CN109671664A - Wafer slide holder - Google Patents
Wafer slide holder Download PDFInfo
- Publication number
- CN109671664A CN109671664A CN201811533651.1A CN201811533651A CN109671664A CN 109671664 A CN109671664 A CN 109671664A CN 201811533651 A CN201811533651 A CN 201811533651A CN 109671664 A CN109671664 A CN 109671664A
- Authority
- CN
- China
- Prior art keywords
- wafer
- slide holder
- disc
- basal disc
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to technical field of semiconductors, more particularly, to a kind of wafer slide holder.Wafer slide holder, comprising: basal disc and multiple contact discs；Multiple contact discs are evenly distributed on the edge of the basal disc, and the contact disc is located at the top on the basal disc surface, and multiple contact discs are for carrying wafer, to reduce the surface tension between wafer and slide holder.To there is technical issues that biggish when liquid, which exists in the prior art, in alleviation is present between wafer slide holder and wafer.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly, to a kind of wafer slide holder.
Background technique
In semiconductor integrated circuit chip manufacturing process, CMP process (CMP) has many applications.In chemistry
Wafer charging crane is mainly used for realizing that manipulator and polishing execute the wafer loading and unloading between station in mechanical polishing process
Journey.
In existing CMP process, inevitably there is liquid and polishing are discarded for wafer loading and unloading process
Object.When liquid is present between wafer slide holder and wafer, there can be biggish surface tension of liquid.
Summary of the invention
The purpose of the present invention is to provide kind of a wafer slide holders, and liquid exists in the prior art with improvement and is present in wafer
When between slide holder and wafer, can there is technical issues that biggish.
A kind of wafer slide holder provided by the invention, comprising: basal disc and multiple contact discs；
Multiple contact discs are evenly distributed on the edge of the basal disc, and the contact disc is located at the basal disc surface
Top, multiple contact discs are for carrying wafer, to reduce the surface tension between wafer and slide holder.
Further, the wafer slide holder further include: flexure adjustment disk；
The center of the basal disc, week of multiple contact discs along the flexure adjustment disk is arranged in the flexure adjustment disk
To being uniformly distributed, and the height of the flexure adjustment disk is less than the height of the contact disc.
Further, the contact disc is provided with transition face and loading end far from one end of the basal disc；
The contact disc is arranged in close to the side at the basal disc center in the transition face, and the loading end is arranged described
Side of the contact disc far from the basal disc center, and connect with the transition face.
Further, detection hole is additionally provided on the contact disc, the detection hole is arranged on the loading end, and described
The extending direction of detection hole is identical as the extending direction of the contact disc, and runs through the contact disc.
Further, multiple groups fluid ejection mechanisms are provided on the basal disc；
Multiple groups fluid ejection mechanisms are evenly distributed between the center of the basal disc and multiple contact discs.
Further, fluid ejection mechanisms described in every group include first jet, second nozzle and third nozzle；
It is provided with the first connector, the second connector and third connector on the basal disc surface, first connector,
Second connector is respectively used to connect with the first jet, second nozzle with third nozzle with the third connector.
Further, the spray regime of the second nozzle is 2 times of first jet and third nozzle spray regime.
Further, along the edge of the basal disc to the direction at the center of the basal disc, the basal disc upper surface is gradually risen
It is high.
Further, the basal disc surface is provided with multiple drainage holes and multiple logical for cooperating with multiple detection holes
The lower section of the contact disc is arranged in hole, the through-hole.
Further, the flexure adjustment disk includes mounting base and positioning protrusion；
The center of the mounting base is arranged in the positioning protrusion, and the positioning protrusion is set far from one end of the mounting base
It is equipped with flexible bearing surface, and is provided with transition face between the flexible bearing surface and the side of the positioning protrusion.
A kind of wafer slide holder provided by the invention, comprising: basal disc and multiple contact discs；Multiple contact discs uniformly divide
Cloth is at the edge of the basal disc, and the contact disc is located at the top on the basal disc surface, and multiple contact discs are for carrying
Wafer, to reduce the surface tension between wafer and slide holder.Using above-mentioned scheme, it is provided in basal disc surface multiple
Contact disc, and the edge of basal disc is arranged in contact disc, wafer is placed on contact disc, can subtract connecing for wafer and slide holder in this way
Contacting surface product then reduces the liquid amount of having between wafer and slide holder, so that the surface tension between wafer and slide holder subtracts
It is small, to alleviate when liquid exists in the prior art being present between wafer slide holder and wafer, there can be biggish liquid table
The technical issues of face tension.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of the first embodiment of wafer slide holder provided by the invention；
Fig. 2 is the partial schematic diagram of the basal disc of wafer slide holder provided by the invention；
Fig. 3 is the structural schematic diagram of the contact disc of wafer slide holder provided by the invention；
Fig. 4 is the structural schematic diagram that adjustment disk is bent on wafer slide holder provided by the invention；
Fig. 5 is the structural schematic diagram of second of embodiment of wafer slide holder provided by the invention.
Icon: 100- basal disc；200- contact disc；300- bends adjustment disk；400- fluid ejection mechanisms；The connection of 110- first
Mouthful；The second connector of 120-；130- third connector；140- through-hole；210- detection hole；220- transition face；230- loading end；
310- mounting base；320- positioning protrusion；321- flexibility bearing surface；410- first jet；420- second nozzle；The spray of 430- third
Mouth.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Fig. 1 is the structural schematic diagram of the first embodiment of wafer slide holder provided by the invention；
As shown in Figure 1, a kind of wafer slide holder provided by the invention, comprising: basal disc 100 and multiple contact discs 200；
Multiple contact discs 200 are evenly distributed on the edge of the basal disc 100, and the contact disc 200 is positioned at described
The top on 100 surface of basal disc, multiple contact discs 200 are for carrying wafer, to reduce the surface between wafer and slide holder
Tension.
Fig. 5 is the structural schematic diagram of second of embodiment of wafer slide holder provided by the invention.As shown in Figure 5, wherein
It can be to be detachably connected between contact disc 200 and basal disc 100, can also be integrally formed setting.
In the present embodiment, 100 surface of basal disc is provided with multiple contact discs 200, and contact disc 200 is arranged in basal disc
100 edge, wafer are arranged on contact disc 200, can reduce the contact area of wafer and slide holder in this way, then reduce brilliant
The liquid amount of having between round and slide holder, so that the surface tension between wafer and slide holder reduces, to alleviate existing skill
When being present between wafer slide holder and wafer in art there are liquid, can there is technical issues that biggish.
Fig. 4 is the structural schematic diagram that adjustment disk is bent on wafer slide holder provided by the invention；As shown in figure 4, above-mentioned
On the basis of embodiment, further, the wafer slide holder further include: flexure adjustment disk 300；
The center of the basal disc 100 is arranged in the flexure adjustment disk 300, and multiple contact discs 200 are along the flexure
The circumferential direction of adjustment disk 300 is uniformly distributed, and the height of the flexure adjustment disk 300 is less than the height of the contact disc 200.
Wherein, the height for bending adjustment disk 300 is less than the height 2-3mm of contact disc 200.
In the present embodiment, when wafer to be mounted on contact disc 200, the center of wafer may generate deflection deformation,
When wafer generates deflection deformation, the flexure adjustment disk 300 in the middle part of slide holder and the difference in height between peripheral contact disk 200
It is different, wafer can be allowed to generate acceptable deformation.And then prevent wafer from generating rupture.
Fig. 3 is the structural schematic diagram of the contact disc of wafer slide holder provided by the invention；As shown in figure 3, in above-mentioned implementation
On the basis of example, further, the contact disc 200 is provided with transition face 220 and loading end far from one end of the basal disc 100
230；
The contact disc 200 is arranged in close to the side at 100 center of basal disc, the loading end in the transition face 220
230 are arranged in side of the contact disc 200 far from 100 center of basal disc, and connect with the transition face 220.
Wherein, it is smoothly connected between transition face 220 and loading end 230.
Wherein, it can be coated with hydrophobic material on loading end 230, for reducing the remaining amount of liquid on loading end 230.
In the present embodiment, loading end 230 is used to and wafer contacts, and the setting of transition face 220 for reducing wafer with
Wafer is worn or abrasive happens when loading end 230 contacts.
Fig. 2 is the partial schematic diagram of the basal disc of wafer slide holder provided by the invention；As shown in Fig. 2, in above-described embodiment
On the basis of, further, detection hole 210 is additionally provided on the contact disc 200, the detection hole 210 is arranged in the carrying
On face 230, and the extending direction of the detection hole 210 is identical as the extending direction of the contact disc 200, and runs through the contact
Disk 200.
Further, 100 surface of basal disc is provided with multiple drainage holes and more for cooperating with multiple detection holes 210
The lower section of the contact disc 200 is arranged in a through-hole 140, the through-hole 140.
In the present embodiment, be provided with detection hole 210 on base plate, detection hole 210 be used to detect on loading end 230 whether
Be placed with wafer, since detection hole 210 runs through contact disc 200, and be connected to the through-hole 140 on contact disc 200, through-hole 140 and
Fluid passage connection, when fluid passage connects positive pressure source, when thering is wafer to be placed on contact disc 200, the self weight of wafer itself
It will lead to corresponding positive pressure source and generate pressure change, can be sentenced by reduced pressure changing value and pressure value when no wafer
Disconnected, whether wafer is intact to be placed on contact disc 200.When fluid passage connects negative pressure source, there is wafer to be placed in contact
When on disk 200, wafer itself can be by the mechanical closure of wafer detection hole 210 in place, and corresponding negative pressure source can generate at this time
Pressure change.Reduced pressure variation and pressure value when no wafer, it can be determined that wafer it is whether intact be placed in contact disc
On 200, the setting of drainage hole can make the flow velocity for accelerating 100 liquid on surface of basal disc.
On the basis of the above embodiments, further, multiple groups fluid ejection mechanisms 400 are provided on the basal disc 100；
Multiple groups fluid ejection mechanisms 400 be evenly distributed on the basal disc 100 center and multiple contact discs 200 it
Between.
In the present embodiment, the setting of fluid ejection mechanisms 400 can carry out the fixation loading and unloading surface inside retaining ring
Cleaning, while a wet environment is provided for slide holder surface, there is the crystal of process liquid to analyse to avoid slide holder surface
Out.And then facilitate the loading and unloading of wafer.Both it ensure that the cleaning on slide holder surface, while having effectively reduced wafer and loading and unloading
The issuable cross contamination of process.Simultaneously avoid the larger particles being likely to form in process, such as polish waste or
Process liquid crystal generates microcosmic or macroscopical surface scratches during subsequent technique to wafer surface.
On the basis of the above embodiments, further, fluid ejection mechanisms 400 described in every group include first jet 410,
Second nozzle 420 and third nozzle 430；
The first connector 110, the second connector 120 and third connector 130, institute are provided on 100 surface of basal disc
It states the first connector 110, the second connector 120 and the third connector 130 is respectively used to and the first jet 410,
Two nozzles 420 and third nozzle 430 connect.
Further, the spray regime of the second nozzle 420 is 430 spray regime of first jet 410 and third nozzle
2 times.
In the present embodiment, the first connector 110, the second connector 120 and third connector 130 are separately connected identical stream
The pipeline of body supply, to ensure the be connected on the first connector 110, the second connector 120 and third connector 130 first spray
Mouth 410, second nozzle 420 are identical with the height for the fluid that third nozzle 430 ejects, and the spray regime of second nozzle 420
It is 2 times of 430 spray regime of first jet 410 and third nozzle, the spray regime phase of first jet 410 and third nozzle 430
Together, to ensure, fixed handling surface can be cleaned inside retaining ring.
On the basis of the above embodiments, further, along the edge of the basal disc 100 to the center of the basal disc 100
Direction, 100 upper surface of basal disc gradually rises.
Wherein, 100 surface of basal disc includes minimum surface, secondary low surface and highest face temperature, the first connector 110, second
Connector 120 and third connector 130 are separately positioned on minimum surface, secondary low surface and highest face temperature, minimum surface, secondary low
Surface and highest face temperature are set gradually along the edge of basal disc 100 to the center of basal disc 100, for improving the discharge of basal disc surface liquid
Speed.
In the present embodiment, the set-up mode of basal disc 100 favorably can be quickly discharged with the liquid on 100 surface of basal disc,
The crystallization for preventing 100 upper surface of basal disc from having polishing fluid generates.
On the basis of the above embodiments, further, the flexure adjustment disk 300 includes mounting base 310 and convex
Play 320；
The center of the mounting base 310 is arranged in the positioning protrusion 320, and the positioning protrusion 320 is far from the installation
Flexible bearing surface 321 is arranged in one end of seat 310, and between the flexible bearing surface 321 and the side of the positioning protrusion 320
It is provided with transition face 220.
In the present embodiment, the center of basal disc 100 is arranged in mounting base 310, and positioning protrusion 320 is arranged in mounting base 310
On, flexible bearing surface 321 is set on positioning protrusion 320, the setting of flexible bearing surface 321 can make positioning protrusion 320 with
When wafer contacts, the probability of wafer damage is reduced.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of wafer slide holder characterized by comprising basal disc and multiple contact discs；
Multiple contact discs are evenly distributed on the edge of the basal disc, and the contact disc is located at the upper of the basal disc surface
Side, multiple contact discs are for carrying wafer, to reduce the surface tension between wafer and slide holder.
2. wafer slide holder according to claim 1, which is characterized in that the wafer slide holder further include: flexure is adjusted
Disk；
The center of the basal disc is arranged in the flexure adjustment disk, and multiple contact discs are circumferential equal along the flexure adjustment disk
Even distribution, and the height of the flexure adjustment disk is less than the height of the contact disc.
3. wafer slide holder according to claim 1, which is characterized in that the contact disc is set far from one end of the basal disc
It is equipped with transition face and loading end；
The contact disc is arranged in close to the side at the basal disc center in the transition face, and the loading end is arranged in the contact
Side of the disk far from the basal disc center, and connect with the transition face.
4. wafer slide holder according to claim 3, which is characterized in that detection hole is additionally provided on the contact disc, it is described
Detection hole is arranged on the loading end, and the extending direction of the detection hole is identical as the extending direction of the contact disc, and
Through the contact disc.
5. wafer slide holder according to claim 1, which is characterized in that be provided with multiple groups fluid injection machine on the basal disc
Structure；
Multiple groups fluid ejection mechanisms are evenly distributed between the center of the basal disc and multiple contact discs.
6. wafer slide holder according to claim 5, which is characterized in that fluid ejection mechanisms described in every group include the first spray
Mouth, second nozzle and third nozzle；
The first connector, the second connector and third connector, first connector, second are provided on the basal disc surface
Connector is respectively used to connect with the first jet, second nozzle with third nozzle with the third connector.
7. wafer slide holder according to claim 6, which is characterized in that the spray regime of the second nozzle is the first spray
2 times of mouth and third nozzle spray regime.
8. wafer slide holder according to claim 7, which is characterized in that along the edge of the basal disc into the basal disc
The direction of the heart, the basal disc upper surface gradually rise.
9. wafer slide holder according to claim 8, which is characterized in that the basal disc surface be provided with multiple drainage holes and
The lower section of the contact disc is arranged in multiple through-holes for cooperating with multiple detection holes, the through-hole.
10. wafer slide holder according to claim 2, which is characterized in that the flexure adjustment disk includes mounting base and determines
Position protrusion；
The center of the mounting base is arranged in the positioning protrusion, and the positioning protrusion is provided with far from one end of the mounting base
Flexible bearing surface, and transition face is provided between the flexible bearing surface and the side of the positioning protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811533651.1A CN109671664A (en) | 2018-12-14 | 2018-12-14 | Wafer slide holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811533651.1A CN109671664A (en) | 2018-12-14 | 2018-12-14 | Wafer slide holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109671664A true CN109671664A (en) | 2019-04-23 |
Family
ID=66144781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811533651.1A Pending CN109671664A (en) | 2018-12-14 | 2018-12-14 | Wafer slide holder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109671664A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111805416A (en) * | 2020-05-25 | 2020-10-23 | 北京烁科精微电子装备有限公司 | Bearing platform with wafer positioning function |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1500028A (en) * | 2001-03-30 | 2004-05-26 | 拉姆研究公司 | Device for controlling eveness of edge polishing |
| US7163393B2 (en) * | 2004-02-02 | 2007-01-16 | Sumitomo Mitsubishi Silicon Corporation | Heat treatment jig for semiconductor silicon substrate |
| CN102044411A (en) * | 2009-10-13 | 2011-05-04 | 东京毅力科创株式会社 | Substrate cooling apparatus, substrate cooling method, and storage medium |
| CN203562415U (en) * | 2013-11-01 | 2014-04-23 | 沈阳拓荆科技有限公司 | Novel wafer carrier |
| CN104246971A (en) * | 2012-04-26 | 2014-12-24 | 信越半导体股份有限公司 | Method of manufacturing bonded wafer |
-
2018
- 2018-12-14 CN CN201811533651.1A patent/CN109671664A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1500028A (en) * | 2001-03-30 | 2004-05-26 | 拉姆研究公司 | Device for controlling eveness of edge polishing |
| US7163393B2 (en) * | 2004-02-02 | 2007-01-16 | Sumitomo Mitsubishi Silicon Corporation | Heat treatment jig for semiconductor silicon substrate |
| CN102044411A (en) * | 2009-10-13 | 2011-05-04 | 东京毅力科创株式会社 | Substrate cooling apparatus, substrate cooling method, and storage medium |
| CN104246971A (en) * | 2012-04-26 | 2014-12-24 | 信越半导体股份有限公司 | Method of manufacturing bonded wafer |
| CN203562415U (en) * | 2013-11-01 | 2014-04-23 | 沈阳拓荆科技有限公司 | Novel wafer carrier |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111805416A (en) * | 2020-05-25 | 2020-10-23 | 北京烁科精微电子装备有限公司 | Bearing platform with wafer positioning function |
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Application publication date: 20190423 |