CN109768004B - System for producing black silicon product through reflectivity self-adjustment - Google Patents
System for producing black silicon product through reflectivity self-adjustment Download PDFInfo
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- CN109768004B CN109768004B CN201811641160.9A CN201811641160A CN109768004B CN 109768004 B CN109768004 B CN 109768004B CN 201811641160 A CN201811641160 A CN 201811641160A CN 109768004 B CN109768004 B CN 109768004B
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Abstract
The invention discloses a system for producing black silicon products through reflectivity self-adjustment, which comprises a PLC (programmable logic controller), a bubble sensor, a human-computer interface, a circulating pump, a liquid supplementing device, a basket feeding mechanical arm and a basket discharging mechanical arm.
Description
Technical Field
The invention relates to the technical field of photovoltaic power generation, in particular to a system for producing black silicon products through reflectivity self-adjustment.
Background
The photovoltaic power generation technology is developed rapidly in recent years, and in order to further improve the conversion efficiency of the crystalline silicon battery, the black silicon technology is developed at the same time, and the conversion efficiency of the battery is improved by preparing a porous structure with a micro-nano scale on the surface of a silicon wafer to improve the absorption of light. The black silicon technology is to prepare nanometer holes on the surface of crystalline silicon through complex chemical reaction, the whole black silicon structure preparation process comprises twenty or more process groove bodies, the core steps are mainly silver deposition, hole digging and hole expanding, the diameter of the black silicon is 700nm, the hole depth is about 500nm, so that the prepared battery can give consideration to good light absorption capacity and lower photogenerated current carrying when the surface reflectivity is about 17 percent, the concentration of the liquid medicine in the existing black silicon technology fluctuates, byproducts are accumulated, the temperature fluctuation objectively exists and can not be completely eliminated, the reaction rate fluctuates along with the fluctuation, the reflectivity of the prepared black silicon product can change along with the fluctuation, the process stability is lower, the hole depth and the hole diameter of the nanometer holes are respectively controlled by the hole digging and hole expanding time, the reaction rate can fluctuate along with the increase of the chemical reaction byproducts, the fluctuation of the liquid medicine concentration, the fluctuation of the process temperature and other hardware fluctuation in the actual production process, under the condition that the process time is not changed, the aperture and the reflectivity of the produced product can drift along with the process time, a craftsman can adjust the process time of hole digging, hole expanding and the like according to the appearance and the reflectivity of a product at the discharging end, the reject ratio of a finished product and the working strength of the craftsman are greatly increased, the release of bubbles can be accompanied in the chemical reaction process of a silicon wafer and liquid medicine during hole digging, a large amount of bubbles are generated in a solution when the reaction is carried out for 100s under the condition of normal reaction rate, the reaction time is set to be normal when the black silicon hole obtained for 220s is deep, the generation time of the bubbles is advanced and delayed when the reaction rate is increased, the reflectivity of the bubbles is reduced by 1% when the bubbles are generated for 10s in advance, and the reflectivity of the delayed bubbles. According to the invention, a large amount of bubbles are generated when the hole expansion is normally performed for 30s, the aperture of the obtained black silicon is normal when the reaction time is set to 100s, and the reflectivity of the obtained black silicon is reduced by 1.5% when the bubbles with a slower hole expansion rate are delayed for 10 s.
Disclosure of Invention
Based on the technical problems in the background art, the invention provides a system for producing black silicon products through reflectivity self-adjustment.
The invention provides a system for producing black silicon products by self-adjusting reflectivity, which comprises a PLC (programmable logic controller), a bubble sensor, a human-computer interface, a circulating pump, a liquid supplementing device, a basket feeding mechanical arm and a basket discharging mechanical arm, wherein the bubble sensor is respectively arranged in a hole digging groove and a hole expanding groove, and is electrically connected with the PLC controller, and mutually feeds back signals by adopting a bidirectional transmission mode, the human-computer interface is arranged on the black silicon machine table, is electrically connected with the PLC controller and adopts a bidirectional transmission mode to feed back signals mutually, the basket feeding mechanical arm and the basket discharging mechanical arm are both electrically connected with the PLC controller, and the signals are mutually fed back by adopting a bidirectional transmission mode, the circulating pump is arranged at the bottom of the hole digging groove and is electrically connected with the PLC controller, and a signal is fed back by adopting a one-way transmission mode, and the liquid supplementing device is arranged outside the black silicon machine table and feeds back the signal by adopting the one-way transmission mode with the PLC.
In a further preferred scheme, the model of the PLC is DVP24SV11T2
In a further preferred embodiment, the bubble sensor is a type a230 and is made of PVDF.
In a further preferred embodiment, the circulating pump is AMX-441FEAAV-1, and the voltage is 380V with the power of 0.75 KW.
The invention has the beneficial effects that:
firstly, the hole digging groove and the hole expanding groove are respectively provided with a bubble sensor at opposite angle positions, when a silicon wafer and liquid medicine are subjected to chemical reaction, bubbles are generated, so that fluctuation of pulse signals is caused, the silicon wafer reacts the chemical reaction speed of the two groove bodies according to the speed generated by the bubbles in the hole digging groove and the hole expanding groove, the pulse signals are fed back to the bubble sensors, the bubble sensors are electrically connected with the PLC, feedback signals are transmitted in a two-way mode, and the reaction time is displayed through a human-computer interface.
The time from the basket feeding mechanical arm to the hole digging groove to the beginning of bubble generation is set to be t1 through a human-computer interface, and the hole digging groove process time t is automatically adjusted according to the following formula: when t1 is less than 100 seconds, t =220- (100-t1), and conversely when t1 is greater than 100 seconds, the process time t is corrected according to the formula t =220+ (t 1-100). And when the same set reaming time s1 is less than 30 seconds, the reaming groove process time s is corrected according to a formula s =100- (30-s1), otherwise, the reaming groove process time s is automatically corrected according to s =100+ (s1-30), so that the automatic adjustment of the process deviation of the reflectivity in the silicon wafer production process is realized.
The flower basket is lifted and placed into the hole digging groove or the hole expanding groove by the basket feeding mechanical hand, after the process time of the former groove body, the groove cover is immediately opened and simultaneously the lifting signal is related to bubble, the PLC controller controls the relay to close the circulating pump, so as to avoid the disturbance of the solution from influencing the chemical reaction process, when the basket feeding mechanical hand is unhooked and the flower basket is placed, the unhooked signal is opened by the PLC controller and the bubble sensor, the human-computer interface carries out the process timing, when the time of a large amount of reaction bubbles is fed back to the PLC controller to correct the reaction time according to the calculation formula, the corresponding human-computer interface process set time is synchronously and automatically changed, after the reaction time reaches the process set time, the PLC controller controls the relay to open the circulating pump to fully and circularly mix the liquid medicine in the groove so as to ensure the uniformity of the liquid medicine, in addition, the temperature is stably controlled by the cold-heat exchanger in the, the automatic adjustment device can automatically adjust the process deviation in the black silicon production process, reduce the workload of personnel, and greatly improve the product yield and the process stability.
Drawings
FIG. 1 is a block diagram of a reflectance self-adjusting black silicon product production system according to the present invention.
FIG. 2 is a schematic diagram of a bubble sensor of a system for self-adjusting reflectivity of black silicon product according to the present invention
In the figure: 1-basket outlet mechanical arm, 2-human-computer interface, 3-bubble sensor, 4-liquid supplementing device, 5-ultrasonic emission probe, 6-circulating pump, 7-basket inlet mechanical arm, 8-pulse generation circuit, 9-micro control unit MCU module, 10-ultrasonic receiving probe and 11-operational amplifier circuit
Note that: black silicon technology: the micro-nano hole structure is prepared on the surface of the silicon wafer, so that the absorption of crystalline silicon to light is increased, the purpose of improving the conversion efficiency of the crystalline silicon battery is achieved, and the silicon wafer prepared by the technology is black in surface and is called as a black silicon technology.
Digging a hole: the process of forming pores in the silicon by the silver deposited on the surface of the silicon wafer through redox reaction is called hole digging, and the deeper the hole digging time is, the better the light absorption effect is and the higher the photoproduction current is.
Reaming: one step in the black silicon process aims to prepare larger and more round holes through HF/HNO3 mixed solution so as to reduce the recombination of photon-generated carriers (4 electrons on the outer layer of a silicon atom can be stably bonded, one electron on the outermost silicon atom of a silicon wafer is not bonded and can be used as a dangling bond to recombine the photon-generated carriers, the more porous the surface burrs are, the larger the specific surface area is, the more serious the recombination is, the lower the battery efficiency is), and the larger the hole diameter is, the higher the reflectivity is. The aperture of the nano hole needs to be ensured within a certain range so as to have good light trapping effect and low photon-generated carrier recombination.
A flower basket: device for containing silicon wafers
A black silicon machine platform: a groove type machine for producing black silicon suede.
Detailed Description
The present invention will be further illustrated with reference to the following specific examples.
Examples
Referring to fig. 1-2, the present embodiment provides a system for producing black silicon products with self-adjusting reflectivity, comprising a PLC controller, a bubble sensor 3, a human-computer interface 2, a circulating pump 6, a fluid infusion device 4, a basket feeding manipulator 7, and a basket discharging manipulator 1, wherein the bubble sensor 3 is disposed in a hole digging groove and a hole expanding groove, and is electrically connected to the PLC controller, and adopts a bidirectional transmission mode to feed back signals to each other, the human-computer interface 2 is disposed on the black silicon machine, is electrically connected to the PLC controller, and adopts a bidirectional transmission mode to feed back signals to each other, the basket feeding manipulator 7 and the basket discharging manipulator 1 are electrically connected to the PLC controller, and adopt a bidirectional transmission mode to feed back signals to each other, the circulating pump 6 is disposed at the bottom of the hole digging groove and is electrically connected to the PLC controller, and adopts a unidirectional transmission mode to feed back signals, the fluid infusion device 4 is disposed outside the black silicon machine, and adopts a unidirectional transmission mode to, firstly, a man-machine interface 2 controls a basket entering manipulator 7 to lift a flower basket into a hole digging groove, the chemical reaction process of silicon chips and liquid medicine is accompanied with the release of bubbles during hole digging, a large amount of bubbles are generated in a solution when the silicon chips and the liquid medicine react for 100s under the condition of normal reaction rate, the reaction time is set to be 220s, the depth of a black silicon hole is normal, the reflectivity of the bubbles is reduced by 1% when 10s is generated in advance, the reflectivity of the bubbles is increased by 1% when 10s is delayed, a bubble sensor 3 is arranged at the opposite angle of the hole digging groove, the bubble sensor 3 consists of an ultrasonic transmitting probe 5, a pulse generating circuit 8, a micro control unit MCU module 9, an operational circuit 11 and an ultrasonic receiving probe 10, the bubble sensor 3 and a PLC controller bidirectionally, the time from the basket feeding mechanical arm 7 to the hole digging groove to the beginning of bubble generation is set to be t1 through the human-computer interface 2, and the hole digging groove process time t is automatically adjusted according to the following formula: when t1 is less than 100 seconds, t =220- (100-t1), and conversely when t1 is greater than 100 seconds, the process time t is corrected according to the formula t =220+ (t 1-100). According to the invention, the hole digging groove is additionally provided with the bubble sensor, the reaction speed is judged by a signal generated by bubbles sensed by the bubble sensor 3 when the silicon chip reacts in the hole digging groove, and meanwhile, a pulse signal is fed back to the PLC controller to further reflect to the human-computer interface 2 to automatically adjust the hole digging time, so that the adjustment of the reflectivity is further realized.
After the hole digging reaction is finished, the man-machine interface 2 controls the basket feeding mechanical arm 1 to send the silicon wafer to a hole enlarging groove, a bubble sensor 3 is arranged on the opposite angle of the hole enlarging groove, a large amount of bubbles are generated when the hole enlarging reaction is normal for 30S, the aperture of the black silicon obtained when the reaction time is set to be 100S is normal, the reflectivity of the black silicon generated at the hole enlarging speed is reduced by 1.5% every time when the bubbles generate 10S delay, the bubble sensor 3 is arranged on the opposite angle of the hole digging groove, the bubble sensor 3 comprises an ultrasonic transmitting probe 5, a pulse generating circuit 8, a micro control unit MCU module 9, an operational circuit 11 and an ultrasonic receiving probe 10, the bubble sensor 3 and a PLC controller bidirectionally transmit feedback signals, the time from the basket feeding mechanical arm 1 to the hole enlarging groove to the bubble generation is set to be S1 through the man-machine interface 2, the hole digging groove process time S is corrected according to the following formula that the hole enlarging time S1 is automatically adjusted, on the contrary, the correction is carried out according to s =100+ (s1-30), the bubble sensor is additionally arranged on the reaming groove, the reaction speed is judged according to a signal generated by bubbles sensed by the bubble sensor 3 when the silicon chip reacts in the reaming groove, meanwhile, a pulse signal is fed back to the PLC, the pulse signal is further reflected to the human-computer interface 2 to automatically adjust the hole digging time, and the adjustment of the reflectivity is further realized.
In the embodiment, after the reaction time is over, the hole digging groove cover is immediately opened, the PLC controller controls the relay, the circulating pump 6 is closed by the aid of the CR-S024VADC1CRS, the problem that disturbance of the solution affects the hole digging chemical reaction process is avoided, the basket feeding mechanical arm 7 is unhooked, the basket is discharged, the basket feeding mechanical arm 1 is controlled to lift the basket after the action is completed through the PLC controller, and the liquid replenishing device 4 performs automatic liquid replenishing when the solution is insufficient.
In the embodiment, a flower basket is lifted and placed into a hole digging groove or a hole expanding groove through a basket entering mechanical hand 7, after the process time of the former groove body reaches, a groove cover is opened immediately and simultaneously a lifting signal is related to bubbling, a PLC controller controls a relay to close a circulating pump 6, the influence of solution disturbance on a chemical reaction process is avoided, when the basket entering mechanical hand 7 is unhooked and the flower basket is placed, an unhooking signal is opened through a PLC controller related bubble sensor 3, a human-computer interface 2 carries out process timing, when the time of a large amount of reaction bubbles is fed back to the PLC controller to correct the reaction time according to a calculation formula, the process set time of the corresponding human-computer interface 2 is synchronously and automatically changed, after the reaction time reaches the process set time, the relay closes the circulating pump 6 to be opened to fully and circularly mix liquid medicine in the groove to ensure the uniformity of the liquid medicine, and the temperature, meanwhile, an electromagnetic switch for controlling the bubble tube and the magnetostrictive liquid supplementing is controlled to open the liquid supplementing device 4, the liquid medicine is automatically supplemented, and finally the basket discharging manipulator 2 lifts the flower basket.
In this example: the conventional black silicon product and a system for producing black silicon products with self-regulated reflectance (time versus reflectance) are as follows:
the reflectivity of the invention can be stabilized within 17.5 from the experimental data.
The battery prepared when the reflectivity is about 17% can give consideration to good light absorption capacity and lower photogenerated carrier current, and the battery comes from power technology, author No. 10 in 2011: zhangtouyun and Lishui root.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (4)
1. A system for producing black silicon products through reflectivity self-adjustment comprises a PLC (programmable logic controller), a bubble sensor (3), a human-computer interface (2), a circulating pump (6), a liquid supplementing device (4), a basket feeding mechanical arm (7) and a basket discharging mechanical arm (1), wherein the bubble sensor (3) is respectively arranged in a hole digging groove and a hole expanding groove and is electrically connected with the PLC, signals are mutually fed back in a bidirectional transmission mode, the human-computer interface (2) is arranged on a black silicon machine table and is electrically connected with the PLC, signals are mutually fed back in a bidirectional transmission mode, the basket feeding mechanical arm (7) and the basket discharging mechanical arm (1) are electrically connected with the PLC and are mutually fed back in a bidirectional transmission mode, the circulating pump (6) is arranged at the bottom of the hole digging groove and is electrically connected with the PLC, and is fed back in a unidirectional transmission mode, the liquid supplementing device (4) is arranged outside a black silicon machine table and feeds back signals in a one-way transmission mode with a PLC (programmable logic controller), the time from the basket feeding manipulator (7) to the hole digging groove to the beginning of bubble generation is set to be t1 through a human-computer interface (2), the hole digging groove process time t is automatically adjusted according to the following formula, when t1 is less than 100 seconds, the t 220- (100-t1) is opposite, when t1 is more than 100 seconds, the process time t is corrected according to the formula t 220+ (t1-100), when s1 is less than 30 seconds, the hole reaming groove process time s is corrected according to the formula s 100- (30-s1), and otherwise, the automatic correction is performed according to the formula s 100+ (s1-30), so that the automatic adjustment of the process deviation of the reflectivity in the silicon wafer production process is achieved.
2. The system for self-adjusting the reflectance of black silicon product produced according to claim 1, wherein the PLC controller is model DVP24SV11T 2.
3. A system for self-regulating the reflectance of black silicon product according to claim 1, wherein the bubble sensor (3) is of type a230 and is made of PVDF.
4. A system for self-regulating the reflectance of black silicon product according to claim 1, wherein the circulation pump (6) is of the type AMX-441 feava-1, with a power of 0.75KW and a voltage of 380V.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1645587A (en) * | 2004-01-20 | 2005-07-27 | 台湾积体电路制造股份有限公司 | Control apparatus and method for preventing wafer from breaking |
| KR20180008175A (en) * | 2016-07-15 | 2018-01-24 | 주식회사 효성 | Pressurized membrane water treatment apparatus |
| CN207868217U (en) * | 2017-12-27 | 2018-09-14 | 通威太阳能（成都）有限公司 | A kind of texturing slot changing liquid automatically system |
| CN207938620U (en) * | 2018-04-11 | 2018-10-02 | 维科诚（苏州）光伏科技有限公司 | A kind of pre- etching device of diamond wire silicon chip |
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- 2018-12-29 CN CN201811641160.9A patent/CN109768004B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1645587A (en) * | 2004-01-20 | 2005-07-27 | 台湾积体电路制造股份有限公司 | Control apparatus and method for preventing wafer from breaking |
| KR20180008175A (en) * | 2016-07-15 | 2018-01-24 | 주식회사 효성 | Pressurized membrane water treatment apparatus |
| CN207868217U (en) * | 2017-12-27 | 2018-09-14 | 通威太阳能（成都）有限公司 | A kind of texturing slot changing liquid automatically system |
| CN207938620U (en) * | 2018-04-11 | 2018-10-02 | 维科诚（苏州）光伏科技有限公司 | A kind of pre- etching device of diamond wire silicon chip |
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