CN109790424B - 导电粘合剂 - Google Patents
导电粘合剂 Download PDFInfo
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- CN109790424B CN109790424B CN201680089507.6A CN201680089507A CN109790424B CN 109790424 B CN109790424 B CN 109790424B CN 201680089507 A CN201680089507 A CN 201680089507A CN 109790424 B CN109790424 B CN 109790424B
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Abstract
本文公开了粘合剂组合物,所述粘合剂组合物包含:(a)连续绝缘粘结剂相,(b)多个导电颗粒,(c)由多个绝缘颗粒形成的第一颗粒非导电相,以及(d)由多个共聚醚酯颗粒形成的第二颗粒非导电相。本文还公开了由固化的粘合剂组合物形成的导电粘合剂,以及包含该导电粘合剂的电子部件或制品。
Description
技术领域
本发明涉及粘合剂组合物、导电粘合剂、和包含该导电粘合剂的电子部件或制品。
背景技术
导电粘合剂(ECA)已广泛用于电子工业中。典型地,ECA由分散在聚合物粘结剂体系中的导电颗粒构成,其可以在两个电子部件之间提供粘结性和导电性。并且较高的导电性需要较高的导电颗粒含量。然而,较高的导电颗粒含量还负面地影响ECA的机械强度。一种解决方案是在ECA中包括颗粒绝缘相,如在以下中公开的那些:美国专利申请公布US2010/0221533;US 2014/0183715;和US 2010/0012358。然而,仍然需要开发具有进一步改善的粘结强度,同时保持足够导电性的ECA。
发明内容
本文提供了粘合剂组合物,所述粘合剂组合物包含:(a)连续绝缘粘结剂相,其由重量比为约25:75-90:10的至少一种含氟弹性体和至少一种乙烯/(甲基)丙烯酸烷基酯共聚物弹性体的混合物形成,(b)多个导电颗粒;(c)第一颗粒非导电相,其包含多个绝缘颗粒,以及(d)第二颗粒非导电相,其包含多个共聚醚酯颗粒,其中,i)所述导电颗粒、所述绝缘颗粒、和所述共聚醚酯颗粒分散在所述连续绝缘粘结剂相中;ii)所述第一颗粒非导电相与该第二颗粒非导电相的体积比是约60:40-20:80;iii)包含在所述第二颗粒非导电相中的所述共聚醚酯颗粒具有100℃-220℃之间的熔点;以及iv)包含在所述第一颗粒非导电相中的所述绝缘颗粒由无机材料或交联聚合物或熔点比所述共聚醚酯颗粒高至少约20℃的高熔点聚合物形成,具有等于约1.7或更小的标准偏差σp(表达为D84.13/D50)值,具有约为导电颗粒的至少1.2倍的粒度分布D50,并且具有范围从约10-80μm的粒度分布D99。
在粘合剂组合物的一个实施例中,连续绝缘粘结剂相以约5-45wt%的水平存在,多个导电颗粒以约30-80wt%的水平存在,并且第一和第二颗粒非导电相以约5-70wt%的水平存在,其中所有组分的重量总计为100wt%。
在粘合剂组合物的另一个实施例中,连续绝缘粘结剂相以约8-45wt%的水平存在,多个导电颗粒以约40-70wt%的水平存在,并且第一和第二颗粒非导电相以约7-60wt%的水平存在,其中所有组分的重量总计为100wt%。
在粘合剂组合物的又一个实施例中,第一颗粒非导电相与第二颗粒非导电相的体积比是约55:45-25:75。
本文进一步提供了由上文公开的粘合剂组合物形成的粘合剂膜。
本文又进一步提供了通过固化上述粘合剂组合物获得的导电粘合剂。
在导电粘合剂的一个实施例中,粘合剂组合物在约100℃-250℃的温度和约0.5-10MPa的压力下固化。
在导电粘合剂的另一个实施例中,粘合剂组合物在约120℃-250℃的温度和约1-10MPa的压力下固化。
本文又进一步提供了包含上文公开的导电粘合剂的电子部件。
具体实施方式
本文公开了粘合剂组合物,所述粘合剂组合物包含:(a)连续绝缘粘结剂相,(b)多个导电颗粒,(c)由多个绝缘颗粒形成的第一颗粒非导电相,以及(d)由多个共聚醚酯颗粒形成的第二颗粒非导电相。
连续绝缘粘结剂相
连续绝缘粘结剂相由至少一种含氟弹性体和至少一种乙烯/(甲基)丙烯酸烷基酯共聚物弹性体(也称为AEM橡胶)的共混物形成或包含所述共混物。
基于含氟弹性体的总重量,本文使用的含氟聚合物可以含有至少约53wt%的氟,或至少约64wt%的氟。
具体地,本文使用的含氟弹性体可以是含偏二氟乙烯的含氟弹性体,基于含氟弹性体的总重量,所述含氟弹性体含有约25-70wt%的偏二氟乙烯(VF2)共聚单元。在此类实施例中,含氟弹性体的剩余单元由一种或多种不同于偏二氟乙烯的另外的共聚单体构成。此类一种或多种不同于偏二氟乙烯的另外的聚合单体可以选自含氟烯烃、含氟乙烯基醚、烃烯烃、及其混合物。
可与偏二氟乙烯共聚的含氟烯烃包括但不限于六氟丙烯(HFP)、四氟乙烯(TFE)、1,2,3,3,3-五氟丙烯(1-HPFP)、三氟氯乙烯(CTFE)、和氟乙烯。
可与偏二氟乙烯共聚的含氟乙烯基醚包括但不限于全氟(烷基乙烯基)醚(PAVE)。适合用作单体的PAVE包括具有下式的那些
CF2=CFO(Rf’O)n(Rf”O)mRf (I)
其中Rf’和Rf”是具有2-6个碳原子的不同直链或支链全氟亚烷基;m和n独立地是0-10的整数;并且Rf是具有1-6个碳原子的全氟烷基。
一类优选的全氟(烷基乙烯基)醚包括具有下式的那些:
CF2=CFO(CF2CFXO)nRf (II)
其中X是F或CF3;n是0-5的整数;并且Rf是具有1-6个碳原子的全氟烷基。
最优选的一类全氟(烷基乙烯基)醚包括其中n是0或1且Rf含有1-3个碳原子的那些醚。此类全氟化醚的实例包括全氟(甲基乙烯基)醚(PMVE)和全氟(丙基乙烯基)醚(PPVE)。其他有用的单体包括具有下式的化合物
CF2=CFO[(CF2)mCF2CFZO]nRf (III)
其中Rf是具有1-6个碳原子的全氟烷基;m是0或1;n是0-5的整数;并且Z是F或CF3。该类的优选成员是其中Rf是C3F7;m是0;并且n是1的那些。
附加的全氟(烷基乙烯基)醚单体包括具有下式的那些
CF2=CFO[(CF2CF{CF3}O)n(CF2CF2CF2O)m(CF2)p]CxF2x+i (IV)
其中m和n独立地是0-10的整数;p是0-3的整数;并且x是1-5的整数。
该类的优选成员包括其中n是0或1;m是0或1;并且x是1的化合物。
有用的全氟(烷基乙烯基醚)的其他实例包括:
CF2=CFOCF2CF(CF3)O(CF2O)mCnF2n+i (V)
其中n是1-5的整数;m是1-3的整数;并且其中,优选地,n是1。
如果PAVE的共聚单元存在于本文使用的含氟弹性体中,则基于含氟弹性体的总重量,PAVE含量通常范围从约25wt%至约75wt%。如果使用PMVE,则本文使用的含氟弹性体优选地含有约30wt%与约55wt%之间的共聚PMVE单元。
本文使用的含氟弹性体还可以任选地包含一种或多种固化部位单体的单元。适合的固化部位单体的实例包括但不限于:i)含溴烯烃;ii)含碘烯烃;iii)含溴乙烯基醚;iv)含碘乙烯基醚;v)1,1,3,3,3-五氟丙烯(2-HPFP);和vi)非共轭二烯。
溴化固化部位单体可以含有其他卤素,优选氟。溴化烯烃固化部位单体的实例是CF2=CFOCF2CF2CF2OCF2CF2Br;溴三氟乙烯;4-溴-3,3,4,4-四氟-1-丁烯(BTFB);溴乙烯;1-溴-2,2-二氟乙烯;全氟烯丙基溴;4-溴-1,1,2-三氟-1-丁烯;4-溴-1,1,3,3,4,4,-六氟丁烯;4-溴-3-氯-1,1,3,4,4-五氟丁烯;6-溴-5,5,6,6-四氟己烯;4-溴全氟-1-丁烯;和3,3-二氟丙烯基溴。本文有用的溴化乙烯基醚固化部位单体包括2-溴-全氟乙基全氟乙烯基醚、分类CF2Br-Rf-O-CF=CF2的氟化化合物(其中Rf是全氟亚烷基,如CF2BrCF2O-CF=CF2)、和分类ROCF=CFBr或ROCBr=CF2的氟乙烯基醚(其中R是低级烷基基团或氟烷基基团,如CH3OCF=CFBr或CF3CH2OCF=CFBr)。
适合的碘化固化部位单体包括具有下式的碘化烯烃:CHR=CH-Z-CH2CHR-I,其中R是-H或-CH3;Z是如在美国专利5,674,959中公开的C1-C18(全)氟亚烷基,直链或支链,任选地含有一个或多个醚氧原子,或(全)氟聚氧亚烷基。有用的碘化固化部位单体的其他实例是具有下式的不饱和醚:I(CH2CF2CF2)nOCF=CF2和ICH2CF2O[CF(CF3)CF2O]nCF=CF2等,其中n是1-3的整数,如美国专利5,717,036中所公开。此外,适合的碘化固化部位单体包括碘乙烯、4-碘-3,3,4,4-四氟-1-丁烯(ITFB);3-氯-4-碘-3,4,4-三氟丁烯;2-碘-1,1,2,2-四氟-1-(乙烯氧基)乙烷;2-碘-1-(全氟乙烯氧基)-l,1,-2,2-四氟乙烯;1,1,2,3,3,3-六氟-2-碘-1-(全氟乙烯氧基)丙烷;2-碘乙基乙烯基醚;3,3,4,5,5,5-六氟-4-碘戊烯;碘三氟乙烯、和美国专利4,694,045中公开的那些。烯丙基碘和2-碘-全氟乙基全氟乙烯基醚也是有用的固化部位单体。
非共轭二烯固化部位单体的实例包括但不限于1,4-戊二烯;1,5-己二烯;1,7-辛二烯;3,3,4,4-四氟-1,5-己二烯;和其他,如加拿大专利2,067,891和欧洲专利0784064A1中公开的那些。适合的三烯是8-甲基-4-亚乙基-1,7-辛二烯。在上文列出的固化部位单体中,对于其中含氟弹性体将用过氧化物固化的情况,优选的化合物包括4-溴-3,3,4,4-四氟-1-丁烯(BTFB);4-碘-3,3,4,4-四氟-1-丁烯(ITFB);烯丙基碘;和溴三氟乙烯。当含氟弹性体将用多元醇固化时,2-HPFP是优选的固化部位单体。然而,为了用多元醇固化,在偏二氟乙烯和六氟丙烯的共聚物中不需要固化部位单体。
当存在于本文使用的含氟弹性体中时,基于含氟弹性体的总重量,固化部位单体的单元典型地以约0.05-10wt%、或约0.05-5wt%、或约0.05-3wt%的水平存在。
另外,由于在制备含氟弹性体期间使用链转移剂或分子量调节剂,含碘端基、含溴端基或其混合物可以任选地存在于一个或两个含氟弹性体聚合物链端处。计算链转移剂(当采用时)的量以使含氟弹性体中的碘或溴水平在约0.005-5wt%、或约0.05-3wt%的范围内。
链转移剂的实例包括含碘化合物,其导致在聚合物分子的一个或两个端部处掺入结合的碘。二碘甲烷;1,4-二碘全氟-正丁烷;以及1,6-二碘-3,3,4,4,四氟己烷是此类试剂的代表。其他碘化链转移剂包括1,3-二碘全氟丙烷;1,6-二碘全氟己烷;1,3-二碘-2-氯全氟丙烷;1,2-二(碘二氟甲基)-全氟环丁烷;一碘全氟乙烷;一碘全氟丁烷;2-碘-1-氢全氟乙烷等。还包括在欧洲专利0868447A1中公开的氰基碘链转移剂。特别优选的是二碘化链转移剂。溴化链转移剂的实例包括1-溴-2-碘全氟乙烷;1-溴-3-碘全氟丙烷;1-碘-2-溴-1,1-二氟乙烷和其他,如在美国专利5,151,492中公开的那些。
适合在本文使用的含氟弹性体中使用的其他链转移剂包括在美国专利3,707,529中公开的那些。此类试剂的实例包括异丙醇、丙二酸二乙酯、乙酸乙酯、四氯化碳、丙酮、和十二烷基硫醇。
本文可以使用的特定含氟弹性体包括但不限于具有至少约53wt%的氟并且包含以下的共聚单元的那些:i)偏二氟乙烯和六氟丙烯;ii)偏二氟乙烯、六氟丙烯、和四氟乙烯;iii)偏二氟乙烯、六氟丙烯、四氟乙烯、和4-溴-3,3,4,4-四氟-1-丁烯;iv)偏二氟乙烯、六氟丙烯、四氟乙烯、和4-碘-3,3,4,4-四氟-1-丁烯;v)偏二氟乙烯、全氟(甲基乙烯基)醚、四氟乙烯、和4-溴-3,3,4,4-四氟-1-丁烯;vi)偏二氟乙烯、全氟(甲基乙烯基)醚、四氟乙烯、和4-碘-3,3,4,4-四氟-1-丁烯;或vii)偏二氟乙烯、全氟(甲基乙烯基)醚、四氟乙烯、和1,1,3,3,3-五氟丙烯。
本文使用的含氟弹性体典型地在乳液聚合方法中制备,该方法可以是连续、半批量、或批量方法。
本文有用的含氟弹性体可从各种供应商商购获得。例如,适合的含氟弹性体可以以商品名从E.I.内穆尔杜邦公司(E.I.du Pont de Nemours and Company)(美国)(下文简称“杜邦公司(DuPont)”)、或以商品名3MTM DyneonTM从3M公司(美国)、或以商品名DAI-ELTM从大金工业株式会社(Daikin Industries,Ltd.)(日本)、或以商品名FluoTrexTM从Tetralene Elastomer公司(美国)获得。
本文使用的含氟弹性体可以用交联剂交联。例如,本文使用的交联剂包括但不限于双酚化合物、二氨基化合物、氨基苯酚化合物、氨基硅氧烷化合物、氨基硅烷、苯酚硅烷、和过氧化物。示例性基于二胺的交联剂包括N,N'-二肉桂叉-1,6-六亚甲基二胺;六亚甲基二胺氨基甲酸酯;N,N-双(亚水杨基)-1,3-丙烷二胺;等。示例性基于双酚的交联剂包括2,2-双(4-羟基苯基)六氟丙烷;4’,4-(六氟异亚丙基)二酚;苄基三苯基鏻氯化物;2,4-二羟基二苯甲酮;双酚AF;等。示例性基于过氧化物的交联剂包括叔丁基枯基过氧化物;α,α-双(叔丁基过氧基-异丙基)苯;2,5-二甲基-2,5-二(叔丁基-过氧基)己烷;等。适合的交联剂还可从各种供应商商购获得,其包括但不限于可以商品名3MTM DynamarTM RubberCurative RC从3M公司,或以商品名VAROXTM从R.T.范德比尔特公司(R.T.VanderbiltCompany,Inc.)(美国),或以商品名TrigonoxTM或PerkadoxTM从阿克苏诺贝尔公司(AkzoNobel Corporate)(荷兰),或以商品名CURATIVE 20、CURATIVE 30、或CURATIVE 50从杜邦公司获得的那些。
基于乙烯/(甲基)丙烯酸烷基酯共聚物弹性体的总重量,本文使用的乙烯/(甲基)丙烯酸烷基酯共聚物弹性体衍生自乙烯的聚合单元和约45-90wt%、或约50-80wt%、或约50-75wt%至少一种(甲基)丙烯酸烷基酯的聚合单元的共聚。术语“(甲基)丙烯酸酯”在本文中用于指甲基丙烯酸的酯和/或丙烯酸的酯,并且术语“甲基”在本文中用于指-H或支链或非支链基团C1-C10烷基,并且术语“烷基”在本文中用于指-H或支链或非支链基团C1-C12烷基、C1-C20烷氧基烷基、C1-C12氰基烷基或、或C1-C12氟烷基。本文使用的(甲基)丙烯酸烷基酯基团包括但不限于丙烯酸烷基酯、甲基丙烯酸烷基酯、乙基丙烯酸烷基酯、丙基丙烯酸烷基酯、己基丙烯酸烷基酯、甲基丙烯酸烷氧基烷基酯、乙基丙烯酸烷氧基烷基酯、丙基丙烯酸烷氧基烷基酯、和己基丙烯酸烷氧基烷基酯。烷基基团可以被氰基基团或一个或多个氟原子取代。即,烷基基团可以是C1-C12氰基烷基基团或C1-C12氟烷基基团。乙烯/(甲基)丙烯酸烷基酯共聚物还可以包含多于一种(甲基)丙烯酸烷基酯的共聚单元,例如两种不同的丙烯酸烷基酯单体。例如,本文使用的乙烯/(甲基)丙烯酸烷基酯共聚物包括但不限于乙烯/丙烯酸甲酯共聚物(EMA)、乙烯/丙烯酸乙酯共聚物(EEA)、和乙烯/丙烯酸丁酯共聚物(EBA)。
此外,基于乙烯/(甲基)丙烯酸烷基酯共聚物弹性体的总重量,本文使用的乙烯/(甲基)丙烯酸烷基酯共聚物弹性体可以任选地进一步包含多达约5wt%的官能化共聚单体。本文使用的任选官能化共聚单体包括但不限于(甲基)丙烯酸酯缩水甘油酯(如甲基丙烯酸缩水甘油酯)、氯乙烯基醚、马来酸、以及具有一个或多个反应基团(包括酸、羟基、酸酐、环氧、异氰酸酯、胺、噁唑啉、氯乙酸酯、羧酸酯部分、或二烯的官能团)的其他共聚单体。还设想的是本文使用的乙烯/(甲基)丙烯酸烷基酯共聚物弹性体是通过共聚乙烯和多于一种(例如两种)(甲基)丙烯酸烷基酯单体制成的。实例是通过聚合乙烯、丙烯酸甲酯、和第二丙烯酸酯(如丙烯酸丁酯)制成的乙烯/(甲基)丙烯酸烷基酯共聚物弹性体。
乙烯/(甲基)丙烯酸烷基酯共聚物弹性体可以通过聚合物领域熟知的各种方法制备。例如,共聚可以在高压釜反应器中作为连续方法进行。或可替代地,本文使用的乙烯/(甲基)丙烯酸烷基酯共聚物可以在管式反应器等中在高压和升高温度下生产。共聚物可以通过常规方法(例如在减压和升高温度下蒸发未聚合的材料和溶剂)从产物混合物中与未反应的单体和溶剂(如果使用的话)分离。
本文使用的乙烯/(甲基)丙烯酸烷基酯共聚物弹性体可以用交联剂交联。
本文使用的交联剂包括但不限于氨基化合物和过氧化物。适用于本文的示例性过氧化物型交联剂包括但不限于甲基乙基酮过氧化物;二枯基过氧化物;2,5-二甲基-2,5-二(叔丁基过氧基)己烷;1,1-双(叔丁基过氧基)-3,3,5-三甲基环己烷;1,1-二-(叔丁基过氧基)环己烷;2,2'-双(叔丁基过氧基)二异丙基苯;4,4'-双(叔丁基过氧基)丁基戊酸酯;3,3-双(叔丁基过氧基)丁酸乙酯;叔丁基枯基过氧化物;二[(叔丁基过氧基)-异丙基]苯;叔丁基过氧化物;6,6,9,9-四甲基-3-甲基-3,正丁基-1,2,4,5-四氧基环壬烷;6,6,9,9-四甲基-3-甲基-3-乙基羰基甲基-1,2,4,5-四氧基-环壬烷;3,3-二(叔丁基过氧基)-丁酸乙酯;过氧化二苯甲酰;2,4-过氧化二氯苯甲酰;OO-叔丁基-O-(2-乙基己基)单过氧基碳酸酯;2,5-二甲基-2,5-二-(叔丁基过氧基)-3-己炔;以及其两种或更多种的组合。
本文使用的过氧化物型交联剂还可商购获得。示例性过氧化物型交联剂可以包括可以商品名PerkadoxTM从阿克苏诺贝尔公司;或以商品名LuperoxTM从阿科玛(Arkerma)公司商购获得的那些。适合的二枯基过氧化物(DCP)交联剂可以从上海方瑞达化工有限公司(Shanghai Fangruida Chemical Co.Ltd.)(中国)或杭州高新精细化工有限公司(Hangzhou Hi-Tech Fine Chemical Co.Ltd.)(中国)获得。
适用于本文的示例性氨基化合物包括但不限于六亚甲基二胺氨基甲酸酯、三亚乙基四胺、和亚甲基二苯胺。适合的氨基化合物作为交联剂可商购获得,如六亚甲基二胺氨基甲酸酯,可以商品名DiakTM No.1从杜邦公司获得;三亚乙基四胺,可从亨斯迈公司(Huntsman Corporation)(美国)获得;亚甲基二苯胺,可从西格玛奥德里奇公司(Sigma-Aldrich Co.LLC)(美国)获得。
应理解,当使用一种或多种过氧化物型交联剂时,还可以使用适合的交联助剂。本文使用的示例***联助剂包括但不限于三官能甲基丙烯酸酯(TMA)、二丙烯酸锌(ZDA)、高乙烯基聚丁二烯(HVPBD)、氰尿酸三烯丙酯(TAC)、和异氰脲酸三烯丙酯(TAIC)。适合的TMA可以商品名AgisynTM 2817(TMPTMA)或AgisynTM 2811(TMTPA)从DSM-AGI公司(台湾)获得;适合的ZDA可以商品名SR633从沙多玛公司(Sartomer Company)(法国)获得;适合的HVPBD可以商品名RiconTM154从克雷谷美国有限责任公司(Cray valley USA,LLC)(美国)获得;适合的TAIC可以商品名DiakTM7从杜邦公司获得。
该至少一种含氟弹性体和该至少一种乙烯/(甲基)丙烯酸烷基酯共聚物弹性体的共混物在粘合剂组合物中形成连续粘结剂相,并且所有其他组分均匀地分散在连续粘结剂相中。在绝缘粘结剂相中,该至少一种含氟弹性体与该至少一种乙烯/(甲基)丙烯酸烷基酯共聚物弹性体的重量比可以在约25:75-90:10、或从约30:70-90:10、或从约35:65-85:15范围内。
基于粘合剂组合物,连续绝缘粘结剂相可以以约5-45wt%、或约8-45wt%的水平存在。
导电颗粒
导电颗粒可以包括金属颗粒、金属涂覆颗粒、及其组合。适合的金属颗粒包括但不限于Au、Ag、Ni、Cu、Al、Sn、Zn、Ti、Sn、Bi、W、Pb、及其两种或更多种的合金的颗粒。用于金属涂覆颗粒的金属涂覆材料可以包括但不限于Au、Ag、Ni、以及其两种或更多种的组合。适合的金属涂覆颗粒包括但不限于Ag涂覆的玻璃珠、Ag涂覆的聚苯乙烯颗粒、Ag涂覆的Cu颗粒、Ni涂覆的Cu颗粒、以及其两种或更多种的组合。
导电颗粒的粒度分布D50可以在约1-20μm、或约2-10μm范围内。粒度分布D50还被称为粒度分布的中值直径或中值,其是累积分布中50体积%处的粒径的值。例如,如果D50=5.4μm,则样品中的50体积%的颗粒具有大于5.4μm的直径,并且50体积%的颗粒具有小于5.4μm的直径。同样,粒度分布D10是累积分布中10体积%处的粒径的值;粒度分布D84.13是累积分布中84.13体积%处的粒径的值;并且粒度分布D99是累积分布中99体积%处的粒径的值。一组颗粒的粒度分布可以使用光散射方法遵循例如ASTM B822-10来确定。
基于粘合剂组合物的总重量,导电颗粒可以以约30-80wt%、或约40-70wt%、或约45-65wt%的水平存在。
第一颗粒非导电相
包含在粘合剂组合物中的第一颗粒非导电相包含多个绝缘颗粒或由其形成,所述绝缘颗粒在适当的工艺条件下不可变形。具体地,当在电子部件中使用时,粘合剂组合物的粘结剂相将交联成粘结剂基质,应理解,聚合物颗粒在这种交联(或固化)过程中将不熔化或变形。
本文使用的无机颗粒包括但不限于金属氧化物颗粒、二氧化硅颗粒、砂颗粒、矿物颗粒、陶瓷颗粒、及其混合物。
本文公开的聚合物颗粒包含高熔点聚合物或交联聚合物或由其形成。
本文使用的交联聚合物包括但不限于交联聚(甲基丙烯酸甲酯)(PMMA)、交联聚二甲基硅氧烷(硅酮)、交联聚苯乙烯(PS)、交联聚乙酸乙烯酯(PVA)、交联甲基丙烯酸缩水甘油酯/甲基丙烯酸甲酯(GMA/MMA),以及其两种或更多种的组合。
本文使用的高熔点聚合物的熔点比共聚醚酯颗粒的熔点高至少约20℃。本文使用的高熔点聚合物包括但不限于聚酰胺6、聚酰胺66、聚四氟乙烯(PTFE)、聚醚酮(PEK)、聚醚醚酮(PEEK)、聚亚苯基亚硫酸酯(polyphenylenesulfite)(PPS)、聚酰亚胺(PI)、聚醚砜(PES)、聚苯砜(PPSU)、以及其两种或更多种的组合。
根据本公开内容,高熔点聚合物的熔点范围为约150℃-450℃、或约170℃-400℃。更具体地,需要本文使用的高熔点聚合物的熔点比用于形成共聚醚酯颗粒的共聚醚酯的熔点高至少20℃。
根据本公开内容,绝缘颗粒的粒度分布D50可以是导电颗粒的粒度分布D50的至少约1.2倍,并且可以在约1.5-80μm的范围内,并且绝缘颗粒的粒度分布D99可以在约10-80μm的范围内。此外,绝缘颗粒的标准偏差σp可以是约1.7或更小。标准偏差σp,表示为D84.13/D50,用于描述一组颗粒的粒度的多样性。具有宽范围粒度的一组颗粒的标准偏差σp大于具有窄范围粒度的那些颗粒的标准偏差σp。获得具有各种粒度分布的颗粒可以通过任何适合的方法实现,如通过筛分。
第二颗粒非导电相
包含在粘合剂组合物中的第二颗粒非导电相包含多个共聚醚酯颗粒或由其形成。
本文使用的共聚醚酯可以是具有多个通过酯键头尾连接的重复长链酯单元和重复短链酯单元的共聚物,长链酯单元由式(I)表示:
并且该短链酯单元由式(II)表示:
其中,
G是在从数均分子量为约400-6000的聚(环氧烷)二醇中除去末端羟基基团后剩余的二价基团;
R是在从数均分子量为约300或更小的二元羧酸中除去羧基基团后剩余的二价基团;
D是在从数均分子量为约250或更小的二醇中除去羟基基团后剩余的二价基团;并且
其中,
该至少一种共聚醚酯含有约1-85wt%的重复长链酯单元和约15-99wt%的重复短链酯单元。
在一个实施例中,本文公开的组合物中使用的共聚醚酯含有约5-80wt%的重复长链酯单元和约20-95wt%的重复短链酯单元。
在另一个实施例中,本文公开的组合物中使用的共聚醚酯含有约10-75wt%的重复长链酯单元和约25-90wt%的重复短链酯单元。
在又另一个实施例中,本文公开的组合物中使用的共聚醚酯含有约40-75wt%的重复长链酯单元和约25-60wt%的重复短链酯单元。
如本文所用,术语“长链酯单元”是指长链二醇与二元羧酸的反应产物。适合的长链二醇是具有末端羟基基团且数均分子量为约400-6000、或约600-3000的聚(环氧烷)二醇,其包括但不限于聚(四氢呋喃)二醇、聚(氧杂环丁烷)二醇、聚(环氧丙烷)二醇、聚(环氧乙烷)二醇、这些环氧烷的共聚二醇,和嵌段共聚物,如环氧乙烷封端的聚(环氧丙烷)二醇。本文使用的长链二醇还可以是两种或更多种上述二醇的组合。
如本文所用,术语“短链酯单元”是指低分子量二醇或其酯形成衍生物与二羧酸的反应产物。适合的低分子量二醇是数均分子量为约250或更低、或约10-250、或约20-150、或约50-100的那些,其包括但不限于脂族二羟基化合物、脂环族二羟基化合物、和芳族二羟基化合物(包括双酚)。在一个实施例中,本文使用的低分子量二醇是具有2-15个碳原子的二羟基化合物,如乙二醇;丙二醇;异丁二醇;1,4-四亚甲基二醇;五亚甲基二醇;2,2-二甲基三亚甲基二醇;六亚甲基二醇;十亚甲基二醇;二羟基环己烷;环己烷二甲醇;间苯二酚;对苯二酚;1,5-二羟基萘;等。在另一个实施例中,本文使用的低分子量二醇是具有2-8个碳原子的二羟基化合物。在又另一个实施例中,本文使用的低分子量二醇是1,4-四亚甲基二醇。本文有用的双酚包括但不限于双(对羟基)二苯基、双(对羟基苯基)甲烷、双(对羟基苯基)丙烷、以及其两种或更多种的混合物。
本文有用的低分子量二醇的酯形成衍生物包括衍生自上述低分子量二醇的那些,如乙二醇的酯形成衍生物(例如环氧乙烷或碳酸亚乙酯)或间苯二酚的酯形成衍生物(例如,间苯二酚二乙酸酯)。如本文所用,数均分子量限制仅涉及低分子量二醇。因此,本文还可以使用作为二醇的酯形成衍生物并且数均分子量大于250的化合物,条件是对应的二醇的数均分子量为约250或更低。
可用于与上述长链二醇或低分子量二醇反应的“二羧酸”是那些低分子量(即,数均分子量为约300或更低、或约10-300、或约30-200、或约50-100)脂族、脂环族、或芳族二羧酸。
本文使用的术语“脂族二羧酸”是指具有各自附接到饱和碳原子的两个羧基基团的那些羧酸。如果羧基基团所附接的碳原子是饱和的并且在环中,则该酸被称为“脂环族二羧酸”。本文使用的术语“芳族二羧酸”是指具有各自附接到芳环结构中的碳原子的两个羧基基团的那些二羧酸。芳族二羧酸中的两个官能羧基基团不必附接到同一芳环。当存在多于一个环时,它们可以通过脂族或芳族二价基团或二价基团如-O-或-SO2-连接。
本文有用的脂族或脂环族二羧酸包括但不限于癸二酸;1,3-环己烷二甲酸;1,4-环己烷二甲酸;己二酸;戊二酸;4-环己烷-1,2-二甲酸;2-乙基辛二酸;环戊烷二甲酸;十氢-1,5-亚萘基二甲酸;4,4’-双环己基二甲酸;十氢-2,6-亚萘基二甲酸;4,4’-亚甲基双内(环己基)羧酸;3,4-呋喃二甲酸;以及其两种或更多种的混合物。在一个实施例中,本文使用的二甲酸选自环己烷二甲酸、己二酸、及其混合物。
本文有用的芳族二羧酸包括但不限于邻苯二甲酸;对苯二甲酸;间苯二甲酸;二苯甲酸;具有两个苯核的二羧酸化合物,(如双(对羧基苯基)甲烷;对氧基-1,5-萘二甲酸;2,6-萘二甲酸;2,7-萘二甲酸;或4,4'-磺酰基二苯甲酸);和上述芳族二羧酸的C1-C12烷基和环取代衍生物(如其卤素、烷氧基、和芳基衍生物)。本文有用的芳族二羧酸还可以是例如,羟基酸,如对-(β-羟基乙氧基)苯甲酸。
在本文公开的组合物的一个实施例中,用于形成共聚醚酯组分的二羧酸可以选自芳族二羧酸。在另一个实施例中,二羧酸可以选自具有约8-16个碳原子的芳族二羧酸。在又另一个实施例中,二羧酸可以是单独的对苯二甲酸或对苯二甲酸与邻苯二甲酸和/或间苯二甲酸的混合物。
此外,本文有用的二羧酸还可以包括二羧酸的功能等价物。在形成共聚醚酯时,二羧酸的功能等价物与上述长链和低分子量二醇基本上以与二羧酸相同的方式反应。二羧酸的有用功能等价物包括二羧酸的酯和酯形成衍生物,如酰卤和酸酐。如本文所用,数均分子量限制仅涉及对应的二羧酸,而不是其功能等价物(如其酯或酯形成衍生物)。因此,本文还可以使用作为二羧酸的功能等价物并且数均分子量大于300的化合物,条件是对应的二羧酸的数均分子量为约300或更低。此外,二羧酸还可以含有任何取代基或其组合,其基本上不干扰共聚醚酯的形成和共聚醚酯在本文公开组合物中的使用。
用于形成本文公开组合物的共聚醚酯组分的长链二醇还可以是两种或更多种长链二醇的混合物。类似地,用于形成共聚醚酯组分的低分子量二醇和二羧酸还可以分别是两种或更多种低分子量二醇的混合物和两种或更多种二羧酸的混合物。在优选的实施例中,至少约70mol%的由上式(I)和(II)中的R表示的基团是1,4-亚苯基,并且至少70mol%的由上式(II)中的D表示的基团是1,4-丁烯基。当两种或更多种二羧酸用于形成共聚醚酯时,优选使用对苯二甲酸和间苯二甲酸的混合物,而当使用两种或更多种低分子量二醇时,优选使用1,4-四亚甲基二醇和六亚甲基二醇的混合物。
包含在本文公开的阻燃共聚醚酯组合物中的该至少一种共聚醚酯还可以是两种或更多种共聚醚酯的共混物。不要求共混物中包含的共聚醚酯单独满足上文对短链和长链酯单元公开的重量百分比要求。然而,在加权平均数基础上,两种或更多种共聚醚酯的共混物必须符合上文对共聚醚酯所述的值。例如,在含有等量的两种共聚醚酯的共混物中,对于共混物中约45wt%的短链酯单元的加权平均数,一种共聚醚酯可以含有约10wt%的短链酯单元,并且另一种共聚醚酯可以含有约80wt%的短链酯单元。
在一个实施例中,包含在本文公开的阻燃共聚醚酯组合物中的该至少一种共聚醚酯组分通过选自对苯二甲酸酯、间苯二甲酸酯、及其混合物的二羧酸酯与作为1,4-四亚甲基二醇的低分子量二醇和作为聚(四亚甲基醚)二醇或环氧乙烷封端的聚环氧丙烷二醇的长链二醇的共聚获得。在另一个实施例中,该至少一种共聚醚酯通过对苯二甲酸酯(例如对苯二甲酸二甲酯)与1,4-四亚甲基二醇和聚(四亚甲基醚)二醇的共聚获得。
可用于本文公开组合物的共聚醚酯可以通过本领域技术人员已知的任何适合的方法(如通过使用常规的酯交换反应)制备。
在一个实施例中,该方法包括在催化剂存在下,加热二羧酸酯(例如对苯二甲酸二甲酯)与聚(环氧烷)二醇和摩尔过量的低分子量二醇(例如1,4-四亚甲基二醇),随后蒸馏出由交换反应形成的甲醇,并继续加热直至甲醇释放完成。取决于温度和催化剂类型的选择以及所使用低分子量二醇的量,聚合可以在几分钟至几小时内完成,并导致形成低分子量预聚物。此类预聚物还可以通过许多替代的酯化或酯交换方法制备,例如,通过使长链二醇与短链酯均聚物或共聚物在催化剂存在下反应直至发生随机化。短链酯均聚物或共聚物可以通过如上所述的二甲酯(例如对苯二甲酸二甲酯)与低分子量二醇(例如1,4-四亚甲基二醇)之间,或者游离酸(例如对苯二甲酸)与乙酸乙二醇酯(例如1,4-丁二醇二乙酸酯)之间的酯交换来制备。可替代地,短链酯均聚物或共聚物可以通过从适当的酸(例如对苯二甲酸)、酸酐(例如邻苯二甲酸酐)、或酰氯(例如对苯二甲酰氯)与二醇(例如1,4-四亚甲基二醇)直接酯化来制备。或者,短链酯均聚物或共聚物可以通过任何其他适合的方法来制备,如二羧酸与环醚或碳酸酯的反应。
此外,通过蒸馏过量的低分子量二醇,可以将如上所述获得的预聚物转化为高分子量共聚醚酯。这种过程称为“缩聚”。在缩聚过程中发生另外的酯交换以增加分子量并使共聚醚酯单元的排列随机化。通常,为了获得最佳结果,在抗氧化剂(如1,6-双-(3,5-二-叔丁基-4-羟基苯酚)丙酰胺基]-己烷或1,3,5-三甲基-2,4,6-三[3,5-二-叔丁基-4-羟苄基]苯)存在下,缩聚可以在小于约1mmHg的压力和约240℃-260℃的温度下进行,并且持续少于约2小时。为了避免在高温下过度保持时间以及可能的不可逆热降解,采用催化剂进行酯交换反应是有利的。本文可以使用多种催化剂,其包括但不限于有机钛酸盐(如单独的钛酸四丁酯或与乙酸镁或乙酸钙的组合)、复合钛酸盐(如衍生自碱金属或碱土金属醇盐和钛酸酯的那些)、无机钛酸盐(如钛酸镧)、乙酸钙/三氧化锑混合物、锂和镁的醇盐、亚锡催化剂、以及其两种或更多种的混合物。
根据本公开内容,本文使用的共聚醚酯的熔点在约100℃-220℃之间。另外,选择工艺条件使得共聚醚酯颗粒在绝缘粘结剂相固化成粘结剂基质后变形。
基于粘合剂组合物的总重量,第一和第二颗粒非导电相的组合重量以约5-70wt%或约7-60wt%的水平存在。
同样根据本公开内容,第一颗粒非导电相与第二颗粒非导电相的体积比可以在约60:40-20:80、或约55:45-25:75的范围内。
粘合剂组合物
本文公开的粘合剂组合物可以通过任何适合的工艺来制备。例如,粘合剂组合物可以通过首先将粘结剂材料(含氟弹性体和乙烯/(甲基)丙烯酸烷基酯共聚物弹性体的共混物)溶解在溶剂(例如甲基异丁基酮(MIBK)和二异丁基酮(DIBK))中并且然后在溶液中混合或捏合其他组成材料来制备。同样,应理解,在粘合剂溶液中,聚合物颗粒和共聚醚酯颗粒两者都保持其原始颗粒形式并保持不同。
粘合剂膜
本文进一步公开了由上文公开的粘合剂组合物制成的粘合剂膜。任何适合的方法可以用于形成膜,包括但不限于涂覆、辊涂、浇铸、挤出等。含氟弹性体和乙烯/(甲基)丙烯酸烷基酯共聚物弹性体的共混物的挤出温度可以在约60℃-110℃的范围内。此外,如上所陈述,选择工艺条件,使得在粘合剂膜内,聚合物颗粒和共聚醚酯颗粒保持其原始颗粒形式并保持不同。
导电粘合剂和包含其的电子部件
本文公开的粘合剂组合物可以用于形成电子部件。在使用时,将粘合剂组合物加热至其固化形式。在这种固化形式中,弹性体共混物是交联的,并且连续绝缘粘结剂相变成粘结剂基质;第一绝缘颗粒保持其原始颗粒形式并保持分散在粘结剂基质中;共聚醚酯颗粒熔融并共混在粘结剂基质中;并且导电颗粒连接到网络中,使得固化的粘合剂组合物变得导电。这种固化的粘合剂组合物也可以称为导电粘合剂。
上文公开的导电粘合剂可以用于各种应用,例如,作为材料用于在导电构件(例如电极)之间形成电连接;用于形成安装的电子元件;用于在电路板上形成电路布线图案;并且用于在多个电路板上的多个电路布线图案之间形成导电连接。
包含上文公开导电粘合剂的电子部件包括但不限于CMOS相机模块、指纹模块、SIM卡座、充电连接器、天线连接器等。
在一个实施例中,本文公开的电子部件是柔性印刷电路模块。本文公开的柔性印刷电路模块包括柔性印刷电路板、粘结到柔性印刷电路板的一个或多个目标区域的导电粘合剂,以及安装在导电粘合剂上的一个或多个加强构件。柔性印刷电路板典型地包括由聚酰亚胺等制成的柔性基膜(板或基底材料)和设置在其上的布线图案。首先将如本文所公开的粘合剂组合物施加在柔性印刷电路板的目标区域上。可以通过喷墨印刷、浇铸、分配等进行粘合剂的施加。或者,可以通过简单地将粘合剂膜放置在柔性印刷电路板的目标区域上来进行粘合剂的施加。然后,将一个或多个加强构件压在粘合剂上,随后在加热和任选的压力下层压。粘合剂组合物或粘合剂膜在层压过程中固化,并且因此在加强构件与柔性印刷电路板之间提供粘结。加强构件可以由绝缘材料制成,如聚酰亚胺、聚对苯二甲酸乙二醇酯(PET)、液晶聚合物(LSP)、玻璃环氧树脂等。当导电粘合剂与柔性印刷电路的接地电极连接时,它提供电磁干扰屏蔽效应。在另一个实施例中,加强构件由导电材料制成,如不锈钢、铜、铝等,并且导电粘合剂在导电加强构件与柔性印刷电路中的电极之间提供电连接。当导电加强构件与柔性印刷电路的接地电极连接时,它还用作电磁干扰屏蔽层。
在层压过程中施加的压力可以在约0.5-15MPa或约1-10MPa的范围内,而层压温度可以设定在约100℃-250℃、或约120℃-250℃的范围内。并且重要的是,在使得形成粘合剂组合物的第一颗粒非导电相的聚合物颗粒保持未变形而形成粘合剂组合物的第二颗粒非导电相的共聚醚酯颗粒熔化并变形的条件下施加层压过程。
本文又进一步公开了包括本文公开的电子部件的制品,其包括但不限于蜂窝电话、笔记本PC和医疗设备等。
实例
材料:
·Cu/Ag:以下的粉末混合物:(i)Cu/Ag-s(以产品名TCSP0415从Join M公司(韩国)获得的涂覆有银的球形铜颗粒(D50=4.2~4.6μm,数据由供应商提供)和(ii)Cu/Ag-f(以产品名TCFL0713从Join M公司获得的涂覆有银的片状铜颗粒(D50=6.5~7.3μm,数据由供应商提供),重量比为3:2,并且测得粉末的D50为9.54μm;
·Ag-f:以产品名HC-02从昆明诺贝金属电子材料有限公司(Kunming NobelMetal Electronic Materials Co.,Ltd)(中国)获得的银片(D50=3.56μm);
·PMMA-1:以产品名AC15-F从Heyo企业有限公司(台湾)获得的半交联PMMA珠(D50=14.7;D84.13=24.24;D99=37.8;σp=1.65;密度=1.2g/cm3);
·PMMA-2:以产品名NMT-20从精彩化工有限公司(J Color Chemicals Corp.,Ltd)(中国)获得的半交联PMMA珠(D50=20.9;D84.13=32.22;D99=44.1;σp=1.54;密度=1.2g/cm3);
·PA 6T/XT:通过粉碎聚酰胺6T/XT树脂(以商品名HTN501来自杜邦公司)获得的聚酰胺粉末并使用500目筛收集(熔点=370℃;D50=16.24;D84.13=28.52;D99=46.7;σp=1.76;密度=1.2g/cm3);
·硅酮:以商品名HY-610从深圳市海扬粉体科技有限公司(Shenzhen HayondPowder Techonology Co.,Ltd.)(中国)获得的交联硅酮珠(D50=14.18;D84.13=23.24;D99=69.2;σp=1.64;密度=1.2g/cm3);
·PTFE:以商品名ZonylTM MP1300从Chemours公司(美国)获得的聚四氟乙烯粉末(熔点=327℃-342℃;D50=9.95;D84.13=20.39;D99=71.2;σp=2.05;密度=2.2g/cm3);
·Al2O3 :以产品名ZF-KK01从厦门展帆贸易有限公司(Xiamen Zhanfan TradingCo.Ltd.)获得的球形Al2O3 颗粒(D50=24.92;D84.13=35.38;D99=48.9;σp=1.42;密度=3.9g/cm3);
·玻璃:以商品名SheriglassTM 3000cp从波特产业有限责任公司(PottersIndustries LLC)(美国)获得的玻璃微球(D50=34.89;D84.13=53.93;D99=82.1;σp=1.59);
·DBPH:从阿拉丁工业公司(Aladdin Industrial Corporation)(美国)获得的2,5-二甲基-2,5-二(叔丁基过氧基)己烷;
·DCP:从国药控股股份有限公司(Sinopharm Group Co.Ltd.)(中国)购得的二枯基过氧化物;
·TMPH:从国药控股化学试剂有限公司(Sinopharm Chemical Reagent Co.,Ltd)获得的1,1-双(叔丁基过氧基)-3,3,5-三甲基环己烷;
·TAIC:以商品名DiakTM7从杜邦公司获得的异氰脲酸三烯丙酯;
·Glymo:从国药控股股份有限公司购得的γ-环氧丙氧丙基三甲氧基硅烷;
·使用Mastersizer 2000(由马尔文仪器有限公司(Malvern Instruments Ltd)(英国)制造)作为分析仪,Hydro 2000SM(A)(由马尔文仪器有限公司(英国)提供)作为附件,以及乙醇作为分散剂,测量上述材料(除非另有说明)的粒度分布D50、D84.13、和D99。并且在测量之前,将粉末混合物分散在分散剂中并超声处理半小时。
粘合剂膜:
在实例E1-E11和对比例CE1-CE23的每个中,如下制备粘合剂组合物(组分列于表1-4中):将粘结剂材料溶解在MIBK/DIBK(1/3)混合物中以形成溶液;(ii)在溶液中加入交联剂,并且以2000rpm混合1min;(iii)将导电颗粒、绝缘颗粒、和共聚醚酯颗粒加入溶液中,并且以2000rpm混合1min;(v)在PET离型膜上槽模涂覆该溶液,随后在100℃下干燥约5-30分钟。
导电粘合剂
在E1-E11和CE1-CE23的每个中,(i)将上文制备的粘合剂膜切割成4x40mm的片;(ii)通过在100℃和0.4MPa下热轧1min,在粘合剂膜上施加聚酰亚胺膜层;(iii)剥离PET离型膜;并且(iv)将“聚酰亚胺/粘合剂膜”双层膜在2.55MPa和170℃下在真空压机(由VIGOR机械有限公司制造,型号VLP-150~60)中层压60min,从而将粘合剂膜固化成导电粘合剂(ECA)膜。
然后,使用QT-70(由QUATEK公司制造)通过四探针法测量固化的ECA膜的表面电阻,同时使用Dektal XT触针轮廓仪测量固化的ECA膜的厚度。该固化的ECA条的电阻率由以下等式计算并列表于表1-4中:
ρ(电阻率)=表面电阻×厚度×几何校正
=表面电阻×厚度×3.2248/4.5324
同样在E1-E11和CE1-E23的每个中,在类似的条件下,切割粘合剂膜的片,并通过热轧在粘合剂膜的每个面上施加聚酰亚胺层,随后进行层压。因此,获得了在两层聚酰亚胺之间层压有导电粘合剂的三层膜。然后将“聚酰亚胺/ECA/聚酰亚胺”三层膜切割成10×100mm的测试样品,并使用LF PLUS通用测试机(由劳埃德仪器有限公司(LloydInstruments Ltd.)制造)测量每个样品的90°剥离强度(以50.8mm/min的速率)。结果列于表1-4中。
如表1所示,当绝缘颗粒包含在组合物中时,固化的ECA表现出低的剥离强度,而包含共聚醚酯颗粒(其中绝缘颗粒与共聚醚酯颗粒的体积比范围为约60:40-20:80)可以在保持低电阻率的同时提高剥离强度。
Claims (9)
1.一种粘合剂组合物,所述粘合剂组合物包含:(a)连续绝缘粘结剂相,其由重量比为25:75-90:10的至少一种含氟弹性体和至少一种乙烯/(甲基)丙烯酸烷基酯共聚物弹性体的混合物形成,(b)多个导电颗粒;(c)第一颗粒非导电相,其包含多个绝缘颗粒,和(d)第二颗粒非导电相,其包含多个共聚醚酯颗粒,其中,
i)所述导电颗粒、所述绝缘颗粒、和所述共聚醚酯颗粒分散在所述连续绝缘粘结剂相中;
ii)所述第一颗粒非导电相与所述第二颗粒非导电相的体积比是60:40-20:80;
iii)包含在所述第二颗粒非导电相中的所述共聚醚酯颗粒具有100℃-220℃之间的熔点;并且
iv)包含在所述第一颗粒非导电相中的所述绝缘颗粒由无机材料或交联聚合物或熔点比所述共聚醚酯颗粒高至少20℃的高熔点聚合物形成,具有表达为D84.13/D50的等于1.7或更小的标准偏差σp值,具有为所述导电颗粒的至少1.2倍的粒度分布D50,并且具有范围从10-80μm的粒度分布D99。
2.如权利要求1所述的粘合剂组合物,其中所述连续绝缘粘结剂相以5-45wt%的水平存在,所述多个导电颗粒以30-80wt%的水平存在,并且所述第一和第二颗粒非导电相以5-70wt%的水平存在,其中所有组分的重量总计为100wt%。
3.如权利要求1所述的粘合剂组合物,其中所述连续绝缘粘结剂相以8-45wt%的水平存在,所述多个导电颗粒以40-70wt%的水平存在,并且所述第一和第二颗粒非导电相以7-60wt%的水平存在,其中所有组分的重量总计为100wt%。
4.如权利要求3所述的粘合剂组合物,其中所述第一颗粒非导电相与所述第二颗粒非导电相的体积比是55:45-25:75。
5.一种粘合剂膜,所述粘合剂膜由如权利要求1-4中任一项所述的粘合剂组合物形成。
6.一种导电粘合剂,所述导电粘合剂通过固化如权利要求1-4中任一项所述的粘合剂组合物而获得。
7.如权利要求6所述的导电粘合剂,其中所述粘合剂组合物在100℃-250℃的温度和0.5-10MPa的压力下固化。
8.如权利要求7所述的导电粘合剂,其中所述粘合剂组合物在120℃-250℃的温度和1-10MPa的压力下固化。
9.一种电子部件,所述电子部件包含如权利要求6-8中任一项所述的导电粘合剂。
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CN101822131A (zh) * | 2007-10-15 | 2010-09-01 | 日立化成工业株式会社 | 电路连接用粘接膜以及电路连接结构体 |
CN102136309A (zh) * | 2006-08-25 | 2011-07-27 | 日立化成工业株式会社 | 电路连接材料、使用其的电路部件的连接结构及其制造方法 |
CN103608907A (zh) * | 2011-05-31 | 2014-02-26 | 住友电木株式会社 | 半导体装置 |
CN103923578A (zh) * | 2013-01-10 | 2014-07-16 | 杜邦公司 | 包括含氟弹性体的导电粘合剂 |
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CN102136309A (zh) * | 2006-08-25 | 2011-07-27 | 日立化成工业株式会社 | 电路连接材料、使用其的电路部件的连接结构及其制造方法 |
CN101822131A (zh) * | 2007-10-15 | 2010-09-01 | 日立化成工业株式会社 | 电路连接用粘接膜以及电路连接结构体 |
CN103608907A (zh) * | 2011-05-31 | 2014-02-26 | 住友电木株式会社 | 半导体装置 |
EP2717301A1 (en) * | 2011-05-31 | 2014-04-09 | Sumitomo Bakelite Co., Ltd. | Semiconductor device |
CN103923578A (zh) * | 2013-01-10 | 2014-07-16 | 杜邦公司 | 包括含氟弹性体的导电粘合剂 |
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