CN109760223A - Silicon carbide crystal bar multi-line cutting method - Google Patents
Silicon carbide crystal bar multi-line cutting method Download PDFInfo
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- CN109760223A CN109760223A CN201910114125.XA CN201910114125A CN109760223A CN 109760223 A CN109760223 A CN 109760223A CN 201910114125 A CN201910114125 A CN 201910114125A CN 109760223 A CN109760223 A CN 109760223A
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Abstract
A kind of multi-line cutting method of silicon carbide crystal bar, comprising: stress state detection is carried out to the end face of silicon carbide crystal bar, selects the compression type end side with compression；Dish, which is pasted, in the compression type end side accompanies piece；It accompanies the silicon carbide crystal bar of piece to carry out multi-wire saw to the dish is pasted with, is pasted with the dish and the chip of piece is accompanied to become end face chip；It separates the dish and accompanies piece and the end face chip.The multi-line cutting method of the silicon carbide crystal bar improves the end face wafer quality and yields of silicon carbide crystal bar, reduces the processing cost of silicon carbide wafer.
Description
Technical field
The invention belongs to semiconductor material manufacture field more particularly to a kind of silicon carbide crystal bar multi-line cutting methods.
Background technique
With the fast development of semiconductor technology and photoelectric technology, the demand of silicon carbide wafer increases year by year.Silicon carbide
Chip main manufacturing processes process are as follows: crystal growth-cutting (slice)-grinding-polishing.Wherein, cutting action is silicon carbide
One of critical process in chip manufacture processing.The quality of cutting processing quality directly affects the quality of subsequent handling processing.
In the chip that cutting action obtains, chip warpage degree (Warp) is the important indicator for evaluating wafer distortion.Chip is stuck up
Curvature is often referred to not under the influence of by external force, the distance of the median surface the highest point and the lowest point of chip.In actual production, chip is stuck up
Curvature is generally difficult to repair, and will lead to during subsequent processing, and wafer axis and crystallographic axis deviate, and influences following process matter
Amount.Therefore, in cutting process, the value of strict control chip warpage degree is needed.
However, easily there is chip (end face chip) end to end in the silicon carbide wafer that existing multi-line cutting method is cut
Chip warpage degree do not meet the case where meeting the requirements.Also, silicon carbide whisker chip size is bigger, and this chip of chip is stuck up end to end
The undesirable situation of curvature is more serious.
More corresponding contents can refer to the Chinese patent application of Publication No. CN104400920A, and it discloses one kind
It reduces crystal bar and generates the rod sticky device of piece end to end and its sticky stick method in cutting process.
Summary of the invention
Problems solved by the invention is to provide a kind of silicon carbide crystal bar multi-line cutting method, improves the end face of silicon carbide crystal bar
Wafer quality and yields reduce the processing cost of silicon carbide wafer.
To solve the above problems, the present invention provides a kind of silicon carbide crystal bar multi-line cutting method, comprising: to silicon carbide crystal bar
End face carry out stress state detection, select the compression type end side with compression；Dish is pasted in the compression type end side
Shape accompanies piece；It accompanies the silicon carbide crystal bar of piece to carry out multi-wire saw to the dish is pasted with, is pasted with the dish and accompanies piece
Chip becomes end face chip；It separates the dish and accompanies piece and the end face chip.
Optionally, the dish accompanies part of the piece closer to center, and thickness is bigger.
Optionally, before the compression type end side stickup dish accompanies piece, the compression type end side is carried out
Surface treatment, makes the roughness of the compression type end side reach 0.8 μm or less.
Optionally, before the compression type end side stickup dish accompanies piece, further includes: accompany piece to the dish
Binding face is surface-treated, and the fitting surface roughness for making the dish accompany piece reaches 0.8 μm or less.
Optionally, it is one of quartz glass, monocrystalline silicon, sapphire or silicon carbide that the dish, which accompanies the material of piece,.
Optionally, when the end face of the silicon carbide crystal bar does not have crystal defect, the dish accompanies piece to have first to be averaged
Thickness, the range of first average thickness are 800 μm~2000 μm；The end face of the silicon carbide crystal bar has crystal defect
When, the dish accompanies the average thickness of piece to be further added by 500 μm~1000 μm on the basis of first average thickness；The crystalline substance
Volume defect include xenocryst type be mingled with, carbon inclusion enclave, micro-pipe, cavity and miniature slight crack.
Optionally, the patch dish is glued using one or more of yellow wax, AB glue, UV glue, pressure sensitive adhesive, latex and accompanies piece.
Optionally, after separating the dish and accompanying piece and the end face chip, the end face chip is made annealing treatment.
Optionally, the annealing carries out annealing 6 to the end face chip under the conditions of being included in 1200 DEG C~2000 DEG C
~12h.
Optionally, after the annealing, surface precision detection is carried out to the end face chip.
In the one aspect of technical solution of the present invention, piece is accompanied to answer with pressure using the dish for preparing corresponding size and shape
The method of power type end side bonding, reduces the warpage degree of end face chip, efficiently solves crystal bar compression type in multi-wire saw
The warpage issues that end face is generated due to its compression make end face chip keep good surface figure accuracy and stress distribution,
The quality for effectively improving end face chip improves the production piece rate of raw material silicon carbide crystal bar.Also, the present invention has preparation process
Simply, low-cost advantage.
Detailed description of the invention
Fig. 1 is the three-dimensional shape schematic diagram that dish accompanies piece；
Fig. 2 is the plan view shape schematic diagram that dish accompanies piece；
Fig. 3 is a kind of side-glance shape schematic diagram that dish accompanies piece；
Fig. 4 is another side-glance shape schematic diagram that dish accompanies piece；
Fig. 5 is another side-glance shape schematic diagram that dish accompanies piece；
Fig. 6 is the dish-shaped schematic diagram for accompanying piece of compression type end side stickup in silicon carbide crystal bar；
Fig. 7 accompanies piece schematic diagram for the end face chip and dish being pasted together after multi-wire saw；
Fig. 8 is the end face chip three-dimensional shape schematic diagram that comparative example obtains；
Fig. 9 is the end face chip three-dimensional shape schematic diagram that embodiment obtains.
Specific embodiment
Carborundum crystals material has the characteristics that high intensity, high-wearing feature, height are hard crisp.The end face chip of silicon carbide crystal bar by
Even more serious compared with the chip of crystal bar middle section in the degree of two sides unbalance stress, warpage, this can many times directly result in end
Face chip is scrapped.And if wafer scrap, the output capacity of cutting are difficult to be promoted end to end, increase being processed into for silicon carbide wafer
This.
For this purpose, the present invention provides a kind of new silicon carbide crystal bar multi-line cutting method, piece is accompanied by pasting, it is brilliant to reduce end face
Piece angularity.It accompanies piece preparation method simple and easy, and low in cost, solves above-mentioned deficiency.
More clearly to indicate, the present invention is described in detail with reference to the accompanying drawing.
The present invention provides a kind of multi-line cutting method of silicon carbide crystal bar, comprising:
Step 1: the end face to silicon carbide crystal bar carries out stress state detection, the compression type end with compression is selected
Face；
Step 2: pasting dish in the compression type end side accompanies piece；
Step 3: accompanying the silicon carbide crystal bar of piece to carry out multi-wire saw to the dish is pasted with, it is pasted with the dish
Shape accompanies the chip of piece to become end face chip；
Step 4: separating the dish accompanies piece and the end face chip.
The end face of silicon carbide crystal bar includes the end face end to end of silicon carbide crystal bar, i.e. compression type end side both may be silicon carbide
The end surface of crystal bar, it is also possible to the breech face of silicon carbide crystal bar.For a silicon carbide crystal bar, in fact it could happen that head therein
End face or breech face are compression type end side, it is also possible to end surface and breech face occur while be compression type end side.
Correspondingly, the end face chip of the subsequent generation of the present invention may be head wafer, it is also possible to tail chip, it is also possible to simultaneously
Including head wafer and tail chip.
In step 1, it can use stress mornitoring equipment and stress state detection carried out to the end face of silicon carbide crystal bar.It is described
Stress mornitoring equipment can be X-ray diffraction stress analysis instrument, micro-Raman spectroscopy, birefringent phase difference measuring instrument or polarisation
One of stress gauge.
It is brilliant end to end accordingly if directly carrying out multi-wire saw when testing result shows that tail end face has compression
The warped state of piece is usual are as follows: from edge to sawline lateral bend, and middle section generates protrusion.Therefore, the present invention continues
Subsequent step 2 and four, to eliminate influence of these stress to chip end to end (end face chip).
Step 2 includes the process that production dish accompanies piece, and it can be quartz glass, monocrystalline that the dish, which accompanies the material of piece,
One of silicon, sapphire or silicon carbide.
When dish accompanies piece, according to silicon carbide crystal bar size and defect feature, by quartz glass, monocrystalline silicon, sapphire or
The raw material such as silicon carbide are processed into the size and shape to match.The diameter of silicon carbide crystal bar can be 100mm or more, for straight
Diameter is therefore the silicon carbide crystal bar of 100mm or more can use respective party including 4 inches~8 inches of silicon carbide crystal bars
Method.At this point, corresponding dish accompanies the vertical view diameter of piece can be equal with the diameter of silicon carbide crystal bar, therefore, can 100mm~
The range of 200mm.
Dish accompanies the three-dimensional shape of piece 10 as shown in Figure 1.
It is a circle that dish, which accompanies the plan view shape of piece 10, as shown in Figure 2.
Dish accompanies a kind of side-glance shape of piece 10 as shown in figure 3, in side-looking direction, closer to the part at center, accordingly
Thickness it is bigger.
Fig. 1 to Fig. 3 shows, further, in side view plane, the dish accompanies the thickness of piece 10 to be in centre from the side
Linearity increases.That is Fig. 1 accompanies piece 10 to dish shown in Fig. 3, is the equal of that increase by one is flat on a flat cylindrical body
Circular cone.
By Fig. 1 to Fig. 3 it is found that dish is accompanied in piece 10, there is flat binding face, this binding face with pressure exactly for answering
The fitting of power type end side, and it is opposite with binding face, it is the crowning that dish accompanies piece 10, conical protrusions is shown in Fig. 3,
This is also the reason that dish accompanies piece 10 bigger closer to the thickness of the partial response at center.
It should be noted that in other cases, dish accompanies piece to can be other shapes.For this purpose, Fig. 4 and Fig. 5 difference
Show that dish accompanies other two kinds of side view structures of piece.At this point, it is still from the side gradually to become to centre that dish, which accompanies the thickness of piece,
Change, closer to the part at center, corresponding thickness is bigger, but is not linearity variation, but curvilinear variation.In Fig. 4, dish
It is the case where a kind of thickness of middle section is noticeably greater than thickness of two sides that shape, which accompanies piece 10 ',.In Fig. 5, dish accompanies piece 10 " in one kind
Between part thickness change it is more gentle, thickness of two sides changes more obvious situation.
It, i.e., can also be to institute before the compression type end side stickup dish accompanies piece before carrying out step 2
It states compression type end side to be surface-treated, to reduce the roughness of compression type end side, had both facilitated and subsequent accompanied piece to paste with dish-shaped
It closes, and makes final shape improvement more preferable.
Before carrying out step 2, i.e., before the compression type end side stickup dish accompanies piece, can also include:
It accompanies the binding face of piece to be surface-treated the dish, the compression type end side and the dish is made to accompany the binding face of piece
Roughness reaches 0.8 μm or less.Under the conditions of this roughness, subsequent compression type end side can be made to accompany piece to paste with dish
Afterwards, dish accompanies piece to play better shape improvement (effect for preventing buckling deformation).
In above-mentioned surface treatment, ideal effect is the binding face and compression type end side (table for so that dish is accompanied piece
Face) roughness reaches consistent level (equal).However, even if the two can not be made to reach equal, it is also desirable to which the roughness of the two is most
It measures close, and their roughness is made to be respectively less than 0.8 μm.
The concrete mode of above-mentioned surface treatment can be mechanical lapping, can refer to the relevant technologies, details are not described herein.
Such as Fig. 6, dish is pasted in the compression type end side (not marking) of silicon carbide crystal bar 20 and accompanies piece 10.
In step 2, can uniformly coat a layer binder 30 in the front/rear end of silicon carbide crystal bar, make dish accompany piece with
The compression type end side of silicon carbide crystal bar fits closely.
It is accompanied specifically, the patch dish can be glued using one or more of yellow wax, AB glue, UV glue, pressure sensitive adhesive, latex
Piece.
That is, the binder 30 specifically can be the yellow wax of heat molten type, hot melt adhesive, wink dry type AB glue, thermosetting
The epoxy resin of type, the UV glue of Photosensitive, one of pressure sensitive adhesive and latex (latex of lotion and latex type) of pressure sensitive or
It is several.
When the dish that processing is pasted together accompanies piece and end face chip, according to the heterogeneity of above-mentioned different binders, divide
One or more of modes such as heating or spray degumming agent not can be used, make dish that piece and end face chip be accompanied to separate.
In step 3, multi-wire saw is that it is uniform that silicon carbide crystal bar is cut into surfacing, thickness according to certain crystal orientation
Cutting sheet, in order to subsequent attrition process.
Multi-wire saw process is implemented on multi-line cutting machine, and cutting mode can be steel wire free abrasive mortar type, can also
To be steel wire concretion abrasive type.Their basic principle is that the sawline of certain diameter is wound on the guide wheel of several flutings, forms one
For row with the cutting gauze of identical specific spacing arrangement, the space between line determines the thickness of subsequent wafer.Sawline is in crystal bar
Surface moves back and forth, and crystal bar constantly pushes (or other relative motion modes), contacts sawline and crystal bar, mortar or cooling
Liquid enters the saw kerf of crystal bar by sawline, and the abrasive grain that the abrasive grain or sawline itself being attached on sawline consolidate generates crystal bar acute
Strong friction achievees the effect that cutting so that material breaks fall off.
To in the multi-wire saw process of silicon carbide crystal bar, needing in view of the stress distribution shape near crystal self-defect
The influence of state, flaw size and distributing position to stress distribution.Just allowing for end face chip (chip end to end) usually stress most
To be serious, therefore, for the compression type end side with compression, paste the dish and accompany piece.
The main volume defect of carborundum crystals include the xenocryst type due to caused by the fluctuation of crystal growth condition be mingled with, carbon
Inclusion enclave, micro-pipe, cavity, miniature slight crack can make crystal be easy to be broken since crystal defect causes stress raisers.Therefore,
If defective presence, accompanies piece average thickness on the basis of original average thickness dish, is further added by 500 inside silicon carbide crystal bar
μm~1000 μm.
That is, the dish accompanies piece flat with first when the end face of the silicon carbide crystal bar does not have crystal defect
Equal thickness, the range of first average thickness are 800 μm~2000 μm；The end face of the silicon carbide crystal bar is lacked with crystal
When falling into, the dish accompanies the average thickness of piece to be further added by 500 μm~1000 μm on the basis of first average thickness；It is described
Crystal defect include xenocryst type be mingled with, carbon inclusion enclave, micro-pipe, cavity and miniature slight crack.
In addition, dish accompany piece curvature (or arch degree, bow) control at 10 μm hereinafter, dish accompany piece angularity (or
Flexion degree, warp) control at 20 μm hereinafter, dish accompany piece total thickness variations amount (total thickness variation,
TTV) control is at 5 μm or less.
After step 3, i.e., after multi-wire saw, obtained end face chip corresponding construction is as shown in fig. 7, comprises end face chip
21 and dish accompany piece 10, be pasted together using binder 30 between them.
It should be noted that after separating the dish and accompanying piece and the end face chip, it can also be to the end face chip
It is made annealing treatment.
Annealing eliminates the internal stress of end face chip, after preventing end face chip from accompanying piece to separate with corresponding dish, and
Bending phenomenon occurs again under stress.
It is described annealing may include under the conditions of 1200 DEG C~2000 DEG C to the end face chip carry out annealing 6~
12h。
After the annealing, surface precision detection is carried out to the end face chip.
After completing the above method, the quality of end face chip can be evaluated.
The method that the present invention accompanies piece Nian Jie with compression type end side using the dish for preparing corresponding size and shape reduces end
The warpage degree of face chip, efficiently solve in multi-wire saw crystal bar compression type end side due to its compression sticking up for generating
Qu Wenti makes end face chip keep good surface figure accuracy and stress distribution, effectively improves the quality of end face chip, is promoted
The production piece rates of raw material silicon carbide crystal bars.Also, the present invention has preparation process simple, low-cost advantage.
The present invention carries out corresponding comparative example and embodiment is as follows.
In comparative example and embodiment, multi-wire saw is carried out to 4 inch silicon carbide silicon crystal bars (diameter 100mm), use
The length of silicon carbide crystal bar is 12mm, is cut into 14 wafers altogether.
Wherein, the multi-wire saw condition that comparative example and embodiment use is as shown in table 1 below:
Table 1
Comparative example
Using the Raman spectrum of micro-Raman spectroscopy measurement silicon carbide crystal bar, the displacement of the Raman peak values obtained from, into
And silicon carbide crystal bar is calculated in the residual stress of endface, confirm the front/rear end (end face end to end) of this silicon carbide crystal bar
Stress state is all compression, at this point, the end face end to end of this silicon carbide crystal bar is compression type end side.
Comparative example is to carry out multi-wire saw process to silicon carbide crystal bar, i.e., without using corresponding dish using existing method
Shape accompanies piece.
Table 2, which is shown, does not paste the cutting effect that dish accompanies piece, as follows:
Table 2
In table 2, each surface precision data that two faces of chip measure exist different.This is because when measurement, it is common flat
The back side of putting that face degree measuring instrument defaults chip is a plane, therefore, when the different sides of chip are as the back side (front), is measured
The data come are different, and rear continued 3 is also same situation.
From Table 2, it can be seen that in 14 chips that comparative example obtains:
The value of TTV is at 20~35 μm；
The value of Bow is at ± 30 μm；
The value of Warp is at 35 μm~75 μm；
Wherein, end to end in chip, the value of Warp is more than 70 μm.
Fig. 8 shows the end face chip 21 ' obtained using existing method, and corresponding is tail chip, i.e., and the in table 2
14 wafers (that is, one of end face chip), in the face Si, the value of Bow is 29.625 μm, and the value of Warp is 72.316 μm.
As can be seen that compared to the chip of middle section, the chip warpage degree at 21 ' both ends of end face chip is larger.This be by
In chip stress is more uneven end to end, and deformation is larger.
Inventor further analyzes the appearance significant warpage reason of chip end to end: according to multi-wire saw principle, when sawline is cut
When crystal bar, vertical load suffered by sawline is gradually increased by zero, while the case where laterally offset occurs, with load
Increasing, the laterally offset loaded with respect to sawline between settling position of initial cutting into position and institute results in the warpage of chip, by
Feed speed is adjusting always during practical multi-wire saw, and sawline institute is loaded also constantly to change, end face chip side
Lateral vibration by sawline is impacted, and the other side is then unfettered, therefore, in end face under the action of inner wafer compression, just
It will cause the excessive adverse consequences of angularity.
Embodiment
Using the Raman spectrum of micro-Raman spectroscopy measurement silicon carbide crystal bar, the displacement of the Raman peak values obtained from, into
And silicon carbide crystal bar is calculated in the residual stress of endface, confirm the front/rear end (end face end to end) of this silicon carbide crystal bar
Stress state is all compression, at this point, the end face end to end of this silicon carbide crystal bar is compression type end side.
In embodiment, before carrying out multi-wire saw, two end faces of 4 inch silicon carbide silicon crystal bars is subjected to mechanical lapping, are made
Its surface roughness is less than 0.8 μm.
The dish for the UFO shape shape that processing binding face diameter is 100mm accompanies piece.Wherein, the dish-shaped maximum gauge for accompanying piece is
1200 μm, minimum thickness is 900 μm, and average thickness is 1000 μm.
In the present embodiment, it is quartz glass that dish, which accompanies the material of piece,.Also, the coating surface of piece is accompanied to grind dish
Mill.
On the binding face that dish accompanies piece, it is uniformly coated with one layer of liquid yellow wax, and be affixed to silicon carbide crystal bar both ends
Pressure type end side on.
After the structure pressurization being pasted together, solidification is stood, dish is made to accompany the compression type end of piece and silicon carbide crystal bar
Face paste is closed secured.
Dish, which will be pasted with, accompanies the silicon carbide crystal bar of piece to carry out multi-wire saw.
After multi-wire saw, piece is accompanied to separate with dish the end face chip cut down.
Finally, detecting to the surface precision of clean end face chip, the results are shown in Table 3:
Table 3
From table 3 it is observed that in 14 chips that embodiment obtains:
The value of TTV is within 20 μm；
The value of Bow is within ± 20 μm；
The value of Warp is within 30 ± 10 μm；
Wherein, in the chip of end face, the value of Warp is within 40 μm.
Fig. 9 shows the end face chip 21 " obtained using the method for the present invention, and corresponding is equally tail chip, i.e. table 3
In the 14th wafer (that is, one of end face chip), in the face Si, the value of Bow is 13.426 μm, and the value of Warp is
33.590μm。
The result and Fig. 9 of upper table 3 are shown, since dish accompanies the use of piece, each crystalline substance including end face chip 21 "
Piece, surface precision have reached preferable level, especially end face chip (i.e. the 1st wafer and the 14th wafer, the 14th platelet
Piece is end face chip 21 ") in, table 3 is shown, the Warp value of each end face chip is controlled in lower range, respectively less than 40 μm.
The table 3 of comparing embodiment and the table 2 of comparative example and Fig. 8 and Fig. 9, it is known that, in embodiment, matter is cut accordingly
Preferably, especially the cutting effect of end face chip improves obvious amount.
It is limited to the growing technology of carborundum crystals, the length of silicon carbide crystal bar at this stage is shorter, and end face chip accounts for entirely
1/7) ratio of portion's chip is higher (in such as the present embodiment, to be accounted for.
And the above method of the invention can inhibit during multi-wire saw caused by unbalanced stress problem and original end face
In compression problem, reduce the curvature and angularity of end face chip, remedied the face type essence that can only be often removed originally
Poor end face chip is spent, the multi-wire saw yields of silicon carbide crystal bar is improved.
Also, method of the invention is simple and easy, low in cost, leads using the efficient Ultra-precision Turning of silicon carbide substrates
Domain has a good application prospect.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (10)
1. a kind of multi-line cutting method of silicon carbide crystal bar characterized by comprising
Stress state detection is carried out to the end face of silicon carbide crystal bar, selects the compression type end side with compression；
Dish, which is pasted, in the compression type end side accompanies piece；
It accompanies the silicon carbide crystal bar of piece to carry out multi-wire saw to the dish is pasted with, is pasted with the chip that the dish accompanies piece
As end face chip；
It separates the dish and accompanies piece and the end face chip.
2. the multi-line cutting method of silicon carbide crystal bar according to claim 1, which is characterized in that the dish accompanies piece more to lean on
Paracentral part, thickness are bigger.
3. the multi-line cutting method of silicon carbide crystal bar according to claim 1, which is characterized in that at compression type end
Before the face stickup dish accompanies piece, the compression type end side is surface-treated, the thick of the compression type end side is made
Rugosity reaches 0.8 μm or less.
4. the multi-line cutting method of silicon carbide crystal bar according to claim 3, which is characterized in that at compression type end
The face stickup dish is accompanied before piece, further includes: is accompanied the binding face of piece to be surface-treated the dish, is accompanied the dish
The fitting surface roughness of piece reaches 0.8 μm or less.
5. the multi-line cutting method of silicon carbide crystal bar according to claim 1, which is characterized in that the dish accompanies the material of piece
Material is one of quartz glass, monocrystalline silicon, sapphire or silicon carbide.
6. the multi-line cutting method of silicon carbide crystal bar according to claim 1, which is characterized in that the silicon carbide crystal bar
When end face does not have crystal defect, the dish accompanies piece to have the first average thickness, and the range of first average thickness is
800 μm~2000 μm；When the end face of the silicon carbide crystal bar has crystal defect, it is described that the dish, which accompanies the average thickness of piece,
On the basis of first average thickness, it is further added by 500 μm~1000 μm；The crystal defect includes that xenocryst type is mingled with, is carbon inclusion enclave, micro-
Pipe, cavity and miniature slight crack.
7. the multi-line cutting method of silicon carbide crystal bar according to claim 1, which is characterized in that use yellow wax, AB glue, UV
One or more of glue, pressure sensitive adhesive, latex glue the patch dish and accompany piece.
8. the multi-line cutting method of silicon carbide crystal bar according to claim 1, which is characterized in that accompanied separating the dish
After piece and the end face chip, the end face chip is made annealing treatment.
9. the multi-line cutting method of silicon carbide crystal bar according to claim 8, which is characterized in that the annealing includes
6~12h of annealing is carried out to the end face chip under the conditions of 1200 DEG C~2000 DEG C.
10. the multi-line cutting method of silicon carbide crystal bar according to claim 9, which is characterized in that in the annealing
Afterwards, surface precision detection is carried out to the end face chip.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001018219A (en) * | 1999-07-09 | 2001-01-23 | Shin Etsu Chem Co Ltd | Method for cutting object to be cut |
| JP2004001409A (en) * | 2002-03-29 | 2004-01-08 | Sumitomo Mitsubishi Silicon Corp | Cutting method for rigid,brittle material |
| CN203888049U (en) * | 2014-06-12 | 2014-10-22 | 金坛市晶容玻璃制品有限公司 | Anti-buckling-deformation glass bonding structure capable of preventing silicon rods from breaking |
| CN204773076U (en) * | 2015-06-17 | 2015-11-18 | 海润光伏科技股份有限公司 | Crystal bar cutting device |
| CN205185119U (en) * | 2015-10-20 | 2016-04-27 | 西安烽火光伏科技股份有限公司 | A special part for improving limit collapses among silicon material cutting process end to end |
-
2019
- 2019-02-14 CN CN201910114125.XA patent/CN109760223B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001018219A (en) * | 1999-07-09 | 2001-01-23 | Shin Etsu Chem Co Ltd | Method for cutting object to be cut |
| JP2004001409A (en) * | 2002-03-29 | 2004-01-08 | Sumitomo Mitsubishi Silicon Corp | Cutting method for rigid,brittle material |
| CN203888049U (en) * | 2014-06-12 | 2014-10-22 | 金坛市晶容玻璃制品有限公司 | Anti-buckling-deformation glass bonding structure capable of preventing silicon rods from breaking |
| CN204773076U (en) * | 2015-06-17 | 2015-11-18 | 海润光伏科技股份有限公司 | Crystal bar cutting device |
| CN205185119U (en) * | 2015-10-20 | 2016-04-27 | 西安烽火光伏科技股份有限公司 | A special part for improving limit collapses among silicon material cutting process end to end |
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| CN109760223B (en) | 2021-08-31 |
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