CN109640515A - A kind of printed circuit board structure - Google Patents
A kind of printed circuit board structure Download PDFInfo
- Publication number
- CN109640515A CN109640515A CN201910081495.8A CN201910081495A CN109640515A CN 109640515 A CN109640515 A CN 109640515A CN 201910081495 A CN201910081495 A CN 201910081495A CN 109640515 A CN109640515 A CN 109640515A
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- China
- Prior art keywords
- circuit board
- printed circuit
- distance
- welding section
- feedback
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/02—Carrying-off electrostatic charges by means of earthing connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of printed circuit board structure, is applied in printed circuit board, wherein including DC-DC DC power supply managing chip and feedback capacitance resistance ware welding section；DC-DC DC power supply managing chip and feedback capacitance resistance ware welding section are arranged on the same face of printed circuit board；At least one first pre-determined distance is arranged in feedback capacitance resistance ware welding section and the edge of printed circuit board；At least one second pre-determined distance is arranged in the edge of DC-DC DC power supply managing chip and printed circuit board.The beneficial effects of the present invention are: by the way that DC-DC DC power supply managing chip and feedback capacitance resistance ware welding section are arranged on the same face of printed circuit board, and corresponding pre-determined distance is arranged with the edge of printed circuit board respectively to improve the ability of circuit in feedback capacitance resistance ware welding section and DC-DC DC power supply managing chip, and reduce production cost.
Description
Technical field
The present invention relates to printed circuit board technology field more particularly to a kind of printed circuit board structures.
Background technique
At present in the design and producing of PCB circuit board, circuit is usually provided with fast-changing pulse load, therefore
The stabilization that DC-DC DC power supply managing chip needs to have quick loop response characteristic to maintain output voltage.But DC-DC
Layout of the DC power supply managing chip in PCB circuit board generally can cause asking for static discharge because of structure and space limitation
Topic, it is unstable so as to cause output voltage, to be easily damaged the internal structure and detonator circuit failure of circuit, in turn result in people
The unnecessary loss of power financial resources, therefore the ability for how promoting the anti-electrostatic discharging of circuit is always generally acknowledged problem.
In the prior art, electrostatic can be improved by way of increasing static discharge impedor (ESD&EOS element)
The ability of electric discharge, but above-mentioned technology requires higher cost；It in the prior art, can also be using in PCB circuit board
Welding feedback capacitance resistance ware, but DC-DC DC power supply managing chip in the prior art and feedback capacitance resistance ware are usually phase
Back setting and DC-DC DC power supply managing chip and feedback capacitance resistance ware close on interface end setting, and contact in static gun
In static discharge generate voltage reach ± 3K and air contact in static discharge generate voltage reach ± 8KV when just
Will lead to the system where PCB circuit board to occur stuck or restart phenomenon, so as to cause circuit anti-electrostatic discharging ability compared with
It is weak, and the edges of boards for feeding back capacitance resistance ware and PCB circuit board are closer, to be easy the interference by operator and drop
The ability of the anti-electrostatic discharging of low circuit.
Summary of the invention
For the above-mentioned problems in the prior art, a kind of ability of anti-electrostatic discharging for being intended to submit circuit is now provided
Printed circuit board structure.
Specific technical solution is as follows:
A kind of printed circuit board structure is applied in printed circuit board, wherein including DC-DC DC power supply managing chip
With feedback capacitance resistance ware welding section；
DC-DC DC power supply managing chip and feedback capacitance resistance ware welding section are arranged on the same face of printed circuit board；
At least one first pre-determined distance is arranged in feedback capacitance resistance ware welding section and the edge of printed circuit board；
At least one second pre-determined distance is arranged in the edge of DC-DC DC power supply managing chip and printed circuit board.
Preferably, printed circuit board structure, wherein feedback capacitance resistance ware welding section includes that welding section, feedback are hindered in feedback
Lower resistance welding section and feedback capacity welding section；
Feedback capacity welding section is disposed adjacent with resistance welding section in feedback；
Welding section is hindered in feedback to be disposed adjacent with feedback lower resistance welding section；And/or
The lower section that welding section is hindered in feedback is arranged in feedback capacity welding section；
The right that welding section is hindered in feedback is arranged in feedback lower resistance welding section.
Preferably, printed circuit board structure, wherein feedback capacitance resistance ware includes the first feedback electricity for being connected into bleeder circuit
Resistance and the second feedback resistance, and the ground capacity of connection DC-DC DC power supply managing chip；And/or
Inductance is the energy storage inductor of DC-DC DC power supply managing chip.
Preferably, printed circuit board structure, wherein including induction soldering area, DC-DC DC power supply managing chip and feedback
Capacitance resistance ware welding section and induction soldering area are arranged on the same face of printed circuit board.
Preferably, printed circuit board structure, wherein the ground pad of DC-DC DC power supply managing chip and induction soldering
The ground pad in area and the ground pad for feeding back capacitance resistance ware welding section are formed by a metal conductor regions；
Preferably, printed circuit board structure, wherein DC-DC DC power supply managing chip is disposed adjacent with induction soldering area.
Preferably, printed circuit board structure, wherein DC-DC DC power supply managing chip and feedback capacitance resistance ware welding section
It is disposed adjacent；And/or
The top in induction soldering area is arranged in DC-DC DC power supply managing chip.
Preferably, printed circuit board structure, wherein the first pre-determined distance include the first lateral distance and first longitudinal direction away from
From；
First lateral distance is feedback capacitance resistance ware welding section and printed circuit in the horizontal direction of printed circuit board
The distance at the edge of plate, the first lateral distance are greater than or equal to 14.6mm；
First longitudinal direction distance is feedback capacitance resistance ware welding section and printed circuit on the vertical direction of printed circuit board
The distance at the edge of plate；
First longitudinal direction distance is greater than or equal to the first lateral distance.
Preferably, printed circuit board structure, wherein
Second pre-determined distance includes the second lateral distance and second longitudinal direction distance；
Second lateral distance is DC-DC DC power supply managing chip and printing electricity in the horizontal direction of printed circuit board
The distance at the edge of road plate, the second lateral distance are greater than or equal to 13.3mm；
Second longitudinal direction distance is the DC-DC DC power supply managing chip and printing electricity on the vertical direction of printed circuit board
The distance at the edge of road plate；
Second longitudinal direction distance is greater than or equal to the second lateral distance.
Preferably, printed circuit board structure, wherein
At least one third pre-determined distance is arranged in the edge of induction soldering area and printed circuit board；
Third pre-determined distance includes third lateral distance and third fore-and-aft distance；
Third lateral distance is the edge in the induction soldering area and printed circuit board in the horizontal direction of printed circuit board
Distance, third lateral distance be greater than or equal to 16.3mm；
Third fore-and-aft distance is the edge in the induction soldering area and printed circuit board on the vertical direction of printed circuit board
Distance；
Third fore-and-aft distance is greater than or equal to third lateral distance.
Above-mentioned technical proposal has the following advantages that or the utility model has the advantages that by by DC-DC DC power supply managing chip and feedback
Capacitance resistance ware welding section is arranged on the same face of printed circuit board, and will feedback capacitance resistance ware welding section and DC-DC direct current
Corresponding pre-determined distance is arranged with the edge of printed circuit board respectively to improve the ability of circuit in power management chip, and reduces life
Produce cost.
Detailed description of the invention
With reference to appended attached drawing, more fully to describe the embodiment of the present invention.However, appended attached drawing be merely to illustrate and
It illustrates, and is not meant to limit the scope of the invention.
Fig. 1 is the structural schematic diagram of printed circuit board constructive embodiment of the present invention；
Fig. 2 is the structural schematic diagram at the A of Fig. 1 of printed circuit board constructive embodiment of the present invention；
Fig. 3 is the structural schematic diagram at the B of Fig. 2 of printed circuit board constructive embodiment of the present invention；
Fig. 4 is the circuit diagram of printed circuit board constructive embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without creative labor it is obtained it is all its
His embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
The present invention includes a kind of printed circuit board structure, is applied in printed circuit board, wherein as shown in Figure 1-3, include
DC-DC DC power supply managing chip 1 and feedback capacitance resistance ware welding section；
DC-DC DC power supply managing chip 1 and feedback capacitance resistance ware welding section are arranged on the same face of printed circuit board；
At least one first pre-determined distance is arranged in feedback capacitance resistance ware welding section and the edge of printed circuit board；
At least one second pre-determined distance is arranged in the edge of DC-DC DC power supply managing chip 1 and printed circuit board.
Further, in the above-described embodiments, by welding DC-DC DC power supply managing chip 1 and feedback capacitance resistance ware
It meets area to be arranged on the same face of printed circuit board, for example, DC-DC DC power supply managing chip 1 and feedback capacitance resistance ware welding
Area can be arranged in together on the top layer face of printed circuit board；For example, DC-DC DC power supply managing chip 1 and feedback resistance-capacitance device
Part welding section can also be arranged in together on the round floor of printed circuit board；To construct short signal circuit, and then reduce DC-DC
The influence of the interference path in signal circuit between DC power supply managing chip 1 and feedback capacitance resistance ware welding section, to mention
The ability of the static discharge of high circuit.
Further, in a preferred embodiment, in the printed circuit boards, by adjusting feedback capacitance resistance ware welding section
With 1 the two of DC-DC DC power supply managing chip at a distance from the edge of printed circuit board, and make to feed back resistance-capacitance device as much as possible
1 marginal position far from printed circuit board of part welding section and DC-DC DC power supply managing chip, is being grasped to reduce operator
To the interference of feedback capacitance resistance ware and DC-DC DC power supply managing chip 1 during work, and then the electrostatic for improving circuit is put
The ability of electricity.
In above-described embodiment and preferred embodiment, by adjusting feedback capacitance resistance ware welding section and DC-DC direct current
The ability of the static discharge of circuit is improved in the position of power management chip 1, can reduce the cost of manufacture of product, and be suitble to
In the experience sense for promoting the use of and improving user.
Further, in the above-described embodiments, as shown in figure 3, feedback capacitance resistance ware welding section includes resistance R1 weldering in feedback
Connect area, the lower resistance welding section R2 of feedback and the welding section feedback capacity Cp；
The welding section feedback capacity Cp is disposed adjacent with the resistance welding section R1 in feedback；
The welding section R1 is hindered in feedback to be disposed adjacent with the feedback lower resistance welding section R2.
In the above-described embodiments, it realizes the welding section feedback capacity Cp, hinder the welding section R1 and the lower resistance R2 welding of feedback in feedback
Shortest cycle is constituted between area, to increase the line width width of each welding section indirectly, and reduces the resistance of signal circuit, into
And the ability of the static discharge of signal circuit is improved.
Further, in the above-described embodiments, the lower section that the welding section R1 is hindered in feedback is arranged in the welding section feedback capacity Cp；
The right that the welding section R1 is hindered in feedback is arranged in the feedback lower resistance welding section R2.
In the above-described embodiments, make the welding section feedback capacity Cp, hinder the welding section R1 in feedback and feedback is lower hinders the welding section R2
It is sequentially connected, to increase the line width width of each welding section indirectly, and reduces the resistance of signal circuit, and then improve
The ability of the static discharge of signal circuit.
Further, in the above-described embodiments, as shown in figure 4, feedback capacitance resistance ware includes be connected into bleeder circuit the
One feedback resistance and the second feedback resistance, and the ground capacity of connection DC-DC DC power supply managing chip 1；And/or
Inductance 2 is the energy storage inductor 2 of DC-DC DC power supply managing chip 1.
Further, in the above-described embodiments, including 2 welding section of inductance, DC-DC DC power supply managing chip 1 and feedback
Capacitance resistance ware welding section and 2 welding section of inductance are arranged on the same face of printed circuit board.
Further, in the above-described embodiments, by welding DC-DC DC power supply managing chip 1 and feedback capacitance resistance ware
It connects area and 2 welding section of inductance to be arranged on the same face of printed circuit board, for example, 1 He of DC-DC DC power supply managing chip
Feedback capacitance resistance ware welding section and 2 welding section of inductance can be arranged in together on the top layer face of printed circuit board；For example, DC-
Printing electricity can also be arranged in DC DC power supply managing chip 1 and feedback capacitance resistance ware welding section and 2 welding section of inductance together
On the round floor of road plate；To construct short signal circuit, and then reduce DC-DC DC power supply managing chip 1 and feedback resistance-capacitance device
The influence of the interference path in signal circuit between 2 welding section three of part welding section and inductance, to improve the quiet of circuit
The ability of discharge of electricity.
Further, in the above-described embodiments, 2 welding section of the ground pad of DC-DC DC power supply managing chip 1 and inductance
Ground pad and feed back capacitance resistance ware welding section ground pad formed by a metal conductor regions.
Further, in the above-described embodiments, DC-DC DC power supply managing chip 1 is disposed adjacent with 2 welding section of inductance；
DC-DC DC power supply managing chip 1 is disposed adjacent with feedback capacitance resistance ware welding section；DC-DC DC power supply managing chip 1 is arranged
In the top of 2 welding section of inductance.
In the above-described embodiments, DC-DC DC power supply managing chip 1 and 2 welding section of inductance and feedback resistance-capacitance device are realized
Shortest cycle is constituted between the three of part welding section, to increase the line width width of each welding section indirectly, and reduces signal and returns
The resistance on road, and then improved the ability of the static discharge of signal circuit.
Further, in the above-described embodiments, the first pre-determined distance includes the first lateral distance and first longitudinal direction distance；
First lateral distance is feedback capacitance resistance ware welding section and printed circuit in the horizontal direction of printed circuit board
The distance at the edge of plate, the first lateral distance are greater than or equal to 14.6mm；
First longitudinal direction distance is feedback capacitance resistance ware welding section and printed circuit on the vertical direction of printed circuit board
The distance at the edge of plate；
First longitudinal direction distance is greater than or equal to the first lateral distance.
In the above-described embodiments, it is disposed adjacent due to the welding section feedback capacity Cp with the resistance welding section R1 in feedback, in feedback
The resistance welding section R1 is disposed adjacent with the lower resistance welding section R2 of feedback, and the setting of the welding section feedback capacity Cp hinders R1 welding in feedback
The lower section in area, while feeding back the lower resistance welding section R2 and the right for hindering the welding section R1 in feedback is set.Therefore the first lateral distance tool
Body can be that the welding section R2 is hindered under the feedback in the horizontal direction of printed circuit board at a distance from the edge of printed circuit board, the
One lateral distance is greater than or equal to 14.6mm, hinders the welding section R1 and feedback in the feedback in the horizontal direction in printed circuit board
Both welding sections capacitor Cp are all larger than the lower resistance welding section R2 of feedback and printed circuit board at a distance from the edge of printed circuit board
The distance at edge.
Feedback capacitance resistance ware welding section is adjusted by above-mentioned first pre-determined distance at a distance from the edge of printed circuit board
Come reduce operator to feedback capacitance resistance ware interference, to improve the ability of the static discharge of circuit.
Further, in the above-described embodiments, the second pre-determined distance includes the second lateral distance and second longitudinal direction distance；
Second lateral distance is DC-DC DC power supply managing chip 1 and printing in the horizontal direction of printed circuit board
The distance at the edge of circuit board, the second lateral distance are greater than or equal to 13.3mm；
Second longitudinal direction distance is the DC-DC DC power supply managing chip 1 on the vertical direction of printed circuit board and prints
The distance at the edge of circuit board；
Second longitudinal direction distance is greater than or equal to the second lateral distance.
The edge of DC-DC DC power supply managing chip 1 and printed circuit board is adjusted by above-mentioned second pre-determined distance
Distance reduces interference of the operator to DC-DC DC power supply managing chip 1, to improve the energy of the static discharge of circuit
Power.
Further, in the above-described embodiments, at least one third is arranged in 2 welding section of inductance and the edge of printed circuit board
Pre-determined distance；
Third pre-determined distance includes third lateral distance and third fore-and-aft distance；
Third lateral distance is the edge of inductance 2 welding section and printed circuit board in the horizontal direction of printed circuit board
Distance, third lateral distance be greater than or equal to 16.3mm；
Third fore-and-aft distance is the edge of inductance 2 welding section and printed circuit board on the vertical direction of printed circuit board
Distance；
Third fore-and-aft distance is greater than or equal to third lateral distance.
2 welding section of inductance is adjusted by above-mentioned second pre-determined distance at a distance from the edge of printed circuit board to reduce behaviour
Make interference of the personnel to 2 welding section of inductance, to improve the ability of the static discharge of circuit.
Further, pre- using above-mentioned first pre-determined distance, the second pre-determined distance and third as preferred embodiment
If distance adjusts separately the welding section feedback capacity Cp, DC-DC DC power supply managing chip 1 and 2 welding section three of inductance and printing
The distance at the edge of circuit board.The electrostatic discharge capacity of subsequent Acquisition Circuit, and be compared for convenience, acquire existing skill
The electrostatic discharge capacity of circuit in art, as shown in the table:
Can clearly it find out in upper table, static discharge of the circuit in primitive technology scheme in static gun contact generates
Voltage reach ± 3K and air contact in static discharge generate voltage reach ± 8KV when will lead to PCB circuit board
The system at place occurs stuck or restarts phenomenon, and what static discharge of the circuit in the present embodiment in static gun contact generated
Voltage reach when the voltage that ± 8KV and the static discharge in air contact generate reaches ± 15KV can also with steady operation, because
This is to improve the ability of the static discharge of the circuit in the present embodiment.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic content
Equivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.
Claims (10)
1. a kind of printed circuit board structure is applied in printed circuit board, which is characterized in that including DC-DC DC power supply management
Chip and feedback capacitance resistance ware welding section；
The same of the printed circuit board is arranged in the DC-DC DC power supply managing chip and the feedback capacitance resistance ware welding section
On on one side；
At least one first pre-determined distance is arranged in the feedback capacitance resistance ware welding section and the edge of the printed circuit board；
At least one second pre-determined distance is arranged in the edge of the DC-DC DC power supply managing chip and the printed circuit board.
2. printed circuit board structure as shown in claim 1, which is characterized in that the feedback capacitance resistance ware welding section includes anti-
Welding section, the lower resistance welding section of feedback and feedback capacity welding section are hindered in feedback；
The feedback capacity welding section is disposed adjacent with resistance welding section in the feedback；
Welding section is hindered in the feedback to be disposed adjacent with resistance welding section under the feedback；And/or
The lower section that welding section is hindered in the feedback is arranged in the feedback capacity welding section；
Welding section is hindered under the feedback, and the right that welding section is hindered in the feedback is set.
3. printed circuit board structure as shown in claim 1, which is characterized in that the feedback capacitance resistance ware includes series connection ingredient
The first feedback resistance and the second feedback resistance of volt circuit, and the ground connection electricity of the connection DC-DC DC power supply managing chip
Hold；And/or
The inductance is the energy storage inductor of the DC-DC DC power supply managing chip.
4. printed circuit board structure as shown in claim 1, which is characterized in that including induction soldering area, the DC-DC direct current
The printed circuit board is arranged in power management chip and the feedback capacitance resistance ware welding section and the induction soldering area
On the same face.
5. the printed circuit board structure as shown in claim 4, which is characterized in that the DC-DC DC power supply managing chip
The ground pad of the ground pad and the feedback capacitance resistance ware welding section in ground pad and the induction soldering area is by one
Metal conductor regions are formed.
6. the printed circuit board structure as shown in claim 4, which is characterized in that the DC-DC DC power supply managing chip with
The induction soldering area is disposed adjacent.
7. printed circuit board structure as shown in claim 1, which is characterized in that the DC-DC DC power supply managing chip with
The feedback capacitance resistance ware welding section is disposed adjacent；And/or
The top in the induction soldering area is arranged in the DC-DC DC power supply managing chip.
8. printed circuit board structure as shown in claim 1, which is characterized in that first pre-determined distance includes first lateral
Distance and first longitudinal direction distance；
First lateral distance be feedback capacitance resistance ware welding section in the horizontal direction of the printed circuit board with
The distance at the edge of the printed circuit board, first lateral distance are greater than or equal to 14.6mm；
First longitudinal direction distance on the vertical direction of the printed circuit board feedback capacitance resistance ware welding section with
The distance at the edge of the printed circuit board；
The first longitudinal direction distance is greater than or equal to first lateral distance.
9. the printed circuit board structure as shown in claim 2, which is characterized in that
Second pre-determined distance includes the second lateral distance and second longitudinal direction distance；
Second lateral distance is the DC-DC DC power supply managing chip in the horizontal direction of the printed circuit board
At a distance from the edge of the printed circuit board, second lateral distance is greater than or equal to 13.3mm；
The second longitudinal direction distance is the DC-DC DC power supply managing chip on the vertical direction of the printed circuit board
At a distance from the edge of the printed circuit board；
The second longitudinal direction distance is greater than or equal to second lateral distance.
10. the printed circuit board structure as shown in claim 4, which is characterized in that
At least one third pre-determined distance is arranged in the edge of the induction soldering area and the printed circuit board；
The third pre-determined distance includes third lateral distance and third fore-and-aft distance；
The third lateral distance is the induction soldering area and the printing in the horizontal direction of the printed circuit board
The distance at the edge of circuit board, the third lateral distance are greater than or equal to 16.3mm；
The third fore-and-aft distance is the induction soldering area and the printing on the vertical direction of the printed circuit board
The distance at the edge of circuit board；
The third fore-and-aft distance is greater than or equal to the third lateral distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910081495.8A CN109640515A (en) | 2019-01-28 | 2019-01-28 | A kind of printed circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910081495.8A CN109640515A (en) | 2019-01-28 | 2019-01-28 | A kind of printed circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109640515A true CN109640515A (en) | 2019-04-16 |
Family
ID=66062437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910081495.8A Pending CN109640515A (en) | 2019-01-28 | 2019-01-28 | A kind of printed circuit board structure |
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| CN (1) | CN109640515A (en) |
Citations (5)
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|---|---|---|---|---|
| CN203951359U (en) * | 2014-06-04 | 2014-11-19 | 广州中海达卫星导航技术股份有限公司 | A kind of PCB structure of DC-DC reduction voltage circuit |
| CN105099169A (en) * | 2015-08-26 | 2015-11-25 | 浪潮电子信息产业股份有限公司 | Contact pin type power supply module |
| CN107645899A (en) * | 2017-08-31 | 2018-01-30 | 广东欧珀移动通信有限公司 | Electrostatic protection apparatus and electronic equipment |
| US20180100884A1 (en) * | 2012-04-13 | 2018-04-12 | International Business Machines Corporation | Integrated circuit protection during high-current esd testing |
| CN109496057A (en) * | 2018-11-12 | 2019-03-19 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board layout |
-
2019
- 2019-01-28 CN CN201910081495.8A patent/CN109640515A/en active Pending
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|---|---|---|---|---|
| US20180100884A1 (en) * | 2012-04-13 | 2018-04-12 | International Business Machines Corporation | Integrated circuit protection during high-current esd testing |
| CN203951359U (en) * | 2014-06-04 | 2014-11-19 | 广州中海达卫星导航技术股份有限公司 | A kind of PCB structure of DC-DC reduction voltage circuit |
| CN105099169A (en) * | 2015-08-26 | 2015-11-25 | 浪潮电子信息产业股份有限公司 | Contact pin type power supply module |
| CN107645899A (en) * | 2017-08-31 | 2018-01-30 | 广东欧珀移动通信有限公司 | Electrostatic protection apparatus and electronic equipment |
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Application publication date: 20190416 |
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