CN109735879A - The preparation method of electrolytic copper foil anode plate - Google Patents
The preparation method of electrolytic copper foil anode plate Download PDFInfo
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- CN109735879A CN109735879A CN201910179671.1A CN201910179671A CN109735879A CN 109735879 A CN109735879 A CN 109735879A CN 201910179671 A CN201910179671 A CN 201910179671A CN 109735879 A CN109735879 A CN 109735879A
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- copper foil
- anode plate
- electrolytic copper
- preparation
- foil anode
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Abstract
The invention discloses a kind of preparation methods of electrolytic copper foil anode plate, comprising: (1) selects titanium plate as raw material；(2) the step of pre-treatment；(3) oxidation furnace at 550-570 DEG C keeps the temperature 1.5-2h；(4) it is equipped with precious metal solution；(5) precious metal solution is repeatedly coated to matrix surface after heat treatment, to form coating of the thickness at 6-7 μm；(6) matrix is mounted on foil machine pedestal.Fluid hole on electrolytic copper foil anode plate prepared by the present invention is ellipse, and it is staggered, it can be deformed during processing and installation to avoid matrix, and it is also more preferable relative to existing anode plate by the electric conductivity of electrolytic copper foil anode plate prepared by the present invention, coating activity, the uniformity, further extend service life.
Description
Technical field
The present invention relates to electrode fields, more particularly, to a kind of preparation method of electrolytic copper foil anode plate.
Background technique
Traditional copper foil electrode uses lead anode, have the disadvantage that seriously polluted, power consumption is high, copper foil is uneven and
Conductive effect is poor, therefore is gradually substituted by Ni―Ti anode, and coated titanium electrode has that light, service life is longer, non-environmental-pollution etc.
Advantage.But be easily deformed during processing and processing using Ni―Ti anode at present, affect its electric conductivity and service life.
Summary of the invention
The present invention is above-mentioned in order to overcome the shortcomings of, provide it is a kind of be unlikely to deform, electric conductivity is more preferable, the service life is longer
The preparation method of electrolytic copper foil anode plate, comprising:
(1) select titanium plate as raw material；
(2) the step of pre-treatment: shearing raw material → processing threaded mounting hole and oval fluid hole → be curled into matrix →
Washing → roughness processing；
(3) oxidation furnace at 550-570 DEG C keeps the temperature 1.5-2h；
(4) parts by weight are 25-28 parts of chloro-iridic acid, 13-15 parts of tantalic chloride, 45-55 parts of hydrochloric acid and 5-8 parts
Butanediol is configured to precious metal solution；
(5) precious metal solution is coated on matrix, in 90-100 DEG C of dry 10min, is sintered then at 520-540 DEG C
15min, cooled to room temperature, in this mode repetitive coatings, drying and sintering 15-18 times, and last time sintering time
For 1-1.5h, the coating of 6-7 μ m-thick is formed after cooling；
(6) matrix is mounted on foil machine pedestal.
The preparation method of electrolytic copper foil anode plate of the present invention, the middle titanium plate thickness selected of step (1) is 1-6mm.
The preparation method of electrolytic copper foil anode plate of the present invention, the threaded mounting hole in step (2) is located at the two sides of titanium plate, ellipse
Round fluid hole is located between the threaded mounting hole of two sides.
The preparation method of electrolytic copper foil anode plate of the present invention, oval fluid hole by laser machining, be machined with to
Few two rows, and be staggered.
The preparation method of electrolytic copper foil anode plate of the present invention, step (2) uses the sandblasting in sand-blasting machine of GH40 steel sand, until thick
Rugosity Rz > 30.
The preparation method of electrolytic copper foil anode plate of the present invention, concentration of hydrochloric acid 10%.
The beneficial effects of the present invention are:
Fluid hole on electrolytic copper foil anode plate prepared by the present invention is ellipse, and is staggered, can be to avoid matrix
It is deformed during processing and installation, and active, equal by the electric conductivity of electrolytic copper foil anode plate prepared by the present invention, coating
Evenness is also more preferable relative to existing anode plate, further extends service life.
Detailed description of the invention
Examples of the present invention will be described by way of reference to the accompanying drawings, in which:
Fig. 1 is electrolytic copper foil anode plate schematic diagram prepared by the present invention.；
Specific embodiment
In conjunction with the accompanying drawings, the present invention is further explained in detail.These attached drawings are simplified schematic diagram, only with
Illustration illustrates basic structure of the invention, therefore it only shows the composition relevant to the invention.
The present invention is described in further detail now.
(1) it selects with a thickness of 1-6mm titanium plate as raw material；
(2) the step of pre-treatment: shearing raw material → processing threaded mounting hole and oval fluid hole → be curled into matrix →
Washing → roughness processing；
(3) oxidation furnace at 550-570 DEG C keeps the temperature 1.5-2h；
(4) parts by weight are 25-28 parts chloro-iridic acid, 13-15 parts of tantalic chloride, 45-55 parts of concentration are 10%
Hydrochloric acid and 5-8 parts of butanediol are configured to precious metal solution；
(5) precious metal solution is coated on matrix, in 90-100 DEG C of dry 10min, is sintered then at 520-540 DEG C
15min, cooled to room temperature, in this mode repetitive coatings, drying and sintering 15-18 times, and last time sintering time
For 1-1.5h, the coating of 6-7 μ m-thick is formed after cooling；
(6) matrix is mounted on foil machine pedestal.
As shown in Figure 1, the threaded mounting hole position 1 in above-mentioned steps (2) is in the two sides of titanium plate, the ellipse fluid hole 2
By laser machining, between the threaded mounting hole 1 of two sides, and there are at least two rows, be staggered.It is adopted when roughness processing
The sandblasting in sand-blasting machine with GH40 steel sand, until roughness Rz > 30.
Fluid hole on electrolytic copper foil anode plate prepared by the present invention is ellipse, and is staggered, can be to avoid matrix
It is deformed during processing and installation, and active, equal by the electric conductivity of electrolytic copper foil anode plate prepared by the present invention, coating
Evenness is also more preferable relative to existing anode plate, further extends service life.
It is above-mentioned according to the present invention for enlightenment, through the above description, relevant staff completely can without departing from
In the range of this invention technical idea, various changes and amendments are carried out.The technical scope of this invention is not limited to
In the content on specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (6)
1. a kind of preparation method of electrolytic copper foil anode plate characterized by comprising
(1) select titanium plate as raw material；
(2) the step of pre-treatment: shearing raw material → processing threaded mounting hole and oval fluid hole → is curled into matrix → washing
The processing of → roughness；
(3) oxidation furnace at 550-570 DEG C keeps the temperature 1.5-2h；
(4) parts by weight are 25-28 parts of chloro-iridic acid, 13-15 parts of tantalic chloride, 45-55 parts of hydrochloric acid and 5-8 parts of fourth two
Alcohol is configured to precious metal solution；
(5) precious metal solution is coated on matrix, in 90-100 DEG C of dry 10min, then at 520-540 DEG C of sintering 15min, certainly
It is so cooled to room temperature, in this mode repetitive coatings, drying and sintering 15-18 times, and last time sintering time is 1-1.5h,
The coating of 6-7 μ m-thick is formed after cooling；
(6) matrix is mounted on foil machine pedestal.
2. the preparation method of electrolytic copper foil anode plate according to claim 1, which is characterized in that selected in step (1)
Titanium plate thickness is 1-6mm.
3. the preparation method of electrolytic copper foil anode plate according to claim 1, which is characterized in that the screw thread in step (2)
Mounting hole is located at the two sides of titanium plate, and oval fluid hole is located between the threaded mounting hole of two sides.
4. the preparation method of electrolytic copper foil anode plate according to claim 3, which is characterized in that oval fluid hole passes through
It laser machines, is machined at least two rows, and be staggered.
5. the preparation method of electrolytic copper foil anode plate according to claim 1, which is characterized in that step (2) uses GH40
Steel sand sandblasting in sand-blasting machine, until roughness Rz > 30.
6. the preparation method of electrolytic copper foil anode plate according to claim 1, which is characterized in that concentration of hydrochloric acid 10%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910179671.1A CN109735879A (en) | 2019-03-11 | 2019-03-11 | The preparation method of electrolytic copper foil anode plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910179671.1A CN109735879A (en) | 2019-03-11 | 2019-03-11 | The preparation method of electrolytic copper foil anode plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109735879A true CN109735879A (en) | 2019-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910179671.1A Pending CN109735879A (en) | 2019-03-11 | 2019-03-11 | The preparation method of electrolytic copper foil anode plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111013983A (en) * | 2019-11-21 | 2020-04-17 | 湖北中一科技股份有限公司 | Preparation method of anode plate applied to electrolytic copper foil |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5489368A (en) * | 1992-01-28 | 1996-02-06 | Permelec Electrode, Ltd. | Insoluble electrode structural material |
| JP2004269977A (en) * | 2003-03-10 | 2004-09-30 | Osaka Prefecture | Insoluble anode for plating |
| CN207608638U (en) * | 2017-11-15 | 2018-07-13 | 灵宝华鑫铜箔有限责任公司 | A kind of foil machine upper liquid hole anode plate |
| CN108660488A (en) * | 2018-05-29 | 2018-10-16 | 江阴安诺电极有限公司 | The preparation method of electrolytic copper foil anode plate |
-
2019
- 2019-03-11 CN CN201910179671.1A patent/CN109735879A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5489368A (en) * | 1992-01-28 | 1996-02-06 | Permelec Electrode, Ltd. | Insoluble electrode structural material |
| JP2004269977A (en) * | 2003-03-10 | 2004-09-30 | Osaka Prefecture | Insoluble anode for plating |
| CN207608638U (en) * | 2017-11-15 | 2018-07-13 | 灵宝华鑫铜箔有限责任公司 | A kind of foil machine upper liquid hole anode plate |
| CN108660488A (en) * | 2018-05-29 | 2018-10-16 | 江阴安诺电极有限公司 | The preparation method of electrolytic copper foil anode plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111013983A (en) * | 2019-11-21 | 2020-04-17 | 湖北中一科技股份有限公司 | Preparation method of anode plate applied to electrolytic copper foil |
| CN111013983B (en) * | 2019-11-21 | 2022-04-26 | 湖北中一科技股份有限公司 | Preparation method of anode plate applied to electrolytic copper foil |
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Application publication date: 20190510 |