CN109671725B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN109671725B CN109671725B CN201811637376.8A CN201811637376A CN109671725B CN 109671725 B CN109671725 B CN 109671725B CN 201811637376 A CN201811637376 A CN 201811637376A CN 109671725 B CN109671725 B CN 109671725B
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- 239000000758 substrate Substances 0.000 claims abstract description 249
- 239000002184 metal Substances 0.000 claims abstract description 63
- 238000012360 testing method Methods 0.000 claims description 39
- 229920001721 polyimide Polymers 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000005452 bending Methods 0.000 abstract description 20
- 239000000565 sealant Substances 0.000 description 33
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display panel and a display device. The display panel comprises a display area and a non-display area positioned on one side of the display area; the non-display area comprises a first routing area which is not bendable, a second routing area which is bendable and a third routing area which is not bendable; the first wiring area is adjacent to the display area; the second wiring area is positioned on one side of the first wiring area far away from the display area; the third wiring area is positioned on one side of the second wiring area far away from the display area; the display panel comprises a first substrate and a second substrate which are oppositely arranged; the first substrate and the second substrate extend into the non-display area; the area of the second substrate in the second wiring area is smaller than that of the first substrate in the second wiring area. In the invention, the second substrate extending to the non-display area can relieve bending stress of the metal wires in the first wire routing area, the second wire routing area and the third wire routing area and can relieve pulling stress of the package of the first substrate and the second substrate at the junction of the display area and the first wire routing area.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
[ background of the invention ]
Currently, display technologies have penetrated various aspects of people's daily lives, and accordingly, more and more materials and technologies are used for display screens. Nowadays, the mainstream display screens mainly include liquid crystal display screens and organic light emitting diode display screens. Wherein, the display panel adopting the flexible material can be bent. However, the display panel is easily broken when bent.
[ summary of the invention ]
In order to solve the above technical problems, the present invention provides a display panel and a display device.
In one aspect, the present invention provides a display panel.
The display panel comprises a display area and a non-display area positioned on one side of the display area;
the non-display area comprises a first routing area which is not bendable, a second routing area which is bendable and a third routing area which is not bendable;
the first wiring area is adjacent to the display area;
the second wiring area is positioned on one side of the first wiring area far away from the display area;
the third wiring area is positioned on one side of the second wiring area far away from the display area;
the display panel comprises a first substrate and a second substrate which are oppositely arranged;
the first substrate and the second substrate extend into the non-display area;
the area of the second substrate in the second wiring area is smaller than that of the first substrate in the second wiring area.
Optionally, a ratio of an area of the second substrate in the second routing area to an area of the first substrate in the second routing area is less than or equal to 70%.
Optionally, the display panel includes a polarizer, the polarizer is located on a side of the second substrate away from the first substrate, and the polarizer is disposed in the display area and the first wiring area.
Optionally, the polarizer is further disposed in the third routing area.
Optionally, the second substrate is not disposed in the second routing area.
Optionally, the second substrate is provided with a first opening region in the second routing region.
Optionally, a ratio of an area of the first opening region to an area of the first substrate in the second routing region is greater than or equal to 30%.
Optionally, the first substrate is provided with a plurality of test terminals in the third routing area, and the test terminals are located on one side of the first substrate close to the second substrate; the second substrate is provided with a second opening area in the third wiring area, and the second opening area exposes the test terminal.
Optionally, the second opening region includes a plurality of second openings, and an area of the second openings is smaller than an area of the test terminals.
Optionally, a ratio of an area of the second opening to an area of the test terminal is less than or equal to 97%.
Optionally, the first substrate and the second substrate are bonded by coating frame glue; the frame glue is arranged in the display area, the first wiring area and the third wiring area.
Optionally, the display panel further includes a supporting pillar disposed in the non-display region and between the first substrate and the second substrate.
Optionally, the display panel further includes a plurality of metal traces disposed in the non-display area, and a projection of the metal trace on the first substrate is separated from a projection of the support pillar on the first substrate.
Optionally, the metal trace is bent at the second routing region toward a center of the second routing region.
Optionally, the display panel further includes an organic film disposed in the non-display area and covering the metal traces.
Optionally, the first substrate comprises a flexible polyimide film and the second substrate comprises a flexible polyimide film.
In another aspect, the present invention provides a display device including the display panel.
In the invention, the first substrate and the second substrate extend into the second wiring area, the first substrate and the second substrate adopt flexible polyimide films, and the first substrate and the second substrate can be bent in the second wiring area; the metal wires extend in the second wire routing area and are arranged on the first substrate, and the metal wires are bent along with the first substrate in the second wire routing area. When the first substrate is bent, the first substrate is subjected to bending stress in the second wiring area, and the plurality of metal wirings are easily broken due to the bending stress in the second wiring area; at the moment, the second substrate can relieve the bending stress of the first substrate in the second wiring area, so that the bending stress of the metal wires in the second wiring area is relieved, and the metal wires are prevented from being broken in the second wiring area.
The first substrate and the second substrate extend to the first wiring area and the third wiring area, the metal wirings extend to the first wiring area and the third wiring area and are arranged on the first substrate, and the first wiring area and the third wiring area are close to the second wiring area; when the first substrate and the second substrate are bent in the second wiring area, the first substrate is subjected to pulling stress in the first wiring area and the third wiring area, and the plurality of metal wirings are easily broken due to the pulling stress in the first wiring area and the third wiring area; at this time, the second substrate relieves the pulling stress of the first substrate in the first routing area and the third routing area, so that the pulling stress of the metal wires in the first routing area and the third routing area is relieved, and the metal wires are prevented from being broken in the first routing area and the third routing area. The first substrate and the second substrate extend to the display area and encapsulate the film layer therein, and the encapsulation of the first substrate and the second substrate extends to the junction of the display area and the first wiring area; when the first substrate is subjected to a pulling stress in the first wiring area, the package of the first substrate and the second substrate is easy to damage when the package of the first substrate and the second substrate is subjected to the pulling stress at the junction of the display area and the first wiring area; at the moment, the second substrate relieves the pulling stress of the first substrate in the first wiring area, further relieves the pulling stress of the package of the first substrate and the second substrate at the junction of the display area and the first wiring area, and avoids the damage of the package of the first substrate and the second substrate at the junction of the display area and the first wiring area. In addition, the second substrate completely covers the metal wires in the first wire routing area and the third wire routing area, and the metal wires are protected from being scratched and polluted in the first wire routing area and the third wire routing area; the area of the second substrate in the second wiring area is smaller than that of the first substrate in the second wiring area, and the first substrate can be easily bent greatly in the second wiring area due to the small area of the second substrate in the second wiring area.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of a prior art display panel 100;
FIG. 2 is a schematic cross-sectional view of a display panel 200 according to an embodiment of the invention;
FIG. 3 is a schematic cross-sectional view of another display panel 200 according to an embodiment of the invention;
FIG. 4 is a schematic cross-sectional view of another display panel 200 according to an embodiment of the invention;
FIG. 5 is a schematic cross-sectional view of another display panel 200 according to an embodiment of the invention;
FIG. 6 is a schematic cross-sectional view of another display panel 200 according to an embodiment of the invention;
FIG. 7 is a schematic plan view of a first substrate 210 of a display panel 200 according to another embodiment of the invention;
FIG. 8 is a schematic plan view of a second substrate 220 of a display panel 200 according to another embodiment of the invention;
FIG. 9 is a schematic plan view of another display panel 200 according to an embodiment of the invention;
FIG. 10 is a schematic plan view of a frame adhesive 250 of another display panel 200 according to an embodiment of the invention;
FIG. 11 is a schematic plan view of a frame adhesive 250 of another display panel 200 according to an embodiment of the invention;
fig. 12 is a schematic plan view of metal traces 270 in another display panel 200 according to another embodiment of the invention;
fig. 13 is a schematic plan view of a display device 300 according to an embodiment of the invention.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that although the terms first, second, etc. may be used herein to describe devices in accordance with embodiments of the present invention, these devices should not be limited by these terms. These terms are only used to distinguish one device from another. For example, a first device may also be referred to as a second device, and similarly, a second device may also be referred to as a first device, without departing from the scope of embodiments of the present invention.
Fig. 1 is a schematic cross-sectional view of a display panel 100 in the prior art.
As shown in fig. 1, in the prior art, a display panel 100 includes a display area 101, a non-display area 102, the non-display area 102 being located at one side of the display area 101; the display panel 100 includes a first substrate 110 and a second substrate 120, the first substrate 110 extends in the display area 101 and the non-display area 102, the second substrate 120 extends in the display area 101, the first substrate 110 and the second substrate 120 are made of flexible materials, such as polyimide films; the display panel 100 further includes metal traces disposed on the first substrate 110 and extending in the display area 101 and the non-display area 102.
However, when the first substrate 110 is bent in the non-display area 102, the first substrate 110 is subjected to a large bending stress, and the display panel 100 is easily damaged by a pulling stress at a boundary between the display area 101 and the non-display area 102; meanwhile, the metal traces are bent in the non-display area 102, and the metal traces are easily broken due to a large bending stress; in addition, the metal traces are not sufficiently protected in the non-display area 102.
In order to solve the above technical problems, embodiments of the present invention provide a display panel and a display device.
FIG. 2 is a schematic cross-sectional view of a display panel 200 according to an embodiment of the invention; FIG. 3 is a schematic cross-sectional view of another display panel 200 according to an embodiment of the invention; FIG. 4 is a schematic cross-sectional view of another display panel 200 according to an embodiment of the invention; FIG. 5 is a schematic cross-sectional view of another display panel 200 according to an embodiment of the invention; FIG. 6 is a schematic cross-sectional view of another display panel 200 according to an embodiment of the invention; FIG. 7 is a schematic plan view of a first substrate 210 of a display panel 200 according to another embodiment of the invention; FIG. 8 is a schematic plan view of a second substrate 220 of a display panel 200 according to another embodiment of the invention; FIG. 9 is a schematic plan view of another display panel 200 according to an embodiment of the invention; FIG. 10 is a schematic plan view of a frame adhesive 250 of another display panel 200 according to an embodiment of the invention; FIG. 11 is a schematic plan view of a frame adhesive 250 of another display panel 200 according to an embodiment of the invention; fig. 12 is a schematic plan view of metal traces 270 in another display panel 200 according to another embodiment of the invention.
As shown in fig. 2 to 3, in the embodiment of the present invention, the display panel 200 includes a display area 201 and a non-display area 202 located at one side of the display area 201;
the non-display area 202 comprises a first routing area 202A which is not bendable, a second routing area 202B which is bendable and a third routing area 202C which is not bendable;
the first routing area 202A is adjacent to the display area 201;
the second routing area 202B is located on a side of the first routing area 202A away from the display area 201;
the third wiring area 202C is located on a side of the second wiring area 202B away from the display area 201;
the display panel 200 includes a first substrate 210 and a second substrate 220 disposed opposite to each other;
the first substrate 210 and the second substrate 220 extend into the non-display region 202;
the area of the second substrate 220 in the second routing area 202B is smaller than the area of the first substrate 210 in the second routing area 202B.
In the embodiment of the present invention, the first substrate 210 and the second substrate 220 extend into the second routing area 202B, the first substrate 210 and the second substrate 220 are made of flexible polyimide films, and the first substrate 210 and the second substrate 220 can be bent in the second routing area 202B; the metal wires extend into the second wire area 202B and are disposed on the first substrate 210, and the metal wires are bent along with the first substrate 210 in the second wire area 202B; during bending, the first substrate 210 is subjected to bending stress in the second routing area 202B, and the plurality of metal traces are easily broken by the bending stress in the second routing area 202B; at this time, the second substrate 220 in the second routing area 202B can relieve the bending stress of the first substrate 210 in the second routing area 202B, so as to relieve the bending stress of the metal traces in the second routing area 202B, and prevent the metal traces from being broken in the second routing area 202B. The first substrate 210 and the second substrate 220 extend to the first routing area 202A and the third routing area 202C, the plurality of metal routing wires extend to the first routing area 202A and the third routing area 202C and are arranged on the first substrate 210, and the first routing area 202A and the third routing area 202C are adjacent to the second routing area 202B; when the first substrate 210 and the second substrate 220 are bent in the second routing area 202B, the first substrate 210 is subjected to a pulling stress in the first routing area 202A and the third routing area 202C, and the plurality of metal traces are subjected to the pulling stress in the first routing area 202A and the third routing area 202C and are prone to break; at this time, the second substrate 220 relieves the pulling stress of the first substrate 210 in the first routing area 202A and the third routing area 202C, so as to relieve the pulling stress of the metal wires in the first routing area 202A and the third routing area 202C and prevent the metal wires from being broken in the first routing area 202A and the third routing area 202C. The first substrate 210 and the second substrate 220 extend to the display area 201 and encapsulate the film layers therein, and the encapsulation of the first substrate 210 and the second substrate 220 extends to the boundary between the display area 201 and the first wiring area 202A; when the first substrate 210 is subjected to a pulling stress in the first routing area 202A, the package of the first substrate 210 and the second substrate 220 at the boundary between the display area 201 and the first routing area 202A is easily damaged by the pulling stress; at this time, the second substrate 220 relieves the pulling stress of the first substrate 210 in the first routing area 202A, so as to relieve the pulling stress of the package of the first substrate 210 and the second substrate 220 at the boundary between the display area 201 and the first routing area 202A, and avoid the damage of the package of the first substrate 210 and the second substrate 220 at the boundary between the display area 201 and the first routing area 202A. In addition, the second substrate 220 completely covers the plurality of metal traces in the first routing area 202A and the third routing area 202C, and protects the plurality of metal traces from being scratched and contaminated in the first routing area 202A and the third routing area 202C; the area of the second substrate 220 in the second routing area 202B is smaller than the area of the first substrate 210 in the second routing area 202B, and the smaller area of the second substrate 220 in the second routing area 202B can make the first substrate 210 easily bend in a large scale in the second routing area 202B, thereby preventing the first substrate 210 and the second substrate 220 from separating when bending.
In the embodiment of the present invention, the first routing area 202A, the second routing area 202B, and the third routing area 202C are located in the lower bezel area in the non-display area 202. The metal traces in the non-display area 202 are electrically connected to the integrated circuit chip in the non-display area 202, the metal traces in the non-display area 202 are electrically connected to the signal lines such as the data lines or the scan lines in the display area 201, and the integrated circuit chip inputs signals to the signal lines such as the data lines or the scan lines through the metal traces in the non-display area 202, so that the display panel 200 realizes display by using a liquid crystal optical effect or realizes display by using an organic light emitting diode.
As shown in fig. 2, in the embodiment of the invention, the second substrate 220 is not disposed in the second routing area 202B. The second substrate 220 is disposed in the first wiring region 202A or the third wiring region 202C. The second substrate 220 does not affect the first substrate 210 to bend in the second routing area 202B, so as to prevent the first substrate 210 and the second substrate 220 from separating during bending.
As shown in fig. 3, in the embodiment of the invention, the ratio of the area of the second substrate 220 in the second routing area 202B to the area of the first substrate 210 in the second routing area 202B is less than or equal to 70%.
In the embodiment of the present invention, the ratio of the area of the second substrate 220 in the second routing area 202B to the area of the first substrate 210 in the second routing area 202B is less than or equal to 70%, and the second substrate 220 covers a part of the first substrate 210 in the second routing area 202B, so that the first substrate 210 is easy to bend greatly in the second routing area 202B, and the first substrate 210 and the second substrate 220 are prevented from being separated when bending.
As shown in fig. 4, in the embodiment of the invention, the display panel 200 includes a polarizer 230, the polarizer 230 is located on a side of the second substrate 220 away from the first substrate 210, and the polarizer 230 is disposed in the display area 201 and the first wiring area 202A.
In the embodiment of the invention, the polarizer 230 is disposed in the display area 201 and on a side of the second substrate 220 away from the first substrate 210, so that the light emitted from the display area 201 is polarized. The polarizer 230 is disposed in the first routing area 202A; when the first substrate 210 and the second substrate 220 are bent in the second routing area 202B, the polarizer 230 relieves the pulling stress applied to the first substrate 210 in the first routing area 202A, and relieves the pulling stress applied to the package of the first substrate 210 and the second substrate 220 at the interface of the display area 201 and the first routing area 202A. The polarizer 230 and the second substrate 220 are commonly disposed in the first routing area 202A, so as to greatly relieve the above-mentioned pulling stress. In addition, the polarizer 230 completely covers the plurality of metal traces in the first trace area 202A, and protects the plurality of metal traces from being scratched and contaminated in the first trace area 202A.
As shown in fig. 4, in the embodiment of the invention, the polarizer 230 is further disposed in the third wiring region 202C. When the first substrate 210 and the second substrate 220 are bent in the second routing area 202B, the polarizer 230 relieves the pulling stress of the first substrate 210 in the third routing area 202C. The polarizer 230 and the second substrate 220 are commonly disposed in the third wiring region 202C, so as to greatly relieve the above-mentioned pulling stress. In addition, the polarizer 230 completely covers the plurality of metal traces in the third trace area 202C, and protects the plurality of metal traces from being scratched and contaminated in the third trace area 202C.
In the embodiment of the present invention, the polarizer 230 and the second substrate 220 are disposed in the first routing area 202A and the third routing area 202C together, the second substrate 220 is disposed in the second routing area 202B, the first substrate 210 and the second substrate 220 are bonded by the sealant 250, and the sealant 250 is disposed in the first routing area 202A and the third routing area 202C; when the first substrate 210 and the second substrate 220 are bent in the second routing area 202B, the polarizer 230, the second substrate 220, and the sealant 250 greatly relieve the bending stress of the first substrate 210 in the second routing area 202B and the pulling stress of the first routing area 202A and the third routing area 202C, and greatly relieve the pulling stress of the package of the first substrate 210 and the second substrate 220 at the boundary of the display area 201 and the first routing area 202A.
As shown in fig. 3 to 6, 8 and 9, in the embodiment of the invention, the second substrate 220 is provided with a first opening region 221 in the second routing region 202B. The first open region 221 is free of the flexible polyimide film. The flexible polyimide film in the second substrate 220 surrounds the first opening region 221 within the second wiring region 202B. The first opening region 221 does not generate an acting force for blocking the first substrate 210 from bending in the second wiring region 202B, so that the first substrate 210 is easy to bend greatly in the second wiring region 202B, and the first substrate 210 and the second substrate 220 are prevented from being separated during bending; moreover, when the first substrate 210 and the second substrate 220 are bent in the second routing area 202B, the flexible polyimide film in the second substrate 220 is in the second routing area 202B, so as to relieve the bending stress applied to the first substrate 210 in the second routing area 202B.
Optionally, a ratio of an area of the first opening region 221 to an area of the first substrate 210 in the second routing region 202B is greater than or equal to 30%. The area of the first opening region 221 is larger, so that the force for blocking the first substrate 210 from bending in the second wiring region 202B is smaller, and the first substrate 210 is easier to bend in the second wiring region 202B.
As shown in fig. 6, 7 to 9, in the embodiment of the present invention, the first substrate 210 is provided with a plurality of test terminals 240 in the third routing area 202C, and the test terminals 240 are located on a side of the first substrate 210 close to the second substrate 220; the second substrate 220 is provided with a second open region 222 in the third wiring region 202C, and the second open region 222 exposes the test terminal 240.
In the embodiment of the present invention, the test terminal 240 is used for testing a circuit to be tested in the display panel 200, such as a scan line or a data line; the test terminal 240 is electrically connected with the scan line short-circuit bar, and the scan line short-circuit bar is electrically connected with the scan line, or the test terminal 240 is electrically connected with the data line short-circuit bar, and the data line short-circuit bar is electrically connected with the data line; at the time of testing, the testing device contacts the test terminal 240 and inputs a test signal at the test terminal 240, the test signal being transmitted to the scan line or the data line. The second opened region 222 exposes the test terminal 240 so that the test device contacts the test terminal 240 through the second opened region 222 and inputs a test signal at the test terminal 240.
In the embodiment of the present invention, the second opening region 222 includes a plurality of second openings, and the area of the second openings is smaller than that of the test terminals 240. The area of the second opening is smaller, and the area of the test terminal 240 is larger, so that the test device basically contacts the test terminal 240 through the second opening area 222 without contacting the metal wire in the non-display area 202, and the test device is prevented from scratching the metal wire in the non-display area 202.
Optionally, a ratio of an area of the second opening to an area of the test terminal 240 is less than or equal to 97%. Thus, when the testing device contacts the testing terminal 240 through the second opening region 222, the second opening defines a position of the testing device, and the testing device can only contact the testing terminal 240 through the second opening region 222, and cannot contact the metal trace in the non-display region 202.
As shown in fig. 2 to 6, 10 and 11, in the embodiment of the invention, the first substrate 210 and the second substrate 220 are bonded by the coating frame glue 250; the sealant 250 is disposed in the display region 201, the first wiring region 202A, and the third wiring region 202C.
In the embodiment of the invention, the first substrate 210 and the second substrate 220 are bonded by coating the sealant 250, or by coating the sealant 250 and sealing; the sealant 250 is disposed in the display area 201, the first wiring area 202A, and the third wiring area 202C, so as to prevent moisture; when the first substrate 210 and the second substrate 220 are bent in the second routing area 202B, the sealant 250 relieves the pulling stress on the first substrate 210 in the first routing area 202A and the third routing area 202C. In addition, the sealant 250 is not disposed in the second routing region 202B, so that the first substrate 210 is easily bent greatly in the second routing region 202B.
It should be noted that fig. 2 to 6 are only partial cross-sectional schematic views of the embodiment of the invention, and fig. 2 to 6 only show a partial sealant 250. As shown in fig. 10 and 11, sealant 250 is disposed at the peripheral edge of the display area 201, the peripheral edge of the first wiring area 202A, and the peripheral edge of the third wiring area 202C.
Specifically, as shown in fig. 10, a closed sealant 250 is coated at the edge around the display area 201, the edge around the first wire routing area 202A, and the edge around the third wire routing area 202C, the closed sealant 250 surrounds the display area 201, the first wire routing area 202A, and the third wire routing area 202C, and the first substrate 210 and the second substrate 220 are bonded by the closed sealant 250.
As shown in fig. 11, the sealant 250 includes a first sealant 250A and a second sealant 250B, the sealant 250A is coated on the edge of the periphery of the display region 201, and the sealant 250A surrounds the display region 201; coating the unsealed frame glue 250A on the upper side and the lower side of the first wiring region 202A, coating the unsealed frame glue 250A on the left side and the right side of the first wiring region 202A, coating the unsealed frame glue 250A on the upper side and the lower side of the third wiring region 202C, coating the unsealed frame glue 250A on the left side and the right side of the third wiring region 202C, and bonding the first substrate 210 and the second substrate 220 through the sealed frame glue 250A of the display region 201, the unsealed frame glue 250A of the first wiring region 202A and the unsealed frame glue 250A of the third wiring region 202C; after the first substrate 210 and the second substrate 220 are bonded, the second sealant 250B is coated on the left side and the right side of the first wiring region 202A, the sealant 250A on the upper side and the lower side of the first wiring region 202A is connected with the second sealant 250B on the left side and the right side of the first wiring region 202A, and surrounds the first wiring region 202A, the second sealant 250B is coated on the left side and the right side of the third wiring region 202C, the sealant 250A on the upper side and the lower side of the third wiring region 202C is connected with the second sealant 250B on the left side and the right side of the third wiring region 202C, and surrounds the third wiring region 202C, so that the sealant 250A and the second sealant 250B of the first wiring region 202A are closed, and the sealant 250A and the second sealant 250B of the third wiring region 202C are closed.
As shown in fig. 5, in the embodiment of the invention, the display panel 200 further includes a supporting pillar 260, and the supporting pillar 260 is disposed in the non-display region 202 and between the first substrate 210 and the second substrate 220. The support posts 260 may be disposed in the first routing area 202A, the second routing area 202B, or the third routing area 202C. When the first substrate 210 and the second substrate 220 are bent in the second routing area 202B, the supporting posts 260 support the first substrate 210 and the second substrate 220 in the first routing area 202A, the second routing area 202B, or the third routing area 202C.
In the embodiment of the invention, the display panel 200 further includes a plurality of metal traces 270 disposed in the non-display area 202, and a projection of the metal traces 270 on the first substrate 210 is separated from a projection of the supporting pillars 260 on the first substrate 210. The metal traces 270 are electrically connected to the integrated circuit chip in the non-display area 202, the metal traces 270 are electrically connected to the signal lines such as the data lines or the scan lines in the display area 201, and the integrated circuit chip inputs signals to the signal lines such as the data lines or the scan lines through the metal traces 270. The projection of the metal traces 270 on the first substrate 210 is separated from the projection of the support posts 260 on the first substrate 210. The support posts 260 do not exert a force on the metal traces 270. When the first substrate 210 and the second substrate 220 are bent in the second routing area 202B, the supporting pillars 260 do not damage the metal traces 270.
As shown in fig. 12, in the embodiment of the invention, the metal trace 270 is bent toward the center of the second routing area 202B at the second routing area 202B. The sealant 250 is disposed on the left and right sides of the first routing region 202A, the left and right sides of the third routing region 202C, and the sealant 250 is not disposed on the left and right sides of the second routing region 202B. When the first substrate 210 and the second substrate 220 are bent in the second routing area 202B, the left side and the right side of the second routing area 202B are pressed by the sealant 250 on the left side and the right side of the first routing area 202A, and are pressed by the sealant 250 on the left side and the right side of the third routing area 202C; at this time, the stress on the left side and the right side of the second routing area 202B is large; thus, the metal trace 270 is bent toward the center of the second routing area 202B in the second routing area 202B, and away from the left side and the right side of the second routing area 202B, so as to avoid being subjected to a large stress.
In the embodiment of the invention, the display panel 200 further includes an organic film disposed in the non-display area 202 and covering the metal traces 270. The organic film is disposed in the second wiring region 202B, the second substrate 220 is not disposed in the second wiring region 202B, or the second substrate 220 is disposed in the second wiring region 202B with a first opening region 221, and the organic film protects the metal wiring 270 from being scratched and contaminated in the second wiring region 202B; the organic film is disposed in the first wire-bonding area 202A and the third wire-bonding area 202C, the second substrate 220 is disposed in the first wire-bonding area 202A and the third wire-bonding area 202C, and the organic film and the second substrate 220 protect the metal wires 270 from being scratched and contaminated in the first wire-bonding area 202A and the third wire-bonding area 202C. In addition, the organic film includes an organic insulator, and the dielectric constant of the organic insulator is small; in the first routing area 202A, the second routing area 202B, and the third routing area 202C, when the organic insulator with a smaller dielectric constant is disposed between two adjacent metal traces 270, the organic insulator with a smaller dielectric constant can make the parasitic capacitance between two adjacent metal traces 270 smaller, so as to suppress the crosstalk between the metal traces 270.
In an embodiment of the present invention, the first substrate 210 includes a flexible polyimide film, and the second substrate 220 includes a flexible polyimide film. The first substrate 210 and the second substrate 220 are made of flexible polyimide films and are bent in the second routing area 202B.
Fig. 13 is a schematic plan view of a display device 300 according to an embodiment of the invention.
As shown in fig. 13, in the embodiment of the present invention, the display device 300 includes the display panel 200. The display device 300 is an electronic device such as a smartphone or a flat panel television. The display panel 200 is described above and will not be described in detail.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (16)
1. A display panel, comprising a display area and a non-display area located at one side of the display area;
the non-display area comprises a first routing area which is not bendable, a second routing area which is bendable and a third routing area which is not bendable;
the first wiring area is adjacent to the display area;
the second wiring area is positioned on one side of the first wiring area far away from the display area;
the third wiring area is positioned on one side of the second wiring area far away from the display area;
the display panel comprises a first substrate and a second substrate which are oppositely arranged;
the first substrate and the second substrate extend into the non-display area;
the area of the second substrate in the second wiring area is smaller than that of the first substrate in the second wiring area;
the first substrate and the second substrate are bonded through coating frame glue; the frame glue is arranged in the display area, the first wiring area and the third wiring area.
2. The display panel according to claim 1, wherein a ratio of an area of the second substrate in the second wiring region to an area of the first substrate in the second wiring region is 70% or less.
3. The display panel according to claim 1, wherein the display panel comprises a polarizer disposed on a side of the second substrate away from the first substrate, the polarizer being disposed in the display region and the first wiring region.
4. The display panel according to claim 3, wherein the polarizer is further provided in the third wiring region.
5. The display panel according to claim 1, wherein the second substrate is not disposed in the second routing region.
6. The display panel according to claim 1, wherein the second substrate is provided with a first open region in the second wiring region.
7. The display panel according to claim 6, wherein a ratio of an area of the first opening region to an area of the first substrate in the second wiring region is greater than or equal to 30%.
8. The display panel according to claim 1, wherein the first substrate is provided with a plurality of test terminals in the third wiring region, the test terminals being located on a side of the first substrate close to the second substrate; the second substrate is provided with a second opening area in the third wiring area, and the second opening area exposes the test terminal.
9. The display panel according to claim 8, wherein the second opening region includes a plurality of second openings, and an area of the second openings is smaller than an area of the test terminals.
10. The display panel according to claim 9, wherein a ratio of an area of the second opening to an area of the test terminal is less than or equal to 97%.
11. The display panel according to claim 1, further comprising a support pillar disposed in a non-display region between the first substrate and the second substrate.
12. The display panel of claim 11, further comprising a plurality of metal traces disposed in the non-display area, wherein a projection of the metal traces on the first substrate is separated from a projection of the support posts on the first substrate.
13. The display panel of claim 12, wherein the metal traces are bent at the second routing region toward a center of the second routing region.
14. The display panel according to claim 13, further comprising an organic film disposed in the non-display region and covering the metal traces.
15. The display panel according to any one of claims 1 to 14, wherein the first substrate comprises a flexible polyimide film, and wherein the second substrate comprises a flexible polyimide film.
16. A display device characterized by comprising the display panel according to any one of claims 1 to 15.
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| CN201811637376.8A CN109671725B (en) | 2018-12-29 | 2018-12-29 | Display panel and display device |
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| CN201811637376.8A CN109671725B (en) | 2018-12-29 | 2018-12-29 | Display panel and display device |
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| CN109671725A CN109671725A (en) | 2019-04-23 |
| CN109671725B true CN109671725B (en) | 2020-10-27 |
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| CN111667764A (en) * | 2020-06-28 | 2020-09-15 | 昆山国显光电有限公司 | Flexible display panel and display device |
| CN113066366B (en) * | 2021-03-15 | 2022-05-17 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
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| CN105892160A (en) * | 2016-05-27 | 2016-08-24 | 厦门天马微电子有限公司 | Liquid crystal display panel |
| CN105975117A (en) * | 2015-03-12 | 2016-09-28 | 株式会社日本显示器 | Display device and method for manufacturing display device |
| CN106873265A (en) * | 2017-03-10 | 2017-06-20 | 惠科股份有限公司 | A kind of substrate, display panel and display device |
| CN107861658A (en) * | 2017-11-29 | 2018-03-30 | 上海中航光电子有限公司 | Display panel and display device |
| CN108230907A (en) * | 2018-01-03 | 2018-06-29 | 上海天马有机发光显示技术有限公司 | Flexible display screen and display device |
| CN108682307A (en) * | 2018-07-18 | 2018-10-19 | 昆山国显光电有限公司 | Display panel and display device |
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| KR102150533B1 (en) * | 2013-11-21 | 2020-09-01 | 엘지디스플레이 주식회사 | Organic light emitting display device and method of manufacturing organic light emmiting display device |
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| CN105975117A (en) * | 2015-03-12 | 2016-09-28 | 株式会社日本显示器 | Display device and method for manufacturing display device |
| CN105892160A (en) * | 2016-05-27 | 2016-08-24 | 厦门天马微电子有限公司 | Liquid crystal display panel |
| CN106873265A (en) * | 2017-03-10 | 2017-06-20 | 惠科股份有限公司 | A kind of substrate, display panel and display device |
| CN107861658A (en) * | 2017-11-29 | 2018-03-30 | 上海中航光电子有限公司 | Display panel and display device |
| CN108230907A (en) * | 2018-01-03 | 2018-06-29 | 上海天马有机发光显示技术有限公司 | Flexible display screen and display device |
| CN108682307A (en) * | 2018-07-18 | 2018-10-19 | 昆山国显光电有限公司 | Display panel and display device |
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| CN109671725A (en) | 2019-04-23 |
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