CN109754055A - A kind of high temperature resistant labels of silica gel packaging - Google Patents
A kind of high temperature resistant labels of silica gel packaging Download PDFInfo
- Publication number
- CN109754055A CN109754055A CN201811651333.5A CN201811651333A CN109754055A CN 109754055 A CN109754055 A CN 109754055A CN 201811651333 A CN201811651333 A CN 201811651333A CN 109754055 A CN109754055 A CN 109754055A
- Authority
- CN
- China
- Prior art keywords
- silica gel
- sheet metal
- antenna
- high temperature
- temperature resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 239000000741 silica gel Substances 0.000 title claims abstract description 86
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 86
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000013523 data management Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Details Of Aerials (AREA)
Abstract
The invention discloses a kind of high temperature resistant labels of silica gel packaging, it include: that antenna, radio frequency chip package module and silica gel encapsulated member are constituted, antenna is made of upper and lower two panels sheet metal disposed in parallel, at least one and the vertically disposed Elecrical connector of thin slice between upper and lower thin slice；Radio frequency chip package module is arranged on a sheet metal of antenna, and the tie point on the electrode and sheet metal of module forms reliable electrical connection.Silica gel encapsulated member is by silica gel material by projecting the encapsulated member formed.The high temperature resistant labels high temperature resistance for the silica gel packaging that this programme provides is superior, can satisfy the demand of actual condition.
Description
Technical field
The present invention relates to electronic tag fields, and in particular to a kind of high temperature resistant labels of silica gel packaging.
Background technique
With the development of technology of Internet of things, the RFID industry as its basis will also welcome the opportunities and challenges of a new round.
From the point of view of current industrial situation, by further expansion, more and more traditional industries will produce RFID the relevant market of RFID
Product generate demand.
It is distinguished from the communication frequency of intelligent label, mainly there is low frequency smart label, high frequency smart and superelevation
Frequency intelligent label.Such as Bus Card, its essence is a 13.56MHz electronic tags, only realize the traffic of communications and transportation link
Reimbursement of expense function, it is convenient and efficient, using simple, received by users, and the field RFID is most widely used at present
Application.The for another example RFID logistic label in logistic storage field, it is a 915MHz single-frequency intelligent label, distance in realization
The identification and data management of item circulation are widely used in logistic storage field, substantially increase the work effect of logistic storage
Rate.
The intelligent label of different frequency characteristic, the physical characteristic of itself is widely different, such as ultra-high-frequency intelligent tag, leads to
Communication distance generally farther out, effective distance between several meters to more than ten meters, and it have fast data exchange communication protocol and
The Anti-knocking characteristic haveing excellent performance is suitble to remote multi-tag application.And the communication distance of high frequency smart is generally at several lis
Rice is to tens centimetres, and Anti-knocking performance is poor, therefore is suitble to closely lack the application of label.But the chip of high-frequency label
It typically is provided with preferable safety, therefore is suitble to the application in financial field.
In some special occasions, the label of the label or property that need special shape realizes corresponding function
Energy.It such as high temperature resistant labels, can work normally in 200 degrees Celsius or more of environment, even up to 300 degrees Celsius or more
Environment temperature will be unable to realize requirement resistant to high temperature according to traditional radio frequency identification tag package technology.
And generally existing poor reliability, high temperature resistance are poor in actual use for existing high temperature resistant labels, it can not
Meets the needs of actual condition.
It can be seen that providing a kind of high reliability and the superior high temperature resistant electronic tag of high temperature resistance is that this field needs
It solves the problems, such as.
Summary of the invention
For the problem that existing high temperature resistant labels high temperature resistance is poor, it is unable to satisfy actual condition demand, is needed a kind of high
Reliability and the superior high temperature resistant labels scheme of high temperature resistance.
For this purpose, the purpose of the present invention is to provide a kind of high temperature resistant labels of silica gel packaging, while being directed to the electronic tag
Corresponding packaging technology is also provided.
In order to achieve the above object, the high temperature resistant labels of silica gel packaging of the invention comprising:
Antenna, the antenna are made of upper and lower two panels sheet metal disposed in parallel, are formed on shown sheet metal
The figure of hollow out is attached between upper sheet metal and lower sheet metal by least one Elecrical connector；
Radio frequency chip package module has at least two electrodes on the radio frequency chip package module, and is arranged described
The company on electrode and sheet metal on upper sheet metal or lower sheet metal in antenna, on the radio frequency chip package module
Contact forms reliable electrical connection；
Silica gel medium, the silica gel medium be silica gel material sheet supporting body, whole installation in antennas, by antenna day
The sheet metal of two panels up and down of line is attached on two parallel planes of silica gel medium, and Elecrical connector is connected across silica gel medium
Upper and lower two panels sheet metal；
Antenna, radio frequency chip package module, silica gel medium are encapsulated and to be formed by silica gel encapsulated member, the silica gel encapsulated member
Closed shape.
Further, the sheet metal of the antenna is one of copper, aluminium, iron and alloy material, the thickness of sheet metal
Degree is between 1um~1000um.
Further, it is independently arranged between upper sheet metal and lower sheet metal in the antenna, between the two by leading
Electric column is attached conducting
Further, it is structure as a whole between upper sheet metal and lower sheet metal in the antenna, passes through between the two
Integrated molding is connected in upper sheet metal with the connection band connection on lower sheet metal.
Further, pass through laser between the tie point on the electrode and sheet metal on the radio frequency chip package module
One of welding, ultrasonic bonding, high temperature resistant soldering or arc welding welding manner forms reliable electrical connection.
Further, the silica gel medium with a thickness of between 1mm~10mm.
Further, it is bonded between the antenna and silica gel medium using adhesive resistant to high temperature, adhesive
Main component is one of organosilicon or epoxy resin.
Further, the silica gel encapsulated member is process by silica gel material ejection formation.
The high temperature resistant labels high temperature resistance for the silica gel packaging that this programme provides is superior, can satisfy the need of actual condition
It asks；And the high reliablity of the high temperature resistant labels of this silica gel packaging.
Detailed description of the invention
The present invention is further illustrated below in conjunction with the drawings and specific embodiments.
Fig. 1 is the planar structure schematic diagram of the high temperature resistant labels of silica gel packaging in present example 1；
Fig. 2 is the assembling side elevation of the high temperature resistant labels of silica gel packaging in present example 1；
Fig. 3 is the schematic diagram of radio frequency package module in present example 1；
Fig. 4 is the structural schematic diagram of upper and lower thin slice separated antenna in present example 1；
Fig. 5 is the assembling side elevation of the high temperature resistant labels of silica gel packaging in present example 2；
Fig. 6 is upper and lower thin slice integral antenna structural schematic diagram in present example 2.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Conjunction is specifically illustrating, and the present invention is further explained.
Example 1
Referring to Fig. 1 and Fig. 2, the structure of the silica gel packaging high temperature resistant labels provided it illustrates this example.
As seen from the figure, the silica gel packaging high temperature resistant labels are in composed structure, main silica gel medium 1, radio-frequency module 3, on
Antenna 2 and lower antenna 4, connection terminal 5 and silica gel encapsulated member 6 are constituted.
Wherein, both upper antenna 2 and lower antenna 4 are made of the sheet metal for being formed with hollow out figure respectively, and are gone up to the sky
It is arranged in parallel between line 2 and lower antenna 4, and conducting is connected by the connection terminal 5 as Elecrical connector between the two, thus
To constitute the antenna body in entire label.Preferably, connection terminal 5 is vertically set on upper antenna 2 disposed in parallel and lower day
Between line 4.
Radio-frequency module 3 in this label has at least two electrodes, while a metal of antenna is arranged in the module
On thin slice, that is, it is arranged on upper antenna 2 or lower antenna 4.Tie point on the electrode and sheet metal of the module is formed reliably
Electrical connection.
Silica gel medium 1 is used to support upper antenna 2 disposed in parallel and lower antenna 4, which is by silica gel material shape
At sheet supporting body, and the sheet metal of two panels up and down of antenna is attached on two parallel planes of silica gel medium, is connected
Terminal 5 passes through medium and connects two panels sheet metal up and down.
Silica gel encapsulated member 6, by silica gel material by projecting the encapsulated member that is formed, by antenna, radio frequency chip package module,
Silica gel medium is encapsulated, and forms closed shape, is formed and is protected to entire label.
Referring to Fig. 3, in specific implementation, the radio-frequency module 3 in this electronic tag is molding chip packing-body, by radio frequency core
Piece is process using high reliability molded packages, and two sides of molded packages body 31 draw two and are suitble to the electricity being electrically connected
Pole 32 and 33, the radio frequency chip that the present embodiment uses is the H3 of ALIEN company.
As shown in Fig. 2, as an example, the radio-frequency module 3 of such structure be arranged in upper antenna 2 close to medium 1 this
Face, the position of welding referring to the upper antenna 2 of Fig. 1 21 both ends of solder terminal, using laser welding, ultrasonic bonding, high temperature resistant
One of soldering or arc welding welding procedure, which are realized, forms reliable electrical connection between tie point on module pin and antenna.
Referring to fig. 4, the antenna in this electronic tag is made of two mutually independent upper antennas 2 and lower antenna 4.Upper antenna
2 and lower antenna 4 be all to be made of the sheet metal with hollow out figure.Here sheet metal is copper, aluminium, iron and alloy material
One of, the thickness of sheet metal is preferably between 1um~1000um.
Upper antenna 2 is the electrode of poliarizing antenna, and lower antenna is reflecting plate, plays the role of anti-metal.In the suitable of upper antenna 2
When position is provided with the resonant ring 22 and solder terminal 21 of annular, wherein solder terminal 21 is symmetrical figure, intermediate
Open circuit.
On this basis, this example side opposite with resonant ring 22 on upper 2 ontology of antenna is formed with and upper antenna sheet
Impedance matching box as entire antenna is made impedance and the chip of antenna by the parallel rectangular member 23 of body, the component 23
Impedance is effectively matched, and obtains good communication efficiency.
In the left end of upper antenna and lower antenna, it is provided with connecting hole 24 and 41, the connection conducting weldering of upper and lower antenna can be carried out
Connect use.When specific implementation, which is set as 1.05mm, and the diameter than connection terminal 5 is slightly larger.This example preferably connects
Connecting terminal 5 selects copper connecting tube, is specially hollow cylinder structure, between 1.0mm, pipe thickness is cylindrical body outer diameter
0.15mm, the length of cylindrical body are 5mm.
Pass through Laser Welding between such connection terminal 5 of structure and the connecting hole 24 of upper antenna and the connecting hole 41 of lower antenna
It connects, ultrasonic bonding, one of high temperature resistant soldering or arc welding welding procedure are reliably connected and are connected.
Referring to fig. 2, silica gel medium 1 in this electronic tag is process using silica gel material, generally thickness 1mm~
Sheet carrier between 10mm, preferred thickness are the laminated structure of 4.0mm.
The silica gel medium 1 of such structure, upper and lower two surfaces, even spread high-temperature-resistant adhesive, this example, which uses, to be had
Machine silica gel or epoxide-resin glue.
The silica gel medium 1 of such setting is when supporting antenna, by upper antenna 2 and lower antenna 4 in the antenna module processed
Distribution fits to about 1 two surface of silica gel medium, light that antenna is pressed to make to keep smooth, so that upper antenna 2 and lower antenna 4 and silica gel
It carries out preliminary bonding between medium by adhesive resistant to high temperature respectively, is then carried out in 150 degrees Celsius of high temperature storage case
Solidification, 30 minutes completion curing process.
Silica gel encapsulated member in this electronic tag is process by silica gel material ejection formation, can effectively by antenna, penetrate
Frequency chip encapsulation module, silica gel medium are encapsulated, and form closed shape.
Specifically, the semi-finished product being cured are carried out silica gel encapsulating by this silica gel encapsulated member, silica gel packaging high temperature resistant mark is formed
Label.
For above-mentioned silica gel packaging high temperature resistant labels scheme, this example also provides a kind of quickly and easily implementation method,
The process for assembling this silica gel packaging high temperature resistant labels based on this method is as follows:
Step 1: carrying out radio frequency chip encapsulation using high reliability molded packages radio frequency chip and form dedicated molded packages
Body is preferably dimensioned to be 1.55*2.65*1.05mm.
Step 2: packaged radio frequency chip module is welded to the position of antenna electrode by connection antenna.
Step 3: in silica gel medium upper and lower surfaces even spread binder resistant to high temperature, the contraposition of upper antenna being attached to silicon
The upper surface of glue medium, so that radio-frequency module thereon is located on the inside of antenna；The contraposition of lower antenna is attached to silica gel medium simultaneously
Lower surface, and make connection terminal pass through silica gel medium connect up and down antenna.
Step 4: the component that step 3 is completed being passed through and is gently pressed, and is put into the solidification that high temperature storage case carries out binder.
Step 5: the semi-finished product being cured being carried out by silica gel encapsulating by silica gel encapsulated member, form silica gel packaging high temperature resistant mark
Label.
The assembling of silica gel packaging high temperature resistant labels can be quickly and easily completed by above-mentioned operation, it is not only high-efficient, and
And high yield rate, guarantee the mass production of product.
Example 2
Referring to figs. 5 and 6, the structure of the silica gel packaging high temperature resistant labels provided it illustrates this example.This example provides
Silica gel packaging high temperature resistant labels overall structure it is identical as the silica gel packaging high temperature resistant labels structure in example 1, be different from place
It is, the antenna in this example in electronic tag is made of the upper antenna 2 of two integral structures and lower antenna 4.
As seen from the figure, in this example upper antenna 2 and between lower antenna 4 be structure as a whole, upper antenna 2 and lower antenna 4 are all
It is made of the sheet metal with hollow out figure.Here sheet metal is one of copper, aluminium, iron and alloy material, metal
The thickness of thin slice is preferably between 1um~1000um.
Upper antenna 2 is the electrode of poliarizing antenna, and lower antenna is reflecting plate, plays the role of anti-metal.In the suitable of upper antenna 2
When position is provided with the resonant ring 22 and solder terminal 21 of annular, wherein solder terminal 21 is symmetrical figure, intermediate
Open circuit.
On this basis, this example side opposite with resonant ring 22 on upper 2 ontology of antenna is formed with and upper antenna sheet
Impedance matching box as entire antenna is made impedance and the chip of antenna by the parallel rectangular member 23 of body, the component 23
Impedance is effectively matched, and obtains good communication efficiency.
By being attached with upper antenna 2 and the integrally formed connecting band 24 of lower antenna 4 between upper antenna 2 and lower antenna 4
Conducting, which can carry out 90 degree of bendings in process, so as to when electronic tag is assembled, with silica gel medium
Cooperation.
When the antenna and silica gel medium of such structure carry out device, firstly, the contraposition of upper antenna 2 is attached to silica gel medium
Upper surface, so that radio-frequency module 3 is located on the inside of antenna；Then connecting band 24 is bent, makes lower antenna 4 around to the another of silica gel medium
A surface, and be bonded.
In addition, it is identical in the other structures and embodiment with example 1 of electronic tag in this example, it is not gone to live in the household of one's in-laws on getting married herein
It states.
The basic principles, main features and advantages of the present invention have been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (8)
1. the high temperature resistant labels of silica gel packaging characterized by comprising
Antenna, the antenna are made of upper and lower two panels sheet metal disposed in parallel, are formed with hollow out on shown sheet metal
Figure, be attached between upper sheet metal and lower sheet metal by least one Elecrical connector；
Radio frequency chip package module has at least two electrodes on the radio frequency chip package module, and is arranged in the antenna
In upper sheet metal or lower sheet metal on, the tie point on electrode and sheet metal on the radio frequency chip package module
Form reliable electrical connection；
Silica gel medium, the silica gel medium are the sheet supporting body of silica gel material, and whole installation in antennas, will be antenna
Upper and lower two panels sheet metal is attached on two parallel planes of silica gel medium, and Elecrical connector passes through the connection of silica gel medium up and down
Two panels sheet metal；
Silica gel encapsulated member, the silica gel encapsulated member antenna, radio frequency chip package module, silica gel medium are encapsulated to be formed it is closed
Shape.
2. the high temperature resistant labels of silica gel packaging according to claim 1, which is characterized in that the sheet metal of the antenna is
One of copper, aluminium, iron and alloy material, sheet metal with a thickness of between 1um~1000um.
3. the high temperature resistant labels of silica gel packaging according to claim 1, which is characterized in that upper sheet metal in the antenna
It is independently arranged between lower sheet metal, conducting is attached by conductive column between the two.
4. the high temperature resistant labels of silica gel packaging according to claim 1, which is characterized in that upper sheet metal in the antenna
It is structure as a whole between lower sheet metal, between the two the company by being integrally formed on upper sheet metal and lower sheet metal
Tape splicing connection conducting.
5. the high temperature resistant labels of silica gel packaging according to claim 1, which is characterized in that the radio frequency chip package module
On electrode and sheet metal on tie point between by laser welding, ultrasonic bonding, high temperature resistant soldering or arc welding
A kind of welding manner form reliable electrical connection.
6. the high temperature resistant labels of silica gel packaging according to claim 1, which is characterized in that the silica gel medium with a thickness of
Between 1mm~10mm.
7. the high temperature resistant labels of silica gel packaging according to claim 1, which is characterized in that the antenna and silica gel medium
Between bonded using adhesive resistant to high temperature, the main component of adhesive is one of organosilicon or epoxy resin.
8. the high temperature resistant labels of silica gel packaging according to claim 1, which is characterized in that the silica gel encapsulated member passes through
Silica gel material ejection formation is process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811651333.5A CN109754055A (en) | 2018-12-31 | 2018-12-31 | A kind of high temperature resistant labels of silica gel packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811651333.5A CN109754055A (en) | 2018-12-31 | 2018-12-31 | A kind of high temperature resistant labels of silica gel packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109754055A true CN109754055A (en) | 2019-05-14 |
Family
ID=66405014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811651333.5A Pending CN109754055A (en) | 2018-12-31 | 2018-12-31 | A kind of high temperature resistant labels of silica gel packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109754055A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100567842B1 (en) * | 2005-12-16 | 2006-04-05 | 주식회사 알에프링크 | Radio frequency identification tag for the metal product with high thermal resistance |
| KR100686598B1 (en) * | 2005-09-30 | 2007-02-26 | 주식회사 손텍 | Radio frequency identification tag with printed antenna |
| KR100686599B1 (en) * | 2005-09-30 | 2007-02-26 | 주식회사 손텍 | Radio frequency identification tag with fabrics antenna |
| KR20080048105A (en) * | 2006-11-28 | 2008-06-02 | 삼성테크윈 주식회사 | Rfid tag having dual package structure and method thereof |
| US20130033150A1 (en) * | 2010-03-29 | 2013-02-07 | Vectron International Gmbh & Co. Kg | High temperature-resistant, electrically conductive thin films |
| US20140224887A1 (en) * | 2011-09-30 | 2014-08-14 | Hitachi Chemical Company, Ltd. | Rfid tag |
| CN106599970A (en) * | 2016-11-03 | 2017-04-26 | 王力安防科技股份有限公司 | Metal product with RFID tag |
| CN209433425U (en) * | 2018-12-31 | 2019-09-24 | 上海仪电特镭宝信息科技有限公司 | A kind of high temperature resistant labels of silica gel packaging |
-
2018
- 2018-12-31 CN CN201811651333.5A patent/CN109754055A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100686598B1 (en) * | 2005-09-30 | 2007-02-26 | 주식회사 손텍 | Radio frequency identification tag with printed antenna |
| KR100686599B1 (en) * | 2005-09-30 | 2007-02-26 | 주식회사 손텍 | Radio frequency identification tag with fabrics antenna |
| KR100567842B1 (en) * | 2005-12-16 | 2006-04-05 | 주식회사 알에프링크 | Radio frequency identification tag for the metal product with high thermal resistance |
| KR20080048105A (en) * | 2006-11-28 | 2008-06-02 | 삼성테크윈 주식회사 | Rfid tag having dual package structure and method thereof |
| US20130033150A1 (en) * | 2010-03-29 | 2013-02-07 | Vectron International Gmbh & Co. Kg | High temperature-resistant, electrically conductive thin films |
| US20140224887A1 (en) * | 2011-09-30 | 2014-08-14 | Hitachi Chemical Company, Ltd. | Rfid tag |
| CN106599970A (en) * | 2016-11-03 | 2017-04-26 | 王力安防科技股份有限公司 | Metal product with RFID tag |
| CN209433425U (en) * | 2018-12-31 | 2019-09-24 | 上海仪电特镭宝信息科技有限公司 | A kind of high temperature resistant labels of silica gel packaging |
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