CN109698305B - Electrical bridging element, electrical energy store and device - Google Patents
Electrical bridging element, electrical energy store and device Download PDFInfo
- Publication number
- CN109698305B CN109698305B CN201811242346.7A CN201811242346A CN109698305B CN 109698305 B CN109698305 B CN 109698305B CN 201811242346 A CN201811242346 A CN 201811242346A CN 109698305 B CN109698305 B CN 109698305B
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- electrical
- housing
- bridging element
- circuit board
- reaction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/572—Means for preventing undesired use or discharge
- H01M50/574—Devices or arrangements for the interruption of current
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Fuses (AREA)
Abstract
An electrical bridging element (1) having at least one first and one second electrical conductor (3, 9), a reaction foil (7), a solder layer (4) and a circuit board (6) which electrically insulates the electrical conductors (3, 9) from one another, wherein the reaction foil (7), the circuit board (6) and the solder layer (4) are arranged between the electrical conductors (3, 9) in such a way that the reaction foil (7) melts the solder layer (4) in an exothermic reaction, so that the solder of the solder layer (4) establishes an electrically conductive connection between the electrical conductors (3, 9).
Description
Technical Field
The invention relates to an electrical bridging element, an electrical energy store and a device.
Background
US 2016/0233479 A1 shows a secondary battery having an electric safety module with a circuit board in a housing.
Disclosure of Invention
The invention proceeds from an electrical bridging element having at least one first and one second electrical conductor, a reaction foil, a solder layer and a printed circuit board, which insulates the electrical conductors from one another, wherein the reaction foil, the printed circuit board and the solder layer are arranged between the electrical conductors in such a way that the reaction foil melts the solder layer in an exothermic reaction, so that the solder of the solder layer establishes an electrically conductive connection between the electrical conductors.
The background of the invention is that the circuit board is used as an integrated design element which serves both as an electrically insulating layer between the electrical conductors and as a reaction element for the reaction foil. In this case, the circuit board can be electrically bridged by means of the solder, so that the electrical conductors are connected in an electrically conductive manner. Thus, components can be saved and the manufacture of the electrical bridging element is facilitated.
According to one advantageous embodiment, the circuit board has at least one line which is connected to a contact surface for contacting the reaction wafer. Advantageously, the lines are arranged on an inner layer of the circuit board, so that they are spaced apart from the reaction wafer and are connected to the reaction wafer only by means of the contact surfaces. This results in a point contact between the reaction disk and the contact surface, which results in a local increase in the current density, which improves the ignition of the reaction disk.
Advantageously, the contact surface is embodied as a projection from the line, wherein the contact surface is embodied integrally with the line. A low electrical resistance between the line and the contact surface is thus achieved.
It is also advantageous if the contact surface has a narrowing cross section, in particular decreasing with increasing spacing from the line. As a result, the contact surface between the contact surface and the reaction wafer can be reduced, so that a local increase in the current density is achieved, which improves the ignition of the reaction wafer.
It is furthermore advantageous if the contact surface is arranged at an end region of the line, in particular wherein the cross section of the line decreases towards the contact surface. A high electrical conductivity in the line towards the contact surface is thus achieved, so that the current density increases towards the contact surface.
According to an advantageous embodiment, the electrical connecting element has a housing with an interior and at least one housing part, wherein the housing surrounds the reaction foil, the circuit board and the solder layer at least partially, forming a housing. It is advantageous here if the housing encloses the reactive layer of the electrical bridging element. Thereby, the reactive layer of the electrical bridging element is protected from particles and/or moisture in the environment.
It is also advantageous if the circuit board and the lines arranged thereon extend through the housing into the interior of the housing. This results in a low electrical resistance between the external connection of the bridging element and the reaction wafer. The reaction time of the bridging element can thus be shortened.
Advantageously, the circuit board has a contact region, wherein the contact region is connected to the contact surface by means of a line, wherein the contact region is arranged outside the housing and the contact surface is arranged inside the housing. Whereby the circuit board can be used for contacting the reaction wafer, wherein a voltage source can be connected to the contact area.
It is also advantageous if the electrical bridging element has a spring element which is provided to press the contact surface against the reaction wafer. A reliable electrical contacting of the reaction wafer during the service life of the electrical bridging element is thus achieved. Furthermore, the reliability of the electrical bridge elements is improved.
The spring element is advantageously embodied as a helical spring, in particular wherein the helical spring is partially accommodated in a hollow-cylindrical recess of the housing part. In this way, a secure placement of the helical spring on the housing part is achieved.
It is also advantageous if the housing is formed by at least one housing part, a seal and an electrical conductor, wherein the interior of the housing is designed to be fluid-tight. Thereby, the reactive layer of the electrical bridging element is protected from particles and/or moisture in the environment.
It is furthermore advantageous if the circuit board has a further line, a connection surface for contacting one of the electrical conductors, and a further contact region, wherein the further line electrically conductively connects the connection surface to the further contact region, in particular wherein the connection surface is arranged within the housing and the further contact region is arranged outside the housing. The circuit board can thereby be used for contacting the electrical conductors. Advantageously, all external connection ends of the bridging element can therefore be connected to the circuit board.
In the case of an electrical energy store having at least one energy storage unit and at least one electrical bridging element as described above, the core of the invention is: the electrical bridging element is arranged in parallel with at least one energy storage unit of the electrical energy store.
The invention is based on the object of providing a short-circuit connection of the energy storage unit in a critical state by means of the bridging element. As a result, the separators in the cells melt and overheating of the energy storage cells, for example due to a short circuit or due to a critical state of charge, can be avoided.
The core of the invention, in terms of equipment and/or vehicles, is: the device and/or the vehicle has an energy storage as described above.
The invention is based on the object of providing a bridging element by means of which the energy store can be short-circuited in critical vehicle conditions. For example, the bridge element is connected indirectly or directly to the vehicle sensor, which detects a critical vehicle condition, which triggers the bridge element and can therefore place the energy store in a safe state.
Drawings
In the following sections, the invention is explained with the aid of an exemplary embodiment, from which further features according to the invention can be derived, but the invention is not limited to these features in its framework. Embodiments of which are shown in the drawings.
Fig. 1 is an exploded view of a first embodiment of an electrical bridging element 1 according to the present invention;
fig. 2 is a top view of a first embodiment of an electrical bridging element 1 according to the present invention;
fig. 3 is a cross-sectional view of a first embodiment of an electrical bridging element 1 according to the present invention;
fig. 4 is a top view of a second embodiment of an electrical bridging element 101 according to the present invention;
fig. 5 is a cross-sectional view of a second embodiment of an electrical bridging element 101 according to the present invention;
fig. 6 shows the circuit board 6 of the electrical bridging element (1, 101) according to the invention;
fig. 7 is a detailed view of a first embodiment of a track 17 having a contact surface 11 on the circuit board 6;
FIG. 8 is a detailed view of a second embodiment of a trace 217 having a contact surface 211 on the circuit board 6;
FIG. 9 is a detailed view of a third embodiment of a circuit 317 having a contact surface 311 on the circuit board 6;
FIG. 10 is a schematic cross-sectional view of an electrical bridging element (1, 101) according to the present invention, an
Fig. 11 is a detail view of a schematic cross-section of an electrical bridging element (1, 101) according to the present invention.
Detailed Description
Fig. 1 to 3 show a first exemplary embodiment of an electrical bridge element 1 according to the invention.
The electrical bridging element 1 has a first electrical conductor 3 and a second electrical conductor 9, each having a solder layer 4, a reaction foil 7, a circuit board 6, which electrically insulates the electrical conductors (3, 9) from one another, and a housing having two housing parts (2, 10).
The housing encloses an inner space of the housing, in which the reaction foil 7, the circuit board 6 and the solder layer 4 are accommodated at least partially, forming a housing.
The housing parts (2, 10) are connected to each other in a clamping manner (klipsverbinden). The housing part 2 has a clamping connection section and the other housing part 10 has a mating clamping connection section, which each project from the respective housing part (2, 10).
The electrical conductors (3, 9) extend through the housing into the interior space of the housing. The housing is fluid-tightly embodied. For this purpose, a seal 5 is arranged in each case on the electrical conductors (3, 9), preferably the seal 5 is injection-molded onto the respective electrical conductor (3, 9). The seal 5 is arranged between the electrical conductor (3, 9) and the housing part (2, 10) in such a way that the electrical conductor (3, 9), the housing part (2, 10) and the seal 5 form the fluid-tight housing. Preferably, the seal 5 has silicon and/or the seal is embodied as an adhesive seal (klebstuffdichtmitel).
The solder layer 4, the reaction foil 7 and the printed circuit board 6 are arranged in a stack, in particular as a layer stack, between the electrical conductors (3, 9). Preferably, the layer stack is connected with the first and/or second electrical conductor (3, 9) by means of an adhesive 8. The solder layer 4 and the reaction foil 7 extend in a direction transverse to the stacking direction of the layer stack further than the circuit board 6, so that the solder layer 4 is electrically insulated from one another by means of the circuit board 6 and the air cavity 14. In order to connect the electrical conductors (3, 9) in an electrically conductive manner, the molten solder flows through an air chamber 14 next to the circuit board 6
The layer thickness of the respective solder layer 4 is 5 μm to 400 μm, preferably 10 μm to 200 μm.
Preferably, the layer thicknesses of the solder layers 4 are the same. Advantageously, the respective solder layer 4 can be applied to the first or second conductor (3, 9) in the working section. Preferably, the solder layer 4 comprises a solder material containing tin.
The thickness of the circuit board 6 is between 25 μm and 200 μm, preferably between 50 μm and 120 μm.
The reaction wafer 7 is arranged between the solder layer 4 and the circuit board 6, the solder layer 4 being arranged on the first electrical conductor 3. On the printed circuit board 6, tracks (17, 217, 317) are arranged, from which contact surfaces (11, 211, 311) for contacting the reaction wafer 7 protrude, said contact surfaces being formed integrally with the tracks (17, 217, 317).
The circuit board 6 and the lines (17, 217, 317) extend through the housing into the interior space of the housing. The circuit board 6 has at least one contact area 13 and/or a further contact area 19, which are each arranged outside the housing. The contact region 13 is connected to the contact surface (11, 211, 311) by means of a line (17, 217, 317). A further line 18 connects a further contact region 19 to the connection region 12 for electrically conductive connection to an electrical conductor (3, 9), which is preferably arranged within the housing.
The reaction foil 7 is, for example, a reactive layer stack having a plurality of nanolayers, wherein the nanolayers have a layer thickness of 1nm to 500 nm. The reacted layer stack has alternating nanolayers, as described, for example, in WO 01/83182.
The line (17, 217, 317) is connected to the first connection of the voltage source by means of a switching element, in particular a MOSFET switch. The second connection of the voltage source is electrically conductively connected to one of the electrical conductors (3, 9) which is electrically conductively connected to the reaction foil 7. The second connection of the voltage source can be electrically conductively connected to the reaction foil 5 by means of contacts and switching elements, in particular MOSFET switches.
At least one spring element is arranged inside the housing part (2, 10) and presses on the layer stack, in particular wherein the spring element presses the printed circuit board 6 with the contact surface (11, 211, 311) against the reaction wafer 7. Preferably, the spring element is embodied as a helical spring, in particular wherein the helical spring is partially accommodated in a hollow-cylindrical recess of the housing part (2, 10).
By activating the reaction foil 7, an exothermic reaction is triggered, which at least partially melts at least one solder layer 4. The molten solder of the solder layer 4 penetrates the air cavity 14 next to the circuit board 6 and establishes an electrically conductive connection between the electrical conductors (3, 9).
Fig. 4 and 5 show a second embodiment of an electrical bridging element 101 according to the present invention.
In contrast to the first exemplary embodiment, the housing of the second exemplary embodiment has two housing parts (102, 110), which are connected to one another in a force-transmitting manner by means of a spring element 115. The spring element 115 is implemented in a U-shape, wherein the housing is arranged between two legs of the spring element 115. Each housing part (102, 110) has a recess (einkerrbung) in each case, into which the spring element 115 can be clamped.
Fig. 6 shows a detailed view of the circuit board 6. The printed circuit board 6 has at least one line 17 which connects the contact surface 11 to the contact region 13, and at least one further line 18 which connects a further contact region 19 to the contact surface 12.
The circuit board 6 is implemented as a flexible circuit board or a rigid-flex circuit board (Starrflex-leiterpattern) or a semi-flexible circuit board (Semiflex-leiterpattern).
Fig. 7 to 9 show three different variants of the line (17, 217, 317) with corresponding contact surfaces (11, 211, 311) in detail. The contact surface (11, 211, 311) is formed integrally with the line (17, 217, 317) and protrudes from the line (17, 217, 317). The contact surface (11, 211, 311) has a smaller surface than the line (17, 217, 317). The contact surfaces (11, 211, 311) are arranged in the end regions of the lines (17, 217, 317).
Fig. 7 shows a first variant of the line 17. The line 17 has a rectangular end region. The contact surface 11 is of rectangular design, wherein the side surfaces of the contact surface 11 and the side surfaces of the end regions of the lines 17 are arranged parallel to one another, in particular wherein the side surfaces touch one another.
Fig. 8 shows a second variant of the line 217. The cross section of the line 217 decreases toward the contact surface 211, in particular wherein the end region is trapezoidal, in particular symmetrically trapezoidal. The contact surface 211 is arranged at the narrowest point of the line 217.
A third variant of said line 317 is shown in fig. 9. The contact surface 311 has a narrowing cross section which decreases with increasing spacing from the line 317. The contact surface 311 is embodied, for example, as a pyramid or a hemisphere.
Fig. 10 and 11 show schematic cross-sectional views of a layer stack. Between the electrical conductors (3, 9) a solder layer 4 is arranged, which is separated from one another by means of the circuit board 6 and the reaction foil 7. The air chamber 14 extends from a solder layer 4 to the reaction wafer 7. In the interior of the printed circuit board 6, a line 17 is arranged, i.e. on an inner layer (innencage) of the printed circuit board 6, which is connected to the reaction wafer 7 by means of the contact surface 11.
The described use of the electrical connecting element (1, 101) according to the invention for energy storage can also be used in vehicle technology, but also in stationary applications, such as energy technology, in particular solar energy technology and/or wind energy technology and/or hydro energy technology.
Claims (14)
1. An electrical bridging element (1, 101) having at least one first (3) and one second (9) electrical conductor, a reaction foil (7), a solder layer (4) and a circuit board (6) which electrically insulates the first (3) and second (9) electrical conductors from one another,
wherein the reaction foil (7), the circuit board (6) and the solder layer (4) are arranged between the first electrical conductor (3) and the second electrical conductor (9) in such a way that the reaction foil (7) melts the solder layer (4) in an exothermic reaction, so that the solder of the solder layer (4) establishes an electrically conductive connection between the first electrical conductor (3) and the second electrical conductor (9),
wherein the circuit board (6) serves as an electrically insulating layer between the electrical conductors and as a reaction element for the reaction foil (7).
2. Electrical bridging element (1, 101) according to claim 1, characterized in that the circuit board (6) has at least one line (17, 217, 317) which is connected to a contact surface (11, 211, 311) on the circuit board (6) for contacting the reaction wafer (7).
3. Electrical bridging element (1, 101) according to claim 2, characterized in that the contact surface (11, 211, 311) is embodied as a protrusion from the line (17, 217, 317),
wherein the contact surface (11, 211, 311) is formed integrally with the line (17, 217, 317).
4. Electrical bridging element (1, 101) according to claim 2 or 3,
it is characterized in that the preparation method is characterized in that,
the contact surface (11, 211, 311) has a narrowing cross section which decreases with increasing distance from the line (17, 217, 317).
5. Electrical bridging element (1, 101) according to claim 2 or 3, characterized in that the contact face (11, 211, 311) is arranged at an end region of the line (17, 217, 317),
wherein the cross-section of the line (17, 217, 317) decreases towards the contact surface (11, 211, 311).
6. Electrical bridging element (1, 101) according to claim 2, characterized in that the electrical bridging element (1, 101) has a housing with an interior space and at least one housing part (2, 10, 102, 110), wherein the housing at least partially forms a housing surrounding the reaction wafer (7), the circuit board (6) and the solder layer (4).
7. Electrical bridging element (1, 101) according to claim 6, characterized in that the circuit board (6) and the lines (17, 217, 317) arranged thereon extend through the housing into the interior space of the housing.
8. Electrical bridging element (1, 101) according to claim 7, characterized in that the circuit board (6) has a contact area (13), wherein the contact area (13) is connected to the contact surface (11, 211, 311) on the circuit board (6) by means of the line (17, 217, 317),
wherein the contact area (13) is arranged outside the housing and the contact surface (11, 211, 311) is arranged inside the housing.
9. Electrical bridging element (1, 101) according to any of claims 6 to 8,
the electrical bridging element has a spring element (15) which is provided to press the contact surface (11, 211, 311) against the reaction wafer (7),
wherein the elastic element (15) is embodied as a helical spring, wherein the helical spring is partially accommodated in a hollow cylindrical recess of the housing part (2, 10, 102, 110).
10. Electrical bridging element (1, 101) according to any of claims 6 to 8,
the housing is formed by at least one housing part (2, 10, 102, 110), a seal (5) and a first electrical conductor (3) and a second electrical conductor (9), wherein the interior of the housing is designed to be fluid-tight.
11. Electrical bridging element (1, 101) according to claim 8,
the circuit board (6) has a further line (18), a connection surface (12) for contacting one of the first electrical conductor (3) and the second electrical conductor (9), and a further contact region (19),
wherein the further line (18) electrically conductively connects the connection surface (12) to the further contact region (19),
wherein the connection face (12) is arranged within the housing and the further contact region (19) is arranged outside the housing.
12. Electrical energy store having at least one energy storage unit and at least one electrical bridging element (1) according to one of claims 1 to 11,
it is characterized in that the preparation method is characterized in that,
the electrical bridging element (1) is arranged in parallel with at least one energy storage cell of the energy store.
13. Device with at least one energy store according to claim 12.
14. Vehicle having at least one energy store according to claim 12.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017218920.7A DE102017218920A1 (en) | 2017-10-24 | 2017-10-24 | Electrical bridging element, electrical energy storage and device |
| DE102017218920.7 | 2017-10-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109698305A CN109698305A (en) | 2019-04-30 |
| CN109698305B true CN109698305B (en) | 2022-11-22 |
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ID=65996307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811242346.7A Active CN109698305B (en) | 2017-10-24 | 2018-10-24 | Electrical bridging element, electrical energy store and device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109698305B (en) |
| DE (1) | DE102017218920A1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101546820A (en) * | 2008-03-28 | 2009-09-30 | 三星Sdi株式会社 | Protective circuit board and battery pack using the same |
| CN101635288A (en) * | 2008-07-24 | 2010-01-27 | 赛米控电子股份有限公司 | System with power semiconductor module and connection device |
| CN102017186A (en) * | 2008-05-09 | 2011-04-13 | 山一电机株式会社 | Connection box, uses of a connection box and method |
| CN102238806A (en) * | 2010-04-28 | 2011-11-09 | 富葵精密组件(深圳)有限公司 | Circuit board module |
| DE102015222939A1 (en) * | 2015-11-20 | 2017-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Electrical bridging device for bridging electrical components, in particular an energy source or an energy consumer |
| CN107026136A (en) * | 2016-02-01 | 2017-08-08 | 赛米控电子股份有限公司 | Apply the power semiconductor modular and its arrangement of body with pressure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR0110528A (en) | 2000-05-02 | 2004-03-09 | Univ Johns Hopkins | Method of manufacturing a independently reactive multilayer sheet |
| DE102012005979B4 (en) | 2012-03-23 | 2013-11-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Electric bridging element and energy storage with the bridging element |
| KR101650027B1 (en) | 2013-09-27 | 2016-08-22 | 주식회사 엘지화학 | Secondary Battery Pack Having PCM |
-
2017
- 2017-10-24 DE DE102017218920.7A patent/DE102017218920A1/en active Pending
-
2018
- 2018-10-24 CN CN201811242346.7A patent/CN109698305B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101546820A (en) * | 2008-03-28 | 2009-09-30 | 三星Sdi株式会社 | Protective circuit board and battery pack using the same |
| CN102017186A (en) * | 2008-05-09 | 2011-04-13 | 山一电机株式会社 | Connection box, uses of a connection box and method |
| CN101635288A (en) * | 2008-07-24 | 2010-01-27 | 赛米控电子股份有限公司 | System with power semiconductor module and connection device |
| CN102238806A (en) * | 2010-04-28 | 2011-11-09 | 富葵精密组件(深圳)有限公司 | Circuit board module |
| DE102015222939A1 (en) * | 2015-11-20 | 2017-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Electrical bridging device for bridging electrical components, in particular an energy source or an energy consumer |
| CN107026136A (en) * | 2016-02-01 | 2017-08-08 | 赛米控电子股份有限公司 | Apply the power semiconductor modular and its arrangement of body with pressure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109698305A (en) | 2019-04-30 |
| DE102017218920A1 (en) | 2019-04-25 |
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Effective date of registration: 20220616 Address after: Stuttgart, Germany Applicant after: ROBERT BOSCH GmbH Address before: Stuttgart, Germany Applicant before: LITHIUM ENERGY AND POWER GmbH & Co.KG |
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