CN109714909A - A kind of pcb board production method - Google Patents
A kind of pcb board production method Download PDFInfo
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- CN109714909A CN109714909A CN201910085802.XA CN201910085802A CN109714909A CN 109714909 A CN109714909 A CN 109714909A CN 201910085802 A CN201910085802 A CN 201910085802A CN 109714909 A CN109714909 A CN 109714909A
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- core plate
- pcb board
- board production
- production method
- plate
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Abstract
The invention discloses a kind of pcb board production methods, comprising the following steps: A, core plate drilling；B, the heavy copper of core plate；C, core plate is electroplated, and is fixed together when wherein blind hole core plate is electroplated by electroplating clamp, and unified plating direction；D, core plate etches；E, core plate presses.The present invention is improved on the basis of original pcb board produces, and effectively increases the efficiency and performance of production.
Description
Technical field
The present invention relates to pcb board production field more particularly to a kind of pcb board production methods.
Background technique
Existing multi-layer board manufacturing technology is often difficult to complete electricity under the same conditions in buried via hole production blind in face of multilayer
The crucial processing procedure such as plating, etching, while in the case where requiring in face of the control of stringent resistance being difficult that project engineering stage is being completed
The resistance value of line conductor is accurately controlled during processing procedure afterwards；Especially in the case where multilayer line is series-parallel, multinode resistance value
Difference ultra-specification or critical limit influence final product performance.
Summary of the invention
To solve technical problem present in background technique, the present invention proposes a kind of pcb board production method, is advantageously implemented
The accurate control of resistance value.
A kind of pcb board production method proposed by the present invention, comprising the following steps:
A, core plate drills；
B, the heavy copper of core plate；
C, core plate is electroplated, and is fixed together when wherein blind hole core plate is electroplated by electroplating clamp, and unified plating direction；
D, core plate etches；
E, core plate presses.
Preferably, in step A, core plate is the copper-clad plate of 1.6-2.0mm thickness.
Preferably, in step C, copper facing is with a thickness of 45-55um.
Preferably, in step D, core plate puts plate direction when etching be to limit direction in advance.
Preferably, in step D, all plus tolerances of line width tolerance after core plate etching.
Preferably, it in step E, is positioned when core plate presses using four side riveteds.
The present invention is improved on the basis of original pcb board produces, and effectively increases the efficiency and property of production
Energy.Need to handle multiple core plates when the pcb board production of multilayer, core plate successively drilled, heavy copper, plating, etching and
The processing of pressing, by the fixed blind hole core plate of electroplating clamp, advantageously reduces the plate damage of PCB, since core plate is relatively thin in order to solve
There are non-uniform problem, the present invention to have identical variation tendency after core plate is electroplated, rear by unified plating direction for plating
The position upper and lower level that can be realized identical copper thickness during phase pressing corresponds, and copper thickness uniformity different levels keep one
It causes, is conducive to improve Product Precision, reduces resistance deviation.
Specific embodiment
The following is a clear and complete description of the technical scheme in the embodiments of the invention, it is clear that described embodiment
Only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, the common skill in this field
Art personnel every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
A kind of pcb board production method proposed by the present invention, comprising the following steps:
A, core plate drills；
B, the heavy copper of core plate；
C, core plate is electroplated, and is fixed together when wherein blind hole core plate is electroplated by electroplating clamp, and unified plating direction；
D, core plate etches；
E, core plate presses.
It needs to handle multiple core plates when the pcb board production of multilayer, core plate successively drilled, heavy copper, plating, erosion
It carves and the processing of pressing, core plate pressing needs to pass through the fixed blind hole of electroplating clamp since core plate is relatively thin with material matings such as copper foils
Core plate advantageously reduces the plate damage of PCB, in order to solve the problems, such as plating there are non-uniform, the present invention by unified plating direction,
There is identical variation tendency after core plate is electroplated, can be realized the position upper and lower level one of identical copper thickness during later period pressing
One is corresponding, and copper thickness uniformity different levels are consistent, and is conducive to improve Product Precision, reduces resistance deviation.
Since the copper-clad plate of 1.6-2.0mm thickness can provide enough support strengths, and it not will cause waste of material, this
In embodiment, in step A, core plate is the copper-clad plate of 1.6-2.0mm thickness.
Conventional products plate copper thickness in 40-60um, and copper-plated uniformity is poorer, and the consistency of line width will be poorer, this reality
It applies in mode, in step C, copper facing is with a thickness of 45-55um.Due to having unified plating direction in electroplating work procedure, be conducive to reality
Now plate the control of copper thickness；The present invention can be by manufacturing parameter (chemical concentration, temperature, time and electric current that initial workpiece plate is tested
Value etc.) meet the requirements after, preset parameter production ensure thickness deviation change.
Since pcb board generally needs to produce in batches, i.e., each core plate requires to produce in batches, loses in batches to reduce
The variation of the external factor such as equipment, personnel, environment and procedure parameter causes the problem of homogeneity of product difference when quarter；Guarantee different levels
The route precision consistency of product, in present embodiment, when core plate etches, each level is etched together.Each core plate
There are two levels for tool, and opposite sides is respectively a level.
In present embodiment, in step D, core plate puts plate direction when etching be to limit direction in advance, is put by limiting in advance
Plate direction makes the plate direction of putting of the core plate of the same level of different batches realize unification, is conducive to control the identical level line width of product
Consistency；The consistency of line width difference that ununified direction will lead to identical level causes resistors match poor.
In order to reduce the resistance value of conducting wire, in present embodiment, in step D, line width tolerance is all positive after core plate etching
Tolerance.Early period by the limitation of control electroplating evenness and etching direction, is conducive to the control of line width tolerance, and can pass through
After the manufacturing parameter (chemical concentration, temperature, time, current value) of initial workpiece plate test meets the requirements, preset parameter production ensures line
The control of wide tolerance.
It in present embodiment, in step E, is positioned when core plate presses using four side riveteds, when improving multi-layer coreboard pressing
The accuracy of positioning.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (6)
1. a kind of pcb board production method, which comprises the following steps:
A, core plate drills；
B, the heavy copper of core plate；
C, core plate is electroplated, and is fixed together when wherein blind hole core plate is electroplated by electroplating clamp, and unified plating direction；
D, core plate etches；
E, core plate presses.
2. pcb board production method according to claim 1, it is characterised in that: in step A, core plate is 1.6-2.0mm thickness
Copper-clad plate.
3. pcb board production method according to claim 1, it is characterised in that: in step C, copper facing is with a thickness of 45-55um.
4. pcb board production method according to claim 1, it is characterised in that: in step D, core plate puts plate direction when etching
To limit direction in advance.
5. pcb board production method according to claim 1, it is characterised in that: in step D, line width tolerance after core plate etching
All plus tolerances.
6. pcb board production method described in -5 any one according to claim 1, it is characterised in that: in step E, core plate pressing
The positioning of tetra- side riveted of Shi Caiyong.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910085802.XA CN109714909A (en) | 2019-01-29 | 2019-01-29 | A kind of pcb board production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910085802.XA CN109714909A (en) | 2019-01-29 | 2019-01-29 | A kind of pcb board production method |
Publications (1)
| Publication Number | Publication Date |
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| CN109714909A true CN109714909A (en) | 2019-05-03 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910085802.XA Pending CN109714909A (en) | 2019-01-29 | 2019-01-29 | A kind of pcb board production method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021056802A1 (en) * | 2019-09-24 | 2021-04-01 | 惠州市金百泽电路科技有限公司 | Method for controlling amplitude consistency of 5g antenna pcb |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079363A (en) * | 2012-12-27 | 2013-05-01 | 红板（江西）有限公司 | PCB (Printed Circuit Board) core board electroplating and porefilling process |
| CN203602744U (en) * | 2013-11-29 | 2014-05-21 | 红板（江西）有限公司 | Electroplating clamp for printed circuit board (PCB) sheet |
| CN104470260A (en) * | 2013-09-13 | 2015-03-25 | 珠海方正科技高密电子有限公司 | Blind hole electroplating filling method and circuit board |
| CN105517374A (en) * | 2015-12-17 | 2016-04-20 | 深圳崇达多层线路板有限公司 | Method for making HDI board with thin core board |
| CN105578778A (en) * | 2015-12-17 | 2016-05-11 | 江门崇达电路技术有限公司 | Manufacturing method of single-face local thick-gold plated PCB |
-
2019
- 2019-01-29 CN CN201910085802.XA patent/CN109714909A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079363A (en) * | 2012-12-27 | 2013-05-01 | 红板（江西）有限公司 | PCB (Printed Circuit Board) core board electroplating and porefilling process |
| CN104470260A (en) * | 2013-09-13 | 2015-03-25 | 珠海方正科技高密电子有限公司 | Blind hole electroplating filling method and circuit board |
| CN203602744U (en) * | 2013-11-29 | 2014-05-21 | 红板（江西）有限公司 | Electroplating clamp for printed circuit board (PCB) sheet |
| CN105517374A (en) * | 2015-12-17 | 2016-04-20 | 深圳崇达多层线路板有限公司 | Method for making HDI board with thin core board |
| CN105578778A (en) * | 2015-12-17 | 2016-05-11 | 江门崇达电路技术有限公司 | Manufacturing method of single-face local thick-gold plated PCB |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021056802A1 (en) * | 2019-09-24 | 2021-04-01 | 惠州市金百泽电路科技有限公司 | Method for controlling amplitude consistency of 5g antenna pcb |
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Application publication date: 20190503 |
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