CN109725392A - A kind of light emission component and light-receiving component - Google Patents
A kind of light emission component and light-receiving component Download PDFInfo
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- CN109725392A CN109725392A CN201910121030.0A CN201910121030A CN109725392A CN 109725392 A CN109725392 A CN 109725392A CN 201910121030 A CN201910121030 A CN 201910121030A CN 109725392 A CN109725392 A CN 109725392A
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Abstract
The invention belongs to optoelectronic device packaging fields, more particularly to a kind of light emission component and light-receiving component, wherein light emission component includes the first conjunction partial wave chip, first laser device array, the first lens array and the first deflecting prism, first laser device array includes N number of first laser device chip, first lens array includes N number of first lens, and the first conjunction partial wave chip includes N number of first input waveguide and 1 the first output waveguide；First laser device chip and the first lens are each attached to the first conjunction partial wave chip surface, and the first deflecting prism is located at first one end for closing partial wave chip；The light of first laser device chip emission is reflected into N number of first input waveguide through the first deflecting prism, and synthesizes and export all the way from the first output waveguide.The present invention takes full advantage of the space for closing partial wave chip surface, and light path devices are mounted on chip surface, by deflecting prism by light path folding, hence it is evident that reduces device size, while simplifying production technology, reduces Material Cost.
Description
[technical field]
The present invention relates to optoelectronic device packaging fields, and in particular to a kind of light emission component and light-receiving component.
[background technique]
Big data, cloud computing development wilderness demand, IEEE and each producer of industrial chain are produced to data Communication ray module
The MSA of composition has formulated special standard for these demands, these standards and specification cover 40G/100G/200G/400G
And the main application scenarios such as 100m, 500m, 2km, 10km.In these application scenarios, coarse wavelength division multiplexing (Coarse
Wavelength Division Multiplexer, is abbreviated as CWDM) laser close partial wave become module encapsulation main skill
In the CWDM4 application on art problem, especially 4 tunnels, the batch of either current 100G QSFP28 CWDM4/CLR4 is delivered still
The exploitation of 400GFR4/LR4 requires the CWDM4 more simplified and closes partial wave scheme.
CWDM closes scheme there are mainly two types of partial waves at present: one is being based on thin film optical filter (Thin Film
Filter is abbreviated as TFF) conjunction partial wave scheme: No. 4 lasers are collimated by respectively, and collimated light is in TFF block infolding
It returns, finally converges to together, converged in optical fiber by lens, as described in CN102684794A patent.The second is based on flat
The conjunction partial wave scheme of face optical waveguide (Planar Lightwave Circuit, be abbreviated as PLC): No. 4 lasers are respectively by lens
It focuses in PLC input waveguide, pools in PLC chip and export all the way, as described in US20130163252A1 patent.This
Two kinds of optical path schemes have all been successfully applied to 100G QSFP28 CWDM4 product, wherein the multiplex solution integration degree based on PLC
High, optical path debugging is the preferred option for improving packaging density simply.
However, PLC chip is sequentially arranged with laser in light emission component in current PLC scenario-frame, PLC core
The optical axis of piece and the luminous zone of laser are in approximately the same plane, then total device length is equal to PLC chip length (about 9mm)
In addition optical path length (about 4mm), optical path volume is larger, this is feasible for 100G encapsulation, but in same volume, design
Seem awkward in 200G, 400G product space.In addition, then laser also needs one firstly the need of being mounted on heat sink
A bigger substrate removes carrying PLC chip and laser substrate, and large substrates are usually aluminium nitride ceramics or tungsten copper material, plays support
And heat transfer effect, expensive, higher cost.Similarly, PLC chip is sequentially arranged with photodetector in light-receiving component
Then column, photodetector also need a bigger substrate to remove carrying PLC chip and photoelectricity firstly the need of being mounted on heat sink
Detector substrate equally exists the defect of larger optical path volume, complex process, higher cost.
In consideration of it, overcoming defect present in the above-mentioned prior art is the art urgent problem to be solved.
[summary of the invention]
The technical problem to be solved in the invention is:
In traditional conjunction partial wave scenario-frame, PLC chip is sequentially arranged with laser or detector, and total device length is equal to
PLC chip length adds optical path length, and optical path volume is larger；And substrate or cushion block are needed to carry PLC chip and laser
Or detector, higher cost.
The present invention reaches above-mentioned purpose by following technical solution:
In a first aspect, the present invention provides a kind of light emission component, including the first conjunction partial wave chip and it is sequentially arranged
First laser device array, the first lens array and the first deflecting prism, the first laser device array include N number of first laser device
Chip, first lens array include N number of first lens, and the first conjunction partial wave chip includes N number of first input waveguide and 1
A first output waveguide；N number of first laser device chip and N number of first lens are each attached to described first and close partial wave core
Piece surface, first deflecting prism are fixed at the described first first end for closing partial wave chip；
Wherein, N >=2；N number of first laser device chip, N number of first lens and N number of first incoming wave
It leads and is arranged in a one-to-one correspondence respectively, form N number of path channels, then the road the N light of N number of first laser device chip emission is respectively by right
It answers the first lens to converge, then is reflected into N number of first input waveguide through first deflecting prism, and synthesize all the way from institute
State the output of the first output waveguide.
Preferably, first deflecting prism is isosceles right-angle prism, including inclined-plane, the first right-angle surface and the second right angle
Face, the part on the inclined-plane are fixedly connected with the first end face of the first conjunction partial wave chip；
Wherein, by the light of first lens convergence through behind the inclined-plane, successively in first right-angle surface and described
Second right-angle surface is totally reflected, and then reflexes to the described first first end face for closing partial wave chip, and enter corresponding first
Input waveguide.
Preferably, the inclined-plane of first deflecting prism and the first reference planes form 6~8 ° of angle, and/or, it is described
First closes the angle of 6~8 ° of the first end face of partial wave chip and the first reference planes formation；Wherein, first reference planes are hung down
Directly in the chief ray of N number of first laser device chip emission.
Preferably, corresponded in the light emission component each first laser device chip be also respectively set it is first heat sink, it is described
First it is heat sink be mounted on described first and close partial wave chip surface, N number of first laser device chip is mounted on corresponding the respectively
One heat sink surface.
Preferably, the light emission component further includes the first prism bracket, and first prism bracket setting is described the
The bottom of one deflecting prism, and be fixedly connected respectively with first deflecting prism and the first conjunction partial wave chip.
Preferably, the light emission component corresponds to each first laser device chip and the first optoisolator, institute is also respectively set
It states the first optoisolator and is fixed on the first conjunction partial wave chip surface, and be located at corresponding first lens and the first turnover rib
Between mirror, or it is located between corresponding first lens and corresponding first laser device chip.
Preferably, each first laser device chip, corresponding first lens, the corresponding triangular positional relationship of first input waveguide
Meet:
Ratio of the effective focal length of each first lens at a distance from corresponding first laser device chip to object focus, equal to pair
Answer the ratio of the waveguide mould field of the first input waveguide with the laser mould field of corresponding first laser device chip；And/or
Each first input waveguide is located at the image space plane wave aberration minimum of corresponding first lens.
Preferably, the light emission component further includes the second conjunction partial wave chip and the second laser battle array that is sequentially arranged
Column, the second lens array and the second deflecting prism, the second laser array include M second laser chip, and described the
Two lens arrays include M the second lens, and the second conjunction partial wave chip includes M the second input waveguides and 1 second output
Waveguide；
Described second, which closes partial wave chip and described first, closes the preparation of partial wave chip on common substrate, and the M second
Chip of laser and the M the second lens are each attached to described second and close partial wave chip surface, and second deflecting prism is solid
Described second first end for closing partial wave chip is set calmly；
Wherein, M >=2；The M second laser chip, the M the second lens and the M the second incoming waves
It leads and is arranged in a one-to-one correspondence respectively, form M path channels, then the road the M light of the M second laser chip emission is respectively by right
It answers the second lens to converge, then is reflected into the M the second input waveguides through second deflecting prism, and synthesize all the way from institute
State the output of the second output waveguide.
Preferably, the first conjunction partial wave chip and the second conjunction partial wave chip are AWG chip, and substrate material is adopted
Use silicon.
Second aspect, the present invention also provides a kind of light-receiving components, including third to close partial wave chip and be sequentially arranged
The first PD array, the third lens array and third deflecting prism, the first PD array includes Z the first PD chips, described
The third lens array includes Z the third lens, and it includes that 1 third input waveguide and Z third are defeated that the third, which closes partial wave chip,
Waveguide out；The Z the first PD chips and the Z the third lens are each attached to the third and close partial wave chip surface, described
Third deflecting prism is fixed at the first end that the third closes partial wave chip；
Wherein, Z >=2；The Z third output waveguide, the Z the third lens and the Z the first PD chip point
It is not arranged in a one-to-one correspondence, forms Z path channels, then after light enters the third input waveguide, be divided into the road Z light respectively from institute
Z third output waveguide output is stated, then reflexes to corresponding the third lens through the third deflecting prism, it is finally described respectively
Z the first PD chips receive.
The beneficial effects of the present invention are:
The present invention carries out conjunction partial wave using partial wave chip is closed, and takes full advantage of the space for closing partial wave chip surface, will be main
Light path devices, which are mounted on, closes partial wave chip surface, by the lesser deflecting prism of size by one-dimensional light path folding at two-dimentional optical path；
It is arranged according to conventional light path, device length, which is equal to, closes partial wave chip length plus optical path length, and device length of the present invention is equal to
It closes partial wave chip length and adds deflecting prism thickness, hence it is evident that reduce device size；Various ceramic cushion blocks, letter are also reduced simultaneously
Change production technology, reduces Material Cost.
[Detailed description of the invention]
In order to illustrate the technical solution of the embodiments of the present invention more clearly, will make below to required in the embodiment of the present invention
Attached drawing is briefly described.It should be evident that drawings described below is only some embodiments of the present invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is a kind of structural schematic diagram of four-way light emission component provided in an embodiment of the present invention；
Fig. 2 is the light path schematic diagram in a kind of light emission component provided in an embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram of the light emission component equipped with optoisolator provided in an embodiment of the present invention；
Fig. 4 is the planar structure schematic diagram of AWG chip in a kind of four-way light emission component provided in an embodiment of the present invention；
Fig. 5 is a kind of structural schematic diagram of eight channel light emission component provided in an embodiment of the present invention；
Fig. 6 is the planar structure schematic diagram of AWG chip in a kind of eight channel light emission component provided in an embodiment of the present invention；
Fig. 7 is the structural schematic diagram of another eight channel light emission component provided in an embodiment of the present invention；
Fig. 8 is a kind of structural schematic diagram of four-way light-receiving component provided in an embodiment of the present invention；
Fig. 9 is a kind of side view floor map of light-receiving component provided in an embodiment of the present invention；
Figure 10 is a kind of structural schematic diagram of eight channels light-receiving component provided in an embodiment of the present invention；
Figure 11 is a kind of structural schematic diagram of optical transceiver module provided in an embodiment of the present invention；
Figure 12 is the planar structure schematic diagram of AWG chip in a kind of optical transceiver module provided in an embodiment of the present invention；
Wherein, appended drawing reference is as follows:
First conjunction partial wave chip 1, first laser device chip 2, the first lens 3, the first deflecting prism 4, first heat sink 5, the
One prism bracket 6, the first optoisolator 7, the first input waveguide 11, the first output waveguide 12；
Second closes partial wave chip 1 ', and second laser chip 2 ', the second lens 3 ', the second deflecting prism 4 ', second is heat sink
5 ', the second prism bracket 6 ', the second optoisolator 7 ', the second input waveguide 11 ', the second output waveguide 12 '；
Third closes partial wave chip 10, the first PD chip 20, the third lens 30, third deflecting prism 40, the first reflecting prism
50, third prism bracket 60, the first TIA chip 70, third input waveguide 101, third output waveguide 102；
4th closes partial wave chip 10 ', the 2nd PD chip 20 ', the 4th lens 30 ', the 4th deflecting prism 40 ', the second reflection
Prism 50 ', the 4th prism bracket 60 ', the 2nd TIA chip 70 ', the 4th input waveguide 101 ', the 4th output waveguide 102 '.
[specific embodiment]
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
In the description of the present invention, term "inner", "outside", " longitudinal direction ", " transverse direction ", "upper", "lower", "top", "bottom",
The orientation or positional relationship of the instructions such as "left", "right", "front", "rear" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the present invention rather than require the present invention that must be constructed and operated in a specific orientation, therefore be not construed as
Limitation of the present invention.
In various embodiments of the present invention, symbol "/" indicate simultaneously tool there are two types of function meaning, and for symbol " A with/
Or B " then shows that the combination between the front and back object connected by the symbol includes " A ", " B ", " A and B " three kinds of situations.
In addition, as long as technical characteristic involved in the various embodiments of the present invention described below is each other not
Constituting conflict can be combined with each other.Just with reference to drawings and examples, in conjunction with coming, the present invention will be described in detail below.
Embodiment 1:
The embodiment of the invention provides a kind of light emission component, the transmitting that can be used for optical module in wavelength-division multiplex system is photosynthetic
Wave.(scheme as shown in Figure 1, light emission component provided in an embodiment of the present invention closes partial wave chip 1 and be sequentially arranged including first
In set gradually from left to right) first laser device array, the first lens array and the first deflecting prism 4.The first laser
Device array is made of N number of first laser device chip 2 of parallel arranged, and first lens array is by N number of the first of parallel arranged
Lens 3 form, and described first, which closes partial wave chip 1, is equipped with N number of the first output waveguide of first input waveguide 11 and 1 12；It is described N number of
First laser device chip 2 and N number of first lens 3, which mount, is fixed on first conjunction, 1 surface of partial wave chip, and described first
Deflecting prism 4 is fixed at the described first first end (i.e. right end in figure) for closing partial wave chip 1.
Wherein, N >=2, N number of first laser device chip 2, N number of first lens 3 and N number of first input
Waveguide 11 is arranged in a one-to-one correspondence respectively, to form parallel N number of path channels.The light emission component combined with Figure 1 and Figure 2,
Light channel structure specifically: N number of first laser device chip 2 launches the road N light, respectively by corresponding first lens 3 converge
First deflecting prism 4 is reached after poly-, reflexes to the first of the first conjunction partial wave chip 1 through first deflecting prism 4
End face (i.e. right side in figure) to respectively enter N number of first input waveguide 11, and synthesizes all the way from first output
Waveguide 12 exports.
It should be noted that the launch wavelength of N number of first laser device chip is usual in photoemissive multiplex scheme
It is different, i.e., described N number of first laser device chip has certain difference, not fully identical such as shown in Fig. 1 light hair
It penetrates in component, N value is 4, then 4 first laser device chips exist different, emits the optical signal of different wave length respectively；Certainly,
In practical applications, according to different application scenarios and demand, the launch wavelength of N number of first laser device chip is also possible to
It is identical, it is not limited here.Further, N number of first lens can be identical structure, can also be according to wavelength
Different or actual demand is customized, it is not limited here.
Using partial wave chip progress multiplex is closed in above-mentioned light emission component provided in an embodiment of the present invention, conjunction is taken full advantage of
Main light path devices are mounted on and close partial wave chip surface by the space of partial wave chip surface, by deflecting prism by one-dimensional optical path
It is folded into two-dimentional optical path, thus by main light path folding to conjunction partial wave chip end face.It is arranged according to conventional light path, device length etc.
Lens image distance (about 4mm) is added in closing partial wave chip length, and device length of the present invention is equal to conjunction partial wave chip length and adds
Upper deflecting prism thickness (about 1mm), hence it is evident that reduce device size.Various ceramic cushion blocks are also reduced simultaneously, simplify production
Technique reduces Material Cost.
In embodiments of the present invention, description is unfolded by taking N=4 as an example, provides a kind of light emission component of four-way, can use
The photosynthetic wave of transmitting in CWDM4.As shown in Figure 1, described first closes partial wave chip 1 as 4 × 1 multiplex, closes and divide described first
1 surface of wave chip mounts four first laser device chips 2 and corresponding four the first lens 3 respectively, forms four road optical channels；
The first deflecting prism 4 is fixedly installed in the right end that described first closes partial wave chip 1.Therefore, from 4 first laser device chips 2 to
Respectively after the convergence of corresponding first lens 3, first deflecting prism 4 reflection, light occurs the four road light that the right side is launched
180 ° of turnovers, four road light are coupled into described first 4 the first input waveguides 11 for closing partial wave chip 1 respectively, then synthesize
It is exported all the way from first output waveguide 12.With reference to the accompanying drawing, Each part is specifically introduced:
In conjunction with Fig. 1, in embodiments of the present invention, the light emission component, which corresponds to each first laser device chip 2, can also divide
Not She Zhi first heat sink 5, that is, be arranged four it is first heat sink, described first heat sink 5, which is mounted on described first, closes 1 table of partial wave chip
Face, the first laser device chip 2 are mounted on corresponding first heat sink 5 surface.By setting corresponding first heat sink 5, can incite somebody to action
The amount of heat that the first laser device chip 2 generates when working dissipates, and avoids device temperature excessively high and damages.
Light to emit the first laser device chip 2 reaches the first conjunction partial wave chip 1 after completing turnover, will
One-dimensional light path folding is designed as isosceles right-angle prism at two-dimentional optical path, first deflecting prism 4.As shown in Figure 1-Figure 3, described
Isosceles right-angle prism includes inclined-plane (i.e. left side in Fig. 2), the first right-angle surface (i.e. upper right end face in Fig. 2) and the second right-angle surface
The first end face of (i.e. right lower end surface in Fig. 2), the lower portion on the inclined-plane and the first conjunction partial wave chip 1 is (right i.e. in figure
End face, alternatively referred to as polished end faces) it is fixedly connected, the inclined-plane is oppositely arranged with the first laser device chip 2.Therefore, by
The light that first lens 3 converge successively occurs in first right-angle surface and second right-angle surface through behind the inclined-plane
Total reflection makes light that turnover occur and reflexes to the described first right side for closing partial wave chip 1, and enters corresponding first incoming wave
Lead 11.
Further, the light to avoid the first laser device chip 2 from emitting passes through first deflecting prism 4 or institute
When stating the first conjunction partial wave chip 1, corresponding reflection light is caused along backtracking to the first laser device chip 2 to laser
The interference of chip, the present embodiment are arranged as follows:
The inclined-plane of first deflecting prism 4 and the first reference planes form 6~8 ° of angle, and/or, described first closes
The right side of partial wave chip 1 and the first reference planes form 6~8 ° of angle.Wherein, first reference planes are perpendicular to institute
State the chief ray of the transmitting of first laser device chip 2.By taking Fig. 2 as an example, described first closes partial wave chip 1 and the first laser device
When chip 2 is horizontal positioned, the chief ray that the first laser device chip 2 is emitted is horizontal direction, then first reference
Plane is vertical direction；Therefore, the inclined-plane of first deflecting prism 4 is with a vertical 6~8 °, and/or, described first closes
The right side of partial wave chip 1 is with a vertical 6~8 °, then reflection light will not be reduced along backtracking to laser core
The damage of piece.
Wherein, since the first conjunction partial wave chip 1 is relatively thin, between right side and the inclined-plane of first deflecting prism 4
Bond area very little.In order to increase adhesive effect, the first prism bracket 6 can be also additionally set, first prism bracket 6 is set
It sets in the bottom of first deflecting prism 4, and then first deflecting prism 4 is held.As shown in Fig. 2, first rib
The upper surface of mirror support 6 is bonded and bonds together with the second right-angle surface of first deflecting prism 4, the first prism branch
The left side of frame 6 is bonded and bonds together with the right side of the first conjunction partial wave chip 1, and does not influence first turnover
The total reflection effect of prism 4.
Other than angle setting above, to avoid reflection light along backtracking to the first laser device chip 2
Cause chip of laser to damage, the light emission component can also correspond to each first laser device chip 2 be respectively set the first light every
From device 7, that is, four the first optoisolators are set.As shown in figure 3, first optoisolator 7, which is fixed on described first, closes partial wave
1 surface of chip, and be located between corresponding first lens 3 and first deflecting prism 4.Therefore, by first deflecting prism 4
The light being reflected back is isolated by first optoisolator 7, cannot continue reverse transfer, so that the first laser will not be reached
Device chip 2.Certainly, first optoisolator 7 can also be provided at corresponding first lens 3 and corresponding first laser device chip 2 it
Between, then reflection light is isolated after first lens 3 by first optoisolator 7, reverse transfer cannot be continued, thus
The first laser device chip 2 will not be reached.
In order to form good coupling optical path, the first laser device chip 2, corresponding first lens 3, corresponding first input
Certain positional relationship is also needed to meet between 11 three of waveguide:
Condition a, the effective focal length of each first lens 3 and corresponding first laser device chip 2 to the ratio at a distance from object focus
Value, at or about waveguide mould field and the laser mould field of corresponding first laser device chip 2 of corresponding first input waveguide 11
Ratio；And/or
Condition b, each first input waveguide 11 are located at the image space plane wave aberration minimum of corresponding first lens 3 or at minimum
Near.
Wherein, condition a ensure that laser hot spot after lens transformation with wave guide mode spot pattern match；Condition b ensure that
Laser hot spot after lens transformation with wave guide mode spot phase matched；When mode and phase matched, could obtain as big as possible
Coupling efficiency.
Further combined with Fig. 4, array waveguide grating (Arrayed Waveguide is can be used in the first conjunction partial wave chip 1
Grating is abbreviated as AWG) chip, 4 the first input waveguides 11 of AWG chip are located at right end, 1 the first output waveguide 12
In left end, middle section is Waveguide array.For the heat dissipation effect for increasing chip of laser, the substrate material of AWG chip is preferable
Using silicon；The thermal conductivity coefficient of silicon can make laser by AWG chip big chip size and heat dissipation area for 140W/ (mK)
The heat that chip generates promptly is dissipated away by silicon substrate, reaches preferable heat dissipation effect.In addition, in the alternative,
The first conjunction partial wave chip 1 can also be diffraction etched diffraction grating (Etched Diffraction Grating, be abbreviated as EDG)
Chip or the cascade chip of more MZI, said chip may be implemented AWG chip and similarly close partial wave function.
In a specific embodiment, the launch wavelength of four first laser device chips 2 be respectively 1270nm,
1290nm, 1310nm, 1330nm, specific optical path configuration are as follows: laser numerical aperture is 0.5, and waveguide numerical aperture is
0.1；Lens are the non-globe lens of biconvex, and are 0.745mm close to the radius of curvature of chip of laser side, close to deflecting prism one
The radius of curvature of side is -0.482；Chip of laser is apart from convex lens surface vertex 0.25mm, 80% or more optimistic coupling efficiency.If
Folding optical path is not used, and device length will increase about 2mm.It should be noted that the parameters setting provided in the present embodiment
By way of example only, it can be selected and be designed with application scenarios according to different needs in practical applications, not limited herein
It is fixed.
Embodiment 2:
On the basis of above-described embodiment 1, the embodiment of the invention also provides another light emission components, can be used for wavelength-division
The photosynthetic wave of the transmitting of optical module in multiplex system.As shown in figure 5 and figure 7, difference from example 1 is that, in embodiment 1
Second laser array, the second lens array adding the second conjunction partial wave chip 1 ' on the basis of corresponding Fig. 1 and being sequentially arranged
Column and the second deflecting prism 4 '.The second laser array is made of M second laser chip 2 ' of parallel arranged, described
Second lens array is made of M the second lens 3 ' of parallel arranged, and the second conjunction partial wave chip 1 ' includes M second input
Waveguide 11 ' and 1 the second output waveguide 12 '.Described second, which closes partial wave chip 1 ' and described first, closes the preparation of partial wave chip 1 altogether
On same substrate, the M second laser chip 2 ' and the M the second lens 3 ' mount to be fixed on described second and close and divide
1 ' surface of wave chip, second deflecting prism 4 ' are fixed at described second one end for closing partial wave chip 1 '.
Wherein, M >=2, the M second laser chip 2 ', the M the second lens 3 ' and the M a second are defeated
Enter waveguide 11 ' to be arranged in a one-to-one correspondence respectively, to form M parallel path channels.Corresponding light channel structure specifically: described
M second laser chip 2 ' launches the road M light, reaches second turnover after the convergence of corresponding second lens 3 ' respectively
Prism 4 ' reflexes to the described second end face for closing partial wave chip 1 ' through second deflecting prism 4 ', to respectively enter the M
A second input waveguide 11 ', and synthesize and exported all the way from second output waveguide 12 '.
In practical applications, the value of M and N can be the same or different, and can be configured according to actual needs, herein
Without limitation.N number of first laser device chip is still formed N number of path channels (reference implementation example 1), and the M second is swashed
Light device chip forms M path channels, therefore forms M+N path channels in total, compared to Figure 1, is increasing less chip ruler
In the case where very little, port number is expanded, to improve encapsulation rate densities.
Wherein, the design comparison of the first conjunction partial wave chip 1 and the second conjunction partial wave chip 1 ' is flexible, as long as two
Chip is not present location conflicts, and input end face and output end face can there are many positions to setting, and specific position is depended on to setting
The setting of the optical electrical interface of optical module.For example, two chips can be backwards to being arranged, specifically as shown in figure 5, described first closes
The right side of partial wave chip 1 and the left side of the second conjunction partial wave chip 1 ' are disposed opposite to each other, and described first closes partial wave chip 1
Left side is overlapped with the right side of the second conjunction partial wave chip 1 ', at this time the transmitting light of the second laser chip 2 ' and institute
The transmitting light direction of first laser device chip 2 is stated on the contrary, then the first laser device array and the second laser array pair
The optical path answered is symmetrical on direction.For another example two chips can also be setting in the same direction for convenient for encapsulation, it is specific such as Fig. 7
Shown, described first, which closes partial wave chip 1 and described second, closes 1 ' arranged in parallel of partial wave chip, at this time the second laser chip
2 ' transmitting light is consistent with the transmitting light direction of the first laser device chip 2.
By taking the corresponding structure of Fig. 5 as an example, specifically it is unfolded to describe with M=4, N=4, provides a kind of light emitting in eight channels
Component.As shown in figure 5, the second conjunction partial wave chip 1 ' is also 4 × 1 multiplex, the preparation of partial wave chip 1 is closed altogether with described first
On same substrate, and bilateral symmetry.Four second laser chips 2 ' are mounted respectively on second conjunction, 1 ' surface of partial wave chip
And corresponding four the second lens 3 ', four road optical channels are formed, described second closes the left end fixed setting second of partial wave chip 1 '
Deflecting prism 4 '.Therefore, pass through corresponding second lens respectively by the four road light that 4 second laser chips 2 ' are launched to the left
After 3 ' convergences, second deflecting prism 4 ' reflection, 180 ° of turnovers occur for light, and four road light are coupled into described second respectively
4 the second input waveguides 11 ' for closing partial wave chip 1 ' are then synthesized and are exported all the way from second output waveguide 12 '.Wherein,
The respective optical path structure of four first laser device chips 2 can refer to embodiment 1, and details are not described herein again.
For right half part in Fig. 5, i.e., described first closes partial wave chip 1, first laser device chip 2, the first lens 3, the
One deflecting prism 4, first heat sink 5, the first prism bracket 6, the first input waveguide 11 and the first output waveguide 12, can specifically join
The associated description in embodiment 1 is examined, details are not described herein again.And left-half is equivalent to the symmetrical structure of right half part, specifically such as
Under:
In conjunction with Fig. 5, the light emission component corresponds to each second laser chip 2 ' and is also respectively set second heat sink 5 ', i.e.,
Setting four is second heat sink, and described second heat sink 5 ', which is mounted on described second, closes 1 ' surface of partial wave chip, the second laser
Chip 2 ' is mounted on corresponding second heat sink 5 ' surface, and then realizes effectively heat dissipation, avoids device temperature excessively high and damages.
To realize that light path folding, the 4 ' same design of the second deflecting prism are isosceles right-angle prism, including inclined-plane and two
A right-angle surface, the lower portion on inclined-plane are bonded and bond together with the left side of the second conjunction partial wave chip 1 ', inclined-plane
Top part it is opposite with the second laser chip 2 '.Therefore, continued by the light of second lens 3 ' convergence saturating to the left
It after crossing inclined-plane, is successively totally reflected in two right-angle surfaces, makes light that turnover occur and reflex to the second conjunction partial wave chip 1 '
Left side, and enter corresponding second input waveguide 11 '.
Further, to avoid reflection light from causing along backtracking to the second laser chip 2 ' to laser core
The interference of piece, the inclined-plane of second deflecting prism 4 ' and the first reference planes form 6~8 ° of angle, and/or, described second
The left side and the first reference planes of closing partial wave chip 1 ' form 6~8 ° of angle；Wherein, second reference planes perpendicular to
The chief ray that the second laser chip 2 ' emits.When the second conjunction partial wave chip 1 ' and the second laser chip
2 ' when being horizontal positioned, and the chief ray that the second laser chip 2 ' is emitted is horizontal direction, then the second turnover rib
The inclined-plane of mirror 4 ' with a vertical 6~8 °, and/or, described second close the left side of partial wave chip 1 ' with a vertical 6~
8°。
Wherein, since the second conjunction partial wave chip 1 ' is relatively thin, the inclined-plane of left side and second deflecting prism 4 '
Between bond area very little.It is also additional that second prism bracket 6 ', second prism bracket 6 ' are set in order to increase adhesive effect
Upper surface be bonded and bond together with a right-angle surface of second deflecting prism 4 ', the right side of second prism bracket 6 '
End face is bonded and bonds together with the left side of the second conjunction partial wave chip 1 ', and does not influence second deflecting prism 4 '
Total reflection effect.
With further reference to Fig. 6, when two conjunction partial wave chips are arranged backwards, the second conjunction partial wave chip 1 ' is also used
AWG chip, 4 the second input waveguides 11 ' are located at left end, and 1 the second output waveguide 12 ' is located at right end, and middle section is battle array
Train wave is led.Silicon is preferably used in substrate, so that the heat for generating chip of laser is promptly dissipated away by silicon substrate.This
Outside, in the alternative, the second conjunction partial wave chip 1 ' can also be EDG chip or the cascade chip of more MZI, above-mentioned
Chip may be implemented AWG chip and similarly close partial wave function.
In addition to angle setting, to avoid reflection light that chip of laser is caused to damage, the light emission component can also be right
It answers each second laser chip 2 ' that the second optoisolator 7 ' is respectively set, that is, four the second optoisolators 7 ' is set, such as Fig. 7 institute
Show, second optoisolator 7 ' is fixed on described second and closes 1 ' surface of partial wave chip, and is located at corresponding second lens 3 ' and institute
It states between the second deflecting prism 4 ', or is located between corresponding second lens 3 ' and corresponding second laser chip 2 ', make to reflect
Light is isolated by second optoisolator 7 ' and can not reach the second laser chip 2 '.
In conjunction with Fig. 5 and Fig. 7 it is found that in embodiments of the present invention, being equivalent to eight groups of chip of laser, heat sink, lens are divided into
Tetra- tunnel Liang Ge, by respective AWG chip multiplex after corresponding deflecting prism (4 or 4 ') reflection, and from respective output waveguide
(12 or 12 ') output.Compared with Example 1, in the case where increasing less chip size, port number expansion is twice, thus
Greatly improve encapsulation rate densities.
Embodiment 3:
The embodiment of the invention provides a kind of light-receiving components, and using photodiode, (photo diode, is abbreviated as
PD) chip, the light partial wave that can be used for optical module in wavelength-division multiplex system receive.As shown in figure 8, light provided in an embodiment of the present invention
Receiving unit include third close partial wave chip 10 and be sequentially arranged and (set gradually from right to left in figure) the first PD array,
The third lens array and third deflecting prism 40.The first PD array is made of Z the first PD chips 20 of parallel arranged, institute
It states the third lens array to be made of the Z the third lens 30 of parallel arranged, it is defeated equipped with 1 third that the third closes partial wave chip 10
Enter waveguide 101 and Z third output waveguide 102；The Z the first PD chips 20 and the Z the third lens 30 mount solid
It is scheduled on the third and closes 10 surface of partial wave chip, the third deflecting prism 40 is fixed at the third and closes partial wave chip 10
First end (i.e. right end in Fig. 8).
Wherein, Z >=2, the Z the first PD chips 20, the Z the third lens 30 and the Z third output wave
Lead 102 to be arranged in a one-to-one correspondence respectively, form Z path channels, the then light channel structure of the light-receiving component specifically: light into
After entering the third input waveguide 101 that the third closes partial wave chip 10, it is divided into the road Z light respectively from the Z third output waveguide
102 outputs, then corresponding the third lens 30 are reflexed to through the third deflecting prism 40, finally respectively by the Z the first PD
Chip 20 receives.
It should be noted that the Z the first PD chips can be respectively used to receive the optical signal of different wave length, such as scheming
In light-receiving component shown in 8, Z value is 4, then 4 the first PD chips receive the optical signal of different wave length respectively；Certainly, exist
In practical application, according to different application scenarios and demand, the Z the first PD chips also can receive the light letter of phase co-wavelength
Number, it is not limited here.Further, the Z the third lens can be identical structure, can also be according to the difference of wavelength
Or actual demand is customized, it is not limited here.
Using partial wave chip progress partial wave is closed in above-mentioned light emission component provided in an embodiment of the present invention, conjunction is taken full advantage of
Main light path devices are mounted on and close partial wave chip surface by the space of partial wave chip surface, by deflecting prism by one-dimensional optical path
It is folded into two-dimentional optical path.It is arranged according to conventional light path, device length, which is equal to, closes partial wave chip length and add optical path length, and this hair
Bright device length, which is equal to, closes partial wave chip length plus deflecting prism thickness, hence it is evident that reduces device size.It also reduces simultaneously
Various ceramics cushion blocks, simplify production technology, reduce Material Cost.
In embodiments of the present invention, description is unfolded by taking Z=4 as an example, provides a kind of light-receiving component of four-way, can use
Light partial wave in CWDM4 receives.As shown in figure 8, it is 1 × 4 partial wave that the third, which closes partial wave chip 10, closes and divide in the third
10 surface of wave chip mounts four the first PD chips 20 and corresponding four the third lens 30 respectively, forms four road optical channels；
Third deflecting prism 40 is fixedly installed in the right end that the third closes partial wave chip 10.With reference to the accompanying drawing, to Each part
It is specifically introduced:
In conjunction with Fig. 8 and Fig. 9, in embodiments of the present invention, due to the photosurface of the first PD chip 20 be upward, because
This needs the first reflecting prism 50 of setting to realize light-receiving also, and the attachment of the first reflecting prism 50 is fixed on the third and closes
10 surface of partial wave chip, and between the first PD array and the third lens array.First reflecting prism 50
Equipped with an inclined-plane, which is located above the photosurface of the first PD chip 20, and is between the inclined-plane and the photosurface
45° angle.In addition, (left side i.e. in figure) is additionally provided with the first TIA after the first PD array for the amplification for realizing electric signal
(i.e. trans-impedance amplifier, Trans-ImpedanceAmplifier) chip 70.Therefore, by Fig. 8 and Fig. 9 it is found that the four-way
The optical path of light-receiving component specifically: after light enters the third input waveguide 101 that the third closes partial wave chip 10, be divided into four
Road light is exported from corresponding third output waveguide 102 respectively, and light occurs 180 ° turns after the third deflecting prism 40 reflection
Folding, four road light reflex to corresponding the third lens 30 respectively, and light occurs after the slant reflection of first reflecting prism 50
90 ° of turnovers, are received by the photosurface of 4 the first PD chips 20 respectively, and complete signal amplification through the first TIA chip 70.
It completes to reach the first PD chip 20 after turnover to make the third close the light that partial wave chip 10 exports, described the
Three deflecting prisms 40 may be designed as isosceles right-angle prism.As shown in figure 8, the isosceles right-angle prism includes inclined-plane and two right angles
(i.e. right side in figure, alternatively referred to as throws the first end face of face, the lower portion on the inclined-plane and third conjunction partial wave chip 10
Light end face) it is fixedly connected, the top part on the inclined-plane is opposite with the first PD chip 20.Therefore, it is exported by the third
The light that waveguide 102 exports successively reaches corresponding the third lens 30 after two right-angle surfaces are totally reflected through behind inclined-plane.
Further, to avoid the reflection light of 102 output light of third output waveguide along backtracking, the present embodiment
It is arranged as follows: the angle on 6~8 ° of the inclined-plane of the third deflecting prism 40 and the first reference planes formation, and/or, it is described
Third closes the right side of partial wave chip 10 and the angle of 6~8 ° of the first reference planes formation.Wherein, first reference planes are hung down
The direction of chief ray is directly received in the first PD chip 20.
Wherein, since third conjunction partial wave chip 10 is relatively thin, the inclined-plane of right side and the third deflecting prism 40
Between bond area very little.In order to increase adhesive effect, third prism bracket 60, the third prism bracket can be also additionally set
60 are arranged in the bottom of the third deflecting prism 40, and then the third deflecting prism 40 is held.As shown in Figure 8 and Figure 9,
The upper surface of the third prism bracket 60 is bonded and bonds together with the right-angle surface of the third deflecting prism 40 on the lower, institute
The left side for stating third prism bracket 60 is bonded and bonds together with the right side that the third closes partial wave chip 10, and not shadow
Ring the total reflection effect of the third deflecting prism 40.
Further, the third, which closes partial wave chip 10, can be used AWG chip, and the substrate material of AWG chip is preferably adopted
With silicon, the heat that PD detection chip and TIA chip can be made to generate promptly is dissipated away by silicon substrate, reaches preferable heat dissipation
Effect.In addition, in the alternative, the third, which closes partial wave chip 10, can also be EDG chip or the cascade core of more MZI
Piece, said chip may be implemented AWG chip and similarly close partial wave function.
Embodiment 4:
On the basis of above-described embodiment 3, the embodiment of the invention also provides another light-receiving component, it can be achieved that increasing
Port number is expanded in the case where less chip size, so that encapsulation rate densities are improved, specific setting method and 2 class of embodiment
Seemingly.As shown in Figure 10, with embodiment 3 the difference is that, add the 4th conjunction partial wave chip 10 ' and be sequentially arranged second
TIA chip 70 ', the 2nd PD array, the second reflecting prism 50 ', the 4th lens array and the 4th deflecting prism 40 '.Described second
PD array is made of Y the 2nd PD chips 20 ' of parallel arranged, and the 4th lens array is saturating by the Y a 4th of parallel arranged
Mirror 30 ' forms, and the described 4th, which closes partial wave chip 10 ', includes 1 the 4th input waveguide 101 ' and Y the 4th output waveguides 102 '.
Described 4th closes partial wave chip 10 ' and the third conjunction preparation of partial wave chip 10 on common substrate；The Y the 2nd PD cores
Piece 20 ' and the Y the 4th lens 30 ', which mount, is fixed on the 4th conjunction 10 ' surface of partial wave chip, the 4th turnover rib
Mirror 40 ' is fixed at the described 4th one end (i.e. right end in Figure 10) for closing partial wave chip 10 '.
Wherein, Y >=2, the Y the 2nd PD chips 20 ', the Y the 4th lens 30 ' and the Y the 4th output
Waveguide 102 ' is arranged in a one-to-one correspondence respectively, forms Y path channels.Therefore, light enters the 4th conjunction partial wave chip 10 '
After 4th input waveguide 101 ', it is divided into the road Y light and is exported respectively from corresponding 4th output waveguide 102 ', through the 4th turnover rib
180 ° of turnovers occur for light after mirror 40 ' reflects, and the road Y light reflexes to corresponding 4th lens 30 ' respectively, through the second reflection rib
90 ° of turnovers occur for light after the slant reflection of mirror 50 ', are received respectively by the photosurface of corresponding 2nd PD chip 20 ', and described in warp
2nd TIA chip 70 ' completes signal amplification.
In practical applications, the value of Y and Z can be the same or different, and can be configured according to actual needs, herein
Without limitation.The Z the first PD chips 20 are still formed Z path channels (reference implementation example 3), the Y the 2nd PD cores
Piece 20 ' forms Y path channels, Y+Z path channels is formed in total, compared with Fig. 8, the case where increasing less chip size
Under, port number is expanded, to improve encapsulation rate densities.
Wherein, the third closes partial wave chip 10 and the design comparison of the 4th conjunction partial wave chip 10 ' is flexible, as long as two
A chip is not present location conflicts, and input end face and output end face can there are many positions to setting, and specific position is depended on to setting
In the setting of the optical electrical interface of optical module.For example, two chips can be backwards to being arranged, i.e., by structure shown in Fig. 8 or so pair
Claim setting；It can also be setting in the same direction, i.e., structure shown in Fig. 8 be arranged parallel.As Y=4, Z=4, by will be shown in Fig. 8
Structure arranged in parallel setting, can make to obtain eight channel light-receiving components as shown in Figure 10, two chips are corresponding at this time
Optical path direction is consistent.
Further, AWG chip can be used in the 3rd AWG chip 10 and the 4th AWG chip 10 ', and substrate is excellent
Selection of land uses silicon, so that the heat for generating PD detection chip and TIA chip is promptly dissipated away by silicon substrate.In addition,
In optional scheme, the third closes partial wave chip 10 and the 4th AWG chip 10 ' can also be EDG chip or more MZI
Cascade chip, said chip may be implemented AWG chip and similarly close partial wave function.
In the embodiment of eight channel light-receiving components, it is equivalent to eight groups of PD chips, lens are divided into tetra- tunnel Liang Ge, two-way light
Line, by respective AWG chip partial wave, is each separated into behind four tunnels through corresponding after respective input waveguide (101 or 101 ') input
Respective lens are reached after deflecting prism (40 or 40 ') reflection, and are received by respective PD chip (20 or 20 ').With embodiment 3
Four-way compare, in the case where increasing less chip size, by port number expansion be twice, thus greatly improve encapsulation speed
Rate density.
Embodiment 5:
On the basis of embodiment 4 above-described embodiment 1-, the embodiment of the invention also provides a kind of optical transceiver modules, can be same
When for optical module in wavelength-division multiplex system light emitting multiplex and light partial wave receive.That is, entire optical assembly can be divided into
Two parts, half are used for light emitting, and specific structure and optical path can refer to embodiment 1；The other half be used for light-receiving, specific structure and
Optical path can refer to embodiment 3.
As shown in figure 11, by taking the optical transceiver module in eight channels as an example, four channels are used for light emitting, and four additional channel is used
In light-receiving.Then specific structure is as follows:
The half portion of lower right is divided into light emitting unit in figure, including first closes partial wave chip 1 and successively set from left to right
First laser device array, the first lens array and the first deflecting prism 4 set.The first laser device array is by parallel arranged
Four first laser device chips 2 form, and first lens array is made of four the first lens 3 of parallel arranged, and described the
One conjunction partial wave chip 1 is set there are four first the first output waveguide of input waveguide 11 and 1 12；Four first laser device chips
2 and four first lens 3 mount and be fixed on described first and close 1 surface of partial wave chip, first deflecting prism 4 is fixed
Described first right end for closing partial wave chip 1 is set.
Four first laser device chips 2, four first lens 3 and four first input waveguides 11 divide
It is not arranged in a one-to-one correspondence, forms four path channels, then the light channel structure of light emitting unit specifically: four first lasers
Device chip 2 launches four Lu Guang, first deflecting prism 4 is reached after the convergence of corresponding first lens 3 respectively, through described
First deflecting prism 4 reflexes to the described first right side for closing partial wave chip 1, to respectively enter four first incoming waves
11 are led, and synthesizes and is exported all the way from first output waveguide 12.
Upper left half portion is divided into light receiving unit in figure, including third is closed partial wave chip 10 and successively set from right to left
The first TIA chip 70, the first PD array, the first reflecting prism 50, the third lens array and the third deflecting prism 40 set.It is described
First PD array is made of four the first PD chips 20 of parallel arranged, and the third lens array is by four of parallel arranged
Three lens 30 composition, the third close partial wave chip 10 and are equipped with 1 third input waveguide 101 and four third output waveguides 102；
The first TIA chip 70, four the first PD chips 20, first reflecting prism 50 and four the third lens 30
Attachment is fixed on the third and closes 10 surface of partial wave chip, and the third deflecting prism 40, which is fixed at the third and closes, to be divided
The right end of wave chip 10.
Four the first PD chips 20, four the third lens 30 and four third output waveguides 102 are divided
It is not arranged in a one-to-one correspondence, forms four path channels, then the light channel structure of light receiving unit specifically: light enters the third
After the third input waveguide 101 for closing partial wave chip 10, it is divided into four road light and is exported respectively from four third output waveguides 102,
Reflex to corresponding the third lens 30 through the third deflecting prism 40 again, through first reflecting prism 50 reflection after respectively by
The Z the first PD chips 20 receive, and complete signal amplification through the first TIA chip 70.
Wherein, the first conjunction partial wave chip 1 and the third, which close partial wave chip 10, can be used AWG chip, and two
AWG chip is prepared on common substrate, as shown in figure 12, described first close the input waveguide of partial wave chip 1, output waveguide with
And the third closes the input waveguide of partial wave chip 10, output waveguide may be provided at the same end.With embodiment 1 and embodiment 3
It compares, in the case where increasing less chip size, port number is expanded, to improve encapsulation rate densities；With embodiment 2 and
Embodiment 4 is compared, while realizing light emitting and light-receiving, meets transceiver setting.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of light emission component, which is characterized in that including the first conjunction partial wave chip and the first laser device battle array being sequentially arranged
Column, the first lens array and the first deflecting prism, the first laser device array include N number of first laser device chip, and described the
One lens array includes N number of first lens, and the first conjunction partial wave chip includes N number of first input waveguide and 1 first output
Waveguide；N number of first laser device chip and N number of first lens are each attached to described first and close partial wave chip surface, institute
It states the first deflecting prism and is fixed at the described first first end for closing partial wave chip；
Wherein, N >=2；N number of first laser device chip, N number of first lens and N number of first input waveguide point
It is not arranged in a one-to-one correspondence, forms N number of path channels, then the road the N light of N number of first laser device chip emission is respectively by corresponding the
One lens convergence, then be reflected into N number of first input waveguide through first deflecting prism, and synthesize all the way from described the
The output of one output waveguide.
2. light emission component according to claim 1, which is characterized in that first deflecting prism is isosceles right-angled edge
Mirror, including inclined-plane, the first right-angle surface and the second right-angle surface, the first end that partial wave chip is closed with described first in the part on the inclined-plane
Face is fixedly connected；
Wherein, after penetrating the inclined-plane by the light of first lens convergence, successively in first right-angle surface and described second
Right-angle surface is totally reflected, and then reflexes to the described first first end face for closing partial wave chip, and enters corresponding first input
Waveguide.
3. light emission component according to claim 2, which is characterized in that the inclined-plane of first deflecting prism and the first ginseng
Examine plane and form 6~8 ° of angle, and/or, described first close the first end face of partial wave chip and the first reference planes form 6~
8 ° of angle；Wherein, chief ray of first reference planes perpendicular to N number of first laser device chip emission.
4. light emission component according to claim 1, which is characterized in that correspond to each first in the light emission component and swash
Light device chip be also respectively set it is first heat sink, described first it is heat sink be mounted on described first and close partial wave chip surface, described N number of the
One chip of laser is mounted on corresponding first heat sink surface respectively.
5. light emission component according to claim 1, which is characterized in that the light emission component further includes the first prism branch
The bottom of first deflecting prism is arranged in frame, first prism bracket, and respectively with first deflecting prism and institute
The first conjunction partial wave chip is stated to be fixedly connected.
6. light emission component according to claim 1, which is characterized in that the light emission component corresponds to each first laser
The first optoisolator is also respectively set in device chip, and first optoisolator is fixed on described first and closes partial wave chip surface, and
Between corresponding first lens and first deflecting prism, or it is located at corresponding first lens and corresponding first laser device core
Between piece.
7. light emission component according to claim 1, which is characterized in that each first laser device chip, corresponding first lens,
The corresponding triangular positional relationship of first input waveguide meets:
Ratio of the effective focal length of each first lens at a distance from corresponding first laser device chip to object focus is equal to correspondence the
The ratio of the waveguide mould field of one input waveguide and the laser mould field of corresponding first laser device chip；And/or
Each first input waveguide is located at the image space plane wave aberration minimum of corresponding first lens.
8. -7 any light emission component according to claim 1, which is characterized in that the light emission component further includes second
Second laser array, the second lens array and the second deflecting prism for closing partial wave chip and being sequentially arranged, described second swashs
Light device array includes M second laser chip, and second lens array includes M the second lens, and described second closes partial wave
Chip includes M the second input waveguides and 1 the second output waveguide；
Described second, which closes partial wave chip and described first, closes the preparation of partial wave chip on common substrate, the M second laser
Device chip and the M the second lens are each attached to described second and close partial wave chip surface, and the second deflecting prism fixation is set
Set the first end for closing partial wave chip described second；
Wherein, M >=2；The M second laser chip, the M the second lens and the M the second input waveguides point
It is not arranged in a one-to-one correspondence, forms M path channels, then the road the M light of the M second laser chip emission is respectively by correspondence the
Two lens convergence, then be reflected into the M the second input waveguides through second deflecting prism, and synthesize all the way from described the
The output of two output waveguides.
9. light emission component according to claim 8, which is characterized in that described first, which closes partial wave chip and described second, closes
Partial wave chip is AWG chip, and substrate material uses silicon.
10. a kind of light-receiving component, which is characterized in that including third close partial wave chip and be sequentially arranged the first PD array,
The third lens array and third deflecting prism, the first PD array include Z the first PD chips, the third lens array packet
Z the third lens are included, it includes 1 third input waveguide and Z third output waveguide that the third, which closes partial wave chip,；The Z
First PD chip and the Z the third lens are each attached to the third and close partial wave chip surface, and the third deflecting prism is solid
The first end that the third closes partial wave chip is set calmly；
Wherein, Z >=2；The Z third output waveguide, the Z the third lens and the Z the first PD chip difference one
One is correspondingly arranged, and forms Z path channels, then after light enters the third input waveguide, is divided into the road Z light respectively from the Z
A third output waveguide output, then corresponding the third lens are reflexed to through the third deflecting prism, finally respectively by the Z
First PD chip receives.
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| CN115211057B (en) * | 2020-03-13 | 2024-03-26 | 华为技术有限公司 | Light receiving module and light module |
| CN113437635A (en) * | 2020-03-23 | 2021-09-24 | 青岛海信激光显示股份有限公司 | Laser device |
| CN112817102A (en) * | 2021-01-04 | 2021-05-18 | 武汉光迅科技股份有限公司 | Optical module and preparation method thereof |
| CN113376751A (en) * | 2021-07-05 | 2021-09-10 | 武汉联特科技股份有限公司 | Multichannel parallel optical assembly |
| WO2023124120A1 (en) * | 2021-12-30 | 2023-07-06 | 苏州旭创科技有限公司 | Optical module |
| CN114815089B (en) * | 2022-04-18 | 2023-10-24 | 东莞立讯技术有限公司 | Optical module |
| CN114815089A (en) * | 2022-04-18 | 2022-07-29 | 东莞立讯技术有限公司 | Optical module |
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