CN109768019B - Heat radiating fin for power module and power module manufactured by same - Google Patents
Heat radiating fin for power module and power module manufactured by same Download PDFInfo
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- CN109768019B CN109768019B CN201811633810.5A CN201811633810A CN109768019B CN 109768019 B CN109768019 B CN 109768019B CN 201811633810 A CN201811633810 A CN 201811633810A CN 109768019 B CN109768019 B CN 109768019B
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Abstract
The invention discloses a radiating fin for a power module and the power module made of the radiating fin, wherein a radiating substrate is a copper plate, the radiating fin also comprises an antioxidant coating and a resin layer which are respectively arranged at two opposite sides of the copper plate, and the resin layer is a single-layer structure resin layer or a double-layer structure resin layer; when the resin layer is a single-structure resin layer, the single-structure resin layer is composed of a first epoxy resin composition, and when the resin layer is a double-structure resin layer, the double-structure resin layer includes a first resin layer formed on the copper plate and a second resin layer formed on the first resin layer, the first resin layer is composed of a second epoxy resin composition, and the second resin layer is composed of a third epoxy resin composition; and a power module made of the radiating fin; the heat sink for the power module has the advantages of high insulating property, high heat dissipation, good scratch resistance, convenience for surface mounting, excellent high temperature resistance, excellent adhesive property and hardness.
Description
Technical Field
The invention belongs to the field of radiating fins, and particularly relates to a radiating fin for a power module and the power module manufactured by using the radiating fin.
Background
An intelligent Power module ipm (intelligent Power module) emerging in recent years is a novel Power switch device, integrates the advantages of a GTR and a MOSFET, and has the advantages of high withstand voltage, high input impedance, high switching frequency, low driving Power and the like. Logic, control, detection and protection circuits are integrated in the IPM, the IPM is convenient to use, the size and development time of a system are reduced, the feasibility of the system is greatly enhanced, the IPM is suitable for the development direction of the current power devices, namely modularization, composition and Power Integrated Circuit (PIC), and the IPM is more and more widely applied to the fields of textile machines, injection molding machines, variable frequency air conditioners, washing machines, refrigerators, electric automobiles, radar servo systems and the like. Compared with the traditional power module, the intelligent power module has the characteristics of small volume, compact structure, more contained power devices and the like, so that the power density is higher, the local heating is more serious, and the failure problem caused by overheating becomes one of the bottlenecks in the development of the intelligent power module.
In the prior art, although a heat sink is also used on an intelligent power module, a substrate used by a traditional heat sink is an aluminum substrate, the thermal conductivity of the aluminum substrate is far lower than that of a copper plate, but copper is easily oxidized when being influenced by environments such as moisture, high temperature and the like, and the copper plate is easily scratched in the processes of carrying and using to influence the service life of the copper plate, so that the copper surface is required to have the characteristics of scratch resistance, oxidation resistance and the like; in addition, the insulating and heat conducting layer used in the heat sink has a single-layer structure, and the insulating performance is limited. Generally, the overall thermal conductivity of the radiating fin is less than or equal to 2W/M.K, the requirement of IPM on high thermal conductivity cannot be met, namely the thermal conductivity is more than or equal to 2.5W/M.K, and the electronic component is required to be directly welded on the radiating fin (such as a copper-clad aluminum substrate, a copper-clad ceramic substrate and the like) in the traditional process, so that the mounting and processing are troublesome.
On the basis of this, a person skilled in the art has proposed an improvement, for example from patent CN105280587B, the radiating fin comprises a copper layer, one surface of the copper layer is covered with an anti-oxidation coating, the oxidation resistant coating layer is composed of 1 or more than 2 inorganic oxides of silicon oxide, aluminum oxide, zirconium oxide and titanium oxide as main components, and a resin layer which is insulating, heat-dissipating and adhesive after heating is compounded on the other surface of the copper layer, the thickness of the oxidation resistant coating is 10 nm-2 mu m, the thickness of the copper layer is 20 mu m-5 mm, the thickness of the resin layer is 50 μm to 1mm, the resin layer comprises a hardened layer formed on the copper layer and an adhesive layer formed on the hardened layer, the gel rate of the hardened layer is more than 50%, and the gel rate of the adhesion layer is less than 50%.
However, although the patent realizes better thermal conductivity, friction resistance and insulation, in practice, the thermal conductivity, adhesion performance, hardness and other properties of the heat sink sheet are still slightly insufficient at higher standards, and the heat sink sheet manufactured by the patent has the potential risk of reducing or even greatly reducing the insulation performance, thermal conductivity, adhesion performance, voltage resistance and other properties at higher temperatures (above 130 ℃).
Accordingly, there is a need in the art for a way to address the above-mentioned problems.
Disclosure of Invention
The technical problem to be solved by the invention is to overcome the defects in the prior art, and provide a heat sink for a power module, which has high insulating property, high heat dissipation property, good scratch resistance and convenient surface mounting, has excellent high temperature resistance, can keep the integral appearance and various properties basically unchanged at the temperature of 150-.
The invention also provides a power module adopting the radiating fin.
In order to solve the technical problems, the invention adopts a technical scheme as follows:
a radiating fin for a power module comprises a radiating substrate, wherein the radiating substrate is a copper plate, the radiating fin further comprises an antioxidant coating and a resin layer which are respectively arranged on two opposite sides of the copper plate, and the resin layer is a single-layer structure resin layer or a double-layer structure resin layer;
when the resin layer is a single-layer structure resin layer, the single-layer structure resin layer is composed of a first epoxy resin composition, and the raw materials of the first epoxy resin composition comprise, by mass, 5-25 parts of a first epoxy resin, 2-12 parts of a first phenoxy resin, 2-20 parts of a first curing agent, 65-95 parts of a first heat-conducting filler and 0-10 parts of a first dispersing agent;
when the resin layer is a two-layer structure resin layer, the two-layer structure resin layer includes a first resin layer formed on the copper plate and a second resin layer formed on the first resin layer, the first resin layer being composed of a second epoxy resin composition, the second resin layer being composed of a third epoxy resin composition;
the raw materials of the second epoxy resin composition comprise, by mass, 5-25 parts of a second epoxy resin, 0-12 parts of a second phenoxy resin, 0-20 parts of a first toughening rubber, 5-25 parts of a second curing agent, 65-95 parts of a second heat-conducting filler and 0-10 parts of a second dispersing agent, and the raw materials of the third epoxy resin composition comprise 5-25 parts of a third epoxy resin, 0-12 parts of a third phenoxy resin, 1-20 parts of a second toughening rubber, 2-20 parts of a third curing agent, 65-95 parts of a third heat-conducting filler and 0-10 parts of a third dispersing agent; when the second phenoxy resin is not contained in the raw material of the second epoxy resin composition, the second epoxy resin is composed of at least two epoxy resins; when the third phenoxy resin is not contained in the raw materials of the third epoxy resin composition, the third epoxy resin is composed of at least two epoxy resins.
According to some preferred aspects of the present invention, when the resin layer is a single-structure resin layer, the single-structure resin layer has a gel fraction of less than 50%;
when the resin layer is a double-layer structure resin layer, the gel fraction of the first resin layer is more than 50%, and the gel fraction of the second resin layer is less than 50%.
According to some preferred aspects of the present invention, the first epoxy resin, the second epoxy resin and the third epoxy resin are each independently selected from a combination of one or more of a bisphenol a type epoxy resin, a bisphenol F type epoxy resin, a novolac type epoxy resin and a modified epoxy resin;
when the second phenoxy resin is not contained in the raw materials of the second epoxy resin composition, the second epoxy resin is composed of at least two epoxy resins selected from bisphenol a type epoxy resins, bisphenol F type epoxy resins, phenol type epoxy resins, and modified epoxy resins; when the third phenoxy resin is not contained in the raw materials of the third epoxy resin composition, the third epoxy resin is composed of at least two epoxy resins selected from bisphenol a type epoxy resins, bisphenol F type epoxy resins, novolac type epoxy resins, and modified epoxy resins.
According to some specific and preferred aspects of the invention, the bisphenol a type epoxy resin is selected from: NPES-901, NPES-902, NPES-903H, NPES-904, NPES-904H, NPES-907, NPES-909 from south Asia epoxy resin company; YD-011, YD-012, YD-013, YD-127, YD134, YD-901, YD-9021 of Korea Doku chemical company; 834, 1001, 1002, 1003, 1055, 1004 of mitsubishi chemical.
According to some particular and preferred aspects of the invention, said bisphenol F type epoxy resin is selected from: NPEF-170 and NPEF-175 of southeast Asia epoxy resin company, YDF-170, YDF-2001 and YDF-2004 of Korean Dow chemical company; 4005P, 4007P, 4010P of Mitsubishi chemical.
According to some specific and preferred aspects of the present invention, the novolac type epoxy resin is selected from NPPN-631, NPPN-638S, NPPN-431, NPPN-438, NPPN-272H, etc., of epoxy resin of south Asia; EPALLOY 8240, EPALLOY 8240E, EPALLOY 8250, EPALLOY8330, CVC USA; YDPN-638, YDPN-641 and YDPN-644 of Korean Country chemical company.
According to some particular and preferred aspects of the invention, the modified epoxy resin is selected from: hypox UA10, Hypox UA11, HyPox DA323, CVC USA; NPER-133L, NPER-450 from south Asia epoxy company; YD-171, YD-172, KR-628, KR-692, KR-693, KSR-1000, UME-305, UME-315, UME-330 of Korean Dow chemical company.
According to some preferred aspects of the present invention, the first toughened rubber and the second toughened rubber are each a combination of one or more selected from the group consisting of acrylic rubber, nitrile rubber, silicone rubber, urethane rubber and fluororubber.
According to some specific and preferred aspects of the present invention, the first toughening rubber and the second toughening rubber are respectively Nipol SBR1723, Nipol SBR1739, Nipol SBR9548, Nipol SBR NS460, Nipol SBR NS552, Nipol BR1220SG, Nipol BR1220SB, Nipol IR2200, Nipol NBR DN003, Nipol NBR N41, Nipol NBR DN101, Nipol NBR DN21, Nipol NBR DN4050, Nipol NBR 3335, Nipol NBR DN3350, Nipol NBR DN3380, Nipol AR31, Nipol AR51, Nipol AR14 independently selected from ZEON; XER32, XER41, XER81, XER91, XER92 from JSR, Japan.
According to some preferred aspects of the present invention, the mass ratio of the charged amount of the second toughening rubber to the total charged amount of the third epoxy resin and the second phenoxy resin is 1: 7-9.
According to some specific and preferred aspects of the present invention, when the second phenoxy resin is contained in the raw material of the second epoxy resin composition, the charging mass ratio of the first epoxy resin and the first phenoxy resin is 2-4: 1; when the third epoxy resin composition contains the third phenoxy resin in the raw materials, the feeding mass ratio of the third epoxy resin to the third phenoxy resin is 2-4: 1.
According to some specific and preferred aspects of the present invention, the phenoxy resin is a combination of one or more selected from the group consisting of a bisphenol a type phenoxy resin, a bisphenol F type phenoxy resin, and a bisphenol S type phenoxy resin, and preferably, the phenoxy resin has a weight average molecular weight Mw of 10000 to 100000.
According to some embodiments of the present invention, the bisphenol a phenoxy resin includes, but is not limited to: PKHA, PKHB +, PKHC, PKHH, PKHJ, PKFE, etc. of the company InChem; 1256, Mitsubishi chemical; YP-50, YP-50S, YBP-40PXM40 and ERF-001M30 of Xinri Cijin chemical.
According to some embodiments of the invention, the bisphenol F phenoxy resin includes, but is not limited to FX-316 from Nippon iron-on-gold chemistry, and the like.
According to some embodiments of the present invention, the bisphenol A and bisphenol F mixed phenoxy resins include, but are not limited to, Mitsubishi chemical 4250, 4276, New Nissan Corp chemical YP-70, ZX-1356-2, and the like.
According to some embodiments of the invention, the bisphenol-A and bisphenol-S mixed phenoxy resin includes, but is not limited to, YPS-007A30 of New Nippon Metal chemical.
According to some embodiments of the present invention, the phenoxy resin may also be selected from phenoxy resins of specific structures such as FX-293, FX-280S, FX-310T40, etc. of Nippon iron-gold chemical.
According to some specific and preferred aspects of the present invention, the first curing agent, the second curing agent and the third curing agent are each independently selected from a combination of one or more of an amine curing agent, an imidazole curing agent, a phenol curing agent and an anhydride curing agent.
Further preferably, the first curing agent, the second curing agent and the third curing agent are each independently selected from an amine curing agent and/or an imidazole curing agent;
wherein the amine curing agent is one or more of dicyandiamide, aromatic amine, diaminodiphenylmethane and diaminodiphenylsulfone; the imidazole curing agent is selected from 1-methylimidazole, 2-ethyl-4-methylimidazole, N- (3-aminopropyl) -imidazole, 1-vinylimidazole, 2-vinylimidazole and 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1, 2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, and 1-cyanoethyl-2-phenylimidazole.
According to some specific aspects of the present invention, the acid anhydride curing agent preferably contains an acid anhydride having an aromatic skeleton, a hydride of the acid anhydride or a modification of the acid anhydride, or contains an acid anhydride having an alicyclic skeleton, a hydride of the acid anhydride or a modification of the acid anhydride.
According to some preferred aspects of the present invention, when the resin layer is a single-layer structure resin layer, the first dispersant is added in an amount of 0.1 to 5% by mass based on the total mass of the first epoxy resin layer;
when the resin layer is a double-layer structure resin layer, the addition amount of the second dispersing agent accounts for 0.1-5% of the total mass of the second epoxy resin layer; the addition amount of the third dispersing agent accounts for 0.1-5% of the total mass of the third epoxy resin layer. The addition of the dispersant is beneficial to improving the adherence between the resin and the heat-conducting filler and increasing the adherence between the resin layer and the heat-radiating substrate.
According to some specific and preferred aspects of the present invention, the dispersant is one or a combination of several selected from the group consisting of a titanate coupling agent, an aluminate coupling agent, an organosilane coupling agent, an organochromium complex coupling agent, and a borate coupling agent.
According to some specific aspects of the invention, the titanate coupling agent comprises isopropyl tris (dioctylpyrophosphate) titanate, isopropyl tris (dioctylphosphonoate) titanate, isopropyl dioleate acyloxy (dioctylphosphonoate) titanate, monoalkoxy unsaturated fatty acid titanate, a chelate of bis (dioctyloxypyrophosphate) ethylene titanate and triethanolamine, bis (dioctyloxypyrophosphate) ethylene titanate, and the like.
According to some specific aspects of the invention, the aluminate coupling agents include aluminum titanium complexes, isopropyl bis (acetoacetato) aluminate, diisopropyl bis (acetylacetonato) aluminate, isopropyl distearoyloxy aluminate, and the like.
According to some specific aspects of the invention, the organosilane coupling agent comprises an aminosilane, an epoxy silane, a methacryloxy silane, a vinyl silane, an alkyl silane, a sulfur-containing silane, a phenoxy silane, an isocyanato silane, a fluorosilane, and the like.
According to some particular aspects of the invention, the titanate coupling agent comprises KR-308S, KR-12, KR-TTS, KR-238S, KR-38S, KR-41B, and the like, from KenreQi, USA.
According to some particular aspects of the invention, the silicone coupling agents include KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM-1403, KBM-502, KBM-503, KBE-502, KBE-503, and Dow Corning OFS-6011, OFS-6020, OFS-6030, OFS-6032, OFS-6040, OFS-6076, OFS-6094, OFS-6106, OFS-6124, and the like, of Japan Beacon chemical.
According to some specific and preferred aspects of the present invention, the first thermally conductive filler, the second thermally conductive filler, and the third thermally conductive filler are each independently selected from one or more combinations of magnesium oxide, beryllium oxide, aluminum nitride, boron nitride, crystalline silica, and synthetic Diamond (also called Diamond-like carbon (DLC)).
According to the invention, the first heat-conducting filler, the second heat-conducting filler and the third heat-conducting filler are respectively fillers with heat conductivity coefficient more than or equal to 10W/M.K. The higher the thermal conductivity of the filler, the higher the thermal conductivity of the entire fin, but it is also possible to mix it with a filler having a thermal conductivity of < 10W/M.K.
According to the present invention, the first, second and third heat conductive fillers may have one or more of polygonal, spherical-like, spherical, flaky and massive shapes, and are preferably spherical or spherical-like because spherical fillers have relatively good filling properties and high heat conductivity. Of course, the main part is spherical or spheroidal, and the filling of the filler with other shapes is also possible, and meanwhile, the cost is saved.
According to some preferred aspects of the present invention, the first, second and third thermally conductive fillers are preferably alumina having a diameter of 0.1 μm to 60 μm, and more preferably alumina having a diameter of 0.2 μm to 50 μm, respectively. In order to obtain a more preferable filling effect, a spherical filler having an average particle size of 5 μm, an average particle size of 10 μm, an average particle size of 20 μm, or the like may be selected and used.
According to some specific and preferred aspects of the present invention, the alumina filler comprises the non-spherical Al-43-KT, AL-47-H, AL-47-1, AL-160SG-3, AL-43-BE, AL-42-2, spheroidal AS-05, AS-10, AS-20, AS-30, AS-40, AS-50, AS-400, spherical CB-P02, CB-P05, CB-P07, CB-P10, CB-P15, CB-P40, CB-A20S, CB-A30S, CB-A40, CB-A50S of the Showa and electrician; spherical alumina of Nippon iron such as AX35-125, AH35-2, AX10-32, AX3-32, AX3-15 and the like.
According to some particular aspects of the invention, the boron nitride comprises UHP-S1, UHP-1K, UHP-2 of Japanese Showa electrician platelet structure, UHP-EX, UHP-G1, UHP-G3 of bulk structure, and the like.
According to some specific aspects of the present invention, the oxidation-resistant coating layer is formed by coating a copper layer with 1 or more than 2 inorganic oxides selected from silicon oxide, aluminum oxide, zirconium oxide, and titanium oxide, and then treating the coated copper layer by one or more of heating, humidifying, and ultraviolet irradiation. The precursor is one or a mixture of more of orthosilicate, perhydropolysilazane and isocyanate silane. After the precursor is coated on the copper layer, the oxidation-resistant coating with the main component of silicon oxide is formed after the precursor is treated by one or more of heating, humidifying and ultraviolet irradiation. The anti-oxidation coating coated on the copper plate prepared by the method not only endows the copper plate with excellent anti-oxidation performance, but also endows the copper plate with excellent scratch resistance, and ensures that the copper plate is resistant to oxidation when being influenced by environments such as moisture, high temperature and the like.
Specifically, the orthosilicates include HAS-1, HAS-2, and HAS-3 of Colcoat in Japan, and Dynasylan40, Dynasylan A, Dynasylan AR, Dynasylan M, Dynasylan MKS, Dynasylan P, Dynasylan MAR of Evonik, Germany.
Specifically, the perhydropolysilazanes include NN110, NN310, NL110A, NL120A, NL150A, NP110, NP140, SP140, UP140 from AZ Electronic Materials, UK, and IOTA-PHPS, IOTA-9108, IOTA-9118, IOTA-OPSZ-9150 from Anhui Eyota.
Specifically, the isocyanosilanes include SI310, SI400 from Matsumoto Fine Chemical company, japan.
Specifically, the thickness of the anti-oxidation coating is 30 nm-2 μm; the thickness of the copper plate is 20 mu m-5 mm; the thickness of the resin layer is 50 mu m-1 mm.
The resin layer prepared by the scheme of the invention not only has high heat-conducting property and excellent insulating property, but also has excellent bonding force after being heated, thereby facilitating the mounting of other subsequent layers, such as but not limited to the mounting of subsequent electronic components, conductive layers and the like.
The invention provides another technical scheme that: a power module comprises a radiating fin, and the radiating fin adopts the radiating fin for the power module.
Further, the power module further includes a conductive layer thermally laminated on the resin layer, and an encapsulation resin for encapsulating the heat sink and the conductive layer.
Still further, the temperature of the conductive layer and the resin layer is 120-160 ℃, and the pressure is 5Kg/cm2～10Kg/cm2Hot pressing for 30-40 seconds; and then packaging the conductive layer and the radiating fin together by using packaging resin, sealing the die for 150-200 ℃/1 min-5 min, and then carrying out curing reaction for 150-200 ℃/3-7 hours to obtain the power module.
According to some specific and preferred aspects of the present invention, after the thermocompression bonding of the conductive layer and the resin layer, the degree of crosslinking of the resin layer is greater than 70%, that is, the degree of crosslinking of both the hardened layer and the adhesion layer is greater than 70%.
In the present invention, the description of "first, second, and third" is only for distinguishing that the several layers respectively contain the heat conductive filler, the epoxy resin, the phenoxy resin, the curing agent, and the like, and is not limited thereto.
Due to the implementation of the technical scheme, compared with the prior art, the invention has the following advantages:
the invention adopts the specific resin layer, endows the radiating fin with excellent high temperature resistance on the premise of having high insulating property, high heat dissipation, good scraping resistance and convenient surface mounting of the radiating fin for the power module, can still keep the integral appearance and various performances basically unchanged at the temperature of 150 plus 200 ℃, simultaneously has excellent bonding property, processing property (good appearance) and hardness, meets the requirements of the current high quality standard, is particularly suitable for the use of the power module, and improves the application prospect of the power module.
Drawings
Fig. 1 is a schematic structural view of a heat sink for a power module according to the present invention;
FIG. 2 is a schematic diagram of a power module (heat sink and conductive layer packaged together);
wherein: 1. an oxidation resistant coating; 2. a copper plate; 3. a resin layer; 31. a first resin layer; 32. a second resin layer; 4. a conductive layer; 5. and (3) encapsulating the resin.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the present invention is not limited to the following examples. The implementation conditions adopted in the examples can be further adjusted according to different requirements of specific use, and the implementation conditions not indicated are those in routine experiments.
In the following, all starting materials are either commercially available or prepared by conventional methods in the art, unless otherwise specified.
Preparing a heat radiating fin for a power module:
taking a clean copper plate (with the thickness of 0.4mm), uniformly coating a precursor (with the solid content of 2-5%) on the surface of the copper plate in a dip-coating mode, baking for 5min at 130 ℃, standing the baked copper plate in a constant-temperature (the temperature is 20-40 ℃) high-humidity (the humidity is 40-85%) environment for 3-20 days, and baking the copper plate after standing in a 170 ℃ vacuum environment for 2h to obtain the copper plate containing the silicon layer for later use.
Preparation of the second epoxy resin composition: dissolving second epoxy resin in butanone solvent, adding second heat-conducting filler, second dispersing agent and second curing agent into the resin solution, selectively adding second phenoxy resin and first toughening rubber, stirring at high speed, and uniformly mixing to obtain the product;
preparation of the third epoxy resin composition: dissolving third epoxy resin in butanone solvent, adding third heat-conducting filler, second toughening rubber, third dispersant and third curing agent into the resin solution, selectively adding third phenoxy resin, stirring at high speed, and uniformly mixing to obtain the epoxy resin-based epoxy resin composite material;
the second epoxy resin composition was uniformly coated on a50 μm release film, and the solvent was evaporated to dryness by heating at a temperature rising rate of 100 ℃/5 min. The second epoxy resin composition surface is thermally pressed and attached to the non-silicon processing surface of the copper plate, so that the second epoxy resin composition can be transferred to the copper plate, then the release film is torn off, and the first resin layer can be formed after high-temperature curing at 200 ℃/1 Hr; and hot pressing another release film coated with the third epoxy resin composition on the existing first resin layer to form a second resin layer, thereby completing the manufacture of the heat sink for the power module.
As shown in fig. 1, the heat sink of the present invention is divided into 4 layers, 1 is an oxidation-resistant coating layer, 2 is a copper plate, 31 is a first resin layer of a resin layer, and 32 is a second resin layer of a resin layer.
As shown in FIG. 2, the present invention provides a power module comprising an oxidation-resistant coating 1, a copper plate 2, a first resin layer 31 of resin layers, a second resin layer 32 of resin layers, and a resin layer laminated in this order, and having a temperature of 140 ℃ and a pressure of 8Kg/cm2And thermally compounding the conducting layer 4 on the bonding layer and the packaging resin 5 for packaging the conducting layer 4 and the radiating fin together by hot pressing for 30-40 seconds, sealing the die at 180 ℃/3min, and performing curing reaction at 190 ℃/5 hours to obtain the power module.
The properties of the raw materials for preparing the heat dissipating fins of examples 1 to 8 and comparative examples 1 to 3 and the finally prepared heat dissipating fins are provided below, specifically as shown in tables 1 and 2, wherein the amounts of the raw materials added in tables 1 and 2 are in parts by weight.
Raw materials in table 1 and table 2:
(1) silicon layer: perhydropolysilazanes (PHPS), AZ NL 110A; HAS-1 available from the firm orthosilicate Colcoat; isocyanic silanes, SI310 from Matsumoto Fine Chemical company.
Bisphenol a type epoxy resin: YD-134 of national institute of chemistry
Bisphenol F type epoxy resin): YDF-170 of national institute of chemistry
Phenolic epoxy resin: YDPN-638 of national chemical company
Modified epoxy resin: YD-171 of national institute of chemistry
Bisphenol A type phenoxy resin (Xinri iron precious chemical YP-50)
Bisphenol A and bisphenol F mixed phenoxy resin, Xinri iron Baojin chemical YP-70
Alumina Showa electrician AS-50
Dispersing agent: signal crossing KBM-403
Curing agent ATUL DDS, four nations chemical formula 2E4 MZ-CN.
TABLE 1
TABLE 2
Test methods for the above evaluation items:
(1) appearance of the product
The appearance of the laminated insulating layer and copper surface treatment layer was visually observed for the presence or absence of bubbles, uniformity of thickness of the insulating layer, and the like
And (4) judging the standard:
very good: the insulating layer and the copper surface treatment layer have no bubbles and foreign matters in appearance, and the thickness deviation of the insulating layer is less than 3 percent;
o: the insulating layer and the copper surface treatment layer have no bubbles and foreign matters in appearance, and the thickness deviation of the insulating layer is less than 5 percent;
and (delta): the insulating layer and the copper surface treatment layer are free of bubbles in appearance, and slight foreign matters on the surface of the insulating layer or thickness deviation of the insulating layer is 5-10%;
x: the appearance of the insulating layer and the copper surface treatment layer has bubbles, or the surface of the insulating layer has slight foreign matters, or the thickness deviation of the insulating layer is more than 10 percent.
(2) Adhesion (bond strength)
On the adhesion layer of the heat sink, 35 μm thick electrolytic copper foil was hot-pressed under a hot-pressing condition of 1MPa/30s, and then heated at 200 ℃ for 1 hour to complete curing. The insulating layer and the copper foil were then peeled at 90 ℃ and the peel strength (unit: N/cm) was measured.
(3) Heat resistance (Oxidation resistance)
A sample of 5cm × 5cm size was punched out of the heat sink by a 60Ton punch, and then the sample was placed in an oven and baked at 170 deg.C/10 hours to compare the appearance change of the copper surface before and after the heat treatment.
Judging the standard:
o: gloss retention was > 70% after heat treatment compared to before heat treatment;
and (delta): the glossiness is kept between 50 and 70 percent after the heat treatment and before the heat treatment;
x: the gloss remained < 50% after heat treatment compared to before heat treatment.
(4) Scratch resistance of copper plate
The copper surface direction of a radiating fin (with the size of 5cm multiplied by 10cm) is attached to a flat stainless steel plate, a weight with the weight of 1kg is placed on the radiating fin, then the radiating fin is held by hands to move back and forth for 5 times by a distance of 5cm, a silicon oxide treatment layer on the surface of the copper plate is rubbed with the stainless steel, and the scratching condition is observed.
Judging the standard:
o: the depth of the scratch is more than 0.5 μm, and the number of the traces with the length of more than 3cm is less than 5;
and (delta): the depth of the scratch is more than 0.5 mu m, and the number of the traces with the length of more than 3cm is less than 5-10;
x: the depth of the scratch is more than 0.5 μm, and the length of the scratch is more than 10 marks of 3 cm;
(5) hardness test of coating surface
Referring to GB/T6739-. The test pencil was placed on the test car with the tip in contact with the coating. The test car was moved relative to the sample at a speed of 0.5mm/s and a distance of 3 mm. The position was changed and 5 strokes were made.
The pencil used is a group of Chinese high-grade drawing pencils which are respectively 9H, 8H, 7H, 6H, 5H, 4H, 3H, 2H, F, HB, B, 2B, 3B, 4B, 5B and 6B, wherein 9H is the hardest and 6B is the softest.
Case of coating scratching: in the 5-pass scratch test, if 2 or more passes are considered to be the case where the coating is not scratched, the same test is carried out by using a pencil with the pencil hardness mark of the previous pencil, the pencil with the coating scratched for 2 or more passes is selected, and the hardness mark of the pencil one position after the pencil hardness mark is recorded.
(6) Processability (punching test)
The copper plate was faced up and the heat sink was punched out with a 60Ton punch to form a 5cm x 5cm sample.
Judging the standard:
o: the adhesion between the insulating layer and the copper plate is good, and no layering exists;
and (delta): light differential layering is formed between the insulating layer and the edge of the copper plate, and the layering area is less than 10%;
x: the layering area between the insulating layer and the copper plate is more than 10 percent.
(7) Thermal conductivity test
The heat sink was punched out of a 2.5cm by 2.5cm sample using a 60Ton punch, while the sample was coated with a layer of heat conductive silicone grease, and tested according to ASTM-D-5470. The testing equipment is Rayleigh-tech LW-9389.
(8) Insulation voltage
The heat sink was punched out into a10 cm × 10cm sample by a 60Ton punch and the sample was baked at 200 ℃ for 1 hour. The sample was then clamped between two cylindrical electrodes of 25mm diameter and tested for the insulation voltage. The test equipment is a Japanese chrysanthemum water (KIKUSUI model TOS5301) pressure-resistant testing machine, the boosting rate is 1Kv/s, and the leakage current is less than 1 mA.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the invention, and not to limit the scope of the invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the scope of the present invention.
Claims (6)
1. The utility model provides a power is fin for module, the fin includes the heat dissipation base plate, the heat dissipation base plate is the copper, the fin still including setting up respectively the anti-oxidation coating and the resin layer of the relative both sides of copper, its characterized in that: the resin layer is a double-layer structure resin layer,
the two-layer structure resin layer includes a first resin layer formed on the copper plate and a second resin layer formed on the first resin layer, the first resin layer being composed of a second epoxy resin composition, the second resin layer being composed of a third epoxy resin composition;
the raw materials of the second epoxy resin composition comprise, by mass, 5-25 parts of a second epoxy resin, 0-12 parts of a second phenoxy resin, 0-20 parts of a first toughening rubber, 5-25 parts of a second curing agent, 65-95 parts of a second heat-conducting filler and 0-10 parts of a second dispersing agent;
the third epoxy resin composition comprises, by mass, 5-25 parts of a third epoxy resin, 0-12 parts of a third phenoxy resin, 1-20 parts of a second toughened rubber, 2-20 parts of a third curing agent, 65-95 parts of a third heat-conducting filler and 0-10 parts of a third dispersing agent; the mass ratio of the feeding amount of the second toughening rubber to the total feeding amount of the third epoxy resin and the second phenoxy resin is 1: 7-9; the first toughening rubber and the second toughening rubber are respectively one or more of acrylic rubber, butadiene cyanide rubber, silicone rubber, polyurethane rubber and fluororubber;
the second epoxy resin and the third epoxy resin are respectively and independently selected from one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, phenolic epoxy resin and modified epoxy resin;
when the second phenoxy resin is not contained in the raw materials of the second epoxy resin composition, the second epoxy resin is composed of at least two epoxy resins selected from bisphenol a type epoxy resins, bisphenol F type epoxy resins, phenol type epoxy resins, and modified epoxy resins; when the third phenoxy resin is not contained in the raw materials of the third epoxy resin composition, the third epoxy resin is composed of at least two epoxy resins selected from bisphenol a type epoxy resins, bisphenol F type epoxy resins, novolac type epoxy resins, and modified epoxy resins.
2. The heat sink for a power module according to claim 1, wherein: the gel fraction of the first resin layer is greater than 50%, and the gel fraction of the second resin layer is less than 50%.
3. The heat sink for a power module according to claim 1, wherein: the second curing agent and the third curing agent are respectively and independently selected from one or more of amine curing agent, imidazole curing agent, phenol curing agent and anhydride curing agent.
4. The heat sink for a power module according to claim 3, wherein: the second curing agent and the third curing agent are respectively and independently selected from amine curing agents and/or imidazole curing agents;
wherein the amine curing agent is one or more of dicyandiamide, aromatic amine, diaminodiphenylmethane and diaminodiphenylsulfone; the imidazole curing agent is selected from 1-methylimidazole, 2-ethyl-4-methylimidazole, N- (3-aminopropyl) -imidazole, 1-vinylimidazole, 2-vinylimidazole and 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1, 2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, and 1-cyanoethyl-2-phenylimidazole.
5. The heat sink for a power module according to claim 1, wherein: the addition amount of the second dispersing agent accounts for 0.1-5% of the total mass of the second epoxy resin layer; the addition amount of the third dispersing agent accounts for 0.1-5% of the total mass of the third epoxy resin layer.
6. A power module comprising a heat sink, characterized in that: the heat sink is the heat sink for power module as claimed in any one of claims 1 to 5.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811633810.5A CN109768019B (en) | 2018-12-29 | 2018-12-29 | Heat radiating fin for power module and power module manufactured by same |
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| CN201811633810.5A CN109768019B (en) | 2018-12-29 | 2018-12-29 | Heat radiating fin for power module and power module manufactured by same |
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| CN109768019A CN109768019A (en) | 2019-05-17 |
| CN109768019B true CN109768019B (en) | 2020-12-25 |
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| CN111138636A (en) * | 2019-12-31 | 2020-05-12 | 浙江华正新材料股份有限公司 | Resin composition, prepreg and laminated board |
| CN114196303A (en) * | 2021-12-03 | 2022-03-18 | 苏州赛伍应用技术股份有限公司 | Intelligent power module and radiating fin for same |
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| CN102558765A (en) * | 2010-12-15 | 2012-07-11 | 新高电子材料（中山）有限公司 | Halogen-free fire-retardant high heat conducting insulating resin composition and heat dissipation metal-base copper clad plate |
| CN102593338A (en) * | 2011-01-07 | 2012-07-18 | 昆山雅森电子材料科技有限公司 | Thin high-thermal-conductivity metal substrate and production method thereof |
| CN103879087A (en) * | 2014-04-09 | 2014-06-25 | 太仓泰邦电子科技有限公司 | Heat-conducting copper foil |
| CN104737634A (en) * | 2013-06-19 | 2015-06-24 | 阿莫绿色技术有限公司 | Hybrid insulation sheet and electronic equipment comprising same |
| CN105280587A (en) * | 2015-07-03 | 2016-01-27 | 苏州赛伍应用技术有限公司 | Radiator fin for power module and power module made of the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105623198B (en) * | 2015-12-29 | 2018-02-16 | 陕西生益科技有限公司 | A kind of highly thermal-conductive resin composition and its application |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102558765A (en) * | 2010-12-15 | 2012-07-11 | 新高电子材料（中山）有限公司 | Halogen-free fire-retardant high heat conducting insulating resin composition and heat dissipation metal-base copper clad plate |
| CN102593338A (en) * | 2011-01-07 | 2012-07-18 | 昆山雅森电子材料科技有限公司 | Thin high-thermal-conductivity metal substrate and production method thereof |
| CN104737634A (en) * | 2013-06-19 | 2015-06-24 | 阿莫绿色技术有限公司 | Hybrid insulation sheet and electronic equipment comprising same |
| CN103879087A (en) * | 2014-04-09 | 2014-06-25 | 太仓泰邦电子科技有限公司 | Heat-conducting copper foil |
| CN105280587A (en) * | 2015-07-03 | 2016-01-27 | 苏州赛伍应用技术有限公司 | Radiator fin for power module and power module made of the same |
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