CN109692707A - From absorption catalyst composition and its manufacturing method of manufacturing method and electroless plating substrate - Google Patents
From absorption catalyst composition and its manufacturing method of manufacturing method and electroless plating substrate Download PDFInfo
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- CN109692707A CN109692707A CN201710995133.0A CN201710995133A CN109692707A CN 109692707 A CN109692707 A CN 109692707A CN 201710995133 A CN201710995133 A CN 201710995133A CN 109692707 A CN109692707 A CN 109692707A
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- Prior art keywords
- catalyst composition
- manufacturing
- silane compound
- substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 117
- 239000003054 catalyst Substances 0.000 title claims abstract description 88
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 73
- 239000000203 mixture Substances 0.000 title claims abstract description 65
- 238000007772 electroless plating Methods 0.000 title claims abstract description 51
- 238000010521 absorption reaction Methods 0.000 title claims abstract description 50
- 239000010415 colloidal nanoparticle Substances 0.000 claims abstract description 66
- -1 silane compound Chemical class 0.000 claims abstract description 57
- 229910000077 silane Inorganic materials 0.000 claims abstract description 53
- 239000002105 nanoparticle Substances 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 239000003223 protective agent Substances 0.000 claims abstract description 29
- 125000003368 amide group Chemical group 0.000 claims abstract description 23
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 70
- 239000000084 colloidal system Substances 0.000 claims description 15
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 14
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 14
- 229910052763 palladium Inorganic materials 0.000 claims description 11
- 239000000470 constituent Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 238000005253 cladding Methods 0.000 claims description 8
- 238000001465 metallisation Methods 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 229920002125 Sokalan® Polymers 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 7
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 238000006555 catalytic reaction Methods 0.000 claims description 6
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 6
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 5
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims description 5
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000004584 polyacrylic acid Substances 0.000 claims description 5
- 238000006884 silylation reaction Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 238000002444 silanisation Methods 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 3
- RRQTYXHHYIJDFB-UHFFFAOYSA-N n'-(triethoxysilylmethyl)hexane-1,6-diamine Chemical compound CCO[Si](OCC)(OCC)CNCCCCCCN RRQTYXHHYIJDFB-UHFFFAOYSA-N 0.000 claims description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 claims 1
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 40
- 238000000034 method Methods 0.000 description 24
- 239000011521 glass Substances 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910052681 coesite Inorganic materials 0.000 description 6
- 229910052906 cristobalite Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229910052682 stishovite Inorganic materials 0.000 description 6
- 229910052905 tridymite Inorganic materials 0.000 description 6
- 230000004913 activation Effects 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 241000209094 Oryza Species 0.000 description 4
- 235000007164 Oryza sativa Nutrition 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 235000009566 rice Nutrition 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 3
- 235000013339 cereals Nutrition 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- KOUONPVXNPOEHQ-UHFFFAOYSA-N 2-[dimethoxy(propyl)silyl]oxyacetamide Chemical compound CCC[Si](OC)(OC)OCC(N)=O KOUONPVXNPOEHQ-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 2
- 229910018536 Ni—P Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229910001868 water Inorganic materials 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FFORSBGYVQBPQQ-UHFFFAOYSA-N NCCCCCCNC[Si](OCC)(OCC)OCC.NCCCCCCNC(C)O[Si](OCC)(OCC)C Chemical compound NCCCCCCNC[Si](OCC)(OCC)OCC.NCCCCCCNC(C)O[Si](OCC)(OCC)C FFORSBGYVQBPQQ-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- GQZXNSPRSGFJLY-UHFFFAOYSA-N hydroxyphosphanone Chemical compound OP=O GQZXNSPRSGFJLY-UHFFFAOYSA-N 0.000 description 1
- 229940005631 hypophosphite ion Drugs 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- FIQAMKBXKOEHET-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine;n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN.CCO[Si](OCC)(OCC)CCCNCCN FIQAMKBXKOEHET-UHFFFAOYSA-N 0.000 description 1
- NHBRUUFBSBSTHM-UHFFFAOYSA-N n'-[2-(3-trimethoxysilylpropylamino)ethyl]ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCNCCN NHBRUUFBSBSTHM-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- GPNDARIEYHPYAY-UHFFFAOYSA-N palladium(ii) nitrate Chemical compound [Pd+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O GPNDARIEYHPYAY-UHFFFAOYSA-N 0.000 description 1
- 229920002627 poly(phosphazenes) Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 230000002311 subsequent effect Effects 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
- B01J31/06—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
- B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
- B01J23/44—Palladium
-
- B01J35/23—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
Abstract
The present invention discloses a kind of catalyst composition of absorption certainly, the certainly manufacturing method of absorption catalyst composition and the manufacturing method of electroless plating substrate.It include colloidal nanoparticles group and silane compound from absorption catalyst composition.Colloidal nanoparticles group includes Pd nano particle and the protective agent for coating Pd nano particle.Silane compound has an at least amido, and silane compound generates reciprocation by amido to roll into a ball with colloidal nanoparticles.Certainly absorption catalyst composition disclosed in this invention has the advantages that easily prepared.In addition to this, by from the use for adsorbing catalyst composition, being able to manufacture electroless plating substrate by environmental protection and easy manufacturing method, and ensure adhesion excellent between electroless plated metal layer and substrate.
Description
Technical field
The present invention relates to it is a kind of from absorption catalyst composition and its manufacturing method and electroless plating substrate manufacturing method,
More particularly to a kind of for described in the absorption catalyst composition certainly of electroless plating techniques and its manufacturing method and a kind of use
From the manufacturing method of the electroless plating substrate of absorption catalyst composition.
Background technique
In the technical field of substrate for forming metallization by electroless plating techniques, it is heavy in electroless plated metal to generally require
Catalyst is used in product program, and this catalyst is mostly the catalyst for belonging to palladium catalyst system.For example, tin can be used
The catalyst such as palladium colloid (acid Sn/Pd colloid) or alkali ion palladium carry out electroless plated metal deposition procedure.It is above two
Business palladium catalyst respectively has advantage and disadvantage, for example, the tin ion for being located at periphery in acidity Sn/Pd colloid is easy after contacting with the air
Oxidation occurs and has the shortcomings that stability is bad, and if washing parameter setting after this catalyst upon activation it is improper, easily formation Sn
(OH)2Or Sn (OH)4Colloid and cause that the chemical layers of copper being subsequently formed is coarse and is not inconsistent demand.In addition, alkali ion palladium catalyst
Requirement to pH value range is more harsh, and precipitating is also easy to produce if pH value is too low, and relatively, pH value is excessively high, will affect activation effect
Fruit.
Therefore, in the art, in relation to the catalyst and relevant electroless plating substrate for electroless plating techniques
Manufacturing method also has space to be modified.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of from adsorption catalyst group in view of the deficiencies of the prior art
At object, has the function of to be grafted (grafting) simultaneously and be catalyzed two kinds of (catalyzing), and single leaching can be passed through
It applies (dipping) program and is arranged at the substrate surface for being intended to metallize.
In order to achieve the above object, a wherein technical solution of the present invention is to provide a kind of from adsorption catalyst
Constituent comprising colloid nanoparticle group and a silane compound.The colloidal nanoparticles group includes a palladium nanometer
One protective agent of particle and the cladding Pd nano particle.The silane compound has an at least amido, and the silane
Compound generates reciprocation by least one amido to roll into a ball with the colloidal nanoparticles.
Further, the protective agent be selected from by blocked with trimethoxy silicon propyl poly- ethamine, polyvinyl alcohol,
Polyvinylpyrrolidone, polyacrylic acid and its etc. any combination composed by group.
Further, the protective agent is the polyphosphazene polymer with the molecular weight between 5,000 to 10,000
Close object.
Further, the silane compound has 1 to 3 amido.
Further, the silane compound is selected from by following composed group: three ethoxy of 3- aminopropyl
Base silane, N- aminoethyl -3- aminopropyl triethoxysilane, N- (6- Aminohexyl) amino methyl triethoxysilane, diethyl
Three aminocarbonyl propyl trimethoxy silane of alkene, N- (2- aminoethyl) -3- aminopropyl trimethoxysilane and these any combination.
Further, the colloidal nanoparticles group has the partial size between 5 to 10 nanometers.
In order to achieve the above object, an other technical solution of the present invention is to provide a kind of from adsorption catalyst
The manufacturing method of constituent, comprising: colloid nanoparticle is provided and rolls into a ball solution, colloidal nanoparticles group solution includes a glue
Body nanoparticle group and a solvent, the colloidal nanoparticles group includes a Pd nano particle and a protective agent, wherein institute
It states protective agent and coats the Pd nano particle；And the mixing colloidal nanoparticles roll into a ball solution and a silane compound, with shape
At described from absorption catalyst composition.The silane compound has an at least amido.It is formed described from adsorption catalyst
In object, the silane compound generates reciprocation by least one amido to roll into a ball with the colloidal nanoparticles.
Further, the content of the colloidal nanoparticles group in colloidal nanoparticles group solution between 50 to
Between 200ppm.
Further, the gross weight of solution and the silane compound, the silicon are rolled into a ball based on the colloidal nanoparticles
The content of hydride compounds is between 0.5 between 5vol.%.
Further, the step of mixing colloidal nanoparticles group's solution and the silane compound is also further wrapped
It includes: with the time between 1.5 to 4.5 hours, stirring colloidal nanoparticles group's solution and the silane compound.
Further, the protective agent be selected from by blocked with trimethoxy silicon propyl poly- ethamine, polyvinyl alcohol,
Polyvinylpyrrolidone, polyacrylic acid and its etc. any combination composed by group.
Further, the silane compound is selected from the group as composed by following compounds: 3- aminopropyl
Triethoxysilane, N- aminoethyl -3- aminopropyl triethoxysilane, N- (6- Aminohexyl) amino methyl triethoxysilicane
Alkane, diethylenetriamine base propyl trimethoxy silicane, N- (2- aminoethyl) -3- aminopropyl trimethoxysilane and these times
Meaning combination.
In order to achieve the above object, other yet another aspect of the present invention is to provide a kind of electroless plating substrate
Manufacturing method, comprising: provide a substrate；By one from the surface that absorption catalyst composition is attached to the substrate,
In, the catalyst composition of absorption certainly includes colloid nanoparticle group and a silane compound, the colloidal nano grain
Son group includes a protective agent of a Pd nano particle and the cladding Pd nano particle, and the silane compound passes through an amine
Base with the colloidal nanoparticles roll into a ball generate reciprocation, the silane compound by a silylation with the substrate
The surface generates covalently bonded；And an electroless plated metal deposition is carried out, to form an electroless plated metal layer in the substrate
The surface on.
Further, also by the step from the surface that absorption catalyst composition is attached to the substrate
Further comprise: the substrate is immersed comprising described from a solution of absorption catalyst composition.
A wherein beneficial effect of the invention is, provided by the present invention to urge from absorption catalyst composition, from absorption
The manufacturing method of agent constituent and the manufacturing method of electroless plating substrate, can be by the way that " colloidal nanoparticles are rolled into a ball
One protective agent of one Pd nano particle and the cladding Pd nano particle " and " silane compound by an amido with
With the colloidal nanoparticles roll into a ball generate reciprocation " technical solution so that electroless plated metal substrate can pass through environmental protection
And easy method manufactures, and can ensure that adhesion excellent between electroless plated metal layer and substrate.
Be further understood that feature and technology contents of the invention to be enabled, please refer to below in connection with it is of the invention specifically
Bright and attached drawing, however provided attached drawing is merely provided for reference and description, is not intended to limit the present invention.
Detailed description of the invention
Fig. 1 is provided by the embodiment of the present invention from the flow chart of the manufacturing method of absorption catalyst composition；
Fig. 2 is provided by the embodiment of the present invention from the step S100 and S102 of the manufacturing method of absorption catalyst composition
Schematic diagram；
Fig. 3 is provided by colloidal nanoparticles group and the embodiment of the present invention used in the present invention from adsoption catalysis
The penetration type electron micrograph of agent constituent；
Fig. 4 is the flow chart of the manufacturing method of electroless plating substrate provided by the embodiment of the present invention；
Fig. 5 is the schematic diagram of the step S202 of the manufacturing method of electroless plating substrate provided by the embodiment of the present invention；
Fig. 6 is the schematic diagram of each step in the manufacturing method of electroless plating substrate in the prior art；
Fig. 7 is using the manufacturing method of electroless plating substrate provided by the embodiment of the present invention and electroless plating in the prior art
The manufacturing method of substrate passes through the photo of atomic force microscope substrate surface obtained；And
Fig. 8 is using the manufacturing method of electroless plating substrate provided by the embodiment of the present invention and electroless plating in the prior art
Adhesion test result between the manufacturing method of substrate substrate obtained and metal layer.
Specific embodiment
Be below illustrated by specific specific example it is presently disclosed it is related " from absorption catalyst composition, from
The embodiment of the manufacturing method of adsorption catalyst constituent and the manufacturing method of electroless plating substrate ", those skilled in the art
Advantages of the present invention and effect can be understood by content disclosed in this specification.The present invention can pass through other different specific implementations
Example is implemented or is applied, and the various details in this specification may be based on different viewpoints and application, of the invention not departing from
It carry out various modifications and changes under design.In addition, attached drawing of the invention is only simple schematically illustrate, not retouching according to actual size
It draws, states in advance.The relevant technologies content of the invention, but disclosure of that will be explained in further detail in the following embodiments and the accompanying drawings
The protection scope being not intended to limit the invention.
Please refer to Fig. 1 and Fig. 2.Fig. 1 is provided by the embodiment of the present invention from the manufacturer for adsorbing catalyst composition
The flow chart of method, and Fig. 2 is provided by the embodiment of the present invention from each step in the manufacturing method of absorption catalyst composition
Schematic diagram.Specifically, include the following steps: provided by the embodiment of the present invention from the manufacturing method of absorption catalyst composition
There is provided colloidal nanoparticles group solution (step S100), colloidal nanoparticles group solution include colloidal nanoparticles group and it is molten
Agent, colloidal nanoparticles group includes Pd nano particle and protective agent, and protective agent coats Pd nano particle；And complex colloid
Nanoparticle group's solution and silane compound, to be formed from absorption catalyst composition (step S102).
Firstly, step S100 is as shown in part (a) in Fig. 2.This step includes providing colloidal nanoparticles to roll into a ball solution.At this
In inventive embodiments, colloidal nanoparticles group solution can be prepared by wet type manufacturing method.Specifically, wet type manufacturer
Method will be protected the metal precursor that agent (capping agent) is protected including the use of reducing agent and restore.It is specific at one
It is first by metal precursor (such as palladium nitrate Pd (NO3) in embodiment2˙2H2O it) is dissolved in solvent (for example, water), then at this
Protective agent is added in metal precursor aqueous solution, so that protective agent (such as high molecular polymer) coats metal precursor.It connects down
Come, is sequentially added reducing agent (such as formaldehyde) and alkaline solution (such as sodium carbonate liquor), and stir at room temperature and make gold
Belong to predecessor and is reduced to metallic atom.In order to avoid being received in the subsequent palladium that occurs from the preparation process of absorption catalyst composition
The phenomenon that rice corpuscles settles, during preparing colloidal nanoparticles group, used metal precursor and protective agent (such as
Polyvinyl alcohol) weight ratio can be between 1:1 between 1:5.
From the above, the protective agent in the embodiment of the present invention can be selected from poly- by being blocked with trimethoxy silicon propyl
Ethamine (trimethoxysilylpropyl modified polyethylenimine), polyvinyl alcohol (Polyvinyl
Alcohol, PVA), polyvinylpyrrolidone (Polyvinylpyrrolidone, PVP), polyacrylic acid (poly (acrylic
Acid), PAA) and its etc. any combination composed by group.It in the following description, is to use polyvinyl alcohol (PVA)
The colloidal nanoparticles group (being indicated using PVA-Pd) that Pd nano particle (indicating with Pd) is coated as protective agent receives as colloid
It is described for rice corpuscles group.In PVA-Pd, molecular stereo barrier that the polymer tail end of PVA generates in a solvent can be with
It effectively prevent colloidal nanoparticles group that aggregation or sedimentation occurs.
In addition to this, since above-mentioned protectant molecular weight is attracted to protective agent the ratio on Pd nano particle surface
Also it is influenced, in a kind of preferable embodiment, protective agent be can be with the molecule between 5,000 to 10,000
The high molecular polymer of amount.Specifically, compared to the high molecular polymer with small-molecular-weight, the high score with macromolecule
The ratio that sub- polymer is adsorbed on Pd nano particle surface is also higher, so that being located at the protective agent of Pd nano particle periphery
It is thicker to measure more and thickness, so that colloidal nanoparticles group has biggish partial size.In an embodiment of the invention
In, colloidal nanoparticles group has the partial size between 5 to 10 nanometers.
It can have about 2 in general, being formed by colloidal nanoparticles by above-mentioned wet type manufacturing method and rolling into a ball solution,
The PVA-Pd concentration of 500ppm.Next, needing to be conducive to synthesis from absorption catalyst composition by colloidal nanoparticles
Group's solution is diluted.Can be by deionized water by PVA-Pd concentration dilution to proper range, and stir between 10 minutes extremely
The time of 40 minutes (such as half an hour).In an embodiment of the present invention, the colloidal nano grain in colloidal nanoparticles group solution
The content of son group (PVA-Pd) is between 50 between 500ppm.Specifically, if the concentration of PVA-Pd is lower than in solution
50ppm is then not easy to reach the subsequent effect in conjunction with silane compound, and if in solution PVA-Pd excessive concentration, for example,
Higher than 500ppm, then part PVA-Pd may be precipitated in subsequent synthesis step.Preferably implement at the present invention one
In mode, the content of colloidal nanoparticles group is between 50 between 200ppm.
Next, step S102 is if Fig. 2 (b) is partially and shown in the part (c).In step s 102, complex colloid is received
Rice corpuscles group's solution and silane compound, to be formed from absorption catalyst composition C.In an embodiment of the present invention, silanization
Closing object can be the silane compound with 1 to 3 amido.In addition to this, silane compound can be selected from by following institute
The group of composition: 3-aminopropyltriethoxysilane (3-aminopropyltriethoxysilane, APS), N- aminoethyl-
3- aminopropyl triethoxysilane (N- [3- (Trimethoxysilyl) propyl] ethylenediamine), N- (6- amino
Hexyl) amino methyl triethoxysilane (N- (6-aminohexyl) aminomethyltriethoxysilane), divinyl
Three aminocarbonyl propyl trimethoxy silanes (3- [2- (2-Aminoethylamino) ethylamino] propyl-
Trimethoxysilane, ETAS), N- (2- aminoethyl) -3- aminopropyl trimethoxysilane (N- (2-aminoethyl) -3-
Aminopropyltrimethoxysilane, EDA) and its etc. any combination.It in the following description, is made with ETAS
To be described for silane compound.
In addition, being that ETAS is added to provided colloidal nanoparticles group solution in the step s 100 in step s 102
In.The gross weight of solution and silane compound (ETAS) is rolled into a ball based on colloidal nanoparticles, the content of silane compound (ETAS) is
Between 0.5 to 5 percent by volume (vol.%).In fact, if the percent by volume of ETAS is less than 0.5, for example, be 0.1,
Then after PVA-Pd solution is added in ETAS, it may cause colloidal nanoparticles group (PVA-Pd) and precipitate completely.In addition, if ETAS
Content be higher than 5vol.%, for example, 10vol.% when, will cause part Pd nano particle precipitating.It is preferable at the present invention one
Embodiment in, be to select the PVA-Pd solution of about 50ppm and self-priming is synthesized using the ETAS of content 0.5 to 5vol.%
Attached catalyst composition C.
For example, by content be 1vol.% ETAS be added 50ppm PVA-Pd solution after, can between
Time (such as 3 hours) between 1.5 to 4.5 hours, stirring colloidal nanoparticles group solution (PVA-Pd solution) and silanization
It closes object (ETAS).After step S102, ETAS passes through amido (amino group) and colloidal nanoparticles group (PVA-
Pd reciprocation) is generated.Specifically, the amido of ETAS can be with the palladium particle in PVA-Pd solution or the palladium ion in solution
Reciprocation occurs.Accordingly, by step S102, the absorption catalyst composition C certainly of dispersion in the solution can be generated
(ETAS-PVA-Pd)。
It is noted that in the above description, though it is described using PVA as protectant example, by experiment
It proves, the ETAS of the 1vol.% PVP-Pd colloidal nanoparticles group solution that 50ppm is added also can produce provided by the present invention
From absorption catalyst composition C.In other words, protectant type is in the present invention and without restriction.
Next, please referring to Fig. 3.Fig. 3 is colloidal nanoparticles group and the embodiment of the present invention used in the present invention
The provided penetration type electron micrograph from absorption catalyst composition.In fact, (a) figure in Fig. 3 is respectively with (b) figure
From the transmission electron microscope of absorption catalyst composition C (ETAS-PVA-Pd) and colloidal nanoparticles group (PVA-Pd)
(TEM) figure, which show the partial sizes of two kinds of substances to compare.By in Fig. 3 it is found that from absorption catalyst composition C (ETAS-
PVA-Pd partial size) is uniformly distributed between 2 to 5 nanometers (nm), and similarly, PVA-Pd is also partial size model having the same
It encloses.Therefore, it adds ETAS and it is made to have no effect on the original partial size of PVA-Pd in conjunction with PVA-Pd, this represents PVA still to Pd
Nanoparticle plays protectant effectiveness, and the addition of ETAS has no effect on the characteristic of colloidal nanoparticles group suspension.
It is obtained from adsorption catalyst group from the manufacturing method of absorption catalyst composition provided by according to the present invention
It include colloidal nanoparticles group (such as PVA-Pd) and silane compound (such as ETAS) at object C, and colloidal nanoparticles group
Protective agent (such as PVA) including Pd nano particle (Pd) and cladding Pd nano particle.In addition, silane compound has at least
One amido (such as ETAS is that there are three amidos for tool), and be that reciprocation is generated to roll into a ball with colloidal nanoparticles by amido.
In addition to this, the present invention also provides a kind of manufacturing methods of electroless plating substrate.It please refers to shown in Fig. 4 and Fig. 5, Fig. 4
For the flow chart of the manufacturing method of electroless plating substrate provided by the embodiment of the present invention, and Fig. 5 is provided by the embodiment of the present invention
Electroless plating substrate manufacturing method a wherein step schematic diagram.
As shown in figure 4, the manufacturing method of electroless plating substrate includes: to provide a substrate (step S200)；It will be from adsoption catalysis
Agent constituent is attached on the surface of substrate (step S202)；And electroless plated metal deposition is carried out, to form electroless plated metal
Layer is on the surface of substrate (step S204).It is noted that the above-mentioned catalyst composition C of absorption certainly includes colloidal nano grain
Son group and silane compound, colloidal nanoparticles group include the protective agent of Pd nano particle and cladding Pd nano particle, and
Silane compound by amido with colloidal nanoparticles roll into a ball generate reciprocation, silane compound by silylation with substrate
Surface generate covalently bonded.
Specifically, substrate T provided in step S200 can be silicon substrate such as glass substrate (SiO2 substrate).So
And substrate T is also possible to substrate made by other materials.In other words, in an embodiment of the present invention, the material of substrate T
Matter is simultaneously without restriction.Next, as shown in figure 5, catalyst composition C will be adsorbed certainly as previously described in step S202
(such as ETAS-PVA-Pd) is attached on the surface of substrate T.The surface of substrate T is that subsequent electroless plated metal to be carried out deposits journey
The surface of sequence.
It for example, in one embodiment of the invention, is using alkali-free (alkali free) glass substrate as base
Plate T (is purchased from Corning Incorporated).The glass substrate is handled with the RCA of standard (NH4OH:H2O2:H2O) cleaned in advance, and with
Deionized water rinse is to remove impurity.Then, this glass substrate is dipped into ETAS-PVA-Pd solution at room temperature up to 5 points
Clock is to achieve the effect that activate the surface substrate T.It in other words, is to immerse substrate T comprising from adsoption catalysis in step S202
In the solution of agent constituent C (ETAS-PVA-Pd).
After the surface of substrate T is activated, from the silylation and substrate for adsorbing the silane compound in catalyst composition C
The surface of T can generate Si-O-Si covalently bonded.In this way, from the amido of the silane compound in absorption catalyst composition C
It may be respectively used for linking with the surface of colloidal nanoparticles group and substrate T with catalysis with silylation, reach whereby
To the effect of activation substrate T.
Finally, electroless plated metal deposition procedure is carried out in step S204, to form one layer of electroless plated metal layer in substrate
T passes through from the surface of absorption catalyst composition C activation.Electroless plated metal deposition, or can be described as autocatalytic plating metal deposit
(Autocatalytic Plating) is first to form the metal covering with catalytic force on working substance surface, or utilize working substance
The catalytic action on surface itself makes metal ion become metallic state precipitation with chemical reduction method.In a kind of implementation of the present invention
In mode, electroless plated metal is deposited as electroless nickel plating metal deposit, that is, the electroless plated metal layer being formed on the surface substrate T is
Nickel metal layer.In this embodiment, reducing agent of the sodium hypophosphite as electroless nickel plating metal deposit can be used.In higher temperatures
Under degree, unstable hypophosphite ion discharges hydrogen atom, is then absorbed by catalyst (palladium metal), causes subsequent electroless plating
Nickel reactant, to form electroless nickel plating metal layer on the surface of substrate T.
Manufacturing method and one of nothing in the prior art below for electroless plating substrate provided by the present invention
The manufacturing method of electroplating substrate is compared.Fig. 6 to Fig. 8 is please referred to, Fig. 6 is the manufacturer of electroless plating substrate in the prior art
The schematic diagram of each step in method, Fig. 7 are using the manufacturing method of electroless plating substrate provided by the embodiment of the present invention and existing skill
The manufacturing method of electroless plating substrate in art, by the photo of atomic force microscope substrate surface obtained, and Fig. 8 is to use
The manufacturing method institute of the manufacturing method of electroless plating substrate provided by the embodiment of the present invention and electroless plating substrate in the prior art
Adhesion test result between the substrate and metal layer of acquisition.
First as shown in fig. 6, provided by the manufacturing method and the embodiment of the present invention of electroless plating substrate in the prior art
The main difference of the manufacturing method of electroless plating substrate is that the manufacturing method of electroless plating substrate in the prior art is first with silicon
Hydride compounds modify the surface of substrate T, then colloidal nanoparticles group is set to the surface of the substrate T by modification,
And manufacturer's rule of electroless plating substrate provided by the embodiment of the present invention is to use single step just will be from adsorption catalyst group
It is attached on the surface of substrate T at object C (including silane compound and colloidal nanoparticles group).
It is first to immerse glass substrate in the solution comprising silane compound ETAS 30 minutes, then table will be passed through in Fig. 6
The glass substrate of face modification immerses in the solution comprising colloidal nanoparticles group (PVA-Pd).In fact, Fig. 6 only show by
Simplified preparation step, and in actual operation, glass substrate needs to immerse in advance 5 in pure isopropanol (99.5%IPA) solution
Minute is pre-processed, then is immersed in the aqueous isopropanol comprising ETAS so that ETAS is adsorbed in the surface of glass substrate.It is logical
It crosses after ETAS makes the program of the surface silanization of glass substrate toast 30 minutes under 160oC and completes.Then, change by surface
The glass substrate of matter just carries out the step of subsequent attachment colloidal nanoparticles group.
Unlike the prior art, as previously mentioned, the manufacturing method of electroless plating substrate provided by the embodiment of the present invention
It is the effect that the surface of activation substrate T is completed only with single step.Specifically, the method for the embodiment of the present invention can be first
It is about to sulfur acid pretreatment 5 minutes of glass substrate with Moore concentration for 5M, then directly immerses glass substrate comprising adsorbing certainly
In the solution of catalyst composition C (ETAS-PVA-Pd).It will be obvious that manufacturing method provided by the embodiment of the present invention is more
It is easy.In order to facilitate narration, in the description which follows, the manufacturing method of the electroless plating substrate of the prior art is referred to as two step ETAS
+ PVA-Pd method.
Referring to Fig. 7, in Fig. 7 the part (a) display by atomic force microscope (AFM) obtain using the prior art
Two step ETAS+PVA-Pd methods are formed by the photo for being adsorbed with the substrate surface of catalyst, and the part (b) is shown in Fig. 7
The photo using the substrate surface of the manufacturing method of electroless plating substrate provided by the embodiment of the present invention obtained by AFM.
Both of which is that use side length be 2 centimeters of square glass substrate as substrate T.By in Fig. 7 it is found that two step ETAS+
The glass substrate of PVA-Pd method is with more loose catalyst carrier (Pd loading) and has some Pd nanoparticles
Aggregation.In addition, being had using the glass substrate of ETAS-PVA-Pd of the invention from absorption catalyst composition C more intensive
And the catalyst being evenly distributed, this has positive influences for the quality of subsequent electroless plated metal layer.
Next, being all at 85oC after forming the substrate by surface active (being attached with catalyst composition)
By 1 minute in substrate T immersion commercialization Ni-P bath to carry out electroless plated metal deposition.Ni-P film is formed by with about 120nm's
Film thickness.It is measured between the manufacturing method of the prior art and manufacturing method provided by the present invention using adhesion test is stripped
Otherness.
It (is denoted as referring to Fig. 8, Fig. 8 is listed using the manufacturing method of electroless plating substrate provided by the embodiment of the present invention
ETAS-PVA-Pd), using two step ETAS+PVA-Pd methods (being denoted as ETAS+PVA-Pd) of the prior art, using existing
The Sn/Pd catalyst (being denoted as Sn/Pd) of technology and the ion target catalyst (being denoted as ion Pd) of the use prior art are each
From the result for carrying out adhesion test three times.
By the content of Fig. 8 it is found that compared to the electroless plating manufacturer for using commercial Sn/Pd catalyst Yu ion Pd catalyst
Method, using two step ETAS+PVA- of the manufacturing method and the prior art of electroless plating substrate provided by the embodiment of the present invention
The effect of the electroless plating manufacturing method of Pd method, which has, obviously preferably sticks together force characteristic.Specifically, adhesion be by 3 to
5MPa is promoted to greater than 9MPa.The above results confirm that the manufacturing method of electroless plating substrate provided by the embodiment of the present invention can obtain
Cause the electroless plated metal layer with excellent adhesion.Furthermore since manufacturing method used by the embodiment of the present invention only needs to carry out
Single immersion step can generate the substrate by surface active, two step ETAS+PVA-Pd compared to the prior art
Method, be it is easier, cost is more cheap and is more suitable in industrial use.
The beneficial effect of embodiment
A wherein beneficial effect of the invention is, provided by the present invention to urge from absorption catalyst composition C, from absorption
The manufacturing method of agent constituent C and the manufacturing method of electroless plating substrate, can be by the way that " colloidal nanoparticles group receives including palladium
Rice corpuscles and coat Pd nano particle protective agent " and " silane compound by amido with colloidal nanoparticles roll into a ball produce
The technical solution of raw reciprocation ", so that electroless plated metal substrate can be manufactured by environmental protection and easy method, and energy
Ensure adhesion excellent between electroless plated metal layer and substrate T.
Specifically, provided by the present invention can be made by relatively simple method from absorption catalyst composition C
It is standby to form, and the efficiency due to being provided simultaneously with grafting and catalysis from absorption catalyst composition C, it can reach in the prior art
The middle technical effect for needing to reach by two independent process, is greatly reduced the complexity of electroless plating manufacturing method whereby.Such as
This one, manufacture electroless plating substrate manufacturing method in, do not need to carry out additional surfaction or processing step
To obtain the surface substrate T through overactivation.Furthermore the system of electroless plating substrate is carried out from absorption catalyst composition C using this
It makes, not only may insure the uniformity of the distribution of metal catalytic particles during activating the surface of substrate T, it can also be
Acquisition has sticking together between excellent electroless plated metal layer and substrate T under conditions of meeting environmental requirement, reducing manufacturing cost
The electroless plating substrate of power.
Content disclosed above is only preferred possible embodiments of the invention, not thereby limits to right of the invention and wants
The protection scope of book is sought, so all equivalence techniques variations done with description of the invention and accompanying drawing content, are both contained in
In the protection scope of claims of the present invention.
Claims (14)
1. a kind of from absorption catalyst composition, which is characterized in that described to include: from absorption catalyst composition
Colloid nanoparticle group, the colloidal nanoparticles group include a Pd nano particle and the cladding Pd nano particle
A protective agent；And
One silane compound, the silane compound have an at least amido；
Wherein, the silane compound generates reciprocation by least one amido to roll into a ball with the colloidal nanoparticles.
2. it is according to claim 1 from absorption catalyst composition, which is characterized in that the protective agent be selected from by with
Trimethoxy silicon propyl sealing end poly- ethamine, polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid and its etc. any combination
Composed group.
3. according to claim 2 from absorption catalyst composition, which is characterized in that the protective agent be between 5,
One high molecular polymer of the molecular weight between 000 to 10,000.
4. according to claim 1 from absorption catalyst composition, which is characterized in that the silane compound has 1 to 3
A amido.
5. according to claim 1 from absorption catalyst composition, which is characterized in that the silane compound is to be selected from
By following composed group: 3-aminopropyltriethoxysilane, N- aminoethyl -3- aminopropyl triethoxysilane, N- (6-
Aminohexyl) amino methyl triethoxysilane, diethylenetriamine base propyl trimethoxy silicane, N- (2- aminoethyl) -3- ammonia
Propyl trimethoxy silicane and these any combination.
6. according to claim 1 from absorption catalyst composition, which is characterized in that the colloidal nanoparticles group has
Partial size between 5 to 10 nanometers.
7. a kind of from the manufacturing method for adsorbing catalyst composition, which is characterized in that described from the system for adsorbing catalyst composition
The method of making includes:
Colloid nanoparticle is provided and rolls into a ball solution, colloidal nanoparticles group solution includes colloid nanoparticle group and one
Solvent, the colloidal nanoparticles group includes a Pd nano particle and a protective agent, which is characterized in that the protective agent cladding
The Pd nano particle；And
Colloidal nanoparticles group's solution and a silane compound are mixed, to form the absorption catalyst composition certainly,
It is characterized in that, the silane compound has an at least amido；
It is characterized in that, it is described from absorption catalyst composition in, the silane compound by least one amido with
It is rolled into a ball with the colloidal nanoparticles and generates reciprocation.
8. according to claim 7 from the manufacturing method for adsorbing catalyst composition, which is characterized in that the colloidal nano
The content of colloidal nanoparticles group in particle cluster solution is between 50 between 200ppm.
9. according to claim 7 from the manufacturing method for adsorbing catalyst composition, which is characterized in that be based on the colloid
The gross weight of nanoparticle group's solution and the silane compound, the content of the silane compound between 0.5 to 5vol.% it
Between.
10. according to claim 7 from the manufacturing method for adsorbing catalyst composition, which is characterized in that mix the glue
Body nanoparticle group's solution and the step of silane compound may further comprise: between 1.5 to 4.5 hours when
Between, stir colloidal nanoparticles group's solution and the silane compound.
11. according to claim 7 from the manufacturing method for adsorbing catalyst composition, which is characterized in that the protective agent
Be selected from by blocked with trimethoxy silicon propyl poly- ethamine, polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid and its
Deng any combination composed by group.
12. according to claim 7 from the manufacturing method for adsorbing catalyst composition, which is characterized in that the silanization
Closing object is selected from the group as composed by following compounds: 3-aminopropyltriethoxysilane, N- aminoethyl -3- aminopropyl
Triethoxysilane, N- (6- Aminohexyl) amino methyl triethoxysilane, diethylenetriamine base propyl trimethoxy silicane,
N- (2- aminoethyl) -3- aminopropyl trimethoxysilane and these any combination.
13. a kind of manufacturing method of electroless plating substrate, which is characterized in that the manufacturing method of the electroless plating substrate includes:
One substrate is provided；
By one from the surface that absorption catalyst composition is attached to the substrate, which is characterized in that described from adsoption catalysis
Agent constituent includes colloid nanoparticle group and a silane compound, and the colloidal nanoparticles group includes a palladium nanoparticle
One protective agent of son and the cladding Pd nano particle, and the silane compound by an amido with the colloidal nano
Particle cluster generates reciprocation, and the silane compound is by a silylation to generate covalent bond with the surface of the substrate
Knot；And
An electroless plated metal deposition is carried out, to form an electroless plated metal layer on the surface of the substrate.
14. the manufacturing method of electroless plating substrate according to claim 13, which is characterized in that will be described from adsorption catalyst
The step that constituent is attached on the surface of the substrate, which may further comprise:, immerses the substrate comprising the self-priming
In one solution of attached catalyst composition.
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