CN109704556A - Waste material removal device and scribing equipment with the waste material removal device - Google Patents
Waste material removal device and scribing equipment with the waste material removal device Download PDFInfo
- Publication number
- CN109704556A CN109704556A CN201711383098.3A CN201711383098A CN109704556A CN 109704556 A CN109704556 A CN 109704556A CN 201711383098 A CN201711383098 A CN 201711383098A CN 109704556 A CN109704556 A CN 109704556A
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- Prior art keywords
- unit
- waste material
- clamping
- removal device
- material removal
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to a kind of waste material removal device and the scribing equipment with the waste material removal device.The present invention provides a kind of waste material removal devices from substrate removal waste material, which includes: the first clamping array comprising multiple clamping units；Clamping unit installation unit is equipped with the first clamping array thereon；And support unit, support clamping unit installation unit, wherein clamping unit has the fixture for keeping waste material, and the height of fixture can be conditioned, and the present invention also provides a kind of scribing equipments with the waste material removal device.
Description
Technical field
The present invention relates to a kind of waste material (dummy, dud) removal devices and a kind of with the waste material removal device
Scribing equipment.More particularly it relates to a kind of waste material removal device and a kind of scribing with the waste material removal device
Equipment is effectively removed the waste material in the front side of substrate and rear side formation.
Background technique
In general, being used for liquid crystal display panel, organic EL display panel, the inorganic electroluminescence of flat-panel monitor
Active display panel, transmission projection substrate, reflective projection substrate etc. be by using unit glass panel (hereinafter, referred to
" unit substrate ") manufacture, unit glass panel be by by the brittleness mother glass panel of such as glass (hereinafter, referred to " female
Substrate ") it is cut to predetermine sizes and is made.
The process (processing, technique) of cutting substrate includes: scribing processes, is drawn by using made of diamond or laser
Piece wheel forms scribe line along the predetermined cuts line on mother substrate on mother substrate；And sliver process, by use along draw
The method of piece line pressing mother substrate is by cutting substrate come obtaining unit substrate.
Meanwhile during the process of cutting substrate, it is necessary to from being removed on mother substrate not include the portion in unit substrate
Subregion.The unnecessary region of mother substrate is referred to as waste material or cullet, or also referred to as rim charge.
As an example, Korean Patent Application Publication the 10-2003-0069195th discloses a kind of construction, wherein passing through wheel
End forms scribe line on the glass substrate, keeps liquid crystal parent panel (female by using the claw unit being mounted in support device
Substrate) rim charge, and rim charge is separated and is abandoned.
However, having problems in that in the related technology, the specific device construction for removing waste material is not disclosed sufficiently
And the structure for effectively supporting and adjusting claw (chuck) unit.
Summary of the invention
This invention address that a kind of waste material removal device and the scribing equipment with the waste material removal device are provided, it can
Waste material is effectively removed during the scribing processes of substrate.
Meanwhile waste material is likely to be present in the rear side of mother substrate and the front side of mother substrate, thereby increases and it is possible to which there are such problems:
If supporting the component of multiple claw units sagging, cannot be effectively removed useless at the front side and rear side for being present in mother substrate
Material.
Therefore, the present invention is also actively working to provide a kind of waste material removal device and the scribing with the waste material removal device is set
It is standby, the waste material of the front side and rear side that are present in substrate can be effectively removed.
The exemplary embodiment of the present invention provides a kind of waste material removal device for from substrate removal waste material, the waste materials
Removal device includes: the first clamping array comprising multiple clamping units；Clamping unit installation unit, is equipped with first thereon
Clamping array；And support unit, supporting clamping unit installation unit, wherein clamping unit has the fixture for keeping waste material,
And the height of fixture can be conditioned.
Clamping unit installation unit can revolvably be supported by support unit.In addition, support unit can be along at least one side
To movement.
Clamping unit can include: clamp base；Chuck body is installed on clamp base；Fixture, setting are being pressed from both sides
Have on ontology；And fixture driving unit, operate fixture.
Waste material removal device may also include height adjusting unit, and the height adjusting unit alignment jig ontology is relative to fixture
The height of base portion.
Waste material removal device may also include the second clamping array, which dividually sets with the first clamping array
It sets on clamping unit installation unit, and including multiple clamping units.
First clamping array can remove front waste material from substrate, and the second clamping array can remove rear portion waste material from substrate.
First clamping array and the second clamping array can be provided about the rotation axis of clamping unit installation unit at
Predetermined angular.First clamping array and the second clamping array can around clamping unit installation unit rotation axis at being equal to or
Angle less than 90 degree and be arranged on clamping unit installation unit.
Another exemplary embodiment of the invention provides a kind of scribing equipment comprising: the first delivery unit and second
Delivery unit transports substrate；Slicing unit forms scribe line on substrate；And waste material removal device, removal is by drawing
The waste material of blade unit separation, wherein waste material removal device includes: the first clamping array comprising multiple clamping units；Clamping is single
First installation unit is equipped with the first clamping array thereon；And support unit, support clamping unit installation unit；Clamping is single
Member has the fixture for keeping waste material, and the height of fixture can be conditioned.
Waste material removal device may also include the second clamping array, be separately provided at clamping unit with the first clamping array
On installation unit, and including multiple clamping units.
First clamping array and the second clamping array can around clamping unit installation unit rotation axis at being equal to or
Angle less than 90 degree and be arranged on clamping unit installation unit.
It, can be in base the present invention provides a kind of waste material removal device and the scribing equipment with the waste material removal device
Waste material is effectively removed in the scribing processes of plate.
In accordance with the invention it is possible to the characteristic of shape and waste material in response to substrate and effectively keep and remove waste material.
The present invention can provide a kind of waste material removal device and scribing equipments, wherein for removing front waste material from substrate
Clamping array and for from substrate removal rear portion waste material clamping array clamping unit installation unit is set apart from each other,
Therefore, waste material effectively can be removed without increasing device/equipment size from substrate.
General introduction above is merely exemplary, and is not intended to and is limited in any way.In addition to example described above
Except scheme, embodiment and feature, by reference to attached drawing and detailed description below, other schemes, embodiment and feature will become
It obtains obviously.
Detailed description of the invention
Fig. 1 is the signal for showing the scribing equipment with waste material removal device of the first exemplary embodiment according to the present invention
The view of construction.
Fig. 2 is the perspective view of the waste material removal device of the first exemplary embodiment according to the present invention.
Fig. 3 A- Fig. 3 B is the clamping shown in the waste material removal device that the first exemplary embodiment according to the present invention is arranged in
The view of unit.
Fig. 4 A- Fig. 4 B is the waste material removal device for explaining the scribing equipment of the first exemplary embodiment according to the present invention
Operation view.
Fig. 5 is the exemplary view for showing the sagging state of clamping unit installation unit.
Fig. 6 is the perspective view of the waste material removal device of the scribing equipment of the second exemplary embodiment according to the present invention.
Fig. 7 A- Fig. 7 B is the waste material removal shown by using the scribing equipment of the second exemplary embodiment according to the present invention
Device removes the view of the process of waste material from mother substrate.
It should be understood that the drawings are not necessarily drawn to scale, the various features of basic principle of the invention are presented
Illustrative slightly simplified expression.It is disclosed herein, including for example specific size, orientation, the present invention of location and shape
Specific design feature will partly be determined by specific intended application and use environment.
In the accompanying drawings, appended drawing reference indicates identical or equal parts of the invention from beginning to end in some figures of attached drawing.
Specific embodiment
Hereinafter, it will be described in detail with reference to the accompanying drawings exemplary embodiment of the present invention.Firstly, in the composition to each figure
When element marks appended drawing reference, it is noted that even if showing constituent element in different drawings, but if it is possible,
Then identical constituent element will be presented with like reference characters.In addition, in the following description of the present invention, when determination is retouched in detail
It states when may subject of the present invention not known, the detailed description of the known construction merged herein or function will be omitted.
In addition, exemplary embodiment of the present invention explained below, but the technical spirit not limited to this of the present invention, and can be by ability
Field technique personnel modify and various implementations.
Fig. 1 is the signal for showing the scribing equipment with waste material removal device of the first exemplary embodiment according to the present invention
The view of construction.Fig. 2 is the perspective view of the waste material removal device of the first exemplary embodiment according to the present invention.Fig. 3 A- Fig. 3 B is
The view of clamping unit in the waste material removal device that the first exemplary embodiment according to the present invention is arranged in is shown.
Scribing equipment 10 include transport mother substrate 1 the first delivery unit 12 and the second delivery unit 14, on mother substrate 1
It forms the slicing unit 16 of scribe line and removes the waste material removal device 20 of waste material 3 from mother substrate 1.
First delivery unit 12 and the second delivery unit 14 transport mother substrate 1, and the first delivery unit 12 and second transports
Unit 14 (such as can transport band, roller or workbench) in known manner and be configured to pass through while transporting mother substrate 1
Suction is to keep mother substrate 1.
Slicing unit 16 forms scribe line on mother substrate 1.Slicing unit 16 may include the first slicing unit 16a and second
Unit 16b is drawn, is respectively set at the upper side and lower side of mother substrate 1, so as in the upper and lower surfaces of mother substrate 1
On be formed simultaneously scribe line.Alternatively, slicing unit 16 can only have the first slicing unit 16a and the second slicing unit 16b
Any of, only to form scribe line on a surface of mother substrate 1.Slicing unit 16 may include in mother substrate
The wheel end (wheel tip) 18 of scribe line is formed on 1.However, slicing unit 16 can quilt as exemplary embodiment of the present invention
It is configured to transmitting laser beam.
After forming scribe line on mother substrate 1 by slicing unit 16, waste material removal device 20 is removed from mother substrate 1
Waste material 3.Waste material removal device 20 clamps waste material 3, waste material 3 is then moved and rotate, so that waste material 3 be separated from mother substrate 1.
Referring to Fig. 2, waste material removal device 20 includes: the first clamping array 100 comprising multiple clamping unit 40a, 40b,
40c and 40d；And clamping unit installation unit 22, support multiple clamping units 40.In addition, waste material removal device 20 includes:
Support unit 24 supports clamping unit installation unit 22 so that clamping unit installation unit 22 is rotatable；And driving unit,
It moves support unit 24 along at least one direction.
Clamping unit installation unit 22 is arranged along the x axis, and can be configured to have the beam of predetermined stiffness, bar or column
Shape.
Multiple clamping unit 40a, 40b, 40c and 40d may make up the clamping unit indicated by appended drawing reference 40.
Clamping unit 40a, 40b, 40c and 40d are mounted on clamping unit installation unit 22 in which can be fixed, or are mounted
At removable along predetermined direction.As exemplary embodiment, the first clamping unit 40a and the 4th clamping unit 40d can be constructed
At along the first clamping unit guiding piece 42a and the second clamping unit guiding piece being arranged on clamping unit installation unit 22
42b is moved in the X-axis direction.In this case, the first clamping unit drive motor 44a provides driving power so that the first folder
It holds unit 40a to move in the X-axis direction along the first clamping unit guiding piece 42a, the second clamping unit drive motor 44b is provided
Drive power so that the 4th clamping unit 40d is moved in the X-axis direction along the second clamping unit guiding piece 42b.Meanwhile second
Clamping unit 40b and third clamping unit 40c can be fixed clamping unit installation unit 22.Fig. 2 shows the first clamping battle arrays
There are four clamping unit 40a to 40d for the setting of column 100, but can increase or decrease the number of clamping unit 40a to 40d as needed
Amount.
Clamping unit installation unit 22 is pivotably supported by support unit 24, and support unit 24, which is equipped with, makes clamping unit
The rotary unit 26 that installation unit 22 rotates.Support unit 24 may be disposed at the two sides of clamping unit installation unit 22.Rotation
Unit 26 may include at least one gear of electric motor and the driving power for transmitting electric motor.
Clamping unit installation unit 22 can move in Y-axis and Z-direction.As exemplary embodiment, support unit 24
It can be moved in the Z-axis direction by Z axis driving unit 30 along Z axis guiding piece 28.In addition, Z axis guiding piece 28 can be drawn by Y-axis
It leads connection unit 32 and is connected to Y-axis guiding piece 34, and can be moved in the Y-axis direction by Y-axis driving unit 36.
Referring to Fig. 3 A- Fig. 3 B, clamping unit 40 includes: clamp base 42；Chuck body 46, is installed in clamp base
On 42；A pair of of fixture 50 is arranged in chuck body 46；And fixture driving unit 44, operate fixture 50.
Fixture 50 includes the first fixture 50a and the second fixture 50b facing with each other, in the first fixture 50a and the second fixture
Engagement pad 52 can be equipped on the part of 50b contacted with the waste material 3 of substrate 1.Engagement pad 52 can be by such as polyurethane
(urethane) material is made.
Fixture driving unit 44 may include electric motor.Fixture 50 can such as schemed by the operation of fixture driving unit 44
It operates under opening state shown in 3A, and is operated under hold mode as shown in Figure 3B.
Meanwhile clamping unit 40 may also include height adjusting unit 48.As exemplary embodiment, height adjusting unit 48
It may be constructed such that the form of spiral (screw, lead screw).It can be by 48 alignment jig ontology 46 of height adjusting unit relative to folder
Has the height of base portion 42.The height of the fixture 50 of multiple clamping unit 40a to 40d is adjusted by height adjusting unit 48 respectively, is made
It is multiple when the proper multiple clamping unit 40a to 40d being arranged on clamping unit installation unit 22 keep the waste material 3 of mother substrate 1
Clamping unit 40a to 40d can be kept uniformly on waste material 3.
It can be gone before waste material removal device 20 starts operation or in waste material removal device 20 from the mother substrate 1 of predetermined the piece number
After waste material, the height of the fixture 50 of multiple clamping unit 40a to 40d is adjusted.
Fig. 4 A- Fig. 4 B is the waste material removal device for explaining the scribing equipment of the first exemplary embodiment according to the present invention
Operation view.
The first clamping array is used in the state that mother substrate 1 is loaded on the first delivery unit 12 referring to Fig. 4 A
100 to remove front waste material 3A from mother substrate 1.Support unit 24 moves in Y-axis and Z-direction, and front waste material 3A is by first
Clamping array 100 is kept, and then, clamping unit installation unit 22 is based on the edge Fig. 4 A- Fig. 4 B and makes a reservation for clockwise or counterclockwise
Angle or support unit 24 move in Y-axis or Z-direction, to remove front waste material 3A from mother substrate 1.
Referring to Fig. 4 B, in the state that mother substrate 1 is transported to the second delivery unit 14 from the first delivery unit 12, use
First clamping array 100 to remove waste material 3B in rear portion from mother substrate 1.For this purpose, single by support in clamping unit installation unit 22
In the state of 24 support of member, clamping unit installation unit 22 rotates 180 degree.Rear portion waste material 3B is kept by the first clamping array 100,
Then the rotation of clamping unit installation unit 22 or support unit 24 move in Y-axis or Z-direction, thus by rear portion waste material 3B
It is separated from mother substrate 1.
However, in the case where clamping unit installation unit 22 is sagging, operation shown in Fig. 4 A- Fig. 4 B possibly can not be by
Accurate control.
Fig. 5 is the exemplary view for showing the sagging state of clamping unit installation unit.
Support unit 24 at the both ends by clamping unit installation unit 22 is arranged in is single to support clamping unit to install
In the state of member 22, the central part of clamping unit installation unit 22 may be sagging downwards.Setting clamping unit 40a extremely
The height of fixture 50 on 40d is set in the state of removal front waste material 3A, when clamping unit installation unit 22 rotates 180
When spending rear portion waste material 3B to remove, the height of the fixture 50 of clamping unit 40a to 40d may not allow accurately to keep rear portion
Waste material 3B.
The second exemplary embodiment of the present invention provides a kind of waste material removal device 200, can effectively go from mother substrate 1
Except front waste material 3A and rear portion waste material 3B, and the area that waste material removal device 200 occupies is not increased.
Fig. 6 is the perspective view of the waste material removal device of the scribing equipment of the second exemplary embodiment according to the present invention.
It below will be based on describing with the difference of waste material removal device 20 shown in Fig. 2 according to the second exemplary embodiment
Waste material removal device 200.
Waste material removal device 200 includes: the first clamping array 100, installs list in clamping unit along first direction setting
In member 22；And second clamping array 110, it is arranged in a second direction.
First clamping array 100 and the second clamping array 110 can be provided about the rotation of clamping unit installation unit 22
Shaft axis is at predetermined angular.
First clamping array 100 may include the first clamping unit to the 4th clamping unit 40a, 40b, 40c and 40d, second
Clamping array 110 may include the 5th clamping unit to the 8th clamping unit 40e, 40f, 40g and 40h.
It can including the 5th clamping unit to the 8th clamping unit 40e, 40f, 40g and 40h in the second clamping array 110
It is fixed to clamping unit installation unit 22, or is mounted to move in the X-axis direction.
Fig. 7 A- figure B is the waste material removal device shown using the scribing equipment of the second exemplary embodiment according to the present invention
From the view of the process of mother substrate removal waste material.
Referring to Fig. 7 A, the front waste material 3A of mother substrate 1 is kept and removed by the first clamping array 100.
Referring to Fig. 7 B, the rear portion waste material 3B of mother substrate 1 is kept and removed by the second clamping array 110.As clamping is single
The rotation of the state shown in Fig. 7 A of first installation unit 22, clamping unit installation unit 22 can be rotated to the second clamping array 110 guarantor
Hold the position of rear portion waste material 3B.
The height quilt of fixture 50 including the clamping unit 40a to 40d in the first clamping array 100 in the Z-axis direction
It is adjusted to be suitable for keeping and remove front waste material 3A.In addition, clamping unit 40e to 40h included in the second clamping array 110
The height in the Z-axis direction of fixture 50 be adjusted to be suitable for keeping and removal rear portion waste material 3B.That is, in the first clamping array
In 100, the height of the position in the X-axis direction clamping unit 40a to 40d and/or fixture 50 is adjusted to before accurately keeping
Portion waste material 3A.Moreover, in the second clamping array 110, the position in the X-axis direction clamping unit 40e to 40f and/or fixture
50 height is adjusted to accurately keep rear portion waste material 3B.
As exemplary embodiment, the first clamping array 100 and the second clamping array 110 are disposed about clamping unit
The rotation axis of installation unit 22 is at the angle for being less than 180 degree.In order to minimize the area occupied by waste material removal device 200
Increase, the angle formed between the first clamping array 100 and the second clamping array 110 can be set equal to or less than 90 degree.
The waste material removal device 200 of the second exemplary embodiment is characterized in that according to the present invention, for going from mother substrate 1
110 edge of the second clamping array except the first clamping array 100 of front waste material 3A and for removing waste material 3B in rear portion from mother substrate 1
Different directions are arranged on clamping unit installation unit 22.Second exemplary embodiment according to the present invention, can not only be effectively
Waste material 3 is removed from mother substrate 1, moreover it is possible to reduce the occupied area of device/equipment, device/equipment overall structure will not be made multiple
Hydridization.
As described above, exemplary embodiment is described and is shown in the accompanying drawings and the description.Exemplary embodiment is selected
Select and describe to explain certain principles and its practical application of the invention, thus enable those skilled in the art manufacture and benefit
With various exemplary embodiments of the invention and its various alternatives and modifications.By in the description of front, it is obvious that of the invention
Some schemes are not limited by exemplary detail shown in this article, it can thus be anticipated that those skilled in the art will think
It is modified and applied to other or it is equivalent.However, after reference book and attached drawing, many changes, modifications of present construction,
Variation and other use and using will become obvious to those skilled in the art.Be considered as it is all these without departing from
The changes, modifications of the spirit and scope of the present invention, variation and other use and using being only limited by the claims which follow
The present invention is covered.
Claims (10)
1. a kind of waste material removal device from substrate removal waste material, the waste material removal device include:
First clamping array comprising multiple clamping units；
Clamping unit installation unit is equipped with first clamping array thereon；And
Support unit supports the clamping unit installation unit,
Wherein, the clamping unit has the fixture for keeping waste material, and the height of the fixture can be conditioned.
2. waste material removal device according to claim 1, wherein the clamping unit installation unit is by the support unit
Revolvably support.
3. waste material removal device according to claim 2, wherein the support unit can move at least one direction
It is dynamic.
4. waste material removal device according to claim 1, wherein the clamping unit includes: clamp base；Fixture sheet
Body is installed on the clamp base；The fixture is arranged in the chuck body；And fixture driving unit,
It operates the fixture.
5. waste material removal device according to claim 4, further includes:
Height adjusting unit adjusts height of the chuck body relative to the clamp base.
6. according to claim 1 to waste material removal device described in any one of 5, further includes:
Second clamping array is separately positioned on the clamping unit installation unit with first clamping array, and is wrapped
Include multiple clamping units.
7. waste material removal device according to claim 6, wherein first clamping array removes front from the substrate
Waste material, second clamping array remove rear portion waste material from the substrate.
8. waste material removal device according to claim 6, wherein first clamping array and second clamping array
The rotation axis of the clamping unit installation unit is provided about into predetermined angular.
9. waste material removal device according to claim 6, wherein first clamping array and second clamping array
It is single to be arranged on the clamping at the angle equal to or less than 90 degree around the rotation axis of the clamping unit installation unit
On first installation unit.
10. a kind of scribing equipment, comprising:
First delivery unit and the second delivery unit transport substrate；
Slicing unit forms scribe line on the substrate；And
Waste material removal device according to claim 1 to 9 removes the waste material separated by the slicing unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0139190 | 2017-10-25 | ||
| KR1020170139190A KR102010756B1 (en) | 2017-10-25 | 2017-10-25 | Dummy removing device and scribing apparatus having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109704556A true CN109704556A (en) | 2019-05-03 |
Family
ID=66253694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711383098.3A Pending CN109704556A (en) | 2017-10-25 | 2017-12-20 | Waste material removal device and scribing equipment with the waste material removal device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102010756B1 (en) |
| CN (1) | CN109704556A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102231457B1 (en) * | 2019-10-30 | 2021-03-24 | 엠에스테크놀러지 주식회사 | Cutting apparatus for pressuring substrate edge |
| KR102304575B1 (en) * | 2019-11-11 | 2021-09-24 | 주식회사 탑 엔지니어링 | End material removing unit and method of removing end material by using the same |
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| JP4402883B2 (en) * | 2001-01-17 | 2010-01-20 | 三星ダイヤモンド工業株式会社 | Dividing device, dividing system and dividing method |
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- 2017-10-25 KR KR1020170139190A patent/KR102010756B1/en active IP Right Grant
- 2017-12-20 CN CN201711383098.3A patent/CN109704556A/en active Pending
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| CN1856392A (en) * | 2003-09-24 | 2006-11-01 | 三星钻石工业株式会社 | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| CN1953853A (en) * | 2004-03-15 | 2007-04-25 | 三星钻石工业株式会社 | Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method |
| JP2015044722A (en) * | 2013-08-29 | 2015-03-12 | 三星ダイヤモンド工業株式会社 | Parting mechanism |
| CN204643127U (en) * | 2015-05-18 | 2015-09-16 | 江苏卡斯美特铸造科技有限公司 | A kind of positioning machine for the production of porcelain filter half-blank blank |
| CN105058603A (en) * | 2015-08-12 | 2015-11-18 | 深圳市华星光电技术有限公司 | Cutoff device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102010756B1 (en) | 2019-08-19 |
| KR20190046069A (en) | 2019-05-07 |
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