CN109729644A - A kind of optical assembly designs device in panel assembly, its assembly method and in plate - Google Patents
A kind of optical assembly designs device in panel assembly, its assembly method and in plate Download PDFInfo
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- CN109729644A CN109729644A CN201711030014.8A CN201711030014A CN109729644A CN 109729644 A CN109729644 A CN 109729644A CN 201711030014 A CN201711030014 A CN 201711030014A CN 109729644 A CN109729644 A CN 109729644A
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- Prior art keywords
- optical assembly
- adagio
- printed circuit
- signal
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
A kind of optical assembly is in panel assembly, comprising: optical assembly and an adagio；Adagio is electrically connected optical assembly to printed circuit board, realizes the transmission of the electric signal at least two channels of optical assembly.It is designed using single piece type adagio, simplifies optical assembly in plate production process, improve production efficiency, reduce costs.
Description
Technical field
The present invention relates to plate design field more particularly to a kind of optical assembly panel assembly, its assembly method and
Plate designs device.
Background technique
Optical assembly inside conventional low rate optical module is assembled using broken plate mode, as shown in Figure 1, wherein optical assembly 102
It is assemblied on circuit board 101 by broken plate mode.However, which is there are optical assembly manual welding, maintenance difficulty is big, product knot
The problems such as structure limitation is more, are chiefly used in that yield is not high, has a single function, the optical module class product design of small size.
Equipment vendor is at BOB (Bi-Direction Optical Subassembly on board, two-way optical assembly is in plate)
Using top dress mode in design, as shown in Figure 2, wherein and BOSA (Bi-Direction Optical Subassembly, it is two-way
Optical assembly) 202 circuit board 201 is assemblied in by pushing up dress mode, the transmission pin 203 of BOSA 202 and receive pin 204 electrically
It is connected to circuit board 201.Top dress mode changes the production method of traditional optical module, by rings such as optical module production, calibration, tests
Section is merged into during the complete machine manufacturing, compresses industry chain length, and integration testing index request supports the automatic metaplasia of BOSA
It produces, acquisition of technology and two-win economically.
However, due to the design limitation of 45 ° of conjunction partial wave optical paths there is the length for receiving pin or transmission pin in top dress BOSA
Too long problem, such as transmission pin 203 shown in Fig. 2 are longer.Longer pin introduces biggish parasitic inductance sensibility reciprocal, causes letter
Number overshoot, ring the problems such as, reduce transmission signal quality.Moreover, for high speed signal such as 2.5Gbps or more signal, pin mistake
Length is very big to transmitting signal eye pattern quality and receiving sensitivity Index Influence.
Summary of the invention
It is the general introduction to the theme being described in detail herein below.This general introduction is not the protection model in order to limit claim
It encloses.
The embodiment of the present application provides a kind of optical assembly and designs device in panel assembly, its assembly method and in plate, and use is a piece of
The design of formula adagio, simplifies optical assembly in plate production process, improves production efficiency, reduce costs.
In a first aspect, the embodiment of the present application provides a kind of optical assembly in panel assembly, comprising: optical assembly and an adagio；
The adagio is electrically connected the optical assembly to printed circuit board, realizes the electric signal at least two channels of the optical assembly
Transmission.
Second aspect, the embodiment of the present application provide a kind of optical assembly in the assembly method of panel assembly, comprising:
On a printed circuit board by optical assembly positioning；
The optical assembly and the printed circuit board are electrically connected using the molding adagio of pre-bending, to realize the light
The transmission of the electric signal at least two channels of component.
The third aspect, the embodiment of the present application provide a kind of in plate design device, comprising:
Optical assembly, an adagio and printed circuit board；The adagio is electrically connected the optical assembly to the printing electricity
Road plate realizes the transmission of the electric signal at least two channels of the optical assembly.
In the embodiment of the present application, optical assembly is electrically connected to by printed circuit board (PCB, Printed using a piece of adagio
Circuit Board), realize the transmission of the electric signal at least two channels of optical assembly.In this way, real by single piece type adagio
Now disposably exempt from positioning assembly, pressure welding knife once positions, simplifies optical assembly in plate production process, shorten production hour, props up
Automatic welding production is held, production efficiency is improved, reduces costs.
After reading and understanding attached drawing and detailed description, it can be appreciated that other aspects.
Detailed description of the invention
Fig. 1 is the assembling schematic diagram of the broken plate mode of optical assembly；
Fig. 2 is the assembling schematic diagram of the top dress mode of optical assembly；
Fig. 3 is assembling schematic diagram one of the optical assembly provided by the embodiments of the present application in panel assembly；
Fig. 4 is assembling schematic diagram two of the optical assembly provided by the embodiments of the present application in panel assembly；
Fig. 5 is assembling schematic diagram three of the optical assembly provided by the embodiments of the present application in panel assembly；
Fig. 6 is assembling schematic diagram four of the optical assembly provided by the embodiments of the present application in panel assembly；
Fig. 7 is assembling schematic diagram five of the optical assembly provided by the embodiments of the present application in panel assembly；
Fig. 8 is flow chart of the optical assembly provided by the embodiments of the present application in the assembly method of panel assembly.
Specific embodiment
The embodiment of the present application is described in detail below in conjunction with attached drawing, it should be understood that embodiments described below is only
For instruction and explanation of the application, it is not used to limit the application.
The embodiment of the present application provides a kind of optical assembly in panel assembly, comprising: optical assembly and an adagio, the adagio are electrical
The optical assembly is connected to printed circuit board (PCB), realizes the transmission of the electric signal at least two channels of the optical assembly.
Wherein, adagio can be FPC (Flexible Printed Circuit, flexible circuit board).
In the present embodiment, the electric connection between optical assembly and PCB is realized using adagio, can be minimized wire length,
Signal lead reduces transmission line parasitic parameter with reference planes.Designed by single piece type adagio, realize optical assembly and PCB it
Between at least two channels electric signal transmission, optical assembly can be simplified in plate production process, improve production efficiency, and reduce
Cost.
Illustratively, optical assembly may include following one: two-way optical assembly (BOSA), at least two channels light emitting group
Part (TOSA, Transmitting Optical Sub-Assembly), at least two channels light-receiving component (ROSA,
Receiving Optical Sub-Assembly).For example, optical assembly can be the 10G and BOSA of the above high-speed.However,
The application does not limit this.
In the exemplary embodiment, the electric signal at least two channels may include: the reception at least two channels
Signal；Alternatively, the transmission signal at least two channels；Alternatively, at least one channel receives signal and at least one channel
Send signal.
For example, the electric signal at least two channels may include the reception signal in a channel when optical assembly is BOSA
With the transmission signal in a channel；When optical assembly is at least TOSA in two channels, the electric signal at least two channels be can wrap
Include the transmission signal at least two channels；When optical assembly is at least ROSA in two channels, the electric signal at least two channels can be with
Reception signal including at least two channels.
In the present embodiment, due to realizing that the transmission of electric signal at least two channels can have letter using single piece type adagio
Between number the problem of crosstalk, in order to avoid between signal the problem of crosstalk, physical isolation measure can be taken in adagio design.First
Kind mode are as follows: adagio is connected and carries out physical segmentation between the part of the electric signal at least two channels；Include with optical assembly
For receiving pin and sending pin, the reception pin of the first end connection optical assembly of adagio, the second end of adagio connects light group
The reception pin of part, and there are notch or gaps between first end and second end, similarly, in the side of adagio connection PCB
Using similar processing；The second way are as follows: notch or gap can be not provided on adagio, but transmitted on adagio different
Setting meets the external series gap of condition between the region of the electric signal in channel, for example, external series gap is equal to 5 times of trace width
Gap.
In the present embodiment, in order to avoid that the problem of crosstalk, electric signal can be taken to be isolated in adagio design between signal
Measure.Wherein, the signal lead on adagio can satisfy claimed below: HW High Way does not allow closely, over long distances in parallel
Cabling, differential signal press isometric cabling, guarantee the continuity of signal lead impedance, and differential signal line packet ground cabling minimizes letter
Number recirculation loop.
In the exemplary embodiment, the electric signal in a channel of optical assembly is transmitted by pin all the way；Adagio is even
It connects at at least two-way pin of optical assembly using unification design；Alternatively, adagio is at the pad of connection PCB using unification design；
Alternatively, adagio is designed at at least two-way pin of connection optical assembly using unification, and using unification at the pad of connection PCB
Design；Wherein, pad is used for transmission the electric signal at least two channels.
By taking optical assembly is BOSA as an example, it includes that receiving and transmitting signal welds on PCB that optical assembly, which includes receiving pin and sending pin,
Disk；Adagio receives pin in connection and sends at pin using unification design；Alternatively, adagio is adopted at connection receiving and transmitting signal pad
It is designed with unification；Alternatively, adagio receives pin in connection and sends using unification design at pin, and in connection receiving and transmitting signal weldering
Pan Chu is using unification design.
In the examples described above, adagio indicates do not have notch or gap on adagio using unification design, for example, being continuous
Face.In the examples described above, it is needed using the adagio of unification design using above-mentioned second of physical isolation measure, i.e., at least two
The electric signal transmission region setting in channel meets the external series gap of condition, to avoid between signal the problem of crosstalk.
In the exemplary embodiment, one end of adagio is fixed on the side, bottom surface or top surface of optical assembly, adagio it is another
End keeps coplanar with PCB, is fixed on PCB.
In the exemplary embodiment, optical assembly may include receiving pin and transmission pin；Adagio may include receiving
Signal area and transmission signal area, receiving signal area includes receiving signal lead and receiving reference horizontal plane of manufacturing, for passing
The defeated signal for receiving pin, sending signal area includes sending signal lead and sending reference horizontal plane of manufacturing, is used for transmission transmission
The signal of pin；It receives signal area and sends the external series gap that there is the condition that meets between signal area.In this example, soft
On plate physical isolation can be realized in such a way that external series gap is set.In this example, it receives reference horizontal plane of manufacturing and sends ginseng
Examining ground level can be connected in the plane in large area of PCB by independent grounding point respectively.
In the exemplary embodiment, optical assembly is assemblied on PCB using top dress mode.Illustratively, optical assembly is in PCB
On assembly direction may include following one: unilateral pin PCB, unilateral pin vertical PCB, two sides pin upwards downward vertically
Parallel PCB.
In the exemplary embodiment, after the pin of optical assembly is welded to adagio, solder joint protrution on adagio can be with
Less than or equal to length threshold (for example, 1mm).
It is illustrated below by optical assembly of multiple examples to the application in panel assembly.In following example optical assembly with
It is illustrated for BOSA.However, the application does not limit this.
Example one
In this example, as shown in figure 3, BOSA 302 is assemblied on PCB 301 using top dress mode, and BOSA 302
Transmission pin 303 is oriented parallel to PCB 301 with reception pin 304, i.e. assembly direction of the BOSA 302 on PCB 301 is
The parallel PCB of two sides pin.Wherein, BOSA 302 can be positioned on PCB 301 by the fixation bracket of bottom surface.Adagio 305
One end is fixed on the side of BOSA 302, and the other end is coplanar with PCB 301, and is fixed on PCB 301.
In this example, 305 pre-bend of adagio forms three parts, and first part and second part are bonded BOSA 302 respectively
Two sides, BOSA 302 transmission pin 303 welding on the second portion, the reception pin 304 of BOSA 302 is welded to
In first part, Part III can be bonded the signal pad on PCB 301.
In this example, as shown in figure 3, it is preforming to the progress bending of adagio 305, and to the transmission pin of BOSA 302
303 carry out shaping with pin 304 is received, and cut off extra pin length, guarantee 1 millimeter of 305 reverse side of adagio exposing after welding
(mm) with internal pin length, meet soldering reliability shortest length；By the transmission pin 303 of BOSA 302, receive pin
304 are welded on adagio 305, it should be noted that transmission pin 303, the solder joint protrution for receiving pin 304 should not mistakes
Long, solder joint need to be in wave crest shape, and bright round and smooth, Wuxi thorn is answered on surface；BOSA 302 is assembled to PCB 301 using side top dress mode
On, the signal of the signal, reception pin 304 that send pin 303 is connected to the single of adagio 305 by the cabling on adagio 305
At pin, preforming 305 natural torsion of adagio fits to the corresponding signal pad of PCB 301 and location hole, and assembly positioning is primary
It completes, is not necessarily to auxiliary movement；Then the pin of adagio 305 is welded to by corresponding signal pad on PCB 301 by press welder
On, pressure welding hilted broadsword once positions primary welding, without adjusting blade position, efficiently complete BOSA assembly, adagio positioning and from
The production requirement of dynamic welding.
As shown in figure 3, BOSA 302 and adagio 305 are in fiducial axis symmetrical structure, BOSA 302 after this symmetrical structure assembly
Ontology is more stable, positions and is not susceptible to turn on one's side when welding, facilitates adagio 305 preforming, be conducive to adagio 305 in PCB
Quick positioning on 301, reduces the auxiliary movement of mask placement device, and the device of BOSA producer and equipment vendor is facilitated to weld, and improves life
Produce efficiency.
As shown in figure 3, adagio 305 receives pin 304 in connection and sends at pin 303 using unification design, i.e. adagio
305 connection send pin 303 and receive pin 304 at be it is continuous, without notch or gap.
In this example, to solve cross-interference issue between unification design bring signal of the adagio 305 at connection transmitting-receiving pin,
It needs to take physical isolation and electric signal quarantine measures in adagio design.It is divided on adagio 305 and sends signal area and reception
Signal area, sending signal area and receiving needs to guarantee certain external series gap between signal area, as between 5 times of trace widths
Gap；Wherein, it sends signal area and only walks to send signal and corresponding reference ground, similarly, reception signal area only is walked to receive signal
And it is corresponding with reference to ground；Reference horizontal plane of manufacturing need to be kept completely, and sending signal and receiving signal does not allow across external series gap cabling,
HW High Way short distance, cabling parallel over long distances are not allowed, differential signal strictly presses isometric cabling, controls signal lead impedance
Continuity, differential lines both sides packet ground cabling, minimize signal recirculation loop；Pass through independence respectively to the reference sent and received
Grounding point be connected in the plane in large area of PCB 301, avoid the formation of the electromagnetic radiation of loop antenna bring and train of signal
Disturb problem.
Example two
In this example, as shown in figure 4, BOSA 402 is assemblied on PCB 401 using top dress mode, and BOSA 402
Transmission pin 403 is oriented parallel to PCB 401 with reception pin 404, i.e. assembly direction of the BOSA 402 on PCB 401 is
The parallel PCB of two sides pin.Wherein, BOSA 402 can be positioned on PCB 401 by the fixation bracket of bottom surface.Adagio 405
One end is fixed on the side of BOSA 402, and the other end is coplanar with PCB 401, and is fixed on PCB 401.
In this example, 405 pre-bend of adagio forms three parts, and first part and second part are bonded BOSA 402 respectively
Two sides, BOSA 402 transmission pin 403 welding over the first portion, the reception pin 404 of BOSA 402 is welded to
On second part, Part III can be bonded the signal pad on PCB 401.
As shown in figure 4, the molding adagio 405 of pre-bending is electrically connected BOSA 402 and PCB 401.Wherein, BOSA 402
It sends pin 403 and receives pin 404 and be welded on adagio 405, signal, the signal of transmission pin 403 for receiving pin 404 are logical
The single pin on adagio 405 is crossed to be connected electrically on the corresponding signal pad of PCB 401.
In this example, it is referred to example one for the settling mode of cross-interference issue between signal, therefore is repeated no more in this.
Example three
In this example, as shown in figure 5, BOSA 502 is assemblied on PCB 501 using top dress mode, and the hair of BOSA 502
That send pin 503 is oriented parallel to PCB 501, and the direction for receiving pin 504 is upwards perpendicular to PCB 501, i.e. BOSA 502
Assembly direction on PCB 501 is unilateral pin vertical PCB upwards.Wherein, BOSA 502 can pass through the fixed branch of bottom surface
Frame positions on PCB 501.One end of adagio 505 is fixed on the top surface of BOSA 502, and the other end is coplanar with PCB 501, and solid
It is scheduled on PCB 501.
In this example, 505 pre-bend of adagio forms three parts, and first part and second part are bonded BOSA 502 respectively
Top surface and side, on the second portion, the reception pin 504 of BOSA 502 welds for the welding of transmission pin 503 of BOSA 502
Onto first part, Part III can be bonded the signal pad on PCB 501.
As shown in figure 5, the molding adagio 505 of pre-bending is electrically connected BOSA 502 and PCB 501.Wherein, BOSA 502
It sends pin 503 and receives pin 504 and be welded on adagio 505, signal, the signal of transmission pin 503 for receiving pin 504 are logical
The single pin on adagio 505 is crossed to be connected electrically on the corresponding signal pad of PCB 501.
In this example, it is referred to example one for the settling mode of cross-interference issue between signal, therefore is repeated no more in this.
Example four
In this example, as shown in fig. 6, BOSA 602 is assemblied on PCB 601 using top dress mode, and the hair of BOSA 602
That send pin 603 is oriented parallel to PCB 601, receive pin (not shown go out, positioned at the bottom surface of BOSA 602) direction be to
Under perpendicular to PCB 601, i.e., assembly direction of the BOSA 602 on PCB 601 is unilateral pin PCB downward vertically.Wherein,
BOSA 602 can be positioned on PCB 601 by the fixation bracket of bottom surface.One end of adagio 605 is fixed on the bottom of BOSA 602
Face, the other end is coplanar with PCB 601, and is fixed on PCB 601.
In this example, 605 pre-bend of adagio forms three parts, and first part and second part are bonded BOSA 602 respectively
Side and bottom surface, over the first portion, the reception pin of BOSA 602 is welded to for the welding of transmission pin 603 of BOSA 602
On two parts, Part III can be bonded the signal pad on PCB 601.
As shown in fig. 6, the molding adagio 605 of pre-bending is electrically connected BOSA 602 and PCB 601.Wherein, BOSA 602
It sends pin 603 and receives pin and be welded on adagio 605, the signal of the signal, transmission pin 603 that receive pin passes through adagio
Single pin on 605 is connected electrically on the corresponding signal pad of PCB 601.
In this example, it is referred to example one for the settling mode of cross-interference issue between signal, therefore is repeated no more in this.
Example five
In this example, as shown in fig. 7, BOSA 702 is assemblied on PCB 701 using top dress mode, and the hair of BOSA 702
That send pin 703 is oriented parallel to PCB 701, receive pin (not shown go out, positioned at the bottom surface of BOSA 702) direction be to
Under perpendicular to PCB 701, i.e., assembly direction of the BOSA 702 on PCB 701 is unilateral pin PCB downward vertically.Wherein,
BOSA 702 can be positioned on PCB 701 by the fixation bracket of bottom surface.One end of adagio 705 is fixed on the bottom of BOSA 702
Face, the other end is coplanar with PCB 701, and is fixed on PCB 701.
In this example, 705 pre-bend of adagio forms three parts, and first part and second part are bonded BOSA 702 respectively
Side and bottom surface, over the first portion, the reception pin of BOSA 702 is welded to for the welding of transmission pin 703 of BOSA 702
On two parts, Part III can be bonded the signal pad on PCB 701.
As shown in fig. 7, the difference of this example and example four shown in fig. 6 is: in this example, the pre-bending of adagio 705
Direction is different from the pre-bending direction of adagio 605 in Fig. 6, so that the position in adagio connection PCB has difference.
This other exemplary explanation is referred to example six, therefore repeats no more in this.
By above-mentioned example it is found that in practical applications, can be laid out according to PCB and assembly of the practical BOSA on PCB
Position, come design adagio how pre-bending, to adapt to the demand of different scenes.
Fig. 8 is flow chart of the optical assembly provided by the embodiments of the present application in the assembly method of panel assembly.As shown in figure 8, this
The assembly method of embodiment, comprising the following steps:
S801, optical assembly is located on PCB；
S802, optical assembly and PCB are electrically connected using the molding adagio of pre-bending, to realize at least two of optical assembly
The transmission of the electric signal in channel.
Wherein, S801 may include: to be located in optical assembly on PCB using top dress mode, wherein optical assembly is on PCB
Assembly direction include following one: unilateral pin downward vertically PCB, vertical PCB, two sides pin are parallel upwards for unilateral pin
PCB。
Wherein, optical assembly can realize the positioning on PCB by the fixation bracket of bottom surface.
Wherein, S802 may include: the side, bottom surface or top surface that one end of adagio is fixed on to optical assembly, by adagio
The other end keeps coplanar with PCB, is fixed on PCB.
Wherein, the other end of adagio is kept coplanar with PCB, is fixed on PCB, may include:
One end of the molding adagio natural torsion of pre-bending is fitted at the pad of PCB, the pin of adagio is welded to PCB
Pad on.
Wherein, before S801, the method for the present embodiment can also include:
Shaping is carried out to the pin of optical assembly, so that the solder joint on adagio goes out foot after the pin of optical assembly is welded to adagio
Length is less than or equal to length threshold (for example, 1mm).
The description that optical assembly in this present embodiment is referred to above-described embodiment in the explanation of panel assembly is closed, therefore not in this
It repeats again.
In practical applications, by taking optical assembly is BOSA as an example, BOSA producer first can carry out pre-bending molding, BOSA to adagio
After being assembled to PCB, the adagio of pre-bending and the pad of PCB are bonded naturally, meet adagio assembly, welding and electrical attachment requirements,
To simplify erection welding process, auxiliary operation is reduced, improves production efficiency, failure rate is reduced, reduces cost.
In addition, the embodiment of the present application, which also provides one kind, designs device in plate, comprising: optical assembly, an adagio and PCB；
The adagio is electrically connected optical assembly to PCB, realizes the transmission of the electric signal at least two channels of optical assembly.
Wherein, the electric signal at least two channels may include: the reception signal at least two channels；Alternatively, at least
The transmission signal in two channels；Alternatively, the transmission signal of the reception signal and at least one channel at least one channel.
Wherein, optical assembly may include following one: BOSA, the TOSA at least two channels, at least two channels ROSA.
The explanation of the optical assembly and adagio that refer to about the present embodiment is referred to the description of above-described embodiment, therefore not in this
It repeats again.
In addition, the embodiment of the present application also provides a kind of computer-readable medium, linkage editor is stored, which is located
Reason device realizes above-mentioned optical assembly the assembly method of panel assembly the step of when executing.
It will appreciated by the skilled person that whole or certain steps, system, dress in method disclosed hereinabove
Functional module or unit in setting may be implemented as software, firmware, hardware and its combination appropriate.In hardware embodiment
In, the division between functional module or unit referred in the above description not necessarily corresponds to the division of physical assemblies；For example,
One physical assemblies can have multiple functions or a function or step and can be executed by several physical assemblies cooperations.Certain
A little components or all components may be implemented as by processor, such as the software that digital signal processor or microprocessor execute, or
Person is implemented as hardware, or is implemented as integrated circuit, such as specific integrated circuit.Such software can be distributed in computer
On readable medium, computer-readable medium may include computer storage medium (or non-transitory medium) and communication media (or
Fugitive medium).As known to a person of ordinary skill in the art, term computer storage medium is included in for storing information
Implement in any method or technique of (such as computer readable instructions, data structure, program module or other data) volatile
Property and non-volatile, removable and nonremovable medium.Computer storage medium includes but is not limited to RAM, ROM, EEPROM, sudden strain of a muscle
It deposits or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storages, magnetic holder, tape, disk storage
Or other magnetic memory apparatus or any other Jie that can be used for storing desired information and can be accessed by a computer
Matter.In addition, known to a person of ordinary skill in the art be, communication media generally comprises computer readable instructions, data structure, journey
Other data in the modulated data signal of sequence module or such as carrier wave or other transmission mechanisms etc, and may include any
Information delivery media.
Although embodiment disclosed by the application is as above, the content only for ease of understanding the application and use
Embodiment is not limited to the application.Technical staff in any the application fields, is taken off not departing from the application
Under the premise of the spirit and scope of dew, any modification and variation, but the application can be carried out in the form and details of implementation
Scope of patent protection, still should be subject to the scope of the claims as defined in the appended claims.
Claims (20)
1. a kind of optical assembly is in panel assembly characterized by comprising optical assembly and an adagio；The adagio is electrically connected
The optical assembly realizes the transmission of the electric signal at least two channels of the optical assembly to printed circuit board.
2. the apparatus according to claim 1, which is characterized in that the electric signal at least two channel includes: at least
The reception signal in two channels；Alternatively, the transmission signal at least two channels；Alternatively, the reception signal at least one channel and
The transmission signal at least one channel.
3. the apparatus according to claim 1, which is characterized in that transmit the area of the electric signal in different channels on the adagio
The external series gap of the condition of satisfaction is provided between domain.
4. device according to claim 3, which is characterized in that the optical assembly includes receiving pin and transmission pin；Institute
Stating adagio includes receiving signal area and sending signal area, and the reception signal area includes receiving signal lead and reception
Reference horizontal plane of manufacturing, is used for transmission the signal for receiving pin, and the transmission signal area includes sending signal lead and hair
Reference horizontal plane of manufacturing is sent, the signal for sending pin is used for transmission；It is deposited between the reception signal area and transmission signal area
In the external series gap for meeting condition.
5. device according to claim 4, which is characterized in that the signal lead on the adagio meets claimed below: high
Velocity signal line does not allow short distance, cabling parallel over long distances, and differential signal presses isometric cabling, guarantees the continuous of signal lead impedance
Property, differential signal line packet ground cabling minimizes signal recirculation loop.
6. device according to claim 4, which is characterized in that the reception reference horizontal plane of manufacturing and transmission reference horizontal plane of manufacturing point
It is not connected in the plane in large area of the printed circuit board by independent grounding point.
7. the apparatus according to claim 1, which is characterized in that the electric signal in a channel of the optical assembly is by all the way
Pin transmission；The adagio is at at least two-way pin for connecting the optical assembly using unification design；Alternatively, the adagio exists
It connects at the pad of the printed circuit board using unification design；Alternatively, the adagio is connecting at least the two of the optical assembly
Using unification design at the pin of road, and using unification design at the pad for connecting the printed circuit board；Wherein, the pad
It is used for transmission the electric signal at least two channels.
8. the apparatus according to claim 1, which is characterized in that one end of the adagio is fixed on the side of the optical assembly
Face, bottom surface or top surface, the other end of the adagio keep coplanar with the printed circuit board, are fixed on the printed circuit board
On.
9. the apparatus according to claim 1, which is characterized in that the optical assembly is assemblied in the printing using top dress mode
On circuit board.
10. device according to claim 9, which is characterized in that assembly of the optical assembly on the printed circuit board
Direction includes following one: the unilateral pin printed circuit board, unilateral the pin vertical printed circuit upwards downward vertically
Plate, two sides the pin printed circuit board in parallel.
11. the apparatus according to claim 1, which is characterized in that after the pin of the optical assembly is welded to the adagio, institute
The solder joint protrution stated on adagio is less than or equal to length threshold.
12. the apparatus according to claim 1, which is characterized in that the optical assembly includes following one: two-way optical assembly,
At least the light emission component in two channels, at least two channels light-receiving component.
13. a kind of optical assembly is in the assembly method of panel assembly characterized by comprising
On a printed circuit board by optical assembly positioning；
The optical assembly and the printed circuit board are electrically connected using the molding adagio of pre-bending, to realize the optical assembly
At least two channels electric signal transmission.
14. according to the method for claim 13, which is characterized in that described to position optical assembly on a printed circuit board, packet
It includes:
Optical assembly is located on the printed circuit board using top dress mode, wherein the optical assembly is in the printed circuit
Assembly direction on plate includes following one: the unilateral pin printed circuit board, unilateral pin vertical institute upwards downward vertically
State printed circuit board, two sides the pin printed circuit board in parallel.
15. according to the method for claim 13, which is characterized in that described to be electrically connected using the molding adagio of pre-bending
The optical assembly and the printed circuit board, comprising:
One end of the adagio is fixed on to the side, bottom surface or top surface of the optical assembly, by the other end of the adagio and institute
It states printed circuit board and keeps coplanar, be fixed on the printed circuit board.
16. according to the method for claim 15, which is characterized in that the other end by the adagio and printing electricity
Road plate keeps coplanar, is fixed on the printed circuit board, comprising:
One end of the molding adagio natural torsion of the pre-bending is fitted at the pad of the printed circuit board, by the adagio
Pin be welded on the pad of the printed circuit board.
17. according to the method for claim 13, which is characterized in that it is described by optical assembly positioning on a printed circuit board it
Before, the method also includes:
Shaping is carried out to the pin of the optical assembly, so that after the pin of the optical assembly is welded to the adagio, the adagio
On solder joint protrution be less than or equal to length threshold.
18. a kind of design device in plate characterized by comprising
Optical assembly, an adagio and printed circuit board；The adagio is electrically connected the optical assembly to the printed circuit board,
Realize the transmission of the electric signal at least two channels of the optical assembly.
19. device according to claim 18, which is characterized in that the electric signal at least two channel include: to
The reception signal in few two channels；Alternatively, the transmission signal at least two channels；Alternatively, the reception signal at least one channel
With the transmission signal at least one channel.
20. device according to claim 18, which is characterized in that the optical assembly includes following one: two-way optical assembly,
At least the light emission component in two channels, at least two channels light-receiving component.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711030014.8A CN109729644B (en) | 2017-10-27 | 2017-10-27 | Optical component on-board device, assembling method thereof and on-board design device |
| PCT/CN2018/105299 WO2019080663A1 (en) | 2017-10-27 | 2018-09-12 | Optical component on-board device, assembly method thereof and on-board designing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711030014.8A CN109729644B (en) | 2017-10-27 | 2017-10-27 | Optical component on-board device, assembling method thereof and on-board design device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109729644A true CN109729644A (en) | 2019-05-07 |
| CN109729644B CN109729644B (en) | 2022-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711030014.8A Active CN109729644B (en) | 2017-10-27 | 2017-10-27 | Optical component on-board device, assembling method thereof and on-board design device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109729644B (en) |
| WO (1) | WO2019080663A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021027455A1 (en) * | 2019-08-09 | 2021-02-18 | 烽火通信科技股份有限公司 | Bi-directional optical sub-assembly with anti-interference performance, and bob optical module |
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| JP2007155863A (en) * | 2005-12-01 | 2007-06-21 | Sumitomo Electric Ind Ltd | Heat dissipation structure of optical transceiver |
| CN101917825A (en) * | 2010-07-26 | 2010-12-15 | 成都优博创技术有限公司 | Connecting method and connecting device of photoelectric component and main printed circuit board |
| US20120148185A1 (en) * | 2010-12-13 | 2012-06-14 | Wen-Tzung Chen | Receptacle-type bi-directional optical module and electronic apparatus thereof |
| CN203579064U (en) * | 2013-10-22 | 2014-05-07 | 江苏奥雷光电有限公司 | Receiver-transceiver optical subassembly and FPC (flexible printed circuit) board welding fixture |
| CN107277651A (en) * | 2017-05-22 | 2017-10-20 | 青岛海信宽带多媒体技术有限公司 | A kind of passive optical network equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6452327B2 (en) * | 2014-06-24 | 2019-01-16 | 日本オクラロ株式会社 | Optical module |
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2017
- 2017-10-27 CN CN201711030014.8A patent/CN109729644B/en active Active
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2018
- 2018-09-12 WO PCT/CN2018/105299 patent/WO2019080663A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007155863A (en) * | 2005-12-01 | 2007-06-21 | Sumitomo Electric Ind Ltd | Heat dissipation structure of optical transceiver |
| CN101917825A (en) * | 2010-07-26 | 2010-12-15 | 成都优博创技术有限公司 | Connecting method and connecting device of photoelectric component and main printed circuit board |
| US20120148185A1 (en) * | 2010-12-13 | 2012-06-14 | Wen-Tzung Chen | Receptacle-type bi-directional optical module and electronic apparatus thereof |
| CN203579064U (en) * | 2013-10-22 | 2014-05-07 | 江苏奥雷光电有限公司 | Receiver-transceiver optical subassembly and FPC (flexible printed circuit) board welding fixture |
| CN107277651A (en) * | 2017-05-22 | 2017-10-20 | 青岛海信宽带多媒体技术有限公司 | A kind of passive optical network equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021027455A1 (en) * | 2019-08-09 | 2021-02-18 | 烽火通信科技股份有限公司 | Bi-directional optical sub-assembly with anti-interference performance, and bob optical module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019080663A1 (en) | 2019-05-02 |
| CN109729644B (en) | 2022-04-29 |
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