CN109755418A - A kind of display panel manufacture craft - Google Patents
A kind of display panel manufacture craft Download PDFInfo
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- CN109755418A CN109755418A CN201910024032.8A CN201910024032A CN109755418A CN 109755418 A CN109755418 A CN 109755418A CN 201910024032 A CN201910024032 A CN 201910024032A CN 109755418 A CN109755418 A CN 109755418A
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- hard substrate
- hole
- base board
- flexible base
- spacer material
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Abstract
The present invention relates to field of display technology, a kind of display panel manufacture craft is disclosed, the following steps are included: the first hard substrate that side is formed with flexible base board is bonded with the second hard substrate with spacer material, wherein, flexible base board is located at the side that the first hard substrate deviates from the second hard substrate, flexible base board has hollow out through-hole, first hard substrate has hole corresponding with hollow out through-hole, spacer material sequentially passes through hole and hollow out through-hole, and flexible base board is equipped with pixel defining layer away from the side of the first hard substrate, end of the spacer material far from the second hard substrate is concordant away from the end of flexible base board with pixel defining layer；Fine metal mask plate is fitted in pixel defining layer surface, wherein be against spacer material on fine metal mask plate far from the end of the second hard substrate；Vapor deposition.Above-mentioned display panel manufacture craft withstands fine metal mask plate by spacer material, can be used for preventing vapor deposition through-hole and pixel openings from mixed color phenomenon caused by misplacing occurs.
Description
Technical field
The present invention relates to field of display technology, in particular to a kind of display panel manufacture craft.
Background technique
OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) display technology is aobvious as a new generation
Show technology, there is quick response, high contrast and flexible characteristic, especially its flexible to establish for flexible display technologies
Basis；One of important development direction as flexible display technologies, OLED stretchable displayer part can be widely applied to can
On wearable device and clothing.
As shown in Figure 1, it is single that the flexible base board 1 of OLED is divided into multiple displays in order to smoothly bend and normally show
Member, opens up hollow out through-hole 2 between display unit, and when underway vapor deposition process, fine metal mask plate 3 is covered on pixel circle
In given layer 5, the vapor deposition through-hole 4 of fine metal mask plate 3 is aligned setting with pixel openings one by one, but in the prior art, vapor deposition
Through-hole 4 is easy to misplace with pixel openings, leads to colour mixture.
Summary of the invention
The invention discloses a kind of display panel manufacture crafts, lead for preventing vapor deposition through-hole and pixel openings from dislocation occurs
The mixed color phenomenon of cause.
In order to achieve the above objectives, the present invention the following technical schemes are provided:
A kind of display panel manufacture craft the following steps are included:
The first hard substrate that side is formed with flexible base board is bonded with the second hard substrate with spacer material,
In, flexible base board is located at the side that the first hard substrate deviates from the second hard substrate, and flexible base board has hollow out through-hole, and first is hard
Matter substrate has hole corresponding with hollow out through-hole, and spacer material sequentially passes through described hole and the hollow out through-hole, and flexible base
Side of the backboard from the first hard substrate is equipped with pixel defining layer, and end of the spacer material far from the second hard substrate is defined with pixel
Layer is concordant away from the end of flexible base board；
Fine metal mask plate is fitted in pixel defining layer surface, wherein make spacer material far from the second hard substrate
End is against on fine metal mask plate；
Vapor deposition forms device pattern on surface of the flexible base board away from first hard substrate.
In above-mentioned display panel manufacture craft, when the second hard substrate is bonded with the first hard substrate, spacer material is successively worn
Hole and hollow out through-hole are crossed, and the end far from the second hard substrate of final spacer material deviates from flexible base with pixel defining layer
The end of plate is concordant；When fine metal mask plate is fitted in pixel defining layer surface, fine metal mask plate is in magnetic attraction
Under the action of can the mobile trend in oriented first hard substrate direction, since the second hard substrate rigidity is larger, with the
After one hard substrate is fixed, it can provide strong support to spacer material without deforming, spacer material supports fine metal and covers
The diaphragm plate region opposite with hollow out through hole avoids the region of fine metal mask plate from generating recess, thus, fine metal is covered
Part around diaphragm plate region corresponding with hollow out through-hole is not easy to move to movement at this, it is ensured that fine metal mask plate
Vapor deposition through-hole and pixel openings can precise alignment, without mixed color phenomenon.
Preferably, described that side is formed with the first hard substrate of flexible base board and the second hard base with spacer material
It is further comprising the steps of before plate fitting:
Described hole is formed on the first hard substrate；
Sacrificial layer is formed in hole；
The flexible base board is formed on the first hard substrate surface；
Film transistor device layer is made on flexible base board surface；
Remove sacrificial layer.
Preferably, the sacrificial layer that formed in hole specifically includes:
Filled polyimide glue or photoresist in hole；
It is heating and curing.
Preferably, the removal sacrificial layer specifically:
Sacrificial layer is etched using laser.
Preferably, the forming process of the flexible base board specifically:
In the first hard substrate surface spin-on polyimide liquid；
It is heating and curing.
Preferably, after the vapor deposition step, further includes:
Separate the first hard substrate and the second hard substrate.
Preferably, described that side is formed with the first hard substrate of flexible base board and the second hard base with spacer material
Plate fitting, specifically includes:
In the second hard substrate there is the surface of spacer material to sequentially form heat sensitive adhesive layer；
Second hard substrate is bonded by the heat sensitive adhesive layer and the first hard substrate；
The first hard substrate of the separation and the second hard substrate, specifically include:
Heat sensitive adhesive layer is heated to lose viscosity；
Second hard substrate is removed from the first hard substrate.
Preferably, pressure-sensitive adhesive layer is also formed between the heat sensitive adhesive layer and second hard substrate.
Preferably, the hollow out through-hole covers on corresponding first hard substrate in the orthographic projection on the first hard substrate
Hole.
Preferably, the hole on the first hard substrate is rounded, and the diameter of hole is 40 μm -180 μm.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of fine metal mask plate and flexible base board cooperation in the prior art；
Fig. 2 is fine metal mask plate and flexible base board in display panel manufacture craft provided in an embodiment of the present invention, the
The structural schematic diagram of one hard substrate, spacer material and the cooperation of the second hard substrate.
Icon: 1- flexible base board；2- hollow out through-hole；3- fine metal mask plate；Through-hole is deposited in 4-；5- pixel defining layer；
6- spacer material；The first hard substrate of 7-；The second hard substrate of 8-；9- hole；10- heat sensitive adhesive layer；11- pressure-sensitive adhesive layer.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Fig. 2, display panel manufacture craft provided in an embodiment of the present invention the following steps are included:
S100: side is formed with the first hard substrate 7 of flexible base board 1 and second hard substrate 8 with spacer material 6
Fitting, wherein flexible base board 1 is located at the side that the first hard substrate 7 deviates from the second hard substrate 8, and flexible base board 1 has hollow out
Through-hole 2, the first hard substrate 7 have hole 9 corresponding with hollow out through-hole 2, and spacer material 6 sequentially passes through hole 9 and hollow out through-hole
2, and flexible base board 1 is equipped with pixel defining layer 5 away from the side of the first hard substrate 7, spacer material 6 is far from the second hard substrate 8
End and pixel defining layer 5 it is concordant away from the end of flexible base board 1；
S200: fine metal mask plate 3 is fitted in 5 surface of pixel defining layer, wherein keep spacer material 6 hard far from second
The end of matter substrate 8 is against on fine metal mask plate 3；
S300: vapor deposition forms device pattern on surface of the flexible base board 1 away from the first hard substrate 7, that is, vapor deposition material
Material passes through.
Wherein, the first hard substrate 7 and the second hard substrate 8 include but is not limited to be made by glass or rigid plastics etc.
At；Spacer material 6 includes but is not limited to be made of photoresist.
In above-mentioned display panel manufacture craft, when the second hard substrate 8 is bonded with the first hard substrate 7, spacer material 6 is successively
Across hole 9 and hollow out through-hole 2, and the end far from the second hard substrate 8 of final spacer material 6 is carried on the back with pixel defining layer 5
End from flexible base board 1 is concordant, in order to enable fine metal mask plate 3 is smooth when being covered in pixel defining layer 5 to open up
It opens, is not susceptible to protrusion or recess；When fine metal mask plate 3 is fitted in 5 surface of pixel defining layer, fine metal is covered
Diaphragm plate 3 under the action of magnetic attraction can the mobile trend in oriented first hard substrate, 7 direction, due to the second hard substrate 8 itself
Hardness is larger, after fixing with the first hard substrate 7, can provide strong support to spacer material 6 without deforming, spacer material
6 support the region opposite at hollow out through-hole 2 of fine metal mask plate 3, and the region of fine metal mask plate 3 is avoided to generate
Recess, thus, the part around the region corresponding with hollow out through-hole 2 of fine metal mask plate 3 is not easy to occur to movement at this
It is mobile, it is ensured that the vapor deposition through-hole 4 and pixel openings of fine metal mask plate 3 can precise alignment, without mixed color phenomenon.
The first concrete mode for forming the above-mentioned hole 9 passed through for spacer material 6 is as follows:
It is further comprising the steps of before S100 step:
S010: hole 9 is formed on the first hard substrate 7；
S020: sacrificial layer is formed in hole 9；
S030: flexible base board 1 is formed on 7 surface of the first hard substrate；
S040: film transistor device layer is made on 1 surface of flexible base board；
S050: removal sacrificial layer.
Wherein, in S020 step, the purpose that sacrificial layer is formed in hole 9 is: preventing from being used to form in S030 step soft
The material of property substrate 1 enters in hole 9, and, the material access aperture of film transistor device layer is used to form in S040 step
In hole 9, hole 9 is blocked and is difficult to clear up, and influences spacer material 6 across hole 9；
It should be noted that just starting to divide in flexible base board 1 multiple after above-mentioned S030 step forms flexible base board 1
Display unit, opens up hollow out through-hole 2 between display unit, hollow out through-hole 2 open up mode can be plasma etching or
Photoetching；
Wherein, S030 step specifically includes:
S031: filled polyimide glue or photoresist in hole 9；
S032: it is heating and curing.
But S030 step is not limited to the above form, the jelly for being also possible to have had been cured is filled into hole
9, for example, the photoresist being cured is filled into hole 9.
Wherein, S050 step specifically:
Sacrificial layer is etched using laser.
But S050 step is not limited to the above form, for example, it can be using sclerotic fiber by sacrificial layer from hole
It is disclosed in 9, alternatively, it is also possible that being fallen sacrifice layer corrosion using corrosive liquids.
Preferably, the forming process of the flexible base board 1 in S100 step specifically:
S111: in 7 surface spin-on polyimide liquid of the first hard substrate, the first hard substrate 7 plays branch to flexible base board 1
Support effect；
S112: it is heating and curing.
The forming process of flexible base board 1 in S100 step is not limited to be also possible to upper type in the first hard substrate 7
Surface reheats solidification after spraying polyimides liquid, also, the material for making flexible base board 1 is not limited to polyimides
Liquid.
Preferably, after S300 step, further includes:
S400: the first hard substrate 7 of separation and the second hard substrate 8；
In S400 step, the first hard substrate 7 and the second hard substrate 8 are separated, the follow-up process to flexible base board 1 is made
It is more flexible, meanwhile, avoid spacer material 6 from causing obstacle to the processes such as subsequent thin-film package and cutting.
Specifically, the first hard substrate 7 and the second hard substrate 8 are separated in S400 step, can be following form:
The first hard substrate 7 that side is formed with flexible base board 1 in S100 step and second with spacer material 6
Hard substrate 8 is bonded, and is specifically included:
S121: in the second hard substrate 8 there is the surface of spacer material 6 to sequentially form heat sensitive adhesive layer 10；
S122: the second hard substrate 8 is bonded by heat sensitive adhesive layer 10 with the first hard substrate 7；
In step S400, the first hard substrate 7 and the second hard substrate 8 are separated, is specifically included:
S410: heat sensitive adhesive layer 10 is heated to losing viscosity；
S420: the second hard substrate 8 is removed from the first hard substrate 7；
During the first hard substrate 7 of the above separation and the second hard substrate 8, heat sensitive adhesive layer 10 is temperature sensitive, temperature
It is poorer to spend more high viscosity, the two is separated without using instrument etc., only needs to heat, the two is just automatically separated.
Preferably, pressure-sensitive adhesive layer 11,11 pairs of pressure-sensitive adhesive layer pressures are also formed between heat sensitive adhesive layer 10 and the second hard substrate 8
Power is sensitive, with the characteristic that the bigger bonding of pressure is tighter, convenient for combining the second hard substrate 8 and the first hard substrate 7, together
When, after heating heat sensitive adhesive layer 10 loses viscosity, after the first hard substrate 7 and the separation of the second hard substrate 8, heat sensitive adhesive layer 10 is logical
It crosses pressure-sensitive adhesive layer 11 to be bonded on the second hard substrate 8, be fallen in process equipment so as to avoid heat sensitive adhesive layer 10, it is difficult to is clear
Reason.
Second of concrete mode for forming the above-mentioned hole 9 passed through for spacer material 6 is as follows:
Flexible base board 1 first is formed on 7 surface of the first hard substrate, then makes thin film transistor (TFT) on 1 surface of flexible base board
Device layer, making hollow out through-hole 2 and hole 9, the two between the adjacent display unit of flexible base board 1 can successively be fabricated separately,
Production can also be punched simultaneously.
Preferably, hollow out through-hole 2 covers on corresponding first hard substrate 7 in the orthographic projection on the first hard substrate 7
Hole 9, i.e. hole 9 are oppositely arranged with hollow out through-hole 2, and frontal projected area of the hollow out through-hole 2 on the first hard substrate 7 is greater than
The area of hole 9；
To ensure that the area of hollow out through-hole 2 is not less than hole 9, and the two is not overlapped, i.e., in production hollow out through-hole 2
When, it can be aligned with the partial region of hollow out through-hole 2 convenient for hole 9, so that spacer material 6 can pass through hole 9, make full use of hole
The perforated area in hole 9.
Preferably, the hole 9 on the first hard substrate 7 is rounded, and the diameter of hole 9 is 40 μm -180 μm, for example, can be with
It is 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170
μm or 180 μm.Hole 9 can also be in rectangle, triangle, ellipse and other shapes, as long as can pass through i.e. for spacer material 6
Can, in order to which spacer material 6 can be stablized, accurately across hole 9, the cross section of spacer material 6 can keep one with the shape of hole 9
It causes, and the cross-sectional area of spacer material 6 is slightly less than hole 9.
Preferably, the shape of hollow out through-hole 2 includes but is not limited to rectangle, when hollow out through-hole 2 is rectangular, width 50
μm -200 μm, for example, can be 50 μm, 70 μm, 90 μm, 110 μm, 130 μm, 145 μm, 150 μm, 165 μm, 180 μm, 192 μm or
200 μm, length value 0.2mm, 0.3mm, 0.5mm, 0.7mm, 0.9mm or 1.0mm.
Obviously, those skilled in the art can carry out various modification and variations without departing from this hair to the embodiment of the present invention
Bright spirit and scope.In this way, if these modifications and changes of the present invention belongs to the claims in the present invention and its equivalent technologies
Within the scope of, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of display panel manufacture craft, which comprises the following steps:
The first hard substrate that side is formed with flexible base board is bonded with the second hard substrate with spacer material, wherein soft
Property substrate be located at the first hard substrate deviate from the second hard substrate side, flexible base board have hollow out through-hole, the first hard base
Plate has hole corresponding with hollow out through-hole, and spacer material sequentially passes through described hole and the hollow out through-hole, and flexible base board is carried on the back
Side from the first hard substrate is equipped with pixel defining layer, and end of the spacer material far from the second hard substrate and pixel defining layer are carried on the back
It is concordant from the end of flexible base board；
Fine metal mask plate is fitted in pixel defining layer surface, wherein make spacer material far from the end of the second hard substrate
It is against on fine metal mask plate；
Vapor deposition forms device pattern on surface of the flexible base board away from first hard substrate.
2. display panel manufacture craft according to claim 1, which is characterized in that described that side is formed with flexible base board
The first hard substrate with spacer material the second hard substrate be bonded before, it is further comprising the steps of:
Described hole is formed on the first hard substrate；
Sacrificial layer is formed in hole；
The flexible base board is formed on the first hard substrate surface；
Film transistor device layer is made on flexible base board surface；
Remove sacrificial layer.
3. display panel manufacture craft according to claim 2, which is characterized in that described to form sacrificial layer tool in hole
Body includes:
Filled polyimide glue or photoresist in hole；
It is heating and curing.
4. display panel manufacture craft according to claim 2, which is characterized in that the removal sacrificial layer specifically:
Sacrificial layer is etched using laser.
5. display panel manufacture craft according to claim 1, which is characterized in that the forming process of the flexible base board has
Body are as follows:
In the first hard substrate surface spin-on polyimide liquid；
It is heating and curing.
6. display panel manufacture craft according to claim 1, which is characterized in that after the vapor deposition step, further includes:
Separate the first hard substrate and the second hard substrate.
7. display panel manufacture craft according to claim 6, which is characterized in that described that side is formed with flexible base board
The first hard substrate be bonded with the second hard substrate of spacer material, specifically include:
In the second hard substrate there is the surface of spacer material to sequentially form heat sensitive adhesive layer；
Second hard substrate is bonded by the heat sensitive adhesive layer and the first hard substrate；
The first hard substrate of the separation and the second hard substrate, specifically include:
Heat sensitive adhesive layer is heated to lose viscosity；
Second hard substrate is removed from the first hard substrate.
8. display panel manufacture craft according to claim 7, which is characterized in that the heat sensitive adhesive layer and described second is firmly
Pressure-sensitive adhesive layer is also formed between matter substrate.
9. display panel manufacture craft according to claim 1, which is characterized in that the hollow out through-hole is in the first hard base
Orthographic projection on plate covers the hole on corresponding first hard substrate.
10. display panel manufacture craft according to claim 1, which is characterized in that the hole on the first hard substrate is in
Circle, the diameter of hole are 40 μm -180 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910024032.8A CN109755418B (en) | 2019-01-10 | 2019-01-10 | Display panel manufacturing process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910024032.8A CN109755418B (en) | 2019-01-10 | 2019-01-10 | Display panel manufacturing process |
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| CN109755418A true CN109755418A (en) | 2019-05-14 |
| CN109755418B CN109755418B (en) | 2021-01-22 |
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| CN110137238A (en) * | 2019-06-21 | 2019-08-16 | 京东方科技集团股份有限公司 | Oled display substrate and preparation method thereof, display device |
| CN110428733A (en) * | 2019-07-22 | 2019-11-08 | 深圳市华星光电半导体显示技术有限公司 | Collapsible display panel |
| CN112309257A (en) * | 2020-10-30 | 2021-02-02 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and flexible display device |
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| Publication number | Publication date |
|---|---|
| CN109755418B (en) | 2021-01-22 |
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