CN109712927A - A kind of cleaning semiconductor chip machine - Google Patents
A kind of cleaning semiconductor chip machine Download PDFInfo
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- CN109712927A CN109712927A CN201811623687.9A CN201811623687A CN109712927A CN 109712927 A CN109712927 A CN 109712927A CN 201811623687 A CN201811623687 A CN 201811623687A CN 109712927 A CN109712927 A CN 109712927A
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- fixedly connected
- cleaning
- plectane
- semiconductor chip
- semiconductor wafer
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Abstract
The present invention relates to semiconductor wafer technical fields, more particularly to a kind of cleaning semiconductor chip machine, including several supporting legs, supporting leg top is fixedly connected with support platform jointly, the first cavity is offered inside the support platform, first cavity is connected by the first hose with extraneous air-introduced machine, and the support platform upper surface is uniformly provided with several first through hole, and support platform surface is placed with semiconductor wafer；It is fixedly connected with mounting base on the supporting leg side wall, is fixedly connected to lifting device in mounting base.The beneficial effects of the invention are as follows in order to further improve the cleaning effect to semiconductor wafer, start the pump housing, the pump housing pumps out the water cleaned in water tank by the second hose, ejected wash water enters the second cavity inside by rotating device and water inlet, then sprayed by the second through-hole, cooperation bristle effectively cleans semiconductor wafer, effectively increases the cleaning effect of semiconductor wafer.
Description
Technical field
The present invention relates to semiconductor wafer technical fields, and in particular to a kind of cleaning semiconductor chip machine.
Background technique
Semiconductor material is the foundation stone of modern semiconductors industry and microelectronics industry.For physical angle, it is referred to
A kind of material of the electric conductivity between conductor and insulator.Semiconductor material is many kinds of, is broadly divided into and inorganic partly leads
Body crystal, organic semiconducting materials and three kinds of amorphous semiconductor.Currently, amorphous semiconductor material is in terms of solar battery
There is very big application prospect.But from first and last, inorganic semiconductor crystal is still occupied an leading position in a semiconductor material.
Inorganic semiconductor crystal can be further divided into elemental semiconductor, compound semiconductor and solid solution semiconductor crystal three
Class.Elemental semiconductor crystal mainly has silicon, germanium, selenium monocrystalline；Compound semiconductor can divide binary, ternary and quaternary crystal again.Two
First compound semiconductor crystal is made of two kinds of elements, many kinds of, there is iii-v, such as GaAs, GaN；There is II-VI group, such as
ZnSe, HgS etc.；There are IV-IV race, such as SiC, there are also leaded object and oxide semiconductor crystal (such as ZnO) in addition to this.Binary
Compound semiconductor crystal is widely used in optoelectronic areas.Ternary semiconductor crystal is with AlGaAs and GaAsP
It represents, is widely used in the production of luminous tube and solid state laser (LD).
Grinding semiconductor wafer machine is mainly used for laminar semiconductor wafer surface grinding, so that semiconductor wafer be made to reach
Defined thickness, and surface is made to reach certain quality requirement.Recently, the miniaturization and lightweight to reach semiconductor devices
The thickness of purpose, semiconductor wafer is more and more thinner, for example, be made into 200 μm or less situation it is more.But it is partly led if being substantially reduced
The thickness of body chip (such as silicon wafer, sapphire belongs to hard brittle material), then the rigidity and intensity of semiconductor wafer are substantially reduced, existing
When cleaning device cleans thin semiconductor chip in the market, the spoilage of thin semiconductor chip is high.
Summary of the invention
The purpose of the present invention is to provide a kind of cleaning semiconductor chip machines, to solve mentioned above in the background art ask
Topic.
To achieve the above object, the invention provides the following technical scheme:
A kind of cleaning semiconductor chip machine, including several supporting legs, it is flat that supporting leg top is fixedly connected with support jointly
Platform offers the first cavity inside the support platform, and the first cavity is connected by the first hose with extraneous air-introduced machine, institute
It states support platform upper surface and is uniformly provided with several first through hole, and support platform surface is placed with semiconductor wafer；The branch
It is fixedly connected with mounting base on support leg side wall, lifting device is fixedly connected in mounting base, the top of lifting device is fixed to be connected
It is connected to horizon bar, plectane is fixedly connected between two horizon bars jointly, is rotatably connected to rotating device, rotating dress on the downside of plectane
The bottom end set is fixedly connected with cleaning brush, and cleaning brush is rounded, the second cavity is offered inside cleaning brush, the second cavity downside is
Even to offer several second through-holes, the cleaning brush lower surface arrangement has bristle, offers water inlet on the upside of cleaning brush；The circle
Cleaning water tank is placed on the upside of plate, cleaning water tank is passed through by the second hose to be connected inside plectane and rotating device, and second is soft
The pump housing is provided on pipe.
Be as further effect of the present invention: the first through hole diameter is 0.5mm-1.5mm.
As the present invention, further effect is: the lifting device is electric pushrod or hydraulic telescopic rod.
As the present invention, further effect is: the rotating device includes vertical sleeve, vertical sleeve bottom end and clear
It scrubs upside to be fixedly connected, the top of vertical sleeve is fixedly connected with Circular Plate；It is L-shaped that section is offered on the downside of the plectane
Annular suspension groove, the top of vertical sleeve and Circular Plate are respectively positioned on annular suspension inside grooves；The vertical sleeve it is interior
It is fixedly connected with rack gear on side wall, gear is engaged on gear ring, shaft is fixedly connected on the upside of gear, it is upward that shaft passes through plectane
Extend, and shaft top is fixedly connected with the motor output shaft being located on plectane.
As the present invention, further effect is: the axis of the vertical sleeve and the axis of cleaning brush coincide.
As the present invention, further effect is: the contact position of the shaft and plectane is provided with bearing.
As the present invention, further effect is: the diameter of second through-hole is 2mm-4mm.
As the present invention, further effect is: the water inlet section is in isosceles trapezoid, and the small end court of water inlet
Lower setting.
The beneficial effects of the invention are as follows air-introduced machines at work to extract the air in the first cavity by the first hose out, from
And make in the first cavity in negative pressure state, then under the action of negative pressure, semiconductor wafer is tightly attached to the upper surface of support platform, so that
In cleaning, semiconductor wafer will not there is a situation where mobile；The rotation of shaft sliding tooth wheel, the gear ring being meshed with gear occur
Rotation, gear ring drive vertical sleeve rotation, and vertical sleeve can drive cleaning brush to rotate；And Circular Plate is in annular suspension groove
Rotation, can be supported effect to vertical sleeve, guarantee the rotation and suspension of vertical sleeve；In order to further improve pair
The cleaning effect of semiconductor wafer starts the pump housing, and the pump housing pumps out the water cleaned in water tank by the second hose, and ejected wash water passes through
Rotating device and water inlet enter the second cavity inside, are then sprayed by the second through-hole, cooperate bristle to semiconductor die
Piece is effectively cleaned, and the cleaning effect of semiconductor wafer is effectively increased.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the structural schematic diagram of rotating device of the present invention；
Fig. 3 is the top view of Circular Plate of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 1-Fig. 3, in the embodiment of the present invention, a kind of cleaning semiconductor chip machine, including several supporting legs 1,
1 top of supporting leg is fixedly connected with support platform 2 jointly, and the first cavity 3, the first cavity 3 are offered inside the support platform 2
It is connected by the first hose 5 with extraneous air-introduced machine 6,2 upper surface of support platform is uniformly provided with several first through hole
4, and 2 surface of support platform is placed with semiconductor wafer, at work, semiconductor wafer is placed on support first with manipulator
On platform 2, then starting air-introduced machine 6, air-introduced machine 6 is at work extracted the air in the first cavity 3 out by the first hose 5,
To make in the first cavity 3 in negative pressure state, then under the action of negative pressure, semiconductor wafer is tightly attached to the upper surface of support platform 2,
So that in cleaning, semiconductor wafer will not there is a situation where mobile；After the upper surface of semiconductor wafer is cleaned, close
Air-introduced machine 6 is closed, air-introduced machine 6 stops working, and the pressure in the first cavity 3 is gradually recovered, and negative pressure disappears, then can be by semiconductor
Chip is easily removed；
It is fixedly connected with mounting base 7 on 1 side wall of supporting leg, lifting device 8 is fixedly connected in mounting base 7, is risen
The top of falling unit 8 is fixedly connected with horizon bar 9, is fixedly connected with plectane 10,10 downside of plectane between two horizon bars 9 jointly
It is rotatably connected to rotating device 11, the bottom end of rotating device 11 is fixedly connected with cleaning brush 12, and cleaning brush 12 is rounded, cleaning brush
The second cavity 13 is offered inside 12, is uniformly provided with several second through-holes 14 on the downside of the second cavity 13, under the cleaning brush 12
After surface layout has bristle 15, semiconductor wafer to be sucked, decline plectane 10 using lifting device 8, then 12 downside of cleaning brush
The bristle 15 of arrangement is in contact with the upper surface of semiconductor wafer, and starts rotating device 11, and rotating device 11 drives cleaning brush
12 rotations, then cleaning brush 12 drives bristle 15 to scrub the upper surface of semiconductor wafer；
Water inlet 16 is offered on the upside of cleaning brush 12；It is placed with cleaning water tank 17 on the upside of the plectane 10, cleans water tank 17
It is passed through by the second hose 18 and is connected inside plectane 10 and rotating device 11, the pump housing 19 is provided on the second hose 5, in order to again
The cleaning effect to semiconductor wafer is further increased, the pump housing 19 is started, the pump housing 19 passes through second for the water in water tank 17 is cleaned
Hose 18 pumps out, and ejected wash water is entered inside the second cavity 13 by rotating device 11 and water inlet 16, then passes through second
Through-hole 14 sprays, and cooperation bristle 15 effectively cleans semiconductor wafer, effectively increases the cleaning effect of semiconductor wafer
Fruit.
14 diameter of first through hole is 0.5mm-1.5mm.
The lifting device 8 is electric pushrod or hydraulic telescopic rod.
Fig. 1-Fig. 3 is please referred to, the rotating device 11 includes vertical sleeve 111, vertical 111 bottom end of sleeve and cleaning brush 12
Upside is fixedly connected, and the top of vertical sleeve 111 is fixedly connected with Circular Plate 112；Section is offered on the downside of the plectane 10 in L
The annular suspension groove 113 of type, the top of vertical sleeve 111 and Circular Plate 112 are respectively positioned on inside annular suspension groove 113；
It is fixedly connected with rack gear 114 on the inner sidewall of the vertical sleeve 111, gear 115,115 upside of gear are engaged on gear ring 114
It is fixedly connected with shaft 116, shaft 116 passes through plectane 10 and upwardly extends, and 116 top of shaft and the motor on plectane 10
117 output shafts are fixedly connected, when bristle 15 at work, in order to which available preferable cleaning effect needs to make 15 turns of bristle
It is dynamic, then start motor 1117, motor 117 drives shaft 116 to rotate, and shaft 116 drives gear 115 to rotate, and nibbles with 115 phase of gear
The gear ring 114 of conjunction rotates, and gear ring 114 drives vertical sleeve 111 to rotate, and vertical sleeve 111 can drive 12 turns of cleaning brush
It is dynamic；And Circular Plate 112 rotates in annular suspension groove 113, and effect can be supported to vertical sleeve 111, it is vertical to guarantee
The rotation and suspension of sleeve 111.
The axis of the axis and cleaning brush 12 of the vertical sleeve 111 coincides.
The shaft 116 and the contact position of plectane 10 are provided with bearing 118.
The diameter of second through-hole 14 is 2mm-4mm.
16 section of water inlet is in isosceles trapezoid, and the small end of water inlet 16 is arranged downward, and ejected wash water enters vertically
After in sleeve 111, since water inlet 16 is in up big and down small state, then there are certain ramps for water inlet 16, so that vertical set
Ejected wash water in cylinder 111 can be all introduced into inside the second cavity 13.
The course of work of the invention is: at work, semiconductor wafer being placed on support platform 2 first with manipulator
On, then start air-introduced machine 6, air-introduced machine 6 is at work extracted the air in the first cavity 3 out by the first hose 5, to make
It is in negative pressure state in first cavity 3, then under the action of negative pressure, semiconductor wafer is tightly attached to the upper surface of support platform 2, so that
Semiconductor wafer will not there is a situation where mobile when cleaning；After the upper surface of semiconductor wafer is cleaned, air inducing is closed
Machine 6, air-introduced machine 6 stop working, and the pressure in the first cavity 3 is gradually recovered, and negative pressure disappears, then can be by semiconductor wafer side
Just it takes out；
After semiconductor wafer is sucked, decline plectane 10 using lifting device 8, then the bristle arranged on the downside of cleaning brush 12
15 are in contact with the upper surface of semiconductor wafer, and start rotating device 11, and rotating device 11 drives cleaning brush 12 to rotate, then clearly
12 drive bristles 15 are scrubbed to scrub the upper surface of semiconductor wafer；
In order to further improve the cleaning effect to semiconductor wafer, start the pump housing 19, the pump housing 19 will clean water tank 17
Interior water is pumped out by the second hose 18, and ejected wash water is entered in the second cavity 13 by rotating device 11 and water inlet 16
Portion is then sprayed by the second through-hole 14, and cooperation bristle 15 effectively cleans semiconductor wafer, is effectively increased and is partly led
The cleaning effect of body chip；
When bristle 15 at work, in order to which available preferable cleaning effect needs to make bristle 15 to rotate, then start electricity
Machine 1117, motor 117 drive shaft 116 to rotate, and shaft 116 drives gear 115 to rotate, the gear ring 114 being meshed with gear 115
It rotates, gear ring 114 drives vertical sleeve 111 to rotate, and vertical sleeve 111 can drive cleaning brush 12 to rotate；And Circular Plate
112 rotate in annular suspension groove 113, can be supported effect to vertical sleeve 111, guarantee the rotation of vertical sleeve 111
Turn and hangs.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (8)
1. a kind of cleaning semiconductor chip machine, including several supporting legs, supporting leg top are fixedly connected with support platform jointly,
It is characterized in that, offering the first cavity inside the support platform, the first cavity passes through the first hose and extraneous air-introduced machine
It is connected, the support platform upper surface is uniformly provided with several first through hole, and support platform surface is placed with semiconductor die
Piece；It is fixedly connected with mounting base on the supporting leg side wall, lifting device, the top of lifting device are fixedly connected in mounting base
End is fixedly connected with horizon bar, is fixedly connected with plectane between two horizon bars jointly, is rotatably connected to rotating dress on the downside of plectane
It sets, the bottom end of rotating device is fixedly connected with cleaning brush, and cleaning brush is rounded, offer the second cavity inside cleaning brush, second
Several second through-holes are uniformly provided on the downside of cavity, the cleaning brush lower surface arrangement has bristle, offered on the upside of cleaning brush into
The mouth of a river；Cleaning water tank is placed on the upside of the plectane, cleaning water tank passes through plectane and phase inside rotating device by the second hose
It is connected to, is provided with the pump housing on the second hose.
2. cleaning semiconductor chip machine according to claim 1, which is characterized in that the first through hole diameter is 0.5mm-
1.5mm。
3. cleaning semiconductor chip machine according to claim 1, which is characterized in that the lifting device be electric pushrod or
Hydraulic telescopic rod.
4. cleaning semiconductor chip machine according to claim 1 or 2, which is characterized in that the rotating device includes vertical
It is fixedly connected on the upside of sleeve, vertical sleeve bottom end and cleaning brush, the top of vertical sleeve is fixedly connected with Circular Plate；The plectane
Downside offers the L-shaped annular suspension groove in section, and the top of vertical sleeve and Circular Plate are respectively positioned on annular suspension groove
It is internal；It is fixedly connected with rack gear on the inner sidewall of the vertical sleeve, gear is engaged on gear ring, is fixedly connected on the upside of gear
Shaft, shaft are upwardly extended across plectane, and shaft top is fixedly connected with the motor output shaft being located on plectane.
5. cleaning semiconductor chip machine according to claim 4, which is characterized in that the axis of the vertical sleeve and cleaning
The axis of brush coincides.
6. cleaning semiconductor chip machine according to claim 5, which is characterized in that the contact position of the shaft and plectane is set
It is equipped with bearing.
7. cleaning semiconductor chip machine according to claim 1, which is characterized in that the diameter of second through-hole is 2mm-
4mm。
8. cleaning semiconductor chip machine according to claim 1 or claim 7, which is characterized in that the water inlet section is in isosceles
It is trapezoidal, and the small end of water inlet is arranged downward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811623687.9A CN109712927A (en) | 2018-12-28 | 2018-12-28 | A kind of cleaning semiconductor chip machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811623687.9A CN109712927A (en) | 2018-12-28 | 2018-12-28 | A kind of cleaning semiconductor chip machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109712927A true CN109712927A (en) | 2019-05-03 |
Family
ID=66259019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811623687.9A Pending CN109712927A (en) | 2018-12-28 | 2018-12-28 | A kind of cleaning semiconductor chip machine |
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| Country | Link |
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| CN (1) | CN109712927A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111774353A (en) * | 2020-07-10 | 2020-10-16 | 李峰 | A dust collector for wafer detects |
| CN115301607A (en) * | 2022-07-19 | 2022-11-08 | 盐城矽润半导体有限公司 | Wet cleaning device for semiconductor wafer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0786222A (en) * | 1993-09-16 | 1995-03-31 | Tokyo Ohka Kogyo Co Ltd | Substrate cleaning device |
| CN101436564A (en) * | 2007-11-13 | 2009-05-20 | 株式会社迅动 | Substrate processing apparatus |
| CN104916567A (en) * | 2014-03-12 | 2015-09-16 | 株式会社迪思科 | Apparatus and method for processing wafer |
| CN207425803U (en) * | 2017-08-18 | 2018-05-29 | 新昌县羽林街道东陈机械厂 | A kind of electronic semi-conductor's processing cleaning device |
-
2018
- 2018-12-28 CN CN201811623687.9A patent/CN109712927A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0786222A (en) * | 1993-09-16 | 1995-03-31 | Tokyo Ohka Kogyo Co Ltd | Substrate cleaning device |
| CN101436564A (en) * | 2007-11-13 | 2009-05-20 | 株式会社迅动 | Substrate processing apparatus |
| CN104916567A (en) * | 2014-03-12 | 2015-09-16 | 株式会社迪思科 | Apparatus and method for processing wafer |
| CN207425803U (en) * | 2017-08-18 | 2018-05-29 | 新昌县羽林街道东陈机械厂 | A kind of electronic semi-conductor's processing cleaning device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111774353A (en) * | 2020-07-10 | 2020-10-16 | 李峰 | A dust collector for wafer detects |
| CN115301607A (en) * | 2022-07-19 | 2022-11-08 | 盐城矽润半导体有限公司 | Wet cleaning device for semiconductor wafer |
| CN115301607B (en) * | 2022-07-19 | 2023-09-26 | 盐城矽润半导体有限公司 | Wet cleaning device for semiconductor wafer |
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Application publication date: 20190503 |
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