CN109640412A - A kind of heat retaining and exothermal feature board - Google Patents
A kind of heat retaining and exothermal feature board Download PDFInfo
- Publication number
- CN109640412A CN109640412A CN201811643959.1A CN201811643959A CN109640412A CN 109640412 A CN109640412 A CN 109640412A CN 201811643959 A CN201811643959 A CN 201811643959A CN 109640412 A CN109640412 A CN 109640412A
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- Prior art keywords
- exothermal
- feature board
- heat retaining
- heat
- heat source
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 206010037660 Pyrexia Diseases 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 239000004033 plastic Substances 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- 239000004575 stone Substances 0.000 claims description 5
- 230000004308 accommodation Effects 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 11
- 239000000126 substance Substances 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 5
- 239000004566 building material Substances 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 238000010792 warming Methods 0.000 abstract description 4
- 239000003989 dielectric material Substances 0.000 abstract description 3
- 230000020169 heat generation Effects 0.000 description 5
- 230000017531 blood circulation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- -1 plank Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/04—Waterproof or air-tight seals for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Central Heating Systems (AREA)
Abstract
This application discloses a kind of heat retaining and exothermal feature boards, belong to electric heat-emitting board technical field, including upper surface panel, lower face plate and the plane heat source heater being arranged between, wherein plane heat source heater includes planar substrate and the conductive exothermal material being located on the outside of planar substrate, plane heat source heater is generated heat by conductive exothermal material after being powered up, and generate far-infrared radiation thermal energy outward simultaneously, to generate thermal field in use space, to make use space generate warm effect, reach safety heating, take the purpose of heat, solve radiator, the problem of heating safety difference, the Heat Conduction Material of the application is the more advantageous thermal energy conduction of fever substance of honeycomb structure, the linear fever substance for comparing heating wire has fever uniform, the advantages that for heat density height and high thermal conversion rate, and the surface plate of the application can be selected it is existing Dielectric material, can be widely applied to building materials, in furniture for warming oneself, being moisture-proof or mould proof.
Description
[technical field]
The application belongs to electric heat-emitting board technical field more particularly to a kind of heat retaining and exothermal feature board.
[background technique]
In cold winter, it is indoor would generally be using equipment such as radiator, heating come to build warm environment at home.But it is warm
In running, the report that often has user to be burned accidentally occurs for furnace, heating, and occupant is easily caused surprisingly to slip touching
Injury is touched, often there is security risk.In recent years, as the research of ground warm device is more mature, exothermic material is increasingly becoming residence
The first choice of family's heating.
[summary of the invention]
The application provides a kind of heat retaining and exothermal feature board to solve the problems, such as background technique.
In order to solve the above technical problems, the technical solution that uses of the application is designs a kind of heat retaining and exothermal feature board, including
Upper surface panel, lower face plate and set on plane heat source heater between the two, the plane heat source heater includes planar substrates
And the conductive exothermal material on the outside of the planar substrates.
Preferably, the conductive exothermal material forms honeycomb structure on the outside of the planar substrates.
Preferably, the conductive exothermal material include fever conduction glaze, carbon element crystal, graphene, metallic conduction heating film,
It is any in radio frequency film.
Preferably, the planar substrates are flexible material.
Preferably, the upper surface panel and lower face plate be plank, medium-density plate, high-density plate, particieboard, plastics,
Any one of ceramic tile, wood-plastic board, stone-plastic plate, stone material.
Preferably, the corresponding two sides of the plane heat source heater are fixed with the copper foil being electrically connected with the external world, the copper
Paillon is equipped with punching hole, and the copper foil is embedded in the plane heat source heater by impact style and realizes fixed electrical connection.
Preferably, the heat retaining and exothermal feature board further includes the electrode socket for accessing power supply, the electrode socket one
End is fixedly welded on the copper foil, and the other end passes through the lower face plate and is exposed to outside.
Preferably, sealing ring is equipped between the electrode socket and the lower face plate.
Preferably, it is equipped between the upper surface panel and the lower face plate and matches with plane heat source fever shape
And the accommodation groove of sealing.
Preferably, the heat retaining and exothermal feature board further includes the temperature-adjusting device for adjusting temperature.
The application's has the beneficial effect that:
(1) plane heat source heater is arranged in the application between upper and lower surfaces plate, and wherein plane heat source heater includes plane base
Material and the conductive exothermal material being located on the outside of planar substrate, so that plane heat source heater passes through conductive exothermal after being powered up
Material fever, and generate far-infrared radiation thermal energy outward simultaneously, to generate thermal field in use space, so that use space be made to produce
Raw warm effect, achievees the purpose that safety heating, takes heat, solve the problems, such as that radiator, heating safety are poor.
(2) the application conductive exothermal material is the face fever more advantageous thermal energy conduction of substance of honeycomb structure, compares electric heating
The linear fever substance of silk has many advantages, such as that fever is uniform, high for heat density and thermal conversion rate is high, while conductive exothermal material
Using fever conduction glaze, carbon element crystal, graphene, metallic conduction heating film, in radio frequency film it is any, when conduction is heated
Thermal energy is transmitted outward in the form of far infrared radiation afterwards, and to reach comprehensive consistent heat generation, and far infrared may advantageously facilitate blood and follow
Ring plays the role of health care.
(3) surface plate of the application can be suitble to existing dielectric material, such as plank, medium-density plate, high-density plate, wood shavings
Plate, plastics, ceramic tile, wood-plastic board, stone-plastic plate, stone material etc., can be widely applied to building materials, in furniture for warming oneself or moisture-proof, mould proof.
(4) the application is additionally provided with temperature-adjusting device, can adjust suitable temperature and far infrared acording to the requirement of user
Radiation intensity uses temperature so as to adjust interior.
[Detailed description of the invention]
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described.
Fig. 1 is a kind of structural schematic diagram of heat retaining and exothermal feature board of the application;
Fig. 2 is a kind of sectional view of heat retaining and exothermal feature board of the application;
Fig. 3 is the partial enlargement diagram of part A in Fig. 2.
[specific embodiment]
Please refer to Fig. 1, Fig. 2 and Fig. 3, a kind of heat retaining and exothermal feature board of the application, including upper surface panel 1, lower face plate 2 with
And plane heat source heater 3.Wherein:
Plane heat source heater 3 is set between upper surface panel 1 and lower face plate 2, and plane heat source heater 3 includes planar substrates 31
And the conductive exothermal material 32 set on 31 outside of planar substrates, plane heat source heater 3 passes through conductive exothermal after being powered up
Material 32 generates heat, and generates far-infrared radiation thermal energy outward simultaneously, to generate thermal field in use space, to make use space
Warm effect is generated, achievees the purpose that safety heating, take heat, solves the problems, such as that radiator, heating safety are poor.
Conductive exothermal material 32 forms the honeycomb structure of regular hexagon on the outside of planar substrates 31, as shown in figure 3, advantage
It is more advantageous thermal energy conduction, plane heat source heater 3 is made to generate heat uniformly and there is the higher thermal efficiency, and the application is face fever
Substance has many advantages, such as that fever is uniform, high for heat density and thermal conversion rate is high compared with the linear fever substance of heating wire.
Conductive exothermal material 32 is fever conduction glaze, carbon element crystal, graphene, metallic conduction heating film, radio frequency
Any in film, thermal energy is transmitted outward in the form of far infrared radiation after conduction is heated, to reach comprehensive consistent heat generation, and it is remote
It is infrared to may advantageously facilitate blood circulation and play the role of health care.
Planar substrates 31 are flexible material, its advantage is that can bending deformation, convenient for being applied to the plate of different structure or shape
In material, such as planar substrates 31, in the form of paper structure, in conjunction with fever conduction glaze, fever conduction glaze is in 31 outside of planar substrates with bee
Nest shape structure exists, and planar heating body 3 is generated heat by the fever conduction glaze in 31 outside of planar substrates after being powered up, and simultaneously
Far-infrared radiation thermal energy is generated outward, is reached with generating thermal field in use space so that use space be made to generate warm effect
To safety heating, hot purpose is taken, solves the problems, such as that radiator, heating safety are poor.
Upper surface panel 1 and lower face plate 2 are plank, medium-density plate, high-density plate, particieboard, plastics, ceramic tile, wood moulding
The materials such as plate, stone-plastic plate, stone material, can be widely applied to building materials, in furniture for warming oneself or moisture-proof, mould proof, such as ground heating, family
Have heating, Intelligent moisture-proof wardrobe, the mould proof cabinet of intelligence, low-heat safety heating desk tops, middle and primary schools' Health care school desk etc..
The corresponding two sides of plane heat source heater 3 are fixed with the copper foil 4 being electrically connected with the external world, and copper foil 4 is equipped with punching
Hole 41 is pressed, copper foil 4 is embedded in plane heat source heater 3 by impact style and realizes fixed electrical connection, and power supply is made by copper foil 4
The comprehensive consistent heat generation of conductive exothermal material 32.
Heat retaining and exothermal feature board further includes the electrode socket 5 for accessing power supply, and 5 one end of electrode socket is fixedly welded on copper
The other end is exposed to outside across lower face plate 2 on paillon 4, and power supply passes sequentially through electrode socket 5, copper foil 4 makes conductive exothermal
The comprehensive consistent heat generation of material 32.
It is equipped with sealing ring 20 between electrode socket 5 and lower face plate 2, is used for dust-proof, waterproof, protects plane heat source heater 3
Normal use.
The accommodation groove for matching and sealing with 3 shape of plane heat source heater is equipped between upper surface panel 1 and lower face plate 2
10, sealing space is conducive to 3 waterproof of plane heat source heater, moisture-proof, extension service life.
Heat retaining and exothermal feature board further includes for adjusting the temperature-adjusting device of temperature (not marking in figure) comprising is set to
For detecting the temperature sensor 61 of real time temperature inside heat retaining and exothermal feature board, and 30 it is used in combination on access power lead
In the power-conditioning device (being not drawn into figure) for adjusting input power or voltage, suitable temperature can be adjusted acording to the requirement of user
With far-infrared radiation intensity, temperature is used so as to adjust interior, increases practicability.
Plane heat source heater is arranged in the application between upper and lower surfaces plate, and wherein plane heat source heater includes planar substrate
And it is located at the conductive exothermal material on the outside of planar substrate, so that plane heat source heater passes through conductive exothermal material after being powered up
Material fever, and generate far-infrared radiation thermal energy outward simultaneously, to generate thermal field in use space, so that use space be made to generate
Warm effect achievees the purpose that safety heating, takes heat, solves the problems, such as that radiator, heating safety are poor, and conductive exothermal material
Generate heat the more advantageous thermal energy conduction of substance for the face of honeycomb structure, compare heating wire linear fever substance have fever uniformly,
The advantages that for heat density height and high thermal conversion rate, while Heat Conduction Material is adopted as the conduction glaze, carbon element crystal, graphene, gold of generating heat
Any in category conductive exothermal film, radio frequency film, thermal energy is transmitted outward in the form of far infrared radiation after conduction is heated,
To reach comprehensive consistent heat generation, and far infrared may advantageously facilitate blood circulation and play the role of health care, and the surface plate of the application can
To be suitble to existing dielectric material, as plank, medium-density plate, high-density plate, particieboard, plastics, ceramic tile, wood-plastic board, stone-plastic plate,
Stone material etc., can be widely applied to building materials, in furniture for warming oneself or moisture-proof, mould proof, the application is additionally provided with temperature-adjusting device, can
Suitable temperature and far-infrared radiation intensity are adjusted acording to the requirement of user, use temperature so as to adjust interior.
The foregoing is merely the preferred embodiments of the application, not to limit the application, all essences in the application
Made any modifications, equivalent replacements, and improvements etc., should be included within the scope of protection of this application within mind and principle.
Claims (10)
1. a kind of heat retaining and exothermal feature board, it is characterised in that: including upper surface panel (1), lower face plate (2) and be set to the two
Between plane heat source heater (3), the plane heat source heater (3) include planar substrates (31) and be set to the planar substrates
(31) the conductive exothermal material (32) on the outside of.
2. a kind of heat retaining and exothermal feature board according to claim 1, it is characterised in that: the conductive exothermal material (32) exists
Honeycomb structure is formed on the outside of the planar substrates (31).
3. a kind of heat retaining and exothermal feature board according to claim 1, it is characterised in that: conductive exothermal material (32) packet
Include fever conduction glaze, carbon element crystal, graphene, metallic conduction heating film, any in radio frequency film.
4. a kind of heat retaining and exothermal feature board according to claim 1, it is characterised in that: the planar substrates (31) are flexibility
Material.
5. a kind of heat retaining and exothermal feature board according to claim 1, it is characterised in that: the upper surface panel (1) and following table
Panel (2) is plank, medium-density plate, high-density plate, particieboard, plastics, ceramic tile, wood-plastic board, stone-plastic plate, any in stone material
Kind.
6. a kind of heat retaining and exothermal feature board according to claim 1, it is characterised in that: plane heat source heater (3) phase
Corresponding two sides are fixed with the copper foil (4) being electrically connected with the external world, and the copper foil (4) is equipped with punching hole (41), the copper
Paillon (4) is embedded in the plane heat source heater (3) by impact style and realizes fixed electrical connection.
7. a kind of heat retaining and exothermal feature board according to claim 6, it is characterised in that: the heat retaining and exothermal feature board also wraps
The electrode socket (5) for accessing power supply is included, described electrode socket (5) one end is fixedly welded on the copper foil (4), another
End is exposed to outside across the lower face plate (2).
8. a kind of heat retaining and exothermal feature board according to claim 7, it is characterised in that: the electrode socket (5) with it is described
Sealing ring (20) are equipped between lower face plate (2).
9. a kind of heat retaining and exothermal feature board according to claim 1, it is characterised in that: the upper surface panel (1) with it is described
The accommodation groove (10) for matching and sealing with plane heat source heater (3) shape is equipped between lower face plate (2).
10. a kind of heat retaining and exothermal feature board according to claim 1, it is characterised in that: the heat retaining and exothermal feature board is also
Including the temperature-adjusting device for adjusting temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811643959.1A CN109640412A (en) | 2018-12-29 | 2018-12-29 | A kind of heat retaining and exothermal feature board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811643959.1A CN109640412A (en) | 2018-12-29 | 2018-12-29 | A kind of heat retaining and exothermal feature board |
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Publication Number | Publication Date |
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CN109640412A true CN109640412A (en) | 2019-04-16 |
Family
ID=66054786
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CN201811643959.1A Pending CN109640412A (en) | 2018-12-29 | 2018-12-29 | A kind of heat retaining and exothermal feature board |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110037421A (en) * | 2019-04-25 | 2019-07-23 | 碳翁(北京)科技有限公司 | A kind of thermal current offer device based on honeycomb heating material |
CN110139408A (en) * | 2019-05-30 | 2019-08-16 | 上海交通大学 | A kind of plate electric heater |
CN110911031A (en) * | 2019-10-21 | 2020-03-24 | 珠海烯蟀科技有限公司 | Device with conducting strip as graphene layer power supply electrode |
CN110993186A (en) * | 2019-10-21 | 2020-04-10 | 珠海烯蟀科技有限公司 | Method for using conducting strip as graphene layer power supply electrode |
CN111063479A (en) * | 2019-10-21 | 2020-04-24 | 珠海烯蟀科技有限公司 | Method and device for supplying power to graphene layer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102174849A (en) * | 2011-02-18 | 2011-09-07 | 上海现戈电气有限公司 | Warm core floor, manufacturing method thereof and conductive heating plate for warm core floor |
CN209693077U (en) * | 2018-12-29 | 2019-11-26 | 中山市艾呦呦智能家居科技有限公司 | A kind of heat retaining and exothermal feature board |
-
2018
- 2018-12-29 CN CN201811643959.1A patent/CN109640412A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102174849A (en) * | 2011-02-18 | 2011-09-07 | 上海现戈电气有限公司 | Warm core floor, manufacturing method thereof and conductive heating plate for warm core floor |
CN209693077U (en) * | 2018-12-29 | 2019-11-26 | 中山市艾呦呦智能家居科技有限公司 | A kind of heat retaining and exothermal feature board |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110037421A (en) * | 2019-04-25 | 2019-07-23 | 碳翁(北京)科技有限公司 | A kind of thermal current offer device based on honeycomb heating material |
CN110139408A (en) * | 2019-05-30 | 2019-08-16 | 上海交通大学 | A kind of plate electric heater |
CN110139408B (en) * | 2019-05-30 | 2021-10-08 | 上海交通大学 | Plate type electric heater |
CN110911031A (en) * | 2019-10-21 | 2020-03-24 | 珠海烯蟀科技有限公司 | Device with conducting strip as graphene layer power supply electrode |
CN110993186A (en) * | 2019-10-21 | 2020-04-10 | 珠海烯蟀科技有限公司 | Method for using conducting strip as graphene layer power supply electrode |
CN111063479A (en) * | 2019-10-21 | 2020-04-24 | 珠海烯蟀科技有限公司 | Method and device for supplying power to graphene layer |
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