CN109786341A - 具有开关装置的功率半导体模块及其配置 - Google Patents

具有开关装置的功率半导体模块及其配置 Download PDF

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Publication number
CN109786341A
CN109786341A CN201811353118.7A CN201811353118A CN109786341A CN 109786341 A CN109786341 A CN 109786341A CN 201811353118 A CN201811353118 A CN 201811353118A CN 109786341 A CN109786341 A CN 109786341A
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Prior art keywords
substrate
power semiconductor
semiconductor modular
shell
spring
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CN109786341B (zh
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B·卡克曼
R·波普
M·莱德勒
R·施瓦茨
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Semikron GmbH and Co KG
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Semikron GmbH and Co KG
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明公开了一种具有开关装置的功率半导体模块及其配置。所述功率半导体模块包括基板、连接装置、端子装置、以及在基板法线方向上可移动地布置的按压装置，所述端子装置优选地包括负载端子和辅助端子装置，基板包括相互电隔离的导体轨迹，功率半导体元件布置于一个导体轨迹并且以导电方式与其连接，开关装置的内部电路连接由连接装置提供，按压装置包括刚性基部元件、弹性压力体、以及一个弹簧元件或多个弹簧元件，弹性压力体沿基板的法线方向从基部元件向基板突出，弹簧元件由固定地布置成与基板相对的固定的邻接件支撑，并且在基板的法线方向(N)上沿基板的方向压缩压力体，以此直接或间接地压靠基板，并因此另外压靠开关装置。

Description

具有开关装置的功率半导体模块及其配置
技术领域
本发明描述了一种具有至少一个开关装置的功率半导体模块，其也可以构成功率半导体***的基本单元。进一步描述了一种具有这种功率半导体模块的配置。
背景技术
从现有技术已知功率半导体模块及其配置，如例如在DE 10 2014 106570A1中所公开的，其中功率半导体模块配置有壳体、具有结合到壳体的基板的开关装置、布置在所述基板上的功率半导体元件、连接装置、负载端子装置、以及按压装置，该按压装置配置为相对于壳体可移动的布置。此处的基板包括第一中央连通开口和相互电绝缘的导体轨迹，其中功率半导体元件布置在一个导体轨迹上。此处的连接装置包括第一主表面和第二主表面，并且构造有导电箔。所述按压装置还包括弹性压力体，所述弹性压力体具有与所述第一连通开口对准的第二连通开口，并且具有第一切口，压力元件以突出的布置装配到所述第一切口，其中所述压力元件将压力施加到连接装置的第二主表面的一个区段，并且该区段因此在功率半导体元件的表面内沿着基板法线方向而布置于突出部。因此，第一连通开口和第二连通开口构造成容纳固定装置，所述配置中的功率半导体模块通过该固定装置而以过盈配合的方式紧固到冷却装置。
发明内容
考虑到上述情况，本发明的目的是提供一种具有至少一个开关装置的功率半导体模块及其配置，其中对开关装置的施压以特别有效的方式执行。
根据本发明，该目的通过具有以下特征的功率半导体模块和配置来实现。
根据本发明的功率半导体模块构造有开关装置，所述功率半导体模块包括基板、连接装置、端子装置(优选地包括负载端子和辅助端子装置)、以及在基板的法线方向上可移动地布置的按压装置，其中基板包括相互电隔离的导体轨迹，其中功率半导体元件布置于一个导体轨迹并且以导电方式与其连接，其中开关装置的内部电路连接由连接装置提供，其中按压装置包括刚性的基部元件、弹性压力体、以及一个弹簧元件或多个弹簧元件，其中弹性压力体在基板的法线方向上从基部元件朝向基板突出，并且其中弹簧元件由固定的邻接件支撑，所述固定的邻接件固定地布置成与基板相对，并且在基板的法线方向上沿基板的方向按压压力体从而直接或间接地压靠基板，并且因此另外压靠开关装置。
术语“固定的邻接件”自然地指完全组装状态(即，在这种类型的功率半导体模块的组装期间)，特别是对于固定体，这种情况尚未实现。“直接地压靠基板”特别地应当理解为，压力大体上直接施加到导体轨迹或基板的任何部分，而不介入任何其他物理对象。“间接地压靠基板”特别地应当理解为，压力经由物理对象(诸如功率半导体元件和/或连接装置)而间接地施加到基板上。
弹簧元件优选地构造为盘簧，或者构造为由多个盘簧构成的成堆的盘簧。
在多个盘簧的情况下，盘簧特别地可以在此组合以构成单元。具体地，盘簧可以通过附着粘合或通过弹性环绕而相互连接。
特别优选的是，基部元件在其远离基板的一侧上包括定位元件(特别是套筒型定位元件或嵌钉型定位元件)，至少一个盘簧相对于该定位元件布置，从而限制盘簧垂直于法线方向的任何移动，即，限制其不在弹簧作用的方向上的任何移动。其特定功能是相对于其余部件来对盘簧进行定位和保持，而不会损害弹簧作用。备选地，或额外地，邻接件在其面向基板的一侧上可包括具有基本相同功能的定位元件，特别是套筒型定位元件或嵌钉型定位元件，至少一个盘簧相对于该定位元件布置。在此处的特定构造中，邻接件被构造为螺栓，其通过相互对准的第一切口和第二切口而穿过按压装置和基板两者。因此，螺栓或至少一部分螺栓构成上述嵌钉。
进一步优选的是，壳体包封开关装置，并且优选地还包封按压装置，并且优选地采用杯型布置。因此，邻接件可以构造为壳体的元件。
壳体还可以有利地包括切口，端子元件穿过所述切口，并且其中第一密封装置布置在切口中，所述第一密封装置构造成保护内部空间以防止溅水。
根据适于功率半导体模块领域的常规实践，上述壳体不一定构造为在所有侧面包封基板的壳体。壳体也可以被构造为骨架壳体，特别是如果功率半导体模块构成较大***的元件，该较大***特别地包括多个功率半导体模块。在这种情况下，仅构成壳体的基本和必要元件，其中，具体地，不需要连续的侧表面。然后，不是仅由壳体提供对内部空间的保护以防止溅水，而是由其他部件提供。
在优选的构造中，上述连接装置包括箔叠层(foil stack)，其具有至少一个导电箔和至少一个电绝缘箔，其中导电箔和绝缘箔构造为交替布置。备选地，连接装置可以构造为金属模制件，优选地构造为平面金属模制件，或构造为结合带(bonding strip)。
基部元件可以由绝缘材料构成，优选地由耐高温且优选热塑性的合成材料构成，特别是由聚苯硫醚构成。备选地，基部元件也可以由金属模制件构成。弹性压力体可以由弹性体构成，优选由硅氧烷弹性体构成，特别是由交联的液态硅酮构成。
根据本发明的配置构造有上述功率半导体模块，其具有固定装置，并且配备有固定器件，其中固定器件与作为壳体元件的固定装置联接，从而将功率半导体模块紧固到固定体，使得邻接件在弹簧元件上施加第一压力，并且其中弹簧元件在按压装置的基部元件上施加第二压力，由此弹性压力体将基板按压到固定体。
进一步优选的是，第二密封装置布置在功率半导体模块的壳体和固定体之间，其中固定体优选地构造成保护内部空间以防止溅水。
固定体的优选地在此构造为冷却装置。
当然，如果没有被明确排除或本质上排除，或者与本发明的构思相矛盾，则特征或成组的分别单独描述的特征(例如，导体轨迹和功率半导体元件)可以共同存在于根据本发明的功率半导体模块或配置中。
应当理解的是，本发明的各种构造，无论它们是否结合所述功率半导体模块或所述配置来描述，都可以单独地执行或以任何期望的组合来执行，以实现改进。具体地，在不脱离本发明范围的情况下，上文和下文中所示和所述的特征不仅可以在所指示的组合中使用，而且可以进一步的组合或单独使用。
附图说明
从以下对图1至图6中示意性示出的本发明示例性实施例或其各个元件的描述中得出本发明的进一步解释说明、有利特征和特性。
图1示出在根据本发明的配置中的根据本发明的功率半导体模块的第一构造。
图2示出根据本发明的功率半导体模块的非压力负载的按压装置的截面。
图3以分解视图示出在根据本发明配置中的根据本发明的功率半导体模块的第二构造。
图4示出在根据本发明配置中的根据本发明的功率半导体模块的第三构造。
图5和图6以三维视图示出根据本发明的配置，其中图6示出图5的截面。
具体实施方式
图1示出在根据本发明的配置10中的根据本发明的功率半导体模块1的第一构造。示出根据现有技术的基本上常规设计的基板2，其具有绝缘体20，所述绝缘体20具有布置在其上的分别相互电隔离的导体轨迹22，导体轨迹22在使用中承载不同的电势，特别是负载电势，但也承载辅助电势，特别是开关装置的开关和测量电势。具体地，在典型的半桥拓扑结构的布置中，在此示出了具有负载电势的三个导体轨迹22。
在两个导体轨迹22上，分别布置功率半导体元件26，在这种情况下，根据现有技术的常规方式的功率开关构造为单独的开关(例如，MOSFET)，或者构造为具有反并联连接的功率二极管的IGBT，如此处所示。在这种情况下，功率半导体元件26在不丧失一般性并且采用根据现有技术的常规方式的情况下分别以导电方式来物质结合(优选地，通过烧结连接)到导体轨迹22。
在这种情况下，开关装置的内部连接通过连接装置3配置，连接装置3包括根据现有技术的常规箔层压件30。具体地，该箔层压件30将各个功率半导体元件26(更具体地，各个功率半导体元件26的远离基板2一侧的接触表面)连接到基板2上的导体轨迹22。在优选的配置中，箔层压件30通过烧结连接而局部地物质结合到接触表面。当然，功率半导体元件26之间和基板2上的导体轨迹22之间的连接也可以采用等同的方式构造。特别是在压力烧结连接的情况下，如所示的那样，有利的是在功率半导体元件26的边缘区域处布置绝缘体28。该绝缘体28也可以布置在导体轨迹22之间的间隙中。基板2布置在金属底座24上并且物质结合到其上，所述金属底座24优选地由铜或铜合金构成。为此目的，根据现有技术的常规方式的基板在其面向底座的一侧上可以包括另外的金属覆盖物，在此未示出该金属覆盖物。
出于外部电连接的目的，功率半导体模块1包括负载端子元件和辅助端子元件4，其中在此仅示出负载端子元件。仅通过示例的方式，这些负载端子元件4被构造为金属模制件，其接触基部物质结合到基板2上的导体轨迹22，有利地，再次通过烧结连接。在这种情况下，以根据现有技术的常规方式，外部连接通过螺纹连接40构造。原则上，连接装置3自身的元件也可以构造为负载端子元件或辅助端子元件。辅助端子元件(诸如栅极或传感器端子)可以另外以根据现有技术的常规方式构造。
功率半导体模块1还包括壳体6，负载端子元件4通过切口610突出到外部，其中，在相应的切口610中，布置第一密封装置62(在这种情况下其被构造为交联的硅凝胶)，以便保护功率半导体模块1的内部防止溅水。构成固定装置602的壳体6的边缘区域通过固定器件(在这种情况下，固定器件为螺纹连接)而连接到固定体(在这种情况下，所述固定体为冷却装置8，更具体地为空气冷却装置)。该螺纹连接构造为螺栓82，固定器件布置在冷却装置8中的盲孔80中，该盲孔80设有螺纹。在底板24和冷却装置8之间，布置有半固态导热层800，其厚度为约10μm的量级。壳体6还包括嵌钉68，其突出到冷却装置8中的相关切口中，并且设计成防止壳体6相对于冷却装置8的任何旋转，特别是在配置10的背景下的功率半导体模块1的组装上。
按压装置5布置在基板2的法线方向N上，并且配置为相对于基板2可移动。该按压装置5包括基部元件50，该基部元件50构造成刚性的，并且特别是构造成抗弯曲的设计。为此目的，它由耐高温的聚苯硫醚构成，因此也是电绝缘的。该基部元件50在其面向基板2的一侧上包括多个切口，其中，在所述切口中，以分别从其中突出的方式布置有弹性压力体52。基部元件50在其远离基板2的一侧上还包括嵌钉500，其在这种情况下与基部元件一体地形成，并且其构成定位元件。
多个成堆的的盘簧54及其相关的切口布置在该嵌钉500上并构成按压装置5的弹簧元件。这些盘簧54在基板2的法线方向N上以可移动的布置而构造到嵌钉500上。嵌钉500还防止任何横向位移(即，垂直于所述盘簧54的法线方向N的任何移动)，并且特别地还防止各个盘簧相对于彼此的任何移动。功率半导体模块1的壳体6组装状态下作为邻接件，该壳体6在盘簧54上施加压力。因此，通过按压装置5的盘簧54，其压力体52压靠连接装置3和基板2而被压缩，并且因此间接地压靠底座24，从而在基板2和底座24之间具有显著的热接触，特别是用于从功率半导体元件26排出热量。这种类型的按压装置5(即，特别是在基部元件50中弹性压力体52的布置)的生产优选地通过双组分喷射模塑成型方法来执行。在这种情况下，弹性压力体52由交联的液体硅橡胶(liquid silicone rubber，LSR)构成。为了组装功率半导体模块1，将盘簧54简单地布置于嵌钉500。
图2示出根据本发明的功率半导体模块的非压力加载的按压装置5的截面。其与根据图1的按压装置的不同之处在于，基部元件50(而不是嵌钉)包括一个或者(如此处未示出的)多个套筒型定位元件502。该套筒型定位元件502实现与根据图1的嵌钉型定位元件相同的功能，并且与基部元件50一体地构造，多个盘簧54布置在所述套筒型定位元件502中。
图3以分解视图示出在根据本发明的配置10中的根据本发明的功率半导体模块1的第二构造。
在此示出的功率半导体模块1与参照图1描述的功率半导体模块的主要不同之处在于，该功率半导体模块1不包括底座，并且端子元件4优选地在此构造为根据本领域内的常规设计的压配触点。此外，在不丧失一般性的情况下，连接装置3以根据现有技术的常规方式在此由多个平面金属模制件32构成。在基板2和冷却装置8之间布置有半固态导热层800，其厚度为约5μm的量级。
在这种情况下，壳体6另外包括嵌钉型定位元件600或简称为嵌钉，其原则上实现上述功能，即，弹簧元件的定位，该弹簧元件被构造为成堆的盘簧54。按压装置5的刚性的基部元件50包括切口504，壳体6上的嵌钉600突出到该切口504中，以便进一步组装，从而将盘簧54的位置固定在所需的任何位置。按压装置5还包括附加金属层，其构造为平面金属部件506。其对基部元件50执行稳定功能，并且布置在其远离基板2的表面上。
通过功率半导体模块1的壳体6到冷却装置8的螺纹连接80，82而构成压力级联(pressure cascade)。在这种情况下，壳体6在按压装置5的弹簧元件54上施加第一压力61。壳体6的边缘区域(在这种情况下，其也构成固定装置602)与冷却装置8接合。因此，壳体6(在这种情况下，其构成按压装置5的邻接件)相对于基板2而以固定方式布置，所述基板2与冷却装置8的上侧联接，所述壳体6相对于基板2在其法线方向N上可移动，以便进一步组装功率半导体模块1。
弹簧元件54转而在基部元件50上施加第二压力62，在这种情况下更具体地在平面金属部件506上施加第二压力62。布置在基部元件50中的弹性压力体52在连接装置3上施加第三压力63。在功率半导体模块1的这种构造中，连接装置3物质结合到相应的功率半导体元件26。类似地，相应的功率半导体元件26物质结合到基板2，更具体地，结合到基板2上的相关导体轨迹22。通过连接装置3、功率半导体元件26和基板2的这种组合，第四压力64现在被传递到冷却装置8。
该压力级联的压力方向在基板2的法线方向N上取向。该构造构成了极好的选择，但不一定是压力级联的唯一可能的构造，如在这种情况下，基板2和冷却装置8之间的接触达到其最大值，功率半导体元件26布置成法线方向N上对准。因此，在使用中由该功率半导体元件26产生的热量可以最佳地排出到冷却装置8，因为此点(即，功率半导体元件26的区域中)的压力接触处于其最大值，从而产生最有效的热接触。
为了良好的运行，由压力体52施加到基板2的压力需要在不同的温度下保持恒定。这通过采用成堆的盘簧54来实现。通常情况下，由压力体52施加的压力随着温度的升高而增加。这由具有适当的设计和数量的盘簧54抵消，其中，盘簧54对与温度升高相关的压力的上升进行补偿。
图4示出在根据本发明的配置10中的根据本发明的功率半导体模块1的第三构造，其中未引入压力。该功率半导体模块1与根据图3的构造的不同之处在于，该功率半导体模块1不一定包括壳体，如在此所示。它进一步在引入压力的方式上不同。
按压装置5的基部元件50和基板2、以及另外必要时的连接装置3分别以相互对准的方式包括全厚度切口208和切口508，螺栓84穿过该切口208和切口508。该螺栓84构造成联接在冷却装置8中的盲孔80中，该盲孔80与所述切口208和切口508对准，并且通过构造在其中的螺纹固定。
在这种情况下，螺栓84(更具体地，螺栓头)用作向按压装置5(更具体地，成堆布置的多个盘簧54中最上面的盘簧)施加压力的邻接件。螺栓轴的第一部分同时构成嵌钉型定位元件。通过螺栓84的布置，盘簧54在垂直于基板2的法线方向N的方向上的移动受到限制。
图5和图6以三维视图示出根据本发明的配置10，其中图6示出图5的截面。示出构造为冷却装置的固定体8，在这种情况下其是空气冷却装置，在固定体8上布置具有基板2的开关装置和连接装置，所述基板2具有多个功率半导体元件。该基板2由按压装置按压，在冷却装置8上，该按压装置具有刚性的基部元件50、多个弹性压力体和弹簧元件54。功率半导体模块1还包括负载端子元件和辅助端子元件4。
借助于金属模制件引入压力，该金属模制件构成功率半导体模块1的壳体6，该壳体6以杯型布置来包封基板2，并且包括平行于冷却装置8的表面取向的边缘。在基板2上方的区域中，在该构造中，多个全厚度切口610布置在壳体6中，负载端子元件和辅助端子元件4通过该切口610突出。在这些切口610的边缘与其相关的负载端子元件和辅助端子元件4之间布置有第一密封装置62，该第一密封装置62以根据现有技术的常规方式构造，防止溅水通过所述切口610。
在金属模制件6的边缘和冷却装置8的表面之间布置有第二密封装置64，该第二密封装置64构造成保护功率半导体模块1的内部空间，防止在该位置处的溅水。
借助于第一密封装置62和第二密封装置64，根据IP67，在具有冷却装置8的该配置10中功率半导体模块1的整个内部空间被安全地保护以防止溅水。基于需求，通过等效的第一密封装置和第二密封装置，防护等级也可以调节到不同的防护等级，包括例如IP65或IP68。
通过构成固定装置的边缘中的切口，构造为螺栓82的固定器件布置为通过金属模制件6的角部中的切口，所述螺栓82将金属模制件6固定到冷却装置8，形成密封，并在按压装置的弹簧元件54上产生压力。
根据图1至图6的示例性实施例中的所有上述弹性压力体52由交联的液体硅树脂构成，基部元件50由聚苯硫醚构成，弹簧元件(即，盘簧54)由弹簧钢制成。

Claims (17)

1.一种功率半导体模块(1)，该功率半导体模块(1)具有开关装置(100)，该功率半导体模块(1)包括基板(2)、连接装置(3)、端子装置(4)、以及在基板(2)的法线方向(N)上能够移动地布置的按压装置(5)，
其中基板(2)包括相互电隔离的导体轨迹(22)，其中功率半导体元件(26)布置于一个导体轨迹(22)并以导电方式连接到该导体轨迹(22)，
其中开关装置(100)的内部电路连接由连接装置(3)提供，
其中按压装置(5)包括刚性的基部元件(50)、弹性压力体(52)、以及一个弹簧元件(54)或多个弹簧元件(54)，其中弹性压力体(52)沿基板(2)的法线方向(N)从基部元件(50)朝向基板突出，并且其中弹簧元件(54)由固定的邻接件支撑，该固定的邻接件固定地布置成与基板(2)相对，并且在基板(2)的法线方向(N)上沿基板的方向按压压力体(52)，使其间接地或直接地压靠基板。
2.根据权利要求1所述的功率半导体模块，其特征在于所述弹簧元件(54)被构造为盘簧，或者被构造为由多个盘簧构成的成堆的盘簧。
3.根据权利要求2所述的功率半导体模块，其特征在于所述基部元件(50)在其远离所述基板(2)的侧面上包括定位元件(500，502)，至少一个盘簧(54)相对于该定位元件(500，502)布置，从而限制盘簧(54)垂直于法线方向(N)的任何移动。
4.根据权利要求3所述的功率半导体模块，其特征在于,该定位元件(500，502)是套筒型定位元件或嵌钉型定位元件。
5.根据权利要求2所述的功率半导体模块，其特征在于所述邻接件在面向所述基板(2)的一侧上包括定位元件(600)，至少一个盘簧(54)相对于该定位元件(600)布置。
6.根据权利要求5所述的功率半导体模块，其特征在于，该定位元件(600)是套筒型定位元件或嵌钉型定位元件。
7.根据权利要求5所述的功率半导体模块，其特征在于所述邻接件被构造为螺栓(84)，所述螺栓(84)通过相互对准的切口(208，508)而穿过所述按压装置和所述基板两者。
8.根据前述权利要求中任一项所述的功率半导体模块，其特征在于壳体(6)包封所述开关装置。
9.根据权利要求8所述的功率半导体模块，其特征在于，壳体(6)包封所述按压装置。
10.根据权利要求8所述的功率半导体模块，其特征在于，壳体(6)采用杯型布置。
11.根据权利要求8所述的功率半导体模块，其特征在于所述邻接件被构造为所述壳体(6)的元件。
12.根据权利要求8所述的功率半导体模块，其特征在于所述壳体(6)由金属材料构成。
13.根据权利要求8所述的功率半导体模块，其特征在于所述壳体(6)包括切口(610)，所述端子元件(4)穿过所述切口(610)，并且其中第一密封装置(62)布置于切口(610)，所述第一密封装置(62)被构造为保护内部空间以防止溅水。
14.一种配置(10)，其具有根据前述权利要求的任一项所述的功率半导体模块(1)，所述配置(10)具有固定装置(602)，并具有固定器件(82)，其中固定器件(82)与固定装置(602)联接，所述固定装置(602)为壳体(6)，从而将功率半导体模块(1)紧固到固定体(8)，使得邻接件在弹簧元件(54)上施加第一压力(60)，并且其中弹簧元件(54)在按压装置(5)的基部元件(50)上施加第二压力，由此弹性压力体(52)将基板(2)按压到固定体(8)。
15.根据权利要求14所述的配置(10)，其特征在于第二密封装置(64)布置在所述功率半导体模块(1)的所述壳体(6)与所述固定体(8)之间。
16.根据权利要求15所述的配置(10)，其特征在于，所述第二密封装置(64)被构造为保护内部空间以防止溅水。
17.根据权利要求14或15所述的配置(10)，其特征在于所述固定体(8)被构造为冷却装置。
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