CN109760291A - A kind of bending structure, bending device and bending method - Google Patents
A kind of bending structure, bending device and bending method Download PDFInfo
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- CN109760291A CN109760291A CN201910101245.6A CN201910101245A CN109760291A CN 109760291 A CN109760291 A CN 109760291A CN 201910101245 A CN201910101245 A CN 201910101245A CN 109760291 A CN109760291 A CN 109760291A
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- flexible panel
- solidification glue
- fixed part
- bending structure
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- 238000005452 bending Methods 0.000 title claims abstract description 229
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 90
- 238000007711 solidification Methods 0.000 claims abstract description 90
- 230000008023 solidification Effects 0.000 claims abstract description 90
- 238000001179 sorption measurement Methods 0.000 claims description 30
- 239000000956 alloy Substances 0.000 claims description 14
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 239000006249 magnetic particle Substances 0.000 claims description 13
- 238000010521 absorption reaction Methods 0.000 claims description 11
- 230000005389 magnetism Effects 0.000 claims description 6
- 239000006260 foam Substances 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910000859 α-Fe Inorganic materials 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910000765 intermetallic Inorganic materials 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 229910000828 alnico Inorganic materials 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- -1 for example Inorganic materials 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- RQMIWLMVTCKXAQ-UHFFFAOYSA-N [AlH3].[C] Chemical compound [AlH3].[C] RQMIWLMVTCKXAQ-UHFFFAOYSA-N 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910002546 FeCo Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910016629 MnBi Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910002837 PtCo Inorganic materials 0.000 description 1
- ARWMTMANOCYRLU-UHFFFAOYSA-N [Ca].[La] Chemical compound [Ca].[La] ARWMTMANOCYRLU-UHFFFAOYSA-N 0.000 description 1
- CLBRCZAHAHECKY-UHFFFAOYSA-N [Co].[Pt] Chemical compound [Co].[Pt] CLBRCZAHAHECKY-UHFFFAOYSA-N 0.000 description 1
- QVYYOKWPCQYKEY-UHFFFAOYSA-N [Fe].[Co] Chemical compound [Fe].[Co] QVYYOKWPCQYKEY-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- KYAZRUPZRJALEP-UHFFFAOYSA-N bismuth manganese Chemical compound [Mn].[Bi] KYAZRUPZRJALEP-UHFFFAOYSA-N 0.000 description 1
- VAWSWDPVUFTPQO-UHFFFAOYSA-N calcium strontium Chemical compound [Ca].[Sr] VAWSWDPVUFTPQO-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910000777 cunife Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
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Abstract
The present invention provides a kind of bending structure, bending device and bending methods.For bending flexible panel；The bending structure is bonded the one side that the flexible panel has solidification glue；The bending structure includes the first fixed part, the second fixed part, and the bending part between first fixed part and second fixed part；First fixed part is configured as fixing one end of the flexible panel；Second fixed part is configured as fixing the other end of the flexible panel, and bends the flexible panel；The bending part is configured as adsorbing the solidification glue during bending the flexible panel and fix, and generates the surface matching of curved surface and the solidification glue that deformation makes towards the flexible panel side.
Description
Technical field
The present invention relates to display panel manufacturing technology fields, more particularly to a kind of bending structure, bending device and bending
Method.
Background technique
Currently, commonly bending technology is to fix the both ends of flexible panel respectively, the bending region of flexible panel 10 is vacant
And bent around rotation center, as shown in Figure 1.Flexible panel 10 includes PI substrate 101, and the side of PI substrate is provided with purple
Outer optic-solidified adhesive 102, the other side is provided with notacoria 103, and is gone in the needs of notacoria 103 that flexible panel 10 bends region
It removes.Since the bending region of flexible panel 10 is more fragile, it is easy in the starting point that notacoria removes and end bending half
Diameter is too small, and leads to the problem of wire breaking occur.For example, breaking point shown in FIG. 1.
Summary of the invention
The present invention provides a kind of bending structure, bending device and bending method, to solve flexible panel in the prior art
The problem of bending region is more fragile, is easy to appear wire breaking.
To solve the above-mentioned problems, the invention discloses a kind of bending structures, for bending flexible panel；The bending knot
Structure is bonded the one side that the flexible panel has solidification glue；
The bending structure includes the first fixed part, the second fixed part, and is located at first fixed part and described second
Bending part between fixed part；
First fixed part is configured as fixing one end of the flexible panel；
Second fixed part is configured as fixing the other end of the flexible panel, and bends the flexible panel；
The bending part is configured as adsorbing the solidification glue during bending the flexible panel and fix, and
Generating deformation makes the surface matching of curved surface and the solidification glue towards the flexible panel side.
Optionally, the bending part includes multiple bend units, has bending gap between adjacent bend unit；
The bending part is configured as compressing the bending gap during bending the flexible panel, so that respectively
The bend unit is towards the curved surface of the flexible panel side and the surface matching of the solidification glue.
Optionally, the bending gap is wedge shaped.
Optionally, the bending part includes the electromagnetic device being arranged away from the side of the flexible panel；
The electromagnetic device generates magnetism, to adsorb the solidification glue when being configured as being powered；Wherein, in the solidification
Magnetic-particle is provided in glue.
Optionally, the magnetic-particle includes casting alloy, sintered alloy, processable alloy, ferrite, intermetallic
At least one of object.
Optionally, the bending part is being provided with adsorption layer towards the side of the solidification glue；In each bend unit
It is internally provided with vacuum hole；
The vacuum hole is separately connected the adsorption layer and vacuum plant, is configured as leading to the vacuum of the vacuum plant
Enter the adsorption layer, so that solidification glue described in the adsorption layer vacuum suction.
Optionally, the adsorption layer includes foam porous material.
Optionally, the material of the bending structure includes at least one of stainless steel, alloy.
The embodiment of the invention also provides a kind of bending device, the bending device includes such as above-mentioned bending structure.
The embodiment of the invention also provides a kind of bending methods, applied to such as above-mentioned bending device, which comprises
Bending structure in the bending device is fitted in flexible panel on the surface of solidification glue；
First fixed part of the bending structure and the second fixed part are fixed on to the both ends of the flexible panel respectively；
By the fixed solidification glue of bending part absorption of the bending structure；
It controls second fixed part and bends the flexible panel.
Compared with prior art, the present invention includes the following advantages:
Bending structure is bonded the one side that flexible panel has solidification glue；Bending structure is fixed including the first fixed part, second
Portion, and the bending part between the first fixed part and the second fixed part；One end of the fixed flexible panel of first fixed part；Second
The other end of the fixed flexible panel of fixed part, and bend flexible panel；Bending part is during bending flexible panel to solidification
Glue absorption is fixed, and generates the surface matching of curved surface and solidification glue that deformation makes towards flexible panel side.It is real through the invention
Example is applied, bending structure can control the pattern that flexible panel bends region in the process of bending, avoid local stress excessive, to thin
The problem of weakness is pullled and causes wire breaking.
Detailed description of the invention
Fig. 1 shows the bending sketch map of the flexible panel in background technique；
Fig. 2 shows a kind of one of the schematic diagrames of bending structure of the embodiment of the present invention one；
Fig. 3 shows the two of the schematic diagram of a kind of bending structure of the embodiment of the present invention one；
Fig. 4 shows the three of the schematic diagram of a kind of bending structure of the embodiment of the present invention one；
Fig. 5 shows the four of the schematic diagram of a kind of bending structure of the embodiment of the present invention one；
Fig. 6 shows the five of the schematic diagram of a kind of bending structure of the embodiment of the present invention one；
Fig. 7 shows the six of the schematic diagram of a kind of bending structure of the embodiment of the present invention one；
Fig. 8 shows a kind of step flow chart of bending method of the embodiment of the present invention three.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
Embodiment one
Referring to Fig. 2, a kind of schematic diagram of bending structure provided in an embodiment of the present invention is shown.For bending flexible panel
10；The bending structure 20 is bonded the one side that the flexible panel 10 has solidification glue 102；
The schematic diagram of bending structure referring to shown in Fig. 3, the bending structure 20 are solid including the first fixed part 201, second
Determine portion 202, and the bending part 203 between first fixed part 201 and second fixed part 202；
First fixed part 201 is configured as fixing one end of the flexible panel 10；
Second fixed part 202 is configured as fixing the other end of the flexible panel 10, and bends the flexible face
Plate 10；
The bending part 203 is configured as adsorbing the solidification glue 102 during bending flexible panel 10
It is fixed, and generate the surface matching of curved surface and the solidification glue 102 that deformation makes towards 10 side of flexible panel.
In the present embodiment, referring to shown in Fig. 2, flexible panel 10 includes PI substrate 101, is arranged in the one side of PI substrate 101
There is solidification glue 102, another side is provided with notacoria 103.With 102 the same face of solidification glue, one end of PI substrate be provided with touch pass
Sensor 104, polaroid 105, the other end are provided with COF (Chip On Flex, flip chip) 106, flexible circuit board 107.Its
In, the bending region of PI substrate 101 is arranged in solidification glue 102, and the region of 103 face solidification glue 102 of gum is removed.Bending knot
Structure 20 is fitted in the one side that flexible panel 10 has solidification glue 102.
Referring to Fig. 3, bending structure 20 includes the first fixed part 201, the second fixed part 202 and bending part 203.Wherein,
One fixed part 201 and the second fixed part 202 fix the both ends of flexible panel 10 respectively.For example, the first fixed part 201 can be fixed
On polaroid 105, the second fixed part 202 can be fixed on COF106 and flexible circuit board 107, as shown in Figure 2.Bending knot
Structure 20 bend flexible panel 10 when, the second fixed part 202 to flexible panel 10 exert a force, make flexible panel 10 go for a stroll compromise the heart progress
Bending, the schematic diagram of bending structure as shown in Figure 4.
During bending, the bending part 203 of bending structure 20 adsorbs the solidification glue 102 on flexible panel 10 solid
It is fixed.Also, deformation occurs in the process of bending for bending part 203, curved surface and solidification of the bending part 203 towards 10 side of flexible panel
The surface matching of glue 102, the i.e. curved surface of bending part 203 are attached with 102 surface of solidification glue always.Compared with prior art, this hair
In bright embodiment, bending structure during bending flexible panel 10, can control the shape in the bending region of flexible panel 10
The problem of looks avoid local stress excessive, are pullled to the weak spot that flexible panel 10 bends region and cause wire breaking.
In a preferred embodiment of the present invention, the bending part 203 includes multiple bend units 2031, adjacent bend list
There is bending gap 2032 between member 2031；
The bending part 203 is configured as compressing the bending gap during bending flexible panel 10
2032, so that each bend unit 2031 is towards the curved surface of 10 side of flexible panel and the surface of the solidification glue 102
Matching.
In the present embodiment, bending part 203 may include multiple bend units 2031, have between adjacent bend unit 2031
Bend gap 2032.During bending flexible panel 10, the compression adjacent to each other of each bend unit 2031 bends gap 2032,
And the curved surface of each bend unit 2031 towards 10 side of flexible panel is bonded with the surface of solidification glue 102 always, sees Fig. 3 institute
Show.The curved surface of bending part 203 and the surface matching of solidification glue 102, can control the bent area in the process of bending of flexible panel 10
The problem of pattern in domain avoids the excessive weak spot for pullling flexible panel 10 of local pressure, causes wire breaking.
In a preferred embodiment of the present invention, referring to Fig. 3, the bending gap 2032 is wedge shaped.
In the present embodiment, bending gap 2032 can be wedge shaped, and the embodiment of the present invention does not limit this in detail, Ke Yigen
It is configured according to actual conditions.
In a preferred embodiment of the present invention, the schematic diagram of bending structure referring to Figure 5, the bending part 203
Including the electromagnetic device 2033 being arranged away from the side of the flexible panel 10；
The electromagnetic device 2033 generates magnetism, to adsorb the solidification glue 102 when being configured as being powered；Wherein, in institute
It states in solidification glue 102 and is provided with magnetic-particle.
In the present embodiment, bending part 203 carries out absorption fixation to solidification glue 102, can be by the way of electromagnetic adsorption.Tool
Body, magnetic-particle is set in solidification glue 102, and electromagnetic device is arranged in the side away from flexible panel 10 in bending part 203
2033.Electromagnetic device 2033 generates magnetic magnetic-particle in absorption solidification glue 102 when being powered, to realize to solidification glue
102 absorption are fixed, and make bending part 203 towards the curved surface of 10 side of flexible panel and the surface matching of solidification glue 102, reference
The schematic diagram of bending structure shown in fig. 6.Compared with prior art, solidification glue 102 is adsorbed and is fixed, make the song of bending part 203
The surface matching in face and solidification glue 102 can control the pattern that flexible panel 10 bends region, avoid local pressure is excessive from pullling
The weak spot of flexible panel 10, the problem of causing wire breaking.
In a preferred embodiment of the present invention, the magnetic-particle includes casting alloy, sintered alloy, processable conjunction
At least one of gold, ferrite, intermetallic compound.
In the present embodiment, magnetic-particle may include casting alloy, for example, alnico AlNiCo, siderochrome cobalt FeCrCo, iron
Chrome molybdenum FeCrMo, iron aluminium carbon FeAlC, iron cobalt FeCo etc..It also may include sintered alloy, for example, rare earth element Re-cobalt Co, dilute
Earth elements Re- iron Fe, alnico AlNiCo, siderochrome cobalt FeCrCo etc..It can also include processable alloy, for example, siderochrome cobalt
FeCrCo, platinum cobalt PtCo, manganese aluminium carbon MnAlC, cupro-nickel iron CuNiFe, aluminium manganese silver AlMnAg etc..It can also include ferrite, mainly
Ingredient is MO6Fe2O3, and wherein M represents the compounding ingredients such as barium Ba, strontium Sr, lead Pb, strontium calcium SrCa, lanthanum calcium LaCa.It can also wrap
Include intermetallic compound, such as manganese bismuth MnBi.The embodiment of the present invention does not limit magnetic-particle in detail, can be according to practical feelings
Condition is configured.
In a preferred embodiment of the present invention, referring to the schematic diagram of bending structure shown in Fig. 7, the bending part 203
The side of the solidification glue 102 is being provided with adsorption layer 2034；Vacuum is internally provided in each bend unit 2031
Hole 2035；
The vacuum hole 2035 is separately connected the adsorption layer 2034 and vacuum plant, is configured as the vacuum plant
Vacuum be passed through the adsorption layer 2034 so that solidification glue 102 described in 2034 vacuum suction of the adsorption layer.
In the present embodiment, bending part 203 carries out absorption fixation to solidification glue 102, can also be by the way of vacuum suction.
Specifically, bending part 203 is provided with adsorption layer 2034 in the side towards solidification glue 102, sets inside each bend unit 2031
It is equipped with vacuum hole 2035, wherein vacuum hole 2035 connects adsorption layer 2034.Vacuum hole 2035 is also connected with external vacuum plant, when
When vacuum plant starts, vacuum can enter adsorption layer 2034 by vacuum hole 2035, so that the absorption of adsorption layer 2034 be made to fix
Solidification glue 102 makes bend unit 2031 towards the curved surface of 10 side of flexible panel and the surface matching of solidification glue 102.With it is existing
Technology is compared, and in the embodiment of the present invention, bending structure 20 can control flexible panel 10 during bending flexible panel 10
The pattern for bending region, avoids local stress excessive the problem of pullling weak spot, causing wire breaking.
In a preferred embodiment of the present invention, the adsorption layer 2034 includes foam porous material.
In the present embodiment, adsorption layer 2034 may include foam porous material.One side vacuum by vacuum hole 2035 into
Enter in foam porous material, the fixed solidification glue 102 of vacuum suction may be implemented；On the other hand, 203 court of bending part can also be made
The surface engagement of curved surface and solidification glue 102, in during bending flexible panel 10, control flexible panel 10 is curved
The pattern in folding area domain avoids local pressure excessive the problem of pullling weak spot, causing wire breaking.
In a preferred embodiment of the present invention, the material of the bending structure 20 include stainless steel, in alloy at least
It is a kind of.
In the present embodiment, bending structure 20 can be made of at least one of stainless steel, alloy material, and the present invention is implemented
Example does not limit this in detail, can be configured according to the actual situation.
In conclusion bending structure is bonded the one side that flexible panel has solidification glue in the embodiment of the present invention；Bending structure
Bending part including the first fixed part, the second fixed part, and between the first fixed part and the second fixed part；First fixed part
One end of fixed flexible panel；The other end of the fixed flexible panel of second fixed part, and bend flexible panel；Bending part is being bent
Solidification glue is adsorbed during flexible panel and is fixed, and generates deformation to make curved surface and solidification glue towards flexible panel side
Surface matching.Through the embodiment of the present invention, bending structure can control the pattern that flexible panel bends region in the process of bending,
Avoid local stress excessive, the problem of pullled weak spot and cause wire breaking.
Embodiment two
A kind of bending device provided in an embodiment of the present invention, the bending device include the bending knot as described in embodiment one
Structure 20.
In the present embodiment, bending structure 20 includes the first fixed part 201, the second fixed part 202 and bending part 203, bending
Portion 203 is between the first fixed part 201 and the second fixed part 202.First fixed part 201 can be fixed on polaroid 105,
Second fixed part 202 can be fixed on COF and flexible circuit board, as shown in Figure 2.Bending structure 20 bends flexible panel 10
When, the second fixed part 202 exerts a force to flexible panel 10, bends the go for a stroll heart of compromising of flexible panel 10, as shown in Figure 4.
During bending, the bending part 203 of bending structure 20 adsorbs the solidification glue 102 on flexible panel 10 solid
It is fixed.Also, deformation occurs in the process of bending for bending part 203, towards the curved surface of 10 side of flexible panel and the table of solidification glue 102
Face matching, i.e., the curved surface of bending part 203 is bonded with the surface of solidification glue 102 always.Compared with prior art, the embodiment of the present invention
The pattern that flexible panel 10 bends region can be controlled during bending flexible panel 10, avoid local stress is excessive from pullling
To weak spot, the problem of causing wire breaking.
Bending structure 20 can be using the fixed solidification glue 102 of electromagnetic adsorption.Specifically, it is arranged in solidification glue 102 and is magnetic
Particle, bending part 203 are provided with electromagnetic device 2033 in the side away from flexible panel 10, and electromagnetic device 2033 generates when being powered
Magnetism, can be with the magnetic-particle in absorption solidification glue 102, to realize the effect for adsorbing fixed solidification glue 102.Bending structure 20
Fixed solidification glue 102 is adsorbed, the pattern that flexible panel 10 bends region is can control, avoids local pressure is excessive from bringing flexibility up
The weak spot of panel 10, the problem of causing wire breaking.Bending device may include power supply unit, and power supply unit is electromagnetic device
2033 power supplies, make electromagnetic device 2033 generate magnetism, adsorb fixed solidification glue 102.The embodiment of the present invention does not make power supply unit
It limits, can be configured according to the actual situation in detail.
Bending structure 20 can also adsorb fixed solidification glue 102 by the way of vacuum suction.Specifically, bending part 203
Side towards solidification glue 102 is provided with adsorption layer 2034, is internally provided with vacuum hole 2035 in each bend unit 2031,
Middle vacuum hole 2035 connects adsorption layer 2034.Bending device may include vacuum plant, and vacuum plant connects bending structure 20
Vacuum hole 2035.When vacuum plant starting, vacuum can enter adsorption layer 2034 by vacuum hole 2035, to make adsorption layer
2034 adsorb fixed solidification glue 102, and make curved surface and solidification glue 102 of the bend unit 2031 towards 10 side of flexible panel
Surface matching.Compared with prior art, the embodiment of the present invention can control flexible panel during bending flexible panel 10
The pattern in 10 bending regions, the problem of avoiding the excessive weak spot for pullling flexible panel 10 of local stress, cause wire breaking.
The embodiment of the present invention does not limit vacuum plant in detail, can be configured according to the actual situation.
In conclusion bending device includes bending structure in the embodiment of the present invention, bending structure fitting flexible panel has
The one side of solidification glue；Bending structure includes the first fixed part, the second fixed part, and be located at the first fixed part and the second fixed part it
Between bending part；One end of the fixed flexible panel of first fixed part；The other end of the fixed flexible panel of second fixed part, and bend
Flexible panel；Bending part, which adsorbs solidification glue during bending flexible panel, to be fixed, and is generated deformation and made towards flexible face
The curved surface of plate side and the surface matching of solidification glue.Through the embodiment of the present invention, bending structure can control flexible panel curved
The pattern that region is bent during folding, avoids local stress excessive, the problem of pullled weak spot and cause wire breaking.
Embodiment three
Referring to Fig. 8, a kind of step flow chart of bending method provided in an embodiment of the present invention is shown.Applied to such as implementation
Bending device described in example two, which comprises
Step 301, the bending structure 20 in the bending device is fitted in the table that flexible panel 10 has solidification glue 102
On face.
In the present embodiment, it is provided with solidification glue 102 on flexible panel 10, the bending structure 20 in bending device is fitted in
Flexible panel 10 has on the surface of solidification glue 102, can make entire 10 uniform force of flexible panel.The material of bending structure 20
It may include at least one of stainless steel, alloy.The embodiment of the present invention does not limit this in detail, can be according to the actual situation
It is configured.
Step 302, the first fixed part 201 of the bending structure 20 and the second fixed part 202 are fixed on respectively described
The both ends of flexible panel 10.
In the present embodiment, bending structure 20 includes the first fixed part 201, the second fixed part 202 and bending part 203, wherein
Bending part 203 is between the first fixed part 201 and the second fixed part 202.Respectively by the first fixed part 201 and the second fixed part
202 are fixed on the both ends of flexible panel 10.For example, as shown in Figure 2, the first fixed part 201 can be fixed on polaroid, it will
Second fixed part 202 is fixed on COF and flexible circuit board.The embodiment of the present invention does not limit fixed form in detail, can be with
It is configured according to the actual situation.
Step 303, by the fixed solidification glue 102 of the absorption of bending part 203 of the bending structure 20.
In the present embodiment, bending part 203 can adsorb fixed solidification glue 102 by the way of electromagnetic adsorption.Specifically, curved
Folding equipment may include power supply unit, and bending part 203 is provided with electromagnetic device 2033 in the side away from flexible panel 10, flexible
Electromagnetic particle is provided in the solidification glue 102 of panel 10.Power supply unit connects electromagnetic device 2033, supplies for electromagnetic device 2033
Electricity, electromagnetic device 2033 generate magnetism after powered up, and the magnetic-particle in absorption solidification glue 102 realizes the suction to solidification glue 102
Attached fixation.Adsorbing fixed solidification glue 102 can be to avoid flexible base board in the process of bending, and local pressure is excessive to pull weakness
Point, the problem of causing wire breaking.
Bending part 203 can also adsorb fixed solidification glue 102 by way of vacuum suction.Specifically, bending part 203 wraps
Multiple bend units 2031 are included, each bend unit 2031 is internally provided with vacuum hole 2035, and bending part 203 is close to flexible face
The side of plate 10 is provided with adsorption layer 2034, and vacuum hole 2035 connects adsorption layer 2034.Bending device may include vacuum plant,
Vacuum hole 2035 connects vacuum plant.When vacuum plant starting, vacuum is passed through adsorption layer 2034 by vacuum hole 2035, makes to inhale
The fixed solidification glue 102 of attached 2034 vacuum suction of layer, so as to control flexible panel 10 during bending flexible panel 10
The pattern for bending region, avoids local pressure excessive the problem of pullling weak spot, causing wire breaking.
Step 304, it controls second fixed part 202 and bends the flexible panel 10.
In the present embodiment, the second fixed part 202 of control, which is gone for a stroll, rolls over center movement, i.e. control bending structure 20 is bent, thus
Bend flexible panel 10.Since bending structure 20 is fitted on flexible panel 10, and the bending part 203 of bending structure 20 adsorbs
The solidification glue 102 of fixed flexible panel 10 can control flexible panel 10 and bend region during bending flexible panel 10
Pattern, the problem of avoiding the excessive weak spot for pullling flexible panel 10 of local pressure, lead to wire breaking.
In conclusion the bending structure in bending device, which is fitted in flexible panel, has solidification in the embodiment of the present invention
On the surface of glue；First fixed part of bending structure and the second fixed part are fixed on to the both ends of flexible panel respectively；It will bending
The bending part of structure adsorbs fixed solidification glue；Control the second fixed part bending flexible panel.Through the embodiment of the present invention, it can control
Flexible panel processed bends the pattern in region in the process of bending, avoids local stress excessive, is pullled weak spot and caused
The problem of wire breaking.
All the embodiments in this specification are described in a progressive manner, the highlights of each of the examples are with
The difference of other embodiments, the same or similar parts between the embodiments can be referred to each other.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, commodity or the equipment that include a series of elements not only include that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, commodity or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in process, method, commodity or the equipment for including the element.
Above to a kind of bending structure provided by the present invention, bending device and bending method, it is described in detail, this
Apply that a specific example illustrates the principle and implementation of the invention in text, the explanation of above example is only intended to
It facilitates the understanding of the method and its core concept of the invention；At the same time, for those skilled in the art, think of according to the present invention
Think, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification should not be construed as pair
Limitation of the invention.
Claims (10)
1. a kind of bending structure, which is characterized in that for bending flexible panel；The bending structure is bonded the flexible panel tool
There is the one side of solidification glue；
The bending structure includes the first fixed part, the second fixed part, and is located at first fixed part and described second and fixes
Bending part between portion；
First fixed part is configured as fixing one end of the flexible panel；
Second fixed part is configured as fixing the other end of the flexible panel, and bends the flexible panel；
The bending part is configured as adsorbing the solidification glue during bending the flexible panel and fix, and generates
Deformation makes the surface matching of curved surface and the solidification glue towards the flexible panel side.
2. bending structure according to claim 1, which is characterized in that the bending part includes multiple bend units, adjacent
There is bending gap between bend unit；
The bending part is configured as compressing the bending gap during bending the flexible panel, so that each described
Bend unit is towards the curved surface of the flexible panel side and the surface matching of the solidification glue.
3. bending structure according to claim 2, which is characterized in that the bending gap is wedge shaped.
4. bending structure according to claim 2, which is characterized in that the bending part includes away from the flexible panel
The electromagnetic device of side setting；
The electromagnetic device generates magnetism, to adsorb the solidification glue when being configured as being powered；Wherein, in the solidification glue
It is provided with magnetic-particle.
5. bending structure according to claim 4, which is characterized in that the magnetic-particle includes casting alloy, sintering conjunction
At least one of gold, processable alloy, ferrite, intermetallic compound.
6. bending structure according to claim 2, which is characterized in that the bending part is arranged towards the side of the solidification glue
There is adsorption layer；Vacuum hole is internally provided in each bend unit；
The vacuum hole is separately connected the adsorption layer and vacuum plant, is configured as the vacuum of the vacuum plant being passed through institute
Adsorption layer is stated, so that solidification glue described in the adsorption layer vacuum suction.
7. bending structure according to claim 6, which is characterized in that the adsorption layer includes foam porous material.
8. bending structure according to claim 1, which is characterized in that the material of the bending structure includes stainless steel, closes
At least one of gold.
9. a kind of bending device, which is characterized in that the bending device includes bending knot as claimed in any one of claims 1 to 6
Structure.
10. a kind of bending method, which is characterized in that be applied to bending device as claimed in claim 9, which comprises
Bending structure in the bending device is fitted in flexible panel on the surface of solidification glue；
First fixed part of the bending structure and the second fixed part are fixed on to the both ends of the flexible panel respectively；
By the fixed solidification glue of bending part absorption of the bending structure；
It controls second fixed part and bends the flexible panel.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910101245.6A CN109760291B (en) | 2019-01-31 | 2019-01-31 | Bending structure, bending equipment and bending method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910101245.6A CN109760291B (en) | 2019-01-31 | 2019-01-31 | Bending structure, bending equipment and bending method |
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| CN109760291A true CN109760291A (en) | 2019-05-17 |
| CN109760291B CN109760291B (en) | 2021-03-19 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103167070A (en) * | 2011-11-15 | 2013-06-19 | 捷讯研究有限公司 | Handheld electronic device having a flexible display |
| CN105977400A (en) * | 2016-07-21 | 2016-09-28 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof and display device |
| CN207067960U (en) * | 2017-08-03 | 2018-03-02 | 深圳市柔宇科技有限公司 | Fold mechanism and terminal |
| EP3407575A1 (en) * | 2016-01-18 | 2018-11-28 | LG Electronics Inc. -1- | Mobile terminal |
-
2019
- 2019-01-31 CN CN201910101245.6A patent/CN109760291B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103167070A (en) * | 2011-11-15 | 2013-06-19 | 捷讯研究有限公司 | Handheld electronic device having a flexible display |
| EP3407575A1 (en) * | 2016-01-18 | 2018-11-28 | LG Electronics Inc. -1- | Mobile terminal |
| CN105977400A (en) * | 2016-07-21 | 2016-09-28 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof and display device |
| CN207067960U (en) * | 2017-08-03 | 2018-03-02 | 深圳市柔宇科技有限公司 | Fold mechanism and terminal |
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| Publication number | Publication date |
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| CN109760291B (en) | 2021-03-19 |
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