CN109708780B - High-precision reference temperature acquisition device and method thereof - Google Patents
High-precision reference temperature acquisition device and method thereof Download PDFInfo
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Abstract
A high-precision reference temperature acquisition device and a method thereof comprise a constant temperature device A, a constant temperature device B, a heat transfer conductor arranged between the constant temperature device A and the constant temperature device B, a plurality of temperature sensors arranged on the heat transfer conductor and connected with a processor, the processor connected with a testing mechanical arm, the processor comprising a sensor temperature recording module, a closest reference temperature sensor acquisition module and a reference point calculation module, the sensor temperature recording module used for recording the temperature of each temperature sensor; the closest reference temperature sensor acquisition module is used for finding two adjacent temperature sensors closest to the reference temperature; the datum point calculation module is used for calculating a datum point with the temperature on the temperature transmission conductor as a datum temperature; the test mechanical arm places the product to be tested on the datum point of the heat transfer conductor under the control of the processor. The invention can effectively reduce the equipment cost of the production line and effectively improve the production efficiency.
Description
Technical Field
The invention relates to a reference temperature acquisition device and a method thereof, in particular to a high-precision reference temperature acquisition device and a method thereof.
Background
Electronic thermometers are increasingly in demand as mercury thermometers are phased out of the market. Whether the contact type or infrared type electronic thermometer or the temperature sticker needs to be calibrated and tested during the production process, the basic accuracy of the thermometer is 0.1 degree centigrade, and therefore a temperature reference source with higher accuracy is needed for calibration or testing during the production process.
In the existing market, a plurality of constant-temperature devices are available, stable temperatures with different accuracies can be provided, but the higher the accuracy is, the more complex the system of the constant-temperature device is, the exponentially increased price is, and the purchase and maintenance cost of the device caused by mass production in factories is greatly increased.
By adopting the low-precision constant temperature equipment, the out-of-limit time can be avoided in the fluctuation period, and the calibration test is carried out when the out-of-limit time reaches the required temperature range, but the production efficiency is reduced.
There is therefore a need in the manufacturing line for a low cost, high efficiency method and apparatus that provides a high precision temperature reference source to facilitate calibration and testing of temperature products.
Disclosure of Invention
The present invention is to overcome the above-mentioned drawbacks of the background art, and provide a high-precision reference temperature acquiring device and method thereof, which can generate a high-precision temperature reference by using low-precision temperature control, thereby effectively reducing the equipment cost of a production line and effectively improving the production efficiency.
The invention solves the technical problem by adopting the technical scheme that the high-precision reference temperature acquisition device comprises a constant temperature device A, a constant temperature device B, a processor and a testing mechanical arm, wherein a heat transfer conductor is arranged between the constant temperature device A and the constant temperature device B, a plurality of temperature sensors are arranged on the heat transfer conductor, the plurality of temperature sensors are all connected with the processor, the processor is connected with the testing mechanical arm, the processor comprises a sensor temperature recording module, a closest reference temperature sensor acquisition module and a reference point calculation module, the sensor temperature recording module is connected with the closest reference temperature sensor acquisition module, the closest reference temperature sensor acquisition module is connected with the reference point calculation module, and the sensor temperature recording module is used for recording the temperature of each temperature sensor; the closest reference temperature sensor acquisition module is used for finding two adjacent temperature sensors closest to the reference temperature; the datum point calculating module is used for calculating a datum point with the temperature on the temperature transmission conductor as a datum temperature; the test mechanical arm places a product to be tested on the datum point of the heat transfer conductor under the control of the processor.
Further, the temperature-transmitting conductor is a metal bar conductor.
Furthermore, the middle part of the heat transfer conductor is wrapped with heat insulation materials.
A high-precision reference temperature acquisition method comprises the following steps:
(1) selecting a constant temperature device A and a constant temperature device B with the temperature precision of D, placing an end A of a heat transfer conductor on the constant temperature device A, and placing an end B of the heat transfer conductor on the constant temperature device B;
(2) a plurality of temperature sensors are arranged in the middle section of the heat transfer conductor, and the reference temperature to be obtained is set as TDatumSetting the temperature of the thermostatic device A to TA，TA≤TDatum-D; setting the temperature of the thermostatic device B to TB，TB≥TDatum+D；
(3) Finding the closest reference temperature T on the temperature-conducting conductorDatumTwo adjacent temperature sensors SiAnd Si+1Reading the temperature sensor SiAt a temperature of TiIn the position Li，LiIs a temperature sensor SiDistance from the end A of the heat transfer conductor; reading temperature sensor Si+1At a temperature of Ti+1In the position Li+1，Li+1Is a temperature sensor Si+1Distance from the end A of the heat transfer conductor;
(4) setting a point L on the heat transfer conductor as a reference point, wherein the reference point temperature is TDatumL is the distance between the reference point on the heat transfer conductor and the end A of the heat transfer conductor; according to the fact that the middle part of the thermal conductor presents monotonous linear or nearly linear TA～TBThe temperature distribution of (1) can be obtained:
（L-Li）/（Li+1-Li）=（Tdatum-Ti）/（Ti+1-Ti），
I.e. L = Li+（Li+1-Li）×（TDatum-Ti）/（Ti+1-Ti) Then, the temperature on the temperature-transmitting conductor is obtained as TDatumThe reference point of (1);
(5) placing the product to be tested at the temperature of the heat transfer conductor of TDatumAnd acquiring a high-precision reference temperature on the reference point, and starting a calibration or test process.
Further, the temperature accuracy D of the thermostatic device a and the thermostatic device B is at least an order of magnitude lower than the required temperature accuracy.
Further, the spacing distance between adjacent temperature sensors is the same.
Compared with the prior art, the invention has the following advantages:
the invention adopts the low-cost constant temperature equipment, and uses the low-precision temperature control to generate the high-precision temperature reference, thereby effectively reducing the equipment cost of the production line; the production process is hardly influenced by temperature control fluctuation of the constant temperature equipment, the optimal reference temperature point can be dynamically locked, the continuous and uninterrupted batch production requirement is met, and the production efficiency can be effectively improved.
Drawings
Fig. 1 is a schematic structural diagram of a high-precision reference temperature acquiring apparatus according to an embodiment of the present invention.
Fig. 2 is a block diagram of a processor of the embodiment shown in fig. 1.
In the figure: 1-constant temperature equipment A, 2-constant temperature equipment B, 3-long metal heat-transfer conductor,
4-temperature sensor, 5-processor, 5-1-sensor temperature recording module, 5-2-closest reference temperature sensor acquisition module, 5-3-datum point calculation module, 6-test mechanical arm and 7-product to be tested.
Detailed Description
The invention is described in further detail below with reference to the figures and specific embodiments.
Referring to fig. 1, the high-precision reference temperature acquiring apparatus of this embodiment includes a constant temperature device A1, a constant temperature device B2, a processor 5, and a testing robot arm 6, wherein a long metal temperature-transmitting conductor 3 is disposed between the constant temperature device A1 and the constant temperature device B2, a plurality of temperature sensors 4 are disposed on the long metal temperature-transmitting conductor 3, the plurality of temperature sensors 4 are all connected to the processor 5, and the processor 5 is connected to the testing robot arm 6.
Referring to fig. 2, the processor 5 includes a sensor temperature recording module 5-1, a closest reference temperature sensor acquisition module 5-2, and a reference point calculation module 5-3, the sensor temperature recording module 5-1 is connected to the closest reference temperature sensor acquisition module 5-2, the closest reference temperature sensor acquisition module 5-2 is connected to the reference point calculation module 5-3, and the sensor temperature recording module 5-1 is configured to record the temperature of each temperature sensor 4; the closest reference temperature sensor acquisition module 5-2 is used for finding two adjacent temperature sensors closest to the reference temperature; the reference point calculating module 5-3 is used for calculating a reference point with the temperature on the long metal temperature-transmitting conductor 3 as a reference temperature.
The test robot arm 6, under the control of the processor 5, can place a product 7 to be tested on the reference point of the long metal heat transfer conductor 3.
In this embodiment, the long metal heat transfer conductor 3 is a metal rod, and the middle portion of the long metal heat transfer conductor 3 is wrapped with a heat insulating material to reduce the influence of the outside on the temperature.
The method for obtaining a high-precision reference temperature of the present embodiment includes the following steps:
(1) selecting constant temperature equipment A1 and constant temperature equipment B2 with low precision (temperature precision is D), placing one end (end A) of a long metal temperature-transmitting conductor 3 on the constant temperature equipment A1, and placing the other end (end B) of the long metal temperature-transmitting conductor 3 on the constant temperature equipment B2;
(2) a plurality of temperature sensors 4 are arranged in the middle section of the long metal temperature-transmitting conductor 3, and the reference temperature to be obtained is set as TDatumSetting the temperature of the thermostatic device A1 to TA，TA≤TDatum-D; setting the temperature of the thermostatic device B2 to TB，TB≥TDatum+ D; the temperatures of two ends of the long metal temperature-transmitting conductor 3 are respectively TAAnd TBThe middle part of the long metal heat-conducting conductor 3 shows monotonous linear or nearly linear T based on good heat-conducting performanceA～TBThe temperature distribution of the medium;
(3) the processor 5 finds the closest reference temperature T on the long metal temperature-conducting conductor 3DatumTwo adjacent temperature sensors SiAnd Si+1Reading the temperature sensor SiAt a temperature of TiIn the position Li，LiIs a temperature sensor SiThe distance from the end 3A of the long metal heat-transfer conductor; reading temperature sensor Si+1At a temperature of Ti+1In the position Li+1，Li+1Is a temperature sensor Si+1The distance from the end 3A of the long metal heat-transfer conductor;
(4) setting the point L on the long-length metal temperature-transmitting conductor 3 as a reference point with the temperature TDatumL is the distance from the reference point on the long metal heat transfer conductor 3 to the end of the long metal heat transfer conductor 3A; the middle part of the long metal temperature-transmitting conductor 3 presents monotonous linear or nearly linear TA～TBThe temperature distribution of (1) can be obtained:
（L-Li）/（Li+1-Li）=（Tdatum-Ti）/（Ti+1-Ti），
I.e. L = Li+（Li+1-Li）×（TDatum-Ti）/（Ti+1-Ti) Then, the temperature T on the long metal heat-transfer conductor 3 is obtainedDatumThe reference point of (1);
(5) the processor 5 controls the mechanical arm 6 to move, and the product 7 to be tested is placed on the long metal temperature-transmitting conductor 3 at the temperature TDatumAnd acquiring a high-precision reference temperature on the reference point, and starting a calibration or test process. Because the temperature of the low-precision thermostatic equipment has certain fluctuation, the processor 5 continuously inquires the temperature value of each temperature sensor 4, and readjusts the temperature to be T when the temperature changesDatumThe position of the reference point enables the product to be tested 7 to always obtain a high-precision temperature reference source in the production process.
The method for obtaining a reference temperature with high accuracy according to the present embodiment will be described below with reference to specific values.
Production of products with set temperatureAn accurate 25 ℃ temperature is required on a production line and is used as a standard for temperature calibration and testing. The precision of +/-1 degree can be achieved by the constant temperature equipment with low precision. The temperature T of the thermostatic device A1 is adjustedAThe adjustment is that: t isAT is less than or equal to 25-1 DEG CALess than or equal to 24 ℃; the temperature T of the thermostatic device B2BThe adjustment is that: t isBT is not less than 25+1 DEG CB≥26℃。
One end (end A) of a long metal temperature-transmitting conductor 3 is arranged on a thermostatic device A1, and the other end (end B) of the long metal temperature-transmitting conductor 3 is arranged on a thermostatic device B2; therefore, the A end of the long metal heat-conducting strip fluctuates at about 24 ℃, the B end of the long metal heat-conducting conductor 3 fluctuates at about 26 ℃, and the situations that the A end and the B end are both higher than 25 ℃ or both lower than 25 ℃ cannot occur simultaneously based on the precision control of the constant temperature equipment. So that a continuous temperature distribution of 25 c is present from low to high for the long metallic temperature-conducting conductor 3.
A plurality of temperature sensors 4 are arranged on the long metal heat-transfer conductor 3 at intervals, for example, one temperature sensor is arranged at intervals of 100mm, and the processor 5 can obtain the temperature distribution condition of the whole long metal heat-transfer conductor 3; the processor 5 firstly obtains two adjacent sensors which are closest to the temperature of 25 ℃ from the temperature sensors 4, and if the temperature of the 6 th sensor on the long metal temperature-transmitting conductor 3 is 24.93 ℃, and the temperature of the 7 th sensor is 25.17 ℃, the distance is short, and the temperature can be processed according to the linear change of the temperature in the interval, then the calculation is carried out:
n=（25-24.93）/（25.17-24.93）×100mm=29.17mm；
n denotes the distance of the reference point on the long metal temperature-conducting conductor 3 from the 6 th sensor, i.e. between the 6 th and 7 th sensors, 29.17mm from the 6 th sensor is the one closest to the temperature of 25 c. The test robot arm 6 may place the product 7 to be tested there for calibration or testing.
Assuming that the maximum deviation of the positioning accuracy of the mechanical arm is 2mm, the theoretical accuracy can also be calculated under the condition:
(25.17-24.93)/100×2≈0.005℃；
the thermometer with the precision of only 0.1 ℃ can completely meet the requirements of production test.
Meanwhile, when the reading of the temperature sensor 4 begins to change, the processor 5 can process in real time and re-determine the reference point, so that the precision is not affected by the fluctuation of the low-precision constant-temperature equipment.
In a specific practical application, the adjacent temperature sensors may be equally or unequally spaced.
The temperature precision D of the constant temperature equipment A and the constant temperature equipment B can be reduced by at least one order of magnitude compared with the required temperature precision, and if the required temperature precision is 0.1 ℃, the temperature precision D of the adopted constant temperature equipment A and the adopted constant temperature equipment B can be 1 ℃.
The invention adopts the low-cost constant temperature equipment, and uses the low-precision temperature control to generate the high-precision temperature reference, thereby effectively reducing the equipment cost of the production line; the production process is hardly influenced by temperature control fluctuation of the thermostatic equipment, the optimal reference temperature point can be dynamically locked, and the continuous and uninterrupted batch production requirement is met.
Various modifications and variations of the present invention may be made by those skilled in the art, and they are also within the scope of the present invention provided they are within the scope of the claims of the present invention and their equivalents.
What is not described in detail in the specification is prior art that is well known to those skilled in the art.
Claims (6)
1. A high-precision reference temperature acquisition device is characterized in that: the temperature measurement device comprises a constant temperature device A, a constant temperature device B, a processor and a testing mechanical arm, wherein a heat transfer conductor is arranged between the constant temperature device A and the constant temperature device B, a plurality of temperature sensors are arranged on the heat transfer conductor, the plurality of temperature sensors are all connected with the processor, the processor is connected with the testing mechanical arm, the processor comprises a sensor temperature recording module, a closest reference temperature sensor acquisition module and a reference point calculation module, the sensor temperature recording module is connected with the closest reference temperature sensor acquisition module, the closest reference temperature sensor acquisition module is connected with the reference point calculation module, and the sensor temperature recording module is used for recording the temperature of each temperature sensor; the closest reference temperature sensor acquisition module is used for finding two adjacent temperature sensors closest to the reference temperature; the datum point calculating module is used for calculating a datum point with the temperature on the temperature transmission conductor as a datum temperature; the test mechanical arm places a product to be tested on the datum point of the heat transfer conductor under the control of the processor.
2. The high precision reference temperature acquisition apparatus according to claim 1, characterized in that: the temperature-transmitting conductor is a metal bar conductor.
3. The high precision reference temperature acquisition apparatus according to claim 1 or 2, characterized in that: the middle part of the heat transfer conductor is wrapped with heat insulation materials.
4. A high-precision reference temperature acquisition method is characterized by comprising the following steps:
(1) selecting a constant temperature device A and a constant temperature device B with the temperature precision of D, placing an end A of a heat transfer conductor on the constant temperature device A, and placing an end B of the heat transfer conductor on the constant temperature device B;
(2) a plurality of temperature sensors are arranged in the middle section of the heat transfer conductor, and the reference temperature to be obtained is set as TDatumSetting the temperature of the thermostatic device A to TA，TA≤TDatum-D; setting the temperature of the thermostatic device B to TB，TB≥TDatum+D；
(3) Finding the closest reference temperature T on the temperature-conducting conductorDatumTwo adjacent temperature sensors SiAnd Si+1Reading the temperature sensor SiAt a temperature of TiIn the position Li，LiIs a temperature sensor SiDistance from the end A of the heat transfer conductor; reading temperature sensor Si+1At a temperature of Ti+1In the position Li+1，Li+1Is a temperature sensor Si+1Distance from the end A of the heat transfer conductor;
(4) setting a position on a heat-transfer conductorPoint L is the reference point, and the reference point temperature is TDatumL is the distance between the reference point on the heat transfer conductor and the end A of the heat transfer conductor; according to the fact that the middle part of the thermal conductor presents monotonous linear or nearly linear TA～TBThe temperature distribution of (1) can be obtained:
（L-Li）/（Li+1-Li）=（Tdatum-Ti）/（Ti+1-Ti），
I.e. L = Li+（Li+1-Li）×（TDatum-Ti）/（Ti+1-Ti) Then, the temperature on the temperature-transmitting conductor is obtained as TDatumThe reference point of (1);
(5) placing the product to be tested at the temperature of the heat transfer conductor of TDatumAnd acquiring a high-precision reference temperature on the reference point, and starting a calibration or test process.
5. The high precision reference temperature acquisition method according to claim 4, characterized in that: the temperature accuracy D of the thermostatic device a and the thermostatic device B is at least an order of magnitude lower than the required temperature accuracy.
6. The high precision reference temperature acquisition method according to claim 4 or 5, characterized in that: the spacing distance between adjacent temperature sensors is the same.
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| EP2215442B1 (en) * | 2007-12-03 | 2016-07-13 | Innovative Sensor Technology IST AG | Device for determining and/or monitoring temperature |
| DE102015002878A1 (en) * | 2015-03-09 | 2016-09-15 | Falk Steuerungssysteme Gmbh | Apparatus and method for thermoelectric temperature measurement on current-carrying conductive samples |
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2018
- 2018-12-24 CN CN201811579570.5A patent/CN109708780B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0869860A (en) * | 1994-08-30 | 1996-03-12 | Tokyo Gas Co Ltd | Reference temperature generating device |
| CN101183031A (en) * | 2007-11-30 | 2008-05-21 | 中国航天空气动力技术研究院 | Glass-bulb thermometers automatic detection device and detection method |
| EP2215442B1 (en) * | 2007-12-03 | 2016-07-13 | Innovative Sensor Technology IST AG | Device for determining and/or monitoring temperature |
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