CN109791176A - 电路板与电路板拼板 - Google Patents

电路板与电路板拼板 Download PDF

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Publication number
CN109791176A
CN109791176A CN201780060305.3A CN201780060305A CN109791176A CN 109791176 A CN109791176 A CN 109791176A CN 201780060305 A CN201780060305 A CN 201780060305A CN 109791176 A CN109791176 A CN 109791176A
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CN
China
Prior art keywords
circuit
area
circuit board
conducting wire
jackknifing
Prior art date
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Pending
Application number
CN201780060305.3A
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English (en)
Inventor
胡小冬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Publication of CN109791176A publication Critical patent/CN109791176A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种电路板(P1，P2)以及包括所述电路板(P1，P2)的电路板拼板(10)。所述电路板(P1，P2)包括设置有导电线路(102)的第一电路区(100)与至少一个第二电路区(200)，所述第一电路区(100)通过第一折裂区(B1)与所述第二电路区(200)连接，且所述第二电路区(200)随着所述第一折裂区(B1)的断裂与所述第一电路区(100)分离。所述第二电路区(200)包括有至少一个导电端(202)，所述第一折裂区(B1)包括至少一条导线(41)，所述导电端(202)通过所述导线(41)与所述第一电路区(100)中的所述的导电线路(102)电性连接。所述电路板(P1，P2)中通过可分离的电路区域上设置导电端(202)，使得测试电路无需直接设置于包括有导电线路(102)的第一电路区(100)上，使得针对第一电路区(100)中导电线路(102)的测试效率与可靠性较高。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN201780060305.3A 2017-06-28 2017-06-28 电路板与电路板拼板 Pending CN109791176A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/090467 WO2019000257A1 (zh) 2017-06-28 2017-06-28 电路板与电路板拼板

Publications (1)

Publication Number Publication Date
CN109791176A true CN109791176A (zh) 2019-05-21

Family

ID=64741917

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780060305.3A Pending CN109791176A (zh) 2017-06-28 2017-06-28 电路板与电路板拼板

Country Status (2)

Country Link
CN (1) CN109791176A (zh)
WO (1) WO2019000257A1 (zh)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101359032A (zh) * 2008-08-21 2009-02-04 Tcl天一移动通信（深圳）有限公司 一种移动通信数据终端电路板的调试装置及其方法
CN101483164A (zh) * 2008-01-11 2009-07-15 佛山普立华科技有限公司 半导体封装结构
US20090266597A1 (en) * 2008-04-28 2009-10-29 Hon Hai Precision Industry Co., Ltd. Printed circuit board preform with test facilitating means
CN101814334A (zh) * 2010-04-30 2010-08-25 福建捷联电子有限公司 双层导体扁平软排线
CN201797644U (zh) * 2010-09-21 2011-04-13 磊鑫达电子(深圳)有限公司 一种设有阻抗模块的pcb板
CN102244972A (zh) * 2010-04-08 2011-11-16 王忠诚 电路板及其应用
CN202151006U (zh) * 2011-08-03 2012-02-22 北大方正集团有限公司 一种印刷电路板在制板
CN202396020U (zh) * 2011-12-08 2012-08-22 深圳市灶星智能科技有限公司 一种电磁炉线圈盘
CN203523148U (zh) * 2013-10-18 2014-04-02 北大方正集团有限公司 一种印刷电路板拼板
CN103858218A (zh) * 2011-07-06 2014-06-11 塞莱敦体系股份有限公司 具有一探针装置的测试***及转位机构
CN105960091A (zh) * 2015-03-09 2016-09-21 阿尔卑斯电气株式会社 布线基板、布线基板的连接构造以及布线基板的连接方法
CN205726647U (zh) * 2016-04-20 2016-11-23 深圳市超跃科技有限公司 电路板
CN106405371A (zh) * 2016-08-04 2017-02-15 深圳市骏达光电股份有限公司 基于fpc钢片的一体化测试***与方法
CN106793475A (zh) * 2017-01-24 2017-05-31 广东欧珀移动通信有限公司 印刷电路板及移动终端

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203352936U (zh) * 2013-06-06 2013-12-18 常州市双进电子有限公司 具有分力孔的大拼板
CN104869752A (zh) * 2015-06-02 2015-08-26 合肥京东方光电科技有限公司 一种柔性电路板及其检测设备、检测方法和显示设备
CN106802389A (zh) * 2016-12-30 2017-06-06 上海艺时网络科技有限公司 Pcb及电子设备

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101483164A (zh) * 2008-01-11 2009-07-15 佛山普立华科技有限公司 半导体封装结构
US20090266597A1 (en) * 2008-04-28 2009-10-29 Hon Hai Precision Industry Co., Ltd. Printed circuit board preform with test facilitating means
CN101359032A (zh) * 2008-08-21 2009-02-04 Tcl天一移动通信（深圳）有限公司 一种移动通信数据终端电路板的调试装置及其方法
CN102244972A (zh) * 2010-04-08 2011-11-16 王忠诚 电路板及其应用
CN101814334A (zh) * 2010-04-30 2010-08-25 福建捷联电子有限公司 双层导体扁平软排线
CN201797644U (zh) * 2010-09-21 2011-04-13 磊鑫达电子(深圳)有限公司 一种设有阻抗模块的pcb板
CN103858218A (zh) * 2011-07-06 2014-06-11 塞莱敦体系股份有限公司 具有一探针装置的测试***及转位机构
CN202151006U (zh) * 2011-08-03 2012-02-22 北大方正集团有限公司 一种印刷电路板在制板
CN202396020U (zh) * 2011-12-08 2012-08-22 深圳市灶星智能科技有限公司 一种电磁炉线圈盘
CN203523148U (zh) * 2013-10-18 2014-04-02 北大方正集团有限公司 一种印刷电路板拼板
CN105960091A (zh) * 2015-03-09 2016-09-21 阿尔卑斯电气株式会社 布线基板、布线基板的连接构造以及布线基板的连接方法
CN205726647U (zh) * 2016-04-20 2016-11-23 深圳市超跃科技有限公司 电路板
CN106405371A (zh) * 2016-08-04 2017-02-15 深圳市骏达光电股份有限公司 基于fpc钢片的一体化测试***与方法
CN106793475A (zh) * 2017-01-24 2017-05-31 广东欧珀移动通信有限公司 印刷电路板及移动终端

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Publication number Publication date
WO2019000257A1 (zh) 2019-01-03

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Address after: Building 43, Dayun software Town, No. 8288 Longgang Avenue, Henggang street, Longgang District, Shenzhen City, Guangdong Province

Applicant after: Shenzhen Ruoyu Technology Co.,Ltd.

Address before: Building 43, Dayun software Town, No. 8288 Longgang Avenue, Henggang street, Longgang District, Shenzhen City, Guangdong Province

Applicant before: SHENZHEN ROYOLE TECHNOLOGIES Co.,Ltd.

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Application publication date: 20190521

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