CN109725387A - A kind of high-power fiber bundling device suitable under hot vacuum environment - Google Patents
A kind of high-power fiber bundling device suitable under hot vacuum environment Download PDFInfo
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- CN109725387A CN109725387A CN201910139741.0A CN201910139741A CN109725387A CN 109725387 A CN109725387 A CN 109725387A CN 201910139741 A CN201910139741 A CN 201910139741A CN 109725387 A CN109725387 A CN 109725387A
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- heat
- bundling device
- optical
- fiber bundling
- vacuum environment
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Abstract
The invention discloses a kind of high-power fiber bundling devices suitable under hot vacuum environment, including heat-sink shell, micro- metal ball, input optical fibre, heat-conducting medium, packaging cartridge and output optical fibre etc..The input optical fibre connects to form the connector with cone area by way of fused biconical taper with output optical fibre, the connector is placed in packaging cartridge, the inner circumferential of packaging cartridge is provided with heat-sink shell, and heat-conducting medium, tightly packed micro- metal ball between heat-sink shell and heat-conducting medium is arranged in cone area periphery.Under hot vacuum environment, after inputting high power pump laser, cone area easily generates heat accumulation effect.By disposing heat-conducting medium outside cone area, micro- metal ball is filled in outside, and heat sink layer, packaging cartridge are thermally conductive, to maintain optical-fiber bundling device normal working temperature.Present invention can ensure that the work of optical-fiber bundling device normal table under hot vacuum environment, have many advantages, such as to enhance that optical-fiber bundling device plasticity, encapsulating structure be simple, thermally conductive efficient uniform.
Description
Technical field
The present invention relates to field of optoelectronic devices, and heat transfer technology is especially applied to optical-fiber bundling device.It can be applied to heat
Under vacuum environment, the fields such as space optical communication, space exploration, aerospace.Compared to traditional fiber bundling device, solves thermal vacuum
The problem of localized heat buildup causes device to burn under environment.
Background technique
Optical-fiber bundling device is also known as power beam combiner, is generally made by multifiber beam by fused biconical taper method, mainly
Function be realize coupling pump light, be one of high-capacity optical fiber laser and the core devices of high power EDFA.Swashed by optical fiber
Light device issues pump light and enters doubly clad optical fiber inner cladding by bundling device, is absorbed by fibre core, realizes signal light amplification.
Due to preparation process, pump in optical transmission process, the pump light of higher order mode will leak out optical fiber with the shape of thermal energy
Formula loses, and causes the raising of optical-fiber bundling device conical region temperature.Traditional optical-fiber bundling device encapsulating structure contains polymer
Coating, bonding agent etc., heat there are problems that being difficult to export at these positions.Under the conditions of thermal vacuum, traditional fluid heat transfer side
Case will be no longer applicable in, while optical-fiber bundling device is crisp, frangibility, poor mechanical property.
Interspace optical communication system needs high power laser light to export, and optical-fiber bundling device is indispensable optical device.And it is in
Under vacuum condition, the heating conduction of optical-fiber bundling device will determine the job stability and power tolerance value of bundling device.Non-real hollow bar
Under part, the cone area of optical-fiber bundling device is radiated by air to optical-fiber bundling device packaging cartridge, and under vacuum conditions, optical-fiber bundling device
It is only radiated by way of heat radiation, easily causes local heat buildup and cause to burn, and strongly limit Output optical power.
It is less for the optical-fiber bundling device to work under hot vacuum environment at present, and use traditional optical-fiber bundling device almost without
Method is tested by thermal vacuum.This applies optical-fiber bundling device to receive very big limitation in space flight (such as: interspace optic communication).
Summary of the invention
Present invention aim to address high-power fiber bundling device localized heat buildups under hot vacuum environment, and device to be caused to burn
The problem of, it is based on metal heat-conducting technology, designs the optical-fiber bundling device structure of high-efficiency heat conduction, realizes optical-fiber bundling device uniform heat conduction,
Steady operation.
To achieve the above object, the technical solution adopted by the present invention is that:
A kind of high-power fiber bundling device suitable under hot vacuum environment, including heat-sink shell, micro- metal ball, input light
Fibre, heat-conducting medium, packaging cartridge and output optical fibre etc..The input optical fibre connects shape with output optical fibre by way of fused biconical taper
At the connector with cone area, which is placed in packaging cartridge, the inner circumferential of packaging cartridge is provided with heat-sink shell, bores area periphery
Heat-conducting medium, tightly packed micro- metal ball between heat-sink shell and heat-conducting medium are set.Under hot vacuum environment, high power is inputted
After pumping laser, cone area easily generates heat accumulation effect.By disposing heat-conducting medium outside cone area, micro- metal ball is filled in outside,
Heat sink layer, packaging cartridge are thermally conductive, to maintain optical-fiber bundling device normal working temperature.
The heat-conducting medium is the hexahedron that refractive index is lower than optical fiber coating, and the hexahedron cross section is by quartering circular arc
It constitutes, circular arc curvature radius and optical fiber are located at the outer diameter matching at cone area.The entire cone area of longitudinal length covering of heat-conducting medium, and
It is contacted with close fiber optic.
Micro- metal ball is 50~100 μm of diameter of aluminum metal ball, be uniformly filled in heat-conducting medium and heat-sink shell it
Between gap in, come into full contact with, be conducive to heat transfer.
The heat-sink shell is high heat conductivity metal aluminium layer, tightly packed in packaging cartridge inner wall to the position between micro- metal ball
It sets, to increase heat transfer efficiency.
The advantages of the present invention:
High-power fiber bundling device of the present invention suitable under hot vacuum environment has for localized heat buildup
Efficient thermal conduction characteristic.According to solid thermal conductivity coefficient value, it can be evaluated whether that its conductive structure can be by optical-fiber bundling device heat transfer efficiency
100 times or more of conventional environment (air) are risen to, more high magnification numbe under vacuum environment, thus stabilized operating temperature.Heat-conducting medium
Low-refraction property avoid that light-output will be transmitted, in order to avoid output power is caused to decline.Under high temperature, thermotropic shape easily occurs for optical fiber
Become, and the moveable metal ball of surrounding will be contacted closely with optical-fiber bundling device in real time, at the same micro- array of metal balls have it is higher can
Plasticity, optical fiber is not easy to damage with optical-fiber bundling device adhesion when deformation occurs in optical-fiber bundling device.The above structure improves light
The plasticity of fine bundling device, power tolerance value and job stability finally influence laser output power, improve optical communication system
Q value.The optical-fiber bundling device structure easily encapsulates, and same principle can be used for other optical device cooling systems under hot vacuum environment
In.
Detailed description of the invention
Fig. 1 is thermal vacuum high-power fiber bundling device structural schematic diagram of the present invention.
Fig. 2 is that optical-fiber bundling device bores area, heat-conducting medium and micro- metal ball assembling structure cross-sectional view in the present invention.
Fig. 3 is heat-conducting medium structural schematic diagram in the present invention.
In figure: 1. heat-sink shells, 2. micro- metal balls, 3. input optical fibres, 4. heat-conducting mediums, 5. packaging cartridges, 6. output optical fibres.
The present invention will be described in detail with reference to the accompanying drawing.
Specific implementation method
It is shown such as Fig. 1, a kind of optical-fiber bundling device suitable under hot vacuum environment provided by the invention, including 1. is heat sink
Layer, 2. micro- metal balls, 3. input optical fibres, 4. heat-conducting mediums, 5. packaging cartridges, 6. output optical fibres.The input optical fibre 3 and output light
Fibre 6 is connected by way of fused biconical taper and is placed in packaging cartridge 5, and the inner circumferential of packaging cartridge is provided with heat-sink shell 1, bores area periphery
Heat-conducting medium 4, tightly packed micro- metal ball 2 between heat-sink shell and heat-conducting medium are set.
Thermal vacuum high-power fiber bundling device proposed by the present invention is based on solid heat transfer characteristic.First by input optical fibre and defeated
Optical fiber connects to form the connector with cone area by way of fused biconical taper out, which is placed in packaging cartridge, low
Refractive index heat-conducting medium uses magnesium fluoride (refractive index 1.378) that hexahedral shape as shown in Figure 2 and Figure 3 is made, and the hexahedron is horizontal
Section is made of quartering circular arc, and circular arc curvature radius and optical fiber are located at the outer diameter matching at cone area；The longitudinal direction of heat-conducting medium is long
The entire cone area of degree covering, and contacted with close fiber optic.Heat-conducting medium is tightly attached to the internal layer placement in cone area, and outer layer fills the micro- gold of aluminum
Belong to ball, micro- metal bulb diameter is 50~100 μm.
Heat-sink shell of the present invention is high heat conductivity metal aluminium layer, tightly packed in packaging cartridge inner wall to the position between micro- metal ball
It sets, to increase heat transfer efficiency.
Packaging cartridge of the present invention be aluminum, with heat-sink shell be in close contact, front and back have respectively hole for install input optical fibre and
Output optical fibre.
Below by taking 4 × 1 optical-fiber bundling device as an example, illustrate that a kind of high-power fiber suitable under hot vacuum environment closes beam
The test method of device:
Packaged optical-fiber bundling device is placed in thermal vacuum tester, a layer thickness is uniformly coated on the downside of packaging cartridge
The about heat-conducting silicone grease of 1mm is fixed on the heat-conducting plate in thermal vacuum tester.After instrument is ready, optic fibre input end input 4
Road laser, the parameter of signal optical fibre are as follows: fibre core/covering is 8/125,0.14/0.46NA.The parameter of pumping optical fiber are as follows: fibre core/packet
Layer 105/125,0.22NA.The parameter of output optical fibre are as follows: 8/125,0.14/0.46NA.Pump mode are as follows: backward pump.It is hot true
Empty condition are as follows:≤6.65 × 10^-3Pa, temperature range are -30~50 DEG C, and Cooling rate is >=1 °/min, is recycled 10 times with this.
The cone area of connector will generate light leakage in experiment, can will build up on heat by low-refraction heat-conducting medium and export in time, then
Aluminum metal ball is by efficient heat transfer into heat-sink shell.If deformation occurs for optical fiber in experiment, filled around the cone area of connector
Micro- metal ball will adjust arrangement mode, tightly packed timely heat dissipation.The function during thermal vacuum is monitored by high-speed power meter
Rate variation, verifies its job stability.Its thermal conduction characteristic is analyzed by thermal imaging system.
Test result is as follows, mainly generates heat aggregation in connector cone area, for common bundling device, since cone area is hanged
Sky can only lean on heat-radiation heat-dissipating under vacuum conditions, and common bundling device is caused to be burned out, and of the invention, due to having and connecting
The heat-conducting medium of junctor cone area's close contact, micro- metal ball, metal heat sink floor high-efficiency heat conduction, the optical-fiber bundling device the operation is stable,
The laser for being up to 10W can be exported with firm power, and is tested by thermal vacuum.
It is a kind of high function optical-fiber bundling device and embodiment suitable under hot vacuum environment above, in poles such as aerospaces
Under the conditions of end, it is with a wide range of applications.
Claims (4)
1. a kind of high-power fiber bundling device suitable under hot vacuum environment, including input optical fibre and output optical fibre, feature
It is that the input optical fibre connects to form the connector with cone area by way of fused biconical taper with output optical fibre, by the connection
Body is placed in packaging cartridge, and the inner circumferential of packaging cartridge is provided with heat-sink shell, and heat-conducting medium is arranged in cone area periphery, heat-sink shell with it is thermally conductive
Tightly packed micro- metal ball between medium.
2. according to claim 1 be suitable for high-power optical-fiber bundling device under hot vacuum environment, which is characterized in that described
Heat-conducting medium is the hexahedron that refractive index is lower than optical fiber coating, which is made of quartering circular arc, and circular arc is bent
Rate radius and optical fiber are located at the outer diameter matching at cone area；The entire cone area of longitudinal length covering of heat-conducting medium, and and close fiber optic
Contact.
3. according to claim 1 be suitable for high-power optical-fiber bundling device under hot vacuum environment, which is characterized in that described
The aluminum metal ball that micro- metal ball is 50~100 μm of diameter, is uniformly filled in the gap between heat-conducting medium and heat-sink shell, fills
Tap touching, is conducive to heat transfer.
4. according to claim 1 be suitable for high-power optical-fiber bundling device under hot vacuum environment, which is characterized in that described
Heat-sink shell is high heat conductivity metal aluminium layer, tightly packed in packaging cartridge inner wall to the position between micro- metal ball, thermally conductive to increase
Efficiency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910139741.0A CN109725387A (en) | 2019-02-26 | 2019-02-26 | A kind of high-power fiber bundling device suitable under hot vacuum environment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910139741.0A CN109725387A (en) | 2019-02-26 | 2019-02-26 | A kind of high-power fiber bundling device suitable under hot vacuum environment |
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| CN109725387A true CN109725387A (en) | 2019-05-07 |
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| CN201910139741.0A Withdrawn CN109725387A (en) | 2019-02-26 | 2019-02-26 | A kind of high-power fiber bundling device suitable under hot vacuum environment |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203705679U (en) * | 2014-01-26 | 2014-07-09 | 王盛华 | High-power optical fiber combiner |
| US20160291256A1 (en) * | 2015-03-31 | 2016-10-06 | Raytheon Company | Optical component including nanoparticle heat sink |
| CN207895122U (en) * | 2017-11-07 | 2018-09-21 | 王盛华 | High-power fiber bundling device |
| CN109188610A (en) * | 2018-10-19 | 2019-01-11 | 北京工业大学 | A kind of optical-fiber bundling device with encapsulating structure |
| CN109239848A (en) * | 2018-09-29 | 2019-01-18 | 武汉锐科光纤激光技术股份有限公司 | A kind of optical-fiber bundling device |
-
2019
- 2019-02-26 CN CN201910139741.0A patent/CN109725387A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203705679U (en) * | 2014-01-26 | 2014-07-09 | 王盛华 | High-power optical fiber combiner |
| US20160291256A1 (en) * | 2015-03-31 | 2016-10-06 | Raytheon Company | Optical component including nanoparticle heat sink |
| CN207895122U (en) * | 2017-11-07 | 2018-09-21 | 王盛华 | High-power fiber bundling device |
| CN109239848A (en) * | 2018-09-29 | 2019-01-18 | 武汉锐科光纤激光技术股份有限公司 | A kind of optical-fiber bundling device |
| CN109188610A (en) * | 2018-10-19 | 2019-01-11 | 北京工业大学 | A kind of optical-fiber bundling device with encapsulating structure |
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Application publication date: 20190507 |