CN109696612B - Double-pulse test system and method for IGBT module for automobile - Google Patents
Double-pulse test system and method for IGBT module for automobile Download PDFInfo
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Abstract
The invention discloses a double-pulse test system and a test method of an IGBT module for an automobile, wherein the test system is integrated with a test loop, a drive control circuit and a test temperature adjusting device, the IGBT module to be tested is arranged in the test loop, the drive control circuit is connected with the drive end of the IGBT module to be tested, the test loop provides adjustable test voltage and test current for the IGBT module to be tested during testing, the drive control circuit provides required double pulses as test pulses for the IGBT module to be tested, and the temperature of the IGBT module to be tested is increased or reduced and adjusted through the test temperature adjusting device so as to be adjusted to a required test temperature value; the test method is a test method using the test system. The invention can simultaneously meet the requirement of double-pulse testing of the automobile-grade IGBT module under the working conditions of high temperature, low temperature and extreme temperature, and has the advantages of simple testing operation, low required cost, high system integration level, high testing efficiency and the like.
Description
Technical Field
The invention relates to the technical field of testing of an Insulated Gate Bipolar Transistor (IGBT) module for an automobile, in particular to a double-pulse testing system and a testing method of the IGBT module for the automobile.
Background
With the increasing exhaustion of fossil fuels and the increasing severity of environmental problems, the automotive field is gradually replacing conventional automobiles with electric automobiles represented by hybrid power, pure electric automobiles and fuel cell automobiles, wherein new energy automobiles represented by electric automobiles become an important development direction of the automobile industry. The electric vehicle mainly uses a battery as an energy source, and is wholly or partially driven by a motor, and can be divided into a pure Electric Vehicle (EV), a Hybrid Electric Vehicle (HEV) and a fuel cell electric vehicle, wherein the motor, a motor controller and the like are used as energy flow systems of the new energy vehicle and play a vital role in the whole new energy vehicle, and an IGBT module is used as a conversion component for converting a direct current power supply into an alternating current power supply and is a core component in the motor controller, so the performance reliability of the whole performance of the vehicle is directly influenced on the performance of the IGBT module.
The power density of a motor controller in an automobile is higher, so that automobile-grade IGBT modules are specially configured automobile-grade modules, the power density of the automobile-grade IGBT modules is higher than that of a conventional IGBT module, the automobile-grade IGBT modules are usually integrated by six chips, and the IGBT modules are IGBT modules with PINFIN structures or IGBT modules with radiators. In order to ensure the stable performance of the IGBT module, dynamic testing of the IGBT module is usually required, and the double-pulse testing is a crucial test link in dynamic testing such as turn-on and turn-off of the IGBT module.
At present, an automobile-grade IGBT module is still in a primary research stage, application research on the automobile-grade IGBT module is less, double-pulse testing for the automobile-grade IGBT module is generally directly carried out in a normal-temperature environment, namely the problem of temperature working conditions is not generally considered, and dynamic parameters of the IGBT module are directly tested and obtained in the normal-temperature environment. The environment which the automobile can be applied to is very complex, if the environment can be a high-temperature environment, the environment can also be a low-temperature environment, even the environment can be an extremely high-temperature working condition or an extremely low-temperature working condition, for the small current of the IGBT module, the low-temperature condition can seriously affect the reverse recovery performance of the diode, the high-temperature environment can cause very severe influence on the turn-on process and the turn-off process of the IGBT switch, the mode of carrying out the double-pulse test on the automobile-level IGBT module only through the normal-temperature test is lacked in the temperature environment condition, the dynamic parameter state of the IGBT module can not be accurately reflected by the dynamic parameter obtained through the test, and when the environment is applied to the high-temperature environment, the low-temperature environment or the extreme-temperature environment. If an IGBT module in a high-temperature environment needs to be tested, one solution is to adopt a high-temperature box or an environment box, but when the high-temperature box or the environment box is adopted, the temperature resistance requirement of the mode of the high-temperature box or the environment box on acquisition equipment is higher, the test difficulty is higher, the acquisition of test data is more difficult, and the actual operation is not convenient.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: aiming at the technical problems in the prior art, the invention provides a double-pulse test system and a double-pulse test method for an automobile IGBT module, which can meet the double-pulse test requirements of the automobile IGBT module under the working conditions of high temperature, low temperature and extreme temperature, and have the advantages of simple test operation, low required cost, high system integration level and high test efficiency.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
the utility model provides a dipulse test system of IGBT module for car, is provided with test circuit, drive control circuit and test temperature adjusting device including the integration, the IGBT module under test set up in the test circuit, drive control circuit with the drive end of IGBT module under test is connected, and during the test circuit provides adjustable test voltage, test current for the IGBT module under test, drive control circuit provides required dipulse and gives the IGBT module under test as test pulse, through test temperature adjusting device rises or reduces the regulation with the temperature of IGBT module under test to adjust to required test temperature value.
As a further improvement of the system of the invention: the test temperature adjusting device comprises a heating module for increasing the test temperature and a refrigerating module for reducing the test temperature, and the heating module or the refrigerating module is started to adjust the test temperature during testing.
As a further improvement of the system of the invention: the heating module comprises a heating plate, a plurality of honeycomb-shaped connecting holes are formed in the heating plate, and the pinfin array in the substrate of the tested IGBT module is inserted into each connecting hole in a matched mode, so that the substrate of the tested IGBT module is in full contact with the heating plate.
As a further improvement of the system of the invention: a heatable medium is filled between the connecting hole and the inserted pinfin array.
As a further improvement of the system of the invention: the heating module comprises a heating plate and a middle switching layer, a plurality of honeycomb-shaped connecting holes are formed in the middle switching layer, the heating plate is connected with the substrate of the tested IGBT module through the middle switching layer, pinfin arrays in the substrate of the tested IGBT module are inserted into the connecting holes in a matched mode, and therefore the substrate of the tested IGBT module is in full contact with the heating plate.
As a further improvement of the system of the invention: the refrigeration module is an adjustable liquid cooling heat dissipation system.
As a further improvement of the system of the invention: the heating module and the refrigeration module are connected with each other through a control module, and the control module is used for acquiring a control instruction and controlling and starting the heating module or the refrigeration module.
As a further improvement of the system of the invention: the test loop comprises a direct-current power supply unit, a voltage stabilizing unit, a discharging loop, a tested IGBT module and a variable load unit which are sequentially connected, and the test voltage and the test current of the tested IGBT module are adjusted by adjusting the output load of the variable load unit.
As a further improvement of the system of the invention: the voltage stabilizing unit comprises a voltage stabilizing capacitor; the discharging loop comprises a control switch and a discharging resistor, and the discharging resistor is controlled to be connected to the discharging circuit through the control switch to discharge.
As a further improvement of the system of the invention: the drive control circuit comprises a double-pulse generator unit, a control unit and a drive unit which are connected in sequence, the pulse generator unit generates required double pulses, and after the control unit generates corresponding PWM signals, the drive unit sends the PWM signals to an upper pipe and a lower pipe of the IGBT module to be tested respectively to control the on-off.
The invention further provides a test method of the double-pulse test system, which comprises the following steps:
s1, acquiring a target test temperature and a current environment temperature of a test to be executed;
s2, comparing the obtained target test temperature with the current environment temperature, if the target test temperature is higher than the current environment temperature, controlling to start a heating module used for increasing the test temperature in the test temperature adjusting device, and if the target test temperature is lower than the current environment temperature, controlling to start a refrigerating module used for reducing the test temperature in the test temperature adjusting device;
and S3, after the current environment temperature reaches the target test temperature, starting the test loop to provide the required test voltage and test current and driving the control circuit to provide the required double-pulse signal to the IGBT module to be tested so as to test the dynamic parameters of the IGBT module to be tested at the target test temperature.
As a further improvement of the process of the invention: and step S3, adjusting the test temperature, the test voltage and the test current provided to the IGBT module to be tested, so as to obtain dynamic parameter curves of the IGBT module to be tested at different test temperatures.
Compared with the prior art, the invention has the advantages that:
1) according to the invention, the double-pulse test system is formed by integrally arranging the test loop, the drive control circuit and the test temperature adjusting device, so that double-pulse tests can be respectively carried out on the automobile-level IGBT module under the working conditions of high temperature, low temperature and extreme temperature, and the requirements of the high-temperature, low-temperature and extreme high-temperature or extreme low-temperature double-pulse tests on the automobile-level IGBT module can be simultaneously met, so that the influence of different temperatures on dynamic parameters of the IGBT module can be obtained through the tests, the dynamic parameters obtained through the tests can accurately reflect the dynamic parameter state of the IGBT module, the performance reliability of the automobile-level IGBT module under various temperature environments can be ensured, and the whole test operation process is simple through an integrally arranged mode, and test data can be conveniently obtained, so that the high;
2) the heating module and the refrigerating module are integrated and arranged at the same time, when a high-temperature test is required to be executed, the heating module is started to adjust the temperature, when a low-temperature test is required to be executed, the refrigerating module is started to adjust the temperature, the test operation is simple, and the requirements of the high-temperature test and the low-temperature test can be met at the same time;
3) the invention further considers the special structure of the automobile-grade IGBT module, and the honeycomb-shaped connecting holes are arranged on the heating plate, the connecting holes are matched with the pinfin array in the substrate of the IGBT module to be tested, and the pinfin array in the substrate of the IGBT module to be tested is inserted into the connecting holes in a matching manner, so that the substrate of the IGBT module to be tested can be fully contacted with the heating plate, the heating effect is effectively improved, the required test temperature can be accurately achieved, and the test precision of the double-pulse test is ensured.
Drawings
Fig. 1 is a schematic structural diagram of a double-pulse test system of an IGBT module for an automobile according to embodiment 1 of the present invention.
Fig. 2 is a schematic structural view of a heating module in embodiment 1 of the present invention.
Fig. 3 is a schematic structural diagram of a test loop and a drive control circuit in embodiment 1 of the present invention.
Fig. 4 is a schematic structural view of a heating module in embodiment 2 of the present invention.
Illustration of the drawings: 1. testing the loop; 2. a drive control circuit; 3. testing the temperature regulating device; 31. a heating module; 311. heating plates; 312. an intermediate transfer layer; 32. a refrigeration module; 4. connecting holes; 5. a substrate of the IGBT module to be tested; 51. pinin array.
Detailed Description
The invention is further described below with reference to the drawings and specific preferred embodiments of the description, without thereby limiting the scope of protection of the invention.
Example 1:
as shown in fig. 1, the double-pulse test system of the IGBT module for the vehicle of this embodiment includes an integrated test circuit 1, a drive control circuit 2 and a test temperature adjusting device 3, the tested IGBT module is disposed in the test circuit 1, the drive control circuit 2 is connected to the drive end of the tested IGBT module, the test circuit 1 provides adjustable test voltage and test current for the tested IGBT module during testing, the drive control circuit 2 provides required double-stroke as test pulse for the tested IGBT module, the temperature of the tested IGBT module is increased or decreased and adjusted through the test temperature adjusting device 3, so as to adjust to a required test temperature value.
In the embodiment, the test loop 1, the drive control circuit 2 and the test temperature adjusting device 3 are integrated to form a double-pulse test system, the test loop 1 provides adjustable test voltage and test current to the tested IGBT module, the drive control circuit 2 provides required double pulses as test pulses to the tested IGBT module, and the test temperature adjusting device 3 is combined to increase or decrease the temperature of the tested IGBT module, so that double-pulse tests can be respectively performed on the automobile IGBT module under high-temperature, low-temperature and extreme-temperature working conditions, the requirements of the automobile IGBT module on the high-temperature, low-temperature and extreme-high-temperature or extreme-low-temperature double-pulse tests can be simultaneously met, the influence of different temperatures on dynamic parameters of the IGBT module can be tested, such as the influence on the switching-on and switching-off processes of a device at the limit temperature, and the dynamic parameters obtained by the test can accurately reflect the dynamic parameter state of the IGBT module, therefore, the performance reliability of the automobile-grade IGBT under various temperature environments is guaranteed, the whole test operation process is simple through an integrated setting mode, test data can be conveniently obtained, and efficient double-pulse test is achieved.
In this embodiment, the test temperature adjusting device 3 includes a heating module 31 for increasing the test temperature and a cooling module 32 for decreasing the test temperature, and the heating module 31 or the cooling module 32 is started to adjust the test temperature during the test. Through integrated setting heating module 31, the refrigeration module 32 simultaneously, when high temperature test is carried out to needs, start heating module 31 and carry out temperature regulation, when low temperature test is carried out to needs, start refrigeration module 32 and carry out temperature regulation, test operation is simple, can satisfy high temperature, low temperature test demand simultaneously.
As shown in fig. 2, the heating module 31 in this embodiment includes a heating plate 311, the heating plate 311 is a planar plate structure, a plurality of connecting holes 4 in a honeycomb shape are provided on the heating plate 311, i.e. a honeycomb heating plate is formed, and the pinfin array 51 in the substrate 5 of the IGBT module under test is inserted into each connecting hole 4 in a matching manner, so that the substrate 5 of the IGBT module under test is in full contact with the heating plate 311.
Because IGBT is the PINFEN structure among the car level IGBT module, PINFIN array 51 distributes on the base plate of module, the IGBT module substrate is the structure of unevenness promptly, and traditional hot plate is the planar plate structure usually, if direct set up the substrate of IGBT module on traditional hot plate, the IGBT module is because there is the clearance between PINFEN structure can and the hot plate, unable abundant contact, make the heating effect poor, it is difficult to accurately reach the test temperature of required test, the result that leads to the dipulse test has great test error. This embodiment is through considering car level IGBT module's special PINFIN structure, through be provided with a plurality of connecting holes 4 that are the honeycomb on heating plate 311, PINFIN array 51 matches each other in each connecting hole 4 and the base plate 5 of the IGBT module under test, PINFIN array 51 matches and inserts to each connecting hole 4 in the base plate 5 of the IGBT module under test in 5, make the base plate 5 and the heating plate 311 of the IGBT module under test fully contact, can zero clearance contact between base plate 5 and the heating plate 311 of the IGBT module under test promptly, effectively improve the heating effect, can be convenient the accuracy reach required test temperature, thereby guarantee the test accuracy of dipulse test.
In this embodiment, a heatable medium is filled between the connection hole 4 and the inserted pinfin array 51, and the medium may specifically be oil, high-temperature liquid, or high-temperature paste medium, or may be other heatable media. That is, oil, high temperature liquid or high temperature paste medium is filled between the honeycomb structure of the heating plate 311 and the IGBT module pinin contact to realize various high temperature simulation.
With the heating module 31 of the above structure, high temperature simulation between normal temperature and 175 ℃ can be achieved.
In this embodiment, the refrigeration module 32 is specifically an adjustable liquid cooling heat dissipation system, and the adjustable liquid cooling heat dissipation system can control and adjust the temperature through control. The adjustable liquid cooling heat dissipation system can specifically realize temperature adjustment under the condition of normal temperature to minus 40 ℃, and can realize simulation tests under various temperature working conditions within the range of minus 40 ℃ to 175 ℃ by combining the heating module 31.
In this embodiment, the test device further includes a control module connected to the heating module 31 and the refrigeration module 32, and configured to obtain a control instruction, control to start the heating module 31 or the refrigeration module 32, and implement automatic switching between high-temperature and low-temperature tests through the control module.
As shown in fig. 3, the test circuit 1 in this embodiment specifically includes a dc power supply unit, a voltage stabilizing unit, a discharging circuit, a tested IGBT module, and a variable load unit, which are connected in sequence, and adjusts the test voltage and the test current of the tested IGBT module by adjusting the output load of the variable load unit; the voltage stabilizing unit is specifically a voltage stabilizing capacitor, the discharge loop comprises a control switch and a discharge resistor, and the control switch controls the access discharge resistor to discharge.
As shown in fig. 3, in the present embodiment, the driving control circuit 2 includes a double-pulse generator unit, a control unit and a driving unit, which are connected in sequence, the pulse generator unit generates the required double pulses, and after the control unit generates the corresponding PWM signals, the driving unit sends the PWM signals to the upper tube and the lower tube of the IGBT module to be tested, respectively, so as to control the on/off of the IGBT module. The double-pulse generator unit is characterized in that a software program of the pulse generator function is loaded in the upper computer, a double-pulse time constant can be adjusted and set according to actual requirements, the control unit is specifically provided with a control board, and the driving unit is specifically provided with a driving board.
When the device works, a direct-current input power supply and a voltage stabilizing capacitor are used as direct-current energy input, the adjustable load ensures the simulation of the on-off working condition of the IGBT module under various voltage and current conditions, after the discharge loop releases the stored energy in the capacitor after the experiment is finished, the upper computer sends the logic of double pulses to be issued to the control board, the PWM signal of the double pulses is generated by the control board and is issued to the drive board to control the on-off of an upper pipe or a lower pipe of the IGBT module.
In this embodiment, the test method using the above-mentioned double-pulse test system includes the steps of:
s1, acquiring a target test temperature and a current environment temperature of a test to be executed;
s2, comparing the obtained target test temperature with the current environment temperature, if the target test temperature is higher than the current environment temperature, controlling to start the heating module 31 for increasing the test temperature, and if the target test temperature is lower than the current environment temperature, controlling to start the refrigerating module 32 for reducing the test temperature;
and S3, after the current environment temperature reaches the target test temperature, starting the test loop 1 to provide the required test voltage and test current and driving the control circuit 2 to provide the required double-pulse signal to the IGBT module to be tested so as to test the dynamic parameters of the IGBT module to be tested at the target test temperature.
By the method, the needed high-temperature, low-temperature or extreme high-temperature and low-temperature environment double-pulse test can be conveniently executed on the automobile-level IGBT module, the test process is simple, the test efficiency is high, and the complete influence of different temperatures on the dynamic parameters of the IGBT can be obtained.
In this embodiment, step S3 is followed by a step of adjusting the test temperature, the test voltage and the test current provided to the IGBT module to be tested, so as to obtain dynamic parameter curves of the IGBT module to be tested at different test temperatures, and the relationship and the variation trend between the dynamic parameters of the IGBT and the temperature can be visually obtained from the dynamic parameter curves of the IGBT module to be tested at different test temperatures, so that the state of the dynamic parameters of the IGBT module considering the temperature environment condition can be determined.
Example 2:
the present embodiment is substantially the same as embodiment 1, except that, in the present embodiment, the heating module 31 includes a heating plate 311 and an intermediate transfer layer 312, the heating plate 311 is of a planar plate structure, a plurality of connection holes 4 in a honeycomb shape are provided on the intermediate transfer layer 312, that is, a honeycomb transfer layer is added, the heating plate 311 is connected with the substrate 5 of the IGBT module under test through the intermediate transfer layer 312, and the pinin array 51 in the substrate 5 of the IGBT module under test is inserted into each connection hole 4 in a matching manner, so that the substrate 5 of the IGBT module under test is in full contact with the heating plate 311.
In this embodiment, the middle adapter layer 312 with a honeycomb structure is additionally provided to realize the matching connection between the heating plate 311 and the substrate of the IGBT module under test, and the structure of the heating plate 311 does not need to be changed.
The foregoing is considered as illustrative of the preferred embodiments of the invention and is not to be construed as limiting the invention in any way. Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention should fall within the protection scope of the technical scheme of the present invention, unless the technical spirit of the present invention departs from the content of the technical scheme of the present invention.
Claims (9)
1. A double-pulse test system of an IGBT module for an automobile is characterized by comprising a test loop (1), a drive control circuit (2) and a test temperature adjusting device (3), wherein the test IGBT module is arranged in the test loop (1), the drive control circuit (2) is connected with a driving end of the test IGBT module, the test loop (1) provides adjustable test voltage and test current for the test IGBT module during testing, the drive control circuit (2) provides required double pulses as test pulses for the test IGBT module, and the temperature of the test IGBT module is increased or decreased and adjusted through the test temperature adjusting device (3) so as to be adjusted to a required test temperature value;
the test temperature adjusting device (3) comprises a heating module (31) used for increasing the test temperature and a refrigerating module (32) used for reducing the test temperature, and the heating module (31) or the refrigerating module (32) is started to adjust the test temperature during testing;
the heating module (31) comprises a heating plate (311), a plurality of connecting holes (4) in a honeycomb shape are formed in the heating plate (311), and pinfin arrays (51) in a substrate (5) of the IGBT module to be tested are inserted into the connecting holes (4) in a matching mode, so that the substrate of the IGBT module to be tested is in full contact with the heating plate (311);
a heatable medium is filled between the connecting hole (211) and the inserted pinfin array (51).
2. The double-pulse test system of the IGBT module for the automobile according to claim 1, characterized in that: the heating module (31) further comprises an intermediate transfer layer (312), a plurality of honeycomb-shaped connecting holes (4) are formed in the intermediate transfer layer (312), the heating plate (311) is connected with the substrate (5) of the IGBT module to be tested through the intermediate transfer layer (312), and a pinfin array (51) in the substrate (5) of the IGBT module to be tested is inserted into each connecting hole (4) in a matched mode, so that the substrate (5) of the IGBT module to be tested is in full contact with the heating plate (311).
3. The double-pulse testing system of the IGBT module for the automobile as claimed in any one of claims 1-2, characterized in that the refrigeration module (32) is an adjustable liquid cooling heat dissipation system.
4. The double-pulse testing system of the IGBT module for the automobile as recited in any one of claims 1 to 2, further comprising a control module connected with the heating module (31) and the cooling module (32) and used for obtaining a control command and controlling the start of the heating module (31) or the cooling module (32).
5. The double-pulse test system of the IGBT module for the automobile as claimed in any one of claims 1-2, characterized in that the test loop (1) comprises a DC power supply unit, a voltage stabilizing unit, a discharging loop, the IGBT module to be tested and a variable load unit which are connected in sequence, and the test voltage and the test current of the IGBT module to be tested are adjusted by adjusting the output load of the variable load unit.
6. The double-pulse test system of the IGBT module for the automobile as recited in claim 5, wherein the voltage stabilization unit comprises a voltage stabilization capacitor; the discharging loop comprises a control switch and a discharging resistor, and the discharging resistor is controlled to be connected to the discharging circuit through the control switch to discharge.
7. The dipulse test system for the IGBT module for the automobile as recited in any one of claims 1 to 2, characterized in that said drive control circuit (2) comprises a dipulse generator unit, a control unit and a drive unit which are connected in sequence, said pulse generator unit generates the required dipulse, after the control unit generates the corresponding PWM signal, the PWM signal is respectively sent to the upper tube and the lower tube of the IGBT module to be tested through said drive unit to control the on-off.
8. A test method of a double pulse test system using the IGBT module for the vehicle as claimed in any one of claims 1 to 7, characterized by comprising the steps of:
s1, acquiring a target test temperature and a current environment temperature of a test to be executed;
s2, comparing the obtained target test temperature with the current environment temperature, controlling and starting a heating module (31) used for increasing the test temperature in the test temperature adjusting device (3) if the target test temperature is higher than the current environment temperature, and controlling and starting a refrigerating module (32) used for reducing the test temperature in the test temperature adjusting device (3) if the target test temperature is lower than the current environment temperature;
and S3, after the current environment temperature reaches the target test temperature, starting the test loop (1) to provide the required test voltage and test current and driving the control circuit (2) to provide the required double-pulse signal to the IGBT module to be tested so as to test the dynamic parameters of the IGBT to be tested at the target test temperature.
9. The test method of claim 8, wherein: and step S3, adjusting the test temperature, the test voltage and the test current provided to the IGBT module to be tested, so as to obtain dynamic parameter curves of the IGBT module to be tested at different test temperatures.
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| CN201710977042.4A CN109696612B (en) | 2017-10-19 | 2017-10-19 | Double-pulse test system and method for IGBT module for automobile |
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| CN202583362U (en) * | 2012-05-17 | 2012-12-05 | 复旦大学 | Experimental device for IGBT short circuit protection function detection |
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| CN104155587B (en) * | 2014-07-18 | 2017-05-10 | 浙江大学 | System and method for on-line detection of operating junction temperature of IGBT module |
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| CN104458799B (en) * | 2014-11-27 | 2017-08-22 | 天津大学 | A kind of method and apparatus of on-line measurement IGBT module transient thermal resistance |
| CN104952813A (en) * | 2015-07-01 | 2015-09-30 | 西安永电电气有限责任公司 | Heating plate and soldering method of IGBT (insulated gate bipolar transistor) module |
| CN105510792A (en) * | 2015-12-08 | 2016-04-20 | 同济大学 | Current transformer IGBT power module field double-pulse testing system and method |
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