CN109703052A - The production method of conducting foam mechanism - Google Patents
The production method of conducting foam mechanism Download PDFInfo
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- CN109703052A CN109703052A CN201811573381.7A CN201811573381A CN109703052A CN 109703052 A CN109703052 A CN 109703052A CN 201811573381 A CN201811573381 A CN 201811573381A CN 109703052 A CN109703052 A CN 109703052A
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- foam
- plates
- melt adhesive
- hot melt
- conducting foam
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Abstract
The invention discloses a kind of production methods of conducting foam mechanism, the conducting foam mechanism includes conducting foam, the conductive fabric for being wrapped in the conducting foam outer surface, comprising the following steps: the foam is cut into multiple plates of the first pre-set dimension by set of molds；In dustfree environment, to the surface coating hot-melt adhesive of each plates under the first preset temperature range；The plates for making surface be coated with hot melt adhesive are in the case of the second preset temperature range, until the hot melt adhesive infiltrates into the hole of the plates；After in the hole that the hot melt adhesive infiltrates into the plates within a preset range, the plates are punched by set of molds by the second required pre-set dimension；The conductive fabric is wrapped in the surface of the plates of the second pre-set dimension, to form the conducting foam mechanism.The present invention includes at least following advantages: can adjust the hardness of foam, can preferably be cut into the conducting foam of smaller size, structure optimization.
Description
Technical field
The present invention relates to conducting foam technical field, a kind of particularly production method of conducting foam mechanism.
Background technique
The description of this part, which is only provided, discloses relevant background information to the present invention, without constituting the prior art.
Conventional conducting foam at present, is that conductive fabric is wrapped up on foam, its surface is made to have good electric conductivity, assembly
It is one of the settling mode of most common solution electromagnetic wave shielding interference in required space.It is more and more thinner small in electronic module
In the design space gently changed, reserved size is smaller and smaller, needs smaller Product Assembly.Current conducting foam small dimension on the market
It is confined to 2 × 2mm, it can not be small again.Less it is applicable in increasingly narrower space.
It should be noted that the above description of the technical background be intended merely to it is convenient to technical solution of the present invention carry out it is clear,
Complete explanation, and facilitate the understanding of those skilled in the art and illustrate.Cannot merely because these schemes of the invention
Background technology part is expounded and thinks that above-mentioned technical proposal is known to those skilled in the art.
Summary of the invention
In order to overcome the defects of the prior art, the embodiment of the invention provides a kind of production sides of conducting foam mechanism
Method can adjust the hardness of foam, can preferably be cut into the conducting foam of smaller size, structure optimization.
The embodiment of the present application discloses: a kind of production method of conducting foam mechanism, and the conducting foam mechanism includes leading
Electric foam, the conductive fabric for being wrapped in the conducting foam outer surface, comprising the following steps:
The foam is cut into multiple plates of the first pre-set dimension by set of molds；
In dustfree environment, to the surface coating hot-melt adhesive of each plates under the first preset temperature range；
The plates for making surface be coated with hot melt adhesive are in the case of the second preset temperature range, until the hot melt adhesive is seeped
Thoroughly extremely in the hole of the plates；
After in the hole that the hot melt adhesive infiltrates into the plates within a preset range, by set of molds by described
Shape body is punched into the second required pre-set dimension；
The conductive fabric is wrapped in the surface of the plates of the second pre-set dimension, to form the conducting foam machine
Structure.
Further, the coating thickness of the hot melt adhesive is between 0.01-0.2mm.
Further, during coating the hot melt adhesive, by the hot melt adhesive by the way of same direction blade coating
It is uniformly coated on one of surface of the foam.
Further, first preset temperature is between 85-100 DEG C, second preset temperature 70-85 DEG C it
Between.
Further, second pre-set dimension is between 0.5 × 0.5-1.5 × 1.5mm.
Further, during the hot melt glue penetration, the one side that the foam is coated with hot melt adhesive is set upward
It sets, and pushes the foam that default winding direction is taken to be moved.
Further, the default winding direction the following steps are included:
It pushes the foam to accelerate in upward direction to designated position, then pushes the foam in a downwardly direction at the uniform velocity
Move to initial position；
Foam uniform rotation multi-turn clockwise along the vertical direction is driven, the foam vertically side is being driven
To uniform rotation same number of turns counterclockwise.
By above technical solution, beneficial effects of the present invention are as follows: by being coated on the surface of the plates
Hot melt adhesive, since the surface of plates has multiple holes, the hot melt adhesive of liquid can infiltrate into plates along hole, etc.
To after hot melt adhesive curing, it can preferably increase the hardness of plates, it can by the plates so as to pass through set of molds
It is punched into lesser size, and can guarantee the high-precision of the punching of plates.
For above and other objects, features and advantages of the invention can be clearer and more comprehensible, preferred embodiment is cited below particularly,
And cooperate institute's accompanying drawings, it is described in detail below.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the method flow diagram in the embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
It should be noted that in the description of the present invention, term " first ", " second " etc. are used for description purposes only and distinguish
Similar object between the two and is not present sequencing, can not be interpreted as indication or suggestion relative importance.In addition,
In description of the invention, unless otherwise indicated, the meaning of " plurality " is two or more.
As shown in connection with fig. 1, a kind of production method of conducting foam mechanism, the conducting foam are disclosed in present embodiment
Mechanism includes conducting foam, the conductive fabric for being wrapped in the conducting foam outer surface, comprising the following steps: by set of molds by institute
State multiple plates that foam cuts into the first pre-set dimension；
In dustfree environment, to the surface coating hot-melt adhesive of each plates under the first preset temperature range；
The plates for making surface be coated with hot melt adhesive are in the case of the second preset temperature range, until the hot melt adhesive is seeped
Thoroughly extremely in the hole of the plates；
After in the hole that the hot melt adhesive infiltrates into the plates within a preset range, by set of molds by described
Shape body is punched into the second required pre-set dimension；
The conductive fabric is wrapped in the surface of the plates of the second pre-set dimension, to form the conducting foam machine
Structure.
In present embodiment, by being coated with hot melt adhesive on the surface of the plates, since the surface of plates has
The hot melt adhesive of multiple holes, liquid can infiltrate into plates along hole, after hot melt adhesive curing, can preferably increase
Add the hardness of plates, so as to which the plates can be punched into lesser size by set of molds, and can guarantee
The high-precision of the punching of plates.
In following step: in dustfree environment, to the surface of each plates under the first preset temperature range
Coating hot-melt adhesive.Specifically, first preset temperature is between 85-100 DEG C of range.At this temperature, the hot melt adhesive
It flows, and then can be easier to infiltrate into the plates.Preferably, first preset temperature is controlled at 90 DEG C
When, the hot melt adhesive can rapidly infiltrate into the plates.Herein, it during coating the hot melt adhesive, uses
The hot melt adhesive is uniformly coated on one of surface of the foam by the mode of same direction blade coating.
In another optional embodiment, the coating thickness of the hot melt adhesive is between 0.01-0.2mm.This implementation
In mode, for preferably the two ratio relation at 0.11, the hardness of the conducting foam is most suitable, and infiltrates into described
Hot melt adhesive in foam will not impact the normal work of the foam.
In another optional embodiment, during the hot melt glue penetration, the foam is coated with heat
The one side of melten gel is arranged upward, and pushes the foam that default winding direction is taken to be moved.The default winding direction packet
It includes following steps: the foam being pushed to accelerate in upward direction to designated position, then push the foam in a downwardly direction
Uniform motion is to initial position；Foam uniform rotation multi-turn clockwise along the vertical direction is driven, described in driving
Foam uniform rotation same number of turns counterclockwise along the vertical direction.In present embodiment, the numerical value of preferably acceleration is
The circle number of 0.02m/s, the rotation enclose for 3 circle clockwise, counterclockwise 3.By above-mentioned default winding direction, on the one hand can
Accelerate the infiltration of the hot melt adhesive, on the other hand can guarantee the uniformity of the hot melt glue penetration.
In following step: when surface being made to be in the second preset temperature range coated with the plates of hot melt adhesive, directly
It is infiltrated into the hole of the plates to the hot melt adhesive.Specifically, second preset temperature is between 70-85 DEG C.?
At a temperature of this, the hot melt adhesive still has and can penetrate into the intracorporal mobility of the sheet, and during infiltration, crosses and carries out
Preliminary solidification process, at this point, the hot melt adhesive be in while flowing, while cured state.Pass through the control of above-mentioned temperature, a side
Face can guarantee that the hot melt adhesive curing to improve the validity of the foam hardness, on the other hand shortens the production cycle.
In following step, in the hole that the hot melt adhesive infiltrates into the plates within a preset range after, pass through
The plates are punched into the second required pre-set dimension by set of molds.Specifically, view can be selected in the detection of the preset range
Feel detection components.Preferably another surface of plates (this surface is oppositely arranged with the plates surface for being coated with hot melt adhesive)
It is provided with vision-based detection component, the vision-based detection component is by another surface that CCD camera lens is used to shoot the plates
The no hot melt adhesive for having infiltration indicates that the hot melt adhesive has permeated completion when detecting with the hot melt adhesive.Certainly, this
Place can also be stated with tired with no restrictions herein to whether the hot melt adhesive permeates completion using other detection devices.
In another optional embodiment, second pre-set dimension is between 0.5 × 0.5-1.5 × 1.5mm.
Specific embodiment is applied in the present invention, and principle and implementation of the present invention are described, above embodiments
Explanation be merely used to help understand method and its core concept of the invention；At the same time, for those skilled in the art,
According to the thought of the present invention, there will be changes in the specific implementation manner and application range, in conclusion in this specification
Appearance should not be construed as limiting the invention.
Claims (7)
1. a kind of production method of conducting foam mechanism, which is characterized in that the conducting foam mechanism includes conducting foam, package
Conductive fabric in the conducting foam outer surface, comprising the following steps:
The foam is cut into multiple plates of the first pre-set dimension by set of molds；
In dustfree environment, to the surface coating hot-melt adhesive of each plates under the first preset temperature range；
The plates for making surface be coated with hot melt adhesive are in the case of the second preset temperature range, until the hot melt adhesive infiltrates into
In the hole of the plates；
After in the hole that the hot melt adhesive infiltrates into the plates within a preset range, by set of molds by the plates
It is punched into the second required pre-set dimension；
The conductive fabric is wrapped in the surface of the plates of the second pre-set dimension, to form the conducting foam mechanism.
2. the production method of conducting foam mechanism as described in claim 1, which is characterized in that the coating thickness of the hot melt adhesive
Between 0.01-0.2mm.
3. the production method of conducting foam mechanism as described in claim 1, which is characterized in that in the mistake for coating the hot melt adhesive
Cheng Zhong, using same direction blade coating by the way of the hot melt adhesive is uniformly coated on the foam one of surface on.
4. the production method of conducting foam mechanism as described in claim 1, which is characterized in that first preset temperature exists
Between 85-100 DEG C, second preset temperature is between 70-85 DEG C.
5. the production method of conducting foam mechanism as described in claim 1, which is characterized in that second pre-set dimension exists
Between 0.5 × 0.5-1.5 × 1.5mm.
6. the production method of conducting foam mechanism as described in claim 1, which is characterized in that in the mistake of the hot melt glue penetration
The one side that the foam is coated with hot melt adhesive is arranged Cheng Zhong upward, and pushes the foam that default winding direction is taken to carry out
Movement.
7. the production method of conducting foam mechanism as claimed in claim 6, which is characterized in that the default winding direction includes
Following steps:
It pushes the foam to accelerate in upward direction to designated position, then pushes foam uniform motion in a downwardly direction
To initial position；
Drive foam uniform rotation multi-turn clockwise along the vertical direction, drive the foam along the vertical direction around
Counter clockwise direction uniform rotation same number of turns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811573381.7A CN109703052A (en) | 2018-12-21 | 2018-12-21 | The production method of conducting foam mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811573381.7A CN109703052A (en) | 2018-12-21 | 2018-12-21 | The production method of conducting foam mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109703052A true CN109703052A (en) | 2019-05-03 |
Family
ID=66257167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811573381.7A Pending CN109703052A (en) | 2018-12-21 | 2018-12-21 | The production method of conducting foam mechanism |
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| Country | Link |
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| CN (1) | CN109703052A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112750573A (en) * | 2021-01-14 | 2021-05-04 | 深圳市鑫诺诚科技有限公司 | Preparation method of sigma-type partially-wrapped grounding foam |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201210788Y (en) * | 2008-06-05 | 2009-03-18 | 深圳市鸿富诚屏蔽材料有限公司 | High speed molding machine for conductive shielding gascket |
| CN103629286A (en) * | 2012-08-27 | 2014-03-12 | 深圳富泰宏精密工业有限公司 | Foam assembly, manufacturing method thereof, and electronic device using same |
-
2018
- 2018-12-21 CN CN201811573381.7A patent/CN109703052A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201210788Y (en) * | 2008-06-05 | 2009-03-18 | 深圳市鸿富诚屏蔽材料有限公司 | High speed molding machine for conductive shielding gascket |
| CN103629286A (en) * | 2012-08-27 | 2014-03-12 | 深圳富泰宏精密工业有限公司 | Foam assembly, manufacturing method thereof, and electronic device using same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112750573A (en) * | 2021-01-14 | 2021-05-04 | 深圳市鑫诺诚科技有限公司 | Preparation method of sigma-type partially-wrapped grounding foam |
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| CB02 | Change of applicant information |
Address after: 215300 No.99, Shunchang Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Longyang Electronics (Kunshan) Co.,Ltd. Address before: 215300 No.99, Shunchang Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Applicant before: LONG YOUNG ELECTRONICS (KUNSHAN) Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190503 |