CN109637968A - Wafer anti-drop device - Google Patents
Wafer anti-drop device Download PDFInfo
- Publication number
- CN109637968A CN109637968A CN201811617047.7A CN201811617047A CN109637968A CN 109637968 A CN109637968 A CN 109637968A CN 201811617047 A CN201811617047 A CN 201811617047A CN 109637968 A CN109637968 A CN 109637968A
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- CN
- China
- Prior art keywords
- wafer
- baffle
- fixed frame
- film magazine
- runner assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of wafer anti-drop device, is related to the technical field of wafer cleaning equipment.Wafer anti-drop device includes film magazine fixed frame, runner assembly and driving assembly；For fixing wafer to be cleaned in film magazine fixed frame；Film magazine fixed frame is connected to one end of runner assembly, and driving assembly is connected to the other end of runner assembly；Driving assembly can drive runner assembly to rotate, and runner assembly is made to drive the inclination of film magazine fixed frame, and make the baffle portion opening and closing of the open end of runner assembly control film magazine fixed frame.It is fixed in slot-type device to solve wafer, when cleaning and dipping, wafer is easily separated from wafer film magazine under the action of natural buoyancy, the problem of causing wafer to damage.The present invention drives runner assembly by driving assembly, is put into film magazine fixed frame convenient for wafer, runner assembly control baffle portion closes open end, it is ensured that the position of wafer is secured.
Description
Technical field
The present invention relates to the technical fields of wafer cleaning equipment, more particularly, to a kind of wafer anti-drop device.
Background technique
Basic material of the wafer as manufacture semiconductor chip, critically important effect is played to semiconductor industrial expansion.
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, can manufacture various circuit elements on silicon
Structure, and become the IC products for having feature electrical functionality.
During semiconductor wafer manufacturing technique, in order to improve the production efficiency, cost of labor is saved, using full-automatic
Cleaning equipment cleans wafer.During the cleaning of wafer whole process, wafer mainly is grabbed using manipulator, to wafer
It is transmitted.
In the prior art, wafer generallys use slot-type device and carries out cleaning and dipping to wafer before being cleaned, due to
The weight of wafer is lighter, when impregnating in the solution, will due to wafer itself buoyancy and be detached from wafer film magazine, or even can also
There is the case where wafer drops out wafer film magazine, so that the damage of wafer is caused, and the cost of wafer is relatively high, can thus make
At very big loss.
Summary of the invention
The purpose of the present invention is to provide a kind of wafer anti-drop devices, and existing in the prior art to solve, wafer exists
Fixed in slot-type device, when cleaning and dipping, wafer is easily separated from wafer film magazine under the action of natural buoyancy, and wafer is caused to damage
The technical issues of.
A kind of wafer anti-drop device provided by the invention, including film magazine fixed frame, runner assembly and driving assembly；
For fixing wafer to be cleaned in film magazine fixed frame；
Film magazine fixed frame is connected to one end of runner assembly, and driving assembly is connected to the other end of runner assembly；
Driving assembly can drive runner assembly to rotate, and so that runner assembly is driven the inclination of film magazine fixed frame, and make rotating group
Part controls the baffle portion opening and closing of the open end of film magazine fixed frame.
Further, film magazine fixed frame includes wafer fixed frame and wafer end position-limited rack；
For installing wafer to be cleaned in wafer fixed frame, baffle portion is connected to the open end of wafer fixed frame；
Wafer end position-limited rack is connected to wafer fixed frame end face corresponding with open end.
Further, the internal perisporium of wafer fixed frame is equipped with the first limiting slot and the second limiting slot, and the first limiting slot is used for
The wafer of fixed small size, the second limiting slot is for fixing large-sized wafer.
Further, wafer end position-limited rack includes the first limiting section and the second limiting section, and the first limiting section and second limit
The end face of the first limiting slot is arranged in the connection of position portion, the first limiting section, and the end face of the second limiting slot is arranged in the second limiting section.
Further, baffle portion includes the first rotary shaft bolster, first baffle, the second rotary shaft bolster and second baffle；
First rotary shaft bolster is connected to the side of open end, and first baffle is connected on the first rotary shaft bolster；
Second rotary shaft bolster is connected to the other side of open end, and second baffle is connected on the second rotary shaft bolster；
First rotary shaft bolster, the second rotary shaft bolster are connected to the both ends of runner assembly.
Further, runner assembly includes sliding part, baffle push rod, rotating part, inclination connection frame and film magazine position-limited rack；
Sliding part is connected to the output end of driving assembly, and sliding part is connected on baffle push rod, and baffle push rod passes through rotation
Portion is connected on inclination connection frame, and inclination connection frame is connected on wafer fixed frame, the first rotary shaft bolster, the second swivel bearing
Frame is connect with rotating part respectively；
One end connection inclination connection frame of film magazine position-limited rack, the other end of film magazine position-limited rack are connected on driving assembly.
Further, sliding part includes sliding block, guiding axis and slide block limiting plate；
Sliding block is connected to the output end of driving assembly, and sliding block is connected on baffle push rod；
The quantity of guiding axis is two, and the outboard end of two guiding axis is respectively fixedly connected in slide block limiting plate；In cunning
The side of block is equipped with limit hole, and the quantity of limit hole is two, and the inner end of two guiding axis is slidably connected at two limits respectively
In the hole of position.
Further, rotating part includes first connecting rod, first baffle pivoted arm, second connecting rod and second baffle pivoted arm；
The outboard end of first connecting rod is connect with one end of baffle push rod, and the inner end connection first baffle of first connecting rod turns
Arm, first baffle pivoted arm are connect with the first rotary shaft bolster；
The outboard end of second connecting rod is connect with the other end of baffle push rod, and the inner end connection second baffle of second connecting rod turns
Arm, second baffle pivoted arm are connect with the second rotary shaft bolster.
Further, driving assembly includes air cylinder fixed plate, cylinder, drive rod and fixed link；
Air cylinder fixed plate is for being connected to Electric Actuator, and cylinder is connected in air cylinder fixed plate, one end of drive rod
It is connect with the output end of cylinder, the other end of drive rod is connected on sliding block；
Fixed link is socketed in the outside of drive rod, and film magazine position-limited rack is connected in fixed link.
Further, cylinder is connected with cylinder connecting plate, and one end of drive rod is connect with cylinder connecting plate.
A kind of wafer anti-drop device provided by the invention, film magazine fixed frame is interior for fixing wafer to be cleaned, with right
The position of wafer is fixed；Film magazine fixed frame is connected to one end of runner assembly, is carried out with the end position to runner assembly
Fixed, driving assembly is connected to the other end of runner assembly, is fixed with another end position to runner assembly；Driving assembly
When starting, runner assembly can be driven to be rotated, runner assembly is made to be able to drive the inclined state of film magazine fixed frame,
It is put into film magazine fixed frame convenient for wafer；Also, runner assembly can also control the baffle portion of the open end of film magazine fixed frame
Opening and closing closes open end using baffle portion, is fixed, makes to the position of wafer after placing the wafer in film magazine fixed frame
The position fixation of wafer.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of wafer anti-drop device provided in an embodiment of the present invention；
Fig. 2 is the portion the A enlarged drawing in Fig. 1；
Fig. 3 is the portion the B enlarged drawing in Fig. 1；
Fig. 4 is the main view of wafer anti-drop device provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram on front side of wafer fixed frame provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram on rear side of wafer fixed frame provided in an embodiment of the present invention；
Fig. 7 is the main view on rear side of wafer fixed frame provided in an embodiment of the present invention.
Icon: 100- film magazine fixed frame；200- runner assembly；300- driving assembly；The open end 101-；102- gear
Plate portion；103- wafer fixed frame；104- wafer end position-limited rack；The first limiting slot of 105-；The second limiting slot of 106-；
The first limiting section of 107-；The second limiting section of 108-；109- the first rotary shaft bolster；110- first baffle；111- second revolves
Rotary bearing pedestal；112- second baffle；201- sliding part；202- baffle push rod；203- rotating part；204- tilts connection frame；
205- film magazine position-limited rack；206- sliding block；207- guiding axis；208- slide block limiting plate；209- first connecting rod；210- first
Baffle pivoted arm；211- second connecting rod；212- second baffle pivoted arm；301- air cylinder fixed plate；302- cylinder；303- driving
Bar；304- fixed link；305- cylinder connecting plate.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Fig. 1 is the structural schematic diagram of wafer anti-drop device provided in an embodiment of the present invention；Fig. 2 is the portion the A amplification in Fig. 1
Figure；Fig. 3 is the portion the B enlarged drawing in Fig. 1；Fig. 4 is the main view of wafer anti-drop device provided in an embodiment of the present invention.
As shown in figures 1-4, a kind of wafer anti-drop device provided by the invention, including film magazine fixed frame 100, rotating group
Part 200 and driving assembly 300；
For fixing wafer to be cleaned in film magazine fixed frame 100；
Film magazine fixed frame 100 is connected to one end of runner assembly 200, and driving assembly 300 is connected to the another of runner assembly 200
One end；
Driving assembly 300 can drive runner assembly 200 to rotate, and make runner assembly 200 that film magazine fixed frame 100 be driven to incline
Tiltedly, and open and close the baffle portion 102 of the open end 101 of the control film magazine fixed frame 100 of runner assembly 200.
In Fig. 1, for placing wafer to be cleaned in film magazine fixed frame 100, it is fixed with the position to wafer.
Film magazine fixed frame 100 is connected to the lower end of runner assembly 200, and driving assembly 300 is connected to the upper of runner assembly 200
End, to realize the connection between film magazine fixed frame 100, driving assembly 300 using runner assembly 200.
In one embodiment of the present of invention, start driving assembly 300, driving assembly 300 moves downward, and drives rotating group
Part 200 rotates, and runner assembly 200 drives film magazine fixed frame 100 to rotate, and baffle portion 102 opens the open end of film magazine fixed frame 100
101,300 stopping of driving assembly movement, at this moment, the bottom surface of film magazine fixed frame 100 are horizontally disposed；By wafer to be cleaned along opening
Mouth end 101 is sequentially placed into film magazine fixed frame 100；After placement, it is again started up driving assembly 300, driving assembly 300 is upward
Movement, driving assembly 300 drive runner assembly 200 to rotate, and runner assembly 200 drives film magazine fixed frame 100 to rotate, and consolidate film magazine
Determine that there is certain angle between the bottom surface and horizontal plane of frame 100, meanwhile, runner assembly 200 drives baffle portion 102 to close opening
End 101, completes the fixation procedure to wafer, it is ensured that the link position of wafer is firm.
Fig. 5 is the structural schematic diagram on front side of wafer fixed frame provided in an embodiment of the present invention；Fig. 6 mentions for the embodiment of the present invention
Structural schematic diagram on rear side of the wafer fixed frame of confession；Fig. 7 is the main view on rear side of wafer fixed frame provided in an embodiment of the present invention.
As shown in Fig. 5~7, further, film magazine fixed frame 100 includes wafer fixed frame 103 and wafer end position-limited rack
104；
For installing wafer to be cleaned in wafer fixed frame 103, baffle portion 102 is connected to opening for wafer fixed frame 103
Mouth end 101；
Wafer end position-limited rack 104 is connected to the end face corresponding with open end 101 of wafer fixed frame 103.
In Fig. 5, wafer fixed frame 103 is П shape frame, and wafer is mounted on the medial surface of П shape frame, makes the left and right two of wafer
Side is respectively engaged with the left and right sides of П shape frame.
The front end of П shape frame is open end 101, is put into П shape frame convenient for wafer along open end 101.
Wafer end position-limited rack 104 is connected to the rear end of П shape frame, with using wafer end position-limited rack 104 to wafer after
End carries out abutting fixation, and wafer is avoided to skid off along the rear end of П shape frame.
Further, the internal perisporium of wafer fixed frame 103 is equipped with the first limiting slot 105 and the second limiting slot 106, the first limit
Position slot 105 is used to fix the wafer of small size, and the second limiting slot 106 is for fixing large-sized wafer.
In Fig. 6, the internal perisporium upper end of wafer fixed frame 103 is equipped with the first limiting slot 105, the first limiting slot 105 be
Multiple strip slots that the internal perisporium of wafer fixed frame 103 is formed, multiple strip slots are on the internal perisporium of wafer fixed frame 103
It is symmetrical arranged at left and right sides of portion, symmetrically arranged strip slot is used to connect and fix the left and right sides of wafer.
The distance between strip slot is shorter at left and right sides of the internal perisporium top of wafer fixed frame 103, is suitble to clamping length
Spend shorter small size wafer.
In Fig. 6, the internal perisporium lower end of wafer fixed frame 103 is equipped with the second limiting slot 106, the second limiting slot 106 be
Multiple strip slots that the internal perisporium of wafer fixed frame 103 is formed, multiple strip slots are under the internal perisporium of wafer fixed frame 103
It is symmetrical arranged at left and right sides of portion, symmetrically arranged strip slot is used to connect and fix the left and right sides of wafer.
The distance between strip slot is long at left and right sides of the internal perisporium lower part of wafer fixed frame 103, is suitble to clamping length
Spend longer large scale wafer.
The wafer of the internal perisporium top clamping smaller size of wafer fixed frame 103, the internal perisporium lower part of wafer fixed frame 103
It is clamped the wafer of larger size, so that whole wafer fixed frame 103 is clamped the wafer of smaller size, larger size simultaneously, makes
It is flexible with mode.
Compared to the prior art, various sizes of wafer is grabbed using manipulator, needs constantly to adjust the size of manipulator,
The size adjusting of manipulator is inconvenient, operates laborious；And wafer is fixed in slot-type device, the size phase of slot-type device
Together, it cannot be clamped various sizes of wafer simultaneously, it is inconvenient for use.It can be fixed simultaneously not in the wafer fixed frame 103 of the application
With the wafer of size, the fixed efficiency of wafer is improved.
Further, wafer end position-limited rack 104 includes the first limiting section 107 and the second limiting section 108, the first limiting section
107 connect with the second limiting section 108, and the end face of the first limiting slot 105 is arranged in the first limiting section 107, and the second limiting section 108 is set
It sets in the end face of the second limiting slot 106.
In Fig. 6, the second limiting section 108 includes that the upper junction plate of upper end, the lower connecting plate of lower end and side are two longer
Connecting column, upper junction plate is connected to the upper end surface rear end of wafer fixed frame 103, and the both ends of lower connecting plate are fixed with wafer respectively
The left and right sides of frame 103 connects, and the upper end of two connecting columns connects upper junction plate, the lower connection of the lower end connection of two connecting columns
Plate；In use, being connected to the rear side of wafer in the second limiting slot 106 using two connecting columns, wafer is avoided to fix along wafer
The rear end of frame 103 skids off.
First limiting section 107 includes two shorter connecting columns and middle connecting plate, the left and right ends point of middle connecting plate
It is not connected to 105 lower end position of the first limiting slot of 103 medial surface of wafer fixed frame, it may be assumed that the left end of middle connecting plate is connected to
The lower end of left end strip groove, the right end of middle connecting plate are connected to the lower end of right end strip groove；The upper end connection of two connecting columns
In the endface of upper junction plate in the inner part, the lower end of two connecting columns is connected between on connecting plate；In use, utilizing two companies
The rear side that column is connected to wafer in the first limiting slot 105 is connect, wafer is avoided to skid off along the rear end of wafer fixed frame 103.
The inside of the second limiting section 108 is arranged in first limiting section 107, so that the wafer rear end of smaller size can limit
In the first limiting section 107, the wafer rear end of larger size can be limited in the second limiting section 108.
Further, baffle portion 102 includes the first rotary shaft bolster 109, first baffle 110, the second rotary shaft bolster 111
With second baffle 112；
First rotary shaft bolster 109 is connected to the side of open end 101, and first baffle 110 is connected to the first swivel bearing
On frame 109；
Second rotary shaft bolster 111 is connected to the other side of open end 101, and second baffle 112 is connected to the second rotary shaft
On bolster 111；
First rotary shaft bolster 109, the second rotary shaft bolster 111 are connected to the both ends of runner assembly 200.
In Fig. 4, the first rotary shaft bolster 109 is left-handed rotary bearing pedestal, and the lower end of left-handed rotary bearing pedestal connects left bearing
Seat, first baffle 110 are right baffle-plate, and right baffle-plate connects left shaft holder.
Second rotary shaft bolster 111 is dextral shaft bolster, and the lower end of dextral shaft bolster connects right bearing seat, second gear
Plate 112 is right shell body, and right shell body connects right bearing seat.
Left-handed rotary bearing pedestal is connected to the left end of runner assembly 200, and right baffle-plate is connected to the left side of open end 101；Dextrorotation
Rotary bearing pedestal is connected to the right end of runner assembly 200, and right shell body is connected to the right side of open end 101；Runner assembly 200 rotates
When, right baffle-plate, right shell body can be driven to open open end 101, Huo Zhefen by left-handed rotary bearing pedestal, dextral shaft bolster respectively
Right baffle-plate, right shell body is not driven to close open end 101 by left-handed rotary bearing pedestal, dextral shaft bolster.
Further, runner assembly 200 includes sliding part 201, baffle push rod 202, rotating part 203, inclination connection frame 204
With film magazine position-limited rack 205；
Sliding part 201 is connected to the output end of driving assembly 300, and sliding part 201 is connected on baffle push rod 202, baffle
Push rod 202 is connected on inclination connection frame 204 by rotating part 203, and inclination connection frame 204 is connected on wafer fixed frame 103,
First rotary shaft bolster 109, the second rotary shaft bolster 111 are connect with rotating part 203 respectively；
One end connection inclination connection frame 204 of film magazine position-limited rack 205, the other end of film magazine position-limited rack 205 are connected to driving
On component 300.
In Fig. 1, sliding part 201 is connected to the output end of 300 lower end of driving assembly using overturning connecting shaft, so that driving
When component 300 starts, it can be rotated by rotation center of lower end.
The quantity of rotating part 203 is two.
Sliding part 201 is slidably connected on baffle push rod 202, the left end of baffle push rod 202 by the rotating part 203 of left end with
Tilt the left end connection of connection frame 204, the rotating part 203 and inclination connection frame 204 that the right end of baffle push rod 202 passes through right end
Right end connection.
First rotary shaft bolster 109 is connect with the rotating part 203 of left end, the rotation of the second rotary shaft bolster 111 and right end
Portion 203 connects.
The outboard end of film magazine position-limited rack 205 is fixedly connected with inclination connection frame 204, and the inner end of film magazine position-limited rack 205 is set
There is circular trough, the lower end of driving assembly 300 is socketed in circle, makes the inner end of film magazine position-limited rack 205 and driving assembly 300
Lower end is fixedly connected.
Further, sliding part 201 includes sliding block 206, guiding axis 207 and slide block limiting plate 208；
Sliding block 206 is connected to the output end of driving assembly 300, and sliding block 206 is connected on baffle push rod 202；
The quantity of guiding axis 207 is two, and the outboard end of two guiding axis 207 is respectively fixedly connected in slide block limiting plate
On 208；It is equipped with limit hole in the side of sliding block 206, the quantity of limit hole is two, the inner end difference of two guiding axis 207
It is slidably connected in two limit holes.
In Fig. 2, the upper end of sliding block 206 is connect by overturning connecting shaft with the output end of 300 lower end of driving assembly, makes to drive
It can be rotated between the lower end and sliding block 206 of dynamic component 300；The lower end of sliding block 206 is equipped with through slot, and through slot is socketed in baffle push rod
On 202.
It is transported close to the movement of slide block limiting plate 208 or sliding block 206 far from slide block limiting plate 208 in use, sliding block 206 is done
It is dynamic, slide the inner end of two guiding axis 207 along two limit holes, using two limit holes to two guiding axis 207
Sliding position is defined, so that the sliding position to sliding block 206 relative to slide block limiting plate 208 is defined.
The maximum distance that slide block limiting plate 208 slides in and out sliding block 206 is defined.
Further, rotating part 203 includes first connecting rod 209, first baffle pivoted arm 210, second connecting rod 211 and second gear
Plate pivoted arm 212；
The outboard end of first connecting rod 209 is connect with one end of baffle push rod 202, the inner end of first connecting rod 209 connection the
One baffle pivoted arm 210, first baffle pivoted arm 210 are connect with the first rotary shaft bolster 109；
The outboard end of second connecting rod 211 is connect with the other end of baffle push rod 202, the inner end connection of second connecting rod 211
Second baffle pivoted arm 212, second baffle pivoted arm 212 are connect with the second rotary shaft bolster 111.
In Fig. 1, Fig. 3, Fig. 6, the outboard end of first connecting rod 209 is connect with the left end of baffle push rod 202, first connecting rod
209 inner end connects first baffle pivoted arm 210, and first baffle pivoted arm 210 is connect with the upper end of the first rotary shaft bolster 109.
The outboard end of second connecting rod 211 is connect with the right end of baffle push rod 202, the inner end of second connecting rod 211 connection the
Two baffle pivoted arms 212, second baffle pivoted arm 212 are connect with the upper end of the second rotary shaft bolster 111.
In one embodiment of the present of invention, when driving assembly 300 starts, driving assembly 300 is moved downward, wafer fixed frame
103 bottom surface is horizontally disposed, and driving assembly 300 is slided with movable slider 206 along guiding axis 207, and sliding block 206 slides into sliding block limit
Position plate 208, at this moment, sliding block 206 drives the inside Slideslip of baffle push rod 202, and the left end of baffle push rod 202 passes through first connecting rod
209, first baffle pivoted arm 210, the first rotary shaft bolster 109 drive first baffle 110 to open, meanwhile, the right side of baffle push rod 202
End drives second baffle 112 to open by second connecting rod 211, second baffle pivoted arm 212, the second rotary shaft bolster 111, opens at this time
It opens at mouth end 101；Various sizes of wafer is sequentially placed into wafer fixed frame 103 and is fixed, after wafer is placed, is opened again
Dynamic driving assembly 300, driving assembly 300 move upwards, and the bottom surface of wafer fixed frame 103 gradually forms between horizontal plane sharp
Angle, driving assembly 300 are slided by sliding block 206 along guiding axis 207, and sliding block 206 is gradually distance from slide block limiting plate 208, at this moment,
Sliding block 206 drives the outside Slideslip of baffle push rod 202, and the left end of baffle push rod 202 is turned by first connecting rod 209, first baffle
Arm 210, the first rotary shaft bolster 109 drive first baffle 110 to close, meanwhile, the right end of baffle push rod 202 passes through second connecting rod
211, second baffle pivoted arm 212, the second rotary shaft bolster 111 drive second baffle 112 to close, at this point, open end 101 is closed,
Cleaning and dipping can be carried out to wafer.
Further, driving assembly 300 includes air cylinder fixed plate 301, cylinder 302, drive rod 303 and fixed link 304；
For being connected to Electric Actuator, cylinder 302 is connected in air cylinder fixed plate 301 air cylinder fixed plate 301, driving
One end of bar 303 is connect with the output end of cylinder 302, and the other end of drive rod 303 is connected on sliding block 206；
Fixed link 304 is socketed in the outside of drive rod 303, and film magazine position-limited rack 205 is connected in fixed link 304.
In Fig. 1, air cylinder fixed plate 301 is rectangular slab, and the left end of air cylinder fixed plate 301 is connected to Electric Actuator
On, so that the left end that Electric Actuator is able to drive air cylinder fixed plate 301 moves along vertical direction.
Cylinder 302 is connected by screw bolts on the right end top of air cylinder fixed plate 301.
The upper end of drive rod 303 is connect with the output end of cylinder 302, and the lower end of drive rod 303 is connected to cunning by pin shaft
On block 206.
Fixed link 304 is hollow pipe, and fixed link 304 is socketed in the outside of drive rod 303, so that drive rod 303 can be
It is moved along vertical direction in fixed link 304；And the upper end of fixed link 304 is connected by screw bolts right in air cylinder fixed plate 301
Lower end surface is held, the inner end of film magazine position-limited rack 205 is socketed in the lower end of fixed link 304.
Further, cylinder 302 is connected with cylinder connecting plate 305, and one end of drive rod 303 and cylinder connecting plate 305 connect
It connects.
In Fig. 1, the square plate that cylinder connecting plate 305 is vertically arranged, cylinder connecting plate 305 is connected by screw bolts in gas
On cylinder 302.
The upper end of drive rod 303 is connect using pin shaft with cylinder connecting plate 305.
Wafer anti-drop device provided by the invention, according to process requirements, by changing the big of gas pressure in cylinder 302
It is small, the inclined speed of wafer fixed frame 103 is controlled, makes wafer is firm to be placed in wafer fixed frame 103, avoids wafer sliding
It falls, occurs damaged；By sliding block 206 along the sliding of guiding axis 207, changes the tilt angle of wafer fixed frame 103, make wafer
Firm is connected in wafer fixed frame 103；By changing the length of 202, two connecting rods of baffle push rod, two gears can be changed
Folding angle of the plate in open end 101, it is ensured that wafer is capable of fixing in wafer fixed frame 103.Present invention is mainly applied to shell
On disembarking, it can also expand and be applied in other monolithic automatic cleaning equipments, application market has a extensive future.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of wafer anti-drop device, which is characterized in that including film magazine fixed frame (100), runner assembly (200) and driving group
Part (300)；
For fixing wafer to be cleaned in the film magazine fixed frame (100)；
The film magazine fixed frame (100) is connected to one end of the runner assembly (200), and the driving component (300) is connected to
The other end of the runner assembly (200)；
The driving component (300) can drive the runner assembly (200) to rotate, and the runner assembly (200) is made to drive institute
Film magazine fixed frame (100) inclination is stated, and makes the open end of the runner assembly (200) control film magazine fixed frame (100)
(101) baffle portion (102) opening and closing.
2. wafer anti-drop device according to claim 1, which is characterized in that the film magazine fixed frame (100) includes crystalline substance
Circle fixed frame (103) and wafer end position-limited rack (104)；
For installing wafer to be cleaned in the wafer fixed frame (103), it is solid that the baffle portion (102) is connected to the wafer
Determine the open end (101) of frame (103)；
It is corresponding with the open end (101) that wafer end position-limited rack (104) is connected to the wafer fixed frame (103)
End face.
3. wafer anti-drop device according to claim 2, which is characterized in that the inner circumferential of the wafer fixed frame (103)
Wall is equipped with the first limiting slot (105) and the second limiting slot (106), and first limiting slot (105) is used to fix the crystalline substance of small size
Circle, second limiting slot (106) is for fixing large-sized wafer.
4. wafer anti-drop device according to claim 3, which is characterized in that wafer end position-limited rack (104) packet
The first limiting section (107) and the second limiting section (108) are included, first limiting section (107) and second limiting section (108) are even
It connects, the first limiting section (107) setting is in the end face of first limiting slot (105), the second limiting section (108) setting
In the end face of second limiting slot (106).
5. wafer anti-drop device according to claim 4, which is characterized in that the baffle portion (102) includes the first rotation
Rotary bearing pedestal (109), first baffle (110), the second rotary shaft bolster (111) and second baffle (112)；
The first rotary shaft bolster (109) is connected to the side of the open end (101), first baffle (110) connection
On the first rotary shaft bolster (109)；
The second rotary shaft bolster (111) is connected to the other side of the open end (101), and the second baffle (112) is even
It connects on the second rotary shaft bolster (111)；
The first rotary shaft bolster (109), the second rotary shaft bolster (111) are connected to the runner assembly
(200) both ends.
6. wafer anti-drop device according to claim 5, which is characterized in that the runner assembly (200) includes sliding
Portion (201), baffle push rod (202), rotating part (203), inclination connection frame (204) and film magazine position-limited rack (205)；
The sliding part (201) is connected to the output end of the driving component (300), and the sliding part (201) is connected to described
On baffle push rod (202), the baffle push rod (202) is connected to the inclination connection frame (204) by the rotating part (203)
On, the inclination connection frame (204) is connected on the wafer fixed frame (103), the first rotary shaft bolster (109), institute
The second rotary shaft bolster (111) is stated to connect with the rotating part (203) respectively；
One end of the film magazine position-limited rack (205) connects the inclination connection frame (204), the film magazine position-limited rack (205) it is another
One end is connected on the driving component (300).
7. wafer anti-drop device according to claim 6, which is characterized in that the sliding part (201) includes sliding block
(206), guiding axis (207) and slide block limiting plate (208)；
The sliding block (206) is connected to the output end of the driving component (300), and the sliding block (206) is connected to the baffle
On push rod (202)；
The quantity of the guiding axis (207) is two, and the outboard end of two guiding axis (207) is respectively fixedly connected with described
In slide block limiting plate (208)；It is equipped with limit hole in the side of the sliding block (206), the quantity of the limit hole is two, two
The inner end of the guiding axis (207) is slidably connected at respectively in two limit holes.
8. wafer anti-drop device according to claim 7, which is characterized in that the rotating part (203) includes the first company
Bar (209), first baffle pivoted arm (210), second connecting rod (211) and second baffle pivoted arm (212)；
The outboard end of the first connecting rod (209) is connect with one end of the baffle push rod (202), the first connecting rod (209)
Inner end connect the first baffle pivoted arm (210), the first baffle pivoted arm (210) and the first rotary shaft bolster
(109) it connects；
The outboard end of the second connecting rod (211) is connect with the other end of the baffle push rod (202), the second connecting rod
(211) inner end connects the second baffle pivoted arm (212), the second baffle pivoted arm (212) and second rotary shaft
Bolster (111) connection.
9. wafer anti-drop device according to claim 8, which is characterized in that the driving component (300) includes cylinder
Fixed plate (301), cylinder (302), drive rod (303) and fixed link (304)；
For being connected to Electric Actuator, the cylinder (302) is connected to the cylinder and fixes the air cylinder fixed plate (301)
On plate (301), one end of the drive rod (303) is connect with the output end of the cylinder (302), the drive rod (303)
The other end is connected on the sliding block (206)；
The fixed link (304) is socketed in the outside of the drive rod (303), and the film magazine position-limited rack (205) is connected to described
In fixed link (304).
10. wafer anti-drop device according to claim 9, which is characterized in that the cylinder (302) is connected with cylinder company
Fishplate bar (305), one end of the drive rod (303) are connect with the cylinder connecting plate (305).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811617047.7A CN109637968B (en) | 2018-12-27 | 2018-12-27 | Wafer anti-drop device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811617047.7A CN109637968B (en) | 2018-12-27 | 2018-12-27 | Wafer anti-drop device |
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| CN109637968A true CN109637968A (en) | 2019-04-16 |
| CN109637968B CN109637968B (en) | 2020-12-01 |
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| CN201811617047.7A Active CN109637968B (en) | 2018-12-27 | 2018-12-27 | Wafer anti-drop device |
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| CN109860087A (en) * | 2019-04-18 | 2019-06-07 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer film magazine suspension mechanism |
| CN110379733A (en) * | 2019-06-03 | 2019-10-25 | 厦门通富微电子有限公司 | Remove the cleaning device of photoresist on wafer |
| CN112750737A (en) * | 2021-01-06 | 2021-05-04 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Substrate soaking mechanism and substrate soaking device |
| CN115274514A (en) * | 2022-09-29 | 2022-11-01 | 智程半导体设备科技(昆山)有限公司 | Semiconductor soaking device |
| CN116504687A (en) * | 2023-06-29 | 2023-07-28 | 北京芯士联半导体科技有限公司 | Wafer soaking device of metal stripping machine |
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| CN109860087A (en) * | 2019-04-18 | 2019-06-07 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer film magazine suspension mechanism |
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| CN112750737A (en) * | 2021-01-06 | 2021-05-04 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Substrate soaking mechanism and substrate soaking device |
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| CN116504687A (en) * | 2023-06-29 | 2023-07-28 | 北京芯士联半导体科技有限公司 | Wafer soaking device of metal stripping machine |
| CN116504687B (en) * | 2023-06-29 | 2023-12-22 | 北京芯士联半导体科技有限公司 | Wafer soaking device of metal stripping machine |
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|---|---|
| CN109637968B (en) | 2020-12-01 |
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