置的概略构成的平面图。
图5是沿着图4的X-X线的向视剖面图。
图6是表示实施方式4的电子装置的概略构成的平面图。
图7是沿着图6的X-X线的向视剖面图。
图8是对实施方式4的电子装置的制造方法进行说明的图。
图9是表示实施方式5的电子装置的概略构成的平面图。
图10是沿着图9的XI-XI线的向视剖面图。
图11是对刚性基板和柔性基板进行组合的电子装置的例子的图。
具体实施方式
参照附图对本发明的实施方式详细地进行说明。需要说明的是,对于附图中相同或者相当的部分,标注同一附图标记而不重复其说明。
<实施方式1>
(电子装置的构成)
参照图1和图2,对实施方式1的电子装置100的概略构成进行说明。图1是表示实施方式1的电子装置100的概略构成的平面图。图2是沿着图1的X-X线的向视剖面图。
电子装置100装入可穿戴便携式设备等便携式电子设备或小型传感器等各种电子设备中,承担电子设备的主要或辅助性的功能。作为可穿戴便携式设备,例如,包含佩戴在衣服上并且对身体表面温度进行测量的测量设备或卷绕于手腕并且对脉搏或血压等进行测量的测量设备等。
如图1和图2所示,电子装置100具备形成有电路的本体部10、能够弯折的弯折部20以及配线30(30a~30h)。本体部10包含树脂成型体11和电子元件12(12a~12e)。
树脂成型体11为大致板状,由聚碳酸酯(PC)或丙烯腈丁二烯苯乙烯(ABS)等树脂构成。需要说明的是,树脂成型体11的形状没有特别的限制,根据电子装置100的形状适当地设计即可。树脂成型体11的材质也可以是其他种类的树脂(例如,聚丙烯(PP)或弹性体等)。
树脂成型体11通过在其内部埋设电子元件12(12a~12e)而对电子元件12进行固定。树脂成型体11以使电子元件12从上表面11a露出的方式埋设电子元件12。
电子元件12(12a~12e)是片式电容器、片式电阻器、IC(Integrated Circuit)等电子元件。不对电子元件12的数量和种类特别地进行限制。
在电子元件12a~12e中的从树脂成型体11露出的表面分别形成有电极13a~13e。
弯折部20与树脂成型体11连接并且能够弯折。具体地说,弯折部20通过与树脂成型体11相同的材质构成,与树脂成型体11一体成型。弯折部20具有比树脂成型体11的厚度t2(例如,3mm)薄的厚度t1(例如,0.2mm),因而弯折性比树脂成型体11好。
弯折部20的表面包含与树脂成型体11的上表面11a连续的连续面20a。在这里,两个面“连续”是指该两个面之间的阶梯小到不会使在其上形成的配线切断的程度。具体地说,弯折部20的连续面20a与树脂成型体11的上表面11a处于同一平面上。
配线30(30a~30h)形成在树脂成型体11的上表面11a和弯折部20的连续面20a的至少上表面11a上,并且与电子元件12a~12e的电极13a~13e中的任一个连接。
具体地说,配线30a~30c形成在树脂成型体11的上表面11a和弯折部20的连续面20a这两个面上,分别从电子元件12e的电极13e、电子元件12d的电极13d、电子元件12b的电极13b到连续面20a上连续地形成。
配线30d~30h在树脂成型体11的上表面11a上形成。配线30d与电子元件12a的电极13a和电子元件12b的电极13b连接。配线30e与电子元件12a的电极13a和电子元件12c的电极13c连接。配线30f与电子元件12c的电极13c和电子元件12d的电极13d连接。配线30g与电子元件12a的电极13a和电子元件12d的电极13d连接。配线30h与电子元件12d的电极13d和电子元件12e的电极13e连接。
例如通过使用喷射印刷法喷射银(Ag)墨而能够容易地形成配线30。喷射印刷法是从喷嘴喷墨,使粒子状的墨在喷射对象面上堆积的印刷方式。
如上所述,树脂成型体11的上表面11a与弯折部20的连续面20a连续,因此通过使用喷射印刷法喷射银(Ag)墨,能够容易地形成配线30。
(电子装置的制造方法)
接着,参照图3,对实施方式1的电子装置100的制造方法的一个例子进行说明。图3是对电子装置100的制造方法进行说明的图。图3中的(a)~(d)分别表示对用于制造电子装置100的第一~第四工序进行说明的图。在图3的(a)中,左侧表示的是平面图,右侧表示的是侧面图。在图3的(b)中表示的是剖面图。在图3的(c)(d)中,左侧表示的是平面图,右侧表示的是沿着平面图中的X-X线的向视剖面图。
(第一工序)
如图3中的(a)所示,首先,通过粘接剂(未图示)将电子元件12a~12e粘贴于长方形形状的临时固定片材200而进行临时固定。此时,电子元件12a~12e以形成有电极13a~13e的面与临时固定片材200接触的方式被粘贴。
作为临时固定片材200的材料,例如,能够使用聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚苯硫醚树脂(PPS)等。出于后述理由,优选临时固定片材200由能够使紫外线透过并且具有柔软性的材料构成。
临时固定例如能够通过在临时固定片材200的一方的面上涂布的例如紫外线固化型粘接剂(未图示)进行。例如,在厚度50μm的PET制的临时固定片材200上以2~3μm的厚度涂布紫外线硬化型的粘接剂。该涂布使用喷射印刷法等方法进行即可。之后,将电子元件12a~12e分别设置在所设定的位置。然后,例如通过从临时固定片材200的临时固定有电子元件12a~12e的面照射3000mJ/cm2的强度的紫外线,使粘接剂固化,将电子元件12a~12e临时固定于临时固定片材200。
(第二工序)
接着,如图3的(b)所示,将临时固定有电子元件12a~12e的临时固定片材200设置在通过对第一模具210和第二模具220进行组合而构成的成型模具的内部。
在第一模具210的与第二模具220对置的面形成有与临时固定片材200相同形状的凹部211,在该凹部211嵌入临时固定片材200。由此,临时固定片材200的粘贴有电子元件12a~12e的面与第二模具220对置。
并且,凹部211的深度与临时固定片材200的厚度相同。因此,临时固定片材200的临时固定有电子元件12的面与第一模具210的不形成凹部211的部分的与第二模具220对置的面处于同一平面上。
第二模具220的与第一模具210对置的面在与第一模具210的凹部211对置的部分形成深度t2的空间221,并且在不与第一模具210的凹部211对置的部分具有形成深度t1的空间222的形状。空间221与空间222连通。
然后,通过向对第一模具210和第二模具220进行组合而构成的成型模具的内部的空间221,222注入树脂材料而进行树脂的注塑成型。
进行注塑成型的条件根据树脂适当地选择即可,例如,在使用聚碳酸酯(PC)的情况下,以270℃的射出树脂温度、100MPa的射出压力进行注塑成型。
注塑成型的树脂能够采用各种树脂材料。其中,如果使用弹性体等具有橡胶弹性的材料,则弯折部20能够更为柔软地变形。并且,不对进行注塑成型的条件特别地进行限定。
(第三工序)
如图3的(c)所示,将通过第二工序的注塑成型得到的构造体230从成型模具取出。构造体230具备与成型模具的空间221具有同一形状(厚度t2)的树脂成型体11和与成型模具的空间222具有同一形状(厚度t1)的弯折部20。
然后,从构造体230剥离临时固定片材200。由此,电子元件12a~12e的表面从树脂成型体11的与临时固定片材200接触过的片材接合面(与上表面11a对应)露出。
在临时固定片材200为PET膜的情况下,由于第二工序时的热变化,临时固定片材200大幅变形,因此能够容易地将临时固定片材200从构造体230分离。
需要说明的是,在第二工序中,在第一模具210的凹部211嵌入临时固定片材200时,临时固定片材200的临时固定有电子元件12的面与第一模具210的与第二模具220对置的面处于同一平面上。因此,在弯折部20中与第一模具210接触过的部分的表面成为与树脂成型体11的上表面11a连续并且与上表面11a处于同一平面上的连续面20a。
(第四工序)
如图3的(d)所示,在第三工序之后,在树脂成型体11的上表面11a和弯折部20的连续面20a上形成规定图案的配线30(30a~30h)。
配线30的形成能够使用通过喷射印刷法等对导电材料(例如,银墨等)进行喷雾的方法、使用气雾剂的方法或者使用配料器的方法等进行。
配线30能够使用适当选择的方法容易且使电路设计的自由度变高地形成,各电子元件12a~12e能够不通过钎焊等而简便地电连接。更详细地说,在工业上,能够在决定各电子元件12a~12e的位置之后将各电子元件12a~12e连接,例如与使电子元件与印刷基板对位的情况相比,能够准确且容易地对各电子元件12a~12e进行电连接。
由此,完成具备包含电子元件12和树脂成型体11的本体部10、弯折部20以及配线30的电子装置100的制作。
(优点)
如上所述,电子装置100具备电子元件12、埋设电子元件12而对其进行固定的树脂成型体11以及与树脂成型体11连接且能够弯折的弯折部20。
树脂成型体11通过埋设电子元件12而对其进行固定,从而作为搭载电子元件的基板发挥作用。由此,与在现有的刚性基板的上表面通过钎焊等搭载电子元件的情况相比,能够使电子装置100小型化和薄型化。
另外,弯折部20与树脂成型体11连接,因此与通过刚性配线板从上下将柔性配线板夹住的情况(参照特开平6-177490号公报参照)相比,能够使电子装置100小型化和薄型化。
弯折部20与树脂成型体11一体地成型。由此,由于在弯折部20与树脂成型体11之间不存在施加有机械负荷的连接点,因此树脂成型体11与弯折部20的连接可靠性变高。并且,不需要使用较为昂贵的柔性基板作为另外的部件,因此能够降低零件成本。
树脂成型体11的表面包含使电子元件12露出的上表面(露出面)11a。弯折部20的表面包含与上表面11a连续的连续面20a。电子装置100具备在上表面11a和连续面20a上形成并且与电子元件12连接的配线30。由此,不需要用于将弯折部与树脂成型体11电连接的端子部,能够进一步实现小型化。
电子装置100通过以下(1)~(3)的工序制造。
(1)将电子元件12粘贴于临时固定片材200的工序。
(2)将临时固定片材200配置在成型模具(第一模具210和第二模具220)内,通过向成型模具内填充树脂,由此对埋设有电子元件12的树脂成型体11和比树脂成型体11薄且能够弯折的弯折部20进行一体成型的工序。
(3)在通过将临时固定片材200从树脂成型体11剥离而露出的树脂成型体11中的与临时固定片材200接触过的上表面(片材接合面)11a和通过将临时固定片材200从树脂成型体11剥离而露出的弯折部20中的与上表面11a连续的连续面20a上形成配线30的工序。
通过上述制造方法,本体部10与弯折部20的电连接能够通过在树脂成型体11的上表面11a和弯折部20的连续面20a上形成配线30而实现。这样,不需要以往用于将柔性基板连结于刚性基板的复杂的工序,并且不需要粘接剂等部件。因此,能够降低电子装置100的制造成本。
<实施方式2>
本发明实施方式2的电子装置是实施方式1的电子装置100的变形例,具备多个包含电子元件和树脂成型体的本体部。
图4是表示实施方式2的电子装置100A的概略构成的平面图。图5是沿着图4的X-X线的向视剖面图。
如图4和图5所示,电子装置100A在具备本体部40和配线30i~30k的这一点与实施方式1的电子装置100不同。
本体部40与弯折部20中的与本体部10连接的端部位于相反侧的端部连接。本体部40包含树脂成型体41和电子元件42(42a~42c)。
树脂成型体41为大致板状,通过与树脂成型体11和弯折部20相同的树脂与树脂成型体11和弯折部20一体成型。
树脂成型体41通过在其内部埋设电子元件42(42a~42c)而对电子元件42进行固定。树脂成型体41以使电子元件42从上表面41a露出的方式埋设电子元件42。
树脂成型体41的上表面41a与弯折部20的连续面20a连续,树脂成型体11的上表面11a与连续面20a处于同一平面上。
电子元件42(42a~42c)是片式电容器、片式电阻器、IC(Integrated Circuit)等电子元件。电子元件42的数量和种类没有特别的限制。
在电子元件42a~42c中的从树脂成型体41露出的表面分别形成有电极43a~43c。
配线30i~30k形成在树脂成型体41的上表面41a,并且与电子元件42a~42c的电极43a~43c连接。
并且,在本实施方式2中,在弯折部20的连续面20a形成的配线30a~30c延长到树脂成型体41的上表面41a。配线30a与电子元件42b的电极43b连接。配线30b,30c与电子元件42c的电极43c连接。
电子装置100A通过与实施方式1同样的方法制造。具体地说,在实施方式1中所说明的第一工序中,与临时固定有电子元件12的临时固定片材200另行地准备临时固定有电子元件42的临时固定片材。在第二工序中,将临时固定有电子元件12的临时固定片材200和临时固定有电子元件42的临时固定片材设置在成型模具的内部,向成型模具的内部注入树脂材料而进行树脂的注塑成型。由此,对树脂成型体11,41和弯折部20进行一体成型。之后,在第四工序中,在树脂成型体11的上表面11a、树脂成型体41的上表面41a以及与上表面11a,41a连续的弯折部20的连续面20a上形成配线30(30a~30k)即可。
根据上述构成,在多个本体部10,40之间配置有能够弯折的弯折部20。因此,在本体部10与本体部40的设置部位不在同一平面上的情况下,也能够通过弯折部20来确保将本体部10的电路与本体部40的电路电连接的状态,并且能够将电子装置100A装入电子设备。
<实施方式3>
本发明实施方式3的电子装置是实施方式1的电子装置100或实施方式2的电子装置100A的变形例,弯折部20的材质与本体部10的树脂成型体11和本体部40的树脂成型体41的材质不同。
例如,优选在本体部10的树脂成型体11和本体部40的树脂成型体41中使用聚碳酸酯(PC)或丙烯腈丁二烯苯乙烯(ABS)等断裂时的伸长率为150%以下的树脂材料。需要说明的是,断裂时的伸长率表示的是按照JISK7162进行拉伸试验时,断裂时的试验片相对于试验前的试验片的伸长率。
由此,本体部10,40难以发生变形,因而容易将本体部10,40固定在固定位置。
与此相对,优选在弯折部20中使用断裂时的伸长率为580%的聚氨酯(PU)或断裂时的伸长率为300%的聚酰胺(PA)等断裂时的伸长率为300%以上的树脂材料。
由此,根据装入有电子装置100,100A的电子设备的其他构成或本体部10,40所设置的位置,根据需要在将弯折部20伸长的状态下将电子装置100,100A装入电子设备。其结果是,即使存在电子设备的内部构成的个体偏差或内部构成的些许的设计变更,也能够容易地将电子装置100,100A装入电子设备。
在装入搭载于衣服(例如下着)并且用于测量身体表面温度的测量设备的电子装置100A的情况下,弯折部20设置在靠近人体关节的位置。由此,使用断裂时的伸长率为300%以上的树脂材料形成的弯折部20能够根据穿着衣服的人的动作而伸缩。
包含温度传感器作为电子元件12的本体部10设置在从人体的关节离开的较为稳定的位置。为了在本体部10的树脂成型体11与人体的表面接触时减轻对该人体的刺激而优选具有某种程度的弹性。形成树脂成型体11的树脂材料能够根据本体部10的设置部位而从断裂时的伸长率为150%以下的树脂材料中适当地选择。
并且,在弯折部20与本体部10的树脂成型体11和本体部40的树脂成型体41的树脂材料相同的情况下,在构成树脂成型体11和树脂成型体41的树脂材料中可以复合填充物(例如,玻璃填充物、碳类填充物)。由此,能够提高本体部10、40的强度。为使强度有效地提高,尤其优选复合玻璃填充物。
作为使弯折部20与本体部10的树脂成型体11和本体部40的树脂成型体41的材质不同的方法,使用现有公知的二次成型法等即可。
二次成型法是将不同树脂或不同原材料彼此进行组合而一体地进行成型的方法。具体地说,在使用第一成型模具对树脂成型体11进行成型后,使用第二成型模具对弯折部20成型,由此对树脂成型体11和弯折部20一体地进行成型。或者,也可以在使用第一成型模具对弯折部20进行成型后,使用第二成型模具对树脂成型体11进行成型,由此对树脂成型体11和弯折部20一体地进行成型。
在使用断裂时的伸长率高的材质作为弯折部20的情况下,弯折部20可以具有与树脂成型体11相同的厚度。
<实施方式4>
在上述实施方式1~3中通过树脂材料的注塑成型对弯折部20进行成型,但实施方式4的电子装置使用柔性基板作为弯折部。
(电子装置的构成)
参照图6和图7,对实施方式4的电子装置100B的构成进行说明。图6是表示实施方式4的电子装置100B的概略构成的平面图。图7是沿着图6的X-X线的向视剖面图。
如图6和图7所示,在电子装置100B具备本体部50而代替本体部10、具备弯折部60而代替弯折部20的这一点与实施方式1的电子装置100不同。
弯折部60是通过聚酰亚胺(PI)或聚对苯二甲酸乙二醇酯(PET)等构成的膜上的柔性基板。弯折部60的形状没有特别的限制,例如为矩形状。弯折部60的厚度没有特别的限制,例如为50μm。
本体部50在具备树脂成型体51而代替树脂成型体11的这一点与实施方式1的本体部10不同。
树脂成型体51为大致板状,由聚碳酸酯(PC)或丙烯腈丁二烯苯乙烯(ABS)等树脂构成。需要说明的是,树脂成型体51的形状没有特别的限制,根据电子装置100B的形状适当地设计即可。树脂成型体51的材质也可以是其他种类的树脂(例如,聚丙烯(PP)或弹性体等)。
树脂成型体51与树脂成型体11同样地通过在其内部埋设电子元件12(12a~12e)而对电子元件12进行固定。树脂成型体51以使电子元件12从上表面51a露出的方式埋设电子元件12。
另外,树脂成型体51通过埋设弯折部60的一部分而对弯折部60进行支承。由此,弯折部60与树脂成型体51连接。在图6和图7所示的例子中,树脂成型体51埋设矩形状的弯折部60的包含一方的短边在内的端部而对其进行支承。树脂成型体51以其上表面51a与弯折部60的表面的一部分(连续面60a)连续的方式对弯折部60进行支承。具体地说,树脂成型体51以上表面51a与弯折部60的连续面60a处于同一平面上的方式对弯折部60进行支承。
配线30(30a~30h)与实施方式1同样地形成在树脂成型体51的上表面51a和弯折部60的连续面60a的至少一方上,并且与电子元件12a~12e中的任一个连接。
(电子装置的制造方法)
接着,参照图8,对实施方式4的电子装置100B的制造方法的一个例子进行说明。图8是对电子装置100B的制造方法进行说明的图。图8的(a)~(d)分别表示的是对用于制造电子装置100B的第一~第四工序进行说明的图。在图8的(a)中,左侧表示的是平面图,右侧表示的是侧面图。在图8的(b)中表示的是剖面图。在图8的(c)(d)中,左侧表示的是平面图,右侧表示的是沿着平面图中的X-X线的向视剖面图。
(第一工序)
如图8的(a)所示,首先,通过粘接剂将电子元件12a~12e和弯折部60粘贴于临时固定片材200而临时固定。此时,电子元件12a~12e以形成有电极13a~13e的面与临时固定片材200接触的方式被粘贴。弯折部60的仅一部分粘贴于临时固定片材200。电子元件12a~12e和弯折部60向临时固定片材200的临时固定的方法与实施方式1的第一工序相同,因此省略详细的说明。
(第二工序)
接着,如图8的(b)所示,将临时固定有电子元件12a~12e和弯折部60的临时固定片材200设置在通过对第一模具210和第二模具220进行组合而构成的成型模具的内部。
与实施方式1相同,将临时固定片材200嵌入在第一模具210上形成的凹部211。此时,弯折部60收纳于空间222的大致整个区域,并且其一部分突出到空间221。
然后,通过向对第一模具210和第二模具220进行组合而构成的成型模具的内部的空间221注入树脂材料而进行树脂的注塑成型。进行注塑成型的条件与实施方式1的第二工序相同。
(第三工序)
如图8的(c)所示,将通过第二工序的注塑成型而得到的构造体240从成型模具取出。构造体240具备埋设电子元件12a~12e并且与成型模具的空间221具有同一形状的树脂成型体51和一部分埋设于树脂成型体51的弯折部60。
然后,将临时固定片材200从构造体240剥离。由此,电子元件12a~12e的表面从树脂成型体51的上表面51a露出。并且,弯折部60中与临时固定片材200粘贴过的连续面60a与树脂成型体51的上表面51a处于同一平面上,并且与上表面51a连续。
(第四工序)
如图8的(d)所示,在第三工序之后,在树脂成型体51的上表面51a和弯折部60的连续面60a上形成规定图案的配线30(30a~30h)。配线30的形成方法与实施方式1的第四工序相同。
由此,完成具备包含电子元件12和树脂成型体51的本体部50、由树脂成型体51支承的弯折部60、配线30的电子装置100B的制作。
(优点)
在实施方式3的电子装置100B中,树脂成型体51埋设弯折部60的一部分而对其进行支承。由此,与通过粘接剂等进行粘接的情况相比,弯折部60与树脂成型体51的连接可靠性提高。
电子装置100B能够通过以下(1)~(3)的工序制造。
(1)将电子元件12和能够弯折的弯折部60粘贴于临时固定片材200的工序。
(2)将临时固定片材200配置在成型模具(对第一模具210和第二模具220进行组合的模具)内,向成型模具内填充树脂,由此对埋设有电子元件12和弯折部60的一部分的树脂成型体51进行成型的工序。
(3)在通过将临时固定片材200从树脂成型体51剥离而露出的树脂成型体51中的与临时固定片材200接触的上表面(片材接合面)51a形成配线(第一配线)30的工序。
由此,能够容易地制造具备弯折部60的电子装置100B。因此,能够降低电子装置100B的制造成本。
配线30也形成在弯折部60中的与树脂成型体51的上表面51a连续的连续面60a上。由此,本体部50与弯折部60的电连接能够通过在树脂成型体51的上表面51a和弯折部60的连续面60a上形成配线30而实现。这样,不需要以往用于将柔性基板连结于刚性基板的复杂的工序,并且不需要粘接剂等部件。因此,能够降低电子装置100B的制造成本。
<实施方式5>
本发明实施方式5的电子装置是实施方式4的电子装置100B的变形例,预先在柔性基板即弯折部60形成有配线。
图9是表示实施方式5的电子装置100C的概略构成的平面图。图10是沿着图9的XI-XI线的向视剖面图。
如图9和图10所示,电子装置100C具备本体部50、弯折部60、配线(第一配线)30(30d~30h,30m,30n,30p)。在弯折部60,在与树脂成型体51的上表面51a连续的连续面60a预先形成有配线(第二配线)61(61a~61c)。
配线61例如通过具有12μm左右的厚度的铜形成。或者,可以取代铜,而是通过铝来形成配线61。
配线30m形成为将在弯折部60形成的配线61a与电子元件12b连接。配线30n形成为将在弯折部60形成的配线61b与电子元件12d连接。配线30p形成为将在弯折部60形成的配线61c与电子元件12e连接。
由此,能够使用已经形成有配线的柔性基板作为弯折部60。
电子装置100C通过与上述实施方式4的电子装置100B同样的制造方法(参照图8)制造。其中,在图8所示的第一工序中,弯折部60以配线61与临时固定片材200对置(接触)的方式粘贴于临时固定片材200。由此,在树脂的注塑成型后,配线61与树脂成型体51中与临时固定片材200接触过的上表面(片材接合面)51a处于同一平面上。其结果是,在形成配线30时,能够容易地使配线30的一部分与配线61连接。这样,能够容易地将在柔性基板即弯折部60的配线61与在树脂成型体51上形成的配线30连接。即,不需要以往用于将柔性基板连接于刚性基板的复杂的工序,并且不需要粘接剂等部件。因此,能够降低电子装置100C的制造成本。
本次公开的实施方式在所有的点仅为例示而不应当被认为是限定性的描述。本发明的范围不限于上述说明,而是通过权利要求书表示,意在包含与权利要求书均等意义和范围内的所有变更。
附图标记说明
10,40,50本体部;11,41,51树脂成型体;11a,41a,51a上表面;12(12a~12e),42(42a~42c),71,76a,76b电子元件;13a~13e,43a~43c电极;20,60弯折部;20a,60a连续面;30(30a~30p),61(61a~61c),72a,72b,77a,77c配线;70,75,80基板;81导电层;90a,90b导电性粘接层;100,100A,100B,100C电子装置;200临时固定片材;210第一模具;211凹部;220第二模具;221,222空间;230,240构造体。
Claims (9)
1.一种电子装置,其特征在于,具备:
电子元件;
树脂成型体,其埋设所述电子元件而对所述电子元件进行固定;
柔性基板,其与所述树脂成型体连接;
所述树脂成型体埋设所述柔性基板的一部分而对其进行支承,
所述树脂成型体的表面包含使所述电子元件露出的露出面,
所述柔性基板的表面包含与所述露出面连续的连续面,
所述电子装置进一步具备在所述露出面和所述连续面上形成并且与所述电子元件连接的配线。
2.根据权利要求1所述的电子装置,其中,
所述配线从所述电子元件到所述连续面上连续地形成。
3.根据权利要求1所述的电子装置,其中,
所述配线包含:
第一配线,其形成在所述露出面上,并且与所述电子元件连接;
第二配线,其形成在所述连续面上,并且与所述第一配线连接。
4.根据权利要求1所述的电子装置,其中,
所述柔性基板的材料的断裂时的伸长率比所述树脂成型体的材料的断裂时的伸长率大。
5.根据权利要求4所述的电子装置,其中,
所述柔性基板通过断裂时的伸长率为300%以上的树脂形成。
6.根据权利要求5所述的电子装置,其中,
所述树脂成型体通过断裂时的伸长率为150%以下的树脂形成。
7.根据权利要求1至6中任一项所述的电子装置,其中,
所述树脂成型体包含填充物。
8.一种电子装置的制造方法,其特征在于,具备:
将电子元件和柔性基板粘贴于片材的工序;
将所述片材配置在成型模具内,向所述成型模具内填充树脂,由此对埋设有所述电子元件和所述柔性基板的一部分的树脂成型体进行成型的工序;
在通过将所述片材从所述树脂成型体剥离而露出的所述树脂成型体中的与所述片材接触过的片材接合面形成第一配线的工序;
所述柔性基板的表面包含与所述片材接合面连续的连续面,
在形成所述第一配线的工序中,也在所述连续面上形成所述第一配线。
9.根据权利要求8所述的电子装置的制造方法,其中,
在所述柔性基板的表面预先形成第二配线,
在所述粘贴的工序中,以所述第二配线与所述片材对置的方式将所述柔性基板粘贴于所述片材,
在形成所述第一配线的工序中,以与所述第二配线连接的方式形成所述第一配线。
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PCT/JP2017/033675 WO2018092407A1 (ja) | 2016-11-21 | 2017-09-19 | 電子装置およびその製造方法 |
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WO2018092407A1 (ja) | 2018-05-24 |
TW201820943A (zh) | 2018-06-01 |
TWI660650B (zh) | 2019-05-21 |
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CN109792836A (zh) | 2019-05-21 |
EP3544392A4 (en) | 2020-01-29 |
JP2018085377A (ja) | 2018-05-31 |
US11004699B2 (en) | 2021-05-11 |
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US20200035511A1 (en) | 2020-01-30 |
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