CN109743056B - Satellite time service device - Google Patents
Satellite time service device Download PDFInfo
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- CN109743056B CN109743056B CN201910141624.8A CN201910141624A CN109743056B CN 109743056 B CN109743056 B CN 109743056B CN 201910141624 A CN201910141624 A CN 201910141624A CN 109743056 B CN109743056 B CN 109743056B
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- crystal oscillator
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- 238000009413 insulation Methods 0.000 claims abstract description 135
- 239000013078 crystal Substances 0.000 claims abstract description 125
- 239000010453 quartz Substances 0.000 claims abstract description 97
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 97
- 238000005192 partition Methods 0.000 claims description 83
- 238000000926 separation method Methods 0.000 claims description 20
- 238000003801 milling Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 abstract description 9
- 238000012546 transfer Methods 0.000 abstract description 8
- 238000004891 communication Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 34
- 210000005056 cell body Anatomy 0.000 description 9
- 238000013461 design Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000004321 preservation Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
- H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
- H03L1/04—Constructional details for maintaining temperature constant
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Abstract
The invention belongs to the technical field of communication products, and particularly relates to a satellite time service device. The satellite time service device comprises a circuit board, an upper cover and a quartz crystal oscillator, wherein the upper cover is covered on the circuit board and encloses with the circuit board to form an installation cavity, a heat insulation groove is formed in the surface of the circuit board, a supporting piece is arranged in the heat insulation groove, the quartz crystal oscillator is fixed on the supporting piece and is positioned in the installation cavity, and a heat insulation air layer is formed between the quartz crystal oscillator and the bottom of the heat insulation groove. Therefore, the heat insulation groove is formed in the circuit board, so that a heat insulation air layer in the heat insulation groove replaces the circuit board to conduct heat transfer, and the heat conductivity coefficient of air is smaller than that of the circuit board, so that the heat resistance of heat exchange between the quartz crystal oscillator and the external environment is increased, the influence of external air flow on the temperature of the quartz crystal oscillator can be reduced, and the temperature stability of the quartz crystal oscillator is improved.
Description
Technical Field
The invention belongs to the technical field of communication products, and particularly relates to a satellite time service device.
Background
With the rapid development of computer networks, network applications are very popular, and the accuracy requirements of network systems on time synchronization are also increasing, so that network systems in the fields of electric power, finance, communication, transportation, national defense and the like need to maintain the time synchronism and time accuracy of computers in a wide range. As is well known, all-weather, full-time and high-precision time service operation can be realized by using global navigation system (GPS), beidou and other Global Navigation Satellite System (GNSS) wireless satellite signals, so that the time between different devices is highly uniform, and the time service precision is as high as tens of nanoseconds.
The time service device based on the satellite time service principle can normally operate without separating an internal clock source in the device; the high-precision operation of the internal clock source is closely related to a quartz crystal oscillator (crystal oscillator for short) which provides a clock signal inside. Generally, crystal oscillators commonly used as internal clock sources include a common active crystal oscillator, a temperature compensation crystal oscillator, a voltage-controlled crystal oscillator, a constant-temperature crystal oscillator and the like, and since the internal clock sources are all electronic, the stability and accuracy of the operation of the internal clock sources are more or less affected by the ambient temperature.
In the prior art, a temperature compensation crystal oscillator, a voltage-controlled crystal oscillator or a constant-temperature crystal oscillator is often used for avoiding or reducing the influence of external environment temperature on a time service device, wherein the constant-temperature crystal oscillator has high stability, but has huge volume and relatively high price; the voltage-controlled crystal oscillator needs an additional closed-loop control system to control, and the stability depends on the closed-loop control system; the temperature compensation crystal oscillator has small volume, relatively low price and high stability, and the typical frequency temperature characteristic of the temperature compensation crystal oscillator commonly used for navigation positioning equipment is +/-0.5 ppm, but the frequency temperature stability of the time service device is still slightly insufficient.
Disclosure of Invention
The invention aims to provide a satellite time service device, and aims to solve the technical problem that the temperature of a quartz crystal oscillator in the satellite time service device in the prior art is easily influenced by external airflow and external environment temperature.
In order to achieve the above purpose, the invention adopts the following technical scheme: the utility model provides a satellite time service device, includes circuit board, upper cover and quartz crystal oscillator, and the upper cover lid closes on the circuit board and encloses with the circuit board and establish and form the installation cavity, and the surface of circuit board orientation upper cover is equipped with the insulating slot that is located upper cover orthographic projection, is provided with support piece in the insulating slot, and quartz crystal oscillator is fixed in on the support piece and is located the installation cavity, and is formed with thermal-insulated air layer between the tank bottom of quartz crystal and insulating slot.
Further, the heat insulation groove comprises a first groove body, the supporting piece comprises a first partition wall and a second partition wall which are used for separating the first groove body in the heat insulation groove, the quartz crystal oscillator is covered on the first groove body and fixedly connected with the first partition wall and the second partition wall, and a first heat insulation cavity is formed by surrounding the quartz crystal oscillator, the first groove body and the circuit board.
Further, the heat insulation groove further comprises a second groove body, the supporting piece further comprises a third partition wall and a fourth partition wall which are used for separating the second groove body in the heat insulation groove, the first groove body is provided with a first end and a second end which are oppositely arranged, the second groove body is arranged at the first end of the first groove body and extends from one end of the circuit board to the other end, the middle part of the second groove body is communicated with the first end of the first groove body, the end part of the third partition wall, which faces the first groove body, is connected with the end part of the first partition wall, which faces the second groove body, the end part of the fourth partition wall, which faces the first groove body, is connected with the end part of the second partition wall, which faces the second groove body, and the upper cover, the second groove body and the circuit board are surrounded to form a second heat insulation cavity.
Further, the heat insulation groove further comprises a third groove body, the support piece further comprises a fifth partition wall and a sixth partition wall which divide the third groove body in the heat insulation groove, and the third groove body is arranged at the second end of the first groove body and is provided with a first end and a second end which are oppositely arranged; the first end of third cell body is linked together with the second end of first cell body, and the tip of fifth division wall orientation first cell body links to each other with the tip of first division wall orientation third cell body, and the tip of sixth division wall orientation first cell body links to each other with the tip of second division wall orientation third cell body, and the second end of third cell body extends towards the direction that deviates from first cell body, and upper cover, third cell body and circuit board enclose to establish and are formed with the third and insulate against heat the chamber.
Further, the heat insulation groove further comprises a fourth groove body and a fifth groove body which are respectively arranged at two sides of the first groove body, the third separation wall, the first separation wall and the fifth separation wall are sequentially connected in the heat insulation groove to separate the fourth groove body, the fourth separation wall, the second separation wall and the sixth separation wall are sequentially connected in the heat insulation groove to separate the fifth groove body, the upper cover, the fourth groove body and the circuit board are surrounded to form a fourth heat insulation cavity, and the upper cover, the fifth groove body and the circuit board are surrounded to form a fifth heat insulation cavity.
Further, the first partition wall is provided with a bonding pad opposite to the upper surface of the upper cover and the second partition wall is provided with a bonding pad opposite to the upper surface of the upper cover, and the quartz crystal oscillator is fixedly welded with the bonding pad.
Further, the number of the bonding pads is at least two, and at least two bonding pads are respectively arranged on the first partition wall and the second partition wall.
Further, the satellite time service device further comprises at least two connecting wires for electrically connecting the quartz crystal oscillator and the circuit board, first ends of the at least two connecting wires are respectively welded with the at least two bonding pads correspondingly, and second ends of the connecting wires are respectively arranged along the third partition wall, the fourth partition wall, the fifth partition wall or the sixth partition wall in an extending mode.
Further, the heat insulation groove is a deep groove manufactured by a depth control groove milling method on the circuit board.
Further, the upper cover is welded with the circuit board, or the upper cover is connected with the circuit board through a fastener.
The invention has the beneficial effects that: the satellite time service device is characterized in that a circuit board for installing the quartz crystal oscillator is provided with a heat insulation groove, a supporting piece is arranged in the heat insulation groove, the quartz crystal oscillator is fixed on the supporting piece and is accommodated in the installation cavity, and at the moment, a heat insulation air layer can be formed between the quartz crystal oscillator and the circuit board, namely, a heat insulation layer is arranged between the quartz crystal oscillator and the circuit board. Like this, through seting up the heat insulating tank on the circuit board, make the thermal-insulated air bed in the heat insulating tank replace the circuit board to carry out heat transfer and conduction, because the coefficient of heat conductivity of air is less than the coefficient of heat conductivity of circuit board, so, carry out the thermal resistance that heat exchanges between quartz crystal oscillator and the external environment grow, at this moment, compare and directly carry out heat transfer through the circuit board, set up the heat insulating tank and after constructing the thermal-insulated air bed, heat exchange resistance between quartz crystal oscillator and the external environment grow, the heat exchange speed reduces, thereby can reduce the influence of external air current to the temperature of quartz crystal oscillator in the installation cavity, the effectual temperature stability who improves quartz crystal oscillator, promote quartz crystal oscillator work accuracy.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a satellite timing device according to an embodiment of the present invention;
FIG. 2 is an exploded view of a satellite timing device according to an embodiment of the present invention;
Fig. 3 is a schematic structural diagram of a circuit board of the satellite timing device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a support member on a circuit board of the satellite timing device according to an embodiment of the present invention.
Wherein, each reference sign in the figure:
10-circuit board 11-heat insulation groove 20-upper cover
30-Quartz crystal oscillator 40-bonding pad 50-connecting wire
111-First groove 112-second groove 113-third groove
114-Fourth tank 115-fifth tank 116-support
1161-First partition 1162-second partition 1163-third partition
1164-Fourth partition 1165-fifth partition 1166-sixth partition.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to fig. 1 to 4 are exemplary and intended to illustrate the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1 to 4, an embodiment of the present invention provides a satellite time service device, which includes a circuit board 10, an upper cover 20 and a quartz crystal oscillator 30, wherein the circuit board 10 is a PCB board and is electrically connected to the quartz crystal oscillator 30, and the upper cover 20 is used for protecting electronic components such as the quartz crystal oscillator 30 on the circuit board 10, wherein the electronic components can be transmitted between the circuit board and the quartz crystal oscillator 30. Specifically, the upper cover 20 is covered on the circuit board 10 and encloses a mounting cavity (not shown) with the circuit board 10, a heat insulation groove 11 located in the orthographic projection of the upper cover 20 is provided on the surface of the circuit board 10 facing the upper cover 20, a supporting member 116 is provided in the heat insulation groove 11, the quartz crystal oscillator 30 is fixed on the supporting member 116 and located in the mounting cavity, and a heat insulation air layer (not shown) is formed between the quartz crystal oscillator 30 and the bottom of the heat insulation groove 11.
The circuit board 10 for installing the quartz crystal oscillator 30 is provided with the heat insulation groove 11, the support 116 is arranged in the heat insulation groove, the quartz crystal oscillator 30 is fixed on the support 116 and is accommodated in the installation cavity, and at the moment, a heat insulation air layer can be formed between the quartz crystal oscillator 30 and the circuit board 10, namely, a heat insulation layer is arranged between the quartz crystal oscillator 30 and the circuit board 10. Thus, by providing the heat insulation groove 11 on the circuit board 10, the heat insulation air layer in the heat insulation groove 11 replaces the circuit board 10 to conduct heat transfer, and because the heat conductivity coefficient of air is far smaller than that of the circuit board 10 (the heat conductivity coefficient of the air is smaller than or only one tenth of that of the circuit board), the heat resistance of heat exchange between the quartz crystal oscillator 30 and the external environment becomes larger, at this time, compared with the heat transfer directly performed through the circuit board 10, after the heat insulation groove 11 is provided and the heat insulation air layer is constructed, the heat exchange resistance between the quartz crystal oscillator 30 and the external environment becomes larger, and the heat exchange speed is reduced, thereby reducing the influence of the external air flow on the temperature of the quartz crystal oscillator 30 in the installation cavity, effectively improving the temperature stability of the quartz crystal oscillator 30, and improving the working accuracy of the quartz crystal oscillator 30. Therefore, when the internal clock source of the time service device adopts the common active crystal oscillator, the heat insulation groove 11 can improve the capability of the common active crystal oscillator for resisting the influence of external air flow and temperature, thereby improving the working stability, and when the internal clock source of the time service device adopts the temperature compensation crystal oscillator, the voltage-controlled crystal oscillator or the constant-temperature crystal oscillator, the heat insulation groove 11 can be matched with the temperature compensation crystal oscillator or the constant-temperature crystal oscillator, thereby further improving the working stability.
Specifically, the quartz crystal oscillator 30 is any one of a common active crystal oscillator, a temperature compensation crystal oscillator, a voltage-controlled crystal oscillator or a constant temperature crystal oscillator, and can be selected according to practical situations when in use, which is not limited only herein.
Preferably, the size of the heat insulation groove 11 can be independently designed through modeling simulation software, so that various design parameters of the heat insulation groove 11, such as the shape of a groove body, the depth of a groove and the like of the heat insulation groove 11 are adjusted through the modeling software, so that the heat insulation parameters of an air heat insulation layer formed inside the heat insulation groove 11 are adjusted and optimized, the heat conductivity coefficient of the air heat insulation layer is reduced, the heat resistance between the quartz crystal oscillator 30 and the external environment is increased, and the heat insulation and heat preservation effects of the heat insulation groove 11 and the air heat insulation layer thereof on the quartz crystal oscillator 30 are improved.
In another embodiment of the present invention, as shown in fig. 2 to 4, the heat insulation groove 11 includes a first groove body 111, the supporting member 116 includes a first partition wall 1161 and a second partition wall 1162 separating the first groove body 111 in the heat insulation groove 11, the quartz crystal oscillator 30 is covered on the first groove body 111 and fixedly connected with the first partition wall 1161 and the second partition wall 1162, and a first heat insulation cavity (not shown) is formed around the quartz crystal oscillator 30, the first groove body 111 and the circuit board 10.
Specifically, the first tank 111 is disposed opposite to the quartz crystal oscillator 30, the quartz crystal oscillator 30 is covered on the first tank 111, the bottom edge of the quartz crystal oscillator 30 opposite to the circuit board 10 is fixedly connected with the first partition wall 1161 and the second partition wall 1162 (i.e. the outer edges of the notches of the first tank 111), at this time, the quartz crystal oscillator 30, the first tank 111 and the circuit board 10 are enclosed to form a first heat insulation cavity, and air is contained in the first heat insulation cavity to form a heat insulation air layer, so that heat exchange between the quartz crystal oscillator 30 and external airflow in the vertical direction needs to be conducted through the heat insulation air layer in the first heat insulation cavity, and the heat insulation air layer with a smaller heat conductivity replaces the circuit board 10 with a larger heat conductivity to conduct heat, so that the vertical heat conduction resistance of the quartz crystal oscillator 30 is increased, thereby effectively reducing the temperature influence of external airflow on the quartz crystal oscillator 30 in the satellite time service device, and being beneficial to improving the temperature stability and working accuracy of the quartz crystal oscillator 30.
Preferably, the size of the first tank 111 can be independently designed by modeling simulation software, so that various design parameters of the first tank 111, such as the shape of the tank of the first tank 111, the depth of the slot, and the like, are optimized by the modeling software, so that the shape and the size of the cavity of the first heat insulation cavity are adjusted and optimized, the heat insulation parameters of the air heat insulation layer in the first heat insulation cavity are optimized, the heat conductivity coefficient of the air heat insulation layer in the vertical direction is reduced, the thermal resistance between the quartz crystal oscillator 30 and the external environment is increased, and the heat insulation and heat preservation effects of the first tank 111 and the air heat insulation layer inside the first tank on the quartz crystal oscillator 30 are improved.
In another embodiment of the present invention, as shown in fig. 2 to 4, the heat insulation slot 11 further includes a second slot body 112, the supporting member 116 further includes a third partition wall 1163 and a fourth partition wall 1164 that partition the second slot body 112 in the heat insulation slot 11, the first slot body 111 has a first end and a second end that are disposed opposite to each other, the second slot body 112 is disposed at the first end of the first slot body 111 and extends from one end to the other end of the circuit board 10, the middle portion of the second slot body 112 is in communication with the first end of the first slot body 111, the end of the third partition wall 1163 facing the first slot body 111 is connected with the end of the first partition wall 1161 facing the second slot body 112, the end of the fourth partition wall 1164 facing the first slot body 111 is connected with the end of the second partition wall 1162 facing the second slot body 112, the upper cover 20, the second slot body 112 and the circuit board 10 are enclosed to form a second heat insulation cavity (not shown), the second heat insulation cavity is capable of accommodating air and forming an air layer, or the second heat insulation cavity is in communication with the first heat insulation cavity and the second heat insulation cavity extends from the first heat insulation cavity to the first heat insulation air layer. In this way, by providing the second groove 112 communicating with the first groove 111, the circuit board 10 at one end of the quartz crystal oscillator 30 is provided as the second heat insulation cavity for extending the heat insulation air layer, so as to further expand the coverage area of the heat insulation air layer, increase the thermal resistance of the periphery side of the quartz crystal oscillator 30, especially increase the thermal resistance of the quartz crystal oscillator 30 for heat transfer along the length direction (or width direction) of the circuit board 10, further reduce the possibility of temperature change of the quartz crystal oscillator 30 caused by external airflow, and improve the temperature stability of the quartz crystal oscillator 30.
It should be noted that, in some other embodiments of the present invention, the middle portion of the second groove 112 may not be in communication with the first groove 111, that is, the end portion of the third partition wall 1163 facing the first groove 111 is directly connected to the end portion of the fourth partition wall 1164 facing the first groove 111, where the third groove 113 and the first groove 111 are disposed independently.
Further, as shown in fig. 2 to 4, the heat insulation tank 11 further includes a third tank body 113, the supporting member 116 further includes a fifth partition wall 1165 and a sixth partition wall 1166 for partitioning the third tank body 113 in the heat insulation tank 11, and the third tank body 113 is disposed at the second end of the first tank body 111 and also has a first end and a second end disposed opposite to each other; the first end of the third slot 113 is communicated with the second end of the first slot 111, the end of the fifth partition wall 1165 facing the first slot 111 is connected with the end of the first partition wall 1161 facing the third slot 113, the end of the sixth partition wall 1166 facing the first slot 111 is connected with the end of the second partition wall 1162 facing the third slot 113, the second end of the third slot 113 extends in a direction away from the first slot 111, a third heat insulation cavity (not shown) is formed around the upper cover 20, the third slot 113 and the circuit board 10, the third heat insulation cavity can accommodate air and form a heat insulation air layer, or the third heat insulation cavity is also communicated with the first heat insulation cavity, and the heat insulation air layer can extend from the first heat insulation cavity to the third heat insulation cavity. That is, the third groove 113 communicating with the first groove 111 is also disposed at the other end of the quartz crystal oscillator 30, so that the coverage area of the heat-insulating air layer can be further expanded on the basis of the second groove 112, the thermal resistance of the periphery side of the quartz crystal oscillator 30 is increased, especially the thermal resistance of the quartz crystal oscillator 30 in the transverse direction is increased, the possibility of temperature change of the quartz crystal oscillator 30 caused by external airflow is further reduced, and the temperature stability of the quartz crystal oscillator 30 is improved.
It should be noted that, in some other embodiments of the present invention, the first end of the third slot 113 may not be in communication with the second end of the first slot 111, and the third slot 113 and the first slot 111 may be disposed independently.
Preferably, the dimensions of the second tank 112 and the third tank 113 can be modeled by combining the design parameters of the first tank 111 with modeling simulation software, so that the design parameters of the second tank 112 and the third tank 113 are optimized by modeling software, thereby adjusting and optimizing the heat insulation parameters of the air heat insulation layer at the periphery of the quartz crystal oscillator 30, reducing the heat conductivity coefficient of the air heat insulation layer in the horizontal direction, and further increasing the heat resistance between the quartz crystal oscillator 30 and the external environment, so as to improve the heat insulation and heat preservation effects of the second tank 112, the third tank 113 and the air heat insulation layer inside the second tank 112 on the quartz crystal oscillator 30.
Still further, as shown in fig. 2 to 4, the heat insulation tank 11 further includes a fourth tank 114 and a fifth tank 115 respectively disposed at two sides of the first tank 111, the third partition wall 1163, the first partition wall 1161 and the fifth partition wall 1165 are sequentially connected to the heat insulation tank 11 to separate the fourth tank 114, the fourth partition wall 1164, the second partition wall 1162 and the sixth partition wall 1166 are sequentially connected to the heat insulation tank 11 to separate the fifth tank 115, the upper cover 20, the fourth tank 114 and the circuit board 10 enclose a fourth heat insulation cavity (not shown), the upper cover 20, the fifth tank 115 and the circuit board enclose a fifth heat insulation cavity (not shown), and the fourth heat insulation cavity and the fifth heat insulation cavity can both hold air and form a heat insulation air layer. In this way, by arranging the fourth tank 114 and the fifth tank 115, the coverage area of the air heat insulation layer can be further expanded, the thermal resistance of the periphery side of the quartz crystal oscillator 30 is increased, and the heat preservation effect of the heat insulation tank 11 and the air heat insulation layer inside the heat insulation tank on the quartz crystal oscillator 30 is better improved. In addition, the design parameters of the fourth tank 114 and the fifth tank 115 can be optimally designed by combining the design parameters of the first tank 111, the second tank 112 and the third tank 113 through modeling simulation software, so as to provide an optimal thermal resistance value, reduce the influence of external air flow on the quartz crystal oscillator 30 to the maximum extent, and maintain the temperature stability of the quartz crystal oscillator 30.
In some other embodiments of the present invention, the fourth insulating cavity and the fifth insulating cavity may be respectively connected to at least one of the first insulating cavity, the second insulating cavity, or the third insulating cavity, and the insulating air layer extends from the first insulating cavity (the second insulating cavity or the third insulating cavity) into the fourth insulating cavity and the fifth insulating cavity, respectively.
In another embodiment of the present invention, as shown in fig. 2 and 3, a bonding pad 40 is provided on both the upper surface of the first partition wall 1161 facing the upper cover and the upper surface of the second partition wall 1162 facing the upper cover 20, and the quartz crystal oscillator 30 is soldered to the bonding pad 40, thereby fixing the quartz crystal oscillator 30 to the circuit board 10.
Preferably, the number of the bonding pads 40 is at least two, and at least two bonding pads 40 are respectively arranged on the first partition wall 1161 and the second partition wall 1162, namely, one bonding pad 40 is arranged on the outer edge of the notch of the first groove body 111 close to the fourth groove body 114, and the other bonding pad 40 is arranged on the outer edge of the notch of the first groove body 111 close to the fifth groove body 115, so that two opposite sides of the quartz crystal oscillator 30 are respectively welded with the notch edge of the first groove body 111 through one bonding pad 40, the quartz crystal oscillator 30 is stably covered on the first groove body 111, and the heat insulation and heat preservation effects of the air heat insulation layer on the quartz crystal oscillator 30 are fully exerted.
More preferably, in the present embodiment, as shown in fig. 2, the number of bonding pads is four, wherein two bonding pads 40 are disposed on the first partition wall 1161, and the other two bonding pads 40 are disposed on the second partition wall 1162, that is, two bonding pads 40 are disposed on the outer edge of the notch of the first groove 111 near the fourth groove 114, and the other two bonding pads are disposed on the outer edge of the notch of the first groove 111 near the fifth groove 115, so that the four corners of the bottom of the quartz crystal oscillator 30 are welded with the notch edge of the first groove 111 through one bonding pad 40, so as to better improve the mounting stability of the quartz crystal oscillator 30.
In another embodiment of the present invention, as shown in fig. 2 and 3, the satellite timing device further includes at least two connection wires 50 for electrically connecting the quartz crystal oscillator 30 and the circuit board 10, wherein first ends of the at least two connection wires 50 are soldered corresponding to the at least two pads 40, respectively, and second ends of the at least two connection wires 50 are disposed along the third partition wall 1163, the fourth partition wall 1164, the fifth partition wall 1165 or the sixth partition wall 1166, respectively.
Preferably, the connecting wire 50 is a copper wire having a relatively small cross-sectional area and a relatively long length. Generally, since copper has a relatively large thermal conductivity and a relatively small thermal resistance, however, in order to secure the temperature stability of the quartz crystal oscillator 30, it is necessary to increase the thermal resistance of the connection wire 50 as much as possible; specifically, according to the single-layer structure thermal resistance formula r=δ/(λa) (where R is a thermal resistance value (k/W), δ is a material layer thickness (m) of the heat transfer path, λ is a material thermal conductivity [ W/(m·k) ], and a is a material cross-sectional area (m ζ2) perpendicular to the heat transfer path), it can be seen that decreasing the cross-sectional area of the connection wire 50 while increasing the length of the connection wire 50 can increase the thermal resistance of the connection wire 50. Therefore, the copper wire with smaller cross-sectional area and longer length is selected as the connecting wire 50 in this embodiment, so as to increase the thermal resistance of the connecting wire 50.
Preferably, the design parameters of the connection wire 50 can be optimally designed by modeling simulation software to select the optimal length, cross-sectional area, shape, etc. of the connection wire 50, so as to balance the design parameters of the connection wire 50, such as thermal conductivity, parasitic inductance, direct current resistance, actual manufacturing condition of the circuit board 10, etc., thereby providing the thermal resistance optimal value of the connection wire 50.
Specifically, when the number of the connection wires 50 is less than or equal to the number of the bonding pads 40, and the number of the connection wires is the same, one bonding pad 40 is correspondingly connected with one connection wire 50, that is, the first ends of the connection wires 50 are correspondingly welded with the bonding pads 40 one by one; and when the number of the arrangement of the connection wires 50 is smaller than the number of the arrangement of the bonding pads 40, the bonding pads 40 not connected to the connection wires 50 are used only for soldering fixation of the quartz crystal oscillator 30.
Preferably, as shown in fig. 2, the number of the bonding pads 40 is preferably 4, the number of the connection wires 50 is preferably four, and the first ends of the four connection wires 50 are respectively soldered with the four bonding pads 40 in a one-to-one correspondence, and the second ends of the four connection wires 50 are respectively extended along the third partition wall 1163, the fourth partition wall 1164, the fifth partition wall 1165 or the sixth partition wall 1166, thereby ensuring stable connection of the quartz crystal oscillator 30.
In another embodiment of the present invention, as shown in fig. 2 to 4, the heat insulation groove 11 is preferably a deep groove formed on the circuit board 10 by a controlled depth milling method. The heat insulation groove 11 of this embodiment is formed on the circuit board 10 by adopting the depth-control groove milling technology, so that the processing precision of the heat insulation groove 11 can be ensured, and the structural integrity of the surface of the circuit board 10, which is far away from the quartz crystal oscillator 30, cannot be damaged during processing, and the heat insulation groove 11 cannot penetrate the whole circuit board 10, so that the integrity of the outer surface of the circuit board 10, which is far away from the quartz crystal oscillator 30, can be ensured.
Specifically, as shown in fig. 3 and 4, the first slot 111, the second slot 112, the third slot 113, the fourth slot 114 and the fifth slot 115 are milled on the circuit board 10 by using the depth-controlled slot milling technology, and the supporting member 116 is formed on the circuit board 12.
In another embodiment of the present invention, as shown in fig. 1 and 2, the upper cover 20 is soldered with the circuit board 10, or the upper cover 20 is connected with the circuit board 10 by a fastener; the upper cover 20 is arranged to cover the circuit board 10, and the quartz crystal oscillator 30 is arranged in a mounting cavity formed by surrounding the upper cover 20 and the circuit board 10, so that the quartz crystal oscillator 30 is protected, and the influence of external airflow on the temperature of the quartz crystal oscillator 30 is reduced.
Preferably, when the upper cover 20 is covered on the circuit board 10, a gap with a small height dimension is formed between the upper cover 20 and the quartz crystal oscillator 30, i.e., a distance between the upper cover 20 and the quartz crystal oscillator 30 is relatively small, so as to reduce convection of air in the entire installation cavity, particularly, air in the heat insulation groove 11, through the gap as much as possible, thereby better ensuring the heat insulation effect of the thin heat insulation air layer in the heat insulation groove 11.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (9)
1. The utility model provides a satellite time service device which characterized in that: the circuit board is covered on the circuit board and forms a mounting cavity with the circuit board in a surrounding way, a heat insulation groove positioned in the orthographic projection of the upper cover is arranged on the surface of the circuit board facing the upper cover, a supporting piece is arranged in the heat insulation groove, the quartz crystal oscillator is fixed on the supporting piece and positioned in the mounting cavity, and a heat insulation air layer is formed between the quartz crystal oscillator and the bottom of the heat insulation groove; the quartz crystal oscillator is any one of an active crystal oscillator, a temperature compensation crystal oscillator, a voltage-controlled crystal oscillator or a constant-temperature crystal oscillator;
the heat insulation groove comprises a first groove body, the supporting piece comprises a first partition wall and a second partition wall which are separated from the first groove body in the heat insulation groove, the quartz crystal oscillator is opposite to the first groove body and is covered on the first groove body and fixedly connected with the first partition wall and the second partition wall, and a first heat insulation cavity is formed by encircling the quartz crystal oscillator, the first groove body and the circuit board.
2. The satellite timing device of claim 1, wherein: the heat insulation groove further comprises a second groove body, and the supporting piece further comprises a third partition wall and a fourth partition wall which are used for separating the second groove body in the heat insulation groove; the first groove body is provided with a first end and a second end which are oppositely arranged, the second groove body is arranged at the first end of the first groove body and extends from one end of the circuit board to the other end, the middle part of the second groove body is communicated with the first end of the first groove body, the end part of the third separation wall, which faces the first groove body, is connected with the end part of the first separation wall, which faces the second groove body, and the end part of the fourth separation wall, which faces the first groove body, is connected with the end part of the second separation wall, which faces the second groove body; the upper cover, the second groove body and the circuit board are surrounded to form a second heat insulation cavity.
3. The satellite timing device according to claim 2, wherein: the heat insulation groove further comprises a third groove body, the support piece further comprises a fifth partition wall and a sixth partition wall which are respectively arranged in the heat insulation groove and separate from the third groove body, and the third groove body is arranged at the second end of the first groove body and is provided with a first end and a second end which are oppositely arranged; the first end of the third groove body is communicated with the second end of the first groove body, the end of the fifth separation wall, which faces the first groove body, is connected with the end of the first separation wall, which faces the third groove body, the end of the sixth separation wall, which faces the first groove body, is connected with the end of the second separation wall, which faces the third groove body, and the second end of the third groove body extends in a direction away from the first groove body; the upper cover, the third groove body and the circuit board are surrounded to form a third heat insulation cavity.
4. A satellite timing device according to claim 3, wherein: the heat insulation groove further comprises a fourth groove body and a fifth groove body which are respectively arranged at two sides of the first groove body, the third separation wall, the first separation wall and the fifth separation wall are sequentially connected in the heat insulation groove to separate the fourth groove body, the fourth separation wall, the second separation wall and the sixth separation wall are sequentially connected in the heat insulation groove to separate the fifth groove body, the upper cover, the fourth groove body and the circuit board enclose to form a fourth heat insulation cavity, and the upper cover, the fifth groove body and the circuit board enclose to form a fifth heat insulation cavity.
5. The satellite timing device according to claim 4, wherein: the first partition wall is opposite to the upper surface of the upper cover, the second partition wall is opposite to the upper surface of the upper cover, bonding pads are arranged on the upper surface of the upper cover, and the quartz crystal oscillator is fixedly welded with the bonding pads.
6. The satellite timing device according to claim 5, wherein: the number of the bonding pads is at least two, and at least two bonding pads are respectively arranged on the first partition wall and the second partition wall.
7. The satellite timing device of claim 6, wherein: the satellite time service device further comprises at least two connecting wires for electrically connecting the quartz crystal oscillator and the circuit board, wherein first ends of the at least two connecting wires are respectively welded with at least two bonding pads correspondingly, and second ends of the connecting wires are respectively arranged along the third partition wall, the fourth partition wall, the fifth partition wall or the sixth partition wall in an extending mode.
8. The satellite timing device according to any one of claims 1 to 7, wherein: the heat insulation groove is a deep groove manufactured on the circuit board by adopting a depth control groove milling method.
9. The satellite timing device according to any one of claims 1 to 7, wherein: the upper cover is welded with the circuit board, or the upper cover is connected with the circuit board through a fastener.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910141624.8A CN109743056B (en) | 2019-02-26 | 2019-02-26 | Satellite time service device |
| PCT/CN2019/126668 WO2020173193A1 (en) | 2019-02-26 | 2019-12-19 | Satellite time transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910141624.8A CN109743056B (en) | 2019-02-26 | 2019-02-26 | Satellite time service device |
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| Publication Number | Publication Date |
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| CN109743056A CN109743056A (en) | 2019-05-10 |
| CN109743056B true CN109743056B (en) | 2024-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910141624.8A Active CN109743056B (en) | 2019-02-26 | 2019-02-26 | Satellite time service device |
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| CN (1) | CN109743056B (en) |
| WO (1) | WO2020173193A1 (en) |
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|---|---|---|---|---|
| CN109743056B (en) * | 2019-02-26 | 2024-06-11 | 泰斗微电子科技有限公司 | Satellite time service device |
| CN111580135A (en) * | 2020-05-27 | 2020-08-25 | 上海锐伟电子科技有限公司 | Method and structure for reducing GPS drift |
| CN114296337A (en) * | 2021-12-29 | 2022-04-08 | 湖南国科微电子股份有限公司 | High-precision time service frequency-granting receiver |
| CN115842529B (en) * | 2023-02-17 | 2023-05-16 | 中国科学院苏州纳米技术与纳米仿生研究所 | Crystal oscillator element packaging structure and packaging method |
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| CN209488554U (en) * | 2019-02-26 | 2019-10-11 | 泰斗微电子科技有限公司 | Satellite time transfer device |
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| WO2020173193A1 (en) | 2020-09-03 |
| CN109743056A (en) | 2019-05-10 |
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