CN109769380B - High-performance temperature equalizing device - Google Patents
High-performance temperature equalizing device Download PDFInfo
- Publication number
- CN109769380B CN109769380B CN201910147731.1A CN201910147731A CN109769380B CN 109769380 B CN109769380 B CN 109769380B CN 201910147731 A CN201910147731 A CN 201910147731A CN 109769380 B CN109769380 B CN 109769380B
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- Prior art keywords
- liquid suction
- bottom plate
- support column
- apron
- suction core
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- 239000007788 liquid Substances 0.000 claims abstract description 64
- 238000005219 brazing Methods 0.000 claims abstract description 28
- 238000003466 welding Methods 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 230000010354 integration Effects 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 2
- 238000010008 shearing Methods 0.000 claims description 2
- 238000002791 soaking Methods 0.000 claims 2
- 238000012546 transfer Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Disinfection, Sterilisation Or Deodorisation Of Air (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a high performance samming device, including bottom plate, wick and apron, the apron sets firmly on the bottom plate, be equipped with square type cavity between apron and bottom plate, the wick is located the cavity, distribute the support column in the cavity, the support column runs through and sets up on the wick, the both ends of support column are respectively with bottom plate, apron fixed connection, fixedly cover has a fixed cover on the support column, the one end terminal surface of fixed cover is laminated and fixed connection with the apron, fixed cover inner wall and apron form the recess, the support column passes through vacuum brazing and is connected with lateral wall and the bottom surface fixed of recess; the bottom plate and the cover plate are attached to the liquid suction core. The grooves on the cover plate are assembled with the support columns on the bottom plate, so that the brazing position is thoroughly separated from the liquid suction core, the liquid suction core is prevented from losing the capillary force function, the welding quality of vacuum brazing is improved to a great extent, and the efficient and stable performance index of the temperature equalizing device is provided; the drainage ring enables the upper liquid suction core and the cover plate to be attached more tightly, and the heat conduction capacity and the heat transfer capacity of the device are improved.
Description
Technical Field
The invention relates to a heat dissipation device, in particular to a high-performance temperature equalization device.
Background
Along with the development of science and technology, electronic equipment is rapidly developed along the direction of high heat flux and micro volume, and the heat source of the electronic equipment is usually a point heat source, and the heat productivity can not be timely transmitted out, so that the local overtemperature of the electronic equipment can be caused, and the electronic equipment is damaged.
The temperature equalizing plate has the characteristics of light weight, high heat conductivity, excellent temperature equalizing property, no need of external power and the like. The temperature equalizing plate is of a flat plate structure, various bosses can be arranged according to the heat source requirement, and the temperature equalizing plate can be directly contacted with one or more electronic devices at the same time. When the electronic equipment works and heats, the temperature equalizing plate can rapidly transfer heat to a large plane almost isothermally, so that the surface temperature of the electronic equipment is reduced.
The existing structural forms in the market of the temperature equalizing device mainly comprise two types:
one is to sinter the capillary core directly on the aluminum material, then carry out high-frequency diffusion welding, the product process is complex, the manufacturing cost is higher, and the reliability and cost reduction of the product are not guaranteed by utilizing the advanced process;
the other is that the aluminum alloy and the sintering silk screen are assembled, and then welded by using a vacuum brazing process which is mature in technology, low in cost and suitable for mass production. The four problems of the vacuum brazing manufacturing temperature equalizing device in the field are that the quality and the performance of the product are seriously restricted. Firstly, the samming device manufactured by adopting a vacuum brazing process in the field only has one layer of liquid suction core, the liquid suction core and the aluminum alloy are not subjected to vacuum brazing, and the vacuum brazing solder is paved on the opposite surface of the liquid suction core, so that the purpose of the design is mainly to separate the liquid suction core from the brazing solder, because the brazing solder is melted into a liquid state during vacuum brazing, the brazing solder is often adsorbed by the liquid suction core along a supporting column or the peripheral wall surface, the brazing surface is insufficient, the welding quality is reduced, an inner cavity has higher pressure during the working of a product, the upper surface and the lower surface of the product are bulged due to tearing of a brazing seam, and meanwhile, the capillary force function is lost due to filling of pores of the liquid suction core by the brazing solder, so that the function of the product is reduced or failed. Secondly, in order to separate the liquid absorption core from the brazing material, only one surface can be arranged on the upper surface and the lower surface of the inner cavity of the temperature equalizing device, the other surface is a brazing material laying surface, when the temperature equalizing device works, only the liquid absorption core on one surface can provide the capillary force of the working medium, and the other surface can retain a large amount of liquid working medium and cannot flow back to a heat source to absorb heat and gasify to form circulation, so that the performance of the temperature equalizing device is lower, and the improvement of the product performance is seriously restricted. Thirdly, the temperature equalizing device is applied more in the fields of aviation, aerospace, electronics and the like, the thickness of the temperature equalizing device is required to be smaller, the weight of the temperature equalizing device is required to be lighter, the thickness of the cover plate and the bottom plate is increased due to the fact that the brazing surface is arranged in the upper cover plate and the lower cover plate, the overall thickness of the temperature equalizing device is increased, the weight of the temperature equalizing device is also increased greatly, and the temperature equalizing device is not utilized widely. Fourth, in the actual use environment, the heat source is usually only on the upper surface or the lower surface, the heat absorption and gasification force of the working medium of the liquid absorption core, which is closely attached to the heat source surface, is large, the liquid working medium on the opposite surface can flow back to the lower surface of the heat source only by means of the supporting columns and the peripheral wall surfaces of the inner cavity, the backflow paths are few, the backflow efficiency is low, and the temperature equalizing capability of the product is reduced to a great extent.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a high-performance temperature equalizing device.
The utility model provides a high performance samming device, includes bottom plate, wick and apron, the apron sets firmly on the bottom plate be equipped with square type cavity between apron and the bottom plate, the wick is located in the cavity the distribution has the support column in the cavity, the support column runs through the setting on the wick, the both ends of support column respectively with bottom plate, apron fixed connection, its characterized in that: a cylindrical fixing sleeve is fixedly sleeved on the support column, one end face of the fixing sleeve is attached to and fixedly connected with the cover plate, a cylindrical groove is formed between the inner wall of the fixing sleeve and the cover plate, and the support column is fixedly connected with the side wall and the bottom face of the groove through vacuum brazing; and the bottom plate and the cover plate are attached to the liquid suction core.
The method further comprises the following steps: the liquid suction core comprises a plurality of layers of liquid suction cores, drainage rings are arranged between the adjacent liquid suction cores, the drainage rings are sleeved on the outer circumference of the fixing sleeve, the drainage rings are arranged on the fixing sleeve, end faces of two ends of each drainage ring are abutted to the liquid suction cores, the liquid suction cores are tightly pressed on a bottom plate or an end cover, poor contact between the liquid suction cores and the end cover or the bottom plate is avoided, a backflow path is increased, and backflow efficiency is improved.
The method further comprises the following steps: the support column sets up with the bottom plate integration, fixed cover one end sets up with the apron integration, the other end of fixed cover is close to the bottom plate. (the bottom plate and the cover plate are made of copper or aluminum or silver or other high thermal conductivity materials).
The method further comprises the following steps: the liquid suction core comprises an upper liquid suction core and a lower liquid suction core, and the liquid suction cores adopt composite sintering nets with different porosities.
The method further comprises the following steps: the drainage ring is a liquid suction core with single porosity, and the drainage ring is made of stainless steel, copper alloy or aluminum alloy.
Compared with the prior art, the invention has the following beneficial effects:
(1) Through set up the recess on the apron to the structural design that recess bottom surface and wick faying face are a face adopts the support column on the bottom plate to insert the assembly structure of recess on the apron simultaneously, makes braze welding department and wick thoroughly separate, has solved when vacuum brazing, and the brazing material melts to liquid by the wick absorption, makes the wick lose the problem of capillary force function.
(2) When vacuum brazing, the brazing material is completely melted into liquid, and as the support columns on the bottom plate are tightly matched with the grooves on the cover plate, gaps are formed between the support columns and the grooves and have gap capillary force, and the melted brazing material fills the gaps formed between the support columns and the grooves and forms welding seams under the action of the gap capillary force, the welding seams not only have tensile force on the bottom surfaces of the grooves on the bottom plate and the cover plate, but also have shearing force on the side walls of the grooves, so that the welding quality of the vacuum brazing is improved to a great extent.
(3) Based on the separation of the liquid absorption core and the brazing material, the problem that the liquid absorption core is arranged on only one surface of the upper surface and the lower surface of the inner cavity of the temperature equalizing device is solved. The upper layer liquid suction core and the lower layer liquid suction core can be arranged in the inner cavity at the same time, and all liquid working mediums are all hidden in the liquid suction core, so that the utilization rate of the working mediums is improved, the working mediums can smoothly flow under the action of the upper layer capillary core and the lower layer capillary core, and the efficient and stable performance index of the temperature equalizing device is provided.
(4) After the support columns on the bottom plate and the grooves on the cover plate are assembled, the wall thickness of the upper surface and the lower surface of the cavity is very thin, usually about 1mm or even thinner, so that the use requirements of smaller thickness and lighter weight of the temperature equalizing device can be met excessively, and the use range and the field of the temperature equalizing device are enlarged.
(5) By adopting the method that the drainage ring is sleeved on the outer side wall of the groove, two problems are solved. Firstly, the drainage ring can play a role in supporting the upper-layer liquid suction core and the lower-layer liquid suction core, so that the upper-layer liquid suction core and the cover plate can be attached more tightly, and meanwhile, the lower-layer liquid suction core and the bottom plate can be attached more tightly, so that the contact thermal resistance between the liquid suction core and the cover plate and the bottom plate is reduced, and the heat conduction capacity of the device is improved; secondly, the drainage ring with single porosity is sleeved on the outer side wall of the groove, so that the number of paths from the liquid phase change material at the condensing end to the evaporating end is greatly increased, the reflux capacity and efficiency are enhanced, and the heat transfer capacity of the temperature equalizing device is improved.
Drawings
FIG. 1 is a split block diagram of the present invention;
FIG. 2 is a block diagram of a base plate in accordance with the present invention;
fig. 3 is a block diagram of a wick in accordance with the present invention;
FIG. 4 is a block diagram of a drainage ring according to the present invention;
FIG. 5 is a block diagram of a cover plate of the present invention;
FIG. 6 is an enlarged view of the structure of area A of FIG. 5;
FIG. 7 is a cross-sectional structural view of the present invention;
fig. 8 is a structural view of the region B in fig. 7.
In the figure, 1, a cover plate; 11. a fixed sleeve; 24. a wick; 2. an upper wick; 3. a drainage ring; 4. a lower wick; 5. a bottom plate; 51. a cavity; 52. and (5) supporting the column.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings. It should be noted that, in the examples of the present invention, terms of left, middle, right, upper, lower, etc. are merely relative concepts or references to normal use states of the product, and should not be construed as limiting.
The high-performance temperature equalizing device comprises a bottom plate 5, a liquid suction core 24 and a cover plate 1, wherein the cover plate 1 is fixedly arranged on the bottom plate 5, a square cavity 51 is arranged between the cover plate 1 and the bottom plate 5, the liquid suction core 24 is positioned in the cavity 51, support columns 52 are distributed in the cavity 51, the support columns 52 are arranged on the liquid suction core 24 in a penetrating manner, and two ends of the support columns 52 are fixedly connected with the bottom plate 5 and the cover plate 1 respectively; a cylindrical fixing sleeve 11 is fixedly sleeved on the support column 52, one end face of the fixing sleeve 11 is attached to and fixedly connected with the cover plate 1, a cylindrical groove is formed between the inner wall of the fixing sleeve 11 and the cover plate 1, and the support column 52 is fixedly connected with the side wall and the bottom surface of the groove through vacuum brazing; the bottom plate 5 and the cover plate 1 are attached to the liquid absorbing core 24, and liquid filling openings are reserved on the side face of the bottom plate 5.
The liquid absorbing cores 24 comprise a plurality of layers of liquid absorbing cores, drainage rings 3 are arranged between adjacent liquid absorbing cores 24, the drainage rings 3 are sleeved on the outer circumference of the fixing sleeve 11, the drainage rings 3 are arranged on the fixing sleeve 11, and end faces of two ends of the drainage rings 3 are abutted against the liquid absorbing cores 24; the support columns 52 are integrally arranged with the bottom plate 5, and as shown in fig. 5 and 6, one end of the fixing sleeve 11 is integrally arranged with the cover plate 1, and the other end of the fixing sleeve 11 is close to the bottom plate 5; the bottom plate 5 and the cover plate 1 are made of copper material, aluminum material, silver material or other high thermal conductivity materials.
In addition, the liquid absorbing core 24 comprises an upper liquid absorbing core 2 and a lower liquid absorbing core 4, and in combination with the illustration of fig. 6, the liquid absorbing core 24 adopts composite sintering nets with different porosities. Referring to fig. 4, the drainage ring 3 is a single-porosity wick, and the drainage ring 3 is made of stainless steel, copper alloy or aluminum alloy.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. The utility model provides a high performance samming device, includes bottom plate, wick and apron, the apron sets firmly on the bottom plate be equipped with square type cavity between apron and the bottom plate, the wick is located in the cavity the distribution has the support column in the cavity, the support column runs through the setting on the wick, the both ends of support column respectively with bottom plate, apron fixed connection, its characterized in that: the support column is fixedly sleeved with a cylindrical fixing sleeve, one end face of the fixing sleeve is attached to and fixedly connected with the cover plate, the inner wall of the fixing sleeve is fixedly connected with the side wall and the bottom face of the groove through vacuum brazing, a gap is formed between the support column and the groove and has gap capillary force, melted solder fills the gap formed between the support column and the groove under the action of the gap capillary force and forms a welding seam, and the welding seam not only has tensile force on the bottom face of the groove but also has shearing force on the side wall of the groove; the bottom plate and the cover plate are attached to the liquid suction core; the liquid suction cores comprise a plurality of layers of liquid suction cores, drainage rings are arranged between adjacent liquid suction cores, the drainage rings are sleeved on the outer circumference of the fixing sleeve, the drainage rings are arranged on the fixing sleeve, and end faces of two ends of each drainage ring are abutted against the liquid suction cores; the liquid suction core comprises an upper liquid suction core and a lower liquid suction core, wherein the liquid suction cores adopt composite sintering nets with different porosities, and the drainage ring is a liquid suction core with single porosity.
2. A high performance soaking device according to claim 1, wherein: the support column sets up with the bottom plate integration, fixed cover one end sets up with the apron integration, the other end of fixed cover is close to the bottom plate.
3. A high performance soaking device according to claim 1, wherein: the drainage ring is made of stainless steel, copper alloy or aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910147731.1A CN109769380B (en) | 2019-02-27 | 2019-02-27 | High-performance temperature equalizing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910147731.1A CN109769380B (en) | 2019-02-27 | 2019-02-27 | High-performance temperature equalizing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109769380A CN109769380A (en) | 2019-05-17 |
| CN109769380B true CN109769380B (en) | 2024-03-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910147731.1A Active CN109769380B (en) | 2019-02-27 | 2019-02-27 | High-performance temperature equalizing device |
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| Country | Link |
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| CN (1) | CN109769380B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| DE102019126364A1 (en) * | 2019-09-30 | 2021-04-01 | Umfotec Gmbh | Bearing bush and method for making a bearing bush |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3156954U (en) * | 2009-10-21 | 2010-01-28 | 奇▲こう▼科技股▲ふん▼有限公司 | Support structure for flat plate heat pipe |
| CN102595861A (en) * | 2012-03-12 | 2012-07-18 | 华南理工大学 | Vapor chamber having support posts with inner-sintering structure |
| CN102818467A (en) * | 2012-09-12 | 2012-12-12 | 锘威科技(深圳)有限公司 | Flat plate heating pipe and manufacturing method thereof |
| CN203203446U (en) * | 2013-02-27 | 2013-09-18 | 讯凯国际股份有限公司 | Plate-type heat pipe structure |
| CN104422322A (en) * | 2013-08-29 | 2015-03-18 | 讯强电子(惠州)有限公司 | Uniform-temperature plate and manufacturing method thereof |
| CN106197109A (en) * | 2016-08-19 | 2016-12-07 | 广州华钻电子科技有限公司 | A kind of liquid cold temperature-uniforming plate composite heating radiator |
| CN207427663U (en) * | 2017-07-10 | 2018-05-29 | 广州华钻电子科技有限公司 | A kind of Superhydrophilic soaking plate |
| CN209824290U (en) * | 2019-02-27 | 2019-12-20 | 新乡市特美特热控技术股份有限公司 | High-performance temperature equalizing device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080245518A1 (en) * | 2004-03-09 | 2008-10-09 | Showa Denko K.K. | Flat Tube Making Platelike Body, Flat Tube, Heat Exchanger and Process for Fabricating Heat Exchanger |
-
2019
- 2019-02-27 CN CN201910147731.1A patent/CN109769380B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3156954U (en) * | 2009-10-21 | 2010-01-28 | 奇▲こう▼科技股▲ふん▼有限公司 | Support structure for flat plate heat pipe |
| CN102595861A (en) * | 2012-03-12 | 2012-07-18 | 华南理工大学 | Vapor chamber having support posts with inner-sintering structure |
| CN102818467A (en) * | 2012-09-12 | 2012-12-12 | 锘威科技(深圳)有限公司 | Flat plate heating pipe and manufacturing method thereof |
| CN203203446U (en) * | 2013-02-27 | 2013-09-18 | 讯凯国际股份有限公司 | Plate-type heat pipe structure |
| CN104422322A (en) * | 2013-08-29 | 2015-03-18 | 讯强电子(惠州)有限公司 | Uniform-temperature plate and manufacturing method thereof |
| CN106197109A (en) * | 2016-08-19 | 2016-12-07 | 广州华钻电子科技有限公司 | A kind of liquid cold temperature-uniforming plate composite heating radiator |
| CN207427663U (en) * | 2017-07-10 | 2018-05-29 | 广州华钻电子科技有限公司 | A kind of Superhydrophilic soaking plate |
| CN209824290U (en) * | 2019-02-27 | 2019-12-20 | 新乡市特美特热控技术股份有限公司 | High-performance temperature equalizing device |
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| CN109769380A (en) | 2019-05-17 |
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