CN109750283A - A kind of process of SMC material chemical plating nickel-phosphorus alloy on surface - Google Patents
A kind of process of SMC material chemical plating nickel-phosphorus alloy on surface Download PDFInfo
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Abstract
The invention discloses a kind of process of SMC material chemical plating nickel-phosphorus alloy on surface and its material application, specific steps include: after plating piece pretreatment, sensitized treatment, activation processing, plating, processing Ni-P alloy layer；The material that present invention process method is prepared fine and close, uniform, bright, wear-resisting, corrosion resistance with overlay coating, and conductive capability enhances, and can apply in fields such as conductive material, engineering material, functional materials.
Description
Technical field
The present invention relates to SMC material technical field of surface, more particularly, to a kind of SMC material surface chemical Ni-P-plating
The process of alloy and its apply
Background technique
SMC (Sheet molding compound) material is sheet molding compound, mainly by glass, unsaturated-resin,
Filler, additive and auxiliary agent composition, belong to thermosetting resin based composites, and formed product uses the stamper of hot-die cold pressing
Skill, product have the characteristics such as excellent electrical isolation, high-strength light, fire-retardant, nontoxic, are widely used in communications and transportation, building, electricity
The every field such as gas, communication, food and drink, wherein maximum in auto industry application amount.
It is made of in SMC material production process molding compound manufacture and two stages of mould pressing process, the molding compound stage is will to remove
Other all the components other than fiber mix, and material paste are made, then paste dipping fiber with these material, sheet molding is made
Material.Product is made by processes such as shearing, charging, compression molding, post-processings in sheet molding compound.Because filler carbon is added in molding compound
Sour calcium, hydrated alumina, magnesia, talcum powder etc. cause wear-resisting, the poor corrosion resistance of SMC material, and impact resistance is weak,
It is at all non-conductive.
Because SMC material is non-conductive, wear-resisting, poor corrosion resistance, thin wall product is by easy fracture when external impacts and damage, limit
Further application has been made, if keeping surface modified in its plating metal on surface or alloy, has been improved on the basis of keeping primary characteristic
Wear-resisting, corrosion-resistant and shock resistance, prolongs the service life, and uses as conductive material, and application field is more extensive.
Therefore, it now needs to construct a kind of method modified using non-metal material surface, improves SMC modifying article surface
Its function, although non-metal material surface method of modifying is many, such as Vacuum Deposition, ion sputtering, spraying, chemical deposit thickness
Uniformly, there is higher hardness, good wear-resisting, corrosion resistance also can be on its surface even for the device of planform complexity
One layer of uniform metal or alloy is plated, is the important method of non-metal surface properties modification, now with electroless plating technology, is visited
Rope plates one layer of nickel-phosphorus alloy on SMC material surface, can solve and above-mentioned encounters that SMC product is non-conductive, wear-resisting, poor corrosion resistance
A series of problems, such as, its wear-resisting, corrosion-resistant and shock resistance is improved, is prolonged the service life, and used as conductive material,
Application field is more extensive.
Summary of the invention
In view of the above existing problems in the prior art, the present invention provides a kind of SMC material chemical plating nickel-phosphorus alloy on surface
Process and by this method prepare material and its application.
Chemical plating is also known as autocatalytic plating, is to carry out in the case where no impressed current passes through using during plating
Redox reaction, by the metal ion in solution, catalytic active center substrate surface is presented, to carry out selectively reduction heavy
Product, is allowed to form metal alloy coating, carries out a kind of modified process in surface to substrate, the substrate after plating is in many sides
Face shows superior performance.
A kind of process of SMC material chemical plating nickel-phosphorus alloy on surface, includes the following steps:
(1) plating piece pre-processes:
SMC material surface to be plated is polished, is then immersed in the sodium carbonate liquor of 1mol/L, is heated to 40 DEG C, is impregnated
Time 10min removes the greasy dirt and glue film on its surface, then clean wash with distilled water；
(2) sensitized treatment:
Pretreated SMC material to be plated is placed in sensitizing solution, 5min is handled under the conditions of 30 DEG C, adsorbs substrate surface
It is easy reduction Sn2+, it is clean wash with distilled water to take out substrate；
(3) it is activated:
The SMC material to be plated of sensitized treatment is put into activating solution, the Sn for being adsorbed on substrate surface is utilized2+By Pd2+Reduction
For Pd, metal Pd particulate catalyst nucleus of crystal is formed；10min is handled in 40 DEG C of activating solution；
(4) reduction treatment:
SMC material to be plated is not cleaned by what is be activated, is put into 18g/L ortho phosphorous acid sodium solution and is carried out also original place
It manages, reduction treatment 2min under the conditions of 30 DEG C, using the strong reducing power of sodium hypophosphite, the Pd for being reduced substrate surface not2+
Reduction completely, it is clean to then take out SMC material distilled water flushing；
(5) plating:
It according to the suitable plating nickel-phosphorus alloy container of SMC material area selection, first pours into plating solution A and pours into plating solution B again, and with dense
Ammonium hydroxide or salt acid for adjusting pH value；As long as plating solution B is poured into plating solution A, redox reaction carries out at once, therefore plating solution B pours into plating
After liquid A, the SMC material of reduction treatment should be immediately placed in plating solution, plating useful load is controlled in 1.0~1.5dm2/ L, control
The temperature and pH value of plating solution processed, chemical plating nickel-phosphorus alloy can carry out, and should be stirred continuously during plating, keep bath concentration equal
It is even, and the bubble generated in plating process is escaped, plating time is controlled in 40min；
(6) it handles
SMC plating piece is taken out after the completion of plating to be washed with dehydrated alcohol, the impurity of plating piece surface deposition is removed, after drying process
?.
Preferably, in step (2), sensitizing solution 6gSnCl2After being dissolved in 20ml concentrated hydrochloric acid, it is diluted to distilled water
500ml, and in prepared SnCl2Tin grain is added in solution prevents Sn2+Oxidation.
Preferably, in step (3), activation liquid making method is that 0.5g palladium chloride is dissolved completely in 6ml concentrated hydrochloric acid, is then used
Distilled water is diluted to 500ml.
Preferably, in step (5), chemical plating fluid configuration method are as follows: form the various substances of precise according to plating solution, remove
NaH2PO2·H2Outside O, various substances are dissolved respectively with a small amount of distilled water, successively by buffer (sodium acetate), complexing agent (fourth two
Acid, citric acid), the solution such as stabilizer pour into main salt NiSO4·6H2It is stirred evenly in O solution, as plating solution A；It then again will be also
Former agent NaH2PO2·H2O is individually dissolved as plating solution B；Plating solution volume is controlled according to chemical plating fluid recipe requirements, it is dilute with distilled water
It releases to the volume of needs.
Preferably, the process conditions of SMC material chemical plating nickel-phosphorus alloy on surface are as follows: bath temperature is controlled in 65 (± 5) DEG C,
PH value is 4.5~5.0.
Preferably, the process conditions of SMC material chemical plating nickel-phosphorus alloy on surface are as follows: Ni2+/H2PO2 -Molar concentration ratio
0.35 (± 0.05), plating time are 40 (± 10) min.
Preferably, which is characterized in that
Chemical plating fluid preparation method: NiSO4·6H2O 24g/L, NaH2PO2·H2O28g/L, CH3COONa26g/L,
C4H6O4(succinic acid) 15g/L, C6H8O7·H2O (citric acid) 10g/L, stabilizer are a small amount of.
Preferably, the chemical equation carried out during plating are as follows:
3H2PO2 -+2H+→2P↓+3H2PO3 -+3H2O
H2PO2 -+H2O→H2PO3 -+H2↑
The present invention also provides materials prepared by a kind of above-mentioned process using SMC material chemical plating nickel-phosphorus alloy on surface
Material.
A kind of material of the process preparation of SMC material chemical plating nickel-phosphorus alloy on surface, in conductive material, engineering material
The application in the fields such as material, functional material.
Advantage of the present invention are as follows:
(1) keep SMC material overlay coating fine and close, uniform, bright using chemical plating nickel-phosphorus alloy
(2) improve that SMC material is wear-resisting, corrosion resistance
(3) SMC material conductive capability enhances, and can be used as conductive material use
(4) that widens SMC material uses field, and has preferable economic benefit
Detailed description of the invention
Fig. 1 SMC material Electroless nickel-phosphor plating process flow diagram
The experimental result picture that Fig. 2 bath temperature influences quality of coating
The experimental result picture that Fig. 3 bath pH value influences quality of coating
Fig. 4 Ni2+/H2PO2 -Molar concentration compares the experimental result picture that quality of coating influences
Fig. 5 SMC plating piece and unplated pieces friction experiment numerical value figure
Fig. 6 SMC plating piece electric conductivity experimental result picture
Fig. 7 SMC unplated pieces electric conductivity experimental result picture
Fig. 8 plating piece field scan Electronic Speculum plan view
Fig. 9 plating piece field scan Electronic Speculum side view
Figure 10 plating piece transmission electron microscope picture
Figure 11 plating piece transmission electron microscope picture
Specific embodiment
Following embodiment of the invention is only used to illustrate realization a specific embodiment of the invention, these embodiments cannot
It is not understood as limitation of the present invention.It is other it is any the change made without departing from the spirit and principles of the present invention,
Modification, combination, simplifies substitution, is accordingly to be regarded as equivalent substitute mode, falls within the scope and spirit of the invention.
The process basic steps of SMC material chemical plating nickel-phosphorus alloy on surface are as follows, and subsequent process condition experiment is all
It is tested on this basis.
(1) plating piece pre-processes:
SMC material surface to be plated is polished, is then immersed in the sodium carbonate liquor of 1mol/L, is heated to 40 DEG C, is impregnated
Time 10min removes the greasy dirt and glue film on its surface, then clean wash with distilled water；
(2) sensitized treatment:
Pretreated SMC material to be plated is placed in sensitizing solution, 5min is handled under the conditions of 30 DEG C, adsorbs substrate surface
It is easy reduction Sn2+, it is clean wash with distilled water to take out substrate；
(3) it is activated:
The SMC material to be plated of sensitized treatment is put into activating solution, the Sn for being adsorbed on substrate surface is utilized2+By Pd2+Reduction
For Pd, metal Pd particulate catalyst nucleus of crystal is formed；10min is handled in 40 DEG C of activating solution；
(4) reduction treatment:
SMC material to be plated is not cleaned by what is be activated, is put into 18g/L ortho phosphorous acid sodium solution and is carried out also original place
It manages, reduction treatment 2min under the conditions of 30 DEG C, using the strong reducing power of sodium hypophosphite, the Pd for being reduced substrate surface not2+
Reduction completely, it is clean to then take out SMC material distilled water flushing；
(5) plating:
It according to the suitable plating nickel-phosphorus alloy container of SMC material area selection, first pours into plating solution A and pours into plating solution B again, and with dense
Ammonium hydroxide or salt acid for adjusting pH value；As long as plating solution B is poured into plating solution A, redox reaction carries out at once, therefore plating solution B pours into plating
After liquid A, the SMC material of reduction treatment should be immediately placed in plating solution, plating useful load is controlled in 1.0~1.5dm2/ L, control
The temperature and pH value of plating solution processed, chemical plating nickel-phosphorus alloy can carry out, and should be stirred continuously during plating, keep bath concentration equal
It is even, and the bubble generated in plating process is escaped, plating time is controlled in 40min；
(6) it handles
SMC plating piece is taken out after the completion of plating to be washed with dehydrated alcohol, the impurity of plating piece surface deposition is removed, after drying process
?.
SMC material Electroless nickel-phosphor plating process condition experiment
Influence SMC material chemical plating nickel-phosphorus alloy on surface quality of coating factor it is more, as bath temperature, bath pH value,
Ni2+/H2PO2 -Molar concentration ratio and complexing agent selection etc., study by many experiments, determine SMC material chemical nickel plating on surface
The process flow and operating condition of phosphorus alloy: in 65 (± 5) DEG C, pH value is 4.5~5.0, Ni for bath temperature control2+/H2PO2 -It rubs
That concentration proportion 0.35 (± 0.05), plating time are 40 (± 10) min, available fine and close, uniformly, bright Ni-P alloy
Coating.
Embodiment 1
The experiment that bath temperature influences quality of coating
When experiment discovery bath temperature is lower than 35 DEG C, plating is difficult, at 45 DEG C of bath temperature or more, plating piece surface occur compared with
More bubbles, nickel-phosphorus alloy deposition velocity is accelerated, and when being heated to 80 DEG C or more, plating solution starts muddiness, and bath stability is deteriorated, coating
Binding force die down, coating rate of body weight gain sustainable growth that temperature is from 45 DEG C to 80 DEG C or more, 65 DEG C or less increase it is very fast, more than 65 DEG C
Above increase slows down.The result shows that plating temperature control is advisable at 65 DEG C or so.Experimental result is as shown in Figure 2.
Embodiment 2
The experiment that bath pH value influences quality of coating
Experiment discovery bath pH value is lower, and nickel-phosphorus alloy deposition rate is smaller, and when plating solution pH < 3, deposition reaction stops, nothing
The effective plating of method；Bath pH value is higher, and deposition velocity is bigger, and coating rate of body weight gain increases, but in plating solutionWith Ni2+It is easy shape
Keep plating solution muddy at phosphorous acid nickel or nickel hydroxide precipitate, and coating becomes coarse and to carry the sediment in plating solution secretly coprecipitated
Product, makes binding force of cladding material be deteriorated, and is easy to cause plating solution decomposition.The result shows that bath pH value control is advisable 4.5~5.0.Such as
Shown in Fig. 3.
Embodiment 3
Ni2+/H2PO2 -Molar concentration compares the experiment that quality of coating influences
Experiment discovery is for main salt nickel sulfate, and influence of the sodium hypophosphite to deposition velocity and quality of coating is more
Significantly, when ortho phosphorous acid sodium content is lower than 30g/L in plating solution, deposition velocity improves rapidly with the increase of its content, more than 30g/L
When, deposition velocity reduces.Ni2+/H2PO2 -When than less than 0.25, coating is dimmed；Ni2+/H2PO2 -When ratio is greater than 0.6, deposition speed
It is difficult to spend lower plating.The result shows that Ni2+/H2PO2 -Than control at 0.35 or so, the deposition velocity of nickel-phosphorus alloy is higher, can
Obtain the coating of uniform bright.Experimental result is as shown in Figure 4.
Embodiment 3
Influence test of the other factors to quality of coating
When ortho phosphorous acid sodium solution is added in experiment discovery plating solution, redox reaction can occur, if matrix is not added (i.e.
It is unloaded) overlong time can cause nickel ion itself reduction to form nickel particle, initiation plating solution decomposition, therefore ortho phosphorous acid is added in plating solution
After sodium, it should be put into matrix plating as early as possible.Furthermore the addition and selection of complexing agent, deposition velocity and coating matter for nickel-phosphorus alloy
Amount also has an impact, and complexing agent succinic acid and citric acid are that polyfunctional group complexing agent and nickel ion form complex compound, controls in plating solution
Nickel ion reaction density, and succinic acid has reduction nickel-phosphorus alloy evolution reaction activation energy, accelerates the effect of deposition velocity, because
The content of succinic acid can neither excessively can not be too low in this plating solution.
Using following verification experimental verifications effect of the present invention:
According to SMC material Electroless nickel-phosphor plating process control condition, the conjunction of SMC material surface chemical Ni-P-plating is carried out
Gold selects its plating piece to carry out performance detection.
(1) abrasion test
After choosing SMC plating piece and unplated pieces sample precise, it is individually placed to standard NO180#On water-proof abrasive paper, sample
On put 100g counterweight, pushed along sand paper long side length and carry out abrasion test, record friction number and sample mass calculates friction damage
Mistake rate, the wear-resisting property of plating piece improves significant compared with unplated pieces.Experimental result is as shown in Figure 5.
w1--- quality before sample rubs, g
w2--- quality after sample friction, g
(2) Electrical conductivity tests
The electric conductivity of SMC plating piece and unplated pieces is detected using CHI660E type electrochemical workstation, the results showed that unplated pieces
The very big no conductive capability of impedance value, the impedance value very little of plating piece, electric conductivity is good, can be used as conductive material and answers
With.Experimental results are as shown in Figure 6,7.
(3) corrosion resistance test
SMC plating piece and unplated pieces are respectively put into different solutions and impregnate certain time progress corrosion resistance experiment detection,
SMC plating piece and unplated pieces are recorded in different solutions, the mass loss of different soaking times, calculate the corrosion of plating piece and unplated pieces
Rate, the experimental results showed that SMC plating piece, compared with unplated pieces, the corrosion resistance of plating piece enhances.Plating piece and not in 25 DEG C of various solution
The Corrosion results of plating piece such as table 1.
w1--- quality before sample corrodes, g
w2--- quality after sample corrosion, g
The Corrosion results of plating piece in 1 25 DEG C of various solution of table
(4) field scan Electronic Speculum and transmission electron microscope detection
SMC plating piece through field emission scanning electron microscope Sigma 500VP (ZEISS Zeiss, Germany) detect, plated layer compact, light,
Uniformly, thickness of coating is greater than 10 μm；JEM-2100PLUS transmission electron microscope (JEOL company) detection, diffraction pattern without lattice fringe,
Salt free ligands luminous point around diffraction ring shows that SMC plating piece nickel-phosphorus alloy is amorphous structure, which is conducive to improve the resistance to of plating piece
Mill, corrosion resistance.Test result is as follows shown in Fig. 8,9,10,11.
Although the present invention has been described in detail, it will be understood by those skilled in the art that in spirit and scope of the invention
Modification will be apparent.However, it should be understood that various aspects, different specific embodiment that the present invention records
Each section and the various features enumerated can be combined or all or part of exchange.In above-mentioned each specific embodiment, that
A little embodiments with reference to another embodiment can be combined suitably with other embodiment, this is will be by this field skill
Art personnel are to understand.In addition, it will be understood to those of skill in the art that the description of front is only exemplary mode, not purport
In the limitation present invention.
Claims (10)
1. a kind of process of SMC material chemical plating nickel-phosphorus alloy on surface, which comprises the steps of:
(1) plating piece pre-processes:
SMC material surface to be plated is polished, is then immersed in the sodium carbonate liquor of 1mol/L, is heated to 40 DEG C, soaking time
10min removes the greasy dirt and glue film on its surface, then clean wash with distilled water；
(2) sensitized treatment:
Pretreated SMC material to be plated is placed in sensitizing solution, handles 5min under the conditions of 30 DEG C, is easy substrate surface absorption
Restore Sn2+, it is clean wash with distilled water to take out substrate；
(3) it is activated:
The SMC material to be plated of sensitized treatment is put into activating solution, the Sn for being adsorbed on substrate surface is utilized2+By Pd2+Pd is reduced to,
Form metal Pd particulate catalyst nucleus of crystal；10min is handled in 40 DEG C of activating solution；
(4) reduction treatment:
SMC material to be plated is not cleaned by what is be activated, is put into 18g/L ortho phosphorous acid sodium solution and is carried out reduction treatment, 30
Reduction treatment 2min under the conditions of DEG C, using the strong reducing power of sodium hypophosphite, the Pd for being reduced substrate surface not2+Completely also
It is clean to then take out SMC material distilled water flushing for original；
(5) plating:
According to the suitable plating nickel-phosphorus alloy container of SMC material area selection, first pours into plating solution A and pour into plating solution B again, and use concentrated ammonia liquor
Or salt acid for adjusting pH value；As long as plating solution B is poured into plating solution A, redox reaction carries out at once, therefore plating solution B pours into plating solution A
Afterwards, the SMC material of reduction treatment should be immediately placed in plating solution, plating useful load is controlled in 1.0~1.5dm2/ L, control plating
The temperature and pH value of liquid, chemical plating nickel-phosphorus alloy can carry out, and should be stirred continuously during plating, keep bath concentration uniform, and
Escape the bubble generated in plating process, plating time is controlled in 40min；
(6) it handles
SMC plating piece is taken out after the completion of plating to be washed with dehydrated alcohol, removes the impurity of plating piece surface deposition, after drying process i.e.
It can.
2. a kind of process of SMC material chemical plating nickel-phosphorus alloy on surface according to claim 1, which is characterized in that
In step (2), sensitizing solution 6gSnCl2After being dissolved in 20ml concentrated hydrochloric acid, it is diluted to 500ml with distilled water, and prepared
SnCl2Tin grain is added in solution prevents Sn2+Oxidation.
3. a kind of process of SMC material chemical plating nickel-phosphorus alloy on surface according to claim 1, which is characterized in that
In step (3), activation liquid making method is that 0.5g palladium chloride is dissolved completely in 6ml concentrated hydrochloric acid, is then diluted to distilled water
500ml。
4. a kind of process of SMC material chemical plating nickel-phosphorus alloy on surface according to claim 1, which is characterized in that
In step (5), chemical plating fluid configuration method are as follows: form the various substances of precise according to plating solution, remove NaH2PO2·H2Outside O, use
A small amount of distilled water respectively dissolves various substances, successively by buffer (sodium acetate), complexing agent (succinic acid, citric acid), stabilization
The solution such as agent pour into main salt NiSO4·6H2It is stirred evenly in O solution, as plating solution A；Then again by reducing agent NaH2PO2·H2O
Individually dissolution is used as plating solution B；Plating solution volume is controlled according to chemical plating fluid recipe requirements, the volume of needs is diluted to distilled water.
5. a kind of process of SMC material chemical plating nickel-phosphorus alloy on surface according to claim 1, which is characterized in that
The process conditions of SMC material chemical plating nickel-phosphorus alloy on surface are as follows: in 65 (± 5) DEG C, pH value is 4.5~5.0 for bath temperature control.
6. a kind of process of SMC material chemical plating nickel-phosphorus alloy on surface according to claim 1, which is characterized in that
The process conditions of SMC material chemical plating nickel-phosphorus alloy on surface are as follows: Ni2+/H2PO2 -Molar concentration ratio 0.35 (± 0.05), plating
Time is 40 (± 10) min.
7. according to claim 1 or a kind of 4 described in any item processes of SMC material chemical plating nickel-phosphorus alloy on surface,
It is characterized in that,
Chemical plating fluid preparation method: NiSO4·6H2O 24g/L, NaH2PO2·H2O 28g/L, CH3COONa 26g/L, C4H6O4
(succinic acid) 15g/L, C6H8O7·H2O (citric acid) 10g/L, stabilizer are a small amount of.
8. a kind of process of SMC material chemical plating nickel-phosphorus alloy on surface according to claim 1, which is characterized in that
The chemical equation carried out during plating are as follows:
3H2PO2 -+2H+→2P↓+3H2PO3 -+3H2O
H2PO2 -+H2O→H2PO3 -+H2↑。
9. material prepared by the process according to claim 1 using a kind of SMC material chemical plating nickel-phosphorus alloy on surface
Material.
10. material prepared by the process according to claim 9 using a kind of SMC material chemical plating nickel-phosphorus alloy on surface
Material, which is characterized in that the application in fields such as conductive material, engineering material, functional materials.
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| CN109750283B (en) | 2021-04-09 |
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