CN109688698B - Circuit board and electric connector with same - Google Patents
Circuit board and electric connector with same Download PDFInfo
- Publication number
- CN109688698B CN109688698B CN201910063128.5A CN201910063128A CN109688698B CN 109688698 B CN109688698 B CN 109688698B CN 201910063128 A CN201910063128 A CN 201910063128A CN 109688698 B CN109688698 B CN 109688698B
- Authority
- CN
- China
- Prior art keywords
- metal
- metal wire
- layer
- differential
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000002184 metal Substances 0.000 claims abstract description 151
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 210000001503 joint Anatomy 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board and an electric connector with the same. The circuit board is sequentially provided with a first circuit layer, a first insulating layer, a second circuit layer, an insulating substrate, a third circuit layer, a second insulating layer and a fourth circuit layer from top to bottom. The first metal wire and the second metal wire are respectively formed on the first circuit layer and the second circuit layer and form a first differential wire pair. The third metal wire and the fourth metal wire are respectively formed on the third circuit layer and the fourth circuit layer and form a second differential wire pair; the two metal wires forming each differential wire pair are vertically corresponding and have different widths, so that crosstalk between signals of adjacent differential pairs can be reduced.
Description
Technical Field
The present invention relates to a connector, and more particularly to a circuit board capable of transmitting differential signals and an electrical connector having the same.
Background
Differential signaling (DIFFERENTIAL SIGNAL) is a signal transmission technology, which is increasingly used in high-speed circuit design, the most critical signals in the circuit are often designed by adopting a differential structure, and the pair of wires carrying the differential signals are called differential wires.
In Practical Circuit Board (PCB) routing, conventional differential routing structures are not effective in reducing crosstalk noise between adjacent differential pairs, which can affect the signal integrity of high speed systems.
Therefore, it is necessary to provide a new circuit board, which adopts a completely new wiring manner to solve the problems existing in the prior art.
Disclosure of Invention
The main objective of the present invention is to provide a circuit board capable of transmitting differential signals and reducing crosstalk between adjacent differential pair signals.
Another object of the present invention is to provide an electrical connector, which uses a new circuit board to reduce crosstalk between adjacent differential pair signals.
Other objects and advantages of the present invention will be further appreciated from the technical features disclosed in the present invention.
In order to achieve the above purpose, the invention adopts the following technical scheme: a circuit board is provided with: a first circuit layer, a first insulating layer, a second circuit layer, an insulating substrate, a third circuit layer, a second insulating layer, and a fourth circuit layer. Forming at least one first metal wire on the first circuit layer, forming at least one second metal wire on the second circuit layer, wherein the first metal wire and the second metal wire form a first differential wire pair; at least one third metal wire is formed on the third circuit layer, at least one fourth metal wire is formed on the fourth circuit layer, and the third metal wire and the fourth metal wire form a second differential wire pair. Wherein the two metal wires forming each differential wire pair are vertically corresponding and have different widths.
In one embodiment, the width of the first metal trace is greater than the width of the second metal trace, and the width of the fourth metal trace is greater than the width of the third metal trace.
In one embodiment, the two metal traces forming each differential trace pair have at least a portion of the paths extending in a staggered manner and the orthographic projections thereof are located in the same projection area.
In one embodiment, the two metal traces comprising each differential trace pair each have at least a portion of a serpentine path.
In one embodiment, one of the metal traces forming each differential trace pair has at least a portion of a serpentine path, and the other metal trace has at least a portion of a linear path that corresponds up and down to the at least a portion of the serpentine path and extends across each other.
In one embodiment, the first metal trace has at least a portion of a serpentine path, the second metal trace has at least a portion of a linear path, and a width of the first metal trace is greater than a width of the second metal trace.
In one embodiment, the insulating substrate has a first surface and a second surface, and the first surface is parallel to the second surface; the second circuit layer is a metal layer, is laid on the first surface of the insulating substrate, and is also provided with another second metal wire; the first insulating layer covers the second circuit layer; the first circuit layer is a metal layer, is formed on the first insulating layer, and is also provided with another first metal wire, and the other first metal wire and the other second metal wire form a third differential wire pair; the third circuit layer is a metal layer and is formed on the second surface of the insulating substrate, and another third metal wire is also formed on the third circuit layer; the second insulating layer covers the third circuit layer; the fourth line layer is a metal layer, is formed on the second insulating layer, and is further formed with another fourth metal wire, and the another first metal wire and the another second metal wire form a fourth differential wire pair.
In one embodiment, a plurality of conductive through holes are further formed on the circuit board, each of the conductive through holes penetrates through the upper surface and the lower surface of the circuit board, and each of the conductive through holes is connected with one end of one of the metal wires.
In order to achieve the above purpose, the present invention also adopts the following technical scheme: an electrical connector includes a circuit board as described above, and a plurality of conductive terminals mounted to the circuit board; each conductive terminal is electrically connected with one end of one metal wire.
Compared with the prior art, the circuit board and the electric connector with the circuit board have the advantages that the two metal wires forming each differential wire pair are arranged on different circuit layers and are inconsistent in width, at least part of paths of the two metal wires are staggered and extend, orthographic projections of the paths are positioned in the same projection area, and therefore the two metal wires of the differential wire pair are guaranteed to be close to each other, and therefore coupling between the two metal wires is enhanced. The circuit board and the electric connector with the circuit board can reduce signal crosstalk between adjacent differential wiring pairs.
Drawings
Fig. 1 is a schematic perspective view of a first embodiment of a circuit board according to the present invention.
Fig. 2 is a cross-sectional view of the circuit board of the present invention taken along the line A-A shown in fig. 1.
Fig. 3 is a top view of the circuit board of the present invention shown in fig. 1.
Fig. 4 is a bottom view of the circuit board of the present invention shown in fig. 1.
Fig. 5 is a layout diagram of a differential pair of wires according to a first embodiment of the present invention.
Fig. 6 is a top view of the differential trace pair of the present invention shown in fig. 5.
Fig. 7 is a bottom view of the differential trace pair of the present invention shown in fig. 5.
Fig. 8 is a layout diagram of a differential pair of wires according to a second embodiment of the present invention.
Fig. 9 is a top view of the differential trace pair of the present invention shown in fig. 8.
Fig. 10 is a bottom view of the differential trace pair of the present invention shown in fig. 8.
Fig. 11 is a view showing a use state of the circuit board according to the present invention.
Fig. 12 is a view showing a use state of the circuit board according to the present invention at another angle.
Fig. 13 is a schematic structural view of the electrical connector of the present invention.
Fig. 14 is a schematic view of a disassembled structure of the electrical connector of the present invention.
The reference numerals in the above figures are explained as follows:
Circuit board 10 of electric connector 1
First circuit layer 101 first insulating layer 102
Second circuit layer 103 insulating substrate 104
First surface 1040 second surface 1041
Third wiring layer 105 second insulating layer 106
Fourth wiring layer 107 conductive via 108
The first differential pair of traces 21, 21a of the pad 109
Second differential wire pair 22, 22a third differential wire pair 23, 23a
Fourth differential wire pair 24, 24a
First metal traces 201, 201', 201a
Second metal traces 202, 202', 202a
Third metal traces 203, 203 'fourth metal traces 204, 204'
Conductive terminal 40 of band-shaped projection area 30, 30a
Front terminal 41 and rear terminal 42
A cable 50.
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the invention may be practiced. The directional terms referred to in the present invention, such as "up", "down", "front", "back", "left", "right", "top", "bottom", etc., refer only to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the invention and is not limiting of the invention.
Referring to fig. 1 and 2, the circuit board 10 of the present invention is sequentially stacked with a first circuit layer 101, a first insulating layer 102, a second circuit layer 103, an insulating substrate 104, a third circuit layer 105, a second insulating layer 106, and a fourth circuit layer 107 from top to bottom. At least one first metal trace 201 is formed on the first circuit layer 101, at least one second metal trace 202 is formed on the second circuit layer 103, and the first metal trace 201 and the second metal trace 202 form a differential trace pair. In addition, at least one third metal trace 203 is formed on the third circuit layer 105, and at least one fourth metal trace 204 is formed on the fourth circuit layer 107, wherein the third metal trace 203 and the fourth metal trace 204 also form a differential trace pair.
More specifically, referring to fig. 2 and fig. 5, in the first embodiment, the first metal wires 201 and the second metal wires 202 are vertically corresponding and staggered to form a first differential wire pair 21. The third metal trace 203 and the fourth metal trace 204 are also vertically corresponding and staggered, and together form a second differential trace pair 22.
Referring to fig. 2 and fig. 5, in the first embodiment, a differential pair, namely, a third differential pair 23 is further formed on the first circuit layer 101 and the second circuit layer 103. A differential pair of wires, namely a fourth differential pair of wires 24, is further formed on the third wiring layer 105 and the fourth wiring layer 107. In more detail, another first metal trace 201 'is further formed on the first circuit layer 101, and another second metal trace 202' is further formed on the second circuit layer 103, and the another first metal trace 201 'and the another second metal trace 202' form the third differential trace pair 23. In addition, another third metal trace 203 'is formed on the third circuit layer 105, and another fourth metal trace 204' is formed on the fourth circuit layer 107, where the another third metal trace 203 'and the another fourth metal trace 204' form the fourth differential trace pair 24.
As shown in fig. 3, the two first metal traces 201, 201' described above can be present on the top surface of the circuit board 10. Of course, a solder resist may also be applied to the top surface of the circuit board 10 to provide insulation protection for the first metal traces 201, 201'.
As shown in fig. 4, the above-described two fourth metal traces 204, 204' can be present on the bottom surface of the circuit board 10. Of course, a solder resist may also be applied to the bottom surface of the circuit board 10 to provide insulation protection for the fourth metal traces 204, 204'.
In the first embodiment, as shown in fig. 2, the two metal wires forming each differential wire pair are located in different circuit layers, so as to reduce signal crosstalk between adjacent differential wire pairs. Taking the first differential wire pair 21 as an example, the first metal wire 201 and the second metal wire 202 forming the first differential wire pair 21 are respectively located in the first circuit layer 101 and the second circuit layer 103, and the widths of the first metal wire 201 and the second metal wire 202 are different, for example, the width of the first metal wire 201 is greater than the width of the second metal wire 202. In the present embodiment, the width of the fourth metal trace 204 is greater than the width of the third metal trace 203.
In the first embodiment, as shown in fig. 5, the two metal traces forming each differential trace pair have at least a portion of paths extending in a staggered manner, and in a direction perpendicular to the top surface of the circuit board (i.e., the top surface of the circuit board), the orthographic projections of the at least a portion of paths are all located in the same projection area, so as to ensure that the two metal traces of the differential trace pair are close to each other, and enhance the coupling between the two metal traces. Taking the first differential pair 21 as an example, the two metal traces 201 and 202 forming the first differential pair 21 each have at least a portion of a serpentine (S-shaped or serpentine) path, and the serpentine paths of the two metal traces 201 and 202 are staggered and have orthographic projections in the same projection area, such as a strip-shaped projection area 30 (see fig. 6). In this embodiment, the at least a portion of the serpentine path is located substantially in the middle region of the corresponding metal trace, for example, the serpentine path of the first metal trace 201 is located in the middle region of the first metal trace 201.
Each layer of the circuit board 10 of the present invention will be described in detail below.
As shown in fig. 2, the insulating substrate 104 has a first surface 1040 and a second surface 1041. The first surface 1040 is parallel to the second surface 1041. The insulating substrate 104 is made of a material which is insulating and heat-insulating and is not flexible. In a first embodiment, the insulating substrate 104 may be made of Glass Epoxy (Glass Epoxy) or the like.
As shown in fig. 2, the second circuit layer 103 is formed on the first surface 1040 of the insulating substrate 104. For example, the second wiring layer 103 may be a thin metal layer that is laid on the first surface, and at least one second metal trace 202 is etched or otherwise formed. In the first embodiment, two second metal traces 202, 202' are formed on the first wiring layer 101.
As shown in fig. 2, the first insulating layer 102 covers the entire second circuit layer 103 to provide isolation.
As shown in fig. 2, the first circuit layer 101 is formed on the first insulating layer 102 in the same manner as the second circuit layer 103. Likewise, the at least one first metal trace 201 can also be formed by etching or other means. In the first embodiment, two first metal traces 201, 201 'are formed on the first circuit layer 101, and the two first metal traces 201, 201' are shown in fig. 1,2 and 3.
Similarly, as shown in fig. 2, the third circuit layer 105 is formed on the second surface 1041 of the insulating substrate 104. In the first embodiment, two third metal traces 203, 203' are formed on the third wiring layer 105.
As shown in fig. 2, the second insulating layer 106 covers the entire third wiring layer 105 to provide isolation.
As shown in fig. 2, the fourth circuit layer 107 is formed on the second insulating layer 106. In the first embodiment, two fourth metal traces 204, 204' are formed on the fourth wiring layer 107. Both fourth metal traces 204, 204' are shown in fig. 2 and 4.
Fig. 6 and 7 show top and bottom plan views of the differential pair of wires of the present invention, respectively, to clearly show the planar layout structure of the first differential pair of wires 21, the second differential pair of wires 22, the third differential pair of wires 23, and the fourth differential pair of wires 24. The two metal traces forming each differential trace pair each have at least a portion of a serpentine (also referred to as S-shaped, serpentine) path extending across each other and having their orthographic projections within the same projection area, such as the strip-shaped projection area 30 (see fig. 6).
The path shape of the differential trace pair described above is not limited to the serpentine shape of the first embodiment.
Fig. 8, 9 and 10 show a second embodiment of the differential pair of traces of the invention. This second embodiment also provides a first differential pair of traces 21a, a second differential pair of traces 22a, a third differential pair of traces 23a, and a fourth differential pair of traces 24a that are similar to the first embodiment. The two metal wires forming each differential wire pair are positioned in different circuit layers and have inconsistent widths, and the two metal wires forming each differential wire pair have at least one part of paths which are not overlapped and extend in a staggered manner, and are orthographic projected in the same projection area, so that the two metal wires of the differential wire pair are ensured to be mutually close to each other, and the mutual coupling is enhanced. Further, one of the metal traces forming each differential trace pair has at least a portion of a serpentine path and the other metal trace has at least a portion of a linear path, the at least a portion of the serpentine path and the at least a portion of the linear path extending across each other and having orthographic projections within the same projection area, such as a strip-shaped projection area 30a (see fig. 9).
Referring to fig. 8, taking the first differential pair of wires 21a as an example, one of the metal wires (i.e., the first metal wire 201 a) forming the first differential pair of wires 21a has at least a portion of a serpentine path, and the other metal wire (i.e., the second metal wire 202 a) has at least a portion of a linear path, as shown in the drawing, the at least a portion of the linear path and the at least a portion of the serpentine path do not overlap, and the two paths are staggered and have orthographic projections located in the same projection area.
In this embodiment, the at least a portion of the straight path and the at least a portion of the serpentine path are each located approximately midway between the corresponding metal traces.
In addition, as shown in fig. 1, a plurality of conductive through holes 108 are formed on the circuit board 10 of the present invention, each conductive through hole 108 penetrates through the upper and lower surfaces of the circuit board 10, and each conductive through hole 108 corresponds to one metal trace and is connected to one end of the metal trace. In more detail, a pad 109 is formed at each end of each metal trace (see fig. 5), and each pad 109 is electrically connected to a corresponding conductive via 108.
As shown in fig. 11 and 12, each conductive via 108 of the circuit board 10 of the present invention is capable of having an external conductive terminal 40 soldered thereto or inserted therein to form an electrical connection.
As shown in fig. 13 and 14, the electrical connector 1 of the present invention employs the circuit board 10 shown in fig. 1.
Referring to fig. 11, 12, 13 and 14, the electrical connector 1 includes a plurality of conductive terminals 40 mounted on the circuit board 10. Each conductive terminal 40 is electrically connected to one end of a corresponding one of the metal traces on the circuit board 10. In addition, the conductive terminals 40 include a plurality of front terminals 41 and a plurality of rear terminals 42, wherein the front terminals 41 can form an electrical butt joint with a corresponding butt joint connector (not shown); the rear terminal 42 is forked and can be electrically connected with the cable 50 of the electric connector 1.
In summary, in the circuit board 10 and the electrical connector 1 having the circuit board of the present invention, the two metal wires forming each differential wire pair are disposed on different circuit layers and have different widths, and at least a portion of the paths of the two metal wires are staggered and extend in the same projection area, so as to ensure that the two metal wires of the differential wire pair are close to each other, thereby enhancing the coupling between the two metal wires, and the layout of the differential wire pair can also reduce the signal crosstalk between the adjacent differential wire pairs.
Claims (6)
1. An electrical connector having a circuit board, characterized by: the electric connector comprises the circuit board and a plurality of conductive terminals arranged on the circuit board;
the circuit board is sequentially provided with a first circuit layer, a first insulating layer, a second circuit layer, an insulating substrate, a third circuit layer, a second insulating layer and a fourth circuit layer from top to bottom in a lamination manner; forming at least one first metal wire on the first circuit layer, forming at least one second metal wire on the second circuit layer, wherein the first metal wire and the second metal wire form a first differential wire pair; forming at least one third metal wire on the third circuit layer, and forming at least one fourth metal wire on the fourth circuit layer, wherein the third metal wire and the fourth metal wire form a second differential wire pair; wherein the two metal wires forming each differential wire pair are vertically corresponding and have different widths;
The plurality of conductive terminals comprise a plurality of front terminals and a plurality of rear terminals, wherein the front terminals are used for forming electric butt joint with a corresponding butt joint connector; the rear terminal is used for forming electric connection with the cable of the electric connector; each conductive terminal is electrically connected with one end of one corresponding metal wire;
the width of the first metal wire is larger than that of the second metal wire, and the width of the fourth metal wire is larger than that of the third metal wire;
the two metal wires forming each differential wire pair have at least one part of paths extending in a staggered manner, and the orthographic projections of the two metal wires are positioned in the same projection area.
2. The electrical connector with circuit board of claim 1, wherein: the two metal traces comprising each differential pair of traces each have at least a portion of a serpentine path.
3. The electrical connector with circuit board of claim 1, wherein: one metal wire of each differential wire pair has at least one part of a serpentine path, and the other metal wire has at least one part of a straight path, and the at least one part of the straight path corresponds to the at least one part of the serpentine path up and down and extends in a staggered manner.
4. The electrical connector with circuit board of claim 3, wherein: the first metal trace has at least a portion of a serpentine path and the second metal trace has at least a portion of a linear path.
5. The electrical connector with circuit board of claim 1, wherein: the insulating substrate is provided with a first surface and a second surface, and the first surface is parallel to the second surface;
The second circuit layer is a metal layer, is laid on the first surface of the insulating substrate, and is also provided with another second metal wire;
the first insulating layer covers the second circuit layer;
the first circuit layer is a metal layer, is formed on the first insulating layer, and is also provided with another first metal wire, and the other first metal wire and the other second metal wire form a third differential wire pair;
The third circuit layer is a metal layer and is formed on the second surface of the insulating substrate, and another third metal wire is also formed on the third circuit layer;
the second insulating layer covers the third circuit layer; and
The fourth circuit layer is a metal layer, is formed on the second insulating layer, and is further formed with another fourth metal wire, and the another third metal wire and the another fourth metal wire form a fourth differential wire pair.
6. The electrical connector with circuit board of claim 5, wherein: the circuit board is also provided with a plurality of conductive through holes, each of which penetrates through the upper surface and the lower surface of the circuit board, and each of which is connected with one end of one of the metal wires.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811206814 | 2018-10-17 | ||
| CN2018112068145 | 2018-10-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109688698A CN109688698A (en) | 2019-04-26 |
| CN109688698B true CN109688698B (en) | 2024-06-28 |
Family
ID=66194053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910063128.5A Active CN109688698B (en) | 2018-10-17 | 2019-01-23 | Circuit board and electric connector with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109688698B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112911802B (en) * | 2020-12-25 | 2022-05-10 | 无锡市同步电子科技有限公司 | Differential signal line wiring method of twisted pair-like staggered layer structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1129993A (en) * | 1993-08-31 | 1996-08-28 | 摩托罗拉公司 | A horizontally twisted-pair planar conductor line structure |
| CN1486561A (en) * | 2000-11-15 | 2004-03-31 | 英特尔公司 | Electromagnetically-coupled bus system |
| CN209824120U (en) * | 2018-10-17 | 2019-12-20 | 欧品电子(昆山)有限公司 | Circuit board and electric connector with same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3764727A (en) * | 1972-06-12 | 1973-10-09 | Western Electric Co | Electrically conductive flat cable structures |
| JP4964090B2 (en) * | 2007-10-26 | 2012-06-27 | 三菱電機株式会社 | Differential signal transmission wiring board |
| WO2010044799A1 (en) * | 2008-10-17 | 2010-04-22 | Hewlett-Packard Development Company, L.P. | Transmission line circuit having pairs of crossing conductive lines |
| US9288893B2 (en) * | 2009-02-11 | 2016-03-15 | Broadcom Corporation | Implementations of twisted differential pairs on a circuit board |
| JP2011114263A (en) * | 2009-11-30 | 2011-06-09 | Kyocer Slc Technologies Corp | Wiring board |
| TWI532416B (en) * | 2011-03-23 | 2016-05-01 | 威盛電子股份有限公司 | Differential pair signal transmission structure, wiring board and electronic module |
| US9338882B2 (en) * | 2014-05-15 | 2016-05-10 | Intel Corporation | Broadside coupled differential transmission lines having alternating wide and narrow portions |
| US9318848B2 (en) * | 2014-08-01 | 2016-04-19 | Commscope, Inc. Of North Carolina | Communications connectors including low impedance transmission line segments that improve return loss and related methods |
-
2019
- 2019-01-23 CN CN201910063128.5A patent/CN109688698B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1129993A (en) * | 1993-08-31 | 1996-08-28 | 摩托罗拉公司 | A horizontally twisted-pair planar conductor line structure |
| CN1486561A (en) * | 2000-11-15 | 2004-03-31 | 英特尔公司 | Electromagnetically-coupled bus system |
| CN209824120U (en) * | 2018-10-17 | 2019-12-20 | 欧品电子(昆山)有限公司 | Circuit board and electric connector with same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109688698A (en) | 2019-04-26 |
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