CN109677035A - A kind of low infrared emissivity heat-barrier material and preparation method thereof - Google Patents
A kind of low infrared emissivity heat-barrier material and preparation method thereof Download PDFInfo
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- CN109677035A CN109677035A CN201811610801.4A CN201811610801A CN109677035A CN 109677035 A CN109677035 A CN 109677035A CN 201811610801 A CN201811610801 A CN 201811610801A CN 109677035 A CN109677035 A CN 109677035A
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- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/304—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/416—Reflective
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
Abstract
The invention discloses a kind of low infrared emissivity heat-barrier material and preparation method thereof, which includes sequentially connected substrate thermal insulation layer, reflection screen material and low infrared emissivity coating；Preparation method includes: to mix low-launch-rate filler with adhesive, is stirred evenly, to obtain low infrared emissivity coating；Obtained low emissivity coatings are uniformly brushed in the surface of reflection screen material, drying；There is the reflection screen material of low emissivity coatings to be combined into one with substrate thermal insulation layer obtained brushing, pressure forming, drying.The emissivity on high-temperature component surface can be effectively reduced in low infrared emissivity heat-barrier material of the invention, reduces the heat transfer between all parts, improves material heat-proof quality.
Description
Technical field
The invention belongs to heat preserving and insulating material fields, and in particular to a kind of low infrared emissivity heat-barrier material and its preparation side
Method.
Background technique
With the continuous improvement of production technology, on the surface of many heat structure parts, to the use temperature of high temperature insulating material
Requirement it is higher and higher.Heat-barrier material is many kinds of, according to material, can be divided into organic heat-barrier material and thermal insulation inorganic material,
For organic heat-barrier material due to inflammable, ageing resistance is poor, is difficult to apply to high temperature applicationss；Thermal insulation inorganic material does not burn, resistance to height
Temperature can be applied to high temperature applicationss, and still, under high temperature environment, the thermal coefficient of thermal insulation inorganic material is relative to room temperature environment
Under thermal conductivity can greatly improve.Therefore, still urgent need prepares the heat-barrier material for still having low heat conductivity under high temperature.
In the place for having temperature difference, heat spontaneous can be propagated from high-temperature part to low temperature part, conduction, convection current, radiation
It is three kinds of basic modes of heat transfer, with the raising of high-temperature part temperature, specific gravity shared by radiant heat transfer is increasing.Heat
Radiation is the electromagnetic wave of infrared band, reduces the emissivity on heat-barrier material surface, heat radiation can be effectively reduced in high-temperature component
Propagation between low-temperature components reduces thermal coefficient, effectively improves the heat-proof quality under material at high temperature.
Summary of the invention
In view of this, the main purpose of the present invention is to provide a kind of low infrared emissivity heat-barrier material and its preparation sides
Method.
In order to reach above-mentioned purpose, the present invention provides a kind of low infrared emissivity heat-barrier material, the low infrared hair
The rate heat-barrier material of penetrating includes sequentially connected substrate thermal insulation layer, reflection screen material and low infrared emissivity coating.
Preferably, wherein being connected with gluing oxidant layer between the substrate thermal insulation layer and reflection screen material.
Preferably, wherein the substrate thermal insulation layer be selected from Zirconium oxide fibre, alumina fibre, alumina silicate fibre,
Any one of aluminum borate fiber, high silica fiber, carbon fiber, mullite fiber or aerosil.
Preferably, wherein the radiation shield material is selected from any one of graphite paper, molybdenum foil or aluminium foil.
Preferably, wherein the low infrared emissivity coating by low-launch-rate filler and adhesive according to 1 ︰ 1~
The weight ratio of 1 ︰ 3 is mixed to prepare.
Preferably, wherein the low-launch-rate filler is selected from zirconia powder, aluminum paste, copper powder, aluminium powder or silver powder
Any one of.
Preferably, wherein the adhesive is selected from aluminum phosphate, chromium phosphate, sodium metasilicate, alumina silicate, Aluminum sol or white
Any one of latex.
The present invention also provides a kind of preparation methods of above-mentioned low infrared emissivity heat-barrier material, comprising the following steps:
1) low-launch-rate filler is mixed with adhesive, is stirred, to obtain low infrared emissivity coating；
2) low emissivity coatings obtained in step 1) are uniformly brushed in the surface of reflection screen material, drying；
3) the reflection screen material of low emissivity coatings is combined into substrate thermal insulation layer group brushing obtained in step 2)
One, pressure forming, drying.
Preferably, wherein in step 3), the reflection screen material and substrate for there are low emissivity coatings are brushed
Thermal insulation layer is bonded as one by gluing oxidant layer.
Preferably, wherein the drying specifically includes: material to be dried is put in step 2) and step 3)
Enter in baking oven, with 1~DEG C/min speed is warming up to 100~220 DEG C, 10~20 hours are kept the temperature, natural cooling.
Preferably, wherein in step 3), the molding pressure limit is 0.1~3.0MPa.
Preferably, wherein further including determining substrate thermal insulation layer material according to application environment temperature before step 1)
The step of material and low infrared emissivity coating material.
The emissivity for reducing thermal insulation inorganic material surface is first key technology of the invention, in thermal insulation inorganic material table
The reflection screen material of face complex fire resistant increases radiation shield design, can effectively block heat such as graphite paper, molybdenum foil or aluminium foil
The propagation in material internal is radiated, the thermal coefficient of material is reduced；Further, by having in radiation shield material surface brushing
The coating material of more low infrared emissivity, zirconia powder, aluminum paste, copper powder, aluminium powder or silver powder all have lower emissivity, can
To continue to reduce the emissivity on heat-barrier material surface, heat radiation shared ratio in heat transfer is further decreased, is reduced heat-insulated
Material thermal conductivity.How the coating raw material of resistance to low infrared emissivity are attached to the surface of high-temperature component, is of the invention
Second key technology, the present invention select inorganic adhesive such as aluminum phosphate, chromium phosphate, sodium metasilicate, alumina silicate, aluminium resistant to high temperature molten
Glue is mixed with low emissivity coatings raw material, and low emissivity coatings are brushed on the surface of reflection screen material, to be effectively reduced
The emissivity on high-temperature component surface reduces the heat transfer between material, improves heat-proof quality.
The invention has the benefit that prepared low infrared emissivity heat-barrier material, with substrate heat-barrier material, radiation shield
Material and surface antiradar reflectivity coating material are combined；Wherein, what substrate heat-barrier material was selected is porous inorfil material
Material or aerogel material have lower thermal coefficient, and thermal conductivity is low, have high temperature resistant, fire-retardant, without putrefaction characteristic, are applicable in
It is closed in temperature high field；It selects graphite paper, aluminium foil or molybdenum foil as reflection screen material, the gas stream of material internal can be inhibited
It is dynamic, convective heat transfer is reduced, and the reflection screen material itself has lower infrared emittance, can reduce the radiation of heat-barrier material
Heat transfer；The slin emissivity of reflection screen material is further decreased in the antiradar reflectivity coating that the radiation shield material surface is brushed, is used
To stop most infra-red radiation, inhibition radiant heat transfer；Using inorganic adhesive by low-launch-rate filler such as zirconia powder, aluminium
Silver paste, copper powder, aluminium powder or silver powder brush the slin emissivity that reflection screen material is further decreased on the surface of reflection screen material,
Reduce radiant heat transfer ratio；And low-launch-rate filler secure bond will not fall off phenomenon on the surface of reflection screen material.
Screen material will be reflected using inorganic adhesive to be bonded together with substrate thermal insulation layer, interfacial bonding strength is high, guarantees the whole of material
Phenomenon of rupture will not occur in use for body and stability.Low infrared emissivity heat-barrier material has good high temperature
Heat-proof quality and mechanical property can be used for the heat-insulated of heat structure part surface.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of low infrared emissivity heat-barrier material of the invention；
Wherein, substrate insulating layer material -1；
Reflect screen material -2；
Low emissivity coatings -3；
Gluing oxidant layer -4.
Specific embodiment
For a further understanding of the present invention, the preferred embodiment of the invention is described below with reference to embodiment, still
It should be appreciated that these descriptions are only further explanation the features and advantages of the present invention, rather than to the claims in the present invention
Limitation.
Following material or reagent are commercially available if not illustrating.
As shown in Figure 1, a kind of low infrared emissivity heat-barrier material, including sequentially connected substrate thermal insulation layer 1, gluing oxidant layer
4, screen material 2 and low infrared emissivity coating 3 are reflected；The substrate thermal insulation layer 1 is selected from Zirconium oxide fibre, alumina fibre, silicon
Any one of sour aluminum fiber, aluminum borate fiber, high silica fiber, carbon fiber, mullite fiber or aerosil；Institute
It states reflection screen material 2 and is selected from any one of graphite paper, molybdenum foil or aluminium foil；The low infrared emissivity coating 3 is by low-launch-rate
Filler and adhesive are mixed to prepare according to the weight ratio of 1 ︰, 1~1 ︰ 3；The low-launch-rate filler be selected from zirconia powder, aluminum paste,
Any one of copper powder, aluminium powder or silver powder；The adhesive be selected from aluminum phosphate, chromium phosphate, sodium metasilicate, alumina silicate, Aluminum sol or
Any one of white glue with vinyl.
The preparation method of above-mentioned low infrared emissivity heat-barrier material, comprising the following steps:
1) low-launch-rate filler is mixed with adhesive, stir (speed of agitator between 20-50 revs/min it
Between, mixing time is between 3-5 minutes), to obtain low infrared emissivity coating；
2) low emissivity coatings obtained in step 1) are uniformly brushed on the surface of reflection screen material, is dried later；
3) the reflection screen material of low emissivity coatings and substrate thermal insulation layer pass through glue brushing obtained in step 2)
Adhesive layer is bonded as one, and passes through the pressure forming of 0.1~3.0MPa, drying.
Wherein in step 2) and step 3), the drying is specifically included: material being put into baking oven, with 1~5 DEG C/min
Speed is warming up to 100~220 DEG C, keeps the temperature 10~20 hours, natural cooling.
Embodiment 1
It first weighs 10g zirconia powder, 10g aluminum phosphate adhesive is added, stir that (speed of agitator is 50 revs/min
Clock, mixing time are 3 minutes), it is dispersed in zirconia powder in aluminum phosphate adhesive solution, low infrared emission is thus made
Rate coating.Low infrared emissivity coating is uniformly brushed in 10cm2The surface of the graphite paper material of area, is placed in baking oven, with 5
DEG C/min speed is warming up to 120 DEG C, keeps the temperature 20 hours under air atmosphere, natural cooling can dry, and use aluminum phosphate gluing afterwards
It is bonded together by agent with alumina fibre, applies the briquetting pressure of 0.1MPa to sample, is placed in baking oven, with 5 DEG C/min
Speed is warming up to 120 DEG C, keeps the temperature 15 hours under air atmosphere, natural cooling dries sample, thus obtains low infrared emissivity
Heat-barrier material.
Embodiment 2
It first weighs 10g copper powder, 20g sodium silicate adhesive is added, stir that (speed of agitator is 20 minutes, stirring
Time is 5 minutes), it is dispersed in copper powder in sodium silicate adhesive solution, low infrared emissivity coating is thus made.It will be low
Infrared emittance coating is uniformly brushed in 10cm2The graphite paper material surface of area, is placed in baking oven and dries, with 1 DEG C/min speed
Degree be warming up to 160 DEG C, keep the temperature 20 hours under air atmosphere, natural cooling can dry, afterwards use sodium silicate adhesive by its with
Zirconium oxide fibre is bonded together, and is applied the briquetting pressure of 0.8MPa to sample, is placed in baking oven, with the heating of 5 DEG C/min speed
To 160 DEG C, 18 hours are kept the temperature under air atmosphere, sample is dried, low infrared emissivity heat-barrier material is thus obtained.
Embodiment 3
10g aluminum paste is first weighed, 25g Aluminum sol adhesive is added, stir (speed of agitator is 40 revs/min,
Mixing time is 4 minutes), it is dispersed in aluminum paste in Aluminum sol adhesive solvent, low infrared emissivity painting is thus made
Material.Low infrared emissivity coating is uniformly brushed in 10cm2The molybdenum foil material surface of area, is placed in baking oven, with 4 DEG C/min speed
Degree be warming up to 180 DEG C, keep the temperature 10 hours under air atmosphere, natural cooling can dry, afterwards use Aluminum sol adhesive by its with
Aerosil is bonded together, and is applied the briquetting pressure of 0.5MPa to sample, is placed in baking oven, with 4 DEG C/min speed
180 DEG C are warming up to, 12 hours or more is kept the temperature under air atmosphere, sample is dried, low infrared emissivity heat-barrier material is thus obtained.
Embodiment 4
It first weighs 10g silver powder, 30g chromium phosphate adhesive is added, stir that (speed of agitator is 30 revs/min, is stirred
Mixing the time is 4.5 minutes), it is dispersed in silver powder in chromium phosphate adhesive solvent, low infrared emissivity coating is thus made.
Low infrared emissivity coating is uniformly brushed in 10cm2The aluminum foil material surface of area is placed in baking oven with 4 DEG C/min speed liter
Temperature keeps the temperature 10 hours under air atmosphere to 180 DEG C, and natural cooling can dry, and uses chromium phosphate adhesive by itself and high silicon afterwards
Oxygen fibres bond together, applies the briquetting pressure of 1.8Mpa to sample, is placed in baking oven, is warming up to 180 with 4 DEG C/min speed
DEG C, 15 hours are kept the temperature under air atmosphere, sample is dried, low infrared emissivity heat-barrier material is thus obtained.
Embodiment 5
It first weighs 10g aluminium powder, 30g aluminosilicagel stick is added, stir that (speed of agitator is 35 revs/min, is stirred
Mixing the time is 3.5 minutes), it is dispersed in silver powder in alumina silicate adhesive solvent, low infrared emissivity coating is thus made.
Low infrared emissivity coating is uniformly brushed in 10cm2The graphite paper material surface of area is placed in baking oven with 3 DEG C/min speed
180 DEG C are warming up to, keeps the temperature 16 hours under air atmosphere, natural cooling can dry, and use aluminosilicagel stick by itself and silicon afterwards
Sour aluminum fiber is bonded together, and is applied the briquetting pressure of 3.0Mpa to sample, is placed in baking oven, is warming up to 3 DEG C/min speed
180 DEG C, 18 hours are kept the temperature under air atmosphere, sample is dried, low infrared emissivity heat-barrier material is thus obtained.
Embodiment 6
It first weighs 10g aluminium powder, 28g Virgin's milk glue adhesive agent is added, stir that (speed of agitator is 50 revs/min, is stirred
Mixing the time is 3 minutes), it is dispersed in aluminium powder in white glue with vinyl adhesive solvent, low infrared emissivity coating is thus made.It will
Low infrared emissivity coating is uniformly brushed in 10cm2The graphite paper material surface of area is placed in baking oven with 2 DEG C/min speed liter
Temperature keeps the temperature 16 hours under air atmosphere to 180 DEG C, and natural cooling can dry, and uses Virgin's milk glue adhesive agent by itself and boric acid afterwards
Aluminum fiber is bonded together, and is applied the briquetting pressure of 2.5Mpa to sample, is placed in baking oven, is warming up to 180 with 2 DEG C/min speed
DEG C, 15 hours are kept the temperature under air atmosphere, sample is dried, low infrared emissivity heat-barrier material is thus obtained.
Embodiment 7
It first weighs 10g zirconia powder, 26g aluminum phosphate adhesive is added, stir that (speed of agitator is 40 revs/min
Clock, mixing time are 4.5 minutes), it is dispersed in zirconium oxide in aluminum phosphate adhesive solution, low infrared emission is thus made
Rate coating.Low infrared emissivity coating is uniformly brushed in 10cm2The graphite paper material surface of area, be placed in baking oven with 3 DEG C/
Min speed is warming up to 170 DEG C, keeps the temperature 13 hours under air atmosphere, and natural cooling can dry, and uses aluminum phosphate adhesive afterwards
It is bonded together with carbon fiber, applies the briquetting pressure of 1.3Mpa to sample, is placed in baking oven, with 3 DEG C/min speed liter
Temperature keeps the temperature 20 hours under air atmosphere, sample is dried, low infrared emissivity heat-barrier material is thus obtained to 170 DEG C.
Embodiment 8
It first weighs 10g silver powder, 26g aluminosilicagel stick is added, stir that (speed of agitator is 50 revs/min, is stirred
Mixing the time is 3 minutes), it is dispersed in silver powder in alumina silicate adhesive solvent, low infrared emissivity coating is thus made.It will
Low infrared emissivity coating is uniformly brushed in 10cm2The aluminum foil material surface of area is placed in baking oven with the heating of 4 DEG C/min speed
To 170 DEG C, 15 hours are kept the temperature under air atmosphere, natural cooling can dry, and use aluminosilicagel stick by itself and mullite afterwards
Fibres bond together, applies the briquetting pressure of 2.6Mpa to sample, is placed in baking oven, is warming up to 170 with 4 DEG C/min speed
DEG C, 17 hours are kept the temperature under air atmosphere, sample is dried, low infrared emissivity heat-barrier material is thus obtained.
The performance indicator of low infrared emissivity heat-barrier material obtained by 1-8 of the embodiment of the present invention see the table below 1.
The performance indicator of 1 low infrared emissivity heat-barrier material of table
The test result of 1-8 and upper table 1 can be seen that the low infrared hair of 1-8 of the embodiment of the present invention through the foregoing embodiment
It is reasonable to penetrate rate heat-barrier material structure setting, substrate heat-barrier material and the optional type of low-launch-rate filler are more, can be significantly reduced
Heat-barrier material slin emissivity, while keeping the lower thermal coefficient of heat-barrier material.It in actual application, can be according to making
With needing to select appropriate substrate heat-barrier material and low-launch-rate filler, to satisfy the use demand.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, according to
According to technical spirit any simple modification, equivalent change and modification to the above embodiments of the invention, this hair is still fallen within
In the range of bright technical solution.
Claims (11)
1. a kind of low infrared emissivity heat-barrier material, which is characterized in that the low infrared emissivity heat-barrier material includes successively connecting
Substrate thermal insulation layer, reflection screen material and the low infrared emissivity coating connect.
2. low infrared emissivity heat-barrier material as described in claim 1, which is characterized in that the substrate thermal insulation layer and radiation shield
Gluing oxidant layer is connected between material.
3. low infrared emissivity heat-barrier material as described in claim 1, which is characterized in that the substrate thermal insulation layer is selected from oxidation
Zirconium fiber, alumina fibre, alumina silicate fibre, aluminum borate fiber, high silica fiber, carbon fiber, mullite fiber or titanium dioxide
Any one of silica aerogel.
4. low infrared emissivity heat-barrier material as described in claim 1, which is characterized in that the reflection screen material is selected from graphite
Any one of paper, molybdenum foil or aluminium foil.
5. low infrared emissivity heat-barrier material as described in claim 1, which is characterized in that the low infrared emissivity coating by
Low-launch-rate filler and adhesive are mixed to prepare according to the weight ratio of 1 ︰, 1~1 ︰ 3.
6. low infrared emissivity heat-barrier material as claimed in claim 5, which is characterized in that the low-launch-rate filler is selected from oxygen
Change any one of zirconium powder, aluminum paste, copper powder, aluminium powder or silver powder.
7. the low infrared emissivity heat-barrier material as described in claim 2 or 5, which is characterized in that the adhesive is selected from phosphoric acid
Any one of aluminium, chromium phosphate, sodium metasilicate, alumina silicate, Aluminum sol or white glue with vinyl.
8. a kind of preparation method of the described in any item low infrared emissivity heat-barrier materials of claim 1-7, which is characterized in that packet
Include following steps:
1) low-launch-rate filler is mixed with adhesive, is stirred evenly, to obtain low infrared emissivity coating；
2) low emissivity coatings obtained in step 1) are uniformly brushed in the surface of reflection screen material, drying；
3) the reflection screen material of low emissivity coatings is combined into one with substrate thermal insulation layer brushing obtained in step 2),
Pressure forming, drying.
9. the preparation method of low infrared emissivity heat-barrier material as claimed in claim 8, which is characterized in that in step 3),
Brushing has the reflection screen material of low emissivity coatings to be bonded as one with substrate thermal insulation layer by gluing oxidant layer.
10. the preparation method of low infrared emissivity heat-barrier material as claimed in claim 8, which is characterized in that in step 2) and
In step 3), the drying is specifically included: material to be dried is put into baking oven, with 1~DEG C/min speed is warming up to 100~
220 DEG C, 10~20 hours are kept the temperature, natural cooling.
11. the preparation method of low infrared emissivity heat-barrier material as claimed in claim 8, which is characterized in that in step 3),
The molding pressure limit is 0.1~3.0MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811610801.4A CN109677035A (en) | 2018-12-27 | 2018-12-27 | A kind of low infrared emissivity heat-barrier material and preparation method thereof |
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| CN201811610801.4A CN109677035A (en) | 2018-12-27 | 2018-12-27 | A kind of low infrared emissivity heat-barrier material and preparation method thereof |
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| CN109677035A true CN109677035A (en) | 2019-04-26 |
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| CN201811610801.4A Pending CN109677035A (en) | 2018-12-27 | 2018-12-27 | A kind of low infrared emissivity heat-barrier material and preparation method thereof |
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| CN111387557A (en) * | 2020-03-19 | 2020-07-10 | 四川三联新材料有限公司 | Multilayer heat insulation material, preparation method and application thereof, and cigarette heating appliance |
| CN113651624A (en) * | 2021-09-22 | 2021-11-16 | 武汉理工大学 | Heat insulation coating with low thermal infrared emissivity and preparation method thereof |
| CN113831104A (en) * | 2021-10-09 | 2021-12-24 | 航天特种材料及工艺技术研究所 | Ultra-high temperature gradient nano heat-insulating material based on reflecting screen and preparation method thereof |
| CN113858724A (en) * | 2021-10-09 | 2021-12-31 | 航天特种材料及工艺技术研究所 | High-temperature-resistant multi-layer heat-insulating material based on multifunctional reflecting screen and preparation method thereof |
| CN113981732A (en) * | 2021-09-10 | 2022-01-28 | 航天特种材料及工艺技术研究所 | Alumina/zirconia fiber composite heat-insulating material and preparation method thereof |
| CN114347580A (en) * | 2021-12-10 | 2022-04-15 | 中国建筑材料科学研究总院有限公司 | High-temperature-resistant multilayer heat insulation structure and preparation method thereof |
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| CN113981732A (en) * | 2021-09-10 | 2022-01-28 | 航天特种材料及工艺技术研究所 | Alumina/zirconia fiber composite heat-insulating material and preparation method thereof |
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| CN113858724A (en) * | 2021-10-09 | 2021-12-31 | 航天特种材料及工艺技术研究所 | High-temperature-resistant multi-layer heat-insulating material based on multifunctional reflecting screen and preparation method thereof |
| CN113831104B (en) * | 2021-10-09 | 2022-12-20 | 航天特种材料及工艺技术研究所 | Ultra-high temperature gradient nano heat-insulating material based on reflecting screen and preparation method thereof |
| CN114347580A (en) * | 2021-12-10 | 2022-04-15 | 中国建筑材料科学研究总院有限公司 | High-temperature-resistant multilayer heat insulation structure and preparation method thereof |
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Application publication date: 20190426 |